Packaging method of solar cell device

Abstract

The invention discloses a packaging method for a solar cell device, and the method comprises the steps: sequentially arranging a barrier film layer, a packaging glue layer and a cover plate at one side, which is away from a substrate, of a cell module when the cell module located on the substrate is packaged, so as to completely cover and package the cell module, prevent the permeation of oxygen, water molecules and the like, and improve the sealing performance of the cell module. In order to prevent oxygen, water molecules and the like from influencing the performance of the battery assembly, the battery assembly comprises a plurality of sub-batteries which are arranged at intervals, each sub-battery comprises a first electrode, an active layer and a second electrode which are sequentially arranged in the direction away from a substrate, and a first scribing groove is formed between every two adjacent sub-batteries; the first scribing groove penetrates through the second electrode and the active layer to the first electrode, so that the barrier film layer covers the side wall and the bottom of the first scribing groove, and the packaging adhesive layer fills the first scribing groove, thereby preventing short circuit caused by lap joint of two adjacent sub-cells at the first scribing groove, improving the stability of the solar cell device, and prolonging the service life of the solar cell device.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell packaging, and in particular to a packaging method for a solar cell device. Background Art

[0002] As a clean, environmentally friendly and cheap renewable energy, solar energy is considered to be one of the most promising energy sources in the future. For the development and utilization of solar energy, the most representative is the solar cell, which can convert solar energy into electrical energy. However, how to further improve the stability of solar cell devices and reasonably evaluate the life of solar cell devices is an important development direction of solar cell devices. For example, in recent years, perovskite solar cells have attracted widespread attention in the photovoltaic field with their high efficiency and low cost advantages. However, in practical applications, external factors such as oxygen, moisture, heat, light, and bias voltage will affect the stability and service life of perovskite solar cell devices. In addition to improving the inherent stability of solar cells, improving packaging is a necessary means to improve the stability of solar cell devices. Summary of the invention

[0003] In order to solve the above technical problems, an embodiment of the present application provides a packaging method for a solar cell device, so as to improve the stability and service life of the solar cell device by improving the packaging film layer in the solar cell device.

[0004] To achieve the above objectives, the present application provides the following technical solutions:

[0005] A packaging method for a solar cell device, the packaging method comprising:

[0006] A substrate and a battery assembly on the substrate are provided, wherein the battery assembly includes a plurality of sub-batteries arranged at intervals, each of the sub-batteries includes a first electrode, an active layer, and a second electrode arranged in sequence in a direction away from the substrate, and a first scored groove is provided between adjacent sub-batteries, wherein the first scored groove penetrates the second electrode and the active layer to the first electrode;

[0007] Depositing a barrier film layer on the battery assembly so that the barrier film layer covers the battery assembly and the barrier film layer covers the sidewall and bottom of the first scoring groove;

[0008] Spraying liquid encapsulation glue on the barrier film layer and part of the substrate, so that the liquid encapsulation glue covers the barrier film layer and part of the substrate surface, and the liquid encapsulation glue fills the first scoring groove;

[0009] A cover plate is mounted on the liquid encapsulating adhesive, and after the liquid encapsulating adhesive is cured, an encapsulating adhesive layer is formed, so that the cover plate is attached to the barrier film layer and the substrate through the encapsulating adhesive layer.

[0010] Optionally, depositing a barrier film layer on the battery assembly includes:

[0011] An atomic layer deposition process is used to deposit a barrier film layer on the battery component.

[0012] Optionally, the deposition temperature T of the barrier film layer satisfies: 40°C≤T≤100°C.

[0013] Optionally, the barrier film layer includes an Al2O3 film layer, a ZnO film layer, a HfO2 film layer and a Hf 0.5 Zr 0.5 At least one of the O2 (HZO) film layers.

[0014] Optionally, in a direction perpendicular to the plane where the substrate is located, a thickness d1 of the barrier film layer satisfies: 50 nm≤d1≤150 nm.

[0015] Optionally, the encapsulation adhesive layer is a polyolefin copolymer (POE) encapsulation adhesive layer, an ethylene-vinyl acetate copolymer (EVA) encapsulation adhesive layer or a polyvinyl butyral (PVB) encapsulation adhesive layer.

[0016] Optionally, in a direction perpendicular to the plane where the substrate is located, a thickness d2 of the encapsulation adhesive layer satisfies: 300 μm≤d2≤600 μm.

[0017] Optionally, before installing a cover plate on the liquid packaging glue, the packaging method further includes:

[0018] On the substrate, an edge sealing glue layer is coated around the entire structure consisting of the battery assembly, the barrier film layer and the liquid packaging glue;

[0019] When a cover plate is installed on the liquid packaging glue, the cover plate is also attached to the substrate through the edge sealing glue layer.

[0020] Optionally, the edge sealing rubber layer is a butyl rubber layer.

