Positioning device and processing method of printed board module for wave soldering

Abstract

The invention discloses a positioning device and a processing method of a printed board module for wave soldering, and belongs to the technical field of printed boards. The positioning device comprises a bottom plate and a positioning assembly; the bottom plate is provided with an avoiding hole for avoiding a printed board on the printed board module; the positioning assembly comprises a fixing block, a first guide rail, a second guide rail, a third guide rail and a fourth guide rail, the fixing block is located on the bottom plate, the first guide rail and the second guide rail are arranged on the bottom plate, sliding grooves extending in the first direction are formed in the first guide rail and the second guide rail correspondingly, and the two ends of the third guide rail are slidably inserted into the sliding grooves correspondingly; a first movable block and a second movable block are arranged on the third guide rail, and a third movable block is arranged on the fourth guide rail. The positioning device of the printed board module for wave soldering provided by the embodiment of the invention not only can position and clamp shells of printed board module assemblies with different shapes and sizes, but also can improve the welding consistency and reliability of components on a printed board during welding.

Description

Technical Field

[0001] The invention belongs to the technical field of printed circuit boards, and in particular relates to a positioning device and a processing method for a printed circuit board module used for wave soldering. Background Art

[0002] Printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connection between electronic components.

[0003] In the related art, the printed circuit board module includes a printed circuit board and a housing, wherein the printed circuit board is fixed on the housing, and multiple components are welded on the printed circuit board. During the production process of the printed circuit board module, the printed circuit board and the housing are first assembled (the housing is a square frame structure, and the printed circuit board is fixed in the housing), and then the components are inserted into the through holes of the printed circuit board (the components are also fixed to the housing through the ears), and finally the multiple components are manually welded on the printed circuit board.

[0004] However, there are uncontrollable factors in manual welding, and the welding quality depends entirely on the workers' technical level, and the consistency of quality of each printed circuit board module cannot be guaranteed. Summary of the invention

[0005] In view of the above defects or improvement needs of the prior art, the present invention provides a positioning device and processing method for a printed circuit board module for wave soldering, the purpose of which is not only to position and clamp the shells of printed circuit board module assemblies of different shapes and sizes, but also to cooperate with wave soldering to improve the consistency and reliability of soldering of components on the printed circuit board during welding.

[0006] To achieve the above-mentioned object, in a first aspect, the present invention provides a positioning device for a printed circuit board module for wave soldering, the positioning device comprising a base plate and a positioning assembly; The bottom plate is provided with a avoidance hole for avoiding the printed circuit board on the printed circuit board module; The positioning assembly includes a fixed block, a first guide rail, a second guide rail, a third guide rail and a fourth guide rail, the fixed block is located on the bottom plate, the first guide rail and the second guide rail are arranged on the bottom plate in parallel and at intervals, a first overlap is provided on the side of the first guide rail, a second overlap is provided on the side of the second guide rail, the first overlap and the second overlap are arranged in parallel and at intervals, and both extend out of the bottom plate to be respectively placed on rollers of wave soldering, the first guide rail and the second guide rail are both provided with a slide groove extending along the first direction, the third guide rail and the fourth guide rail are arranged on the bottom plate in parallel and at intervals, two ends of the third guide rail are respectively slidably inserted into the slide groove, the third guide rail is provided with two first movable blocks and a second movable block that can slide along the second direction, the fourth guide rail is provided with a third movable block that can slidably cooperate along the second direction, and a positioning space for clamping the upper shell of the printed circuit board module is formed between the fixed block, the first movable block, the second movable block and the third movable block.

[0007] Optionally, the fixed block, the first movable block, the second movable block and the third movable block are all provided with L-shaped steps on one side facing the positioning space to respectively correspond to the four right angles of the upper shell supporting the printed circuit board module.

[0008] Optionally, sliders are provided at both ends of the third guide rail, the sliders are slidably matched with the corresponding slide grooves, and the sliders and the slide grooves are both dovetail structures or T-shaped structures.

