Wafer cleaning device and wafer thinning equipment comprising same

Abstract

The invention provides a wafer cleaning device and wafer thinning equipment comprising the same. The wafer cleaning device comprises a plurality of clamping rotating wheels used for clamping and limiting a wafer to be cleaned; the back cleaning rolling brush assembly comprises a back cleaning rolling brush and a back cleaning rolling brush support, the back cleaning rolling brush is installed on the back cleaning rolling brush support, and the back cleaning rolling brush support is used for supporting the back cleaning rolling brush and enabling the back cleaning rolling brush to be attached to the back of the wafer. The back cleaning rolling brush is a segmented rolling brush passing through the circle center of the wafer and is composed of a first rolling brush half part and a second rolling brush half part which are independent, and when the back of the wafer is cleaned, the first rolling brush half part and the second rolling brush half part are opposite in rotation direction. The wafer back cleaning device is suitable for cleaning the back of the wafer after the dicing process, cleaning of the back of the wafer and the cleaning device can be achieved, and damage of the cleaning device to the wafer is reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing; more specifically, the present invention relates to a wafer cleaning device and a wafer thinning equipment comprising the same. Background Art

[0002] After the dicing process is completed, the wafer needs to be cleaned on the back after edge thinning. After the dicing process, the main contaminants (silicon slurry) on the back of the wafer are mainly distributed on the edge and bottom of the wafer. Since the contaminants cannot be removed during the handling process, residual contaminants are formed during the process of the wafer being clamped by the clamping wheel. During the back cleaning process, the contaminants remaining between the wafer and the clamping wheel will grind against each other as the clamping wheel and the wafer rotate, causing scratches on the wafer and wear on the clamping wheel. Summary of the invention

[0003] In view of this, the present invention provides a wafer cleaning device and a wafer thinning device including the same, so as to solve or at least alleviate one or more of the above-mentioned problems and other problems existing in the prior art.

[0004] In order to achieve the above-mentioned object, a first aspect of the present invention provides a wafer cleaning device, wherein the wafer cleaning device comprises: A plurality of clamping wheels, wherein the clamping wheels are used to clamp and limit the wafer to be cleaned; and A back cleaning roller brush assembly, the back cleaning roller brush assembly comprising a back cleaning roller brush and a back cleaning roller brush bracket, the back cleaning roller brush is mounted on the back cleaning roller brush bracket, the back cleaning roller brush bracket is used to support the back cleaning roller brush and fit the back cleaning roller brush to the back of the wafer, Among them, the back cleaning roller brush is a segmented roller brush passing through the center of the wafer and is composed of an independent first roller brush half and a second roller brush half. When cleaning the back of the wafer, the first roller brush half and the second roller brush half rotate in opposite directions.

[0005] In the wafer cleaning device as described above, optionally, the back cleaning roller brush extends over the entire length of the back cleaning roller brush bracket, the first roller brush half and the second roller brush half move in opposite directions to the wafer parts they contact respectively, and the length of the first roller brush half is greater than the length of the second roller brush half.

[0006] In the wafer cleaning device as described above, optionally, the wafer cleaning device also includes an edge cleaning roller brush assembly, the edge cleaning roller brush assembly includes an edge cleaning roller brush and an edge cleaning roller brush bracket, the edge cleaning roller brush is installed on the edge cleaning roller brush bracket, and the edge cleaning roller brush bracket is used to support the edge cleaning roller brush and fit the edge cleaning roller brush to the edge of the wafer.

[0007] In the wafer cleaning device as described above, optionally, the back cleaning roller brush bracket and the edge cleaning roller brush bracket are integrally formed into a cross shape, and the edge cleaning roller brush includes a first edge cleaning roller brush and a second edge cleaning roller brush, and the first edge cleaning roller brush and the second edge cleaning roller brush are respectively arranged at both ends of the edge cleaning roller brush bracket.

[0008] In the wafer cleaning device as described above, optionally, the edge cleaning roller brush is movably mounted on the end of the edge cleaning roller brush bracket, the rotation direction of the edge cleaning roller brush is opposite to the rotation direction of the wafer, and: when the wafer edge is cleaned, the edge cleaning roller brush adheres to the edge of the wafer; when the wafer edge cleaning is finished, the edge cleaning roller brush detaches from the edge of the wafer.

[0009] In the wafer cleaning device as described above, optionally, the edge cleaning roller brush includes a first edge cleaning roller brush and a second edge cleaning roller brush, the first edge cleaning roller brush and the second edge cleaning roller brush are respectively pivoted at two ends of the edge cleaning roller brush bracket, the clamping cleaning contact points of the first edge cleaning roller brush and the second edge cleaning roller brush are connected through the center of the wafer, and the first edge cleaning roller brush and the second edge cleaning roller brush are also respectively connected to the wafer edge cleaning roller brush sleeve rod and the wafer edge cleaning roller brush guide rod, the wafer edge cleaning roller brush sleeve rod is sleeved with the wafer edge cleaning roller brush guide rod and the two can move relative to each other under the drive of the wafer edge cleaning roller brush cylinder, thereby respectively driving the first edge cleaning roller brush and the second edge cleaning roller brush to switch between adhering to the edge of the wafer and detaching from the edge of the wafer.

[0010] In the wafer cleaning device as described above, optionally: A first lever is provided at the first end of the edge cleaning roller brush bracket, the first edge cleaning roller brush is fixed to the upper end of the first lever, the lower end of the first lever is pivotally connected to the outer end of the wafer edge cleaning roller brush sleeve rod, and a second lever is provided at the second end of the edge cleaning roller brush bracket, the second edge cleaning roller brush is fixed to the upper end of the second lever, and the lower end of the second lever is pivotally connected to the outer end of the wafer edge cleaning roller brush guide rod.

[0011] In the wafer cleaning device as described above, optionally, the wafer cleaning device has a mounting base, and the back cleaning roller brush assembly and the edge cleaning roller brush assembly are mounted on the mounting base via a cleaning mechanism support seat.