[0021] Optionally, the sub-batteries in the battery assembly are arranged in sequence from the 1st sub-battery to the Nth sub-battery along a first direction, N≥2, and the first direction is parallel to the plane where the substrate is located;

[0022] Therefore, the battery assembly further includes a first bus bar and a second bus bar, wherein the first bus bar is electrically connected to the first sub-battery, and the second bus bar is electrically connected to the Nth sub-battery;

[0023] Depositing a barrier film layer on the battery assembly so that the barrier film layer covers the battery assembly comprises:

[0024] A barrier film layer is deposited on the battery assembly so that the barrier film layer covers each of the sub-batteries and the first bus bar and the second bus bar.

[0025] Compared with the prior art, the above technical solution has the following advantages:

[0026] The packaging method of the solar cell device provided in the embodiment of the present application, when packaging the battery assembly on the substrate, forms a packaging film layer by sequentially arranging a barrier film layer, a packaging adhesive layer and a cover plate on the side of the battery assembly away from the substrate, wherein the barrier film layer covers the battery assembly, the packaging adhesive layer covers the barrier film layer and part of the substrate surface, and the cover plate is attached to the barrier film layer and the substrate through the packaging adhesive layer, so as to fully cover and protect the battery assembly, prevent the penetration of oxygen and water molecules, etc., prevent oxygen and water molecules, etc. from affecting the performance of the battery assembly, and achieve the purpose of improving the stability and service life of the solar cell device. Furthermore, considering that the battery assembly includes a plurality of sub-cells arranged at intervals, each sub-cell includes a first electrode, an active layer and a second electrode arranged in sequence in a direction away from the substrate, a first score groove is provided between adjacent sub-cells, and the first score groove penetrates the second electrode and the active layer to the first electrode. Therefore, by covering the side wall and the bottom of the first score groove with a barrier film layer, and using a liquid encapsulation glue to form a packaging glue layer, so that the packaging glue layer fills the first score groove, it is prevented that two adjacent sub-cells are overlapped at the first score groove, and a short circuit between adjacent sub-cells is avoided, thereby further improving the stability and service life of the solar cell device.

[0027] In addition, when the packaging method provided in the embodiment of the present application is used to package the battery assembly located on the substrate, since the barrier film layer can be deposited by the atomic layer deposition process, and the atomic layer deposition process can be carried out at a low temperature, and the liquid packaging glue is used to form the packaging glue layer without heating and melting, the entire packaging process can be carried out at a low temperature, effectively preventing the solar cell device from denaturing or failing at a high temperature, and further improving the stability and service life of the solar cell device. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1A schematic diagram of a process for packaging a solar cell device provided in an embodiment of the present application;

[0030] Figure 2 A schematic cross-sectional view of a solar cell device obtained by using the packaging method provided in an embodiment of the present application;

[0031] Figure 3 A schematic diagram comparing stability test results of a solar cell device obtained by using the packaging method provided by an embodiment of the present application and an existing solar cell device;

[0032] Figure 4 A schematic flow chart of another method for packaging a solar cell device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0034] In the following description, many specific details are set forth to facilitate a full understanding of the present application, but the present application may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0035] Secondly, the present application is described in detail with reference to the schematic diagram. When describing the embodiments of the present application in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present application. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0036] As mentioned in the background technology section, improving encapsulation is a necessary means to improve the stability of solar cell devices.

[0037] At present, the commonly used packaging method for solar cell devices is to use UV curing glue or polyethylene packaging resin to add a cover plate for packaging. Specifically, after coating the solar cell with a film, the cover plate is laid on the film, and the whole is placed in a laminator for lamination. The air in the device is extracted by vacuuming, and then the film is heated to melt, so as to bond the solar cell, the substrate where the solar cell is located, and the added cover plate together. Finally, the device is taken out after cooling.

[0038] The inventors have found that the above packaging method is still not very effective in isolating oxygen and water molecules, and the stability of solar cell devices still needs to be improved.

[0039] In view of this, an embodiment of the present application provides a packaging method for a solar cell device. Figure 1 A schematic diagram of a process of packaging a solar cell device provided in an embodiment of the present application is shown. Figure 2 A schematic cross-sectional view of a solar cell device obtained by using the packaging method provided in an embodiment of the present application is shown, combined with Figure 1 and Figure 2 As shown, the packaging method includes:

[0040] S10: Figure 2 As shown, a substrate 10 and a battery assembly 20 located on the substrate 10 are provided, the battery assembly 20 includes a plurality of sub-batteries 21 arranged at intervals, each sub-battery 21 includes a first electrode 211, an active layer 212 and a second electrode 213 arranged in sequence along a direction away from the substrate 10, and a first groove P3 is provided between adjacent sub-batteries 21, and the first groove P3 passes through the second electrode 213 and the active layer 212 to the first electrode 211.

[0041] Optionally, the substrate 10 may be a glass substrate.