[0009] Optionally, the positioning device also includes two spaced-apart connecting blocks, each of the connecting blocks includes a first connecting portion and a second connecting portion connected to each other, the first connecting portion and the second connecting portion are arranged in an L shape, the first connecting portion is located on the third guide rail, and the first movable block and the second movable block are located between the two first connecting portions, and the second connecting portion is connected to the top surface of the corresponding slider.

[0010] Optionally, the first connecting portion has a through hole, the third guide rail is inserted into a corresponding through hole, and the first connecting portion and the third guide rail are connected together by bolts.

[0011] Optionally, a first locking bolt is inserted into the second connecting portion, and the first locking bolt passes through the second connecting portion and abuts against the first guide rail or the second guide rail.

[0012] Optionally, guide grooves are provided on the first movable block, the second movable block and the third movable block, the third guide rail and the fourth guide rail extend along the second direction, and the guide grooves are slidably matched with the corresponding third guide rail or the fourth guide rail.

[0013] Optionally, a second locking bolt is inserted into the first movable block, the second movable block and the third movable block, and the second locking bolt passes through the first movable block, the second movable block or the third movable block and then abuts against the third guide rail or the fourth guide rail.

[0014] Optionally, limit blocks are provided at both ends of the fourth guide rail to limit the third movable block.

[0015] In a second aspect, the present invention provides a method for processing a printed circuit board module for wave soldering, the processing method is based on the positioning device described above, and the processing method comprises: Abut one side of the upper shell of the printed circuit board module against one side of the fixed block, and move the third movable block so that one side of the third movable block abuts against the other side of the upper shell of the printed circuit board module; Move the third guide rail toward the upper shell of the printed board module, and make the first movable block and the second movable block abut against the upper shell of the printed board module, so as to realize the clamping and positioning of the upper shell of the printed board module by forming the positioning space; The first overlap and the second overlap are placed on rollers of wave soldering respectively, enter the soldering zone of wave soldering through the rollers, and automatically solder the components on the printed circuit board in the wave soldering through soldering selection programming.

[0016] The above-mentioned improved technical features can be combined with each other as long as they do not conflict with each other.

[0017] In general, compared with the prior art, the above technical solution conceived by the present invention has the following beneficial effects: For a positioning device for a printed circuit board module for wave soldering provided in an embodiment of the present invention, before soldering the printed circuit board module (at this time, the printed circuit board is fixed on the shell), first, one side of the upper shell of the printed circuit board module is abutted against one side of the fixed block, and the third movable block is moved so that one side of the third movable block is abutted against the other side of the upper shell of the printed circuit board module. At this time, the two sides of the shell can be positioned by the first fixed block and the third movable block. Then, the third guide rail is moved toward the upper shell of the printed circuit board module, and the first movable block and the second movable block are abutted against the upper shell of the printed circuit board module, so as to realize the clamping and positioning of the upper shell of the printed circuit board module by forming a positioning space. At this time, at least four sides of the shell are clamped and positioned. In addition, since the positions of the first movable block, the second movable block and the third movable block on the bottom plate are adjustable, the shells of printed circuit board module assemblies of different shapes and sizes can be positioned and clamped. Finally, the first overlap and the second overlap are placed on the roller of wave soldering respectively, and the roller enters the welding zone of wave soldering, and the components on the printed circuit board are automatically welded in the wave soldering through the welding selection programming. During wave soldering, the printed circuit board is automatically welded from the bottom of the base plate and through the avoidance holes of the base plate. The wave crest, speed, welding time, etc. can be controlled, which improves the consistency and reliability of the welding of components on the printed circuit board during welding, and avoids the problem of inconsistent quality of each printed circuit board module caused by manual welding of components.