[0012] In the wafer cleaning device as described above, optionally, the multiple clamping wheels include a first clamping wheel, a second clamping wheel, a third clamping wheel and a fourth clamping wheel, the first clamping wheel and the second clamping wheel are respectively mounted on the first supporting cross arm, the third clamping wheel and the fourth clamping wheel are respectively mounted on the second supporting cross arm, the first supporting cross arm and the second supporting cross arm are respectively mounted on the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider in a manner that can adaptively adjust the torsion, the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider are slidably engaged with a clamping guide rail, the clamping guide rail is fixed to the mounting base plate, and the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider are respectively located on both sides of the cleaning mechanism support seat, and the wafer is clamped and limited by moving toward each other along the clamping guide rail under the action of the clamping cylinder.

[0013] In the wafer cleaning device as described above, optionally, the first clamping wheel and the second clamping wheel are respectively slidably mounted on the first supporting cross arm via a first wheel bracket, and the third clamping wheel and the fourth clamping wheel are respectively slidably mounted on the second supporting cross arm via a second wheel bracket.

[0014] In the wafer cleaning device as described above, optionally, the clamping guide rails are respectively covered with rail protection covers between the cleaning mechanism support seat and the first wafer clamping mechanism bearing slider and between the cleaning mechanism support seat and the second wafer clamping mechanism bearing slider.

[0015] In the wafer cleaning device as described above, optionally, the cleaning mechanism support seat is in an inverted U shape, and the clamping guide rail passes through the cleaning mechanism support seat between two legs of the inverted U shape.

[0016] In the wafer cleaning device as described above, optionally, the wafer cleaning device further includes a wheel edge cleaning mechanism, which is arranged at each of the clamping wheels and is used to clean the clamping wheels. In the wafer cleaning device as described above, optionally, the wheel edge cleaning mechanism includes a wheel edge nozzle, the wheel edge nozzle has a curved portion facing the clamping wheel, nozzles are distributed on one side of the curved portion close to the clamping wheel, and the spraying direction of the nozzles converges to the clamping portion of the clamping wheel.

[0017] In the wafer cleaning device as described above, optionally, the wafer cleaning device is equipped with two wheel-side nozzles for each clamping wheel, so as to clean the clamping wheel at different angles.

[0018] In order to achieve the aforementioned objective, a second aspect of the present invention provides a wafer thinning device, wherein the wafer thinning device has a wafer cleaning device as described in any one of the aforementioned first aspects.

[0019] The present invention is suitable for cleaning the back of a wafer after a dicing process, and can clean the back of the wafer and the cleaning device itself, thereby reducing damage to the wafer caused by the cleaning device itself.

[0020] In some technical solutions of the present invention, a segmented bottom roller brush is used to clean the back of the wafer, and the rotation direction of the wafer is adapted by an axially relatively forward and reverse roller brush combination, so that the bottom of the wafer can be cleaned efficiently.

[0021] In a further technical solution of the present invention, the wafer contour can be optionally cleaned by an edge cleaning roller brush.

[0022] In a further technical solution of the present invention, the clamping wheel can be self-cleaned by a side wheel cleaning mechanism of the clamping wheel to prevent the clamping wheel from being contaminated and the contaminated particles from scratching the outer contour of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The disclosure of the present invention will become more apparent with reference to the accompanying drawings. It should be understood that these drawings are only for illustrative purposes and are not intended to limit the scope of protection of the present invention. In the drawings: Figure 1 A schematic perspective view of an embodiment of a wafer cleaning device according to the present invention is shown; Figure 2 yes Figure 1 A schematic perspective view of a wafer cleaning apparatus, showing a wafer to be cleaned in place; Figure 3 yes Figure 1 A schematic side view of a wafer cleaning apparatus; Figure 4 yes Figure 3 A partial side cross-sectional view of a wafer being cleaned by a back cleaning roller brush and an edge cleaning roller brush of a wafer cleaning device; Figure 5 yes Figure 1 A schematic diagram of a wheel edge cleaning mechanism of a wafer cleaning device, wherein a partial enlarged diagram of a wheel edge nozzle is also shown; Figures 6 to 8 Schematically shows Figure 1 The state change process of the edge cleaning roller brush assembly of the wafer cleaning device; and Fig. 9 and Fig.10 A schematic diagram showing the influence of the relative movement direction of the wafer and the cleaning roller brush on the cleaning effect.

[0024] Figure numerals: 1-wafer cleaning device; 2-clamping wheel; 3-wafer; 4-back cleaning roller brush assembly; 5-back cleaning roller brush; 51-first roller brush half; 52-second roller brush half; 6-back cleaning roller brush bracket; 7-edge cleaning roller brush assembly; 8-edge cleaning roller brush; 81-first edge cleaning roller brush; 82-second edge cleaning roller brush; 9-edge cleaning roller brush bracket; 10-wafer edge cleaning roller brush sleeve rod; 11-wafer edge cleaning roller brush guide rod; 12-wafer edge cleaning roller brush cylinder; 13-mounting base plate; 14-cleaning mechanism support seat; 15-first support cross arm; 16-second support cross arm; 17-first wafer Circular clamping mechanism carrying slider; 18-second wafer clamping mechanism carrying slider; 19-clamping guide rail; 20-clamping cylinder; 21-first clamping wheel; 22-second clamping wheel; 23-third clamping wheel; 24-fourth clamping wheel; 27-guide rail protection cover; 28-wheel cleaning mechanism; 29-bending part; 30-nozzle; 31-wheel nozzle fixing seat; 32-wheel bracket; 33-clamping wheel motor assembly; 34-clamping cylinder bracket; 35-adaptive torsion adjustment disk; 36-first roller brush half motor assembly; 37-second roller brush half motor assembly; 38-back cleaning roller brush assembly cylinder; 39-first lever. DETAILED DESCRIPTION

[0025] With reference to the accompanying drawings and specific embodiments, the structure, composition, characteristics and advantages of the wafer cleaning device of the present invention and the wafer thinning equipment including the same will be explained below in an exemplary manner. However, all descriptions should not be used to form any limitation on the present invention.

[0026] For any single technical feature described or implied in the embodiments mentioned in this document, or any single technical feature displayed or implied in the accompanying drawings, the present invention still allows any combination or deletion between these technical features (or their equivalents) without any technical obstacles, and thus it should be considered that these more embodiments according to the present invention are also within the scope of the description of this document.

[0027] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.