[0042] Optionally, in the battery assembly 20, the first electrode 211 may be a transparent conductive layer, the second electrode 213 may be a metal electrode, and the active layer 212 may include a stacked hole transport layer, a perovskite layer, and an electron transport layer, that is, the sub-cell 21 may include a transparent conductive layer, a hole transport layer, a perovskite layer, an electron transport layer, and a metal electrode arranged in sequence in a direction away from the substrate 10, or include a transparent conductive layer, an electron transport layer, a perovskite layer, a hole transport layer, and a metal electrode arranged in sequence in a direction away from the substrate 10, in which case the solar cell device is a perovskite solar cell device. Among them, the perovskite layer may be a halide perovskite layer, the transparent conductive layer (first electrode 211) may be an ITO (indium tin oxide) layer, a FTO (fluorine-doped SnO2 conductive glass) layer, etc., and the metal electrode (second electrode 213) may be Au, Ag, Cu, Al, Mo, W, Cr, Bi, etc.

[0043] like Figure 1As shown, a first groove P3 is provided between two adjacent sub-batteries 21, which is also referred to as a P3 groove below. In fact, a P1 groove and a P2 groove are also provided between two adjacent sub-batteries 21, and the P1 groove, the P2 groove and the P3 groove are arranged in sequence, wherein the P1 groove passes through the first electrode 211 and is filled with the active layer 212 to separate the first electrodes 211 of the two adjacent sub-batteries 21, and the P2 groove passes through the active layer 212 to the first electrode 211 and is filled with the second electrode The second electrode 213 is filled to separate the active layer 212 of two adjacent sub-batteries 21, and the P3 groove runs through the second electrode 213 and the active layer 212 to the first electrode 211 to separate the second electrodes 213 of the two adjacent sub-batteries 21, so that the two adjacent sub-batteries 21 are separated, and the second electrode 213 of one sub-battery 21 can be electrically connected to the first electrode 211 of the other sub-battery 21 through the P2 groove, so as to realize the series connection of the two adjacent sub-batteries 21.

[0044] S20: Figure 2 As shown, a barrier film layer 30 is deposited on the battery assembly 20 so that the barrier film layer 30 covers the battery assembly 20 and the barrier film layer 30 covers the sidewall and bottom of the first scoring groove P3.

[0045] Optionally, depositing the barrier film layer 30 on the battery assembly 20 includes:

[0046] The barrier film layer 30 is deposited on the battery assembly 20 using an atomic layer deposition process.

[0047] Since the atomic layer deposition (ALD) process is a nearly perfect thin film deposition process, the deposited thin film has a unique layer-by-layer growth characteristic, and can deposit a uniform and dense thin film with controllable thickness and high repetition rate at a low temperature, therefore, the barrier film layer 30 is deposited on the battery assembly 20 using the atomic layer deposition process, so that the barrier film layer 30 can cover the sidewalls and bottom of the first scribed groove P3.

[0048] In the aforementioned existing packaging method of solar cell devices, the cured adhesive film needs to be heated to melt it. Generally, photovoltaic packaging resins need to be melted at a relatively high temperature of 130°C-180°C, and then hot-pressed and packaged. This can easily cause the active layer (such as the perovskite layer) of the solar cell to decompose at high temperature, resulting in device denaturation or failure. In the packaging method provided in the embodiment of the present application, an atomic layer deposition process can be used to deposit a barrier film layer 30 on the battery assembly 20, and the atomic layer deposition process can be performed at low temperatures. Optionally, the deposition temperature T of the barrier film layer 30 satisfies: 40°C≤T≤100°C, which effectively prevents the solar cell device from denaturing or failing at high temperatures, and improves the stability and service life of the solar cell device.

[0049] Optionally, the barrier film layer 30 includes an Al2O3 (aluminum oxide) film layer, a ZnO (zinc oxide) film layer, a HfO2 (hafnium dioxide) film layer and a Hf 0.5 Zr 0.5 At least one of the O2 (hafnium-based ferroelectric thin films, referred to as HZO) film layers.

[0050] In this embodiment, the barrier film layer 30 may include only one film layer, such as an Al2O3 film layer, or may include a stack of two or more film layers, such as a stack of two film layers, an Al2O3 film layer and a ZnO film layer. Since the Al2O3 film layer, the ZnO film layer, the HfO2 film layer and the HZO film layer have good compactness and high corrosion resistance, they can effectively isolate the penetration of oxygen and water molecules, isolate the air, prevent the influence of oxygen and water molecules on the performance of solar cells, and improve the stability and service life of solar cell devices.

[0051] It can be understood that, in the direction perpendicular to the plane where the substrate 10 is located, the greater the thickness d1 of the barrier film layer 30, the better the isolation effect against external oxygen and water molecules, etc., but the higher the cost. For this reason, optionally, in the direction perpendicular to the plane where the substrate 10 is located, the thickness d1 of the barrier film layer 30 satisfies: 50nm≤d1≤150nm. When the thickness d1 of the barrier film layer 30 is within this range, it can maintain a good isolation effect against oxygen and water molecules, etc., and the cost is relatively low.

