Metal bonding failure analogue simulation method and device and electronic equipment
By constructing and adjusting the CAE simulation model, the complexity and accuracy of metal bond failure simulation in the prior art are solved, and the accurate simulation of bond failure performance and the accurate evaluation of the vehicle performance are achieved.
Patent Information
- Application Number
- CN202411616490.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-13
- Publication Date
- 2025-02-11
AI Technical Summary
In the process of simulating metal bonding failure, the existing technology has difficulty coping with the modeling of metal plate shell bonding in complex directions, the failure result display is not obvious, and the difficulty of obtaining the bonding failure parameters and the association of the subsystem with the vehicle model.
By obtaining the force displacement curve data of tensile tests and shear tests, data processing and abnormal data removal, a CAE simulation model is constructed, and the adhesive simulation model is obtained by adjusting the model parameters until the simulation results match the experimental data.
Accurate simulation of metal bond failure performance is achieved, ensuring the accuracy of evaluation of the collision barrier performance of the whole vehicle and the performance of the hit vehicle.
Smart Images
Figure CN119416532A_ABST
Abstract
Description
Technical Field
[0001] One or more embodiments of the present specification relate to computer-aided engineering technology, and more particularly to a method, device and electronic device for simulating metal bonding failure. Background Art
[0002] To meet the connection needs of metal structures, adhesive bonding has gradually emerged. Adhesive bonding is to tightly combine homogeneous or heterogeneous substrates with adhesives. Compared with traditional connections, adhesive bonding has the advantages of complete structure, light weight, uniform stress distribution and convenient operation. The characteristics of metal adhesive bonding, especially the failure characteristics, have a significant impact on the performance of the metal structure it connects.
[0003] At present, in the computer-aided engineering (CAE) simulation process of collision, the simulation of metal bonding is carried out by using solid elements or *CONSTRAINED_SPOTWELD. The solid elements are difficult to deal with the problem of bonding modeling of metal plates and shells in complex directions, and the *CONSTRAINED_SPOTWELD method has problems such as unclear display of failure results. At the same time, there are also problems such as how to effectively obtain the corresponding bonding failure parameters and how to associate the simulation model of the subsystem with the simulation model of the whole vehicle. Therefore, a simulation method that can accurately and truly reflect the failure performance of adhesive is currently needed. Summary of the invention
[0004] In order to solve the above problems, one or more embodiments of this specification describe a method, device and electronic device for simulating metal bonding failure.
[0005] According to a first aspect, a method for simulating metal bonding failure is provided, the method comprising:
[0006] Acquire the first force-displacement curve test data of the tensile test metal part loaded until the adhesive failure occurs in the tensile test, and acquire the second force-displacement curve test data of the shear test metal part loaded until the adhesive failure occurs in the tensile test;
[0007] After eliminating abnormal data in the force-displacement curve test data, the force-displacement curve test data are averaged to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test;
[0008] Building a first CAE simulation model based on the tensile test conditions, adjusting model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and recording the curing parameters of the first CAE simulation model, wherein the curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction;
[0009] A second CAE simulation model is constructed based on the shear test conditions, and after the curing parameters are imported, the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model are adjusted until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model;
[0010] A whole vehicle collision barrier model is built based on the bonding simulation model, and a simulation is performed on the vehicle to be tested based on the whole vehicle collision barrier model.
[0011] Preferably, the step of obtaining the first force-displacement curve test data of the tensile test metal part after the tensile test is loaded until the adhesive fails, and obtaining the second force-displacement curve test data of the shear test metal part after the tensile test is loaded until the adhesive fails, comprises:
[0012] Obtain at least two sets of first force-displacement curve test data of the tensile test metal piece after at least two tensile tests are loaded until adhesive failure occurs, and obtain at least two sets of second force-displacement curve test data of the shear test metal piece after at least two tensile tests are loaded until adhesive failure occurs.
