Wearable electronic device

Abstract

The wearable electronic device may include: a frame; a printed circuit board disposed within the frame and including at least one ground portion; and a connecting member. The connecting member may include: an extension portion; a first portion extending from a first end portion of the extension portion and connected to the printed circuit board; a second portion extending from a second end portion of the extension portion and connected to a conductive region of the printed circuit board; and a conductive trace extending from the first portion to the second portion through an extension portion. The conductive trace may be electrically connected to the at least one ground portion through the conductive region of the printed circuit board.

Description

Technical Field

[0001] An embodiment of the present disclosure relates to a wearable electronic device. Background Art

[0002] An electronic device may include an antenna for sending and receiving wireless signals. The antenna may include a housing of the electronic device as an antenna element. For example, the housing of the electronic device may be at least partially formed of metal. The antenna of the electronic device may include a metal portion of the housing as a radiating element.

[0003] The electronic device may include electronic components for providing various functions. For example, the electronic device may include a key switch, an acoustic sensor, and a biometric sensor. The electronic component may be at least partially exposed through the housing to form the appearance of the electronic device, or may be disposed within the housing to be adjacent to the housing. In addition, the electronic device may include a connecting member (e.g., a flexible printed circuit board) that operably connects multiple electronic components. Summary of the invention

[0004] Technical issues The performance of the antenna may be degraded by the electronic components adjacent to the housing forming the antenna and the connecting members operably connecting the electronic components. For example, electromagnetic noise generated from the electronic components may affect the radiation performance of the antenna. For another example, the connecting members operably connecting the electronic components serve as the radiating elements of the antenna, so that unwanted parasitic components may be generated.

[0005] According to one embodiment of the present disclosure, a printed circuit board connecting a plurality of electronic components and a wearable electronic device including the printed circuit board capable of reducing or preventing antenna performance degradation may be provided.

[0006] Technical Solution According to one aspect of the present disclosure, there is provided a wearable electronic device, comprising: a frame forming a side wall; a printed circuit board disposed within the frame and including at least one grounding portion; and a connecting member at least partially extending along the side wall. The connecting member comprises: an extension portion extending along the side wall; a first portion extending from a first end of the extension portion and connected to the printed circuit board; a second portion extending from a second end of the extension portion and connected to a conductive area of ​​the printed circuit board; and a conductive trace extending from the first portion to the second portion through the extension portion. The conductive trace is electrically connected to at least one grounding portion through a conductive area of ​​the printed circuit board. The printed circuit board comprises a conductive pattern extending from the conductive area.

[0007] Beneficial Effects According to the embodiments disclosed herein, antenna performance degradation due to noise and / or parasitic components may be reduced or prevented by an electrical loop structure provided by a printed circuit board.

[0008] According to the embodiments disclosed herein, the resonant frequency and the parasitic component frequency may be shifted by a conductive pattern connected to an electric loop structure, and the efficiency of the antenna may be improved.

[0009] Furthermore, various effects directly or indirectly recognized by the present disclosure can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 is a perspective view of the front side of a mobile electronic device according to one embodiment.

[0011] Figure 2 is a perspective view of a back side of an electronic device according to one embodiment.

[0012] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0013] Figure 4 is a perspective view showing some components of an electronic device according to one embodiment.

[0014] Figure 5 is a perspective view showing some components of an electronic device according to one embodiment.

[0015] Figure 6 is a view showing a connection member according to one embodiment.

[0016] Figure 7 A second surface of a printed circuit board is shown according to one embodiment.

[0017] Figure 8 A first surface of a printed circuit board according to one embodiment is shown.

[0018] Figure 9a is a graph showing antenna radiation efficiencies of an electronic device according to a comparative example and an electronic device according to an embodiment of the present disclosure.

[0019] Figure 9b is a graph showing antenna radiation coefficients of an electronic device according to a comparative example and an electronic device according to an embodiment of the present disclosure.

[0020] Fig.10 is a graph showing antenna radiation efficiency according to a length of a fifth pattern according to an embodiment of the present disclosure.

[0021] Fig.11a The radiation efficiency according to the line width of the conductive pattern when the fifth pattern is connected to at least one ground portion is shown.

[0022] Fig.11b yes Fig.11aGraph corresponding to the first frequency band from 650 MHz to 900 MHz.

[0023] Fig.11c yes Fig.11a Graph corresponding to a second frequency band from 1500 MHz to 2200 MHz.

[0024] Fig.12 is a block diagram illustrating electronic devices in a network environment according to various embodiments.

[0025] Regarding the description of the drawings, the same or similar reference numerals may be used for the same or similar elements. DETAILED DESCRIPTION

[0026] Hereinafter, various embodiments disclosed in the present disclosure will be described with reference to the accompanying drawings. However, this is not intended to limit the present disclosure to specific embodiments, but is interpreted as including various modifications, equivalent forms and / or alternative forms of the embodiments of the present disclosure. In addition, repeated descriptions of structures with the same reference numerals may be omitted.

[0027] Figure 1 is a perspective view of the front side of a mobile electronic device according to one embodiment.

[0028] Figure 2 is a perspective view of a back side of an electronic device according to one embodiment.

[0029] like Figure 1 and Figure 2As shown, the electronic device 100 according to one embodiment may include a housing 110 and a coupling member 150, a coupling member 160, wherein the housing 110 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B, and the coupling member 150 and the coupling member 160 are connected to at least a portion of the housing 110 and are configured to detachably couple the electronic device 100 to a body part (e.g., wrist, etc.) of a user. In one embodiment, the housing 110 may be referred to as a structure forming a portion of the first surface 110A, the second surface 110B, and the side surface 110C. According to one embodiment, the first surface 110A may be formed by a front plate 101 (e.g., a glass plate or a polymer plate including various coatings) that is at least partially substantially transparent. The second surface 110B may be formed by a back plate 107. The back plate 107 may include a substantially transparent area and / or a substantially opaque area. For example, the back plate 107 may be formed of coated glass or colored glass, ceramics, polymers, metals (e.g., aluminum, stainless steel (STS) or magnesium), or a combination of at least two of these materials. The side surface 110C may be bonded to the front plate 101 and the back plate 107, and may be formed of a frame 106 comprising a metal and / or a polymer. The frame 106 may be referred to as a frame structure, a side frame structure, or a side member. In one embodiment, the back plate 107 and the frame 106 may be integrally formed and include the same material (e.g., a metal material such as aluminum), but are not limited thereto. The coupling member 150 and the coupling member 160 may be formed of various materials and in various shapes. For example, the coupling member 150 and the coupling member 160 may be formed of a woven material, leather, rubber, polyurethane, metal, ceramics, or a combination of at least two of these materials.

[0030] According to one embodiment, the electronic device 100 may include at least one of the display 120, the audio modules 105 and 108, the sensor module 111, the key input devices 102, 103 and 104, and the connector hole 109. In some embodiments, the electronic device 100 may omit at least one of the components (e.g., the connector hole 109), or may additionally include other components.

[0031] The display 120 may be exposed through most of the front plate 101. For example, the display 120 may be visually visible through a transparent area of ​​the front plate 101. The shape of the display 120 may be a shape corresponding to the shape of the front plate 101, and may have various shapes such as a circular shape, an elliptical shape, or a polygonal shape. The display 120 may be combined with a touch sensing circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and / or a fingerprint sensor, or may be disposed adjacent to the touch sensing circuit, the pressure sensor capable of measuring the strength (pressure) of a touch, and / or a fingerprint sensor.

