Glass wafer processing device and use method thereof

Abstract

The invention discloses a glass wafer processing device and a use method thereof.The glass wafer processing device comprises a grinding box, a grinding mechanism, a supporting mechanism and a storage fixing assembly; a lifting supporting assembly is installed on one side of the grinding box. The grinding mechanism comprises a driving grinding motor, a fixed transmission shaft is installed on the driving grinding motor, a grinding disc is rotationally connected to the fixed transmission shaft, a fixed connecting column is fixed to the grinding disc, and the fixed transmission shaft is in threaded connection with the fixed connecting column; the supporting mechanism comprises a rotating boss, a glass wafer body is arranged on the rotating boss, a driving arc rod is fixed to one side of the rotating boss, and the other end of the driving arc rod is fixedly connected with an anti-blocking scraper. Through the arrangement of corresponding mechanisms, particles generated during grinding of the glass wafer can be washed away in time and are not prone to being mixed into grinding liquid, so that the flatness and precision of the glass wafer are not prone to being affected, the probability of defective products is reduced, and loss is reduced for a user.

Description

Technical Field

[0001] The present invention belongs to the technical field of glass wafer processing, and in particular relates to a glass wafer processing device and a use method thereof. Background Art

[0002] Glass wafers are thin round glass sheets used in fields such as semiconductors and micro-nano processing. Compared with traditional silicon wafers, glass wafers have some unique properties. They usually have good optical transparency, which makes them very advantageous in the manufacture of optical devices. Glass wafers have a relatively low coefficient of thermal expansion, which means that in an environment with temperature changes, they can maintain good dimensional stability and reduce shape changes and internal stress caused by thermal expansion and contraction.

[0003] In the early stage of glass wafer manufacturing, the wafers were obtained by cutting and other methods, but the cut wafers may have uneven thickness or thickness that does not meet the requirements of subsequent processes, so the glass wafers need to be ground. Through grinding, the thickness of the glass wafer can be accurately controlled within a specific range, and the unevenness of the glass wafer surface caused by cutting and other operations can be eliminated, providing a good foundation for subsequent polishing and chip manufacturing processes.

[0004] When grinding glass wafers, grinding fluid is sprayed on the grinding area between the grinding pad and the wafer. The grinding fluid mainly consists of abrasives (such as aluminum oxide, silicon carbide, etc.) and chemical additives. However, the material ground off the glass wafer during grinding will be mixed into the grinding fluid, which will change the distribution and size ratio of the abrasive particles in the grinding fluid, and then cause uneven local grinding rate, affecting the flatness and precision of the glass wafer surface, and thus increasing the probability of defective products, causing unnecessary economic losses to users.

[0005] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0006] The object of the present invention is to provide a glass wafer processing device and a method of using the same, which can solve the problem in the prior art that material particles generated during grinding of the glass wafer are easily mixed into the grinding liquid, resulting in uneven grinding and uneven surface of the glass wafer.

[0007] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows: A glass wafer processing device comprises: a grinding box, a grinding mechanism, a supporting mechanism and a storage and fixing assembly; A lifting support assembly is installed on one side of the grinding box; The grinding mechanism is installed on the lifting support assembly, and the grinding mechanism includes a driving grinding motor, a fixed transmission shaft is installed on the driving grinding motor, a grinding disc is rotatably connected to the fixed transmission shaft, a fixed connecting column is fixed on the grinding disc, and the fixed transmission shaft is threadedly connected to the fixed connecting column; The support mechanism is arranged below the grinding disc, and comprises a rotating boss, on which a glass wafer body is arranged, on which a plurality of evenly distributed adsorption holes are drilled, a driving arc rod is fixed on one side of the rotating boss, and an anti-clogging scraper is fixedly connected to the other end of the driving arc rod; The storage fixing assembly is installed below the rotating boss, and comprises a fixed bottom frame, a storage cavity is bored inside the fixed bottom frame, a plurality of evenly distributed lower leakage holes are bored on the side wall of the storage cavity, and a permeation filter membrane is installed on the fixed bottom frame.