[0013] Preferably, the averaging of the force displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test includes:
[0014] For the first force-displacement curve test data, determining the first maximum tension of each of the first force-displacement curve test data, calculating the average value of each of the first maximum tensions, and obtaining the first failure force data;
[0015] For the second force-displacement curve test data, the second maximum tension of each of the second force-displacement curve test data is determined, and the average value of each of the second maximum tensions is calculated to obtain the second failure force data.
[0016] Preferably, the simulation analysis solver of the first CAE simulation model and the second CAE simulation model is LS-DYNA, the metal samples in the model are simulated based on shell elements of a specified grid size, and the adhesive in the model is simulated based on a specified number of weld beam elements.
[0017] Preferably, the simulation of the vehicle to be tested based on the whole vehicle collision barrier model includes:
[0018] The actual glue area of the vehicle to be tested is determined, the number of weld beam units to be set is determined based on the actual glue area, and the vehicle to be tested is simulated based on the number of weld beam units and the whole vehicle collision barrier model.
[0019] Preferably, after adjusting the S-direction shear failure force and the T-direction shear failure force of the second CAE simulation model, the method further includes:
[0020] When the failure force data corresponding to the simulation of the second CAE simulation model and the second failure force data continue to fail to match, the model parameters of the first CAE simulation model are readjusted.
[0021] Preferably, the method further comprises:
[0022] Acquire actual test results and simulation results of the vehicle to be tested, and verify the simulation results based on the actual test results.
[0023] According to a second aspect, a simulation device for metal bonding failure is provided, the device comprising:
[0024] An acquisition module is used to acquire first force-displacement curve test data of a metal part in a tensile test, which is loaded until adhesive failure occurs in a tensile test, and to acquire second force-displacement curve test data of a metal part in a shear test, which is loaded until adhesive failure occurs in a tensile test;
[0025] A processing module, used for removing abnormal data in the force-displacement curve test data and then averaging the force-displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test;
[0026] A first construction module is used to construct a first CAE simulation model based on the tensile test conditions, adjust the model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and record the curing parameters of the first CAE simulation model, wherein the curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction;
[0027] A second construction module is used to construct a second CAE simulation model based on the shear test conditions, and after importing the curing parameters, adjust the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model;
[0028] The simulation module is used to build a whole vehicle collision barrier model based on the bonding simulation model, and to simulate the vehicle to be tested based on the whole vehicle collision barrier model.
[0029] According to a third aspect, there is provided an electronic device, comprising a processor and a memory;
[0030] The processor is connected to the memory;
[0031] The memory is used to store executable program code;
[0032] The processor runs a program corresponding to the executable program code by reading the executable program code stored in the memory, so as to execute the steps of the method provided in the first aspect or any possible implementation manner of the first aspect.
[0033] According to a fourth aspect, a computer-readable storage medium is provided, on which a computer program is stored, and the computer-readable storage medium stores instructions, which, when the instructions are executed on a computer or a processor, cause the computer or the processor to execute the method provided in the first aspect or any possible implementation of the first aspect.
[0034] The method provided in the embodiment of this specification obtains the first failure force data and the second failure force data by respectively processing the tensile test and the shear test, and then adjusts the first CAE simulation model with the first failure force data as the target parameter, and adjusts the second CAE simulation model according to its corresponding curing parameter combined with the second failure force data to obtain the bonding simulation model, and finally performs simulation with the bonding simulation model. The bonding simulation model obtained in the above manner can accurately and truly reflect the failure performance of the adhesive, thereby ensuring the accuracy of the evaluation of the collision barrier performance of the whole vehicle and the performance of the collided vehicle. BRIEF DESCRIPTION OF THE DRAWINGS
[0035] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0036] Figure 1 It is a flow chart of a method for simulating metal bonding failure in one embodiment of the present specification.
[0037] Figure 2 It is a curve diagram of the first force displacement curve test data of a tensile test in one embodiment of this specification.
[0038] Figure 3 It is a curve diagram of the second force displacement curve test data of the shear test in one embodiment of this specification.
