Cooling device, display panel and display screen

Abstract

The invention relates to a cooling device, a display panel and a display screen, the cooling device is applied to the display panel, the display panel comprises a unit plate, the cooling device comprises a body, the body is provided with a cavity and an air guide port, the air guide port is communicated with the cavity and the external environment, and the body is used for being in heat conduction connection with the unit plate; and the at least one telescopic piece is mounted on the body, and the telescopic piece is configured to change the size of the cavity in the cavity during telescopic action so as to generate airflow flowing into or out of the cavity from the air guide port. The body of the cooling device is in heat conduction connection with the unit plate, so that heat on the unit plate is transmitted to the body in a heat conduction mode, and compared with an original radiation heat dissipation mode, the cooling device has higher heat dissipation efficiency; the size of the cavity in the cavity can be changed when the telescopic part stretches out and draws back, so that gas is driven to enter and exit from the cavity through increase and decrease of the pressure in the cavity, disturbance is formed, the gas flow is increased, the heat dissipation efficiency is improved, heat accumulation is avoided, and the service life of the display panel and the display screen is prolonged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a cooling device, a display panel and a display screen. Background Art

[0002] The LED screen is mainly composed of unit boards (modules), hub boards and cabinets. When the screen is powered on, the LED chips convert electrical energy mainly into light energy, but at the same time, part of the electrical energy is also converted into heat energy and released into the external environment. In addition, the cabinet contains power devices, which also generate heat energy during operation.

[0003] During the long-term use of the LED screen, the heat is mainly conducted outward by radiation, resulting in heat accumulation inside the screen, causing the surface temperature of the screen to gradually increase with the increase of use time. Especially as the pixel pitch of the LED screen decreases, this problem of heat accumulation becomes more significant.

[0004] Some existing LED display screens have openings on the edge of the box for air circulation, but since there is basically no disturbance inside the box, the air circulation is low and thus the heat dissipation capacity is limited. Summary of the invention

[0005] Based on this, it is necessary to provide a cooling device, display panel and display screen to address the problem that during long-term use of the LED screen, heat accumulates inside the screen, causing the screen surface temperature to gradually increase with the increase in usage time.

[0006] The present application provides a cooling device, which is applied to a display panel, wherein the display panel includes a unit board, and the cooling device includes: a main body, having a chamber and an air duct, wherein the air duct connects the chamber and the external environment, and the main body is used for thermal connection with the unit board; at least one telescopic member is installed on the main body, and the telescopic member is configured to change the size of the cavity in the chamber during telescopic action to generate an airflow flowing into or out of the chamber through the air duct.

[0007] According to one embodiment of the present application, at least one mounting groove is provided inside the main body, the mounting groove is connected to the chamber, and the telescopic member is installed in the mounting groove.

[0008] According to one embodiment of the present application, the telescopic member is partially located in the chamber, and the telescopic member is configured to change the volume of the portion of the telescopic member located in the chamber during the telescopic action to change the size of the cavity in the chamber; or, a diaphragm is provided between the mounting groove and the chamber, the telescopic member is connected to the diaphragm, and the telescopic member is configured to drive the diaphragm to produce a movement toward or away from the chamber during the telescopic action to change the size of the cavity in the chamber.

[0009] According to one embodiment of the present application, the telescopic member is made of magnetostrictive material or electrostrictive material.

[0010] According to one embodiment of the present application, there are multiple telescopic parts in the cooling device.

[0011] According to one embodiment of the present application, the cooling device also includes thermally conductive adhesive; the main body and the unit plate are connected by the thermally conductive adhesive, or the display panel also includes a bottom shell, and the unit plate and the bottom shell and / or the bottom shell and the main body are connected by the thermally conductive adhesive.

[0012] According to one embodiment of the present application, the thermally conductive adhesive includes an adhesive material and a thermally conductive material, the adhesive material includes an epoxy resin polymer and an acrylic polymer, and the present application also provides a combination of one or both, and the thermally conductive material includes a thermally conductive ceramic powder material.