[0028] The present invention relates to the cleaning of the back of a wafer after a dicing process. After the dicing process, the back of the wafer will be contaminated by silicon slurry. The present invention cleans the back of the wafer by a segmented bottom roller brush mechanism, and adapts to the self-rotation direction of the wafer by an axially relatively forward and reverse roller brush combination, so that the bottom can be cleaned efficiently, and the wafer edge cleaning mechanism can be used to clean the wafer contour. At the same time, the clamping wheel is self-cleaned by a side wheel cleaning mechanism of the clamping wheel to prevent the contaminated particles from scratching the outer contour of the wafer after the clamping wheel is contaminated, thereby achieving the cleaning of the back of the wafer and the cleaning device itself, and reducing the damage of the cleaning device itself to the wafer.

[0029] Figure 1 A schematic perspective view of an embodiment of a wafer cleaning device according to the present invention is shown. Figure 2 yes Figure 1 A schematic three-dimensional diagram of a wafer cleaning apparatus is shown, showing wafers in place to be cleaned.

[0030] As shown in the figure, the wafer cleaning device 1 includes multiple clamping wheels 2, a back cleaning roller brush assembly 4, an edge cleaning roller brush assembly 7, and a wheel edge cleaning mechanism 28, and these clamping wheels 2, the back cleaning roller brush assembly 4, the edge cleaning roller brush assembly 7, and the wheel edge cleaning mechanism 28 are all installed on the mounting base 13.

[0031] When the wafer cleaning device is used to clean the back of the wafer, multiple clamping wheels 2 hold the wafer 3 in place and drive the wafer 3 to rotate, the back cleaning roller brush assembly 4 cleans the back of the wafer, the edge cleaning roller brush assembly cleans the edge of the wafer, and the wheel edge cleaning mechanism cleans the clamping wheels. Multiple clamping wheels 2 are in the same plane. When cleaning, the relative rotation direction of each rotating cleaning mechanism and the wafer is set so that at the contact point between each rotating cleaning mechanism and the back of the wafer, the contact part of each rotating cleaning mechanism and the contact part of the back of the wafer move in opposite directions. In the illustrated example, the rotating cleaning mechanism includes a back cleaning roller brush, an edge cleaning roller brush, etc. The wafer cleaning device can effectively and quickly remove contaminants at the dead angle between the clamping wheel and the wafer, can effectively prevent and avoid scratches on the edge of the wafer and scratches and wear of the clamping wheel group, reduce the number of replacement times of the clamping wheel group and improve the yield rate of the wafer.

[0032] As can be seen from the figure, the clamping wheel 2 is used to clamp and limit the wafer 3 on the back side to be cleaned. Figure 3 Specifically, a clamping portion is formed on the top of each clamping wheel 2, and the outer circumference of the clamping portion is in the shape of an inverted truncated cone. The inclined outer peripheral edge of each clamping wheel is used to clamp the wafer and hold the wafer in place to prevent the wafer from falling off during cleaning.

[0033] exist Figure 1Two groups of clamping wheels 2 are shown in the figure, the first group of clamping wheels includes two clamping wheels located on the first side of the back cleaning roller brush assembly 4, and the second group of clamping wheels includes two clamping wheels located on the second side of the back cleaning roller brush assembly 4. The first group of clamping wheels and the second group of clamping wheels are relatively movable. When the wafer 3 is to be clamped, the two groups of clamping wheels 2 move to both sides respectively to increase the distance between them, so that the wafer can be placed between the clamping wheels at various locations. After the wafer is placed between the clamping wheels, the two groups of clamping wheels can move toward the middle to reduce the distance between them, thereby clamping the wafer between the four clamping wheels. In an optional embodiment, the two groups of clamping wheels 2 can independently control the moving position. By controlling the two at the same time, efficiency and flexibility can be improved.

[0034] Among the four clamping wheels 2 shown in the figure, at least one clamping wheel 2 can be an active wheel, and the other clamping wheels 2 are driven wheels. When the wafer 3 is placed between the clamping wheels 2 and clamped in place by the clamping wheels 2, the active wheel can be started, and the four clamping wheels 2 rotate in the same direction, driving the clamped wafer to rotate, and the wafer back cleaning roller brush and edge cleaning roller brush at the bottom of the wafer, the wheel edge cleaning mechanism, etc. start to work, and the back of the wafer is cleaned.

[0035] More specifically, if Figure 1 As shown in , the first group of clamping wheels and the second group of clamping wheels may include a first clamping wheel 21, a second clamping wheel 22, a third clamping wheel 23 and a fourth clamping wheel 24. It should be pointed out here that in an optional embodiment, these first clamping wheel 21, the second clamping wheel 22, the third clamping wheel 23 and the fourth clamping wheel 24 can be independently provided, and each can be independently controlled to adjust the position to clamp the wafer, which should also fall within the scope of the present invention.

[0036] according to Figure 1 In the embodiment of the present invention, the first clamping wheel 21 and the second clamping wheel 22 are respectively mounted on the first supporting cross arm 15, and the third clamping wheel 23 and the fourth clamping wheel 24 are respectively mounted on the second supporting cross arm 16. At this time, the first supporting cross arm 15 and the second supporting cross arm 16 are each capable of movable adjustment and / or rotational adjustment.

[0037] Specifically, the first support cross arm 15 and the second support cross arm 16 are respectively mounted on the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 in a manner capable of adaptively adjusting torsion. The figure shows an adaptive torsion adjustment disk, which provides adaptive rotational freedom for the first support cross arm 15 and the second support cross arm 16. When the first support cross arm 15 and the second support cross arm 16 move toward the wafer, once each clamping wheel 2 reaches the wafer, it will adaptively rotate and adjust so that all four clamping wheels 2 engage the outer periphery of the wafer. The adaptive torsion adjustment disk is composed of two disk components that can rotate relative to each other and are connected up and down.

[0038] At the same time, the first wafer clamping mechanism bearing slider 17 and the second wafer clamping mechanism bearing slider 18 are slidably engaged with the clamping guide rail 19. The clamping guide rail 19 is fixed to the mounting base plate 13. The first wafer clamping mechanism bearing slider 17 and the second wafer clamping mechanism bearing slider 18 are respectively located on both sides of the cleaning mechanism support seat 14, and move toward each other along the clamping guide rail 19 under the action of the clamping cylinder 20 to clamp and limit the wafer 3. The clamping cylinder 20 can be fixed to the mounting base plate 13 through the clamping cylinder bracket 34, and the clamping cylinder 20 is installed on the clamping cylinder bracket 34. As shown in the figure, on both sides of the wafer cleaning device 1, a supporting cross arm, an adaptive torsion adjustment disk, and a bearing slider are provided for the first group of clamping wheels and the second group of clamping wheels, respectively, and are located on the mounting base plate 13 at both ends.