[0008] In one or more embodiments of the present invention, the lifting support assembly includes a driving cylinder for controlling the lifting and lowering movement of the piston push rod, thereby providing power for lifting the grinding disc and driving the grinding disc to descend. A piston push rod is installed on the driving cylinder, and a swing arm is installed on one end of the piston push rod. A support arm is installed on the swing arm. The driving grinding motor is installed on the support arm for driving the lifting and lowering movement of the driving grinding motor and facilitating its adjustment of position, thereby facilitating the installation of the grinding disc.

[0009] In one or more embodiments of the present invention, an arc support plate is provided on one side of the driving grinding motor, which is used to support the grinding shielding platform and drive the grinding shielding platform to move up and down. A plurality of support columns are fixedly connected between the arc support plate and the driving grinding motor, which are used to link the arc support plate and the driving grinding motor, so that the arc support plate can move with the driving grinding motor, thereby facilitating the adjustment of the position of the grinding shielding platform. A grinding shielding platform is fixed under the arc support plate to shield the grinding liquid sprayed from the spray pipe, so that the grinding liquid can flow downward to achieve the effect of flushing the glass wafer body, so that the glass particles ground by the grinding disk can leave the upper end surface of the glass wafer body, thereby avoiding affecting the subsequent grinding and improving the use effect of the grinding liquid.

[0010] In one or more embodiments of the present invention, a rotating disc is provided inside the rotating boss, which is used to drive the rotating boss to rotate and play the role of rotating support. A plurality of linkage rods are fixedly connected between the rotating disc and the rotating boss, which are used to link the rotating disc and the rotating boss, so that the rotating disc can drive the rotating boss to rotate, thereby realizing the function of driving the glass wafer body to rotate, which is convenient for grinding the entire glass wafer body; A driving support shaft is fixedly connected below the rotating disc to support the rotating disc and drive the rotating disc to rotate, thus playing a supporting and transmission role.

[0011] In one or more embodiments of the present invention, a fixed conveying gas frame is rotatably connected between the rotating boss and the rotating disk for conveying gas. A tight kit is fixedly connected between the fixed conveying gas frame, the rotating boss and the rotating disk for improving the sealing performance, making it difficult for gas to leak, thereby making it difficult for the glass wafer body to be loosened, thereby improving the fixing effect of the glass wafer body. A plurality of fixed air pipes are fixedly connected to the fixed conveying gas frame for connecting the fixed conveying gas frame and the negative pressure air cavity, thereby facilitating the conveying and circulation of gas.

[0012] In one or more embodiments of the present invention, a negative pressure air cavity is further opened on the fixed bottom frame, and a plurality of the fixed air pipes are connected to the negative pressure air cavity to facilitate the flow and extraction of gas, so as to generate negative pressure between the rotating boss and the rotating disk, thereby facilitating the fixing of the glass wafer body, making it less likely for the glass wafer body to shake or tilt during grinding, thereby improving the stability of the glass wafer body; A negative pressure air pump is installed on the outer wall of the grinding box to provide power for vacuuming to form negative pressure, so that the glass wafer body is not easy to shake and fall off. A delivery air pipe is fixedly connected to the negative pressure air pump, and the other end of the delivery air pipe is inserted into the negative pressure air cavity to inhale and drive the circulation of gas.

[0013] In one or more embodiments of the present invention, a driving rotary motor is installed in the fixed bottom frame, and the driving rotary motor is fixedly connected to the lower end of the driving support shaft. By starting the driving rotary motor, the driving support shaft can drive the rotating disk to rotate, so that the glass wafer body can rotate stably, thereby providing conditions for the grinding of the glass wafer body. A connecting sleeve is provided on one end of the driving support shaft close to the driving rotary motor, so that the rotation of the driving support shaft is not easily affected, thereby being able to stably drive the glass wafer body to rotate.

