Semi-automatic double-blade scribing machine for 8-inch semiconductor wafer

Abstract

The invention discloses a semi-automatic double-blade dicing saw for an 8-inch semiconductor wafer. The semi-automatic double-blade dicing saw comprises an equipment shell, a gantry bracket assembly, an X-axis motion control device, a vacuum workbench, a blade height measuring device, a multifunctional cutter head bracket, a dicing blade control device, a visual positioning device, a Y-axis motion control device and a Z-axis motion control device. According to the technical scheme, the semi-automatic double-blade scribing machine for the 8-inch semiconductor wafer is manufactured, through the double-blade main shaft layout of the gantry structure, compared with other single-main-shaft or double-main-shaft layout design, the scribing efficiency is effectively improved, the scribing algorithm of software is matched, and the scribing efficiency is improved. And various cutting modes such as single-blade cutting, double-blade cutting and double-blade stepped cutting can be realized. In particular, in the aspect of coordinated control of multi-blade cutting, an intelligent control algorithm is adopted, the operation process is greatly simplified, the equipment state is monitored in real time through a fault diagnosis system, and highly intelligent operation experience is provided.

Description

Technical Field

[0001] The invention relates to the field of dicing machines, and in particular to an 8-inch semiconductor wafer semi-automatic double-blade dicing machine. Background Art

[0002] Semiconductor wafer dicing machine is a device used to cut and separate semiconductor wafers into small-sized chips, and plays a key role in the semiconductor manufacturing process. Semiconductor wafer dicing machine uses a high-speed rotating diamond dicing blade to separate the chips on the wafer by rotating and cutting the cutting path on the wafer, thereby cutting the large-sized wafer into many small-sized chips. The chips after cutting and separation can be used to manufacture various electronic products, such as mobile phones, computer memory, car processors, etc. Semiconductor wafer dicing machine is widely used in the semiconductor industry and is one of the indispensable equipment in semiconductor manufacturing.

[0003] The existing semiconductor wafer dicing machines on the market still have various shortcomings, such as: low dicing accuracy, uncontrollable dicing quality, high defective rate, low production efficiency, insufficient adaptability to wafers of different sizes and materials, etc. These problems more or less limit the production capacity and output of semiconductor packaging plants. For this reason, we propose an 8-inch semiconductor wafer semi-automatic double-blade dicing machine. Summary of the invention

[0004] In order to solve the above problems, the present invention provides an 8-inch semiconductor wafer semi-automatic double-blade dicing machine.

[0005] The present invention discloses an 8-inch semiconductor wafer semi-automatic double-blade dicing machine, comprising an equipment housing, a gantry support assembly, an X-axis motion control device, a vacuum workbench, a blade height measuring device, a blade head multifunctional support, a dicing knife control device, a visual positioning device, a Y-axis motion control device and a Z-axis motion control device. The equipment housing is provided with a gantry support assembly, the gantry support assembly is provided with an X-axis motion control device, the X-axis motion control device is provided with a vacuum workbench, the gantry support assembly is also provided with a blade height measuring device and a blade head multifunctional support, the blade head multifunctional support is provided with a dicing knife control device and a visual positioning device, two groups of Y-axis motion control devices are provided on the upper part of the gantry support assembly, each group of the Y-axis motion control devices is provided with a Z-axis motion control device, the two groups of the Y-axis motion control devices move in opposite directions, the dicing knife control device is provided below the Z-axis motion control device, and the visual positioning device is provided in front of the Z-axis motion control device.

[0006] In the above scheme, the visual positioning device includes a main body mounting bracket, a lens fixing bracket, a column, a camera, a lens, a connecting fixing bracket and an annular light source. The main body mounting bracket is provided with a lens fixing bracket, the lens fixing bracket is provided with a column, the column is provided with a camera and a lens, the column is connected to the connecting fixing bracket, the connecting fixing bracket is connected to the annular light source, and the column and the lens constitute a lens system.

[0007] In the above scheme, an electrical control box is provided in the upper part of the equipment casing, and a valve island, an industrial computer and a UPS are provided in the lower part of the equipment casing.

[0008] In the above scheme, an observation door and a workpiece placement door are provided on the front of the equipment housing.