[0013] The present application also provides a display panel, comprising: a unit board having a display side and a back display side; a cooling device of the above embodiment, located on the back display side of the unit board, and a body of the cooling device being thermally connected to the unit board.

[0014] According to one embodiment of the present application, it also includes: a bottom shell connected to the back display side of at least one of the unit boards and to the body, and the bottom shell is provided with at least one hollow hole.

[0015] The present application also provides a display screen, comprising: a housing; a cooling device or a display panel of the above-mentioned embodiment, installed in the housing; and a power supply device, installed in the housing and electrically connected to the unit board.

[0016] The above-mentioned cooling device, display panel and display screen, the main body of the cooling device is thermally connected to the unit board, so that the heat on the unit board can be transferred to the main body by heat conduction, which has higher heat dissipation efficiency than the original radiation heat dissipation method. In addition, the telescopic part of the cooling device can change the size of the cavity in the chamber during the telescopic action, thereby driving the gas in and out of the chamber through the increase and decrease of the pressure in the chamber, forming a disturbance, increasing the gas flow rate, further improving the heat dissipation efficiency, avoiding heat accumulation, and helping to increase the service life of the display panel and the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A front view of a cooling device and a unit plate matching structure provided in one embodiment of the present application.

[0018] Figure 2 A side view of a cooling device and a unit plate cooperation structure provided in one embodiment of the present application.

[0019] Figure 3 A cross-sectional view of a cooling device provided in one embodiment of the present application.

[0020] Figure 4 A cross-sectional view of a cooling device provided in another embodiment of the present application.

[0021] Figure 5 A bottom view of a cooling device provided in another embodiment of the present application.

[0022] Figure 6 A front view of a cooling device provided in another embodiment of the present application.

[0023] Figure 7 A schematic diagram of the gas flow state in a cooling device provided in another embodiment of the present application.

[0024] Figure 8 A cross-sectional view of the cooperation structure of a cooling device, a bottom shell and a unit plate provided in another embodiment of the present application.

[0025] Fig. 9 An exploded view of a display screen provided in accordance with an embodiment of the present application.

[0026] Reference numerals:

[0027] 100. Unit board;

[0028] 200, bottom shell; 210, hollow hole; 220, ventilation hole;

[0029] 300, cooling device; 310, body; 311, chamber; 312, air guide port; 313, mounting slot; 320, telescopic member; 330, diaphragm;

[0030] 400, power supply device; 410, power supply; 420, box HUB board; 430, module HUB board;

[0031] 500. Cabinet. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0033] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0034] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0035] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0036] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0038] See also Figure 1 and Figure 2 , Figure 1 A front view of a cooling device and a unit plate matching structure provided in one embodiment of the present application. Figure 2 A side view of a cooling device and a unit plate cooperation structure provided in one embodiment of the present application. Figure 1 and Figure 2 The dashed lines in indicate interior lines.

[0039] The cooling device 300 is applied to a display panel, the display panel includes a unit board 100, and the cooling device 300 includes a body 310 and at least one telescopic member 320. The body 310 has a chamber 311 and an air guide 312, the air guide 312 connects the chamber 311 and the external environment, and the body 310 is used for thermal connection with the unit board 100. The telescopic member 320 is installed on the body 310, and the telescopic member 320 is configured to change the size of the cavity in the chamber 311 during the telescopic action, so as to generate an airflow flowing into or out of the chamber 311 from the air guide 312.

[0040] In this embodiment, the air in the chamber 311 can flow out through the air guide 312, and the air in the external environment can also flow into the chamber 311 through the air guide 312. The telescopic member 320 changes the size of the cavity in the chamber 311 through the telescopic action, which can change the air pressure in the chamber 311, thereby generating an airflow flowing into or out of the chamber 311 through the air guide 312. Specifically, when the cavity in the chamber 311 becomes smaller, its internal air pressure becomes larger, so that at least part of the air in the chamber 311 flows out through the air guide 312. When the cavity in the chamber 311 becomes larger, its internal air pressure decreases, so that part of the air in the external environment flows into the chamber 311 through the air guide 312. The airflow generated thereby can improve the heat dissipation efficiency and avoid heat accumulation.