[0039] Figure 4It is a structural schematic diagram of a simulation device for metal bonding failure in one embodiment of the present specification.
[0040] Figure 5 It is a structural diagram of an electronic device in one embodiment of this specification. DETAILED DESCRIPTION
[0041] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application.
[0042] In the following introduction, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The following introduction provides multiple embodiments of the present application, and different embodiments can be replaced or combined, so the present application can also be considered to include all possible combinations of the same and / or different embodiments recorded. Therefore, if one embodiment includes features A, B, and C, and another embodiment includes features B and D, then the present application should also be considered to include embodiments containing one or more of all other possible combinations of A, B, C, and D, although the embodiment may not be clearly recorded in the following text.
[0043] The following description provides examples and does not limit the scope, applicability or examples set forth in the claims. Changes may be made to the functions and arrangements of the elements described without departing from the scope of the present application. Various processes or components may be appropriately omitted, substituted or added to each example. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted or combined. In addition, features described in some examples may be combined in other examples.
[0044] See also Figure 1 , Figure 1 : is a flow chart of a method for simulating metal bonding failure provided in an embodiment of the present application. In the embodiment of the present application, the method includes:
[0045] S101, obtaining first force-displacement curve test data of a metal part subjected to a tensile test and loaded until adhesive failure occurs, and obtaining second force-displacement curve test data of a metal part subjected to a shear test and loaded until adhesive failure occurs.
[0046] The execution entity of this application can be a cloud server.
[0047] In the embodiment of this specification, the actual metal parts are first subjected to tensile tests and shear tests to measure the corresponding first force displacement curve test data and second force displacement curve test data, and uploaded to the cloud server. The corresponding curve graphs of the two are shown as follows: Figure 2 and Figure 3As shown. Specifically, aluminum alloy materials can be used to make tensile test and shear test specimens, and then the mechanical properties and size information of the aluminum alloy materials are clarified, and the adhesive area and performance information are clarified. Then, a universal tensile testing machine is used to perform tensile tests on the tensile test specimens and shear test specimens, and the load is applied until the adhesive fails, and the force displacement curve test data corresponding to the test process until the adhesive fails are recorded. Among them, the tensile test specimens made of aluminum alloy materials need to ensure that the force exerted on the adhesive used for bonding is pure tensile force, so that the relevant parameters in the subsequent tensile simulation model can be conveniently calibrated without being interfered by other factors. For this reason, the tensile test specimens use two identical T-shaped aluminum alloy sheet samples, and the corresponding planes are bonded with adhesive, while the planes perpendicular to them are clamped by upper and lower clamps. The shear test specimens made of aluminum alloy are two aluminum alloy sheets of the same size, one end of which is partially bonded together by bonding, and the other end is clamped by upper and lower clamps. In addition, the bonding area and thickness of the tensile test specimens and the shear test specimens are kept consistent as much as possible to facilitate the establishment of subsequent simulation models.
[0048] In one possible implementation manner, obtaining the first force-displacement curve test data of the tensile test metal piece after the tensile test is loaded until the adhesive fails, and obtaining the second force-displacement curve test data of the shear test metal piece after the tensile test is loaded until the adhesive fails, comprises:
[0049] Obtain at least two sets of first force-displacement curve test data of the tensile test metal piece after at least two tensile tests are loaded until adhesive failure occurs, and obtain at least two sets of second force-displacement curve test data of the shear test metal piece after at least two tensile tests are loaded until adhesive failure occurs.
[0050] In the embodiments of this specification, in order to improve the reliability and accuracy of the data, the tensile test and the shear test will be performed multiple times, and each time a set of force displacement curve test data will be obtained. The cloud server will obtain multiple sets of data to determine the failure force data based on the multiple sets of data in the subsequent steps to ensure the accuracy of the data.
[0051] S102, after eliminating abnormal data in the force-displacement curve test data, averaging the force-displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test.