[0009] In the above scheme, the workpiece placing and retrieval door includes a workpiece placing and retrieval protection door and a workpiece placing and retrieval protection door lock, the workpiece placing and retrieval protection door and the workpiece placing and retrieval protection door lock are connected, the workpiece placing and retrieval protection door lock includes a door lock base, a door lock cylinder, a door lock core and a sensor, the door lock base is connected to the door lock cylinder, the door lock cylinder is connected to the door lock core, a sensor is provided under the door lock base, and a workpiece placing and retrieval protection door lock buckle is provided on the workpiece placing and retrieval protection door.

[0010] In the above solution, a display touch screen, a control button panel, and a liquid flow meter panel are provided on the front of the device housing.

[0011] In the above solution, an alarm light is provided on the device housing.

[0012] In the above solution, a rear observation window and a pressure surface panel are provided on the back of the device housing.

[0013] In the above scheme, an exhaust and drainage interface and an air and water inlet main valve connector are provided on the back of the equipment housing.

[0014] In the above solution, the vacuum workbench is a ceramic vacuum workbench.

[0015] The advantages and beneficial effects of the present invention are as follows: the present invention provides an 8-inch semiconductor wafer semi-automatic double-blade dicing machine. The present invention effectively improves the dicing efficiency through the double-blade spindle layout of the gantry structure, compared with other single-spindle or double-spindle layout designs. With the dicing algorithm of the software, multiple cutting methods such as single-blade, double-blade, and double-blade step-cutting can be realized. An independent visual positioning device is adopted on the dicing blade of the present invention. While realizing high-precision dicing, the double blades can realize independent dicing quality monitoring, further improving the dicing efficiency. The multifunctional support of the blade head of the present invention can simultaneously realize real-time monitoring and dynamic adjustment of blade wear during dicing, as well as cooling control of the blade and wafer, ensuring the stability and reliability of dicing quality. The dicing knife control device of the present invention can achieve a dicing speed of 6000-60000 rpm, and the power is 1.8KW, which can cope with various complex semiconductor wafer materials. The display touch screen of the present invention makes the operation of the equipment more convenient through the optimized human-computer interaction interface and semi-automatic operation process, reducing the technical requirements for operators. Especially in the coordinated control of multi-blade cutting, an intelligent control algorithm is adopted to greatly simplify the operation process, and the equipment status is monitored in real time through the fault diagnosis system, providing a highly intelligent operation experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the back structure of the present invention; Figure 3 It is a schematic diagram of the internal structure of the present invention; Figure 4 It is a structural schematic diagram of a visual positioning device; Figure 5 It is a structural schematic diagram of the workpiece placing and taking door; Figure 6 for Figure 5 Enlarged schematic diagram of the lock of the workpiece protection door; Figure 7 This is a schematic diagram of the structure of the door lock for placing and removing workpieces; Figure 8 for Figure 7 AA enlarged schematic diagram.

[0018] In the figure: 1. Equipment housing 2. Gantry bracket assembly 3. X-axis motion control device 4. Vacuum workbench 5. Blade height measuring device 6. Multifunctional bracket for cutter head 7. Slicing knife control device 8. Visual positioning device 9. Y-axis motion control device 10. Z-axis motion control device 11. Electrical control box 12. Valve island, industrial computer and UPS 13. Observation door 14. Workpiece loading and unloading door 15. Display touch screen 16. Control button panel 17. Liquid flow meter panel 18. Warning light 19. Rear observation window 20. Pressure surface panel 21. Ventilation and drainage interface 22. Air and water inlet main valve connector 81. Main body mounting bracket 82. Lens fixing bracket 83. Column 84. Camera 85. Lens 86. Connecting fixing bracket 87. Ring light source 141. Access workpiece protection door 142. Access workpiece protection door lock 143. Door lock base 144. Door lock cylinder 145. Door lock core 146. Sensor 147. Access workpiece protection door lock buckle DETAILED DESCRIPTION

[0019] The specific implementation of the present invention is further described below in conjunction with the accompanying drawings and embodiments. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and cannot be used to limit the protection scope of the present invention.