[0041] The above-mentioned heat-conducting connection refers to direct heat conduction between the body 310 and the unit board 100, or indirect heat conduction between the body 310 and the unit board 100 through other components. The heat generated by the unit board 100 is transferred by heat conduction, which can make the heat generated by the unit board 100 transfer to the body 310 faster, thereby reducing the adverse effects of heat on the unit board 100.

[0042] Combination Figure 1 In order to install the telescopic member 320, in some embodiments, at least one mounting groove 313 is provided inside the body 310, and the mounting groove 313 is connected to the chamber 311, or in other words, the mounting groove 313 is provided on one side wall of the chamber 311. The telescopic member 320 is installed in the mounting groove 313. The present embodiment does not specifically limit the shape of the mounting groove 313, as long as it can meet the installation requirements of the telescopic member 320 and enable the telescopic member 320 to complete the telescopic action according to the working requirements, for example, one end of the telescopic member 320 is inserted into the mounting groove 313 and fixed, and the other end can be movable.

[0043] The telescopic member 320 in this embodiment can have a variety of installation methods, as long as the function of changing the size of the cavity in the chamber 311 during the telescopic action can be achieved, it should be within the protection scope of this embodiment. The following will describe in detail two installation methods of the telescopic member 320 with specific examples:

[0044] In an optional form, the mounting groove 313 is connected to the chamber 311, and part of the telescopic member 320 is located in the mounting groove 313, and the other part is located in the chamber 311. The volume of the part of the telescopic member 320 located in the chamber 311 can be adjusted by the telescopic action of the telescopic member 320, that is, the size of the space occupied by the telescopic member 320 in the chamber 311 is adjusted, thereby changing the size of the cavity in the chamber 311. When the telescopic member 320 is extended, the space occupied by the telescopic member 320 in the chamber 311 increases, the cavity in the chamber 311 becomes smaller, the air pressure in the chamber 311 increases, and part of the air in the chamber 311 is forced to be discharged. When the telescopic member 320 is shortened, the space occupied by the telescopic member 320 in the chamber 311 decreases, the cavity in the chamber 311 becomes larger, the air pressure in the chamber 311 decreases, and air in the external environment is forced to enter the chamber 311.

[0045] In this embodiment, a seal can be formed between the telescopic member 320 and the main body 310 at the connection position between the mounting groove 313 and the chamber 311 by reducing the size of the mounting groove 313 or adding sealant, thereby avoiding gas exchange between the mounting groove 313 and the chamber 311 during the telescopic process of the telescopic member 320.

[0046] Please refer to the following Figure 3 and Figure 4 , Figure 3 A cross-sectional view of a cooling device provided in one embodiment of the present application. Figure 4 A cross-sectional view of a cooling device provided in another embodiment of the present application.

[0047] In another optional form, there is a diaphragm 330 between the mounting groove 313 and the chamber 311, and the telescopic member 320 is connected to the diaphragm 330, and the telescopic member 320 is configured to drive the diaphragm 330 to move toward or away from the chamber 311 during the telescopic action. It can be understood that under the separation effect of the diaphragm 330, no gas exchange occurs between the mounting groove 313 and the chamber 311. When the telescopic member 320 drives the diaphragm 330 (whole or part) to move toward the direction of the chamber 311, the cavity in the chamber 311 becomes smaller, the air pressure in the chamber 311 increases, and part of the air in the chamber 311 is discharged; when the telescopic member 320 drives the diaphragm 330 (whole or part) to move away from the chamber 311, the cavity in the chamber 311 becomes larger, the air pressure in the chamber 311 decreases, and the air in the external environment enters the chamber 311.