[0032] The audio module 105 and the audio module 108 may include a microphone hole 105 and a speaker hole 108. The microphone hole 105 may have a microphone disposed therein for acquiring external sound, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. The speaker hole 108 may be used as an external speaker and a call receiver. In some embodiments, the speaker hole 108 and the microphone hole 105 may be implemented as one hole, or may include a speaker (e.g., a piezoelectric speaker) without the speaker hole 108.

[0033] The sensor module 111 may generate an electrical signal or a data value corresponding to an internal operating state or an external environmental state of the electronic device 100. The sensor module 111 may include, for example, a biometric sensor module 111 (e.g., an HRM sensor) disposed on the second surface 110B of the housing 110. The electronic device 100 may further include a sensor module not shown, for example, at least one of a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0034] The key input device 102, the key input device 103, and the key input device 104 may be disposed on the first surface 110A of the housing 110, and may include a wheel key 102 that can rotate in at least one direction, and / or a side key 103 and a side key 104 disposed on a side surface 110C of the housing 110. The wheel key may have a shape corresponding to the shape of the front plate 101. In other embodiments, the electronic device 100 may not include some or all of the key input device 102, the key input device 103, and the key input device 104, or may further include other key input devices not shown. At least some of the key input device 102, the key input device 103, and the key input device 104 may be implemented in other forms (such as soft keys on the display 120).

[0035] Although not shown, the electronic device 100 may further include a connector hole. The connector hole may accommodate a connector (e.g., a USB connector) for transmitting power and / or data to and / or receiving power and / or data from an external electronic device, or a connector (e.g., a headphone connector) for transmitting audio signals to and / or receiving audio signals from an external electronic device.

[0036] The coupling members 150 and 160 may be detachably coupled to at least a portion of the housing 110 using the locking members 151 and 161. The coupling members 150 and 160 may include one or more of the fixing member 152, the fixing member fastening hole 153, the belt guide member 154, and the belt fixing ring 155.

[0037] The fixing member 152 may be configured to fix the housing 110 and the coupling members 150 and 160 to a body part of the user (e.g., a wrist, etc.). The fixing member fastening hole 153 may fix the housing 110 and the coupling members 150 and 160 to a body part of the user corresponding to the fixing member 152. The belt guide member 154 may be configured to limit the range of movement of the fixing member 152 when the fixing member 152 is fastened to the fixing member fastening hole 153, so that the coupling members 150 and 160 can be tightly combined to the body part of the user. The belt fixing ring 155 may limit the range of movement of the coupling members 150 and 160 when the fixing member 152 and the fixing member fastening hole 153 are fastened. However, the configuration that enables the electronic device 100 to be worn on the user's body (such as the fixing member 152 and the fixing member fastening hole 153 of the coupling member 150 and the coupling member 160) is not limited to the above example, and various mechanisms may be applied.

[0038] Figure 3 is an expanded perspective view of an electronic device according to an embodiment. Figure 3 , the electronic device 300 (eg, Figure 1 The electronic device 100 in the embodiment may include a front panel 101, a display 120, a frame 310 (eg, Figure 1 , a frame 106 in the middle, a first antenna 350, a bracket 360, a battery 370, a printed circuit board 380, a connecting member 50 and a back plate 396.

[0039] The front panel 101 may be disposed on an upper portion of the frame 310 (eg, in the second direction D2). Figure 1The back plate 107 in the frame 310 may be disposed at a lower portion of the frame 310 (e.g., in the first direction D1). The back plate 396 may include a rear shell 393 and a rear cover 365. The rear cover 365 may be disposed on one surface of the rear shell 393 (e.g., a surface facing the first direction D1). The rear shell 393 may be coupled to the frame 310. The rear cover 365 may be coupled to the rear shell 393. In another embodiment, the rear shell 393 and the rear cover 365 may be integrally formed.

[0040] The frame 310 may surround the space between the front plate 101 and the rear plate 396. For example, the frame 310 may include a portion extending from the front plate 101 to the rear plate 396 to surround the space (eg, Figure 4 side wall 415).

[0041] The front panel 101 may be coupled to an upper portion of the frame 310 (e.g., in the second direction D2). The back panel 396 may be coupled to a lower portion of the frame 310 (e.g., in the first direction D1). Between the frame 310 and the rear shell 393, a sealing member (e.g., a waterproof tape or a waterproof tape) configured to block moisture and foreign matter from flowing from the outside into the interior of the electronic device 300 may be inserted. The front panel 101, the frame 310, and the rear panel 396 combined together may define an interior space of the electronic device 300. In the interior space, the display 120, the first antenna 350, the bracket 360, the battery 370, the printed circuit board 380, and the connecting member 50 may be disposed. At least a portion of the front panel 101, the frame 310, and the back panel 396 may be referred to as a housing (e.g., a housing) of the electronic device 300. Figure 1 The housing 110 in FIG.

[0042] The display 120 may be disposed between the front panel 101 and the bracket 360. The display 120 may be at least partially accommodated in the frame 310. The display 120 may be attached to a rear surface (e.g., a surface facing the first direction D1) of the front panel 101. For example, the display 120 may be attached to the front panel 101 by an optical bonding member (e.g., an optically clear adhesive (OCA) or an optically clear resin (OCR)).

[0043] The bracket 360 may be disposed inside the frame 310. The bracket 360 may be surrounded by the frame 310. The bracket 360 may be at least partially spaced apart from the inner surface of the frame 310. The connection member 50 may be disposed in a space defined by the separated bracket 360 and the frame 310.

[0044] The display 120 and the first antenna 350 may be disposed on one surface of the bracket 360 (e.g., in the second direction D2), and the battery 370 and the printed circuit board 380 may be disposed on the other surface (e.g., in the first direction D1). The bracket 360 may support the display 120, the first antenna 350, the battery 370, the printed circuit board 380, and the connecting member 50. The bracket 360 may be referred to as a supporting member.

[0045] The bracket 360 may be provided separately from the frame 310 and coupled to the frame 310, or may be integrally formed with the frame 310. The bracket 360 may be formed of, for example, a metal material and / or a non-metal (eg, polymer such as plastic) material.

[0046] The printed circuit board 380 may be disposed between the bracket 360 and the back plate 396. On the printed circuit board 380, a processor (eg, Fig.12 processor 1220 in the processor 1220), memory (e.g., Fig.12 1230) and / or an interface (e.g., Fig.12 The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit (GPU), an application processor, a sensor processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may include a connector (e.g., Fig.12 A connection terminal 1278 in the body, such as a USB connector, an SD card / MMC connector, or an audio connector.

[0047] The battery 370 may be a device for supplying power to at least one of the components of the electronic device 300, and may include, for example, a rechargeable storage battery. The battery 370 may be disposed between the bracket 360 and the printed circuit board 380. The battery 370 may be at least partially disposed in a receiving space (e.g., a groove) formed in one surface (e.g., a surface facing the first direction D1) of the bracket 360. The battery 370 may be attached to the bracket 360 by an adhesive member (adhesive or adhesive tape).

[0048] The first antenna 350 may be disposed between the display 120 and the bracket 360. The first antenna 350 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the first antenna 350 may perform short-range communication with an external device, wirelessly transmit and receive power required for charging, and transmit a short-range communication signal or a self-based signal including payment data.