[0039] Optionally, the first clamping wheel 21 and the second clamping wheel 22 are slidably mounted on the first supporting cross arm 15 through a first wheel bracket, and the third clamping wheel 23 and the fourth clamping wheel 24 are slidably mounted on the second supporting cross arm 16 through a second wheel bracket. In order to clarify the positions of the first wheel bracket and the second wheel bracket, a wheel bracket 32 ​​is schematically shown in the figure. Through such a setting, the clamping wheel can be adjusted as needed to adapt to wafers of different sizes.

[0040] As can be seen from the figure, the back cleaning roller brush assembly 4 includes a back cleaning roller brush 5 and a back cleaning roller brush bracket 6, and the back cleaning roller brush 5 is installed on the back cleaning roller brush bracket 6, and the back cleaning roller brush bracket 6 is used to support the back cleaning roller brush 5 and fit the back cleaning roller brush 5 to the back of the wafer 3. After the back cleaning roller brush 5 is fitted to the back of the wafer 3, when the cleaning starts, the back cleaning roller brush 5 and the wafer 3 start to rotate, and the two produce reverse relative movement, so that the back cleaning roller brush brushes and removes the contaminants on the back of the wafer. The motor assembly of the back cleaning roller brush is arranged at its end and is coaxially arranged with the back cleaning roller brush. Its diameter is smaller than the back cleaning roller brush, so that it will not interfere with the wafer during cleaning.

[0041] The back cleaning roller brush 5 is a segmented roller brush that passes through the center of the wafer, i.e., is aligned with the wafer diameter, and is composed of an independent first roller brush half 51 and a second roller brush half 52. In an optional embodiment, the central rotating shaft of the first roller brush half 51 and the central rotating shaft of the second roller brush half 52 can be connected to each other, or can be the same central rotating shaft. When cleaning the back of the wafer, the first roller brush half 51 and the second roller brush half 52 rotate in opposite directions. The first roller brush half 51 and the second roller brush half 52 are driven by the first roller brush half motor assembly 36 and the second roller brush half motor assembly 37 located at the end, respectively. As shown in the figure, the first roller brush half motor assembly 36 and the second roller brush half motor assembly 37 extend axially outward from the ends of the first roller brush half 51 and the second roller brush half 52, respectively, and the diameters are smaller than the diameters of the first roller brush half 51 and the second roller brush half 52, respectively, so as to avoid interference with the wafer during the cleaning process.

[0042] In an optional embodiment, the first roller brush half 51 and the second roller brush half 52 can be arranged to move in opposite directions to the wafer parts they contact, and: the lengths of the first roller brush half 51 and the second roller brush half 52 are equal and are respectively located on both sides of the rotation center of the back cleaning roller brush bracket 6, or the length of the first roller brush half 51 is greater than the length of the second roller brush half 52. It can also be seen from the figure that the first roller brush half 51 and the second roller brush half 52 are separated from each other, and the first roller brush half 51 and the second roller brush half 52 have the same diameter and are aligned with the center of the circle, so that the back cleaning of the wafer can be carried out simultaneously. By setting it in this way, it is possible to avoid leaving uncleaned contaminants at the center of the circle. Even if part of the wafer is not cleaned by the second roller brush half 52, the first roller brush half 51 will still perform effective cleaning, which is conducive to ensuring the back cleaning quality of the wafer.

[0043] The wafer cleaning device uses a segmented wafer back cleaning roller brush to clean the back of the wafer in different areas, and the counter-rotation in the opposite direction of the wafer rotation ensures the cleaning effect and cleaning of dead corners, ensuring the effective cleaning area and cleaning effect of the wafer back. At the same time, the edge cleaning mechanism realizes the reverse cleaning of the wafer edge relative to the wafer rotation direction, improving the cleaning effect in the same working space.

[0044] In an optional embodiment, the shorter second roller brush half 52 may be omitted as needed, and only the longer first roller brush half 51 may be retained, so that the overall structure of the wafer cleaning device 1 is simpler.

[0045] As can be seen from the figure, the edge cleaning roller brush assembly 7 includes an edge cleaning roller brush 8 and an edge cleaning roller brush bracket 9. The edge cleaning roller brush 8 is installed on the edge cleaning roller brush bracket 9. The edge cleaning roller brush bracket 9 is used to support the edge cleaning roller brush 8 and fit the edge cleaning roller brush 8 to the edge of the wafer 3 to facilitate cleaning the outer peripheral edge of the wafer.

[0046] The edge cleaning roller brush 8 is movably mounted on the end of the edge cleaning roller brush bracket 9, and the rotation direction of the edge cleaning roller brush 8 is opposite to the rotation direction of the wafer 3, and: when cleaning the edge of the wafer, the edge cleaning roller brush 8 is attached to the edge of the wafer 3; when the edge cleaning of the wafer is finished, the edge cleaning roller brush 8 is separated from the edge of the wafer 3. In this way, when taking and placing the wafer, the edge cleaning roller brush 8 can be moved away first; when cleaning, the edge cleaning roller brush 8 is moved to the cleaning position, which can effectively prevent accidents when taking and placing the wafer, causing accidents such as wafer falling, clamping deviation, and fragmentation.

[0047] The edge cleaning roller brush 8 may include a first edge cleaning roller brush 81 and a second edge cleaning roller brush 82, the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 are respectively pivotally connected to the two ends of the edge cleaning roller brush bracket 9, and the clamping cleaning contact points of the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 are connected through the center of the wafer. It should be noted that in different embodiments, other numbers of edge cleaning roller brushes may be set, such as but not limited to one, three, four or even more.

[0048] In the illustrated example, the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 can be connected to the wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11 respectively, and the wafer edge cleaning roller brush sleeve rod 10 is sleeved with the wafer edge cleaning roller brush guide rod 11 and the two can move relative to each other under the drive of the wafer edge cleaning roller brush cylinder 12, thereby driving the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 to switch between fitting the edge of the wafer 3 and separating from the edge of the wafer 3. It can be understood that in an optional embodiment, the position switching of each edge cleaning roller brush can also be controlled separately; in the illustrated example, the sleeve rod and the guide rod are used to associate different edge cleaning roller brushes, so that each edge cleaning roller brush can switch positions synchronously, avoiding operation accidents caused by the asynchronous switching positions of different edge cleaning roller brushes, which affects the normal production.

