Magnetic type electronic product protection backboard and hot press molding device thereof

Abstract

The invention relates to the technical field of electronic product accessories, and discloses a magnetic type electronic product protection backboard and a hot press molding device thereof, and the magnetic type electronic product protection backboard comprises a protection main board which is formed by laminating and hot-pressing two-layer main boards and at least one middle-layer main board clamped between the two-layer main boards, a plurality of assembling grooves matched with corresponding magnetic attraction structures of the electronic product are formed in one side face of the protection main board in a concave mode, a magnetic attraction part is arranged in each assembling groove, and a cover plate for blocking the assembling groove is arranged in a groove opening of each assembling groove. The assembly groove is formed in the position, corresponding to the magnetic attraction part, of the protection main board, so that the magnetic attraction part and the protection main board do not affect each other during hot pressing, the magnetic attraction part can be installed after the protection main board is subjected to hot pressing forming, the cover plate is used for shielding the magnetic attraction part and preventing the magnetic attraction part from being exposed to affect the appearance, and meanwhile, the magnetic attraction part can be installed on the protection main board. The thickness condition of the protection mainboard can be controlled through the arrangement of the cover plate, the quality of the protection backboard is guaranteed, and meanwhile the manufacturing difficulty is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic product accessories, and in particular to a magnetic electronic product protective back plate and a hot pressing molding device thereof. Background Art

[0002] The protective back panel of electronic products is a product that provides protection for electronic products. It is usually used to protect the back of electronic devices such as smartphones and tablets. It can effectively prevent the device from external damage such as scratches and collisions, thereby extending the service life of electronic products and maintaining their appearance intact.

[0003] The magnetic protective back panel is a product that uses magnetic adsorption technology to provide protection for electronic products. It is usually used to protect the back of electronic devices such as smartphones and tablets. The back panel is tightly attached to the back of the device through magnetic force to provide protection against dust, scratches, and falls.

[0004] With the changes in market demand and the development of technology, the materials and designs of tablet computer protective cases have begun to diversify. The current magnetic protective back panels are usually made by laminating multiple layers of materials. The magnetic part is squeezed into the back panel during the lamination process. The density and thickness of the layered material at the location of the magnetic part are changed. During the lamination process, it is easy to cause the back panel to be uneven, which not only affects the appearance of the back panel, but also affects the overall use of the back panel, so that the back panel cannot be fully attached to the back of the electronic product, thereby reducing the protective effect of the electronic product. Summary of the invention

[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: to provide a magnetic electronic product protective back panel and a thermoforming device thereof to solve the problem that the magnetic back panel becomes uneven after lamination and installation of the magnetic part.

[0006] In order to solve the above technical problems, a technical solution adopted by the present invention is: providing a protective main board formed by stacking and hot-pressing two surface layer main boards and at least one intermediate layer main board sandwiched between the two surface layer main boards, a plurality of assembly grooves corresponding to the magnetic attraction structure of the electronic product are recessed on one side surface of the protective main board, each of the assembly grooves is provided with a magnetic attraction part, and a cover plate for blocking the assembly groove is provided in the groove opening of each assembly groove, so as to avoid the bulging phenomenon of the protective main board after pressing due to the existence of the magnetic attraction part through the cooperation of the assembly groove and the cover plate, thereby affecting the appearance and product quality.

[0007] Furthermore, the two surface main boards include a first main board and a second main board, and the middle main board includes a third main board and a fourth main board, the third main board is located on a side close to the first main board, and the fourth main board is located on a side close to the second main board; the first main board and the third main board are both made of semi-cured sheet materials, and the second main board and the fourth main board are both made of long fiber materials, so as to reduce the cost and have a higher cost performance; a plurality of contoured openings are provided through the second main board at a position corresponding to the magnetic attraction structure of the electronic product, the shape of each contoured opening is adapted to the magnetic attraction structure of the electronic product, and each contoured opening forms the assembly groove after hot pressing to reduce the difficulty of molding.

[0008] Furthermore, the protective mainboard is provided with ribs in a grid-like structure, and the notches of the assembly slots are arranged flush with the ribs to ensure compatibility with the electronic product.

[0009] Furthermore, each of the assembly grooves is recessed with a plurality of independent sub-grooves, the magnetic attraction portions are disposed in each sub-groove corresponding to the sub-grooves, and each of the assembly grooves is blocked by a cover plate; a stepped surface is formed between the groove opening of each sub-groove and the assembly groove, and the cover plate is adhered to the magnetic attraction portion and the step surface by gluing to ensure the stability of the cover plate and the strength of the entire protective back plate.

