Chip package substrate stacking device and operation method thereof

Abstract

The invention belongs to the technical field of chip packaging, and discloses a chip packaging substrate stacking device and an operation method thereof.The chip packaging substrate stacking device comprises a base, a stand column is fixedly arranged at the top of the base, a sleeve is fixedly arranged at the top of the stand column, and a rotary communication part is rotationally installed in the sleeve. The rotating positions of the adsorption grabbing assemblies on the two sides are driven to be switched in cooperation with the rotating communication part, under the vacuumizing effect of the vacuum suction assembly, the states of the adsorption grabbing assemblies in different positions are automatically controlled, it is guaranteed that the adsorption grabbing assemblies complete adsorption grabbing of an upper-layer base plate on the top of the first feeding box, and the efficiency is improved. Compared with the prior art, the multi-layer substrate stacking device has the advantages that the multi-layer substrate stacking device is simple in feeding and positioning operation of different substrates, combined stacking is quickly realized, manual auxiliary manual adjustment is not needed, the efficiency and the precision are greatly improved especially for stacking processing of multiple layers of substrates, and the use effect is good.

Description

Technical Field

[0001] The present invention belongs to the technical field of chip packaging, and in particular relates to a chip packaging substrate stacking device and an operating method thereof. Background Art

[0002] The chip packaging substrate stacking device is a device used in the electronic component packaging process. Its main function is to stack different levels of substrates (such as circuit boards, chip carriers, etc.) to achieve high-density integration and high-performance packaging solutions.

[0003] The chip packaging substrate stacking device in the prior art, during use, when performing multi-layer packaging stacking, often needs to first position a group of substrates, and apply glue on the bottom, and then prevent other substrates from bonding and press them in turn, and then complete the multi-level stacking. In fact, it is necessary to continuously position, place and apply glue on the multi-layer substrates. The process is relatively complicated and the automation difficulty is low. It often needs to cooperate with manual adjustment and processing to carry out continuous layer stacking. The actual operation is cumbersome, the stacking efficiency is low, and the practical effect is not good. Summary of the invention

[0004] The object of the present invention is to provide a chip packaging substrate stacking device and an operating method thereof to solve the problems raised in the above background technology.

[0005] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a chip packaging substrate stacking device and an operating method thereof, comprising a base, a column is fixedly provided on the top of the base, a sleeve is fixedly provided on the top of the column, a rotating connecting part is rotatably installed in the sleeve, adsorption and grasping components are fixedly provided at both ends of the rotating connecting part, a vacuum suction component is fixedly provided on the top of the base, the vacuum suction component is intermittently connected with the adsorption and grasping component, a No. 1 loading box and a No. 2 loading box are respectively fixedly provided on the top of the base, the No. 1 loading box and the No. 2 loading box are symmetrically distributed on both sides of the column, a pushing mechanism is provided inside the No. 1 loading box and the No. 2 loading box, and a gluing component is fixedly provided on the top of the adsorption and grasping component.

[0006] Preferably, the rotating connecting part includes a rotating shaft, a gear 1, a power unit, a connecting sleeve and a connecting hole. The rotating shaft is rotatably installed in the sleeve through a bearing. The gear 1 is fixedly sleeved on the outer surface of the rotating shaft. The power unit is fixed on the outside of the sleeve. The power unit is meshed with gear 1 and drives gear 1 to rotate. The connecting sleeve is fixedly sleeved on the top of the rotating shaft. The connecting hole is symmetrically opened on both sides of the connecting sleeve. One end of the connecting hole is located on the side of the connecting sleeve, and the other end is located at the bottom of the connecting sleeve. The power unit includes a motor and gear 2. The motor drives gear 2 to rotate, and gear 2 is meshed with gear 1.

[0007] Preferably, the adsorption grabbing assembly includes an adsorption plate, a curved tube arm, an intermediate cavity and a suction hole, one end of the curved tube arm is fixedly connected to the adsorption plate, and the other end is fixedly connected to the connecting sleeve and connected to the connecting hole, the intermediate cavity is opened inside the adsorption plate, the suction hole is opened at the bottom of the adsorption plate and connected to the intermediate cavity, and the intermediate cavity is connected to the curved tube arm.