[0049] Figure 4 is a perspective view showing some components of an electronic device according to one embodiment. Figure 5 is a perspective view showing some components of an electronic device according to one embodiment. Figure 6 2 is a view showing a connection member according to an embodiment. Figure 4 , Figure 5 and Figure 6 According to an embodiment of the electronic device 400 (eg, Figure 3 The electronic device 300 in FIG. 4 may include a printed circuit board 480 , a bracket 460 , a frame 410 , a connecting member 50 , a first button 416 , a second button 417 , and a display 420 .

[0050] In one embodiment, a printed circuit board 480 (eg, Figure 3 The printed circuit board 380 in the embodiment may include a first surface 480A and a second surface 480B facing a direction opposite to the first surface 480A. For example, the first surface 480A of the printed circuit board 480 may face a first direction D1, and the second surface 480B of the printed circuit board 480 may face a second direction D2 opposite to the first direction D1.

[0051] In one embodiment, although not shown, various electronic components (eg, Fig.12 480 and the wireless communication module 1292 in the printed circuit board 480). A protective member 485 for protecting the electronic components disposed on the printed circuit board 480 may be disposed on the first surface 480A and / or the second surface 480B of the printed circuit board 480. For example, the protective member 485 may include an insulating member (e.g., a resin) covering the electronic components to protect the electronic components from external moisture, etc. and a conductive layer (e.g., a conformal shield) formed on the surface of the insulating member to shield electromagnetic interference (EMI), and / or include a shielding cover for covering the electronic components. However, the protective member 485 is not limited thereto.

[0052] In one embodiment, the printed circuit board 480 may be disposed on the bracket 460 . For example, the printed circuit board 480 may be disposed on the bracket 460 in the first direction D1 . The second surface 480B of the printed circuit board 480 may face the bracket 460 .

[0053] In one embodiment, the frame 410 (e.g., Figure 3 The frame 310 in the embodiment may include a side surface (eg, Figure 2The side wall 415 may extend in the height direction (e.g., the first direction D1) of the electronic device 400. The side wall 415 may surround the bracket 460. When the frame 410 is viewed from above (e.g., when viewed in the first direction D1 or the second direction D2), the shape of the side wall 415 may be substantially circular. However, the shape is not limited thereto, and the side wall 415 may have various shapes, such as a quadrilateral, a quadrilateral with rounded corners, a polygon, etc.

[0054] In one embodiment, the frame 410 may include a first point 411 and a second point 412. The first point 411 and / or the second point 412 may be directly formed on the sidewall 415, or may be formed in a portion protruding inward from the sidewall 415.

[0055] In one embodiment, the frame 410 may include a first portion 413 and a second portion 414. The first portion 413 may include a portion extending from a first point 411 of the side wall 415 to a second point 412 in one direction (e.g., counterclockwise). Based on one direction, the first portion 413 may have a first length from the first point 411 of the side wall 415 to the second point 412. The second portion 414 may include a portion extending from the first point 411 of the side wall 415 to the second point 412 in a direction different from the one direction (e.g., clockwise). Based on a direction other than the one direction, the second portion 414 may have a second length from the first point 411 of the side wall 415 to the second point 412. The second length may be shorter than the first length.

[0056] In one embodiment, the electronic device 400 may include an antenna including at least a portion of a frame 410 as an antenna element. In one embodiment, the frame 410 may be powered at a first point 411 and grounded at a second point 412 to function as an antenna for transmitting and receiving wireless signals.

[0057] In one embodiment, the first point 411 of the frame 410 may be connected to a first connector 481 disposed on the second surface 480B of the printed circuit board 480. For example, the first point 411 of the frame 410 may be electrically connected to contact the first connector 481. In one embodiment, a wireless communication circuit (e.g., Fig.12 The wireless communication module 1292 in the embodiment of the present invention may be electrically connected to the first point 411 of the frame 410 through a transmission line formed on the printed circuit board 480 and a first connector 481 electrically connected to the transmission line. The first connector 481 may include, for example, a c-clip connector, but is not limited thereto. For example, the first connector 481 may include a coaxial cable.

[0058] In one embodiment, the second point 412 of the frame 410 may be connected to a second connector 482 disposed on the second surface 480B of the printed circuit board 480. For example, the second point 412 of the frame 410 may be electrically connected to contact the second connector 482. The second connector 482 may include, for example, a c-clip connector, but is not limited thereto.

[0059] In one embodiment, the second point 412 of the frame 410 can be electrically connected to a ground plane of the printed circuit board 480 via the second connector 482. The ground plane can include a conductive layer (e.g., a copper layer) located on at least one layer of the printed circuit board 480. The ground plane can be formed as one or more regions on one or more layers of the printed circuit board. In this regard, the ground plane of the printed circuit board 480 can be referred to as "at least one ground portion".

[0060] In one embodiment, the frame 410 may form a first resonant frequency corresponding to a first designated frequency band (e.g., a low frequency band (LB) below 1 GHz, but not limited thereto) and a second resonant frequency corresponding to a second designated frequency band (e.g., a mid-frequency band (MB) from 1 GHz to 2.3 GHz, but not limited thereto). For example, the frame 410 may be powered at a first point 411 and short-circuited with a ground portion at a second point 412 to form a first resonant frequency band and / or a second resonant frequency band. The first resonant frequency and the second resonant frequency may vary according to the circumferential length (e.g., the first length and the second length) of each of the first portion 413 and the second portion 414 of the frame 410 divided into the first point 411 and the second point 412. The first resonant frequency and the second resonant frequency may vary according to current paths including the first portion 413 and the second portion 414 of the frame 410, respectively.

[0061] In one embodiment, the wireless communication circuit can send and receive wireless signals of the first designated frequency band and the second designated frequency band by supplying power to the first point 411 of the frame 410. Figure 4 , only the first point 411 and the second point 412 are shown, but the present disclosure is not limited thereto. For example, the frame 410 may further include at least one feeding point and / or at least one grounding point.

[0062] In one embodiment, the bracket 460 (e.g., Figure 3 The bracket 360 in the frame 410 may be at least partially accommodated in the space formed by the frame 410. For example, the bracket 460 may be disposed in the side wall 415 of the frame 410.

[0063] In one embodiment, the bracket 460 may be at least partially spaced apart from the sidewall 415 of the frame 410. For example, the bracket 460 may include a side surface 460C facing the sidewall 415, and the side surface 460C of the bracket 460 may be at least partially spaced apart from the sidewall 415.

[0064] In one embodiment, the bracket 460 may support the printed circuit board 480 and the connection member 50. In one embodiment, the connection member 50 may include a flexible printed circuit board or a rigid-flexible printed circuit board, and at least a portion of the connection member 50 may be bent.

[0065] In one embodiment, the connection member 50 may be at least partially disposed between the bracket 460 and the sidewall 415 of the frame 410. The connection member 50 may be at least partially seated in a receiving groove 462 formed on a side surface 460C of the bracket 460 facing the sidewall 415.

[0066] In one embodiment, the connection member 50 may be disposed between the bracket 460 and the first portion 413 of the frame 410. For example, the connection member 50 may be closer to the first portion 413 of the frame 410 than the second portion 414 of the frame 410. However, the connection member 50 is not limited thereto, and for another example, unlike what is shown, the connection member 50 may be disposed between the bracket 460 and the second portion 414 of the frame 410.