[0049] As shown in the figure, the back cleaning roller brush bracket 6 and the edge cleaning roller brush bracket 9 are integrally formed into a cross shape. The wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11 are parallel to the edge cleaning roller brush bracket 9 and are spatially located below the plane where the aforementioned intersection is located. It can also be seen that the back cleaning roller brush 5 extends over the entire length of the back cleaning roller brush bracket 6, and the edge cleaning roller brush 8 includes a first edge cleaning roller brush 81 and a second edge cleaning roller brush 82, and the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 are respectively arranged at both ends of the edge cleaning roller brush bracket 9.

[0050] Furthermore, it can be seen from the figure that the first end of the edge cleaning roller brush bracket 9 is provided with a first lever 39, the upper end of the first lever 39 is fixed with the first edge cleaning roller brush 81, the lower end of the first lever 39 is pivotally connected to the outer end of the wafer edge cleaning roller brush sleeve rod 10, and the second end of the edge cleaning roller brush bracket 9 is provided with a second lever (not marked), the upper end of the second lever is fixed with the second edge cleaning roller brush 82, and the lower end of the second lever is pivotally connected to the outer end of the wafer edge cleaning roller brush guide rod 11.

[0051] In an optional embodiment, according to specific needs, an independent back cleaning roller brush bracket and an independent edge cleaning roller brush bracket can be set. At this time, the back cleaning roller brush bracket and the edge cleaning roller brush bracket can be in different horizontal planes, separated up and down to avoid interference with each other.

[0052] Combination Figure 2 and Figure 5As shown, the main function of the clamping wheel 2 is to clamp and limit the wafer, and in this example, they work in an even number of pairs. Among them, the clamping wheel motor assembly 33 provides the self-rotation power for the clamping wheel 2, and the unit has been waterproofed. During the self-rotation of the clamping wheel 2, the back and edge roller brushes of the wafer cannot clean the clamping wheel 2, causing the wafer to clamp the contaminants in the dead angle of contact with it in the initial state of being uncleaned, and the edge and body of the wafer will be scratched during the self-rotation of the wafer. The clamping wheel 2 is cleaned by adding a wheel edge cleaning mechanism 28, such as a wheel edge nozzle. As shown in FIG. Figure 5 As shown in FIG. 1 , the wheel side spraying position is located at the outer side of the diagonal, and the clamping wheel 2 is sprayed without affecting the wafer handling action of the handling system. The spraying angle is shown in FIG. Figure 5 In the partial enlarged view of II, the main easily contaminated areas of the clamping wheel 2 are fully covered by spraying, so as to effectively prevent and remove the pollutants remaining in the dead corners and avoid scratches on the wafer edge and the clamping wheel.

[0053] As can be seen from the figure, the wheel cleaning mechanism 28 is arranged at each of the clamping wheels 2 for cleaning the clamping wheels 2. In the illustrated example, four wheel cleaning mechanisms 28 are shown, which clean each clamping wheel 2 respectively. The wheel cleaning mechanism 28 can be in different forms, such as but not limited to cleaning with cleaning liquid, cleaning gas purging, roller brush contact cleaning, etc. In the illustrated embodiment, each wheel cleaning mechanism 28 includes two wheel spray nozzles, such as Figure 1 As shown in the figure, they are respectively arranged at the wheel bracket 32 ​​through the wheel side nozzle fixing seat 31, and each wheel side nozzle can spray cleaning liquid to the clamping wheel 2 to clean the clamping wheel.

[0054] The wafer cleaning device prevents wafer edge scratches. It can effectively and quickly remove contaminants at the dead corners of the clamping wheel and the wafer through the wheel edge cleaning mechanism, effectively preventing and avoiding wafer edge scratches and scratches and wear of the clamping wheel group, reducing the number of replacement times of the clamping wheel group and improving the wafer yield.

[0055] The wafer cleaning device 1 has a mounting base plate 13 .

[0056] The back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7 are mounted on the mounting base 13 via a cleaning mechanism support seat 14. As shown in the figure, the cleaning mechanism support seat 14 is in an inverted U shape, and the clamping guide rail 19 passes through the cleaning mechanism support seat 14 between the two legs of the inverted U shape. Through the mounting base 13, the wafer cleaning device 1 can be mounted to a wafer thinning device (not shown). The cleaning mechanism support seat 14 can be fixed to the mounting base 13; in an optional embodiment, it can also be configured to be able to move and adjust the position along the clamping guide rail 19. The back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7 are both mounted on the cleaning mechanism support seat 14.

[0057] The clamping wheels 2 are mounted on the clamping guide rails 19 on the mounting base plate 13 through the supporting cross arms, the adaptive torsion adjustment disk 35, the first wafer clamping mechanism carrying slider 17, the second wafer clamping mechanism carrying slider 18, etc., and are located on both sides of the back cleaning roller brush assembly 4 and the edge cleaning roller brush assembly 7. The clamping cylinder 20 located on the clamping guide rails 19 can adjust the moving position of the clamping wheel 2 along the clamping guide rails 19, and the adaptive torsion adjustment disk 35 enables the clamping wheel 2 to adaptively clamp the wafer in place.

[0058] Combination Figure 1 and Figure 2 According to this embodiment, when the back cleaning process is performed on the wafer 3, the four clamping wheels 2 on both sides move toward each other along the clamping guide rail 19 through the action of the clamping cylinder 20 to clamp and limit the wafer 3 ( Figure 2 The middle arrow is a clamping action diagram). The back cleaning roller brush assembly cylinder 38 lifts the back cleaning roller brush bracket 6 to fit the first roller brush half 51 and the second roller brush half 52 to the back of the wafer to clean the back of the wafer. The wheel edge cleaning mechanism 28 continuously sprays the clamping wheel 2 to prevent contaminants on the back of the wafer from remaining in the edge seam of the clamping wheel 2, resulting in a cleaning dead corner at the edge of the wafer. The edge cleaning roller brush 8 is lifted by the wafer edge cleaning roller brush cylinder 12 to make the wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11 move relative to each other, driving the edge cleaning roller brush 8 to fit the wafer edge to clean the wafer edge contour. The two ends of the guide rail protective cover 27 below the cleaning mechanism support seat 14 are respectively fixed on the first wafer clamping mechanism bearing slider 17 and the second wafer clamping mechanism bearing slider 18 and fully cover the clamping guide rail 19 below it to prevent contaminants from splashing onto the guide rail during the cleaning process and causing the guide rail to get stuck. The four clamping wheels 2 rotate in the same direction, driving the clamped wafer to rotate, and the bottom cleaning brush and the contour cleaning brush start to work to clean the back of the wafer.