[0052] In the embodiment of this specification, the cloud server first removes some data with obvious abnormal curve shapes and values, and then averages the remaining force displacement curve test data to finally obtain the first failure force data and the second failure force data. Specifically, the averaging process can be to calculate the average value of the maximum tension in the force displacement curve test data, that is, the peak point, or to calculate the average value of all data greater than a preset value. The first failure force data and the second failure force data finally determined will be used as the tensile target value and shear target value of adhesive failure, respectively, for subsequent simulation model benchmarking.
[0053] In one possible implementation, the averaging process of the force displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test includes:
[0054] For the first force-displacement curve test data, determining the first maximum tension of each of the first force-displacement curve test data, calculating the average value of each of the first maximum tensions, and obtaining the first failure force data;
[0055] For the second force-displacement curve test data, the second maximum tension of each of the second force-displacement curve test data is determined, and the average value of each of the second maximum tensions is calculated to obtain the second failure force data.
[0056] In the embodiments of the present specification, since each test will be performed multiple times, multiple sets of data will be obtained. Regardless of whether it is the first force-displacement curve test data or the second force-displacement curve test data, the cloud server will first determine the maximum tensile force in each set of force-displacement curve test data, and then calculate the average value of these maximum tensile forces as the failure force data for this type of test.
[0057] S103, constructing a first CAE simulation model based on the tensile test conditions, adjusting model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and recording the curing parameters of the first CAE simulation model.
[0058] The curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction.
[0059] In the embodiment of the present specification, the tensile test conditions will be used as basic parameters to construct a first CAE simulation model, and then the model parameters of the first CAE simulation model will be continuously adjusted according to the first failure force data until the failure force data finally simulated by the model matches the first failure force data, that is, the error between the two is less than the preset error, and the curing parameters of the first CAE simulation model at this time are recorded.
[0060] In one possible implementation manner, the simulation analysis solver of the first CAE simulation model and the second CAE simulation model is LS-DYNA, the metal samples in the model are simulated based on shell elements of a specified grid size, and the adhesive in the model is simulated based on a specified number of weld beam elements.
[0061] In the embodiments of this specification, LS-DYNA will be used as the simulation analysis solver. The metal samples in the model are simulated using shell units with appropriate mesh sizes, while the adhesive is simulated using a certain number of weld beam units. The weld beam unit needs to set the corresponding section properties, material properties, and material failure criteria. In order to achieve benchmarking with the corresponding test, the parameters that can be adjusted for the weld beam unit mainly include the beam diameter TS1 and beam diameter TS2 in the properties, the elastic modulus E in the material, the yield stress SIGY, the plastic hardening modulus EH, and the failure axial force N. RRF , Shear failure force in S direction N RSF , shear failure force in T direction N RTF , where S direction and T direction refer to the directions of the in-plane shear force. The S direction shear force refers to the shear force in the material plane at a ±45° angle to the longitudinal direction (1 direction). The T direction shear force refers to the shear force in another ±45° direction perpendicular to the S direction in the material plane. During the tensile simulation, the failure criterion corresponding to the beam element is calculated according to the following formula:
[0062]
[0063] Among them, N RR 、N RS 、N RT It is the axial force, S-direction shear force, and T-direction shear force calculated during the simulation process.
[0064] In addition, since the simulated beam element is subjected to pure tensile force, the shear failure force N in the S direction of the model parameter is RSF , shear failure force in T direction N RTF It has no effect on the results and no curing is required in this step. Other parameters are initially cured according to the results after benchmarking.
[0065] S104. Construct a second CAE simulation model based on the shear test conditions, and after importing the curing parameters, adjust the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model.
[0066] In the embodiment of this specification, the shear test conditions are used as basic parameters to construct a second CAE simulation model, and the curing parameters are introduced as part of the model parameters. Then, the shear failure force N in the S direction of the model is mainly RSF , shear failure force in T direction N RTF Perform settings and debugging to ensure that the simulation results and test results meet the error requirements, so as to finally obtain the bonding simulation model.