[0018] That is to say, the positioning device of a printed circuit board module for wave soldering provided in an embodiment of the present invention can not only position and clamp the shell of a printed circuit board module assembly of different shapes and sizes, but also can be used in conjunction with wave soldering, thereby improving the consistency and reliability of soldering of components on the printed circuit board during soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a structural schematic diagram of a positioning device for a printed circuit board module for wave soldering according to an embodiment of the present invention; Figure 2 is a schematic structural diagram of a base plate provided by an embodiment of the present invention; Figure 3 is a schematic structural diagram of a first guide rail provided in an embodiment of the present invention; Figure 4 is a schematic structural diagram of a second guide rail provided in an embodiment of the present invention; Figure 5 is a schematic diagram of the assembly of the third guide rail provided in an embodiment of the present invention; Figure 6 is a schematic structural diagram of a third guide rail provided in an embodiment of the present invention; Figure 7 is a schematic diagram of the assembly of the fourth guide rail provided in an embodiment of the present invention; Figure 8is a schematic structural diagram of a fourth guide rail provided in an embodiment of the present invention; Fig. 9 is a schematic structural diagram of a fixing block provided in an embodiment of the present invention; Fig.10 is a schematic structural diagram of a slider provided by an embodiment of the present invention; Fig.11 is a schematic diagram of the structure of a connection block provided in an embodiment of the present invention; Fig.12 is a structural schematic diagram of a first movable block provided by an embodiment of the present invention; Fig.13 is a structural schematic diagram of a second movable block provided by an embodiment of the present invention; Fig.14 is a schematic structural diagram of a third active block provided by an embodiment of the present invention; Fig.15 The present invention provides a flowchart of a method for processing a printed circuit board module for wave soldering.

[0020] In all the drawings, the same reference numerals represent the same technical features, specifically: 1. Bottom plate; 11. Avoidance hole; 12. Positioning hole; 13. Threaded hole; 14. Positioning pin; 15. Bolt; 2. Fixed block; 3. First guide rail; 31. First overlap; 4. Second guide rail; 41. Second overlap; 5. Third guide rail; 51. First movable block; 52. Second movable block; 53. Slider; 54. Connecting block; 541. First connecting part; 5411. Through hole; 542. Second connecting part; 543. First locking bolt; 6. Fourth guide rail; 61. Third movable block; 62. Limiting block; 63. Plug; 7. Slide groove; 71. Bolt through hole; 8. L-shaped step; 9. Guide groove; 10. Second locking bolt; 100. Housing; 200. Printed circuit board. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0022] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0023] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0024] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0025] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0026] Example: Figure 1 is a structural schematic diagram of a positioning device for a printed circuit board module for wave soldering according to an embodiment of the present invention, such as Figure 1 As shown, the positioning device includes a base plate 1 and a positioning component.

[0027] Figure 2is a schematic diagram of the structure of the base plate provided by an embodiment of the present invention, such as Figure 2 As shown, the bottom plate 1 has a avoiding hole 11 for avoiding the printed circuit board 200 on the printed circuit board module.

[0028] The positioning assembly includes a fixed block 2, a first guide rail 3, a second guide rail 4, a third guide rail 5 and a fourth guide rail 6. The fixed block 2 is located on the base plate 1, and the first guide rail 3 and the second guide rail 4 are arranged on the base plate 1 in parallel and at intervals.

[0029] Figure 3 is a schematic structural diagram of a first guide rail provided in an embodiment of the present invention, Figure 4 is a schematic diagram of the structure of the second guide rail provided in an embodiment of the present invention, such as Figure 3 and Figure 4 As shown, a first overlap 31 is provided on the side of the first guide rail 3, and a second overlap 41 is provided on the side of the second guide rail 4. The first overlap 31 and the second overlap 41 are arranged in parallel and spaced apart, and both extend out of the base plate 1 so as to be placed on the rollers of the wave soldering respectively. The first guide rail 3 and the second guide rail 4 are both provided with a slide groove 7 extending along the first direction (X-axis direction), and the third guide rail 5 and the fourth guide rail 6 are arranged in parallel and spaced apart on the base plate 1.