[0010] The present invention provides a hot pressing forming device for a magnetically-attractive electronic product protective back panel, comprising an upper mold and a lower mold that can be interlocked with each other, wherein the top of the lower mold is concavely provided with a forming cavity consistent with the shape contour of the protective mainboard, and the bottom of the upper mold is convexly provided with a pressing plate for blocking one side of the forming cavity opening, and a heating unit for heating the forming cavity and the pressing plate is provided between the upper mold and the lower mold for forming the protective mainboard.

[0011] Furthermore, the lower mold includes a base, a first heat insulation board arranged on the base, and a mother mold arranged on the first heat insulation board. A forming groove is formed on the top surface of the mother mold for the pressure plate to vertically penetrate therein, and the molding cavity is formed at the bottom of the forming groove. When the upper mold and the mother mold are interlocked with each other and the upper mold contacts the top surface of the mother mold, the pressure plate hovers at the cavity mouth of the molding cavity; the heating unit includes a first heating part arranged inside the mother mold and evenly distributed below the molding cavity, and the first heating part is used to heat the molding cavity so as to press the stacked two-layer main board and the middle layer main board into shape.

[0012] Furthermore, the top surface of the base is concave to form a mounting groove with two through sides, the mounting groove is arranged vertically opposite to the molding cavity, the heat insulation plate cover is arranged above the mounting groove, a connecting plate that can move vertically in the mounting groove is arranged in the mounting groove, and a plurality of ejector pins arranged vertically upward are arranged on the connecting plate, each of the ejector pins can vertically penetrate the first heat insulation plate and penetrate into the molding cavity when the connecting plate moves upward, so as to facilitate the removal of the product after the hot pressing is completed.

[0013] Furthermore, height limiting blocks with tops protruding from the top surface of the mother mold are symmetrically arranged on the top surface of the mother mold and located at the periphery of the forming groove. When the upper mold is buckled on the mother mold, it abuts against the height limiting blocks and the pressure plate hovers at the cavity mouth of the molding cavity to ensure that the pressure plate and the forming groove can cooperate to form a molding cavity with the same shape as the protective back plate.

[0014] Furthermore, the upper mold includes a top plate, a pad, a second heat insulation plate and a male mold connected in sequence from top to bottom, the bottom surface of the male mold is convexly formed with the pressure plate, and at least two positioning holes are concavely provided on the bottom surface of the male mold, and the positioning holes are symmetrically arranged on the outside of the pressure plate; a positioning column is convexly provided at the position corresponding to the positioning hole on the female mold, and the positioning column is vertically penetrated therein when the male mold is buckled on the female mold to ensure the precise fit between the pressure plate and the forming groove; the heating unit also includes a second heating part arranged inside the male mold and evenly distributed above the pressure plate, and the second heating part is used to heat the pressure plate, so as to facilitate the molding of both sides of the protective main board.

[0015] Furthermore, the heating unit also includes a first water-cooling part arranged inside the female mold and evenly distributed below the molding cavity, and a second water-cooling part arranged inside the male mold and evenly distributed above the pressing plate. The first water-cooling part is located on the side away from the molding cavity relative to the first heating part, and the second water-cooling part is located on the side away from the pressing plate relative to the second heating part, so as to better control the temperature and prevent the product from being damaged by excessive temperature.

[0016] The magnetic electronic product protective back plate and its hot pressing forming device of the present invention have at least the following beneficial effects: by opening an assembly groove at a position corresponding to the magnetic attraction part on the protective main board, the magnetic attraction part and the protective main board will not affect each other during hot pressing, and the magnetic attraction part can be installed after the protective main board is hot pressed. The cover plate is used to shield the magnetic attraction part to prevent the magnetic attraction part from being exposed and affecting the appearance. At the same time, the setting of the cover plate can control the thickness of the protective main board, ensure the quality of the protective back plate, and reduce the manufacturing difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0018] Figure 1 This is a schematic structural diagram of a magnetic electronic product protection back plate of the present invention;

[0019] Figure 2 An exploded view of the magnetic electronic product protection back plate of the present invention;

[0020] Figure 3 for Figure 2 An enlarged view of section A is shown;

[0021] Figure 4 An exploded view of the protective mainboard of the present invention;

[0022] Figure 5 It is a partial cross-sectional view of the magnetic electronic product protection back plate of the present invention;

[0023] Figure 6 It is a schematic structural diagram of the hot pressing forming device of the present invention;

[0024] Figure 7 It is a structural schematic diagram of the upper mold of the present invention;

[0025] Figure 8 It is a schematic diagram of the upper mold, the stacked protective main board and the lower mold after being separated according to the present invention;

[0026] Fig. 9 It is a side sectional view of the hot pressing forming device of the present invention.