[0020] like Figure 1 , Figure 2 , Figure 3 As shown, the present invention is an 8-inch semiconductor wafer semi-automatic double-blade dicing machine, comprising an equipment housing 1, a gantry support assembly 2, an X-axis motion control device 3, a vacuum workbench 4, a blade height measuring device 5, a cutter head multifunctional support 6, a dicing knife control device 7, a visual positioning device 8, a Y-axis motion control device 9 and a Z-axis motion control device 10. The equipment housing 1 is provided with a gantry support assembly 2, the gantry support assembly 2 is provided with an X-axis motion control device 3, the X-axis motion control device 3 is provided with a vacuum workbench 4, the gantry support assembly 2 is also provided with a blade height measuring device 5 and a cutter head multifunctional support 6, the cutter head multifunctional support 6 is provided with a dicing knife control device 7 and a visual positioning device 8, two groups of Y-axis motion control devices 9 are provided on the upper part of the gantry support assembly 2, each group of Y-axis motion control devices 9 is provided with a Z-axis motion control device 10, the two groups of Y-axis motion control devices 9 move in opposite directions, the dicing knife control device 7 is arranged below the Z-axis motion control device 10, and the visual positioning device 8 is arranged in front of the Z-axis motion control device 10. The inner side of the equipment housing 1 is connected to the gantry support assembly 2 at multiple locations to fix the equipment housing 1. Universal wheels and shock-absorbing foot pads are provided at the lower end of the gantry support assembly 2. The vacuum workbench 4 is a ceramic vacuum workbench (θ axis).

[0021] like Figure 4As shown, the visual positioning device 8 includes a main mounting bracket 81, a lens fixing bracket 82, a column 83, a camera 84, a lens 85, a connecting fixing bracket 86 and a ring-shaped light source 87. The main mounting bracket 81 is provided with a lens fixing bracket 82, the lens fixing bracket 82 is provided with a column 83, the column 83 is provided with a camera 84 and a lens 85, the column 83 is connected to the connecting fixing bracket 86, the connecting fixing bracket 86 is connected to the ring-shaped light source 87, and the column 83 and the lens 85 constitute a lens system.

[0022] An electrical control box 11 is provided in the upper part of the equipment casing 1, and a valve island, an industrial computer and a UPS 12 are provided in the lower part of the equipment casing 1. The electrical control box 11 connects the valve island, the industrial computer and the UPS 12 and the motors of each motion control device through control cables to realize motion control.

[0023] The front side of the device housing 1 is provided with an observation door 13 and a workpiece access door 14. The right end of the observation door 13 is movably connected to the inner surface of the device housing 1, so that the observation door 13 can be opened. The front end of the workpiece access door 14 is movably connected to the inner surface of the device housing 1, so that the workpiece access door 14 can be opened.

[0024] like Figure 5-Figure 8 As shown, the workpiece placing and retrieval door 14 includes a workpiece placing and retrieval protection door 141 and a workpiece placing and retrieval protection door lock 142, the workpiece placing and retrieval protection door 141 and the workpiece placing and retrieval protection door lock 142 are connected, the workpiece placing and retrieval protection door lock 142 includes a door lock base 143, a door lock cylinder 144, a door lock core 145 and a sensor 146, the door lock base 143 is connected to the door lock cylinder 144, the door lock cylinder 144 is connected to the door lock core 145, a sensor 146 is provided under the door lock base 143, and a workpiece placing and retrieval protection door lock buckle 147 is provided on the workpiece placing and retrieval protection door 141.

[0025] The front of the device housing 1 is provided with a display touch screen 15, a control button panel 16, and a liquid flow meter panel 17. The left end of the display touch screen 15 is movably connected to the inner surface of the device housing 1, so that the display touch screen 15 can be turned on, and the functional operation interface of the dicing machine system can be displayed on the display touch screen 15, and touch operation is supported. The control button panel 16 is fixedly installed on the inner surface of the device housing 1, including a power on / off button, an emergency stop button, a maintenance mode button, an internal lighting button, and a USB interface. The liquid flow meter panel 17 is fixedly installed on the inner surface of the device housing 1, and displays the real-time flow of various liquids in the device.