[0008] Preferably, the vacuum suction assembly includes a connecting plate, a vacuum pump, a No. 1 hole, a No. 2 hole and an annular cavity, the vacuum pump is fixed on the outer side of the sleeve, the connecting plate is sleeved on the outer side of the rotating shaft, the connecting plate is fixed to the top of the base through a support rod, the annular cavity is opened inside the connecting plate, the No. 1 hole and the No. 2 hole are symmetrically opened on both sides of the top of the connecting plate, the No. 1 hole is connected with the annular cavity, one end of the No. 2 hole is located at the top of the connecting plate, and the other end is located at the side of the connecting plate, and a sealing ring is fixed on the top of the connecting plate.

[0009] Preferably, the No. 1 loading box includes a box body 1 and an inclined frame 1, and the inclined frame 1 is fixedly connected to the side of the box body 1. The No. 2 loading box includes a box body 2 and an inclined frame 2, and the inclined frame 2 is fixedly connected to the side of the box body 2. The sides of the box body 1 and the box body 2 are both provided with inclined openings, and the two inclined openings are respectively connected to the inclined frame 1 and the inclined frame 2. The top of the inner cavity of the box body 1 and the top of the inner cavity of the box body 2 are both fixedly provided with elastic positioning frames, and the internal cavity of the elastic positioning frames is narrow at the top and wide at the bottom.

[0010] Preferably, the pushing mechanism includes a bracket, a hydraulic push rod and a push plate, the top of the hydraulic push rod is fixedly connected to the push plate, the hydraulic push rod is fixed to the top of the base through the bracket, and a limit frame is provided at the bottom of the push plate.

[0011] Preferably, the glue coating assembly includes a storage frame, a spray pipe, an extrusion ring, a movable frame and an electric push rod, the storage frame is fixedly connected to the top of the adsorption plate, the spray pipe is fixedly nested in the interior of the adsorption plate, the top of the spray pipe is connected to the storage frame, the extrusion ring is movably sleeved in the storage frame, the storage frame is located on the outside of the curved tube arm, the movable frame is located on the top of the storage frame, the lower end of the movable frame movably passes through the storage frame and is fixedly connected to the extrusion ring, the electric push rod is fixed to the top of the storage frame, and the movable end is fixedly connected to the movable frame, the extrusion ring extrude the glue liquid under the storage frame and squeezes out the glue liquid through the spray pipe.

[0012] An operating method of a chip packaging substrate stacking device comprises the following operating steps: Step 1: insert the bottom substrate to be stacked along the No. 2 loading box, and the bottom substrate falls into the top of the pushing mechanism in the No. 2 loading box, then put the upper substrate to be stacked into the No. 1 loading box, start the power part in the rotating connecting part, and drive the rotating shaft to rotate, so that the connecting sleeve drives the adsorption and grabbing components on both sides to rotate, so that one group of adsorption and grabbing components moves to the top of the No. 2 loading box, and at this time, the other group of adsorption and grabbing components is located on the top of the No. 1 loading box; Step 2: Start the push mechanism in the No. 1 loading box, which pushes the top upper substrate upward and squeezes it upward along the inner wall of the elastic positioning frame, so that the upper substrate is automatically pushed to the center position and moves out of the No. 1 loading box; Step 3: As the upper substrate continues to move upward and fits with the corresponding adsorption plate, the vacuum suction assembly is started, and the vacuum pump sucks the gas in the corresponding connected adsorption grabbing assembly through the connecting sleeve, so that the upper substrate is adsorbed and fixed on the bottom of the adsorption grabbing assembly; Step 4: At the same time, the push mechanism in the No. 2 loading box pushes the bottom substrate out of the No. 2 loading box. At this time, the electric push rod in the gluing assembly corresponding to the upper part of the No. 2 loading box is started, and the movable frame drives the extrusion ring downward to squeeze out the glue liquid, and squeeze it out through the ejection pipe to the top of the bottom substrate below to complete the gluing; Step 5: Rotate the connecting part to rotate the adsorption and grabbing component that adsorbs and grabs the upper substrate by 180° and move it to the top of the bottom substrate. At this time, the corresponding adsorption and grabbing component is connected to the outside air, and the internal negative pressure disappears. The upper substrate that loses the adsorption and grabbing effect falls and falls on the top of the bottom substrate coated with glue. Continue to start the pushing mechanism in the No. 2 loading box. The bottom substrate and the upper substrate are clamped between the adsorption plate and the top of the pushing mechanism to complete the bonding and fixing. Step 6: After bonding, the pusher mechanism in the No. 2 loading box descends. At this time, the upper gluing component is glued again, and the next upper substrate is put into the No. 1 loading box on the other side. With the adsorption and transfer of the substrate, the third layer is bonded and fixed on the top of the two substrates to complete the stacking.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention realizes the loading preparation of the bottom substrate and the upper substrate respectively by utilizing the actions of the No. 1 loading box, the No. 2 loading box and the pushing mechanism, and cooperates with the rotating connecting part to drive the rotation position switching of the adsorption and grabbing components on both sides. Under the vacuuming effect of the vacuum suction component, the state of the adsorption and grabbing components at different positions is automatically controlled to ensure that the adsorption and grabbing components complete the adsorption and grasping of the upper substrate at the top of the No. 1 loading box, and automatically cancel the adsorption and grasping after the transfer, and perform corresponding bonding with the bottom substrate coated with glue on the top. The loading and positioning operations of different substrates are simple, and the combined stacking is quickly realized without manual adjustment assisted by humans. Especially for the stacking process of multi-layer substrates, the efficiency and accuracy are greatly improved, and the use effect is good.