[0027] The meanings of the symbols in the accompanying drawings are:

[0028] Protective main board-1; assembly groove-11; step surface-111; secondary groove-112; processing surface-12; rib-13; connection hole-14; surface main board-15a; middle main board-15b; first main board-151; second main board-152; third main board-153; fourth main board-154; profiling mouth-155; folding structure-16; magnetic attraction part-2; cover plate-3; upper mold-4; pressing plate-41; top plate-42; pad plate-43; second heat insulation board-44; male mold-45 ; Positioning hole -46; Male mold -47; Lower mold -5; Molding cavity -51; Base -52; Bottom plate -521; Side plate -522; Mounting groove -523; First heat insulation plate -53; Female mold -54; Forming groove -541; Molding protrusion structure -542; Ejector pin -55; Connecting plate -551; Height limit block -561; Positioning column -562; Movable block -563; Heating unit -6; First heating part -61; Second heating part -62; First water cooling part -63; Second water cooling part -64. DETAILED DESCRIPTION

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] like Figures 1 to 5 As shown, the magnetic electronic product protective back plate of the present invention comprises a protective mainboard 1 adapted for the electronic product, a magnetic attraction portion 2 arranged in the protective mainboard 1, and a cover plate 3 arranged on the protective mainboard 1 to block the magnetic attraction portion 2. The protective mainboard 1 is used to protect the electronic product, and the magnetic attraction portion 2 is convenient for magnetic attraction with the metal structure or magnetic attraction structure on the electronic product to increase the tightness of the connection between the protective back plate and the electronic product and increase the protection stability. The cover plate 3 is convenient for the installation of the magnetic attraction portion 2. The electronic products described in this embodiment include but are not limited to tablet computers, and the protective mainboard 1 is used to protect the back shell of the tablet computer.

[0031] In this embodiment, a plurality of assembly slots 11 adapted to the magnetic attraction structure corresponding to the electronic product are concavely provided on one side of the protective mainboard 1 corresponding to the electronic product, and the size, shape and position of each assembly slot 11 are different. The side of the protective mainboard 1 on which the assembly slot 11 is concave is defined as the processing surface 12, and the other side of the protective mainboard 1 is defined as the back surface, which is a plane, and ribs 13 with a grid-like structure are convexly provided on the processing surface 12 of the protective mainboard 1, and each assembly slot 11 is located on the part surrounded by the inner side of each rib 13, and each rib 13 constitutes a part of the assembly slot 11 so that the notch position of the assembly slot 11 is flush with the rib 13, so as to reduce the contact between the processing surface 12 and the object surface during subsequent processing or use, thereby increasing the protection effect. Since the shapes and sizes of each assembly slot 11 are different, in order to facilitate the production and installation of the magnetic attraction part 2, a plurality of independent sub-slots 112 are concavely formed in each assembly slot 11, and each sub-slot 112 can be a square slot, or other shapes that are convenient for forming and opening. In order to facilitate the arrangement and installation of the cover plate 3, a stepped surface 111 is formed between the notch of each secondary groove 112 and the notch of the assembly groove 11, so that the total outer circumference of each secondary groove 112 in each assembly groove 11 is formed with a stepped surface 111 around the notch of the assembly groove 11, and the stepped surface 111 is flush with the notch of each secondary groove 112, so that the cover plate 3 can be abutted against the notch of each secondary groove 112 and the stepped surface 111 when installed in the assembly groove 11. A connecting hole 14 is formed through the protective main board 1, which can be easily connected with other structures in subsequent processing and production. An integrally formed folding structure 16 is protruded along the width direction on the edge where one of the long sides of the protective main board 1 is located. The folding structure 16 is designed to be assembled with the edge part of a similar product, so as to form a folded edge with other protective structures in subsequent processing.