[0030] Figure 5 is a schematic diagram of the assembly of the third guide rail provided in an embodiment of the present invention, Figure 6 is a schematic diagram of the structure of the third guide rail provided in an embodiment of the present invention, Figure 5 and Figure 6 As shown, both ends of the third guide rail 5 are slidably inserted into the slide groove 7 respectively, and the third guide rail 5 is provided with two first movable blocks 51 and second movable blocks 52 which can slide along the second direction (Y-axis direction).

[0031] Figure 7 is a schematic diagram of assembling the fourth guide rail provided in an embodiment of the present invention, Figure 8 is a schematic diagram of the structure of the fourth guide rail provided in an embodiment of the present invention, combined with Figure 7 and Figure 8 As shown, a third movable block 61 slidably engaged along the second direction is disposed on the fourth guide rail 6, and a positioning space for clamping the upper housing 100 of the printed circuit board module is formed between the fixed block 2, the first movable block 51, the second movable block 52 and the third movable block 61.

[0032] For a positioning device for a printed circuit board module for wave soldering provided in an embodiment of the present invention, before soldering the printed circuit board module (at this time, the printed circuit board 200 is fixed on the housing 100), first, one side of the upper housing 100 of the printed circuit board module is abutted against one side of the fixed block 2, and the third movable block 61 is moved so that one side of the third movable block 61 is abutted against the other side of the upper housing 100 of the printed circuit board module. At this time, the two sides of the housing 100 can be positioned by the first fixed block 2 and the third movable block 61. Then, the third guide rail 5 is moved toward the upper housing 100 of the printed circuit board module, and the first movable block 51 and the second movable block 52 are abutted against the upper housing 100 of the printed circuit board module, so as to realize the clamping and positioning of the upper housing 100 of the printed circuit board module by forming a positioning space. At this time, at least four sides of the housing 100 are clamped and positioned. Furthermore, since the positions of the first movable block 51, the second movable block 52 and the third movable block 61 on the bottom plate 1 are adjustable, the housing 100 of the printed circuit board module assembly of different shapes and sizes can be positioned and clamped. Finally, the first overlap 31 and the second overlap 41 are respectively placed on the rollers of the wave soldering, and the rollers enter the welding area of ​​the wave soldering, and the components on the printed circuit board 200 are automatically welded in the wave soldering through the welding selection programming. During wave soldering, the printed circuit board 200 is automatically welded from the bottom plate 1 and through the avoidance hole 11 of the bottom plate 1. The wave crest, speed, welding time, etc. can be controlled, which improves the consistency and reliability of the welding of components on the printed circuit board 200 during welding, and avoids the problem of inconsistent quality of each printed circuit board module caused by manual welding of components.

[0033] That is to say, the positioning device of a printed circuit board module for wave soldering provided in an embodiment of the present invention can not only position and clamp the shell 100 of the printed circuit board module assembly of different shapes and sizes, but also can be used in conjunction with wave soldering, thereby improving the consistency and reliability of soldering of components on the printed circuit board 200 during soldering.

[0034] It is easy to understand that the positioning device can not only position and clamp the shell 100 of the printed circuit board module assembly of different shapes and sizes, but also provide overlaps (first overlap 31 and second overlap 41) that are compatible with the rollers on the wave soldering equipment, so that it can match the wave soldering equipment while positioning and clamping.

[0035] Exemplarily, the first guide rail 3 and the second guide rail 4 are both provided with bolt through holes 71 corresponding to the slide slots 7. The bottom plate 1 is provided with a plurality of threaded holes 13 and a plurality of positioning holes 12.

[0036] In one implementation of the present invention, the fixing block 2 (see Fig. 9), the first movable block 51, the second movable block 52 and the third movable block 61 are all provided with L-shaped steps 8 on one side facing the positioning space to respectively correspond to the four right angles supporting the upper shell 100 of the printed circuit board module.

[0037] In the above embodiment, the L-shaped step 8 can clamp and position the housing 100 and can also horizontally support the housing 100 , thereby avoiding the risk of the printed circuit board module assembly falling off the base plate 1 .