[0014] 2. The present invention utilizes No. 1 loading box and No. 2 loading box, cooperates with the upward push of the pushing mechanism, and cooperates with the structure of reducing the internal space of the elastic positioning frame to assist in positioning the upwardly moved substrate, and automatically pushes it down to the center position accurately located at the top of the pushing mechanism. The actual positioning operation is simple and quick, further improving the stacking efficiency, and improving the stacking accuracy, avoiding misalignment, and having a good use effect.

[0015] 3. The present invention utilizes the coordination of the gluing component and the adsorption and grabbing component, and coordinates the two groups of adsorption and grabbing components in different working states at different positions. On the one hand, it realizes the quick gluing of the bottom substrate. On the other hand, under the action of the adsorption and grabbing components on both sides, each rotation can complete one grabbing and gluing. The efficiency of the entire processing procedure is greatly improved. The gluing of the bottom substrate and the adsorption and grabbing of the upper substrate are carried out simultaneously, the comprehensive lamination efficiency is greatly improved, and the use effect is good. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the present invention; Figure 2 It is a cross-sectional schematic diagram of the present invention; Figure 3 It is a cross-sectional schematic diagram of a No. 1 loading box of the present invention; Figure 4 It is a cross-sectional schematic diagram of the No. 2 loading box of the present invention; Figure 5 It is a schematic diagram of the rotating connecting part of the present invention; Figure 6 is a schematic diagram of a vacuum suction assembly of the present invention; Figure 7 is a cross-sectional schematic diagram of a connecting plate of the present invention; Figure 8 It is a cross-sectional schematic diagram of the adsorption and grabbing assembly of the present invention; Fig. 9 It is a schematic diagram of the explosion of the glue coating component of the present invention.

[0017] In the figure: 1. base; 2. column; 3. sleeve; 4. rotating connecting part; 41. rotating shaft; 42. gear one; 43. power part; 44. connecting sleeve; 45. connecting hole; 5. adsorption and grabbing assembly; 51. adsorption plate; 52. curved tube arm; 53. middle cavity; 54. suction hole; 6. vacuum suction assembly; 61. connecting plate; 62. vacuum pump; 63. hole No. 1; 64. hole No. 2; 65. annular cavity; 7. feeding box No. 1; 71. box body one; 72. inclined frame one; 8. feeding box No. 2; 81. box body two; 82. inclined frame two; 9. pushing mechanism; 10. elastic positioning frame; 11. gluing assembly; 111. storage frame; 112. ejection pipe; 113. extrusion ring; 114. movable frame; 115. electric push rod. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0019] like Figures 1 to 9 As shown, an embodiment of the present invention provides a chip packaging substrate stacking device and an operating method thereof, comprising a base 1, a column 2 is fixedly provided on the top of the base 1, a sleeve 3 is fixedly provided on the top of the column 2, a rotating connecting part 4 is rotatably installed in the sleeve 3, adsorption and grasping components 5 are fixedly provided at both ends of the rotating connecting part 4, a vacuum suction component 6 is fixedly provided on the top of the base 1, the vacuum suction component 6 is intermittently connected with the adsorption and grasping component 5, a No. 1 loading box 7 and a No. 2 loading box 8 are fixedly provided on the top of the base 1, respectively, the No. 1 loading box 7 and the No. 2 loading box 8 are symmetrically distributed on both sides of the column 2, a pushing mechanism 9 is provided inside the No. 1 loading box 7 and the No. 2 loading box 8, and a gluing component 11 is fixedly provided on the top of the adsorption and grasping component 5.

