High-power-density aluminum substrate connecting device and inverter

Abstract

The invention discloses a high-power-density aluminum substrate connecting device, and relates to the technical field of photovoltaic power generation. A current-carrying plate is conductively connected with a power supply device in a transformer, a switching electronic plate and the current-carrying plate are overlapped and relatively fixedly connected, the switching electronic plate and the current-carrying plate are conductively connected, and an aluminum substrate is assembled on a radiator in a heat conduction manner; the aluminum substrate and the switching electronic plate have an overlapping area, are relatively and fixedly connected, and are conductively connected; the power flow electronic plate and the aluminum substrate have an overlapping area and are relatively and fixedly connected, and the power flow electronic plate is conductively connected with the aluminum substrate; conductive connection is achieved between the transformer and the power flow electronic board through the current carrying board, the switching electronic board and the aluminum substrate, an overlapped area exists between the two boards which are in conductive connection with each other, the mode of conducting electricity through wire connection is replaced by conducting electricity through all the boards, wires do not need to be installed, therefore, stress concentration is avoided, the wires do not need to be avoided, and the cost is reduced. The space utilization rate is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic power generation, and further to a high-power-density aluminum substrate connection device and an inverter. Background Art

[0002] Combine Figure 1 、 Figure 2 As shown, it is a schematic diagram of the structure in which the existing aluminum substrate 01 and the power board 06 are fastened by screws; the aluminum substrate 01 and the transformer 02 are fastened together by the power electronic wire 03 through the current-carrying stud 04 and the screw 05. After the above two steps are completed, they are installed on the radiator 05 again to achieve the purpose of power flow.

[0003] This solution currently has three shortcomings:

[0004] 1. After the power lock wire terminal of the transformer is tightened with screws, due to assembly and material differences, stress concentration of varying degrees will occur at the root of the patch stud.

[0005] 2. Due to the height restrictions of the transformer's locking wire terminals and screws, the size of the power board is severely limited. Under the premise of the same power, the existing solution requires a larger box to meet the space requirements; resulting in low power density.

[0006] 3. Connecting the transformer and aluminum base plate with screws requires internal threading of the current-carrying studs, and the overall height needs to be increased to meet connection requirements. Secondly, under the premise of the same power density, the larger the box size, the higher the material cost. Under the same volume conditions, the power density decreases and the system cost increases.

[0007] For those skilled in the art, how to avoid stress concentration and improve space utilization is a technical problem that needs to be solved at present. Summary of the Invention

[0008] The core of this invention is to provide a high-power density aluminum substrate connection device. By connecting multiple plates to each other, it replaces the conductive wires, eliminating the need to connect the wires one by one, avoiding stress concentration and improving space utilization. The specific scheme is as follows:

[0009] A high power density aluminum substrate connection device, comprising:

[0010] The current-carrying plate is electrically connected to the power supply components in the transformer;

[0011] A transfer electronic board having an overlapping area with the current-carrying board and being relatively fixedly connected, the transfer electronic board being conductively connected to the current-carrying board;

[0012] An aluminum substrate is heat-conductingly mounted on a heat sink, wherein the aluminum substrate and the adapter electronic board have an overlapping area and are relatively fixedly connected; the aluminum substrate and the adapter electronic board are electrically conductively connected;

[0013] The power flow electronic board has an overlapping area with the aluminum substrate and is relatively fixedly connected thereto. The power flow electronic board is conductively connected to the aluminum substrate.

[0014] Optionally, the adapter electronic board is arranged above the current-carrying plate and the aluminum base plate, and the power flow electronic board is arranged above the adapter electronic board.

[0015] Optionally, the current-carrying board is provided with a first current-carrying column, the adapter electronic board is fixedly connected to the first current-carrying column by bolts, and the first current-carrying column supports the adapter electronic board.

[0016] Optionally, the current-carrying plate or the transformer is provided with a conductive column, and the conductive column is conductively connected to the power supply device in the transformer and the current-carrying plate respectively;

[0017] The conductive pillar and the first current-carrying pillar are respectively located at two opposite sides of the current-carrying plate, so that the side where the first current-carrying pillar is located forms a cantilever.