[0014] In one or more embodiments of the present invention, a support and protection frame is fixed in the grinding box to protect and support the driving liquid pump, so that the driving liquid pump will not shake or tilt, thereby improving the stability of the driving liquid pump. The driving liquid pump is installed in the support and protection frame to provide power for extracting the grinding liquid, so that the grinding liquid can be extracted from the storage chamber; The driving liquid pump is fixedly connected with a liquid extraction pipe and a spraying pipe, both of which are used to transport the grinding liquid. The other end of the liquid extraction pipe is inserted into the storage cavity, so that the grinding liquid can be extracted from the storage cavity and then sprayed outward through the spraying pipe. Moreover, when the grinding motor is driven to drive the grinding disk to grind the glass wafer body, the grinding liquid sprayed from the spray pipe can impact the grinding shielding table, so that the grinding liquid can be guided to impact the glass wafer body, thereby achieving the effect of rinsing the surface of the glass wafer body, and then washing away the ground glass particles, which will not affect the subsequent grinding. When the grinding motor is driven to drive the grinding disk to rise, the grinding liquid sprayed from the spray pipe can impact the bottom of the grinding disk, thereby achieving the effect of rinsing the grinding disk and preventing glass particles from sticking to the bottom of the grinding disk.

[0015] In one or more embodiments of the present invention, a guide ring tube is fixed below the rotating boss on the rotating boss, a shielding ring tube is arranged on the inner side of the guide ring tube, and the shielding ring tube is fixed on the fixed bottom frame. The shielding ring tube and the guide ring tube can prevent the grinding fluid from contacting the driving support shaft, so that the rotation of the driving support shaft will not be affected, thereby avoiding leakage of the grinding fluid.

[0016] A method for using a glass wafer processing device comprises the following steps: S1. The staff places the glass wafer body on the rotating boss, and then starts the negative pressure air pump to suck air through the negative pressure air pump, so that negative pressure is generated in the rotating boss, and then the glass wafer body can be tightly adsorbed on the rotating boss to achieve the effect of fixing the glass wafer body; S2, then start the driving rotation motor, drive the driving support shaft to rotate by driving the rotation motor, and then drive the rotating disc to rotate by driving the support shaft, and then drive the rotating boss to rotate by multiple linkage rods, so as to achieve the function of driving the glass wafer body to rotate, and then drive the grinding motor to drive the grinding disc to rotate, so as to achieve the grinding of the glass wafer body by the grinding disc; S3, while the driving grinding motor drives the grinding disc to fit on the glass wafer body, it also drives the supporting column, arc support plate and grinding shielding platform to move downward, at this time, the driving liquid pump is started to extract the grinding liquid in the storage chamber through the liquid extraction pipe, and then spray it out through the spray pipe; S4. The lowered grinding shielding platform can block the grinding liquid sprayed from the spray pipe, and the blocked grinding liquid will flow downward and then wash on the main body of the glass wafer, so that the main body of the glass wafer just ground by the grinding disk can be washed, and the ground glass particles can be washed away to avoid affecting the subsequent grinding; S5. After the grinding disc is ground, the grinding motor is driven to rise by the lifting support assembly, thereby driving the grinding shielding platform to rise. At this time, the grinding liquid sprayed from the spray pipe can impact the grinding disc, thereby achieving the effect of washing the grinding disc, so that the particle impurities on the surface of the grinding disc can be washed away, avoiding affecting the grinding of the main body of the glass wafer; S6. The rinsed grinding liquid flows onto the permeable filter membrane, and is filtered by the permeable filter membrane, so that the grinding liquid can flow down into the storage chamber to achieve the recycling of resources. The rotation of the rotating boss can drive the driving arc rod and the anti-clogging scraper to rotate, thereby achieving the effect of scraping away particulate impurities, avoiding blockage on the permeable filter membrane, and improving the filtration efficiency of the grinding liquid.