[0048] The diaphragm 330 in this embodiment can be a flexible structure or a rigid structure:

[0049] Combination Figure 3 When the diaphragm 330 is a flexible structure, the edge of the diaphragm 330 is connected to the body 310 to form a relative seal between the mounting groove 313 and the cavity. When the telescopic member 320 is extended or retracted, the diaphragm 330 is deformed, thereby changing the size of the cavity in the chamber 311. The diaphragm 330 can be a part of the body 310, or it can be an additional film layer connected to the body 310 by bonding or the like;

[0050] Combination Figure 4 When the diaphragm 330 is a rigid structure, the edge of the diaphragm 330 is in sliding contact with the side wall of the chamber 311, and the air guide 312 and the telescopic member 320 are disposed on both sides of the diaphragm 330. When the telescopic member 320 is extended or retracted, the diaphragm 330 slides, thereby changing the size of the cavity in the chamber 311 (here, the portion of the chamber 311 that is connected to the air guide 312). The diaphragm 330 may be a part of the telescopic member 320, or may be an additional film layer that is fixedly connected to the movable end of the telescopic member 320 by bonding or the like.

[0051] In some embodiments of the present application, the telescopic member 320 is made of magnetostrictive material, for example, rare earth giant magnetostrictive material, such as terbium iron alloy, dysprosium iron alloy, terbium dysprosium iron alloy, etc. The above materials can produce a telescopic effect under the action of a magnetic field. Its advantages include high energy density, fast response speed, and reversible deformation ability within a certain range. When affected by a magnetic field, it changes shape quickly and effectively, thereby generating the required mechanical movement, such as in the wind guide module in the cooling device 300, air flow is achieved by the expansion and contraction of the material.

[0052] In other embodiments, the telescopic member 320 uses an electrostrictive material, illustratively, an electrocrystalline thin film material, such as lead magnesium niobate, lead titanate solid solution, etc. Electrostrictive materials can deform under the action of an electric field. The advantage of this type of material is that it usually has a high mechanical output capacity and a fast response characteristic, and in some cases can also provide precise control capabilities. Electrostrictive materials can use electrical signal input to accurately control their degree of deformation, which is very useful for occasions that require fine adjustment. In the cooling device 300, the electrostrictive material can achieve changes in the air pressure inside the wind guide module through precise control, thereby controlling the discharge of airflow and achieving the effect of optimizing heat dissipation.

[0053] Figure 5 A bottom view of a cooling device provided in another embodiment of the present application. Figure 6 A front view of a cooling device provided in another embodiment of the present application. Figure 7 A schematic diagram of the gas flow state in a cooling device provided in another embodiment of the present application. Figure 5 and Figure 6 The dashed lines in the figure represent internal lines. Figure 5 , Figure 6 and Figure 7 As shown, in some embodiments, there are multiple telescopic members 320 in the cooling device 300. By implementing air flow through multiple telescopic members 320, there can be multiple airflow adjustment methods, which is conducive to improving the heat dissipation capacity of the cooling device 300. For example, when multiple telescopic members 320 are configured to extend or shorten synchronously, greater air flow can be achieved, and when multiple telescopic members 320 are configured to extend or shorten alternately, a better spoiler effect can be achieved.

[0054] It is worth noting that the present embodiment does not specifically limit the number of air guide outlets 312 in the air guide module. For example, the air guide module is only provided with one air guide outlet 312 on one side of the main body 310. In this case, the number of air guide outlets 312 is small, the inlet and outlet area is small, and the air flow rate is large when the air flow is formed. Alternatively, the number of air guide outlets 312 in the air guide module is multiple, and the multiple air guide outlets 312 are located on the same side of the main body 310 of the air guide module or are arranged on different sides of the main body 310. In this case, the number of air guide outlets 312 is large, the total inlet and outlet area is large, and it is convenient to form airflows in different directions.

[0055] In some embodiments, the cooling device 300 further includes thermally conductive adhesive (not shown in the figure).

[0056] As an optional method, the main body 310 and the unit plate 100 are connected by thermal conductive glue, that is, there is only thermal conductive glue between the main body 310 and the unit plate 100, and no other components are set. This setting method can make the heat generated on the unit plate 100 directly conduct to the air guide module.