[0052] Specifically, a 50nm-150nm Al2O3 film layer (or ZnO film layer, HfO2 film layer, HZO film layer) can be deposited as the barrier film layer 30 at a low temperature of 40°C-100°C by an atomic layer deposition process for 800-1000 cycles.

[0053] S30: Figure 2 As shown, liquid encapsulation glue is sprayed on the barrier film layer 30 and a portion of the substrate 10 , so that the liquid encapsulation glue covers the barrier film layer 30 and a portion of the substrate 10 surface, and the liquid encapsulation glue fills the first scribed groove P3 .

[0054] S40: Figure 2 As shown, a cover plate 50 is installed on the liquid encapsulating adhesive, and after the liquid encapsulating adhesive is cured, an encapsulating adhesive layer 40 is formed, so that the cover plate 50 is attached to the barrier film layer 30 and the substrate 10 through the encapsulating adhesive layer 40 .

[0055] In step S30, liquid encapsulation glue is sprayed on the barrier film layer 30 and part of the substrate 10, so that the liquid encapsulation glue can cover the barrier film layer 30 and part of the substrate 10 surface, and can also fill the first scribed groove P3. In addition, the barrier film layer 30 can be deposited by atomic layer deposition process, and the atomic layer deposition process can be carried out at low temperature, and the liquid encapsulation glue does not need to be heated and melted, so that the entire packaging process can be carried out at low temperature, effectively preventing the solar cell device from being denatured or failing at high temperature, and improving the stability and service life of the solar cell device.

[0056] Optionally, the packaging adhesive layer 40 is a polyolefin copolymer (POE) packaging adhesive layer, an ethylene-vinyl acetate copolymer (EVA) packaging adhesive layer or a polyvinyl butyral (PVB) packaging adhesive layer.

[0057] Optionally, in a direction perpendicular to the plane where the substrate 10 is located, a thickness d2 of the encapsulation adhesive layer 40 may satisfy: 300 μm≤d2≤600 μm.

[0058] Specifically, a liquid resin encapsulation adhesive (such as POE, EVA or PVB) with a thickness of 300 μm-600 μm may be ultrasonically sprayed on the barrier film layer 30 and part of the substrate 10 , and then cured to form the encapsulation adhesive layer 40 .

[0059] Optionally, the cover plate 50 may be a glass cover plate.

[0060] In summary, when the packaging method provided in the embodiment of the present application is used to package the battery assembly located on the substrate, a packaging film layer is formed by sequentially arranging a barrier film layer, a packaging adhesive layer and a cover plate on the side of the battery assembly facing away from the substrate, wherein the barrier film layer covers the battery assembly, the packaging adhesive layer covers the barrier film layer and part of the substrate surface, and the cover plate is adhered to the barrier film layer and the substrate through the packaging adhesive layer, so as to fully cover and protect the battery assembly, prevent the penetration of oxygen and water molecules, etc., prevent oxygen and water molecules, etc. from affecting the performance of the battery assembly, and achieve the purpose of improving the stability and service life of the solar cell device.

[0061] Furthermore, the inventors have also discovered that in the aforementioned existing packaging method of solar cell devices, when the device is pressed and packaged, the packaging glue layer will be partially pressed into the P3 groove, but because the packaging glue layer is a cured glue, the packaging glue layer will only be squeezed to the notch of the P3 groove, and two adjacent sub-cells 21 may still overlap inside the P3 groove and short-circuit, and the notch of the P3 groove may also be deformed due to the squeezing of the packaging glue layer, thereby affecting the stability and service life of the solar cell device.

[0062] Based on this, considering that the battery assembly includes a plurality of sub-cells arranged at intervals, each sub-cell includes a first electrode, an active layer and a second electrode arranged in sequence along a direction away from the substrate, and a first score groove is arranged between adjacent sub-cells, and the first score groove runs through the second electrode and the active layer to the first electrode. Therefore, by covering the side wall and the bottom of the first score groove with a barrier film layer, and using a liquid encapsulation glue to form a packaging glue layer, so that the packaging glue layer fills the first score groove, it is prevented that two adjacent sub-cells are overlapped at the first score groove, and a short circuit between adjacent sub-cells is avoided, thereby further improving the stability and service life of the solar cell device.

[0063] In addition, when the packaging method provided in the embodiment of the present application is used to package the battery assembly located on the substrate, since the barrier film layer can be deposited by the atomic layer deposition process, and the atomic layer deposition process can be carried out at a low temperature, and the liquid packaging glue is used to form the packaging glue layer without heating and melting, the entire packaging process can be carried out at a low temperature, effectively preventing the solar cell device from denaturing or failing at a high temperature, and further improving the stability and service life of the solar cell device.