[0018] Optionally, a stop current-carrying boss is provided on the aluminum substrate, and the stop current-carrying boss is engaged with the adapter electronic board;

[0019] One side edge of the transfer electronic board is supported by the stop current-carrying boss, and the other opposite side forms a cantilever, and the edge of the cantilever is connected to the current-carrying board.

[0020] Optionally, the stop current-carrying boss includes a lower support column and an upper positioning column, the cross-sectional area of ​​the lower support column is larger than the cross-sectional area of ​​the upper positioning column; the upper positioning column is provided with a positioning slot;

[0021] The transfer electronic board is provided with a stop notch which cooperates with the upper positioning column, and the stop notch is provided with a positioning block; the positioning block cooperates with the positioning slot to clamp and position.

[0022] Optionally, the width of the aluminum substrate is equal to the width of the power flow electronic board;

[0023] The width of the aluminum substrate is greater than the width of the adapter electronic board;

[0024] The width of the transfer electronic board is equal to the width of the current-carrying board.

[0025] Optionally, the power flow electronic board extends above the current-carrying board and the adapter electronic board; and an avoidance channel is provided on the power flow electronic board.

[0026] Optionally, a second current-carrying column is provided on the aluminum substrate, and the second current-carrying column is used to support the power flow electronic board and realize conductive connection.

[0027] The present invention further provides an inverter, comprising any one of the above-mentioned high-power density aluminum substrate connection devices, a transformer matched with the current-carrying plate, and a heat sink matched with the aluminum substrate;

[0028] A positioning groove for positioning the aluminum substrate is provided on the surface of the radiator, and the aluminum substrate is fixed and pressed into the positioning groove by bolts.

[0029] The present invention provides a high-power density aluminum substrate connection device, in which a current-carrying plate is conductively connected to a power supply device in a transformer, a switching electronic board overlaps with the current-carrying plate and is relatively fixedly connected, the switching electronic board is conductively connected to the current-carrying plate, the aluminum substrate is heat-conductingly assembled on a radiator, and there is an overlapping area between the aluminum substrate and the switching electronic board and they are relatively fixedly connected, the aluminum substrate and the switching electronic board are conductively connected; there is an overlapping area between the power flow electronic board and the aluminum substrate and they are relatively fixedly connected, the power flow electronic board and the aluminum substrate are conductively connected; the transformer and the power flow electronic board are conductively connected via the current-carrying plate, the switching electronic board and the aluminum substrate, there is an overlapping area between the two conductively connected plates, and conduction is performed via each plate, replacing the conductive method of connecting with a wire, eliminating the need to avoid the wire and improving space utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0031] Figure 1 This is an exploded diagram of the assembly of an aluminum substrate and a power board in the prior art;

[0032] Figure 2 This is a schematic diagram of the assembly of an aluminum substrate and a power board in the prior art;

[0033] Figure 3 This is an exploded diagram of the high power density aluminum substrate connection device of the present invention in conjunction with a transformer and a heat sink;

[0034] Figure 4 This is a schematic diagram of the assembly of the high power density aluminum substrate connection device of the present invention in conjunction with the transformer and the radiator;

[0035] Figure 5It is a front view schematic diagram of the high power density aluminum substrate connection device of the present invention cooperating with the transformer and the heat sink.

[0036] Figure 6 This is the assembly diagram of the transformer, current-carrying board, transfer electronic board, and aluminum base plate;

[0037] Figure 7 This is an exploded diagram of the adapter electronic board and the aluminum base plate.

[0038] Figure 8 This is a schematic diagram of the cooperation between the positioning block and the stop current-carrying boss.

[0039] The diagram includes:

[0040] Aluminum substrate 01, transformer 02, power electronic wire 03, current-carrying stud 04, screw 05, power board 06;