[0067] In one embodiment, the connection member 50 may be fixedly disposed on the side surface 460C of the bracket 460. For example, the connection member 50 may be coupled to the bracket 460 in such a manner that the protrusion 464 formed in the receiving groove 462 and the hole 537 formed in the connection member 50 are inserted and combined together. For another example, the connection member 50 may be coupled to the bracket 460 by an adhesive member (e.g., double-sided tape) or a fixing member (e.g., a screw).

[0068] In one embodiment, when viewing a side surface of the electronic device 400 (eg, when viewed in a direction perpendicular to the first direction D1), the connection member 50 may be disposed to at least partially overlap the sidewall 415 of the frame 410 and / or the bracket 460 .

[0069] In one embodiment, the connecting member 50 may include a first portion 51, a second portion 52, and an extension portion 53. In one embodiment, the extension portion 53 may be located between the bracket 460 and the side wall 415. The extension portion 53 may extend along the side wall 415 of the frame 410 (or the side surface 460C of the bracket 460). The extension portion 53 may be at least partially accommodated in the accommodation groove 462 of the bracket 460.

[0070] In one embodiment, the extension portion 53 may include a first end 53A and a second end 53B. The first end 53A may be located between the first button 416 and the bracket 460. The second end 53B may be located between the second button 417 and the bracket 460.

[0071] In one embodiment, various components of the electronic device 400 may be disposed on the extension portion 53. For example, a first component 531, a second component 532, and a third component 533 may be disposed on the extension portion 53.

[0072] In one embodiment, the first button 416 and the second button 417 may be at least partially exposed through the frame 410. In one embodiment, when observing the side surface (e.g., Figure 2 When the side wall 415 of the frame 410 is viewed from the front (e.g., when viewed in a direction perpendicular to the first direction D1), the first button 416 and the second button 417 may at least partially overlap with the connection member 50. In one embodiment, when the side wall 415 of the frame 410 is viewed from the front (e.g., when viewed in a direction perpendicular to the first direction D1), the first button 416 and the second button 417 may at least partially overlap with the extension portion 53 of the connection member 50. For example, the first button 416 may at least partially overlap with the first end 53A of the extension portion 53, and the second button 417 may at least partially overlap with the second end 53B of the extension portion 53.

[0073] In one embodiment, the display 420 (e.g., Figure 3 The display 120 in the frame 410 may be disposed in the frame 410. In one embodiment, the bracket 460 may be disposed between the display 420 and the printed circuit board 480. The printed circuit board 480 may be disposed and supported in one direction (e.g., the first direction D1) of the bracket 460, and the display 420 may be disposed and supported in another direction (e.g., the second direction D2).

[0074] In one embodiment, the first component 531 and / or the second component 532 may include a biometric sensor. For example, the first component 531 and / or the second component 532 may include, but are not limited to, a bioelectrical impedance analysis sensor (BIA sensor) and / or an electrocardiogram sensor (ECG sensor). The biometric sensor may include a first conductive structure and a second conductive structure electrically connected to the first button 416 and the second button 417 to obtain biometric information. The first conductive structure and the second conductive structure may include, for example, a conductive plate. The conductive structure may include contact portions 5311 and 5321 that at least partially contact the first button 416 and the second button 417 and fixed portions 5312 and 5322 that extend from the contact portions 5311 and 5321 and are electrically connected to the first end 53A and the second end 53B of the connecting member 50.

[0075] In one embodiment, the first component 531 may include a first dome switch. The first dome switch may be disposed between the first conductive structure and a surface of the connecting member 50. The first dome switch may be activated by the first button 416 (e.g., Figure 1In one embodiment, the second component 532 may include a second dome switch. The second dome switch may be disposed between the second conductive structure and one surface of the connecting member 50. The second dome switch may generate an electrical signal by being pressed by the second button 417 according to the user's operation.

[0076] In one embodiment, the first conductive structure of the first component 531 may be electrically connected to a first button 416 formed at least in part of a conductive material (e.g., metal). In one embodiment, the second conductive structure of the second component 532 may be electrically connected to a second button 417 formed at least in part of a conductive material. When the user's body contacts the first button 416, the first component 531 and the first button 416 may function as a first electrode for detecting biometric information about the user. When the user's body contacts the second button 417, the second component 532 and the second button 417 may function as a second electrode for detecting biometric information about the user. In one embodiment, the signals detected by the first electrode and the second electrode may be provided to a processor (e.g., Fig.12 The processor 1220 in the embodiment of the present invention can obtain biometric information about the user based on the detected signal. The biometric information can include, but is not limited to, information about components of the user's body and / or information about the user's electrocardiogram.

[0077] The electronic device 400 according to one embodiment may include an analog-to-digital converter (not shown) that processes an analog signal detected from a biometric sensor into a digital signal and transmits the digital signal to a processor. The analog-to-digital converter may be disposed on the printed circuit board 480, but is not limited thereto.

[0078] In one embodiment, the third component 533 may be disposed between the first component 531 and the second component 532 in the extension portion 53. In one embodiment, the third component 533 may include an acoustic sensor. In one embodiment, the third component 533 may be located between the extension portion 53 and the bracket 460. In one embodiment, a microphone hole 535 through which sound is introduced may be formed in the third component 533, and the microphone hole 535 may be aligned with an opening 536 formed in the extension portion 53 to communicate with the opening 536.

[0079] In one embodiment, the above-mentioned first component 531, second component 532, and third component 533 are not limited to the above-mentioned examples, and may be replaced with components having functions different from those described above.

[0080] In one embodiment, the first portion 51 of the connecting member 50 may extend from the first end 53A of the extension portion 53. The first portion 51 of the connecting member 50 may extend from the first end 53A of the extension portion 53 to face the first surface 480A of the printed circuit board 480. The first portion 51 may be disposed on the first surface 480A of the printed circuit board 480. For example, the first portion 51 may include a plug 511 of a connector, and a socket 487 of the connector may be disposed on the first surface 480A of the printed circuit board 480. The first portion 51 may be connected to the printed circuit board 480 in a manner that the plug 511 and the socket 487 are combined with each other. However, in order to connect the connecting member 50 to the printed circuit board 480, the connector structure is not limited to the connector structure formed by the above-mentioned socket and plug, and various methods may be used. Alternatively, the first portion 51 may be disposed on the second surface 480B of the printed circuit board 480.

[0081] In one embodiment, at least one processor (e.g., Fig.12 The processor 1220 in the embodiment of the present invention can be operably connected to the first component 531, the second component 532, and the third component 533 through the connecting member 50. For example, the at least one processor can be electrically connected to the first component 531, the second component 532, and the third component 533 through the printed circuit board 480 and the conductive traces (or patterns) formed on the connecting member 50. In one embodiment, the at least one processor can send and / or receive electrical signals to and from the first component 531, the second component 532, and the third component 533. The electrical signal can be transmitted through the first portion 51 of the connecting member 50.

[0082] In one embodiment, the second portion 52 of the connecting member 50 may extend from the second end 53B of the extending portion 53. The second portion 52 of the connecting member 50 may extend from the second end 53B of the extending portion 53 to face the second surface 480B of the printed circuit board 480. The second portion 52 may be disposed on the second surface 480B of the printed circuit board 480. In the second portion 52, a conductive region 521 (or conductive pad) in which the conductive pattern of the connecting member 50 is partially exposed may be formed. The conductive region 521 may face the second surface 480B of the printed circuit board 480. The conductive region 521 may be connected to a third connector 483 disposed on the second surface 480B of the printed circuit board 480. For example, the conductive region 521 may contact the third connector 483. The conductive region 521 may be electrically connected to the third connector 483. For example, the third connector 483 may include, but is not limited to, a C-clip. Optionally, the second portion 52 of the connecting member 50 may be disposed on the first surface 480A of the printed circuit board 480.