[0032] In the content defined in this embodiment, the protective main board 1 includes two-layer main boards 15a and at least one intermediate main board 15b sandwiched between the two-layer main boards 15a, which are stacked and hot-pressed. The two-layer main boards 15a include a first main board 151 and a second main board 152, and the intermediate main board 15b includes a third main board 153 and a fourth main board 154. The third main board 153 is located on the side close to the first main board 151, and the fourth main board 154 is located on the side close to the second main board 152, so that the first main board 151, the third main board 153, the fourth main board 154 and the second main board 152 are arranged in sequence. In this embodiment, the first main board 151, the second main board 152, the third main board 153 and the fourth main board 154 are all rectangular sheet structures and are stacked in sequence. Among them, the first main board 151 and the third main board 153 are both semi-cured sheet materials, specifically plain PP-2116, fiber tow 23.6*22.8, fiber cloth thickness 0.084mm, fiber weight 103±3 (g / m2), resin content 45~49 (by wt%), density 1.8~2.0 (g / cm3), PP weight 206~224 (g / m2), titanium dioxide 3~5% (by wt%), and molding thickness 0.10mm. The second main board 152 and the fourth main board 154 are both long fiber materials, specifically sheet molding materials, type Chopped-12.5mm, specification HT301512-1.5, density 1.5g / cm3, resin content 50%, fiber content 30%, glass beads 12%, others 8%, flame retardant grade UL94HB. The combination of long fiber material and semi-cured sheet is not only strong and durable, but also has low material cost and easy manufacturing. In this embodiment, after the first main board 151, the third main board 153, the fourth main board 154 and the third main board 153 are stacked and before hot pressing, the side of the first main board 151 is used as the parting line, and the four outer sides of the stacked first main board 151, the third main board 153, the fourth main board 154 and the second main board 152 form a draft angle of 4 to 6 degrees from one side of the parting line to the other side along the thickness direction, preferably 5 degrees, for easy demolding. In order to facilitate subsequent fine processing, the length and width of each first main board 151, the second main board 152, the third main board 153 and the fourth main board 154 are 3mm longer than the length and width of the magnetic suction type electronic product protective backboard after processing, so that each side of the first main board 151, the second main board 152, the third main board 153 and the fourth main board 154 has a 1.5mm margin, which is convenient for cutting during subsequent mechanical fine processing. During cutting, the four corners of the protective main board 1 are rounded.In order to facilitate the formation of the step surface 111 and the notch of the assembly groove 11 and reduce the difficulty of hot pressing, a plurality of profiling openings 155 are opened through the second main board 152 at the position corresponding to the magnetic attraction structure of the electronic product. The shape of each profiling opening 155 is adapted to the magnetic attraction structure of the electronic product, and each profiling opening 155 forms the notch portion of the assembly groove 11 after the first main board 151, the second main board 152, the third main board 153 and the fourth main board 154 are hot-pressed, while the fourth main board 154, the first main board 151 and the second main board 152 cooperate to form the secondary groove 112 portion.

[0033] In this embodiment, the number and size of the magnetic attraction parts 2 are arranged in one-to-one correspondence with the number and size of each secondary slot 112. A magnetic attraction part 2 is provided in each secondary slot 112. The magnetic attraction part 2 is a magnet that can be magnetically matched with metal or other magnetic attraction structures. The magnet is a square block structure or a sheet structure, and it is divided into small blocks to facilitate the setting of various shapes.

[0034] In this embodiment, the cover plates 3 are arranged one by one at the notches of the assembly slots 11 to block the magnetic attraction parts 2 in each secondary slot 112 and the notches of the assembly slots 11, to prevent the magnetic attraction parts 2 from being directly exposed, and to protect the magnetic attraction parts 2. At the same time, the arrangement of the cover plates 3 enables the magnetic attraction parts 2 to be installed on the protective main board 1 after the protective main board 1 is hot-pressed, which is more convenient to assemble than the existing protective plates, and can also avoid the unevenness caused by the hot pressing of the magnetic attraction parts 2 as needed. The cover plates 3 are made of metal materials such as steel, and the material is N45SH-100RC, which is not magnetized, to ensure the protection of the magnetic attraction parts 2. The cover plates 3 can be arranged to be consistent with the number of secondary slots 112. Preferably, one cover plate 3 is arranged corresponding to each assembly slot 11. For this reason, the shape of the cover plates 3 is consistent with the shape of the assembly slots 11, so that when the magnetic attraction parts 2 are installed in the secondary slots 112, they can be installed in the assembly slots 11 to block the magnetic attraction parts 2 in each secondary slot 112. The cover plate 3 is pasted on the magnetic part 2 and the stepped surface 111 by gluing. The glue uses a two-component AB glue of model HHD 8190R, with an A:B mixing ratio of 10:1, so that it can be cured after hot pressing to stick to the cover plate 3. The magnetic part 2 is also glued in the secondary groove 112. It should be noted that the depth of the notch of the assembly groove 11, that is, the depth between the stepped surface 111 and the outer rib 13 of the notch of the assembly groove 11 is greater than or equal to the thickness of the cover plate 3, so that the cover plate 3 does not protrude from the rib 13.