[0020] Embodiment: The bottom substrate to be stacked is inserted along the No. 2 loading box 8, and the bottom substrate falls into the top of the pushing mechanism 9 in the No. 2 loading box 8, and then the upper substrate to be stacked is put into the inclined frame 172 of the No. 1 loading box 7, and the power part 43 in the rotating connecting part 4 is started. The power part 43 drives the meshing gear 142 to rotate, and drives the rotating shaft 41 to rotate, so that the connecting sleeve 44 drives the adsorption and grabbing components 5 on both sides to rotate, so that one group of adsorption and grabbing components 5 moves to the top of the No. 2 loading box 8, and at this time, the other group of adsorption and grabbing components 5 is located at the top of the No. 1 loading box 7, and the pushing mechanism 9 in the No. 1 loading box 7 is started. The pushing mechanism 9 pushes the top upper substrate upward, and squeezes upward along the inner wall of the elastic positioning frame 10, so that the upper substrate is automatically pushed to the center position, and the upper substrate is moved out of the No. 1 loading box 7; Step 3: As the upper substrate in the No. 1 loading box 7 continues to move up and fits with the corresponding adsorption plate 51, the vacuum suction component 6 is started, and the vacuum pump 62 sucks the gas in the annular cavity 65, and sucks the air in the corresponding curved tube arm 52 through the No. 1 hole 63, thereby sucking the gas in the corresponding adsorption plate 51, and cooperating with the upper substrate that closes the suction hole 54, so that the upper substrate is adsorbed and fixed on the bottom of the adsorption grabbing component 5. At the same time, the pushing mechanism 9 in the No. 2 loading box 8 pushes the bottom substrate to move out of the No. 2 loading box 8, and the automatic positioning and centering of the bottom substrate is also completed. At this time, the glue coating component 11 corresponding to the upper side of the No. 2 loading box 8 is started, and the electric push rod 115 drives the movable frame 114 downward, and drives the extrusion ring 113 downward to squeeze out the glue liquid, and squeezes it out to the top of the bottom substrate below through the ejection pipe 112 to complete the gluing, and then the rotating connecting part 4 is operated again, so that the adsorption grabbing component 5 that adsorbs and grabs the upper substrate rotates 180° and moves to the bottom The upper layer substrate is moved upwards synchronously, and clamped between the corresponding upper adsorption plate 51 and the top of the pushing mechanism 9, and the bonding and fixing are completed. The pressure is maintained to complete the curing and fixing. After bonding, the pushing mechanism 9 in the No. 2 loading box 8 descends, driving the double-layer substrate bonded on the top to move down a certain distance, so that the bottom of the corresponding adsorption plate 51 on the top is opened. At this time, the upper gluing component 11 is glued again, and the next upper substrate is put into the No. 1 loading box 7 on the other side. With the push and adsorption of the upper substrate, a 180° rotation transfer is performed again, so that the next grasped upper substrate moves to the top of the two substrates, and the third layer is bonded and fixed to complete the stacking.

[0021] Firstly, by utilizing the actions of the No. 1 loading box 7, the No. 2 loading box 8 and the pushing mechanism 9, the loading preparations of the bottom substrate and the upper substrate are realized respectively, and the rotating connecting part 4 is cooperated to drive the rotation position switching of the adsorption and grasping components 5 on both sides. Under the vacuuming effect of the vacuum suction component 6, the state of the adsorption and grasping components 5 at different positions is automatically controlled to ensure that the adsorption and grasping components 5 complete the adsorption and grasping of the upper substrate at the top of the No. 1 loading box 7, and automatically cancel the adsorption and grasping after the transfer, and perform corresponding bonding with the bottom substrate coated with glue on the top. The loading and positioning operations of different substrates are simple, and the combined stacking is realized quickly without manual adjustment assisted by humans. Especially for the stacking process of multi-layer substrates, the efficiency and precision are greatly improved, and the use effect is good.