[0057] Figure 8 A cross-sectional view of a cooling device, a bottom shell and a unit plate matching structure provided in another embodiment of the present application, such as Figure 8 As shown, as another optional method, the display panel also includes a bottom shell 200, and the bottom shell 200 is located between the unit board 100 and the main body 310. The unit board 100 and the bottom shell 200 and / or the bottom shell 200 and the main body 310 are connected by thermal conductive adhesive. In this way, the heat of the unit board 100 is first conducted to the bottom shell 200, and then conducted to the main body 310 through the bottom shell 200.

[0058] In the above two methods, since the components are connected by thermal conductive adhesive, a good thermal conductivity effect can be achieved to prevent heat accumulation.

[0059] Optionally, when the body 310 and the unit board 100 are connected by heat-conducting adhesive, the chamber 311 of the body 310 is located on a side of the telescopic member 320 close to the unit board 100 , so that the air flowing in the chamber 311 can better take away the heat generated by the unit board 100 .

[0060] Combination Figure 8 Optionally, when the display panel further includes a bottom shell 200, and the bottom shell 200 is located between the unit board 100 and the body 310, the chamber 311 of the body 310 is located on the side of the telescopic member 320 close to the unit board 100, and the bottom shell 200 is provided with ventilation holes 220, which extend in a direction perpendicular to the arrangement of the bottom shell 200 and the unit board 100, so that the area enclosed by the bottom shell 200, the body 310 and the unit board 100 can be connected to the outside, and when the telescopic member 320 telescopic action generates an airflow flowing into or out of the chamber 311 from the air guide port 312, it can also drive the area enclosed by the bottom shell 200, the body 310 and the unit board 100 to form an airflow. Of course, in some other ways, the area enclosed by the bottom shell 200, the body 310 and the unit board 100 can also be filled with thermal conductive glue, so that the unit board 100, the bottom shell 200 and the body 310 can achieve a good thermal conductivity effect with each other.

[0061] In some embodiments, the thermally conductive adhesive includes an adhesive material and a thermally conductive material. The adhesive material includes one or a combination of epoxy resin polymers and acrylic polymers, and the thermally conductive material includes a thermally conductive ceramic powder material, such as magnesium oxide, boron nitride, etc. Since the thermally conductive adhesive includes an adhesive material and a thermally conductive material, it can simultaneously meet the requirements of bonding and fixing and the requirements of improving thermal conductivity.

[0062] An embodiment of the present application also provides a display panel, including a unit board 100, wherein the unit board 100 has a display side and a back display side, wherein the display side refers to the side of the unit board 100 used to display images, and the back display side refers to the side of the unit board 100 opposite to the display side.

[0063] The display panel further includes the above-mentioned cooling device 300 . The cooling device 300 is located at the rear display side of the unit panel 100 . The body 310 of the cooling device 300 is thermally connected to the unit panel 100 .

[0064] Optionally, the display panel further includes a bottom shell 200, the bottom shell 200 is connected to the back display side of at least one unit board 100, and is connected to the body 310, and the bottom shell 200 is provided with at least one hollow hole 210. The hollow hole 210 on the bottom shell 200 can provide an installation space for the unit board 100 and the cooling device 300. The unit board 100 can be connected to the power supply 410 through the hollow hole 210, and the cooling device 300 can also be arranged at the position of the hollow hole 210 (for example, the cooling device 300 is located in the hollow hole 210, or, as Figure 8 The hollow hole 210 shown is located between the unit plate 100 and the cooling device 300).

[0065] Optionally, the display panel includes a plurality of unit panels 100 and a plurality of cooling devices 300, and the plurality of unit panels 100 are arranged along the same plane. At least one cooling device 300 is respectively provided corresponding to each unit panel 100, or more than two unit panels 100 share the same cooling device 300. Further, the bottom case 200 is provided with a plurality of hollow holes 210, and each unit panel 100 corresponds to at least one hollow hole 210.

