Chip batch microscopic examination device and method
By designing a chip batch microscope device, using lifting mechanism and microscope to achieve microscope from low to high magnitude, solving the problems of low efficiency, poor reliability and high cost in the existing technology, and achieving efficient and reliable batch microscope inspection reduces costs.
Patent Information
- Application Number
- CN202411447275.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-16
- Publication Date
- 2025-02-11
AI Technical Summary
The existing chip microscope inspection process is low efficiency, poor reliability and high cost. Especially when high-magnitude microscope inspection of large batch detectors, it is necessary to repeatedly clip the microscope inspection, resulting in scratches and damage to the device and increasing costs.
A chip batch microscopy device is designed, including a box-type box frame, main abutment and lifting mechanism. The height of the main abutment is adjusted by the lifting mechanism, and the entire box chip is batched from low-power to high-power using a pre-set microscope. Mirror inspection to avoid repeated clamping operations.
It improves the reliability and process efficiency of microscopic inspection, reduces labor and time costs, reduces the possibility of detector damage, and improves the chip yield.
Smart Images
Figure CN119413809A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of detection technology, and in particular, relates to a chip batch microscopic inspection device and method. Background Art
[0002] In the current chip microscopy process, batch microscopy under a low-magnification lens will cause many contaminations and detector defects to go unseen, resulting in poor microscopy reliability, which will reduce the subsequent integrated detector yield and increase the process cost. High-magnification microscopy of large quantities of detectors requires them to be clamped and inspected one by one and then put back, which has low work efficiency. In addition, the need to repeatedly clamp and return the detectors increases the chance of scratches and damage, which increases costs and reduces yields. Summary of the invention
[0003] The embodiments of the present application provide a chip batch microscopic inspection device and method, which are used to at least solve the problems of low chip microscopic inspection process efficiency, poor microscopic inspection reliability and high cost in the related art.
[0004] In a first aspect, an embodiment of the present application provides a chip batch microscopic inspection device, comprising:
[0005] Box frame;
[0006] A main base, arranged inside the box-type frame, for storing the device to be tested;
[0007] A lifting mechanism is disposed below the main body base, and is used to adjust the main body base to a preset height when a plurality of devices to be inspected are stored on the first surface of the main body base, so as to perform batch microscopic inspection on the plurality of devices to be inspected from a low-power microscope to a high-power microscope using a pre-set microscope;
[0008] The first surface is a surface of the main body base away from the lifting mechanism, and the setting position of the microscope matches the preset height, and the preset height is higher than the frame height of the box-type box frame.
[0009] In a second aspect, an embodiment of the present application provides a chip batch microscopic inspection method, the method is applied to the chip batch microscopic inspection device as described in any embodiment of the first aspect, the method comprising:
[0010] When a plurality of devices to be detected are stored on the first surface of the main body base, the main body base is adjusted to a preset height by a lifting mechanism;
[0011] Use pre-set microscopes from low to high magnification to perform batch microscopic inspection on a number of devices to be inspected;
[0012] The first surface is a surface of the main body base away from the lifting mechanism, and the setting position of the microscope matches the preset height, and the preset height is higher than the frame height of the box-type box frame.
[0013] The chip batch microscopy device and method of the embodiments of the present application are based on a box-type box frame and a main base inside it. The surface of the main base can store a number of devices to be inspected, and its height can be adjusted by a lifting mechanism under the main base. Therefore, a microscope from low-power to high-power can be used to perform batch microscopy on the entire box of chips, avoiding the situation of repeatedly clamping and releasing devices, improving the reliability of microscopy, greatly improving process efficiency and saving manpower and time costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate the technical solution of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.
[0015] Figure 1 It is a front view of a chip batch microscopic inspection device provided in an embodiment of the present application;
[0016] Figure 2 is a top view of a chip batch microscopy device provided in an embodiment of the present application;
[0017] Figure 3 is a stereoscopic diagram of a chip batch microscopic inspection device provided in an embodiment of the present application;
[0018] Figure 4 It is a flow chart of a chip batch microscopic inspection method provided in an embodiment of the present application.
[0019] Reference numerals:
[0020] Box-type box frame 100 , main body base 200 , lifting mechanism 300 , detachable box cover 400 , vacuum release adhesive box 210 , knob 310 . DETAILED DESCRIPTION
[0021] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, rather than to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.