[0022] In addition, by utilizing the No. 1 loading box 7 and the No. 2 loading box 8, cooperating with the upward push of the pushing mechanism 9, and cooperating with the structure of reducing the internal space of the elastic positioning frame 10, the upwardly moved substrate is assisted in positioning, and automatically pushed down to the center position precisely located at the top of the pushing mechanism 9. The actual positioning operation is simple and quick, further improving the stacking efficiency, and improving the stacking accuracy, avoiding misalignment, and having a good use effect.

[0023] On the other hand, by utilizing the cooperation between the gluing component 11 and the adsorption and grabbing component 5, and coordinating the two groups of adsorption and grabbing components 5 in different working states at different positions, on the one hand, quick gluing of the bottom substrate can be achieved, and on the other hand, under the action of the adsorption and grabbing components 5 on both sides, each rotation can complete one grabbing and gluing, and the efficiency of the entire processing procedure is greatly improved. The gluing of the bottom substrate and the adsorption and grabbing of the upper substrate are carried out simultaneously, the comprehensive lamination efficiency is greatly improved, and the use effect is good.

[0024] Among them, the rotating connecting part 4 includes a rotating shaft 41, a gear 1 42, a power part 43, a connecting sleeve 44 and a connecting hole 45. The rotating shaft 41 is rotatably installed in the sleeve 3 through a bearing. The gear 1 42 is fixedly sleeved on the outer surface of the rotating shaft 41. The power part 43 is fixed on the outer side of the sleeve 3. The power part 43 is meshed with the gear 1 42 and drives the gear 1 42 to rotate. The connecting sleeve 44 is fixedly sleeved on the top of the rotating shaft 41. The connecting hole 45 is symmetrically arranged on both sides of the connecting sleeve 44. One end of the connecting hole 45 is located on the side of the connecting sleeve 44, and the other end is located at the bottom of the connecting sleeve 44. The power part 43 includes a motor and a gear 2. The motor drives the gear 2 to rotate, and the gear 2 is meshed with the gear 1 42. The adsorption and grabbing component 5 includes an adsorption plate 51, a curved tube arm 52, an intermediate cavity 53 and a suction hole 54. One end of the curved tube arm 52 is fixedly connected to the adsorption plate 51 , and the other end is fixedly connected to the connecting sleeve 44 and communicated with the connecting hole 45, the middle cavity 53 is opened inside the adsorption plate 51, the suction hole 54 is opened at the bottom of the adsorption plate 51, and is communicated with the middle cavity 53, the middle cavity 53 is communicated with the curved tube arm 52, the vacuum suction assembly 6 includes a connecting plate 61, a vacuum pump 62, a No. 1 hole 63, a No. 2 hole 64 and an annular cavity 65, the vacuum pump 62 is fixed on the outer surface of the sleeve 3, the connecting plate 61 is sleeved on the outer side of the rotating shaft 41, the connecting plate 61 is fixed to the top of the base 1 through a supporting rod, the annular cavity 65 is opened inside the connecting plate 61, the No. 1 hole 63 and the No. 2 hole 64 are symmetrically opened on both sides of the top of the connecting plate 61, the No. 1 hole 63 is communicated with the annular cavity 65, one end of the No. 2 hole 64 is located at the top of the connecting plate 61, and the other end is located at the side of the connecting plate 61, and a sealing ring is fixed on the top of the connecting plate 61.

[0025] The rotating connecting part 4 realizes the rotation and swing control of the adsorption and grasping components 5 on both sides, switches different working positions, and the adsorption and grasping components 5 cooperate with vacuum suction to realize adsorption and grasping, and when the adsorption and grasping components 5 are aligned and connected with the No. 1 hole 63, they cooperate with the vacuum pump 62 for suction to realize negative pressure adsorption and grasping, and the bottom is sealed during the rotation process to maintain the adsorption effect under pressure, and when the adsorption and grasping components 5 move to the No. 2 hole 64 for connection, it is connected to the outside world through the curved hole, contacts the negative pressure state, and automatically puts down the adsorption and grasping substrate.

[0026] Among them, the No. 1 feeding box 7 includes a box body 71 and an inclined frame 72, and the inclined frame 72 is fixedly connected to the side of the box body 71. The No. 2 feeding box 8 includes a box body 81 and an inclined frame 82, and the inclined frame 82 is fixedly connected to the side of the box body 81. The sides of the box bodies 1 71 and 81 are both provided with inclined openings, and the two inclined openings are respectively connected to the inclined frame 1 72 and the inclined frame 82. The top of the inner cavity of the box body 71 and the top of the inner cavity of the box body 81 are both fixedly provided with an elastic positioning frame 10, and the internal cavity of the elastic positioning frame 10 is narrow at the top and wide at the bottom.