[0026] The device housing 1 is provided with an alarm light 18. The lower outer surface of the alarm light 18 is fixedly connected to the upper outer surface of the device housing 1, and displays different combinations of lights and alarm horns according to the operating status of the device to remind the device operator / manager.

[0027] A rear observation window 19 and a pressure surface panel 20 are provided on the back of the device housing 1. Both sides of the rear observation window 19 are movably connected to the outer surface of the device housing 1 (quick release screws), so that the rear observation window 19 can be opened. The pressure surface panel 20 is fixedly installed to the inner surface of the device housing 1.

[0028] The back of the device housing 1 is provided with an exhaust and drainage interface 21 and an air and water inlet main valve joint 22. The exhaust and drainage joint 21 is fixedly installed on the inner surface of the device housing 1. The air and water inlet main valve joint 22 is fixedly installed on the inner surface of the device housing 1.

[0029] The present invention is an 8-inch semiconductor wafer semi-automatic double-blade dicing machine, which can slice 8-inch semiconductor wafers (hereinafter referred to as workpieces). The working platform for placing the workpieces is composed of an X-axis motion control device 3 and a ceramic vacuum worktable 4 (θ axis). The X-axis motion control device 3 can move in the X-axis direction through a motor, a lead screw and a guide rail. The effective X-axis stroke is 450 mm, the speed is in the range of 0.1 mm / s to 600 mm / s, and the repeat positioning accuracy is ≤0.001 mm.

[0030] A ceramic vacuum worktable 4 (θ axis) is installed on the X-axis motion control device 3 to realize the movement of the vacuum worktable 4 in the X direction. The ceramic vacuum worktable 4 (θ axis) is provided with a ceramic vacuum suction cup and is directly connected to the DD motor to realize high-precision control of the angle of the worktable. The maximum working range of the worktable is 380° (starting from the initial position, 320° clockwise and 60° counterclockwise), and the rotation angle resolution can be accurate to 0.494" (angle).

[0031] Two sets of Y-axis motion control devices 9 are installed on the gantry bracket assembly 2. The two sets of Y-axis motion control devices 9 share a set of fully closed-loop grating scales. The Y-axis motion control devices 9 can make opposite movements in the Y-axis direction through motors, lead screws and guide rails. The effective stroke of the Y-axis is 280 mm, the speed is in the range of 0.1 mm / s to 100 mm / s, and the repeat positioning accuracy is ≤0.001 mm.

[0032] A Z-axis motion control device 10 is installed at the front end of the Y-axis motion control device 9. The Z-axis motion control device 10 drives the lead screw slide to move in the vertical direction of the Y-axis motion control device 9 through a motor, which can drive the dicing knife control device 7 and the visual positioning device 8 to make up and down linear motion. This motion control method can achieve high-precision up and down linear motion, which can control the knife head lowering height during dicing, and can also realize the smooth focusing function of the visual positioning device. The maximum stroke of the Z-axis is 20 mm, the motor movement resolution can reach 0.00005 mm, and the repeatability accuracy is 0.001 mm.

[0033] The front end of the dicing knife control device 7 is the dicing knife head, and the front end is also equipped with a dicing knife head multifunctional bracket 6. The main function of the dicing knife head multifunctional bracket 6 is to provide cooling water and cleaning water for the dicing knife head and the workpiece during dicing to ensure the dicing quality. It also has a jet function to dry the dicing knife head. The power of the dicing knife control device is 1.8KW, and the dicing knife speed is 6000-60000 rpm.

[0034] The visual positioning device 8 is equipped with a high-magnification lens camera and a low-magnification lens camera. The up and down positions of the camera are adjusted by the Z-axis slide to perform the focusing action, and the Y-axis slide moves the camera left and right and forward and backward, so that the camera and the tool head are positioned in coordination; the visual positioning device is divided into a high-magnification camera and a low-magnification camera, which can achieve high-speed and high-precision dicing target positioning.