[0035] like Figures 6 to 9As shown, the hot pressing forming device of the present invention includes an upper mold 4, a lower mold 5 and a heating unit 6. The upper mold 4 and the lower mold 5 can be interlocked to enclose a cavity structure that is completely consistent with the outer contour of the magnetic electronic product protective mainboard 1. The first mainboard 151, the third mainboard 153, the fourth mainboard 154 and the second mainboard 152 stacked in sequence are placed in the corresponding cavity structure, and the upper mold 4 and the lower mold 5 are heated by the heating unit 6 to heat the mainboards in the cavity structure until the protective mainboard 1 is hot pressed into shape. In this embodiment, a molding cavity 51 consistent with the contour of the protective main board 1 is formed on the top of the lower mold 5, that is, the molding cavity 51 is adapted to the outer contour structure and size of the protective main board 1, and a pressure plate 41 capable of blocking one side of the opening of the molding cavity 51 is correspondingly convexly provided on the bottom of the upper mold 4, so that after each main board is stacked in the molding cavity 51, the pressure plate 41 blocks the opening of the molding cavity 51 and presses each main board by buckling the upper mold 4, and the heating unit 6 is used to heat the molding cavity 51 and the pressure plate 41 to ensure comprehensive, sufficient and uniform heating, thereby improving the effect and quality of hot pressing.

[0036] In this embodiment, the lower mold 5 includes a base 52, a first heat insulation plate 53, a mother mold 54 and an ejector pin 55 which are arranged in sequence from bottom to top. The base 52 is used to support the mother mold 54. The first heat insulation plate 53 prevents the high temperature during hot pressing from being transmitted to the base 52 and the workbench for placing the base 52, which affects the service life. The molding cavity 51 is formed on the mother mold 54 for cooperation with the upper mold 4 for hot pressing molding. The ejector pin 55 facilitates the separation of the protective main board 1 which is closely attached to the molding cavity 51 after hot pressing molding.

[0037] In the content defined in this embodiment, the base 52 includes a bottom plate 521 and two side plates 522 spaced apart on the top surface of the bottom plate 521, the side plates 522 are arranged in parallel and make the base 52 in a "concave" shape, so that a concave installation groove 523 is formed between the top surface of the bottom plate 521 and the side plates 522, the two sides of the installation groove 523 are through-set along the length direction of the side plates 522, and the side plates 522 are arranged in parallel along the width direction thereof. The top of the installation groove 523 is open and arranged directly opposite to the mother mold 54 and the molding cavity 51 on the mother mold 54.

[0038] In the content defined in this embodiment, the first insulation board 53 is a rectangular sheet or block structure. The first insulation board 53 adopts insulation materials such as cotton rock board, and the width of the first insulation board 53 is greater than the width between the two side plates 522. The two sides of the first insulation board 53 are respectively placed on the top surface of the two side plates 522 so that the cover plate 3 is covered above the installation groove 523.

[0039] In the content defined in this embodiment, the mother mold 54 is directly placed or fixedly installed on the top surface of the first heat insulation board 53, so as to block the temperature transfer of the mother mold 54 to a certain extent. The mother mold 54 is a rectangular block structure, and a forming groove 541 is formed on the top surface of the mother mold 54. The length and width of the forming groove 541 are the same as the length and width of the second main board 152. A forming protrusion structure 542 that is completely consistent with the shape of the processing surface 12 of the protective main board 1 is formed on the bottom surface of the forming groove 541. The forming protrusion structure 542 includes structures corresponding to each assembly groove 11 and each part of the rib 13. The bottom surface of the forming groove 541 is also adapted to the remaining part of the first main board 151, the second main board 152, the third main board 153 and the fourth main board 154, so that the second main board 152 can be placed in the forming groove 541 more adaptably. The side of the forming groove 541 is adapted to the draft angle of the protective main board 1 and the bottom angle is 95° to facilitate demoulding after molding. The forming cavity 51 is formed at the bottom of the forming groove 541. When the upper mold 4 and the mother mold 54 are interlocked and combined with the upper mold 4 contacting the top surface of the mother mold 54, the pressing plate 41 is suspended in the forming groove 541. At this time, the forming groove 541 part from the bottom surface of the pressing plate 41 and below is the forming cavity 51. The pressing plate 41 is also located at the cavity mouth of the forming cavity 51. The forming groove 541 also provides space for the pressing plate 41 to ensure the close fit between the pressing plate 41 and the forming groove 541, so that the pressing plate 41 can evenly and comprehensively press each main board into the forming cavity 51, thereby forming the protective main board 1 by hot pressing. The height limiting block 561 is installed on the top surface of the mother mold 54 and outside the groove of the forming groove 541. Each height limiting block 561 is symmetrically arranged on the outer periphery of the forming groove 541 and the top surface is convex to the top surface of the mother mold 54. The top surface height of each height limiting block 561 is consistent and flush. The height limiting blocks 561 are set to be two groups or four groups. When there are two groups, the two groups of height limiting blocks 561 can be symmetrically arranged on the opposite sides of the forming groove 541. When there are four groups, the four groups of height limiting blocks 561 can be symmetrically arranged on the four sides of the forming groove 541. The height limiting blocks 561 can control the thickness of the pressure plate 41. The top surface height of the height limiting blocks 561 can be adjusted to facilitate the adjustment and replacement of pressure plates 41 of different thicknesses. However, it should be ensured that when the bottom surface of the upper mold 4 is buckled and abutted against the height limiting blocks 561 on the top surface of the mother mold 54, the pressure plate 41 just hovers at the cavity mouth position of the molding cavity 51. In order to facilitate the rapid alignment of the upper mold 4 and the lower mold 5 and ensure that the position of the pressure plate 41 is not offset and is accurately aligned, at least two positioning columns 562 are provided on the top surface of the mother mold 54 and on the outer periphery of the groove 541, protruding upward in the vertical direction, and two of the positioning columns 562 are located on both sides of the diagonal corners. Positioning holes 46 can be adapted to be provided on the upper mold 4 at positions corresponding to the positioning columns 562 to ensure that the positioning columns 562 are inserted into the positioning holes 46 when the upper mold 4 and the lower mold are interlocked.In this embodiment, grooves are provided on both sides of the female mold 54 and on two opposite sides of the forming groove 541. The grooves facing the side of the forming groove 541 can penetrate the forming groove 541. A loose piece 563 embedded in the grooves in a riveted form is screwed in the grooves, so that the protective mainboard 1 formed after molding can be pried out from the side by removing the loose piece 563 when it is difficult to demold. Due to the setting of the margin, even if the side of the protective mainboard 1 formed after molding may have defects due to the loose piece 563, it can be removed during the subsequent cutting and finishing, thereby ensuring the quality of the protective backplane of the magnetic electronic product. The loose piece 563 can also be a temperature sensor, so as to detect the temperature of the male mold 47 and the female mold 54 at the same time.