[0059] According to this embodiment, when the wafer is cleaned, the wafer rotates, and the back cleaning roller brush 5 rolls and rotates in contact with the back of the wafer, and relative motion is generated between the two to remove contaminants. The two roller brush halves cooperate so that their positions relative to the wafer fully cover the wafer, and there is no inaccessible cleaning dead corner. At the same time, the roller brushes rotate in different directions on both sides of the wafer rotation center, and both sides can be thoroughly cleaned.

[0060] Figure 3 yes Figure 1 Schematic side view of a wafer cleaning apparatus.

[0061] Figure 3 It is more clearly shown in the figure that the clamping guide rails 19 are covered with rail protection covers 27 between the cleaning mechanism support seat 14 and the first wafer clamping mechanism bearing slider 17 and between the cleaning mechanism support seat 14 and the second wafer clamping mechanism bearing slider 18 respectively.

[0062] The rail protection cover 27 may be an accordion-type protection cover, which is made of a folding flexible material, and its two ends may be fixed to the first wafer clamping mechanism bearing slider 17 and the second wafer clamping mechanism bearing slider 18 respectively, and can be extended and retracted as needed and fully cover the clamping guide rail 19 below the cleaning mechanism support seat 14 to prevent liquid and contaminants from splashing onto the clamping guide rail during the cleaning process and causing the rail to become stuck. The rail waterproof cover 27 may be integral, passing through the bottom of the cleaning mechanism support seat 14, and its two ends may be fixed to the first wafer clamping mechanism bearing slider 17 and the second wafer clamping mechanism bearing slider 18 respectively.

[0063] In an optional embodiment, the guide rail protection cover 27 can also be divided into two sections, one section is connected between the cleaning mechanism support seat 14 and the first wafer clamping mechanism supporting slider 17, and the other section is connected between the cleaning mechanism support seat 14 and the second wafer clamping mechanism supporting slider 18.

[0064] It can also be seen from the figure that a distance is maintained between the guide rail protective cover 27 and the clamping guide rail 19 to prevent the guide rail protective cover 27 from getting stuck on the clamping guide rail 19 and causing jamming when the first wafer clamping mechanism supporting slider 17 and the second wafer clamping mechanism supporting slider 18 move toward the cleaning mechanism support seat 14.

[0065] in addition, Figure 3 The figure also shows more clearly the components of the wafer cleaning device 1. For example, the figure shows that two clamping cylinders 20 are fixed to the two ends of the mounting base plate 13 through clamping cylinder brackets 34, respectively, which respectively control the sliding movement of the first wafer clamping mechanism carrying slider 17 and the second wafer clamping mechanism carrying slider 18 on the clamping guide rail 19. In addition, the figure also shows the clamping wheel, the clamping wheel motor assembly, the wheel edge cleaning mechanism, etc.

[0066] Figure 4 yes Figure 1 A partial side cross-sectional view of a wafer being cleaned by a back cleaning brush and an edge cleaning brush of a wafer cleaning apparatus.

[0067] The figure shows the direction of rotation of the first brush half 51 and the second brush half 52 of the back cleaning brush 5 along their longitudinal axis, the direction of rotation of the wafer 3 along an axis perpendicular to its center, and the direction of rotation of the first edge cleaning brush 81 and the second edge cleaning brush 82 along their longitudinal axis.

[0068] from Figure 4 It can be seen that in this example, the first roller brush half 51 and the second roller brush half 52 of the back cleaning roller brush 5 are not of equal length, and the length of the first roller brush half 51 is greater than the length of the second roller brush half 52. The contact portion of the back cleaning roller brush 5 with the wafer 3 coincides with a diameter of the wafer and passes through the center of the wafer 3. In addition, the first roller brush half 51 and the second roller brush half 52 rotate in opposite directions along the axis, but since the first roller brush half 51 and the second roller brush half 52 are mainly located on both sides of the center of the wafer 3, respectively, the rotation direction of the wafer 3 makes the movement direction of the first roller brush half 51 and the second roller brush half 52 at the contact with the wafer 3 basically opposite to the corresponding position on the wafer 3. Although the first roller brush half 51 has a portion extending beyond the center of the wafer in the same direction of movement as the wafer, the corresponding position on the wafer can be cleaned when it is brushed by the other side portion of the first roller brush half 51 that does not extend through the center of the wafer, so no undesirable contaminant residue will be formed on the back of the wafer.

[0069] The figure also shows the rotation direction of the edge cleaning brush. It can be seen from the figure that the first edge cleaning brush 81, the second edge cleaning brush 82 and the wafer 3 all rotate clockwise, so that the positions where the first edge cleaning brush 81 and the second edge cleaning brush 82 contact the wafer 3 are different from the movement direction of the wafer 3, which is more conducive to the brushing effect on the outer circumferential edge of the wafer 3.

[0070] like Figure 4As shown, the cleaning effect of the main area on the back of the wafer 3 is achieved by adjusting the rotation direction of the first roller brush half 51 and the second roller brush half 52 relative to the wafer 3. As shown in the figure, when the wafer 3 rotates clockwise, the first roller brush half 51 rotates counterclockwise and the second roller brush half 52 rotates clockwise at the same visual angle. When the wafer 3 rotates counterclockwise, the first roller brush half 51 rotates clockwise and the second roller brush half 52 rotates counterclockwise at the same visual angle. At the same time, the effective cleaning axial distance of the bottom first roller brush half 51 is slightly longer than that of the second roller brush half 52, and passes the center of the wafer 3. The purpose of cleaning the main cleaning area without dead angles is achieved through the structure and action of the bottom roller brush. A pair of edge cleaning roller brushes, namely the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82, are distributed on the edge of the wafer. The line connecting the clamping cleaning contact points passes through the center of the wafer, which has balanced the stress effect on the wafer 3. The first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 on both sides rotate in the opposite direction to the wafer 3 , so as to achieve the cleaning operation of edge contaminants.