[0017] Compared with the prior art, the present invention, through the setting of corresponding mechanisms, can promptly wash away the particles generated during the grinding of the glass wafer, and is not easily mixed into the grinding liquid, thereby not easily affecting the flatness and precision of the glass wafer, reducing the probability of defective products and reducing losses for users. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 is a cross-sectional view of a glass wafer processing device according to an embodiment of the present invention; Figure 2 for Figure 1 The schematic diagram of the structure shown at A in the middle; Figure 3 for Figure 1 The schematic diagram of the structure shown at B in the figure; Figure 4 for Figure 1 The schematic diagram of the structure shown at C in the middle; Figure 5 for Figure 1 The schematic diagram of the structure shown at D in the figure; Figure 6 A three-dimensional diagram of a glass wafer processing device according to an embodiment of the present invention; Figure 7 for Figure 6 The schematic diagram of the structure shown at E in the middle; Figure 8 Schematic diagram of the structure of a grinding shielding platform in one embodiment of the present invention.

[0020] Description of main reference numerals: 1-grinding box, 101-lifting support assembly, 102-driving cylinder, 103-piston push rod, 104-swing arm, 105-support arm, 2-grinding mechanism, 201-driving grinding motor, 202-fixed transmission shaft, 203-grinding disc, 204-fixed connecting column, 205-support column rod, 206-arc support plate, 207-grinding shielding platform, 3-support mechanism, 301-rotating boss, 302-glass wafer body, 303-adsorption hole, 304-driving arc rod, 305-anti-clogging scraper, 306-rotating Disc, 307-linkage rod, 308-driving support shaft, 309-fixed conveying air frame, 310-tightening kit, 311-fixed air pipe, 312-negative pressure air pump, 313-conveying air pipe, 4-storage fixed component, 401-fixed bottom frame, 402-storage chamber, 403-lower leakage hole, 404-permeable filter membrane, 405-driving rotary motor, 406-negative pressure air cavity, 407-support protection frame, 408-driving liquid pump, 409-liquid extraction pipe, 410-spraying pipe, 411-shielding ring pipe, 412-guide ring pipe. DETAILED DESCRIPTION

[0021] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0022] like Figure 1-Figure 8 As shown, a glass wafer processing device in one embodiment of the present invention includes: a grinding box 1, a grinding mechanism 2, a supporting mechanism 3 and a storage and fixing component 4.

[0023] like Figure 1-Figure 6 As shown, a lifting support assembly 101 is installed on one side of the grinding box 1. The lifting support assembly 101 includes a driving cylinder 102, which is used to control the lifting and lowering movement of a piston push rod 103, thereby providing power for lifting the grinding disc 203 and driving the grinding disc 203 to descend. A piston push rod 103 is installed on the driving cylinder 102, a swing arm 104 is installed on one end of the piston push rod 103, and a support arm 105 is installed on the swing arm 104. The driving grinding motor 201 is installed on the support arm 105, which is used to drive the driving grinding motor 201 to move up and down, and facilitate its position adjustment, thereby facilitating the installation of the grinding disc 203.

[0024] like Figure 1-Figure 3As shown, the grinding mechanism 2 is installed on the lifting support assembly 101, and the grinding mechanism 2 includes a driving grinding motor 201, which is used to support the grinding disc 203 and drive the grinding disc 203 to rotate, and provide power for grinding the glass wafer body 302. The driving grinding motor 201 is installed with a fixed transmission shaft 202, and the fixed transmission shaft 202 is rotatably connected with the grinding disc 203, which is used to grind the glass wafer body 302.

[0025] like Figure 1-Figure 3 As shown, a fixed connecting column 204 is fixed on the grinding disc 203, and the fixed transmission shaft 202 is threadedly connected to the fixed connecting column 204. The tightening direction of the threads of the fixed connecting column 204 and the fixed transmission shaft 202 is opposite to the direction of rotation of the driving grinding motor 201, so that the grinding disc 203 becomes tighter and tighter during the grinding process, thereby preventing the grinding disc 203 from loosening.