[0064] Optional, such as Figure 3 As shown, before the cover plate is installed on the liquid packaging glue, the packaging method further includes:

[0065] S50: Figure 2 As shown, on the substrate 10, an edge sealing glue layer 60 is coated around the entire structure consisting of the battery assembly 20, the barrier film layer 30 and the liquid packaging glue.

[0066] In step S40 , when the cover plate 50 is installed on the liquid packaging glue, the cover plate 50 is also attached to the substrate 10 through the edge sealing glue layer 60 .

[0067] Thus, the edge sealing layer 60 is located between the substrate 10 and the cover plate 50 , and surrounds the overall structure consisting of the battery assembly 20 , the barrier film layer 30 and the packaging layer 40 , so as to package the battery assembly 20 .

[0068] Optionally, the edge sealing rubber layer 60 may be a butyl rubber layer.

[0069] In this embodiment, an edge sealing layer 60 is arranged between the substrate 10 and the cover plate 50 and around the overall structure composed of the battery assembly 20, the barrier film layer 30 and the packaging adhesive layer 40. On the one hand, the cover plate 50 and the substrate 10 can be more firmly attached. On the other hand, the solar cell device can have a wider and thicker packaging edge to prevent oxygen and water molecules from penetrating from the surroundings of the solar cell device, thereby further improving the stability and service life of the solar cell device.

[0070] It should be noted that the present application does not limit the number of sub-batteries 21 in the battery assembly 20, which depends on the specific situation.

[0071] It should also be noted that if Figure 2 As shown, the sub-batteries 21 in the battery assembly 20 are arranged in sequence from the 1st sub-battery to the Nth sub-battery along the first direction X, N≥2, and the first direction X is parallel to the plane where the substrate 10 is located; the battery assembly 20 also includes a first bus bar 22 and a second bus bar 23, the first bus bar 22 is electrically connected to the 1st sub-battery, and the second bus bar 23 is electrically connected to the Nth sub-battery, so as to lead out the positive and negative electrodes of the battery assembly; in this embodiment, a barrier film layer 30 is deposited on the battery assembly 20 so that the barrier film layer 30 covers the battery assembly 20, including:

[0072] A barrier film layer 30 is deposited on the battery assembly 20 so that the barrier film layer 30 covers each sub-battery in the battery assembly 20 and the first bus bar and the second bus bar. However, the first bus bar 22 and the second bus bar 23 need to be led out by leads.

[0073] Optional, such as Figure 2 As shown, the first bus bar 22 is the positive electrode, and the second bus bar 23 is the negative electrode. It can be understood that the first bus bar 22 can also be the negative electrode, in which case the second bus bar 23 is the positive electrode.

[0074] Figure 4 A schematic diagram comparing the stability test results of a solar cell device obtained by using the packaging method provided in an embodiment of the present application and an existing solar cell device is shown. It can be seen that compared with the existing solar cell device, the stability of the solar cell device obtained by using the packaging method provided in an embodiment of the present application is significantly improved, while the stability of the existing solar cell device decreases significantly with the increase in usage time.

[0075] The embodiment of the present application provides a solar cell device, Figure 2 A cross-sectional schematic diagram of a solar cell device provided in an embodiment of the present application is shown. Figure 2 As shown, the solar cell device comprises:

[0076] substrate 10;

[0077] The battery assembly 20 is located on the substrate 10. The battery assembly 20 includes a plurality of sub-batteries 21 arranged at intervals. Each sub-battery 21 includes a first electrode 211, an active layer 212, and a second electrode 213 arranged in sequence in a direction away from the substrate 10. A first groove P3 is provided between adjacent sub-batteries 21. The first groove P3 penetrates the second electrode 213 and the active layer 212 to the first electrode 211.

[0078] A barrier film layer 30, the barrier film layer 30 covers the battery assembly 20, and the barrier film layer 30 covers the sidewall and bottom of the first score groove P3;

[0079] The encapsulation adhesive layer 40 covers the barrier film layer 30 and a portion of the surface of the substrate 10 , and the encapsulation adhesive layer 40 fills the first scribed groove P3 ;

[0080] And a cover plate 50 , the cover plate 50 is attached to the barrier film layer 30 and the substrate 10 through the packaging adhesive layer 40 .

[0081] Optionally, the substrate 10 may be a glass substrate.

[0082] Optionally, the cover plate 50 may be a glass cover plate.

[0083] Optionally, in the battery assembly 20, the first electrode 211 may be a transparent conductive layer, the second electrode 213 may be a metal electrode, and the active layer 212 may include a stacked hole transport layer, a perovskite layer, and an electron transport layer, that is, the sub-cell 21 may include a transparent conductive layer, a hole transport layer, a perovskite layer, an electron transport layer, and a metal electrode arranged in sequence in a direction away from the substrate 10, or include a transparent conductive layer, an electron transport layer, a perovskite layer, a hole transport layer, and a metal electrode arranged in sequence in a direction away from the substrate 10, in which case the solar cell device is a perovskite solar cell device. Among them, the perovskite layer may be a halide perovskite layer, the transparent conductive layer (first electrode 211) may be an ITO (indium tin oxide) layer, a FTO (fluorine-doped SnO2 conductive glass) layer, etc., and the metal electrode (second electrode 213) may be Au, Ag, Cu, Al, Mo, W, Cr, Bi, etc.