[0041] Current-carrying board 1, first current-carrying column 11, adapter electronic board 2, stop notch 21, positioning block 211, aluminum base plate 3, stop current-carrying boss 31, lower support column 311, upper positioning column 312, positioning slot 313, second current-carrying column 32, power flow electronic board 4, avoidance channel 41, transformer 5, conductive column 51, heat sink 6, positioning slot 61. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the technical solution of the present invention, the high power density aluminum substrate connection device and the inverter of the present invention will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0043] The present invention provides a high power density aluminum substrate connection device, combined with Figure 3 、 Figure 4 As shown, the circuit comprises a current-carrying board 1, a transfer electronic board 2, an aluminum substrate 3, and a power flow electronic board 4. These three components are electrically connected in sequence. Each of these three components performs a conductive function and is a printed circuit board assembly (PCB). This is a process where a blank printed circuit board (PCB) undergoes SMT (Surface Mounting) or DIP (Dialect Plug-in) assembly, often referred to as a PCBA. Surface mount devices, switching transistors, and other components are typically placed on the aluminum substrate 3. The output rectifier conducts heat away through the substrate, resulting in very low thermal resistance.

[0044] The current-carrying plate 1 is electrically connected to the power supply components inside the transformer 5. The current-carrying plate 1 is used to electrically connect the power supply components inside the transformer 5 with external components. A circuit is printed on the current-carrying plate 1, and conduction is achieved through the printed circuit.

[0045] There is an overlapping area between the adapter electronic board 2 and the current-carrying board 1, that is, part of the edge of the adapter electronic board 2 and part of the edge of the current-carrying board 1 overlap with each other in the direction perpendicular to the board surface. The adapter electronic board 2 and the current-carrying board 1 are relatively fixedly connected, and the adapter electronic board 2 and the current-carrying board 1 are conductively connected. The printed circuit on the adapter electronic board 2 and the printed circuit on the current-carrying board 1 are conductively coordinated with each other, and the printed circuit acts as a conductor.

[0046] The aluminum substrate 3 is thermally assembled to the heat sink 6. Its inherent structure offers excellent thermal conductivity, copper bonding on one side, allowing components to be placed only on the copper-bonded surface. It also lacks holes for electrical connections, preventing the placement of jumpers as with single-sided boards. The excellent thermal conductivity of the aluminum substrate 3 allows for rapid heat dissipation from the components. The aluminum substrate 3 and the adapter board 2 overlap and are fixedly connected. Specifically, a portion of the aluminum substrate 3's edge overlaps perpendicular to the board surface, creating a conductive connection between the two boards.

[0047] The power flow electronic board 4 and the aluminum substrate 3 have an overlapping area and are relatively fixedly connected. At least a portion of the edge of the power flow electronic board 4 overlaps with at least a portion of the edge of the aluminum substrate 3 in a direction perpendicular to the board surface. Figure 5 As shown, the aluminum substrate 3 is completely covered by the power flow electronic board 4 , and the power flow electronic board 4 is electrically conductively connected to the aluminum substrate 3 .

[0048] The high-power-density aluminum substrate connection device of the present invention replaces the traditional wire connection with the conductive connection form of PCBA, so that the conductive connection between the transformer 5 and the aluminum substrate 3 adopts PCBA connection. The current-carrying board 1 and the adapter electronic board 2 cooperate with each other to replace the wires between the transformer 5 and the aluminum substrate 3. Since there are no wires, stress concentration on the wires is avoided; the power flow electronic board 4 does not need to avoid the wires, and its structural design is more flexible, which can improve space utilization.

[0049] On the basis of the above technical solutions, combined with Figure 5As shown, the overall structure of the device in the front view is shown. In a specific structure of the present invention, the adapter electronic board 2 is arranged above the current-carrying board 1 and the aluminum substrate 3. The current-carrying board 1 is first installed on the transformer 5 and the aluminum substrate 3 is installed on the radiator 6. Then the adapter electronic board 2 is installed above the current-carrying board 1 and the aluminum substrate 3, and the areas on the two opposite sides of the adapter electronic board 2 are overlapped with the current-carrying board 1 and the aluminum substrate 3 respectively. The adapter electronic board 2 is located above the current-carrying board 1 and the aluminum substrate 3, and the areas on the two opposite sides of the adapter electronic board 2 are fixed relative to the current-carrying board 1 and the aluminum substrate 3 respectively. The power flow electronic board 4 is arranged above the adapter electronic board 2. After the adapter electronic board 2 is installed, the power flow electronic board 4 is installed. The power flow electronic board 4 is placed above the adapter electronic board 2. After the installation is completed, a vertical spacing space exists between the power flow electronic board 4 and the adapter electronic board 2.