[0040] In the content defined in this embodiment, a connecting plate 551 capable of moving vertically in the installing groove 523 is provided in the installing groove 523, a plurality of ejector pins 55 are provided and symmetrically arranged on the connecting plate 551, and each ejector pin 55 protrudes from the connecting plate 551 in the vertical direction. A plurality of first through holes are provided at positions corresponding to each ejector pin 55 on the first heat insulation board 53, and the ejector pin 55 can freely pass through the first through holes, and each ejector pin 55 is always arranged in the first through hole, and the first through hole guides the ejector pin 55. On the bottom surface of the mother mold 54, at the position corresponding to each first through hole, a second through hole is opened upward in the vertical direction, penetrating the bottom surface of the forming groove 541. When the connecting plate 551 abuts against the bottom surface of the mounting groove 523, the top end of each ejector pin 55 passes through the first through hole and is located in the second through hole. After the protective main board 1 is hot-pressed, the connecting plate 551 is moved upward to enable each ejector pin 55 to vertically pass through the first heat insulation plate 53 and penetrate into the molding cavity 51, so as to separate the protective main board 1 from the molding cavity 51, thereby assisting demolding and reducing the difficulty of demolding.

[0041] In this embodiment, the upper mold 4 includes a top plate 42, a pad 43, a second heat insulation plate 44 and a male mold 47 connected in sequence from top to bottom. The pressure plate 41 is convexly formed on the bottom surface of the male mold 47. The top plate 42 is convenient for connection with other driving devices to drive the top plate 42 to move in the vertical direction, thereby providing support for the male mold 47, etc. The pad 43 is used to increase the thickness between the top plate 42 and the second heat insulation plate 44. The second heat insulation plate 44 prevents the high temperature during hot pressing from being transmitted to the top plate 42 and other driving devices to affect the connection and use. The female mold 54 cooperates with the female mold 54 to interlock with each other, and the pressure plate 41 and the forming groove 541 are interlocked to compress the stacked main boards.

[0042] In the content defined in this embodiment, the top plate 42 and the pad 43 are both rectangular block or sheet structures, and the driving structure can drive the upper mold 4 to move by sucking the top plate 42 with bolts or using a suction cup. The material of the second heat insulation board 44 is consistent with the material of the first heat insulation board 53 and is fixedly connected to the bottom surface of the pad 43. The male mold 47 is fixedly connected to the bottom surface of the second heat insulation board 44 and the length and width are consistent with the length and width of the female mold 54, so that the male mold 47 and the female mold 54 can be more closely and evenly matched. The pressing plate 41 is integrally formed on the bottom surface of the male mold 47, the length of the pressing plate 41 is consistent with the length of the forming groove 541, and the width of the pressing plate 41 is consistent with the width of the forming groove 541, so that the pressing plate 41 can penetrate into the forming groove 541 and is used to protect the formation of the back of the main board 1. The male mold 47 and the female mold 54 are both made of high hardness and high temperature resistant materials such as cast iron alloy. The positioning hole 46 is recessed on the bottom surface of the male mold 47 corresponding to the positioning column 562 and is located at the periphery of the pressing plate 41 without interfering with the pressing plate 41. A height limiting block 561 is also fixedly arranged on the bottom surface of the male mold 47. The height limiting block 561 on the male mold 47 is convex from the bottom surface of the male mold 47, and the thickness of the height limiting block 561 on the male mold 47 that is convex from the bottom surface of the male mold 47 is the same as the thickness of the height limiting block 561 on the female mold 54 that is convex from the top surface. The height limiting block 561 of the male mold 47 and the height limiting block 561 on the female mold 54 are staggered to further ensure the matching of the pressing plate 41 and the forming groove 541.