[0084] like Figure 2As shown, a first groove P3 is provided between two adjacent sub-batteries 21, which is also referred to as a P3 groove below. In fact, a P1 groove and a P2 groove are also provided between two adjacent sub-batteries 21, and the P1 groove, the P2 groove and the P3 groove are arranged in sequence, wherein the P1 groove passes through the first electrode 211 and is filled with the active layer 212 to separate the first electrodes 211 of the two adjacent sub-batteries 21, and the P2 groove passes through the active layer 212 to the first electrode 211 and is filled with the second electrode The second electrode 213 is filled to separate the active layer 212 of two adjacent sub-batteries 21, and the P3 groove runs through the second electrode 213 and the active layer 212 to the first electrode 211 to separate the second electrodes 213 of the two adjacent sub-batteries 21, so that the two adjacent sub-batteries 21 are separated, and the second electrode 213 of one sub-battery 21 can be electrically connected to the first electrode 211 of the other sub-battery 21 through the P2 groove, so as to realize the series connection of the two adjacent sub-batteries 21.

[0085] Different from the packaging method of the aforementioned existing solar cell devices, the solar cell device provided in the embodiment of the present application no longer only packages the battery assembly by adding a cover plate to the packaging glue layer, but instead forms a packaging film layer by sequentially arranging a barrier film layer 30, a packaging glue layer 40 and a cover plate 50 on the side of the battery assembly 20 away from the substrate 10, wherein the barrier film layer 30 covers the battery assembly 20, the packaging glue layer 40 covers the barrier film layer 30 and a portion of the surface of the substrate 10, and the cover plate 50 is adhered to the barrier film layer 30 and the substrate 10 through the packaging glue layer 40, thereby fully covering and protecting the battery assembly 20, preventing the penetration of oxygen and water molecules, etc., and preventing oxygen and water molecules, etc. from affecting the performance of the battery assembly, thereby achieving the purpose of improving the stability and service life of the solar cell device.

[0086] It can be understood that, compared with the existing solar cell device whose packaging film layer only includes a packaging glue layer and a cover plate, the packaging film layer of the solar cell device provided in the embodiment of the present application, in addition to the packaging glue layer 40 and the cover plate 50, also includes a barrier film layer 30, and the barrier film layer 30 is adhered to the battery assembly, thereby reducing the transmittance of the device's packaging film layer to oxygen and water molecules, etc., and playing a better isolation role against oxygen and water molecules, etc.

[0087] At the same time, the inventors have also discovered that in the aforementioned existing packaging method of solar cell devices, when the device is pressed and packaged, the packaging glue layer will be partially pressed into the P3 groove, but because the packaging glue layer is a cured glue, the packaging glue layer will only be squeezed to the notch of the P3 groove, and the two adjacent sub-cells 21 may still overlap inside the P3 groove and short-circuit, and the notch of the P3 groove will also be deformed due to the squeezing of the packaging glue layer, thereby affecting the stability and service life of the solar cell device.

[0088] Based on this, in the solar cell device provided in the embodiment of the present application, by covering the side wall and bottom of the first score groove P3 with the barrier film layer 30 and filling the first score groove P3 with the encapsulation glue layer 40, it is prevented that two adjacent sub-cells 21 are overlapped at the first score groove P3, thereby avoiding a short circuit between the two adjacent sub-cells 21, thereby further improving the stability and service life of the solar cell device.

[0089] Optionally, an atomic layer deposition process can be used to deposit a barrier film layer 30 on the battery assembly 20, so that the barrier film layer 30 covers the battery assembly 20, and the barrier film layer 30 covers the side walls and bottom of the first score groove P3. Since the atomic layer deposition (ALD) process is a nearly perfect thin film deposition process, the deposited film has a unique layer-by-layer growth characteristic, and can deposit a film with controllable thickness, high repetition rate, uniformity and density at low temperature. Therefore, the barrier film layer 30 is deposited on the battery assembly 20 using the atomic layer deposition process, so that the barrier film layer 30 covers the side walls and bottom of the first score groove P3.

[0090] Furthermore, liquid encapsulation glue can be sprayed on the barrier film layer 30 and a portion of the substrate 10 so that the liquid encapsulation glue fills the first score groove P3. After the cover plate 50 is installed on the liquid encapsulation glue, the liquid encapsulation glue is cured to form an encapsulation glue layer 40, so that the encapsulation glue layer 40 fills the first score groove P3, and the cover plate 50 is adhered to the barrier film layer 30 through the encapsulation glue layer 40.