[0035] The operator opens the workpiece access door 14, places the workpiece on the ceramic vacuum workbench 4, turns on the vacuum to adsorb the workpiece, and closes the workpiece access door 14; Slicing position positioning: The operator operates the software to control the movement of the workpiece in the X direction and theta direction through the ceramic vacuum workbench 4 and the X-axis motion control device 3, and controls the movement of the visual positioning device 8 in the Y direction through the Y-axis motion control device 9, so as to obtain a real-time image of the workpiece position (the focusing of the visual positioning device 9 is achieved by the movement of the Z-axis motion control device 10 in the Z direction) and realize the precise positioning of the slicing position.

[0036] Slicing: The software automatically controls the X-axis motion control device 3 and the Y-axis motion control device 9 to accurately position the tool head of the slicing knife control device 7 to the first predetermined slicing position, the slicing knife control device 7 controls the slicing knife to rotate at high speed, the tool head multifunctional bracket 6 starts to spray cooling water, the Z-axis motion control device 10 descends to the specified slicing height, and the X-axis motion control device 3 makes a uniform linear motion backward to start the first slicing; after the first slicing is completed, the Z-axis motion control device 10 rises to the specified standby height, and the software automatically controls the X-axis motion control device 3 and the Y-axis motion control device 9 to accurately position the tool head of the slicing knife control device 7 to the second predetermined slicing position, and repeats this process until the slicing is completed.

[0037] Precision control during dicing: During the dicing process, the dicing quality needs to be monitored at all times. The software will use the visual positioning device 8 to check the image of the dicing position according to preset conditions. When it is determined that the dicing quality has decreased, the blade height measuring device 5 will be used to detect the blade height to ensure the dicing quality.

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A semi-automatic double-blade dicing machine for 8-inch semiconductor wafers, characterized in that: It includes an equipment housing, a gantry support assembly, an X-axis motion control device, a vacuum workbench, a blade height measuring device, a tool head multifunctional support, a slicing knife control device, a visual positioning device, a Y-axis motion control device and a Z-axis motion control device. A gantry support assembly is arranged in the equipment housing, an X-axis motion control device is arranged on the gantry support assembly, a vacuum workbench is arranged on the X-axis motion control device, a blade height measuring device and a tool head multifunctional support are also arranged on the gantry support assembly, a slicing knife control device and a visual positioning device are arranged on the tool head multifunctional support, two groups of Y-axis motion control devices are arranged on the upper part of the gantry support assembly, each group of the Y-axis motion control devices is provided with a Z-axis motion control device, the two groups of Y-axis motion control devices move in opposite directions, the slicing knife control device is arranged below the Z-axis motion control device, and the visual positioning device is arranged in front of the Z-axis motion control device.

2. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: The visual positioning device includes a main body mounting bracket, a lens fixing bracket, a column, a camera, a lens, a connecting fixing bracket and an annular light source. The main body mounting bracket is provided with a lens fixing bracket, the lens fixing bracket is provided with a column, the column is provided with a camera and a lens, the column is connected to the connecting fixing bracket, the connecting fixing bracket is connected to the annular light source, and the column and the lens constitute a lens system.

3. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: An electrical control box is arranged at the upper part of the equipment shell, and a valve island, an industrial computer and a UPS are arranged at the lower part of the equipment shell.

4. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: An observation door and a workpiece placing and taking door are arranged on the front of the equipment housing.

5. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 4, characterized in that: The workpiece access door includes a workpiece access protection door and a workpiece access protection door lock. The workpiece access protection door and the workpiece access protection door lock are connected. The workpiece access protection door lock includes a door lock base, a door lock cylinder, a door lock core and a sensor. The door lock base is connected to the door lock cylinder. The door lock cylinder is connected to the door lock core. A sensor is provided under the door lock base. The workpiece access protection door is provided with a workpiece access protection door lock buckle.

6. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: The front of the device housing is provided with a display touch screen, a control button panel, and a liquid flow meter panel.

7. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: An alarm light is arranged on the device shell.

8. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: A rear observation window and a pressure surface panel are provided on the back of the equipment housing.

9. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: The back of the equipment shell is provided with an exhaust and drainage interface and an air and water inlet main valve connector.

10. The 8-inch semiconductor wafer semi-automatic double-blade dicing machine according to claim 1, characterized in that: The vacuum workbench is a ceramic vacuum workbench.

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