[0022] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
[0023] With the rapid development of the third-generation HgCdTe infrared detector technology, the preparation of low-cost large-scale focal plane chips requires a more stable process and a higher chip yield rate. In aerospace remote sensing applications, the complex space application environment also places higher demands on the reliability of HgCdTe photovoltaic detector chips. By performing microscopic inspection on the surface of HgCdTe detectors, surface defects, scratches, contamination, film removal and other surface conditions can be monitored, which plays a key role in improving the yield rate of hybrid detectors and finding technical problems.
[0024] At present, most storage boxes for HgCdTe detectors use G-pak boxes, which can store a large number of HgCdTe detectors of different sizes. When using a microscope with a lens lower than 20x, all chips placed in the box can be inspected in batches. However, the low-magnification lens cannot detect some defects on the surface of the HgCdTe detector, such as plate rubbing and dirt. Once the detector flows into the process line, it will waste process resources and increase costs. When using a higher-magnification microscope for inspection, switching the lens will touch the frame of the box, which may seriously damage the lens. In addition, the current high-magnification microscope inspection requires manual use of tweezers to pick up the detectors one by one and place them under a microscope for high-magnification observation. This method cannot achieve batch inspection and seriously reduces work efficiency. In addition, for large-array chips, the manual action of picking up and delivering the detectors will increase the possibility of scratches and damage to the detectors, making the process uncontrollable and increasing process costs.
[0025] In order to solve the problems of the related art, the embodiments of the present application provide a chip batch microscopy device and method, which can be suitable for high-power microscope batch microscopy, taking into account the efficiency, cost and yield of the process baseline.
[0026] It should be noted that the chip batch microscopy device in the embodiment of the present application can be widely used in many hybrid device preparation fields such as MEMS (Micro-Electro-Mechanical System), infrared detectors (such as mercury cadmium telluride infrared detectors), and ultraviolet detectors, that is, there is no limitation on the specific type of detection device.
[0027] The chip batch microscopy device provided in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.
[0028] refer to Figure 1 , is a front view of a chip batch microscopic inspection device according to an embodiment of the present application. Figure 1 As shown, the chip batch microscopic inspection device includes a box-type box frame 100, a main body base 200 and a lifting mechanism 300. The main body base 200 is arranged inside the box-type box frame 100 for storing the devices to be inspected; the lifting mechanism 300 is arranged below the main body base 200, and is used to adjust the main body base 200 to a preset height when a number of devices to be inspected are stored on the first surface of the main body base 200, so as to perform batch microscopic inspection on the devices to be inspected from low power to high power using a pre-set microscope.
[0029] It should be noted that the first surface is the surface of the main base 200 away from the lifting mechanism 300 , and the setting position of the microscope matches the preset height, which is higher than the frame height of the box-type box frame 100 .
[0030] Therefore, based on the box-type box frame 100 and the main body base 200 inside it, a number of devices to be inspected can be stored on the surface of the main body base 200, and its height can be adjusted by the lifting mechanism 300 under the main body base 200, so that the whole box of chips can be batch inspected using a microscope from low-power to high-power, avoiding the situation of repeatedly clamping and releasing devices, improving the reliability of microscopic inspection, greatly improving process efficiency and saving manpower and time costs.
[0031] Furthermore, in some embodiments, Figure 2 A top view of a chip batch microscopy device is shown. Figure 3 A three-dimensional diagram of a chip batch microscopy device is shown.
[0032] like Figure 2 and Figure 3As shown, the first surface of the main body base 200 is provided with a vacuum release surface adhesive box 210 with a transparent gel coating. In this way, under normal conditions, the adhesive surface components are tightly adhered to reduce the movement or shaking of the components to be detected on the first surface of the main body base 200 during transportation and movement. It should be understood that other adhesive materials can also be provided on the first surface, and this embodiment does not specifically limit this.
[0033] As an optional embodiment, Figure 1 As shown, the box-type box frame 100 has a hollow area, specifically, there is a part of the hollow area at the bottom of the main base 200. Based on the hollow area, an external vacuum device can be connected according to application requirements to make the inside of the box-type box frame 100 a vacuum environment through the vacuum device. Therefore, when the main base 200 is at a preset height, the inside of the box-type box frame 100 is set to a vacuum environment, and since the surface adhesion is reduced in a vacuum state, it is convenient to take and place the device.