[0043] In this embodiment, the heating unit 6 includes a first heating part 61 arranged inside the female mold 54 and evenly distributed below the molding cavity 51, a second heating part 62 arranged inside the male mold 47 and evenly distributed above the pressing plate 41, a first water-cooling part 63 arranged inside the female mold 54 and evenly distributed below the molding cavity 51, and a second water-cooling part 64 arranged inside the male mold 47 and evenly distributed above the pressing plate 41. The first heating part 61 is used to heat the molding cavity 51, the second heating part 62 is used to heat the pressing plate 41, the first water-cooling part 63 is used to adjust the temperature of the first heating part 61 so that the molding cavity 51 can maintain a constant stability, thereby making the hot pressing molding more stable, and the second water-cooling part 64 is used to adjust the temperature of the second heating part 62 so that the temperature of the pressing plate 41 remains constant and more stable. In the content defined in this embodiment, the first heating part 61 and the second heating part 62 both include oil heating pipes. The oil heating pipe can be one and evenly distributed in a circular shape inside the female mold 54 and the male mold 47. The oil heating pipe of the female mold 54 is located directly below the molding cavity 51, and the oil heating pipe of the male mold 47 is located directly above the pressing plate 41. When in use, high-temperature hot oil is injected into the oil heating pipe through an external heating structure to heat the oil heating pipe, thereby heating the female mold 54 and the molding cavity 51 as well as the male mold 47 and the pressing plate 41. A temperature sensor can be set on the female mold 54 to detect the temperature of the female mold 54 and the male mold in real time. The first water-cooling part 63 is located on the side away from the molding cavity 51 relative to the first heating part 61, and the second water-cooling part 64 is located on the side away from the pressing plate 41 relative to the second heating part 62. The first water-cooling part 63 and the second water-cooling part 64 both include water-cooling pipes, and the arrangement of the water-cooling pipes is the same as that of the oil-heating pipes. The first water-cooling part 63 and the second water-cooling part 64 are used to adjust the hot pressing temperature. When the temperature is too high, the temperature of the male mold 47 and the female mold 54 is reduced by water cooling until the temperature is at a suitable temperature. The first water-cooling part 63 and the second water-cooling part 64 are both located on the side away from the molding cavity 51 to avoid the temperature in the molding cavity 51 from cooling down too quickly during cooling, which affects the hot pressing effect. At the same time, the first water-cooling part 63 and the second water-cooling part 64 can respectively reduce the temperature of the female mold 54 on the side close to the first heat insulation plate 53 and the temperature of the male mold 47 on the side close to the second heat insulation plate 44, thereby improving the heat insulation effect.

[0044] It should be noted that all structures of the hot pressing forming device are made of high temperature resistant materials to ensure the hot pressing work.

[0045] One of the working principles of the magnetic electronic product protection back plate and hot pressing forming device of the present invention is as follows: first, the first main board 151, the third main board 153, the fourth main board 154 and the second main board 152 are stacked in sequence, and the first heating unit 61 and the second heating unit 62 heat the molding cavity 51 and the pressing plate 41 respectively, and then the second main board 152 is placed in the molding cavity 51 facing the bottom side of the molding cavity 51, and the stacked main boards are placed in the molding cavity 51, and the external driving device drives the upper mold 4 to move, and after the positioning column 562 is aligned with the positioning hole 46, the pressing plate 41 is gradually Approaching each main board, the pressing plate 41 then gradually presses each main board, thereby heating and squeezing each main board, until the male mold 47 and the female mold 54 abut against the height limit block 561, which is sufficient to extrude and deform each main board and fill the molding cavity 51 until it is formed. After hot pressing for a certain period of time, such as 700s, each protective main board 1 is formed, and after it cools down, the protective main board 1 is expelled with the assistance of the ejector pin 55. After that, the magnetic suction part 2 and the cover plate 3 are installed in the assembly groove 11 in turn, and the remaining part is finely processed until the formation and assembly of the magnetic suction type electronic product protective backplane is completed.