[0026] like Figure 1-Figure 7 As shown, an arc support plate 206 is provided on one side of the driving grinding motor 201, which is used to support the grinding shielding platform 207 and drive the grinding shielding platform 207 to move up and down. A plurality of support columns 205 are fixedly connected between the arc support plate 206 and the driving grinding motor 201, which are used to link the arc support plate 206 and the driving grinding motor 201, so that the arc support plate 206 can move with the driving grinding motor 201, thereby facilitating the adjustment of the position of the grinding shielding platform 207.

[0027] like Figure 7-Figure 8 As shown, a grinding shielding platform 207 is fixed below the arc support plate 206 to shield the grinding liquid sprayed from the spray pipe 410, so that the grinding liquid can flow downward to achieve the effect of flushing the glass wafer body 302, so that the glass particles ground by the grinding disk 203 can leave the upper end surface of the glass wafer body 302, thereby avoiding affecting the subsequent grinding, and also improving the use effect of the grinding liquid.

[0028] like Figure 1-Figure 5 As shown, the support mechanism 3 is disposed below the grinding disc 203, and the support mechanism 3 includes a rotating boss 301, which is used to support and fix the glass wafer body 302, so that the glass wafer body 302 will not shake or fall off during grinding. The glass wafer body 302 is disposed on the rotating boss 301, and a plurality of evenly distributed adsorption holes 303 are drilled on the rotating boss 301, which are used to tightly adsorb the glass wafer body 302, so that the glass wafer body 302 will not fall off.

[0029] like Figure 1-Figure 4As shown, a driving arc rod 304 is fixed on one side of the rotating boss 301 for supporting the anti-clogging scraper 305 and driving the anti-clogging scraper 305 to rotate, so that the anti-clogging scraper 305 can be driven to rotate when the rotating boss 301 rotates, and the other end of the driving arc rod 304 is fixedly connected with the anti-clogging scraper 305 for scraping the osmotic filter membrane 404 to avoid clogging of the osmotic filter membrane 404, thereby not affecting the downward flow of the grinding liquid.

[0030] like Figure 1-Figure 5 As shown, a rotating disc 306 is provided inside the rotating boss 301, which is used to drive the rotating boss 301 to rotate and play the role of rotating support. A plurality of linkage rods 307 are fixedly connected between the rotating disc 306 and the rotating boss 301, which are used to link the rotating disc 306 and the rotating boss 301, so that the rotating disc 306 can drive the rotating boss 301 to rotate, thereby realizing the role of driving the glass wafer body 302 to rotate, and facilitating the grinding of the glass wafer body 302 as a whole.

[0031] Specifically, a driving support shaft 308 is fixedly connected below the rotating disc 306 to support the rotating disc 306 and drive the rotating disc 306 to rotate, thereby playing a supporting and transmission role.

[0032] like Figure 1-Figure 5 As shown, a fixed gas delivery frame 309 is rotatably connected between the rotating boss 301 and the rotating disc 306 for gas delivery. A tight set 310 is fixedly connected between the fixed gas delivery frame 309 and the rotating boss 301 and the rotating disc 306 to improve the sealing performance, so that the gas is not easy to leak, and then the fixation of the glass wafer body 302 is not easy to loosen, thereby improving the fixing effect of the glass wafer body 302. A plurality of fixed air pipes 311 are fixedly connected to the fixed gas delivery frame 309 to connect the fixed gas delivery frame 309 and the negative pressure air cavity 406, thereby facilitating the delivery and circulation of gas.

[0033] Specifically, a negative pressure air pump 312 is installed on the outer wall of the grinding box 1, which is used to provide power for exhausting air to form negative pressure, so that the glass wafer body 302 is not easy to shake and fall off. A delivery air pipe 313 is fixedly connected to the negative pressure air pump 312, and the other end of the delivery air pipe 313 is inserted into the negative pressure air cavity 406 for suction to drive the circulation of gas.