[0067] In one possible implementation, after adjusting the S-direction shear failure force and the T-direction shear failure force of the second CAE simulation model, the method further includes:
[0068] When the failure force data corresponding to the simulation of the second CAE simulation model and the second failure force data continue to fail to match, the model parameters of the first CAE simulation model are readjusted.
[0069] In the embodiment of the present specification, if the error between the simulation result and the test result still does not meet the requirement after repeated adjustments, it is necessary to readjust the parameters of the first CAE simulation model to adjust the inherent parameters of the second CAE simulation model.
[0070] S105, building a whole vehicle collision barrier model based on the bonding simulation model, and simulating the vehicle to be tested based on the whole vehicle collision barrier model.
[0071] In the embodiments of this specification, the whole vehicle collision barrier model can be regarded as a complete test system composed of different models. The present application adds the adhesive joint simulation model as a model part that reflects the adhesive joint failure to build a complete whole vehicle collision barrier model. Finally, the collision simulation between the barrier and the whole vehicle can be directly performed on the test vehicle to ensure that the adhesive joint simulation model can correctly reflect the actual dynamic response and related adhesive joint failure during the whole vehicle collision.
[0072] In one possible implementation, the simulating the vehicle to be tested based on the whole vehicle collision barrier model includes:
[0073] The actual glue area of the vehicle to be tested is determined, the number of weld beam units to be set is determined based on the actual glue area, and the vehicle to be tested is simulated based on the number of weld beam units and the whole vehicle collision barrier model.
[0074] In the embodiments of this specification, when using the calibrated weld beam unit to simulate the adhesive bonding, the actual adhesive area needs to be considered, and then the area conversion is performed according to the calibrated model to determine the number of weld beam units used. Specifically, a conversion formula can be set in advance for conversion, or a mapping relationship between different area intervals and unit numbers can be directly set, and the mapping relationship can be directly queried in actual situations.
[0075] In one embodiment, the method further comprises:
[0076] Acquire actual test results and simulation results of the vehicle to be tested, and verify the simulation results based on the actual test results.
[0077] In the embodiment of this specification, the actual test results of the vehicle to be tested are also obtained and compared with the simulation results to verify the reliability of the model. If the difference between the two exceeds the preset error, the model will be retrained to optimize the model parameters.
[0078] The following will be combined with the attached Figure 4 , the simulation device for metal bonding failure provided in the embodiment of the present application is introduced in detail. It should be noted that the attached Figure 4 The metal bonding failure simulation device shown is used to implement the present application Figure 1 For the convenience of explanation, only the part related to the embodiment of the present application is shown. For the specific technical details not disclosed, please refer to the present application. Figure 1 The embodiment shown.
[0079] See also Figure 4 , Figure 4 Schematic diagram of a metal bonding failure simulation device provided in an embodiment of the present application. Figure 4 As shown, the device comprises:
[0080] An acquisition module 401 is used to acquire first force-displacement curve test data of a metal part in a tensile test after being loaded in a tensile test until adhesive failure occurs, and to acquire second force-displacement curve test data of a metal part in a shear test after being loaded in a tensile test until adhesive failure occurs;
[0081] A processing module 402 is used to remove abnormal data in the force-displacement curve test data and then average the force-displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test;
[0082] A first construction module 403 is used to construct a first CAE simulation model based on the tensile test conditions, adjust the model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and record the curing parameters of the first CAE simulation model, wherein the curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction;
[0083] The second construction module 404 is used to construct a second CAE simulation model based on the shear test conditions, and after importing the curing parameters, adjust the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model;
[0084] The simulation module 405 is used to build a whole vehicle collision barrier model based on the bonding simulation model, and simulate the vehicle to be tested based on the whole vehicle collision barrier model.
[0085] In one possible implementation, the acquisition module 401 is specifically used for:
[0086] Obtain at least two sets of first force-displacement curve test data of the tensile test metal piece after at least two tensile tests are loaded until adhesive failure occurs, and obtain at least two sets of second force-displacement curve test data of the shear test metal piece after at least two tensile tests are loaded until adhesive failure occurs.