[0034] In some optional embodiments, such as Figure 3 As shown, the lifting mechanism 300 includes a knob 310 for controlling the lifting mechanism 300 to rise or fall, that is, the lifting mechanism 300 can control its moving distance in the vertical direction through the knob 310 to achieve the lifting and lowering of the main base 200, so that the main base 200 is located at a desired height position.
[0035] In addition, in some embodiments, the preset height is determined according to the frame height of the box-type box frame 100, the setting position of the microscope and the thickness information of the device to be detected. In addition, the dimensions of the box-type box frame 100, the main base 200 and the lifting mechanism 300, as well as the lifting height range can be adjusted according to actual application requirements.
[0036] It can be seen that the chip batch microscopy device of the embodiment of the present application has low manufacturing cost and simple operation. The box-type box frame 100 is used to store the main base 200. The surface of the main base 200 can store multiple mercury cadmium telluride infrared detectors of different sizes and thicknesses. Under the main base 200 is a freely liftable mechanism, which can adjust the height accordingly according to the thickness of the stored infrared detectors to facilitate batch microscopy.
[0037] In order to avoid the microscope lens from hitting the thicker device during the microscopic inspection of devices with different thicknesses, or even damage the lens, the chip storage box in the related art can only perform microscopic inspection on devices of the same thickness in batches or take them out of the box for microscopic inspection. Therefore, according to the thickness of the stored detector, the present embodiment uses the knob 310 of the lifting mechanism 300 to control the free lifting and lowering of the main base 200 so as to place it under the microscope lens and realize the microscopic inspection of the entire box of mercury cadmium telluride detectors at one time; and, through the lifting process, the height of the device is made higher than the frame height of the box-type box frame 100 to avoid the microscope lens from hitting the frame when the microscope is turned. The microscopic inspection of devices of different thicknesses in batches is realized, and mercury cadmium telluride detectors of different sizes and thicknesses can be stored according to the specific process, and can be reused, which has universality.
[0038] Furthermore, in some embodiments, Figure 1 As shown, the chip batch microscopic inspection device further includes a detachable box cover 400, which is used to be arranged above the box-type box frame 100 when the height of the main base 200 is lower than the frame height of the box-type box frame 100. In this way, before or after microscopic inspection, the mercury cadmium telluride detector in the box body can be protected by the box cover to prevent surface scratches and contamination.
[0039] Furthermore, the present application also provides a chip batch microscopic inspection method. It should be noted that the chip batch microscopic inspection method can be applied to the chip batch microscopic inspection device of any of the above embodiments.
[0040] Figure 4 FIG. 2 is a schematic diagram showing a flow chart of a chip batch microscopic inspection method according to an embodiment of the present application. Figure 4 As shown, the chip batch microscopic inspection method may specifically include the following steps:
[0041] S401, when a plurality of devices to be detected are stored on the first surface of the main body base, the main body base is adjusted to a preset height by a lifting mechanism;
[0042] S402, using an external vacuum pumping device to set the interior of the box-type frame to a vacuum environment;
[0043] S403, using a pre-set microscope from low power to high power to perform batch microscopic inspection on a number of devices to be inspected, the first surface is a surface of the main base away from the lifting mechanism, the setting position of the microscope matches the preset height, and the preset height is higher than the frame height of the box-type box frame;
[0044] S404, adjusting the main body base to a height position lower than the frame height of the box-type box frame by the lifting mechanism;
[0045] S405, disposing a detachable box cover on the top of the box-type box frame.
[0046] In some embodiments, when using a microscope to inspect mercury cadmium telluride detectors, the box cover is pulled out, and the height of the main base is adjusted by a knob according to the thickness of the stored infrared detectors so that the main base is located under the microscope lens. In this way, the microscope can perform batch inspections of mercury cadmium telluride detectors of different thicknesses and sizes from low power to high power.
[0047] In some embodiments, after the microscopic examination is completed, the box cover is placed on the lifting body base to protect the mercury cadmium telluride detector in the box body to avoid surface scratches and contamination.