[0034] like Figure 1-Figure 4As shown, the storage fixing assembly 4 is installed below the rotating boss 301. The storage fixing assembly 4 includes a fixed bottom frame 401, which is used to provide power for the supporting part assembly. A storage cavity 402 is drilled in the fixed bottom frame 401 to store the grinding liquid conveniently. A plurality of evenly distributed lower leakage holes 403 are drilled on the side wall of the storage cavity 402 to allow the grinding liquid to flow downward, so that the grinding liquid can be recycled. A permeable filter membrane 404 is installed on the fixed bottom frame 401 to filter out glass debris and impurity particles, so that the grinding liquid can be recycled to avoid wasting resources.

[0035] Specifically, a negative pressure air cavity 406 is also opened on the fixed bottom frame 401, and multiple fixed air pipes 311 are connected to the negative pressure air cavity 406 to facilitate the flow and extraction of gas, thereby generating negative pressure between the rotating boss 301 and the rotating disk 306, thereby facilitating the fixation of the glass wafer body 302, making it less likely for the glass wafer body 302 to shake or tilt during grinding, thereby improving the stability of the glass wafer body 302.

[0036] like Figure 1 As shown, a driving rotation motor 405 is installed in the fixed bottom frame 401, and the driving rotation motor 405 is fixedly connected to the lower end of the driving support shaft 308. By starting the driving rotation motor 405, the driving support shaft 308 can drive the rotating disk 306 to rotate, so that the glass wafer body 302 can rotate stably, thereby providing conditions for the grinding of the glass wafer body 302. A connecting sleeve is sleeved on one end of the driving support shaft 308 close to the driving rotation motor 405, so that the rotation of the driving support shaft 308 is not easily affected, thereby being able to stably drive the glass wafer body 302 to rotate.

[0037] like Figure 1 As shown, a support and protection frame 407 is fixed in the grinding box 1 to protect and support the driving liquid pump 408, so that the driving liquid pump 408 will not shake or tilt, thereby improving the stability of the driving liquid pump 408. The driving liquid pump 408 is installed in the support and protection frame 407 to provide power for extracting the grinding liquid so that the grinding liquid can be extracted from the storage chamber 402.

[0038] like Figure 1-Figure 4 As shown, the driving liquid pump 408 is fixedly connected with a liquid extraction pipe 409 and a spraying pipe 410, both of which are used to transport the grinding liquid. The other end of the liquid extraction pipe 409 is inserted into the storage chamber 402, so that the grinding liquid can be extracted from the storage chamber 402 and then sprayed outward through the spraying pipe 410.

[0039] Specifically, when the grinding motor 201 is driven to drive the grinding disk 203 to grind the glass wafer body 302, the grinding liquid sprayed from the spray tube 410 can impact the grinding shielding table 207, so that the grinding liquid can be guided to impact the glass wafer body 302, thereby achieving the effect of rinsing the surface of the glass wafer body 302, and then washing away the ground glass particles without affecting the subsequent grinding. When the grinding motor 201 is driven to drive the grinding disk 203 to rise, the grinding liquid sprayed from the spray tube 410 can impact the bottom of the grinding disk 203, thereby achieving the effect of rinsing the grinding disk 203, and preventing glass particles from sticking to the bottom of the grinding disk 203.

[0040] In addition, a guide ring tube 412 is fixed below the rotating boss 301 on the rotating boss 301, and a shielding ring tube 411 is arranged on the inner side of the guide ring tube 412. The shielding ring tube 411 is fixed on the fixed bottom frame 401. The shielding ring tube 411 and the guide ring tube 412 can prevent the grinding liquid from contacting the driving support shaft 308, so that the rotation of the driving support shaft 308 will not be affected, thereby avoiding leakage of the grinding liquid.