[0091] In the aforementioned existing packaging method of solar cell devices, the curing adhesive film needs to be heated to melt it. Generally, photovoltaic packaging resin needs to be melted at a relatively high temperature of 130°C-180°C, and then hot-pressed and packaged. This can easily cause the active layer (such as the perovskite layer) of the solar cell to decompose at high temperature, resulting in device denaturation or failure. In the solar cell device provided in the embodiment of the present application, since the barrier film layer 30 can be deposited by an atomic layer deposition process, and the atomic layer deposition process can be carried out at low temperatures, and the liquid packaging glue does not need to be heated and melted, the entire packaging process can be carried out at low temperatures, effectively preventing the solar cell device from denaturing or failing at high temperatures, and further improving the stability and service life of the solar cell device.

[0092] Optionally, the barrier film layer 30 includes an Al2O3 (aluminum oxide) film layer, a ZnO (zinc oxide) film layer, a HfO2 (hafnium dioxide) film layer and a Hf 0.5 Zr 0.5 At least one of the O2 (hafnium-based ferroelectric thin films, referred to as HZO) film layers.

[0093] In this embodiment, the barrier film layer 30 may include only one film layer, such as an Al2O3 film layer, or may include a stack of two or more film layers, such as a stack of two film layers, an Al2O3 film layer and a ZnO film layer. Since the Al2O3 film layer, the ZnO film layer, the HfO2 film layer and the HZO film layer have good compactness and high corrosion resistance, they can effectively isolate the penetration of oxygen and water molecules, isolate the air, prevent the influence of oxygen and water molecules on the performance of solar cells, and improve the stability and service life of solar cell devices.

[0094] It can be understood that, in the direction perpendicular to the plane where the substrate 10 is located, the greater the thickness d1 of the barrier film layer 30, the better the isolation effect against external oxygen and water molecules, etc., but the higher the cost. For this reason, optionally, in the direction perpendicular to the plane where the substrate 10 is located, the thickness d1 of the barrier film layer 30 satisfies: 50nm≤d1≤150nm. When the thickness d1 of the barrier film layer 30 is within this range, it can maintain a good isolation effect against oxygen and water molecules, etc., and the cost is relatively low.

[0095] For example, an 80nm thick Al2O3 film layer is grown on the battery assembly 20 by atomic layer deposition process as a barrier film layer 30, and then liquid resin is sprayed and a cover plate 50 is installed to obtain a solar cell device, which effectively prevents the entry of oxygen and water molecules and improves the stability of the solar cell device. Specifically, the obtained solar cell device is placed under the test conditions of 25°C and 100% RH for testing. The results show that the water vapor transmission rate is only 2.69×10 -4 g·m -2 ·d -1 .

[0096] For another example, a 100nm thick ZnO film (or HfO2 film, HZO film) is grown on the battery assembly 20 by atomic layer deposition process as a barrier film 30, and then liquid resin is sprayed and a cover plate 50 is installed to obtain a solar cell device, which effectively prevents the entry of oxygen and water molecules and improves the stability of the solar cell device. Specifically, the obtained solar cell device is placed under the test conditions of 25°C and 100% RH for testing. The results show that the water vapor transmission rate is only 1.28×10 -5 g·m -2 ·d -1 .

[0097] Optionally, the packaging adhesive layer 40 is a polyolefin copolymer (POE) packaging adhesive layer, an ethylene-vinyl acetate copolymer (EVA) packaging adhesive layer or a polyvinyl butyral (PVB) packaging adhesive layer.

[0098] Optionally, in a direction perpendicular to the plane where the substrate 10 is located, a thickness d2 of the encapsulation adhesive layer 40 may satisfy: 300 μm≤d2≤600 μm.

[0099] Optional, such as Figure 2 As shown, the solar cell device also includes:

[0100] The edge sealing layer 60 is located between the substrate 10 and the cover plate 50 and surrounds the overall structure composed of the battery assembly 20 , the barrier film layer 30 and the packaging layer 40 , and is used to package the battery assembly 20 .

[0101] Optionally, the edge sealing rubber layer 60 is a butyl rubber layer.

[0102] In this embodiment, an edge sealing layer 60 is arranged between the substrate 10 and the cover plate 50 and around the overall structure composed of the battery assembly 20, the barrier film layer 30 and the packaging adhesive layer 40. On the one hand, the cover plate 50 and the substrate 10 can be more firmly attached. On the other hand, the solar cell device can have a wider and thicker packaging edge to prevent oxygen and water molecules from penetrating from the surroundings of the solar cell device, thereby further improving the stability and service life of the solar cell device.

[0103] It should be noted that the present application does not limit the number of sub-batteries 21 in the battery assembly 20, which depends on the specific situation.