[0027] The No. 1 loading box 7 realizes the loading and positioning of the upper substrate to be stacked and bonded, and the No. 2 loading box 8 realizes the pushing and pressing of the bottom substrate for stacking and bonding, controls the height to reserve glue coating space, moves upward to push and squeeze the upper substrate to jointly complete the bonding process under pressure.

[0028] The pushing mechanism 9 includes a bracket, a hydraulic push rod and a push plate. The top of the hydraulic push rod is fixedly connected to the push plate. The hydraulic push rod is fixed to the top of the base 1 through the bracket, and a limit frame is provided at the bottom of the push plate.

[0029] The limit frame ensures that the substrates continuously stacked in the inclined frame 1 72 and the inclined frame 2 82 automatically slide down when moving upward, and only when the push plate moves down to the bottom of the inclined opening, the substrates can be automatically slid in for loading.

[0030] Among them, the glue coating component 11 includes a storage frame 111, a spray pipe 112, an extrusion ring 113, a movable frame 114 and an electric push rod 115. The storage frame 111 is fixedly connected to the top of the adsorption plate 51, the spray pipe 112 is fixedly nested inside the adsorption plate 51, the top of the spray pipe 112 is connected to the storage frame 111, the extrusion ring 113 is movably sleeved in the storage frame 111, the storage frame 111 is located on the outside of the curved tube arm 52, the movable frame 114 is located on the top of the storage frame 111, the lower end of the movable frame 114 movably passes through the storage frame 111 and is fixedly connected to the extrusion ring 113, the electric push rod 115 is fixed on the top of the storage frame 111, and the movable end is fixedly connected to the movable frame 114, the extrusion ring 113 extrude the glue liquid downward in the storage frame 111, and squeezes out the glue liquid through the spray pipe 112.

[0031] The glue coating assembly 11 realizes automatic glue coating, and a replenishing port is provided on the side of the storage frame 111, and the glue can be replenished by opening the sealing cover.

[0032] An operating method of a chip packaging substrate stacking device comprises the following operating steps: The first step: insert the bottom substrate to be stacked along the No. 2 loading box 8, and the bottom substrate falls into the top of the pushing mechanism 9 in the No. 2 loading box 8, and then put the upper substrate to be stacked into the No. 1 loading box 7, start the power part 43 in the rotating connecting part 4, and drive the rotating shaft 41 to rotate, so that the connecting sleeve 44 drives the adsorption and grabbing components 5 on both sides to rotate, so that one group of adsorption and grabbing components 5 moves to the top of the No. 2 loading box 8, and at this time, the other group of adsorption and grabbing components 5 is located at the top of the No. 1 loading box 7; Step 2: Start the push mechanism 9 in the No. 1 loading box 7, the push mechanism 9 pushes the top upper substrate upward, and squeezes upward along the inner wall of the elastic positioning frame 10, so that the upper substrate is automatically pushed to the center position, and the upper substrate is moved out of the No. 1 loading box 7; Step 3: As the upper substrate continues to move upward and fits with the corresponding adsorption plate 51, the vacuum suction assembly 6 is started, and the vacuum pump 62 sucks the gas in the corresponding connected adsorption grabbing assembly 5 through the connecting sleeve 44, so that the upper substrate is adsorbed and fixed on the bottom of the adsorption grabbing assembly 5; Step 4: At the same time, the pushing mechanism 9 in the No. 2 loading box 8 pushes the bottom substrate to move out of the No. 2 loading box 8. At this time, the electric push rod 115 in the gluing assembly 11 corresponding to the upper part of the No. 2 loading box 8 is started, and the movable frame 114 drives the extrusion ring 113 downward to squeeze out the glue liquid, and squeeze it out through the ejection pipe 112 to the top of the bottom substrate below, completing the gluing; Step 5: Rotate the connecting part 4 to rotate the adsorption and grabbing component 5 that adsorbs and grabs the upper substrate by 180° and move it to the top of the bottom substrate. At this time, the corresponding adsorption and grabbing component 5 is connected to the outside air, and the internal negative pressure disappears. The upper substrate that loses the adsorption and grabbing effect falls and falls on the top of the bottom substrate coated with glue. Continue to start the pushing mechanism 9 in the No. 2 loading box 8, and the bottom substrate and the upper substrate are clamped between the adsorption plate 51 and the top of the pushing mechanism 9 to complete the bonding and fixing; Step 6: After bonding, the pushing mechanism 9 in the No. 2 loading box 8 descends. At this time, the upper gluing component 11 is glued again, and the next upper substrate is put into the No. 1 loading box 7 on the other side. With the adsorption and transfer of the substrate, the third layer is bonded and fixed on the top of the two substrates to complete the stacking.