[0087] In one embodiment, the processing module 402 is specifically configured to:
[0088] For the first force-displacement curve test data, determining the first maximum tension of each of the first force-displacement curve test data, calculating the average value of each of the first maximum tensions, and obtaining the first failure force data;
[0089] For the second force-displacement curve test data, the second maximum tension of each of the second force-displacement curve test data is determined, and the average value of each of the second maximum tensions is calculated to obtain the second failure force data.
[0090] In one possible implementation manner, the simulation analysis solver of the first CAE simulation model and the second CAE simulation model is LS-DYNA, the metal samples in the model are simulated based on shell elements of a specified grid size, and the adhesive in the model is simulated based on a specified number of weld beam elements.
[0091] In one possible implementation, the second building module 404 is further configured to:
[0092] When the failure force data corresponding to the simulation of the second CAE simulation model and the second failure force data continue to fail to match, the model parameters of the first CAE simulation model are readjusted.
[0093] In one possible implementation, the simulation module 405 is specifically used for:
[0094] The actual glue area of the vehicle to be tested is determined, the number of weld beam units to be set is determined based on the actual glue area, and the vehicle to be tested is simulated based on the number of weld beam units and the whole vehicle collision barrier model.
[0095] In one possible implementation, the simulation module 405 is further configured to:
[0096] Acquire actual test results and simulation results of the vehicle to be tested, and verify the simulation results based on the actual test results.
[0097] Those skilled in the art can clearly understand that the technical solutions of the embodiments of the present application can be implemented with the help of software and / or hardware. The "unit" and "module" in this specification refer to software and / or hardware that can independently complete or cooperate with other components to complete specific functions, where the hardware can be, for example, a field programmable gate array (Field-Programmable Gate Array, FPGA), an integrated circuit (Integrated Circuit, IC), etc.
[0098] Each processing unit and / or module of the embodiments of the present application may be implemented by an analog circuit that implements the functions described in the embodiments of the present application, or may be implemented by software that executes the functions described in the embodiments of the present application.
[0099] See also Figure 5 , which shows a schematic diagram of the structure of an electronic device involved in an embodiment of the present application, the electronic device can be used to implement Figure 1 The method in the embodiment shown. Figure 5 As shown, the electronic device 500 may include: at least one processor 501 , at least one network interface 504 , a user interface 503 , a memory 505 , and at least one communication bus 502 .
[0100] The communication bus 502 is used to realize the connection and communication between these components.
[0101] The user interface 503 may include a display screen (Display) and a camera (Camera), and the optional user interface 503 may also include a standard wired interface and a wireless interface.
[0102] The network interface 504 may optionally include a standard wired interface or a wireless interface (such as a WI-FI interface).
[0103] Among them, the processor 501 may include one or more processing cores. The processor 501 uses various interfaces and lines to connect various parts within the entire electronic device 500, and executes various functions and processes data of the electronic device 500 by running or executing instructions, programs, code sets or instruction sets stored in the memory 505, and calling data stored in the memory 505. Optionally, the processor 501 can be implemented in at least one hardware form of digital signal processing (Digital Signal Processing, DSP), field programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA). The processor 501 can integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics central processing unit (Graphics Processing Unit, GPU) and a modem. Among them, the CPU mainly processes the operating system, user interface and application programs; the GPU is responsible for rendering and drawing the content to be displayed on the display screen; the modem is used to process wireless communications. It can be understood that the above-mentioned modem may not be integrated into the processor 501, and it can be implemented separately through a chip.
[0104] Among them, the memory 505 may include a random access memory (Random Access Memory, RAM) and may also include a read-only memory (Read-Only Memory). Optionally, the memory 505 includes a non-transitory computer-readable storage medium. The memory 505 can be used to store instructions, programs, codes, code sets or instruction sets. The memory 505 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), instructions for implementing the above-mentioned various method embodiments, etc.; the data storage area may store data involved in the above-mentioned various method embodiments, etc. The memory 505 may also be optionally at least one storage device located away from the aforementioned processor 501. As Figure 5 As shown, the memory 505 as a computer storage medium may include an operating system, a network communication module, a user interface module, and program instructions.