[0066] Fig. 9 This is an exploded view of a display screen provided in one embodiment of the present application. Fig. 9 As shown, the embodiment of the present application further provides a display screen, including a box 500, a power supply device 400, and the above-mentioned cooling device 300 or the above-mentioned display panel. The power supply device 400 and the cooling device 300 or the display panel are installed in the box 500, and the power supply device 400 is electrically connected to the unit board 100, so as to supply power to the unit board 100.

[0067] Optionally, the power supply device 400 includes a power supply 410, a box HUB board 420 and a module HUB board 430. The power supply 410 is responsible for converting the externally provided power into a voltage and current form suitable for the display screen, and is the energy source of the entire system, ensuring normal power supply. The box HUB board 420 is located inside the entire display screen, responsible for managing and coordinating the distribution of signals in the entire display screen, receiving signals from the control system or computer, and forwarding these signals to multiple module HUB boards 430. The box HUB board 420 ensures that the signal is evenly distributed throughout the display screen. The module HUB board 430 is connected to the unit board 100, and its main function is to receive the data signal of the box HUB board 420, and then distribute these signals to each unit board 100, ensuring that the signal can be stably transmitted to each LED lamp bead. The module HUB board 430 may also have the function of signal amplification to ensure the quality of signal transmission.

[0068] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0069] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A cooling device, applied to a display panel, wherein the display panel comprises a unit panel, characterized in that: The cooling device comprises: A body, comprising a chamber and an air guide port, wherein the air guide port is in communication with the chamber and the external environment, and the body is used for heat-conducting connection with the unit plate; At least one telescopic member is mounted on the body, and the telescopic member is configured to change the size of the cavity in the chamber during telescopic action to generate an airflow flowing into or out of the chamber through the air guide port.

2. The cooling device according to claim 1, characterized in that: At least one mounting groove is arranged inside the body, the mounting groove is connected to the chamber, and the telescopic member is mounted in the mounting groove.

3. The cooling device according to claim 2, characterized in that: The telescopic member is partially located in the chamber, and the telescopic member is configured to change the volume of the portion of the telescopic member located in the chamber during telescopic action, so as to change the size of the cavity in the chamber; Alternatively, there is a diaphragm between the mounting groove and the chamber, the telescopic member is connected to the diaphragm, and the telescopic member is configured to drive the diaphragm to move toward or away from the chamber during telescopic action to change the size of the cavity in the chamber.

4. The cooling device according to any one of claims 1 to 3, characterized in that: The telescopic member is made of magnetostrictive material or electrostrictive material.

5. The cooling device according to any one of claims 1 to 3, characterized in that: The number of the telescopic parts in the temperature-cooling device is multiple.

6. The cooling device according to any one of claims 1 to 3, characterized in that: The temperature reduction device also includes heat-conducting glue; The body and the unit board are connected via the thermal conductive adhesive, or the display panel further comprises a bottom shell, and the unit board and the bottom shell and / or the bottom shell and the body are connected via the thermal conductive adhesive.

7. The cooling device according to claim 6, characterized in that: The thermally conductive adhesive comprises an adhesive material and a thermally conductive material, wherein the adhesive material comprises one or a combination of two of an epoxy resin polymer and an acrylic polymer, and the thermally conductive material comprises a thermally conductive ceramic powder material.

8. A display panel, characterized in that: include: A unit board having a display side and a back display side; The cooling device according to any one of claims 1 to 7 is located on the rear display side of the unit board, and the body of the cooling device is thermally connected to the unit board.

9. The display panel according to claim 8, characterized in that: Also includes: The bottom shell is connected to the back display side of at least one of the unit boards and to the body, and the bottom shell is provided with at least one hollow hole.

10. A display screen, characterized in that: include: Box; The cooling device according to any one of claims 1 to 7 or the display panel according to claim 8 or 9, mounted on the box; A power supply device is installed on the box and electrically connected to the unit board.

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