[0050] It should be noted that in the above structure, the adapter electronic board 2 is arranged above the current-carrying board 1 and the aluminum base plate 3. The vertical projection of the current-carrying board 1 is located within the vertical projection range of the transformer 5, and the vertical projection of the aluminum base plate 3 is located within the vertical projection range of the heat sink 6. In this case, the current-carrying board 1 and the aluminum base plate 3 are connected to the adapter electronic board 2. If the edge of the current-carrying board 1 extends beyond the transformer 5, or the edge of the aluminum base plate 3 extends beyond the heat sink 6, the adapter electronic board 2 can be arranged below the current-carrying board 1 and / or the aluminum base plate 3. This arrangement should also be included in the scope of protection of the present invention.

[0051] Combine Figure 3 、 Figure 5 As shown, the current-carrying board 1 is provided with a plurality of first current-carrying posts 11. These are arranged along one side edge of the current-carrying board 1. The first current-carrying posts 11 protrude from the upper surface of the current-carrying board 1, and each first current-carrying post 11 is conductively connected to the printed circuit board 1. The ends of the first current-carrying posts 11 are provided with threaded holes for threaded bolts. The adapter electronic board 2 is fixedly connected to the first current-carrying posts 11 via bolts, and the first current-carrying posts 11 support the adapter electronic board 2. The adapter electronic board 2 has corresponding openings corresponding to the first current-carrying posts 11, and the heights of the first current-carrying posts 11 are aligned. During installation, the adapter electronic board 2 is first placed on the upper end of the first current-carrying posts 11, supported by the first current-carrying posts 11, and then screwed to each first current-carrying post 11, thereby fixing the adapter electronic board 2 relative to the first current-carrying posts 11 and achieving relative connection and assembly between the adapter electronic board 2 and the current-carrying board 1.

[0052] Combine Figure 3 、 Figure 5As shown, the current-carrying plate 1 or the transformer 5 is provided with a conductive column 51, that is, the conductive column 51 can be provided on the current-carrying plate 1 or the transformer 5, and a total of multiple conductive columns 51 are provided. The conductive columns 51 are respectively conductively connected to the power supply device in the transformer 5 and the current-carrying plate 1, and the conductive columns 51 can provide support for the current-carrying plate 1.

[0053] Combine Figure 5 As shown, the conductive pillar 51 and the first current-carrying pillar 11 are respectively located at two opposite sides of the current-carrying plate 1. The conductive pillar 51 provides support for the current-carrying plate 1, so that the side where the first current-carrying pillar 11 is located forms a cantilever. Figure 5 The left side of the current-carrying plate 1 is supported by the conductive pillar 51, and the right side forms a cantilever structure. Since the current-carrying plate 1 can undergo a certain degree of elastic deformation, the cantilever side of the current-carrying plate 1 can float up and down to a certain extent.

[0054] Combine Figure 3 、 Figure 6 、 Figure 7 As shown, a stop current-carrying boss 31 is provided on the aluminum substrate 3, and the stop current-carrying boss 31 and the adapter electronic board 2 are engaged with each other. One side edge of the adapter electronic board 2 is supported by the stop current-carrying boss 31, and the other side opposite to it forms a cantilever, and the cantilever edge is connected to the current-carrying board 1. Figure 5 As shown, the stop current-carrying boss 31 supports the right end of the adapter electronic board 2, and the left end of the adapter electronic board 2 is the cantilever end. Since the adapter electronic board 2 can undergo a certain degree of elastic deformation, the cantilever side of the adapter electronic board 2 can float up and down to a certain extent.

[0055] The welding stop current-carrying boss 31 is mounted on the aluminum substrate 3 through the patch process, and the adapter electronic board 2 is pre-connected to the stop current-carrying boss 31 by plug-in, and reverse wave soldering is performed. This process can realize the assembly of the aluminum substrate module.

[0056] The left end of the adapter electronic board 2 and the right end of the current-carrying board 1 each form a cantilevered end. The two cantilevered ends overlap and are fixedly connected relative to each other. This dual cantilevered structure of the adapter electronic board 2 and the current-carrying board 1 achieves low stress. One end of the current-carrying board 1 is connected to the transformer 5, forming the first cantilever structure; one end of the adapter electronic board 2 is connected to the aluminum substrate 3, forming the second cantilever structure. During operation, the dual cantilevered ends compensate for the thermal expansion and contraction of the transformer 5's thermal conductive colloid and the shrinkage of the sealing strip, thereby reducing internal stress within the PCBA and alleviating local stress at the fastening and soldering points within the PCBA.