[0105] exist Figure 5In the electronic device 500 shown, the user interface 503 is mainly used to provide an input interface for the user and obtain the data input by the user; and the processor 501 can be used to call the metal bonding failure simulation application stored in the memory 505, and specifically perform the following operations:
[0106] Acquire the first force-displacement curve test data of the tensile test metal part loaded until the adhesive failure occurs in the tensile test, and acquire the second force-displacement curve test data of the shear test metal part loaded until the adhesive failure occurs in the tensile test;
[0107] After eliminating abnormal data in the force-displacement curve test data, the force-displacement curve test data are averaged to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test;
[0108] Building a first CAE simulation model based on the tensile test conditions, adjusting model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and recording the curing parameters of the first CAE simulation model, wherein the curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction;
[0109] A second CAE simulation model is constructed based on the shear test conditions, and after the curing parameters are imported, the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model are adjusted until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model;
[0110] A whole vehicle collision barrier model is built based on the bonding simulation model, and a simulation is performed on the vehicle to be tested based on the whole vehicle collision barrier model.
[0111] The present application also provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the above method are implemented. The computer-readable storage medium may include, but is not limited to, any type of disk, including a floppy disk, an optical disk, a DVD, a CD-ROM, a micro drive, and a magneto-optical disk, a ROM, a RAM, an EPROM, an EEPROM, a DRAM, a VRAM, a flash memory device, a magnetic card or an optical card, a nanosystem (including a molecular memory IC), or any type of medium or device suitable for storing instructions and / or data.
[0112] It should be noted that, for the aforementioned method embodiments, for the sake of simplicity, they are all expressed as a series of action combinations, but those skilled in the art should be aware that the present application is not limited by the described order of actions, because according to the present application, certain steps can be performed in other orders or simultaneously. Secondly, those skilled in the art should also be aware that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily required by the present application.
[0113] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.
[0114] In the several embodiments provided in the present application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are only schematic, such as the division of the units, which is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some service interfaces, and the indirect coupling or communication connection of devices or units can be electrical or other forms.
[0115] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0116] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.
[0117] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product, and the computer software product is stored in a memory, including a number of instructions to enable a computer device (which can be a personal computer, server or network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present application. The aforementioned memory includes: U disk, read-only memory (ROM), random access memory (RAM), mobile hard disk, disk or optical disk and other media that can store program code.
[0118] A person skilled in the art may understand that all or part of the steps in the various methods of the above embodiments may be completed by entering a program to instruct the relevant hardware. The program may be stored in a computer-readable memory, and the memory may include: a flash drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.
[0119] The above is only an exemplary embodiment of the present disclosure, and the scope of the present disclosure cannot be limited thereto. That is, any equivalent changes and modifications made according to the teachings of the present disclosure are still within the scope of the present disclosure. After considering the specification and practicing the disclosure here, those skilled in the art will easily think of the implementation scheme of the present disclosure. This application is intended to cover any modification, use or adaptation of the present disclosure, which follows the general principles of the present disclosure and includes common knowledge or customary technical means in the technical field not recorded in the present disclosure. The description and examples are regarded as exemplary only, and the scope and spirit of the present disclosure are defined by the claims.
Claims
1. A method for simulating metal bonding failure, characterized in that: The method comprises: Acquire the first force-displacement curve test data of the tensile test metal part loaded until the adhesive failure occurs in the tensile test, and acquire the second force-displacement curve test data of the shear test metal part loaded until the adhesive failure occurs in the tensile test; After eliminating abnormal data in the force-displacement curve test data, the force-displacement curve test data are averaged to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test; Building a first CAE simulation model based on the tensile test conditions, adjusting model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and recording the curing parameters of the first CAE simulation model, wherein the curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction; A second CAE simulation model is constructed based on the shear test conditions, and after the curing parameters are imported, the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model are adjusted until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model; A whole vehicle collision barrier model is built based on the bonding simulation model, and a simulation is performed on the vehicle to be tested based on the whole vehicle collision barrier model.