[0071] Figure 5 yes Figure 1 Schematic diagram of the wheel cleaning mechanism of the wafer cleaning device, wherein a partial enlarged diagram of the wheel nozzle is also shown. Figure 5 A detail I of the center wheel side nozzle is shown by an enlarged left side II view.

[0072] In different embodiments, the wheel edge cleaning mechanism 28 may be a spray cleaning liquid, a cleaning brush, etc. In the illustrated example, a wheel edge spray pipe is included, which can continuously spray cleaning liquid to the clamping part of the clamping wheel to prevent contaminants on the back of the wafer from remaining at the edge of the clamping wheel, thereby forming a cleaning dead corner at the edge of the wafer.

[0073] The wafer cleaning device can prevent scratches on the edge of the wafer. The wheel edge cleaning mechanism can effectively and quickly prevent and remove contaminants at the dead corners of the clamping wheel and the wafer, thereby avoiding scratches on the edge of the wafer contour and wear on the contact position of the clamping wheel during the relative rotation of the wafer and the clamping wheel.

[0074] The wheel-side spray pipe has a curved portion 29 facing the clamping wheel 2, and nozzles 30 are distributed on one side of the curved portion 29 close to the clamping wheel 2, and the spray direction of the nozzles 30 is directly facing the clamping wheel 2. As can be seen from the figure, the nozzles 30 form a row, and due to the bending of the curved portion 29, all the nozzles converge to spray the clamping portion of the clamping wheel. In an optional embodiment, multiple wheel-side spray pipes can be provided for a clamping wheel, and continuous cleaning can be performed at different circumferential positions of different clamping wheels.

[0075] In the illustrated example, combined Figure 1It can be known that the wafer cleaning device 1 is equipped with two wheel-side nozzles for each clamping wheel 2, so as to clean the clamping wheel 2 at different angles.

[0076] Figures 6 to 8 Schematically shows Figure 1 The state change process of the edge cleaning roller brush assembly of the wafer cleaning device.

[0077] As shown in the figure, the wafer edge cleaning roller brush cylinder 12 is fixed on the cleaning mechanism support seat 14. Figure 6 As shown in the figure, the wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11 are retracted, so that the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 are driven to open through the lever structure at both ends, and the wafer to be cleaned can be received at this time. Figure 7 In the process, the wafer edge cleaning brush sleeve rod 10 and the wafer edge cleaning brush guide rod 11 are driven to extend, so that the first edge cleaning brush 81 and the second edge cleaning brush 82 are retracted through the lever structure at both ends, so that the wafer can be kept in place. Figure 8 In the middle are the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 which are completely retracted. When a wafer is placed on the back cleaning roller brush assembly, the first edge cleaning roller brush 81 and the second edge cleaning roller brush 82 will be close to or fit the outer peripheral edge of the wafer respectively. When the wafer and the edge cleaning roller brushes rotate at the same time, the edge of the wafer can be cleaned.

[0078] In this example, the operation process of the edge cleaning roller brush is as follows: when the transport mechanism transports the wafer to the cleaning area of ​​the wafer cleaning device of the present invention, the wafer edge cleaning mechanism is in Figure 6 In the state shown in the figure, the edge cleaning roller brush 8 moves relative to the wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11 under the action of the wafer edge cleaning roller brush cylinder 12, so that the edge cleaning roller brush 8 makes an avoidance action to prevent interference when the upper transport mechanism transports the wafer down. When the clamping wheel group completes the clamping action on the wafer, Figure 7 As shown in , the edge cleaning roller brush 8 moves toward each other through the wafer edge cleaning roller brush sleeve rod 10 and the wafer edge cleaning roller brush guide rod 11 under the action of the wafer edge cleaning roller brush cylinder 12, so that the edge cleaning roller brush 8 performs a clamping action. Figure 8 In the state, after the edge cleaning roller brush 8 is clamped stably, it rotates in the opposite direction to the rotation direction of the wafer to clean the edge of the wafer.

[0079] Fig. 9 and Fig.10 A schematic diagram showing the influence of the relative movement direction of the wafer and the cleaning roller brush on the cleaning effect.

[0080] The figure shows a wafer 3, a clamping wheel 2 and a back cleaning roller brush 5. The wafer 3 rotates in a horizontal plane, and the rotation direction is indicated by the arrow on it. The back cleaning roller brush 5 rotates along an axis perpendicular to the paper surface, and its rotation direction is indicated by the arrow on the back cleaning roller brush 5. It can be seen from the figure that the operating state of the back cleaning roller brush 5 relative to the wafer 3 can be Fig. 9 The two rotate in the same direction and Fig.10 According to the figure, relatively speaking, when the two relative running directions are opposite, the back side of the wafer 3 passing through the back cleaning roller brush 5, such as Fig. 9 and Fig.10 The contaminants on the back side of the wafer on the right side of the middle back cleaning roller brush 5 will be cleaned more thoroughly, which can more effectively avoid the situation where some contaminants remain on the back side of the wafer after brushing.

[0081] The present invention also provides a wafer thinning device, which may have a wafer cleaning apparatus as described in any one of the aforementioned embodiments.

[0082] The technical solution of the present invention is suitable for cleaning the back of the wafer after the dicing process, and can prevent the back of the wafer from being contaminated by silicon slurry after the dicing process. Some technical solutions of the present invention clean the back of the wafer by a segmented back cleaning roller brush, and adapt to the self-rotation direction of the wafer by an axially relatively forward and reverse roller brush combination, so that it can efficiently clean the bottom. In a further technical solution of the present invention, the wafer contour is cleaned by a wafer edge cleaning mechanism; at the same time, the clamping wheel is self-cleaned by a side wheel cleaning mechanism of the clamping wheel to prevent the contaminated particles from scratching the outer contour of the wafer after the clamping wheel is contaminated, thereby achieving cleaning of the back of the wafer and the cleaning device itself, and reducing the damage to the wafer by the cleaning device itself.

[0083] The technical scope of the present invention is not limited to the contents of the above description. Those skilled in the art can make various deformations and modifications to the above implementation without departing from the technical idea of ​​the present invention, and these deformations and modifications should all fall within the scope of the present invention.