[0083] In one embodiment, the connection member 50 may include a plurality of conductive traces (or patterns). The plurality of conductive traces may include signal lines and power lines for operating the first component 531, the second component 532, and the third component 533, and a plurality of ground lines. At least some of the plurality of ground lines may be electrically connected to the conductive region 521 of the second portion 52 directly or indirectly (e.g., via another ground line). At least some of the plurality of ground lines may be electrically connected to the third connector 483 through the conductive region 521.

[0084] In one embodiment, the connecting member 50 may be at least partially bendable. In one embodiment, the connecting member 50 may include a flexible portion and a rigid portion. For example, referring to Figure 6 , the connecting member 50 may include a first rigid portion 611 , a second rigid portion 612 , a third rigid portion 613 , a fourth rigid portion 614 , a fifth rigid portion 615 , a first flexible portion 661 , a second flexible portion 662 , a third flexible portion 663 and a fourth flexible portion 664 .

[0085] The plug 511 may be disposed on the first rigid portion 611. In one embodiment, the first flexible portion 661 may connect the first rigid portion 611 and the second rigid portion 612. For example, the first flexible portion 661 may extend from the first rigid portion 611 to the second rigid portion 612. In one embodiment, since the first rigid portion 611 and the first flexible portion 661 extend from the first end 53A of the extension portion 53, the first rigid portion 611 and the first flexible portion 661 may be referred to as the first portion 51 of the connection member 50.

[0086] The first component 531 may be disposed on the second rigid portion 612. The second flexible portion 662 may connect the second rigid portion 612 and the third rigid portion 613. For example, the second flexible portion 662 may extend from the second rigid portion 612 to the third rigid portion 613.

[0087] The third component 533 may be disposed on the third rigid portion 613. Figure 4 An opening 536 communicating with the third rigid portion 613 may be formed in the third rigid portion 613.

[0088] The third flexible portion 663 may connect the third rigid portion 613 and the fourth rigid portion 614. For example, the third flexible portion 663 may extend from the third rigid portion 613 to the fourth rigid portion 614 in a direction away from the second flexible portion 662. The second component 532 may be disposed on the fourth rigid portion 614.

[0089] The second rigid portion 612, the second flexible portion 662, the third rigid portion 613, the third flexible portion 663, and the fourth rigid portion 614 may extend along the side wall 415 of the frame 410 or the side surface 460C of the bracket 460. In this regard, the second rigid portion 612, the second flexible portion 662, the third rigid portion 613, the third flexible portion 663, and the fourth rigid portion 614 may be referred to as an extension portion 53 of the connecting member 50. The first end 53A of the connecting member 50 may be understood as including at least a portion of the second rigid portion 612. In one embodiment, the second end 53B of the connecting member 50 may be understood as including at least a portion of the fourth rigid portion 614.

[0090] The conductive region 521 may be formed on the fifth rigid portion 615. The conductive region 521 may include a conductive pad for electrically connecting to the third connector 483.

[0091] The fourth flexible portion 664 may connect the fourth rigid portion 614 and the fifth rigid portion 615. The fourth flexible portion 664 may extend from the fourth rigid portion 614 to the fifth rigid portion 615.

[0092] Since the fourth flexible portion 664 and the fifth rigid portion 615 extend from the second end 53B of the extending portion 53 , the fourth flexible portion 664 and the fifth rigid portion 615 may be referred to as the second portion 52 of the connecting member 50 .

[0093] However, the distinction between the rigid portion and the flexible portion described above is exemplary, and various design changes are possible. For example, when the third component 533 is omitted, the third rigid portion 613 can be replaced by a flexible portion. For another example, the first end 53A (or the second end 53B) of the extension portion 53 has been described as including at least a portion of the second rigid portion 612 (or the fourth rigid portion 614), but in other embodiments, the first end 53A and / or the second end 53B of the extension portion 53 may be at least partially formed as a flexible portion.

[0094] Figure 7 A second surface of a printed circuit board is shown according to one embodiment. Figure 8 A first surface of a printed circuit board according to one embodiment is shown.

[0095] Reference Figure 7 and Figure 8, the printed circuit board 480 according to one embodiment may include a conductive pattern 710 electrically connected to the third connector 483, a first conductive through hole 781, a second conductive through hole 782, and at least one grounding portion 730. The conductive pattern 710 may be formed of a conductive material (e.g., copper). The conductive pattern 710 may include a first pattern 711, a second pattern 712, a third pattern 713, a fourth pattern 714, and a fifth pattern 715. The conductive pattern 710 may also include a first connection pad 761, a second connection pad 762, and a third connection pad 763.

[0096] The first pattern 711 may be electrically connected to the third connector 483. For example, the third connector 483 may be mounted on a conductive area 770 provided by the printed circuit board 480, and the first pattern 711 may be connected to the conductive area 770. The first pattern 711 may be electrically connected to the third connector 483 through the conductive area 770. The first pattern 711 may extend from the conductive area 770 to the first connection pad 761. The first connection pad 761 and the second connection pad 762 may be electrically connected by a first circuit element (e.g., a resistor, an inductor, a capacitor). The first circuit element may be connected in series to the conductive pattern 710. However, the connection configuration is not limited thereto, and for example, the first circuit element and the first connection pad 761 and the second connection pad 762 for setting the first circuit element may be omitted. In this case, the first pattern 711 may be extended to the second pattern 712 to be directly connected to the second pattern 712. The second pattern 712 may extend from the second connection pad 762 to at least one grounding portion 730. The second pattern 712 may be electrically connected to at least one grounding portion 730.

[0097] The third pattern 713 may extend from the first connection pad 761 to the third connection pad 763. The third connection pad 763 may be electrically connected to the fourth connection pad 764 through a second circuit element (e.g., a resistor, an inductor, a capacitor). The second circuit element may be connected in series to the conductive pattern 710. However, the connection configuration is not limited thereto, and for example, the second circuit element and the third connection pad 763 and the fourth connection pad 764 for setting the second circuit element may be omitted. In this case, the third pattern 713 may be extended to the fourth pattern 714 to be directly connected to the fourth pattern 714.

[0098] The fourth pattern 714 may extend from the fourth connection pad 764 to the first conductive via 781. The fourth pattern 714 may be electrically connected to the first conductive via 781. In order to route the conductive patterns 710 located on different layers of the printed circuit board 480, the first conductive via 781 may include a hole partially passing through the printed circuit board 480 and a conductive material (e.g., copper) at least partially filling the hole.

[0099] The first conductive via 781 may be electrically connected to the second conductive via 782. For example, the first conductive via 781 may be connected to the second conductive via 782 through another conductive pattern or another conductive via not shown. The second conductive via 782 may be electrically connected to the fifth pattern 715.

[0100] In another embodiment, the second conductive via 782 may be omitted. In this case, the first conductive via 781 may be directly electrically connected to the fourth pattern 714 and the fifth pattern 715. The first conductive via 781 may route the fourth pattern 714 and the fifth pattern 715.

[0101] The fifth pattern 715 may extend from the second conductive via 782 to at least one ground portion 730. Figure 8 , the fifth pattern 715 is shown as extending rightward from the second conductive via 782, but is not limited thereto. The fifth pattern 715 may extend in a direction different from the direction shown, for example, extending leftward from the second conductive via 782.