2. The method according to claim 1, characterized in that The method of obtaining the first force displacement curve test data of the tensile test metal part after the tensile test is loaded until the adhesive fails, and obtaining the second force displacement curve test data of the shear test metal part after the tensile test is loaded until the adhesive fails, comprises: Obtain at least two sets of first force-displacement curve test data of the tensile test metal piece after at least two tensile tests are loaded until adhesive failure occurs, and obtain at least two sets of second force-displacement curve test data of the shear test metal piece after at least two tensile tests are loaded until adhesive failure occurs.
3. The method according to claim 2, characterized in that The averaging process of the force displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test includes: For the first force-displacement curve test data, determining the first maximum tension of each of the first force-displacement curve test data, calculating the average value of each of the first maximum tensions, and obtaining the first failure force data; For the second force-displacement curve test data, the second maximum tension of each of the second force-displacement curve test data is determined, and the average value of each of the second maximum tensions is calculated to obtain the second failure force data.
4. The method according to claim 1, characterized in that: The simulation analysis solver of the first CAE simulation model and the second CAE simulation model is LS-DYNA, the metal samples in the model are simulated based on shell elements of a specified grid size, and the adhesive in the model is simulated based on a specified number of weld beam elements.
5. The method according to claim 4, characterized in that The simulating the vehicle to be tested based on the whole vehicle collision barrier model includes: The actual glue area of the vehicle to be tested is determined, the number of weld beam units to be set is determined based on the actual glue area, and the vehicle to be tested is simulated based on the number of weld beam units and the whole vehicle collision barrier model.
6. The method according to claim 1, characterized in that After adjusting the S-direction shear failure force and the T-direction shear failure force of the second CAE simulation model, the method further includes: When the failure force data corresponding to the simulation of the second CAE simulation model and the second failure force data continue to fail to match, the model parameters of the first CAE simulation model are readjusted.
7. The method according to claim 1, characterized in that The method further comprises: Acquire actual test results and simulation results of the vehicle to be tested, and verify the simulation results based on the actual test results.
8. A simulation device for metal bonding failure, characterized in that: The device comprises: An acquisition module is used to acquire first force-displacement curve test data of a metal part in a tensile test, which is loaded until adhesive failure occurs in a tensile test, and to acquire second force-displacement curve test data of a metal part in a shear test, which is loaded until adhesive failure occurs in a tensile test; A processing module, used for removing abnormal data in the force-displacement curve test data and then averaging the force-displacement curve test data to obtain first failure force data corresponding to the tensile test and second failure force data corresponding to the shear test; A first construction module is used to construct a first CAE simulation model based on the tensile test conditions, adjust the model parameters of the first CAE simulation model until the failure force data of the model simulation matches the first failure force data, and record the curing parameters of the first CAE simulation model, wherein the curing parameters include the remaining parameters except the shear failure force in the S direction and the shear failure force in the T direction; A second construction module is used to construct a second CAE simulation model based on the shear test conditions, and after importing the curing parameters, adjust the shear failure force in the S direction and the shear failure force in the T direction of the second CAE simulation model until the failure force data of the model simulation matches the second failure force data, thereby obtaining a bonding simulation model; The simulation module is used to build a whole vehicle collision barrier model based on the bonding simulation model, and to simulate the vehicle to be tested based on the whole vehicle collision barrier model.
9. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the method according to any one of claims 1 to 7 are implemented.
10. A computer-readable storage medium having a computer program stored thereon, wherein the computer-readable storage medium has instructions stored therein, and when the instructions are executed on a computer or a processor, the computer or the processor executes the steps of the method according to any one of claims 1 to 7.