[0038] Exemplarily, the fixing block 2 is located at one end of the first guide rail 3 and one end of the fourth guide rail 6. The fixing block 2 is provided with a positioning hole 12 and a bolt through hole 71, and the fixing block 2 is fixed to the bottom plate 1 by inserting a positioning pin 14 and a bolt 15.

[0039] It should be noted that in other embodiments of the present invention, positioning grooves may be further provided on the side of the fixed block 2, the first movable block 51, the second movable block 52 and the third movable block 61 facing the positioning space, and positioning support may be performed by plugging and cooperating with the shell 100, and the present invention does not impose any limitation on this.

[0040] Fig.10 is a schematic diagram of the structure of a slider provided by an embodiment of the present invention, such as Fig.10 As shown, sliders 53 are provided at both ends of the third guide rail 5 , and the sliders 53 are slidably matched with the corresponding slide grooves 7 , and both the sliders 53 and the slide grooves 7 are dovetail structures or T-shaped structures.

[0041] In the above embodiment, the slider 53 facilitates the sliding fit between the third guide rail 5 and the slide groove 7. In addition, the slider 53 and the slide groove 7 are both dovetail structures or T-shaped structures, which can effectively prevent the slider 53 from being separated from the slide groove 7 during the sliding fit process.

[0042] Fig.11 is a schematic diagram of the structure of the connection block provided in an embodiment of the present invention, such as Fig.11 As shown, the positioning device further includes two spaced connection blocks 54, each connection block 54 includes a first connection portion 541 and a second connection portion 542 connected to each other, the first connection portion 541 and the second connection portion 542 are arranged in an L shape, the first connection portion 541 is located on the third guide rail 5, and the first movable block 51 and the second movable block 52 are located between the two first connection portions 541, and the second connection portion 542 is connected to the top surface of the corresponding slider 53. The connection block 54 serves to connect the third guide rail 5 and the slider 53.

[0043] In addition, the first connecting portion 541 has a through hole 5411, and the third guide rail 5 is inserted into the opposite through hole 5411, and the first connecting portion 541 and the third guide rail 5 are connected together by bolts. The through hole 5411 can be used to position the third guide rail 5 on the connecting block 54, and the bolts can be used to achieve a reliable connection between the two.

[0044] Exemplarily, threaded holes 13 and positioning holes 12 are provided at both ends of the third guide rail 5 .

[0045] In this embodiment, a first locking bolt 543 is inserted into the second connecting portion 542 . The first locking bolt 543 penetrates through the second connecting portion 542 and abuts against the first guide rail 3 or the second guide rail 4 .

[0046] In the above embodiment, the first locking bolt 543 can lock the sliding of the connecting block 54 , thereby locking the sliding of the sliding block 53 .

[0047] Exemplarily, a through hole is provided on the slider 53 to achieve the avoidance of the first locking bolt 543 .

[0048] Fig.12 is a schematic structural diagram of a first movable block provided in an embodiment of the present invention, Fig.13 is a schematic diagram of the structure of a second active block provided by an embodiment of the present invention, Fig.14 is a schematic diagram of the structure of the third active block provided in an embodiment of the present invention, combined with Figure 12-14 As shown, the first movable block 51 , the second movable block 52 and the third movable block 61 are all provided with guide grooves 9 , the third guide rail 5 and the fourth guide rail 6 both extend along the second direction, and the guide grooves 9 are slidably matched with the corresponding third guide rail 5 or fourth guide rail 6 .

[0049] In the above embodiment, the first movable block 51 , the second movable block 52 and the third movable block 61 can be slidably matched with the corresponding guide rails through the guide groove 9 , thereby ensuring stability during the sliding process.

[0050] Exemplarily, the guide groove 9 may be a dovetail structure or a T-shaped structure.

[0051] Similarly, the first movable block 51, the second movable block 52 and the third movable block 61 are all inserted with the second locking bolt 10. The second locking bolt 10 passes through the first movable block 51, the second movable block 52 or the third movable block 61 and then abuts against the third guide rail 5 or the fourth guide rail 6, thereby locking the corresponding movable block through the second locking bolt 10.