[0102] The fifth pattern 715 may be electrically connected to at least one ground portion 730. The fifth pattern 715 may be formed on a layer different from at least one of the first pattern 711, the second pattern 712, the third pattern 713, and / or the fourth pattern 714. For example, the first pattern 711, the second pattern 712, the third pattern 713, and the fourth pattern 714 may be formed on a first layer (not necessarily the uppermost layer or the lowermost layer) of the printed circuit board 480, and the fifth pattern 715 may be formed on a second layer different from the first layer (not necessarily stacked on the first layer). The physical length of the fifth pattern 715 may be longer than the physical length of the first pattern 711, the second pattern 712, the third pattern 713, or the fourth pattern 714. Optionally, a third circuit element (e.g., a resistor, an inductor, a capacitor) may be connected in series to the fifth pattern 715.

[0103] Optionally, with Figure 8 Unlike the illustration in FIG. 7 , the fifth pattern 715 may not be connected to the at least one ground portion 730. For example, the fifth pattern 715 may extend from the second conductive via 782 but have an end formed by an open stub. Figure 9a is a graph showing antenna radiation efficiency of an electronic device according to a comparative example and an electronic device according to an embodiment of the present disclosure, and Figure 9b is a graph showing antenna radiation coefficients of an electronic device according to a comparative example and an electronic device according to an embodiment of the present disclosure. Figure 9a and Figure 9b , a curve 901 is a curve of an electronic device according to a comparative example that does not include the third pattern 713, the fourth pattern 714, the first conductive via 781, the second conductive via 782, and the fifth pattern 715. Figure 9a and Figure 9b In FIG. 9 , a curve 903 is a curve in a state where the fifth pattern 715 is not connected to at least one ground portion 730 and an end portion of the fifth pattern 715 is electrically open. Figure 9a and Figure 9b , a curve 905 is a curve of a state in which the fifth pattern 715 is electrically connected to at least one ground portion 730. Figure 9a and 9b , the radiation efficiency of curve 903 and curve 905 may be generally higher than the radiation efficiency of curve 901. In addition, the radiation efficiency of curve 905 may be generally higher than the radiation efficiency of curve 903. In particular, in a specified frequency band A of about 1300 MHz to about 1800 MHz, the radiation efficiency of curve 903 may be higher than the radiation efficiency of curve 901, and the radiation efficiency of curve 905 may be higher than the radiation efficiency of curve 903.

[0104] Return to reference Figure 7 and Figure 8 , the fifth pattern 715 may have various lengths. For example, the fifth pattern 715 may extend from the second conductive via 782 to the first position a, the second position b, or the third position c. When the fifth pattern 715 extends to the first position a, the fifth pattern 715 may have a first length. When the fifth pattern 715 extends to the second position b, the fifth pattern 715 may have a second length. When the fifth pattern 715 extends to the third position c, the fifth pattern 715 may have a third length. The first length may be greater than the second length, and the second length may be greater than the third length. The end of the fifth pattern 715 corresponding to each of the first position a, the second position b, or the third position c may be open without being electrically connected to at least one ground portion 730.

[0105] Fig.10 is a graph showing the antenna radiation efficiency according to the length of the fifth pattern 715 according to an embodiment of the present disclosure. Fig.10 , curve 1001 shows the radiation efficiency of the electronic device when the fifth pattern 715 has a first length corresponding to the first position a, and curve 1003 shows the radiation efficiency of the electronic device when the fifth pattern 715 has a second length corresponding to the second position b. Curve 1005 shows the radiation efficiency of the electronic device when the fifth pattern 715 has a third length corresponding to the third position c. Fig.10 , as the length of the fifth pattern 715 becomes shorter, the antenna radiation efficiency can shift to a higher frequency band.

[0106] Return to reference Figure 7 and Figure 8 , the conductive pattern 710 may have a specific line width. For example, the fifth pattern 715 of the conductive pattern 710 may have a specific line width w. The line width of the conductive pattern 710 may be determined according to the radiation efficiency of the required frequency band. Fig.11a The radiation efficiency according to the line width w of the conductive pattern 710 when the fifth pattern 715 is connected to at least one ground portion is shown. Fig.11b yes Fig.11a Graph corresponding to the first frequency band from 650 MHz to 900 MHz. Fig.11c yes Fig.11a The graph in FIG. 1 corresponds to a second frequency band of 1500 MHz to 2200 MHz. Fig.11a , Fig.11b and Fig.11c , curve 1101 shows the radiation efficiency when the line width w of the conductive pattern 710 is 1.4 mm, curve 1103 shows the radiation efficiency when the line width w of the conductive pattern 710 is 2.0 mm, and curve 1105 shows the radiation efficiency when the line width w of the conductive pattern 710 is 2.5 mm. Fig.11a , Fig.11b and Fig.11c , the radiation efficiency may vary according to the line width w of the conductive pattern 710. For example, referring to Fig.11b , in the first frequency band, the radiation efficiency of curve 1003 and curve 1005 may be higher than the radiation efficiency of curve 1001. For example, referring to Fig.11c , in the second frequency band, the radiation efficiency of curve 1003 may be higher than the radiation efficiencies of curve 1001 and curve 1005 .

[0107] Reference Figure 7 and Figure 8 , the third connector 483 may be electrically connected to at least one ground portion 730 through the conductive pattern 710. Figure 5 , the conductive region 521 of the connecting member 50 may be electrically connected to the third connector 483. A plurality of ground lines of the connecting member 50 may be electrically connected to at least one ground portion 730 of the printed circuit board 480 through the conductive region 521 and the third connector 483. The connecting member 50 may form a loop structure, wherein the first portion 51 is disposed on the printed circuit board 480 to be operably connected to at least one processor, and the second portion 52 is electrically connected to at least one ground portion 730 of the printed circuit board 480. By forming a loop structure between the two ends (e.g., the first portion 51 and the second portion 52) of the connecting member 50, noise and / or parasitic components may be reduced, thereby reducing and / or preventing performance degradation of the antenna. The conductive pattern 710 may be electrically connected to the electrical loop structure. By extending the ground loop structure by the conductive pattern 710, the antenna efficiency may be improved. By adjusting the length and / or line width of the conductive pattern 710, the antenna efficiency of the desired frequency band may be improved. In addition, by adjusting the length and / or line width of the conductive pattern 710, the antenna resonant frequency and the parasitic resonant frequency may be offset, thereby tuning the antenna efficiency of the desired frequency band.

[0108] The conductive pattern 710 may be referred to as a printed circuit board embedded antenna (PEA).

[0109] In one embodiment, a wearable electronic device (e.g., Figure 4 The electronic device 400 may include: including a side wall (eg, Figure 4 415) and at least partially forms a frame for the antenna (e.g., Figure 4 410 in the frame); disposed within the frame and including at least one grounding portion (eg, Figure 7 at least one grounding portion 730) of a printed circuit board (eg, Figure 4 480 in the printed circuit board); and a connecting member (eg, Figure 4 The connecting member 50 in the figure). The connecting member may include: an extending portion extending along the side wall (for example, Figure 4 from the first end of the extension portion (eg, Figure 4 The first end 53A in the embodiment extends and is connected to a first portion of the printed circuit board (eg, Figure 4 from the second end of the extension portion (eg, Figure 4 The second end 53B in the embodiment of the present invention extends and is connected to a conductive area of ​​the printed circuit board (e.g., Figure 7 The second portion of the conductive region 770 in FIG. Figure 4 The conductive trace may be electrically connected to at least one ground portion through a conductive region of the printed circuit board. The printed circuit board may include a conductive pattern (e.g., Figure 7 The conductive pattern 710 in the printed circuit board can be electrically connected to the conductive traces of the connecting member through the conductive area.