[0104] It should also be noted that if Figure 2 As shown, the sub-batteries 21 in the battery assembly 20 are arranged in sequence from the 1st sub-battery to the Nth sub-battery along the first direction X, N≥2, and the first direction X is parallel to the plane where the substrate 10 is located; the battery assembly 20 also includes a first bus bar 22 and a second bus bar 23, the first bus bar 22 is electrically connected to the 1st sub-battery, and the second bus bar 23 is electrically connected to the Nth sub-battery, so as to lead out the positive and negative electrodes of the battery assembly; in this embodiment, the barrier film layer 30 covering the battery assembly 20 includes the barrier film layer 30 covering each sub-battery 21 in the battery assembly 20 and the first bus bar 22 and the second bus bar 23, but the first bus bar 22 and the second bus bar 23 need to be led out by leads.

[0105] Optional, such as Figure 2 As shown, the first bus bar 22 is the positive electrode, and the second bus bar 23 is the negative electrode. It can be understood that the first bus bar 22 can also be the negative electrode, in which case the second bus bar 23 is the positive electrode.

[0106] The various parts in this manual are described in a combination of parallel and progressive ways. Each part focuses on the differences from other parts, and the same or similar parts between the various parts can be referenced to each other.

[0107] With respect to the above description of the disclosed embodiments, the features described in the embodiments in this specification may be replaced or combined with each other, so that professionals in the field can implement or use the present application. Various modifications to these embodiments will be apparent to professionals in the field, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method for packaging a solar cell device, characterized in that: The packaging method comprises: A substrate and a battery assembly on the substrate are provided, wherein the battery assembly includes a plurality of sub-batteries arranged at intervals, each of the sub-batteries includes a first electrode, an active layer, and a second electrode arranged in sequence in a direction away from the substrate, and a first scored groove is provided between adjacent sub-batteries, wherein the first scored groove penetrates the second electrode and the active layer to the first electrode; Depositing a barrier film layer on the battery assembly so that the barrier film layer covers the battery assembly and the barrier film layer covers the sidewall and bottom of the first scoring groove; Spraying liquid encapsulation glue on the barrier film layer and part of the substrate, so that the liquid encapsulation glue covers the barrier film layer and part of the substrate surface, and the liquid encapsulation glue fills the first scoring groove; A cover plate is mounted on the liquid encapsulating adhesive, and after the liquid encapsulating adhesive is cured, an encapsulating adhesive layer is formed, so that the cover plate is attached to the barrier film layer and the substrate through the encapsulating adhesive layer.

2. The method for packaging a solar cell device according to claim 1, characterized in that: Depositing a barrier film layer on the battery assembly includes: An atomic layer deposition process is used to deposit a barrier film layer on the battery component.

3. The packaging method of a solar cell device according to claim 2, characterized in that: The deposition temperature T of the barrier film layer satisfies: 40°C≤T≤100°C.

4. The packaging method of a solar cell device according to any one of claims 1 to 3, characterized in that: The barrier film layer includes an Al2O3 film layer, a ZnO film layer, a HfO2 film layer and a Hf 0.5 Zr 0.5 At least one of the O2 (HZO) film layers.

5. The method for packaging a solar cell device according to any one of claims 1 to 3, characterized in that: In a direction perpendicular to the plane where the substrate is located, a thickness d1 of the barrier film layer satisfies: 50nm≤d1≤150nm.

6. The method for packaging a solar cell device according to claim 1, characterized in that: The encapsulation adhesive layer is a polyolefin copolymer (POE) encapsulation adhesive layer, an ethylene-vinyl acetate copolymer (EVA) encapsulation adhesive layer or a polyvinyl butyral (PVB) encapsulation adhesive layer.

7. The method for packaging a solar cell device according to claim 1, characterized in that: In a direction perpendicular to the plane where the substrate is located, a thickness d2 of the packaging adhesive layer satisfies: 300 μm≤d2≤600 μm.

8. The method for packaging a solar cell device according to claim 1, characterized in that: Before installing a cover plate on the liquid packaging glue, the packaging method further includes: On the substrate, an edge sealing glue layer is coated around the entire structure consisting of the battery assembly, the barrier film layer and the liquid packaging glue; When a cover plate is installed on the liquid packaging glue, the cover plate is also attached to the substrate through the edge sealing glue layer.

9. The method for packaging a solar cell device according to claim 8, characterized in that: The edge sealing rubber layer is a butyl rubber layer.

10. The method for packaging a solar cell device according to claim 1, characterized in that: The sub-cells in the battery assembly are arranged in sequence from the 1st sub-cell to the Nth sub-cell along a first direction, N≥2, and the first direction is parallel to the plane where the substrate is located; Therefore, the battery assembly further includes a first bus bar and a second bus bar, wherein the first bus bar is electrically connected to the first sub-battery, and the second bus bar is electrically connected to the Nth sub-battery; Depositing a barrier film layer on the battery assembly so that the barrier film layer covers the battery assembly comprises: A barrier film layer is deposited on the battery assembly so that the barrier film layer covers each of the sub-batteries and the first bus bar and the second bus bar.

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