[0041] A method for using a glass wafer processing device comprises the following steps: S1. The staff places the glass wafer body 302 on the rotating boss 301, and then starts the negative pressure air pump 312. The negative pressure air pump 312 sucks air, so that negative pressure is generated in the rotating boss 301, and then the glass wafer body 302 can be tightly adsorbed on the rotating boss 301, so as to achieve the effect of fixing the glass wafer body 302; S2, then start the driving rotation motor 405, drive the driving support shaft 308 to rotate by driving the rotation motor 405, and then drive the rotating disk 306 to rotate by driving the support shaft 308, and then drive the rotating boss 301 to rotate through multiple linkage rods 307, so as to achieve the function of driving the glass wafer body 302 to rotate, and then drive the grinding motor 201 to drive the grinding disk 203 to rotate, so as to achieve the grinding of the glass wafer body 302 by the grinding disk 203; S3, while driving the grinding motor 201 to drive the grinding disc 203 to fit the glass wafer body 302, it also drives the support column 205, the arc support plate 206 and the grinding shielding platform 207 to move downward, and at this time, the driving liquid pump 408 is started to extract the grinding liquid in the storage chamber 402 through the liquid extraction pipe 409, and then spray it out through the spray pipe 410; S4, the lowered grinding shielding platform 207 can block the grinding liquid sprayed from the spraying pipe 410, and the blocked grinding liquid will flow downward and then wash on the glass wafer body 302, so that the glass wafer body 302 just ground by the grinding disc 203 can be washed, and the ground glass particles can be washed away to avoid affecting the subsequent grinding; S5. After the grinding disc 203 is ground, the grinding motor 201 is driven to rise by the lifting support assembly 101, thereby driving the grinding shielding platform 207 to rise. At this time, the grinding liquid sprayed from the spray pipe 410 can impact the grinding disc 203, thereby achieving the effect of washing the grinding disc 203, so that the particle impurities on the surface of the grinding disc 203 can be washed away, avoiding affecting the grinding of the glass wafer body 302; S6. The rinsed grinding liquid flows onto the permeable filter membrane 404, and is filtered by the permeable filter membrane 404, so that the grinding liquid can flow down into the storage chamber 402, thereby realizing the recycling of resources. The rotation of the rotating boss 301 can drive the driving arc rod 304 and the anti-clogging scraper 305 to rotate, thereby achieving the effect of scraping away particulate impurities, avoiding blockage on the permeable filter membrane 404, and improving the filtering efficiency of the grinding liquid.

[0042] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0043] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A glass wafer processing device, characterized in that: include: A grinding box, a lifting support assembly being installed on one side of the grinding box; A grinding mechanism is installed on the lifting support assembly, the grinding mechanism includes a driving grinding motor, a fixed transmission shaft is installed on the driving grinding motor, a grinding disc is rotatably connected to the fixed transmission shaft, a fixed connecting column is fixed on the grinding disc, and the fixed transmission shaft is threadedly connected to the fixed connecting column; A support mechanism is arranged below the grinding disc, the support mechanism comprises a rotating boss, a glass wafer body is arranged on the rotating boss, a plurality of evenly distributed adsorption holes are drilled on the rotating boss, a driving arc rod is fixed on one side of the rotating boss, and an anti-clogging scraper is fixedly connected to the other end of the driving arc rod; The storage fixing assembly is installed below the rotating boss, and the storage fixing assembly comprises a fixed bottom frame, a storage cavity is bored inside the fixed bottom frame, a plurality of evenly distributed lower leakage holes are bored on the side wall of the storage cavity, and a permeation filter membrane is installed on the fixed bottom frame.

2. A glass wafer processing device according to claim 1, characterized in that: The lifting support assembly includes a driving cylinder, a piston push rod is installed on the driving cylinder, a swing arm is installed on one end of the piston push rod, a support arm is installed on the swing arm, and the driving grinding motor is installed on the support arm.

3. The glass wafer processing device according to claim 1, characterized in that: An arc support plate is arranged on one side of the driving grinding motor, a plurality of support columns are fixedly connected between the arc support plate and the driving grinding motor, and a grinding shielding platform is fixed below the arc support plate.