Claims

1. A magnetic electronic product protective back panel, characterized in that: It comprises a protective mainboard formed by stacking and hot-pressing two surface layer mainboards and at least one middle layer mainboard sandwiched between the two surface layer mainboards. A side surface of the protective mainboard is concavely provided with a plurality of assembly grooves corresponding to the magnetic attraction structure of the electronic product, each of the assembly grooves is provided with a magnetic attraction part, and a cover plate for blocking the assembly groove is provided in the notch of each assembly groove.

2. The magnetic electronic product protective back plate according to claim 1, characterized in that: The two surface main boards include a first main board and a second main board, and the middle main board includes a third main board and a fourth main board, the third main board is located on a side close to the first main board, and the fourth main board is located on a side close to the second main board; the first main board and the third main board are both made of semi-cured sheet materials, and the second main board and the fourth main board are both made of long fiber materials; a plurality of contoured openings are provided through the second main board at positions corresponding to the magnetic attraction structures of the electronic products, the shape of each contoured opening is adapted to the magnetic attraction structures of the electronic products, and each contoured opening forms the assembly groove after hot pressing.

3. The magnetic electronic product protective back plate according to claim 1, characterized in that: The protective main board is provided with ribs in a grid-like structure, and the notches of the assembly slots are flush with the ribs.

4. The magnetic electronic product protective back plate according to claim 1, characterized in that: Each of the assembly grooves is recessed with a plurality of independent sub-grooves, and the magnetic attraction parts are arranged in each sub-groove corresponding to the sub-grooves, and each of the assembly grooves is blocked by a cover plate; a stepped surface is formed between the groove opening of each sub-groove and the assembly groove, and the cover plate is adhered to the magnetic attraction part and the step surface by bonding.

5. The hot pressing forming device for the magnetic electronic product protective back plate according to any one of claims 1 to 4, characterized in that: It comprises an upper mould and a lower mould which can be interlocked, the top of the lower mould is concavely provided with a moulding cavity which is consistent with the shape contour of the protective mainboard, the bottom of the upper mould is convexly provided with a pressing plate for blocking one side of the opening of the moulding cavity, and a heating unit for heating the moulding cavity and the pressing plate is provided between the upper mould and the lower mould.

6. The hot pressing forming device according to claim 5, characterized in that: The lower mold comprises a base, a first heat insulation board arranged on the base, and a mother mold arranged on the first heat insulation board, a forming groove is formed on the top surface of the mother mold, and the forming cavity is formed at the bottom of the forming groove, and when the upper mold and the mother mold are buckled with each other and the upper mold contacts the top surface of the mother mold, the pressing plate is suspended at the cavity opening of the forming cavity; The heating unit comprises a first heating part which is arranged inside the mother mold and evenly distributed below the molding cavity, and the first heating part is used for heating the molding cavity.

7. The hot pressing forming device according to claim 6, characterized in that: The top surface of the base is concave to form a mounting groove with two sides passing through, the mounting groove is arranged vertically opposite to the molding cavity, the heat insulation plate cover is arranged above the mounting groove, a connecting plate that can move vertically in the mounting groove is arranged in the mounting groove, and a plurality of ejector pins arranged vertically upward are arranged on the connecting plate, and each of the ejector pins can vertically pass through the first heat insulation plate and penetrate into the molding cavity when the connecting plate moves upward.

8. The hot pressing forming device according to claim 5 or 6, characterized in that: On the top surface of the mother mold and at the periphery of the forming groove, there are symmetrically arranged height limiting blocks with the top protruding from the top surface of the mother mold. When the upper mold is buckled on the mother mold, it abuts against each height limiting block and the pressure plate hovers at the cavity mouth position of the molding cavity.

9. The hot pressing forming device according to claim 8, characterized in that: The upper mold comprises a top plate, a backing plate, a second heat insulation plate and a male mold connected in sequence from top to bottom, the bottom surface of the male mold is convexly formed with the pressing plate, and at least two positioning holes are concavely provided on the bottom surface of the male mold, and the positioning holes are symmetrically arranged on the outside of the pressing plate; A positioning column is protrudingly provided on the female mold at a position corresponding to the positioning hole, and the positioning column is vertically penetrated therein when the male mold is buckled with the female mold; The heating unit further comprises a second heating part which is arranged inside the male mold and evenly distributed above the pressing plate, and the second heating part is used for heating the pressing plate.

10. The hot pressing forming device according to claim 9, characterized in that: The heating unit also includes a first water-cooling part arranged inside the female mold and evenly distributed below the molding cavity, and a second water-cooling part arranged inside the male mold and evenly distributed above the pressing plate. The first water-cooling part is located on a side away from the molding cavity relative to the first heating part, and the second water-cooling part is located on a side away from the pressing plate relative to the second heating part.

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