[0052] It should be noted that in other embodiments of the present invention, the first movable block 51, the second movable block 52 and the third movable block 61 can also be locked by sliding through positioning pins (a plurality of positioning holes arranged at intervals are provided on the third guide rail 5 and the fourth guide rail 6, and the positioning pins are inserted into the corresponding positioning holes).

[0053] Exemplarily, the first movable block 51, the second movable block 52 and the third movable block 61 are all provided with threaded holes 13 for inserting the second locking bolt 10. The fourth guide rail 6 is provided with a positioning hole 12 and a bolt through hole 71. Among them, a plug 63 is movably inserted in the bolt through hole 71, so that after the fourth guide rail 6 is fixed by inserting a bolt through the bolt through hole 71, the bolt through hole 71 can be filled through the plug 63, ensuring that the surface of the fourth guide rail 6 is flush and the second locking bolt 10 is locked.

[0054] In this embodiment, limit blocks 62 are provided at both ends of the fourth guide rail 6 to limit the third movable block 61 and prevent the third movable block 61 from detaching from the fourth guide rail 6 during the sliding process.

[0055] Exemplarily, a threaded hole 13 is provided at the end of the fourth guide rail 6 , so that the fourth guide rail 6 and the limit block 62 are connected by bolts.

[0056] Similarly, both the first guide rail 3 and the second guide rail 4 are provided with limit blocks 62 .

[0057] In general, compared with the prior art, the positioning device can achieve the following beneficial effects: 1. The present invention can be applied to the installation of printed circuit board module components of different sizes through guide rails and movable movable blocks, has strong versatility, and is simple and convenient to operate.

[0058] 2. The present invention has accurate positioning and reliable clamping. By utilizing selective welding programming, the consistency and stability of welding quality are significantly improved, thus avoiding the uncontrollable factors and quality risks of manual welding.

[0059] 3. The present invention uses wave soldering to replace manual soldering, which shortens the soldering time, reduces the labor intensity, improves the production efficiency, and meets the needs of mass production.

[0060] Fig.15 1 is a flow chart of a method for processing a printed circuit board module for wave soldering provided by an embodiment of the present invention, such as Fig.15 As shown, the processing method is based on the above positioning device, and the processing method includes: S1. Abut one side of the upper housing 100 of the printed circuit board module against one side of the fixed block 2, and move the third movable block 61 so that one side of the third movable block 61 abuts against the other side of the upper housing 100 of the printed circuit board module.

[0061] S2. Move the third guide rail 5 toward the upper shell 100 of the printed circuit board module, and make the first movable block 51 and the second movable block 52 abut against the upper shell 100 of the printed circuit board module, so as to achieve the clamping and positioning of the upper shell 100 of the printed circuit board module by forming a positioning space.

[0062] S3, placing the first overlap 31 and the second overlap 41 on the rollers of wave soldering respectively, entering the soldering zone of wave soldering through the rollers, and automatically soldering the components on the printed circuit board 200 in the wave soldering through the soldering selection programming.

[0063] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A positioning device for a printed circuit board module for wave soldering, characterized in that: The positioning device comprises a base plate (1) and a positioning component; The bottom plate (1) is provided with a avoidance hole (11) for avoiding the printed circuit board (200) on the printed circuit board module; The positioning assembly comprises a fixed block (2), a first guide rail (3), a second guide rail (4), a third guide rail (5) and a fourth guide rail (6); the fixed block (2) is located on the bottom plate (1); the first guide rail (3) and the second guide rail (4) are arranged in parallel and spaced apart on the bottom plate (1); a first overlap (31) is provided on the side of the first guide rail (3); a second overlap (41) is provided on the side of the second guide rail (4); the first overlap (31) and the second overlap (41) are arranged in parallel and spaced apart and both extend out of the bottom plate (1) so as to be placed on the rollers of the wave soldering respectively; and the first guide rail (3) and the second guide rail (4) are both provided with A slide groove (7) extending in a first direction is provided, the third guide rail (5) and the fourth guide rail (6) are arranged in parallel and spaced apart on the bottom plate (1), the two ends of the third guide rail (5) are respectively slidably inserted into the slide groove (7), the third guide rail (5) is provided with two first movable blocks (51) and a second movable block (52) which can slide in a second direction, the fourth guide rail (6) is provided with a third movable block (61) which can slide in the second direction, and a positioning space for clamping an upper shell (100) of a printed circuit board module is formed between the fixed block (2), the first movable block (51), the second movable block (52) and the third movable block (61).