[0048] In a specific implementation, when inspecting mercury cadmium telluride detectors of different thicknesses under a microscope, the box cover is pulled out, and the main base storing the mercury cadmium telluride infrared detectors to be inspected is taken out; the main base is placed under a microscope; the main base is raised by rotating the knob counterclockwise, and the rising height can be adjusted accordingly according to the thickness of the chip; the detectors in the storage box are subjected to batch high-power microscope inspection; after the inspection is completed, the knob is rotated clockwise to make the height of the main base lower than the outer frame; and the main base is placed back into the box-type box frame.
[0049] Therefore, a whole box of HgCdTe detectors can be inspected under a microscope at one time, which can avoid the situation of repeatedly clamping and placing the detectors, reduce the probability of damage, and realize high-power batch microscopic inspection of HgCdTe detectors, thereby enhancing the reliability of microscopic inspection, improving the yield of hybrid detectors, greatly improving process efficiency and saving manpower and time costs.
[0050] It should be noted that the above describes some embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the above embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0051] Reference to "embodiment" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments.
[0052] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "attached" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0053] In the embodiments of the present application, the same reference numerals represent the same components, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device are only exemplary descriptions and should not constitute any limitation to the present application.
[0054] The term "plurality" used in the present application refers to two or more (including two).
[0055] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.
[0056] It should also be noted that the exemplary embodiments mentioned in this application describe some methods or systems based on a series of steps or devices. However, this application is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiment, or in a different order from the embodiment, or several steps can be performed simultaneously.
[0057] The above is only a specific implementation of the present application. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working processes of the systems, modules and units described above can refer to the corresponding processes in the aforementioned method embodiments, and will not be repeated here. It should be understood that the protection scope of the present application is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in this application, and these modifications or replacements should be included in the protection scope of this application.
Claims
1. A chip batch microscopy device, characterized in that: include: Box frame; A main base, arranged inside the box-type frame, for storing the device to be tested; A lifting mechanism is disposed below the main body base, and is used to adjust the main body base to a preset height when a plurality of devices to be inspected are stored on the first surface of the main body base, so as to perform batch microscopic inspection on the plurality of devices to be inspected from a low-power microscope to a high-power microscope using a pre-set microscope; The first surface is a surface of the main body base away from the lifting mechanism, and the setting position of the microscope matches the preset height, and the preset height is higher than the frame height of the box-type box frame.
2. The chip batch microscopic inspection device according to claim 1, characterized in that: The first surface of the main body base is provided with a vacuum release surface glue box with a transparent gel coating.
3. The chip batch microscopic inspection device according to claim 2, characterized in that: The box-type box frame has a hollow area, which is used for externally connecting a vacuum pumping device to make the interior of the box-type box frame a vacuum environment when the main base is located at a preset height.
4. The chip batch microscopy device according to claim 1, characterized in that: The chip batch microscopic inspection device also includes a detachable box cover, which is used to be arranged above the box-type box frame when the height position of the main body base is lower than the frame height of the box-type box frame.
5. The chip batch microscopic inspection device according to claim 1, characterized in that: The lifting mechanism comprises a knob for controlling the lifting mechanism to rise or fall.
6. The chip batch microscopic inspection device according to claim 1, characterized in that: The preset height is determined according to the frame height of the box-type box frame, the setting position of the microscope and the thickness information of the device to be detected.
7. A chip batch microscopy method, characterized in that: The method is applied to a chip batch microscopic inspection device according to any one of claims 1 to 6, and the method comprises: When a plurality of devices to be detected are stored on the first surface of the main body base, the main body base is adjusted to a preset height by a lifting mechanism; Use pre-set microscopes from low to high magnification to perform batch microscopic inspection on a number of devices to be inspected; The first surface is a surface of the main body base away from the lifting mechanism, and the setting position of the microscope matches the preset height, and the preset height is higher than the frame height of the box-type box frame.
8. The method according to claim 7, characterized in that After the main base is adjusted to a preset height by the lifting mechanism, and before a plurality of devices to be inspected are subjected to batch microscopic inspection from a low-power microscope to a high-power microscope using a preset microscope, the method further includes: The interior of the box-type frame is set to a vacuum environment by using an external vacuum pumping device.
9. The method according to claim 7, characterized in that: After performing batch microscopic inspection on a plurality of devices to be inspected using a preset microscope from low power to high power, the method further includes: The main body base is adjusted to a height position lower than the frame height of the box-type box frame by the lifting mechanism; The detachable box cover is arranged above the box-type box frame.