Claims

1. A wafer cleaning device, characterized in that: The wafer cleaning device comprises: A plurality of clamping wheels, wherein the clamping wheels are used to clamp and limit the wafer to be cleaned; and A back cleaning roller brush assembly, the back cleaning roller brush assembly comprising a back cleaning roller brush and a back cleaning roller brush bracket, the back cleaning roller brush is mounted on the back cleaning roller brush bracket, the back cleaning roller brush bracket is used to support the back cleaning roller brush and fit the back cleaning roller brush to the back of the wafer, Among them, the back cleaning roller brush is a segmented roller brush passing through the center of the wafer and is composed of an independent first roller brush half and a second roller brush half. When cleaning the back of the wafer, the first roller brush half and the second roller brush half rotate in opposite directions.

2. The wafer cleaning device according to claim 1, characterized in that: The back cleaning roller brush extends over the entire length of the back cleaning roller brush bracket, the first roller brush half and the second roller brush half move in opposite directions to the wafer parts they contact, and the length of the first roller brush half is greater than the length of the second roller brush half.

3. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device also includes an edge cleaning roller brush assembly, which includes an edge cleaning roller brush and an edge cleaning roller brush bracket. The edge cleaning roller brush is installed on the edge cleaning roller brush bracket, and the edge cleaning roller brush bracket is used to support the edge cleaning roller brush and fit the edge cleaning roller brush to the edge of the wafer.

4. The wafer cleaning device according to claim 3, characterized in that: The back cleaning roller brush bracket and the edge cleaning roller brush bracket are integrally formed into a cross shape, and the edge cleaning roller brush includes a first edge cleaning roller brush and a second edge cleaning roller brush, and the first edge cleaning roller brush and the second edge cleaning roller brush are respectively arranged at two ends of the edge cleaning roller brush bracket.

5. The wafer cleaning device according to claim 3, characterized in that: The edge cleaning roller brush is movably mounted on the end of the edge cleaning roller brush bracket, and the rotation direction of the edge cleaning roller brush is opposite to the rotation direction of the wafer, and: when the wafer edge is cleaned, the edge cleaning roller brush adheres to the edge of the wafer; when the wafer edge cleaning is finished, the edge cleaning roller brush is detached from the edge of the wafer.

6. The wafer cleaning device according to claim 5, characterized in that: The edge cleaning roller brush includes a first edge cleaning roller brush and a second edge cleaning roller brush, the first edge cleaning roller brush and the second edge cleaning roller brush are respectively pivotally connected to the two ends of the edge cleaning roller brush bracket, the clamping cleaning contact points of the first edge cleaning roller brush and the second edge cleaning roller brush are connected through the center of the wafer, and the first edge cleaning roller brush and the second edge cleaning roller brush are also respectively connected to the wafer edge cleaning roller brush sleeve rod and the wafer edge cleaning roller brush guide rod, the wafer edge cleaning roller brush sleeve rod is sleeved with the wafer edge cleaning roller brush guide rod and the two can move relative to each other under the drive of the wafer edge cleaning roller brush cylinder, thereby respectively driving the first edge cleaning roller brush and the second edge cleaning roller brush to switch between adhering to the edge of the wafer and detaching from the edge of the wafer.

7. The wafer cleaning device according to claim 6, characterized in that: A first lever is provided at the first end of the edge cleaning roller brush bracket, the first edge cleaning roller brush is fixed to the upper end of the first lever, the lower end of the first lever is pivotally connected to the outer end of the wafer edge cleaning roller brush sleeve rod, and a second lever is provided at the second end of the edge cleaning roller brush bracket, the second edge cleaning roller brush is fixed to the upper end of the second lever, and the lower end of the second lever is pivotally connected to the outer end of the wafer edge cleaning roller brush guide rod.

8. The wafer cleaning device according to claim 3, characterized in that: The wafer cleaning device has a mounting base plate, and the back cleaning roller brush assembly and the edge cleaning roller brush assembly are mounted on the mounting base plate through a cleaning mechanism support seat.

9. The wafer cleaning device according to claim 8, characterized in that: The multiple clamping wheels include a first clamping wheel, a second clamping wheel, a third clamping wheel and a fourth clamping wheel, the first clamping wheel and the second clamping wheel are respectively mounted on the first supporting cross arm, the third clamping wheel and the fourth clamping wheel are respectively mounted on the second supporting cross arm, the first supporting cross arm and the second supporting cross arm are respectively mounted on the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider in a manner that can adaptively adjust the torsion, the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider are slidably engaged with a clamping guide rail, the clamping guide rail is fixed to the mounting base plate, and the first wafer clamping mechanism supporting slider and the second wafer clamping mechanism supporting slider are respectively located on both sides of the cleaning mechanism support seat, and the wafer is clamped and limited by moving toward each other along the clamping guide rail under the action of the clamping cylinder.

10. The wafer cleaning device according to claim 9, characterized in that: The first clamping wheel and the second clamping wheel are respectively slidably mounted on the first supporting cross arm via a first wheel bracket, and the third clamping wheel and the fourth clamping wheel are respectively slidably mounted on the second supporting cross arm via a second wheel bracket.

11. The wafer cleaning device according to claim 9, characterized in that: The clamping guide rails are respectively covered with rail protection covers between the cleaning mechanism support seat and the first wafer clamping mechanism bearing slider and between the cleaning mechanism support seat and the second wafer clamping mechanism bearing slider.

12. The wafer cleaning device according to claim 9, characterized in that: The cleaning mechanism support seat is in an inverted U shape, and the clamping guide rail passes through the cleaning mechanism support seat between two legs of the inverted U shape.

13. The wafer cleaning device according to claim 1, characterized in that: The wafer cleaning device also includes a wheel edge cleaning mechanism, which is arranged at each of the clamping wheels and is used to clean the clamping wheels.

14. The wafer cleaning device according to claim 13, characterized in that: The wheel cleaning mechanism comprises a wheel spray pipe having a curved portion facing the clamping wheel, and nozzles are distributed on one side of the curved portion close to the clamping wheel, and the spraying directions of the nozzles converge to the clamping portion of the clamping wheel.

15. The wafer cleaning device according to claim 14, characterized in that: The wafer cleaning device is equipped with two wheel-side nozzles for each clamping wheel, so as to clean the clamping wheel at different angles.

16. A wafer thinning device, characterized in that: The wafer thinning equipment has a wafer cleaning device as claimed in any one of claims 1 to 15.

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