[0110] The conductive pattern may include a first pattern extending from a conductive region (eg, Figure 7 A first pattern 711 in the figure) and a second pattern extending from the first pattern to at least one ground portion (eg, Figure 7 The second pattern 712 in FIG.

[0111] A wearable electronic device according to an embodiment may include a first circuit element. The first pattern and the second pattern may be electrically connected through the first circuit element.

[0112] In one embodiment, the printed circuit board may include a first conductive via (e.g., Figure 7 The conductive pattern may include a third pattern extending from the first pattern (eg, Figure 7 713 in the first conductive via hole) and a fourth pattern extending from the third pattern to the first conductive via hole (eg, Figure 7 The fourth pattern 714 in FIG.

[0113] The wearable electronic device according to one embodiment may include a second circuit element. The third pattern and the fourth pattern may be electrically connected through the second circuit element.

[0114] In one embodiment, the fourth pattern may be formed on a first layer of the printed circuit board. The conductive pattern may include a fifth pattern (eg, Figure 8 The fifth pattern 715 in FIG.

[0115] In one embodiment, the printed circuit board may include a second conductive via (eg, Figure 8 The fourth pattern may be formed on the first layer of the printed circuit board. The conductive pattern may include a fifth pattern (e.g., Figure 8 The fifth pattern 715 in FIG.

[0116] In one embodiment, the fifth pattern of the conductive pattern may extend a first length toward the at least one ground portion to be electrically connected to the at least one ground portion, or extend a length shorter than the first length to be electrically open to the at least one ground portion.

[0117] In one embodiment, the conductive pattern may include a fifth pattern (eg, Figure 8 The fifth pattern 715 in the conductive region). The fifth pattern may extend from the conductive region by a first length to be electrically connected to at least one ground portion, or extend by a length shorter than the first length to be electrically open to at least one ground portion.

[0118] A wearable electronic device according to one embodiment may include a bracket (eg, Figure 4 The printed circuit board may include a first surface (eg, Figure 8 a first surface 480A in the bracket) and a second surface opposite to the first surface and facing the bracket (e.g., Figure 7 The second surface 480B in the printed circuit board is provided. The extended portion of the connecting member may be disposed between the side wall and the bracket. The first portion of the connecting member may be disposed on the first surface of the printed circuit board. The second portion of the connecting member may be disposed on the second surface of the printed circuit board.

[0119] Fig.12 1 is a block diagram illustrating an electronic device 1201 in a network environment 1200 according to various embodiments. Fig.12, the electronic device 1201 in the network environment 1200 may communicate with the electronic device 1202 via the first network 1298 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 1204 or the server 1208 via the second network 1299 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 1201 may communicate with the electronic device 1204 via the server 1208. According to an embodiment, the electronic device 1201 may include a processor 1220, a memory 1230, an input module 1250, a sound output module 1255, a display module 1260, an audio module 1270, a sensor module 1276, an interface 1277, a connection terminal 1278, a haptic module 1279, a camera module 1280, a power management module 1288, a battery 1289, a communication module 1290, a subscriber identification module (SIM) 1296, or an antenna module 1297. In some embodiments, at least one of the above components (e.g., the connection terminal 1278) may be omitted from the electronic device 1201, or one or more other components may be added to the electronic device 1201. In some embodiments, some of the above components (e.g., the sensor module 1276, the camera module 1280, or the antenna module 1297) may be implemented as a single component (e.g., the display module 1260).

[0120] The processor 1220 may run, for example, software (e.g., program 1240) to control at least one other component (e.g., hardware component or software component) of the electronic device 1201 connected to the processor 1220, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 1220 may store a command or data received from another component (e.g., sensor module 1276 or communication module 1290) in the volatile memory 1232, process the command or data stored in the volatile memory 1232, and store the resultant data in the non-volatile memory 1234. According to an embodiment, the processor 1220 may include a main processor 1221 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 1223 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is independent of or combined with the main processor 1221 in operation. For example, when the electronic device 1201 includes a main processor 1221 and an auxiliary processor 1223, the auxiliary processor 123 may be configured to use less power than the main processor 1221 or to be dedicated to a specified function. The auxiliary processor 1223 may be implemented separately from the main processor 1221 or as part of the main processor 1221.

[0121] When the main processor 1221 is in an inactive (e.g., sleep) state, the auxiliary processor 1223 (rather than the main processor 1221) may control at least some of the functions or states related to at least one component among the components of the electronic device 1201 (e.g., the display module 1260, the sensor module 1276, or the communication module 1290), or when the main processor 1221 is in an active state (e.g., running an application), the auxiliary processor 1223 may control at least some of the functions or states related to at least one component among the components of the electronic device 1201 (e.g., the display module 1260, the sensor module 1276, or the communication module 1290) together with the main processor 1221. According to an embodiment, the auxiliary processor 1223 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 1280 or a communication module 1290) that is functionally related to the auxiliary processor 1223. According to an embodiment, the auxiliary processor 1223 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated via machine learning. For example, such learning may be performed by an electronic device 1201 that performs artificial intelligence or via a separate server (e.g., server 1208). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0122] The memory 1230 may store various data used by at least one component of the electronic device 1201 (e.g., the processor 1220 or the sensor module 1276). The various data may include, for example, software (e.g., the program 1240) and input data or output data for commands related thereto. The memory 1230 may include a volatile memory 1232 or a nonvolatile memory 1234.

[0123] The program 1240 may be stored as software in the memory 1230 , and the program 1240 may include, for example, an operating system (OS) 1242 , middleware 1244 , or an application 1246 .

[0124] The input module 1250 may receive commands or data to be used by other components (e.g., the processor 1220) of the electronic device 1201 from outside (e.g., a user) of the electronic device 1201. The input module 1250 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0125] The sound output module 1255 can output sound signals to the outside of the electronic device 1201. The sound output module 1255 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0126] The display module 1260 may visually provide information to the outside of the electronic device 1201 (e.g., a user). The display module 1260 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 1260 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0127] The audio module 1270 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 1270 may obtain sound via the input module 1250, or output sound via the sound output module 1255 or an earphone of an external electronic device (e.g., electronic device 1202) directly (e.g., wired) or wirelessly coupled to the electronic device 1201.