[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A chip packaging substrate stacking device, comprising a base (1), characterized in that: A column (2) is fixedly provided on the top of the base (1), a sleeve (3) is fixedly provided on the top of the column (2), a rotating connecting portion (4) is rotatably mounted in the sleeve (3), adsorption and grabbing components (5) are fixedly provided at both ends of the rotating connecting portion (4), a vacuum suction component (6) is fixedly provided on the top of the base (1), the vacuum suction component (6) is intermittently connected to the adsorption and grabbing component (5), a No. 1 loading box (7) and a No. 2 loading box (8) are fixedly provided on the top of the base (1), the No. 1 loading box (7) and the No. 2 loading box (8) are symmetrically distributed on both sides of the column (2), a pushing mechanism (9) is provided inside the No. 1 loading box (7) and the No. 2 loading box (8), and a gluing component (11) is fixedly provided on the top of the adsorption and grabbing component (5).

2. The chip packaging substrate stacking device according to claim 1, characterized in that: The rotating connecting part (4) comprises a rotating shaft (41), a gear one (42), a power part (43), a connecting sleeve (44) and a connecting hole (45); the rotating shaft (41) is rotatably mounted in the sleeve (3) via a bearing; the gear one (42) is fixedly sleeved on the outer surface of the rotating shaft (41); the power part (43) is fixedly sleeved on the outer side of the sleeve (3); the power part (43) meshes with the gear one (42) and drives the gear one (42) to rotate; the connecting sleeve (44) is fixedly sleeved on the top of the rotating shaft (41); the connecting hole (45) is symmetrically arranged on both sides of the connecting sleeve (44); one end of the connecting hole (45) is located on the side of the connecting sleeve (44) and the other end is located at the bottom of the connecting sleeve (44); the power part (43) comprises a motor and a gear two; the motor drives the gear two to rotate, and the gear two meshes with the gear one (42).

3. The chip packaging substrate stacking device according to claim 2, characterized in that: The adsorption grabbing assembly (5) comprises an adsorption plate (51), a curved tube arm (52), an intermediate cavity (53) and a suction hole (54); one end of the curved tube arm (52) is fixedly connected to the adsorption plate (51), and the other end is fixedly connected to the connecting sleeve (44) and connected to the connecting hole (45); the intermediate cavity (53) is provided inside the adsorption plate (51); the suction hole (54) is provided at the bottom of the adsorption plate (51) and connected to the intermediate cavity (53); and the intermediate cavity (53) is connected to the curved tube arm (52).

4. The chip packaging substrate stacking device according to claim 3, characterized in that: The vacuum suction assembly (6) comprises a connecting plate (61), a vacuum pump (62), a No. 1 hole (63), a No. 2 hole (64) and an annular cavity (65); the vacuum pump (62) is fixed on the outer surface of the sleeve (3); the connecting plate (61) is sleeved on the outer side of the rotating shaft (41); the connecting plate (61) is fixed to the top of the base (1) via a supporting rod; the annular cavity (65) is provided inside the connecting plate (61); the No. 1 hole (63) and the No. 2 hole (64) are symmetrically provided on both sides of the top of the connecting plate (61); the No. 1 hole (63) is connected to the annular cavity (65); one end of the No. 2 hole (64) is located at the top of the connecting plate (61) and the other end is located at the side of the connecting plate (61); a sealing ring is fixedly provided on the top of the connecting plate (61).

5. The chip packaging substrate stacking device according to claim 4, characterized in that: The first loading box (7) comprises a box body (71) and an inclined frame (72), wherein the inclined frame (72) is fixedly connected to the side of the box body (71). The second loading box (8) comprises a box body (81) and an inclined frame (82), wherein the inclined frame (82) is fixedly connected to the side of the box body (81). The sides of the box body (71) and the box body (81) are both provided with inclined openings, wherein the two inclined openings are respectively connected to the inclined frame (72) and the inclined frame (82). The top of the inner cavity of the box body (71) and the top of the inner cavity of the box body (81) are both fixedly provided with an elastic positioning frame (10), wherein the internal cavity of the elastic positioning frame (10) is narrow at the top and wide at the bottom.