4. The glass wafer processing device according to claim 1, characterized in that: A rotating disc is arranged inside the rotating boss, a plurality of linkage rods are fixedly connected between the rotating disc and the rotating boss, and a driving support shaft is fixedly connected below the rotating disc.

5. The glass wafer processing device according to claim 4, characterized in that: A fixed air delivery frame is rotatably connected between the rotating boss and the rotating disc, a tight set is fixedly connected between the fixed air delivery frame, the rotating boss and the rotating disc, and a plurality of fixed air pipes are fixedly connected to the fixed air delivery frame.

6. The glass wafer processing device according to claim 5, characterized in that: A negative pressure air cavity is also excavated on the fixed bottom frame, and the multiple fixed air pipes are connected to the negative pressure air cavity. A negative pressure air pump is installed on the outer wall of the grinding box, and a delivery air pipe is fixedly connected to the negative pressure air pump. The other end of the delivery air pipe is inserted into the negative pressure air cavity.

7. The glass wafer processing device according to claim 4, characterized in that: A driving rotary motor is installed in the fixed bottom frame. The driving rotary motor is fixedly connected to the lower end of the driving support shaft. A connecting sleeve is sleeved on one end of the driving support shaft close to the driving rotary motor.

8. The glass wafer processing device according to claim 1, characterized in that: A supporting and protecting frame is fixed in the grinding box, a driving liquid pump is installed in the supporting and protecting frame, a liquid extraction pipe and a spraying pipe are fixedly connected to the driving liquid pump, and the other end of the liquid extraction pipe is inserted into the storage cavity.

9. The glass wafer processing device according to claim 1, characterized in that: A guide ring tube is fixed below the rotating boss on the rotating boss, a shielding ring tube is arranged inside the guide ring tube, and the shielding ring tube is fixed on the fixed bottom frame.

10. A method for using a glass wafer processing device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1. The staff places the glass wafer body on the rotating boss, and then starts the negative pressure air pump to suck air through the negative pressure air pump, so that negative pressure is generated in the rotating boss, and then the glass wafer body can be tightly adsorbed on the rotating boss to achieve the effect of fixing the glass wafer body; S2, then start the driving rotation motor, drive the driving support shaft to rotate by driving the rotation motor, and then drive the rotating disc to rotate by driving the support shaft, and then drive the rotating boss to rotate by multiple linkage rods, so as to achieve the function of driving the glass wafer body to rotate, and then drive the grinding motor to drive the grinding disc to rotate, so as to achieve the grinding of the glass wafer body by the grinding disc; S3, while the driving grinding motor drives the grinding disc to fit on the glass wafer body, it also drives the supporting column, arc support plate and grinding shielding platform to move downward, at this time, the driving liquid pump is started to extract the grinding liquid in the storage chamber through the liquid extraction pipe, and then spray it out through the spray pipe; S4. The lowered grinding shielding platform can block the grinding liquid sprayed from the spray pipe, and the blocked grinding liquid will flow downward and then wash on the main body of the glass wafer, so that the main body of the glass wafer just ground by the grinding disk can be washed, and the ground glass particles can be washed away to avoid affecting the subsequent grinding; S5. After the grinding disc is ground, the grinding motor is driven to rise by the lifting support assembly, thereby driving the grinding shielding platform to rise. At this time, the grinding liquid sprayed from the spray pipe can impact the grinding disc, thereby achieving the effect of washing the grinding disc, so that the particle impurities on the surface of the grinding disc can be washed away, avoiding affecting the grinding of the main body of the glass wafer; S6. The rinsed grinding liquid flows onto the permeable filter membrane, and is filtered by the permeable filter membrane, so that the grinding liquid can flow down into the storage chamber to achieve the recycling of resources. The rotation of the rotating boss can drive the driving arc rod and the anti-clogging scraper to rotate, thereby achieving the effect of scraping away particulate impurities, avoiding blockage on the permeable filter membrane, and improving the filtration efficiency of the grinding liquid.

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