2. A positioning device for a printed circuit board module for wave soldering according to claim 1, characterized in that: The fixed block (2), the first movable block (51), the second movable block (52) and the third movable block (61) are all provided with L-shaped steps (8) on one side facing the positioning space, so as to respectively correspond to the four right angles of the upper shell (100) supporting the printed circuit board module.

3. A positioning device for a printed circuit board module for wave soldering according to claim 1, characterized in that: Both ends of the third guide rail (5) are provided with sliders (53), the sliders (53) are slidably matched with the corresponding slide grooves (7), and the sliders (53) and the slide grooves (7) are both dovetail structures or T-shaped structures.

4. A positioning device for a printed circuit board module for wave soldering according to claim 3, characterized in that: The positioning device further comprises two spaced-apart connection blocks (54), each of the connection blocks (54) comprising a first connection portion (541) and a second connection portion (542) connected to each other, the first connection portion (541) and the second connection portion (542) being arranged in an L shape, the first connection portion (541) being located on the third guide rail (5), and the first movable block (51) and the second movable block (52) being located between the two first connection portions (541), and the second connection portion (542) being connected to the top surface of the corresponding sliding block (53).

5. A positioning device for a printed circuit board module for wave soldering according to claim 4, characterized in that: The first connecting portion (541) has a through hole (5411), the third guide rail (5) is inserted into an opposite through hole (5411), and the first connecting portion (541) and the third guide rail (5) are connected together by bolts.

6. A positioning device for a printed circuit board module for wave soldering according to claim 4, characterized in that: A first locking bolt (543) is inserted into the second connecting portion (542); the first locking bolt (543) penetrates the second connecting portion (542) and abuts against the first guide rail (3) or the second guide rail (4).

7. A positioning device for a printed circuit board module for wave soldering according to claim 1, characterized in that: The first movable block (51), the second movable block (52) and the third movable block (61) are all provided with guide grooves (9); the third guide rail (5) and the fourth guide rail (6) both extend along the second direction; the guide grooves (9) are slidably matched with the corresponding third guide rail (5) or the fourth guide rail (6).

8. A positioning device for a printed circuit board module for wave soldering according to claim 7, characterized in that: The first movable block (51), the second movable block (52) and the third movable block (61) are all inserted with a second locking bolt (10); the second locking bolt (10) penetrates the first movable block (51), the second movable block (52) or the third movable block (61) and abuts against the third guide rail (5) or the fourth guide rail (6).

9. A positioning device for a printed circuit board module for wave soldering according to any one of claims 1 to 8, characterized in that: Limiting blocks (62) are provided at both ends of the fourth guide rail (6) to limit the position of the third movable block (61).

10. A method for processing a printed circuit board module for wave soldering, characterized in that: The processing method is based on the positioning device according to any one of claims 1 to 9, and the processing method comprises: Abutting one side of the printed circuit board module upper housing (100) against one side of the fixed block (2), and moving the third movable block (61) so that one side of the third movable block (61) abuts against the other side of the printed circuit board module upper housing (100); Moving the third guide rail (5) in the direction of the printed board module upper shell (100), and making the first movable block (51) and the second movable block (52) abut against the printed board module upper shell (100), thereby achieving clamping and positioning of the printed board module upper shell (100) by forming the positioning space; The first overlap (31) and the second overlap (41) are respectively placed on rollers of wave soldering, enter the soldering zone of wave soldering through the rollers, and automatically solder components on the printed circuit board (200) in the wave soldering through soldering selection programming.

Images