[0128] The sensor module 1276 may detect an operating state (e.g., power or temperature) of the electronic device 1201 or an environmental state (e.g., a state of a user) outside the electronic device 1201, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 1276 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0129] The interface 1277 may support one or more specific protocols to be used to directly (e.g., wired) or wirelessly combine the electronic device 1201 with an external electronic device (e.g., the electronic device 1202). According to an embodiment, the interface 1277 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0130] The connection end 1278 may include a connector, wherein the electronic device 1201 can be physically connected to an external electronic device (e.g., the electronic device 1202) via the connector. According to an embodiment, the connection end 1278 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0131] The haptic module 1279 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 1279 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0132] The camera module 1280 may capture a still image or a moving image. According to an embodiment, the camera module 1280 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0133] The power management module 1288 may manage power supply to the electronic device 1201. According to an embodiment, the power management module 1288 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0134] The battery 1289 may power at least one component of the electronic device 1201. According to an embodiment, the battery 1289 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0135] The communication module 1290 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 1201 and an external electronic device (e.g., electronic device 1202, electronic device 1204, or server 1208), and perform communication via the established communication channel. The communication module 1290 may include one or more communication processors capable of operating independently from the processor 1220 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 1290 may include a wireless communication module 1292 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1294 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules may communicate via a first network 1298 (e.g., a short-range communication network such as Bluetooth TMThe wireless communication module 1292 may communicate with an external electronic device through a wireless communication network 1298 (e.g., a wireless fidelity (Wi-Fi) direct connection, or an infrared data association (IrDA)) or a second network 1299 (e.g., a long-distance communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network (LAN) or a wide area network (WAN))). These various types of communication modules may be implemented as a single component (e.g., a single chip), or may be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 1292 may identify or authenticate the electronic device 1201 in a communication network (such as a first network 1298 or a second network 1299) using user information (e.g., an international mobile subscriber identity (IMSI)) stored in the user identification module 1296.

[0136] The wireless communication module 1292 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 1292 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 1292 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 1292 can support various requirements specified in the electronic device 1201, an external electronic device (e.g., electronic device 1204), or a network system (e.g., a second network 1299). According to an embodiment, the wireless communication module 1292 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less for a round trip).

[0137] The antenna module 1297 may transmit or receive a signal or power to or from the outside of the electronic device 1201 (e.g., an external electronic device). According to an embodiment, the antenna module 1297 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 1297 may include a plurality of antennas (e.g., an antenna array). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 1298 or the second network 1299) may be selected from the plurality of antennas by, for example, the communication module 1290. A signal or power may then be transmitted or received between the communication module 1290 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be further formed as a part of the antenna module 1297.

[0138] According to various embodiments, the antenna module 1297 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the designated high frequency band.

[0139] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (eg, a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and transmit signals (eg, commands or data) therebetween.

[0140] According to an embodiment, a command or data may be sent or received between the electronic device 1201 and the external electronic device 1204 via the server 1208 combined with the second network 1299. Each of the external electronic device 1202 or the external electronic device 1204 may be a device of the same type as the electronic device 1201, or a device of a different type from the electronic device 1201. According to an embodiment, all or some operations to be executed in the electronic device 1201 may be executed in one or more of the external electronic device 1202, the external electronic device 1204, or the server 1208. For example, if the electronic device 1201 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 1201 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 1201 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 1201. The electronic device 1201 may provide the result as at least a partial reply to the request with or without further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology, or client-server computing technology, for example, may be used. The electronic device 1201 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 1204 may include an Internet of Things (IoT) device. The server 1208 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 1204 or the server 1208 may be included in the second network 1299. The electronic device 1201 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology or IoT-related technologies.

[0141] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0142] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being “coupled with”, “coupled to”, “connected to”, “connected to” or “connected to” another element (e.g., the second element), with or without the terms “operably” or “communicatively” being used, it means that the element may be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0143] As used in conjunction with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0144] The embodiments described herein may be implemented as software (e.g., program 1240) including one or more instructions stored in a storage medium (e.g., internal memory 1236 or external memory 1238) readable by a machine (e.g., electronic device 1201). For example, a processor (e.g., processor 1220) of a machine (e.g., electronic device 1201) may call and execute at least one of the one or more instructions stored in the storage medium under the control of the processor with or without one or more other components. This allows the machine to be operated to perform at least one function according to at least one instruction called. One or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish whether the data is semi-permanently stored in the storage medium or temporarily stored in the storage medium.

[0145] According to example embodiments, the method according to example embodiments may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., a CD-ROM) or distributed via an application store (e.g., PlayStore). TM ) online distribution (e.g. download or upload), or directly between two user devices (e.g. smartphones). If distributed online, at least a part of the computer program product may be temporarily generated or at least temporarily stored in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a relay server.

[0146] According to various embodiments, each of the components described above (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately provided in different components. According to various embodiments, one or more of the components described above may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform one or more functions of the corresponding components in the multiple components in the same or similar manner as the manner in which the functions were performed by each of the multiple components before integration. According to various embodiments, the operations performed by a module, a program, or another component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be run in a different order or omitted, or one or more other operations may be added.

Claims

1. A wearable electronic device, comprising: a frame forming a side wall of the wearable electronic device; a printed circuit board within the frame and including a ground portion; as well as a connecting member, wherein at least a portion of the connecting member extends along the side wall, Wherein, the connecting member comprises: an extension portion extending along the side wall; a first portion extending from a first end of the extending portion and connected to the printed circuit board; a second portion extending from the second end of the extending portion and connected to the conductive area of ​​the printed circuit board; and a conductive trace extending from the first portion to the second portion through the extension portion, wherein the conductive trace is connected to the ground portion through the conductive area of ​​the printed circuit board, and Wherein, the printed circuit board includes a conductive pattern extending from the conductive area.

2. The wearable electronic device according to claim 1, wherein: The conductive pattern includes a first pattern extending from the conductive region.

3. The wearable electronic device according to claim 1, wherein: The conductive pattern includes a second pattern extending from the first pattern to the ground portion.

4. The wearable electronic device as claimed in claim 3, in, The printed circuit board also includes a first circuit element, and Wherein, the first pattern and the second pattern are connected through the first circuit element.

5. The wearable electronic device as claimed in claim 2, wherein: The conductive pattern includes a third pattern extending from the first pattern.

6. The wearable electronic device as claimed in claim 5, in, The printed circuit board includes a first conductive via, and The conductive pattern includes a fourth pattern extending from the third pattern to the first conductive via.

7. The wearable electronic device as claimed in claim 6, in, The printed circuit board includes a second circuit element, and The third pattern and the fourth pattern are connected via the second circuit element.

8. The wearable electronic device as claimed in claim 6, wherein: The fourth pattern is formed on the first layer of the printed circuit board.

9. The wearable electronic device as claimed in claim 8, wherein: The conductive pattern includes a fifth pattern extending from the first conductive via on a second layer of the printed circuit board different from the first layer.

10. The wearable electronic device according to claim 9, wherein: The fifth pattern extends a first length toward the ground portion and is connected to the ground portion, or extends a length shorter than the first length and is not connected to the ground portion.

11. The wearable electronic device according to claim 8, wherein: The printed circuit board also includes a second conductive via connected to the first conductive via, and The conductive pattern further includes a fifth pattern extending from the second conductive via in a second layer of the printed circuit board different from the first layer.

12. The wearable electronic device according to claim 11, wherein: The fifth pattern extends a first length toward the ground portion and is connected to the ground portion, or extends a length shorter than the first length and is not connected to the ground portion.

13. The wearable electronic device according to claim 1, wherein: The conductive pattern includes a fifth pattern, and The fifth pattern extends from the conductive region to a first length and is connected to the ground portion, or extends to a length shorter than the first length and is not connected to the ground portion.

14. The wearable electronic device of claim 1, further comprising a bracket, within the frame, in, The printed circuit board further comprises a first surface and a second surface opposite to the first surface, wherein the second surface faces the bracket, and Wherein, the extending portion of the connecting member is between the side wall and the bracket.

15. The wearable electronic device according to claim 14, wherein: The first portion of the connecting member is on the first surface of the printed circuit board, and Wherein, the second portion of the connecting member is on the second surface of the printed circuit board.

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