6. The chip packaging substrate stacking device according to claim 5, characterized in that: The pushing mechanism (9) comprises a bracket, a hydraulic push rod and a push plate, the top of the hydraulic push rod is fixedly connected to the push plate, the hydraulic push rod is fixed to the top of the base (1) through the bracket, and a limit frame is provided at the bottom of the push plate.

7. The chip packaging substrate stacking device according to claim 6, characterized in that: The glue coating assembly (11) comprises a storage frame (111), a spray pipe (112), an extrusion ring (113), a movable frame (114) and an electric push rod (115); the storage frame (111) is fixedly connected to the top of the adsorption plate (51); the spray pipe (112) is fixedly nested inside the adsorption plate (51); the top of the spray pipe (112) is in communication with the storage frame (111); the extrusion ring (113) is movably sleeved in the storage frame (111); and the storage frame (111) is 11) is located outside the curved tube arm (52), the movable frame (114) is located at the top of the storage frame (111), the lower end of the movable frame (114) movably passes through the storage frame (111) and is fixedly connected to the extrusion ring (113), the electric push rod (115) is fixed to the top of the storage frame (111), and the movable end is fixedly connected to the movable frame (114), and the extrusion ring (113) extrude the glue liquid under the storage frame (111) and squeezes the glue liquid through the ejection pipe (112).

8. The method for operating a chip packaging substrate stacking device according to claim 7, characterized in that: The steps include: The first step: insert the bottom substrate to be stacked along the No. 2 loading box (8), and the bottom substrate falls into the top of the pushing mechanism (9) in the No. 2 loading box (8), and then put the upper substrate to be stacked along the No. 1 loading box (7), start the power part (43) in the rotating connecting part (4), and drive the rotating shaft (41) to rotate, so that the connecting sleeve (44) drives the adsorption and grabbing components (5) on both sides to rotate, so that one group of adsorption and grabbing components (5) moves to the top of the No. 2 loading box (8), and at this time, the other group of adsorption and grabbing components (5) is located on the top of the No. 1 loading box (7); Step 2: Activate the push mechanism (9) in the No. 1 loading box (7), the push mechanism (9) pushes the top upper substrate upward, and squeezes upward along the inner wall of the elastic positioning frame (10), so that the upper substrate is automatically pushed to the center position, and the upper substrate is moved out of the No. 1 loading box (7); Step 3: As the upper substrate continues to move upward and fits with the corresponding adsorption plate (51), the vacuum suction component (6) is started, and the vacuum pump (62) sucks the gas in the corresponding connected adsorption and grabbing component (5) through the connecting sleeve (44), so that the upper substrate is adsorbed and fixed on the bottom of the adsorption and grabbing component (5); Step 4: At the same time, the push mechanism (9) in the No. 2 loading box (8) pushes the bottom substrate to move out of the No. 2 loading box (8). At this time, the electric push rod (115) in the gluing assembly (11) above the No. 2 loading box (8) is started, and the movable frame (114) drives the extrusion ring (113) downward to squeeze out the glue liquid, and squeeze it out through the ejection pipe (112) to the top of the bottom substrate below, completing the gluing; Step 5: The connecting part (4) is rotated to rotate the adsorption and grabbing component (5) for adsorbing and grabbing the upper substrate by 180° and move to the top of the bottom substrate. At this time, the corresponding adsorption and grabbing component (5) is connected to the outside air, the internal negative pressure disappears, and the upper substrate that loses the adsorption and grabbing effect falls and falls on the top of the bottom substrate coated with glue. The pushing mechanism (9) in the No. 2 loading box (8) is started again, and the bottom substrate and the upper substrate are clamped between the adsorption plate (51) and the top of the pushing mechanism (9), and the bonding and fixing are completed; Step 6: After bonding, the push mechanism (9) in the No. 2 loading box (8) descends, and the glue coating component (11) above is glued again, and the next upper substrate is put into the No. 1 loading box (7) on the other side. With the adsorption and transfer of the substrate, the third layer is bonded and fixed on the top of the two substrates to complete the stacking.

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