[0057] Combine Figure 7As shown, the stop current-carrying boss 31 includes a lower support column 311 and an upper positioning column 312, which are made of conductive material. The cross-sectional area of ​​the lower support column 311 is larger than that of the upper positioning column 312, forming an annular step structure that gradually shrinks from bottom to top; the upper positioning column 312 is provided with a positioning slot 313. The adapter electronic board 2 is provided with a stop notch 21 that cooperates with the upper positioning column 312. The diameter of the stop notch 21 is slightly larger than that of the upper positioning column 312. The side wall of the stop notch 21 is provided with a positioning block 211; the positioning block 211 and the positioning slot 313 cooperate with each other to clamp and position, and the combination Figure 8 As shown, the clearance between the positioning block 211 and the positioning slot 313 is smaller than the clearance between the stop current-carrying boss 31 and the stop notch 21. This tight clearance fit between the positioning block 211 and the positioning slot 313 allows for more precise positioning of the adapter electronic board 2. Compared to a threaded connection, this connection prevents increased deviation from the transformer due to rotation, thus preventing the adapter electronic board 2 from shaking. The positioning block 211, when mated with the positioning slot 313, prevents the stop current-carrying boss 31 from rotating. The use of the stop current-carrying boss 31 reduces material height by over 40%, and the removal of the fastening screw thread at the stop current-carrying boss 31 increases the effective utilization rate of the PCBA by over 30%.

[0058] In one embodiment, combining Figure 6 As shown, of the four panels described in this invention, the width of the aluminum base plate 3 is equal to that of the power flow electronic board 4; the width of the aluminum base plate 3 is greater than that of the adapter electronic board 2; and the width of the adapter electronic board 2 is equal to that of the current-carrying board 1. The adapter electronic board 2 is narrower than the width of the aluminum base plate 3 to avoid the bolts securing the aluminum base plate 3. The aluminum base plate 3 is secured with six bolts, requiring only one opening in the adapter electronic board 2 to accommodate the bolt located in the middle of the left side.

[0059] Based on any of the above technical solutions and their mutual combination, the power flow electronic board 4 extends above the current carrying board 1 and the adapter electronic board 2, combined with Figure 5 As shown, the range of the dotted brackets represents the newly added utilization area of ​​the power flow electronic board 4 compared to the traditional structure. Since the adapter electronic board 2 is located below the power flow electronic board 4, the area of ​​the power flow electronic board 4 is not affected by the adapter electronic board 2. The power flow electronic board 4 can be designed with a larger area, utilizing the space area between the aluminum substrate 3 and the transformer 5. This area was originally vacant due to the influence of the wire starting line. The present invention utilizes this part of the area, and more components can be set in this expanded area, thereby improving the utilization rate of the power flow electronic board 4. An avoidance channel 41 is opened on the power flow electronic board 4. The power flow electronic board 4 blocks the bolt position of the current-carrying plate 1. In order to avoid the bolts, an avoidance channel 41 is opened on the power flow electronic board 4.

[0060] Combine Figure 3 、 Figure 5 As shown, a second current-carrying column 32 is provided on the aluminum substrate 3 , and the second current-carrying column 32 is used to support the power flow electronic board 4 and realize conductive connection. The structure and function of the second current-carrying column 32 are similar to those of the first current-carrying column 11 .

[0061] The present invention also provides an inverter, including the above-mentioned high-power density aluminum substrate connection device, the inverter also includes a transformer 5 cooperating with the current-carrying plate 1, and a heat sink 6 cooperating with the aluminum substrate 3; wherein the transformer 5 is provided with a conductive column 51 extending from the inside to the outside, for conducting electricity with the current-carrying plate 1 and providing support.

[0062] The surface of the radiator 6 is provided with a positioning groove 61 for positioning the aluminum substrate 3 , and the aluminum substrate 3 is fixed and pressed into the positioning groove 61 by bolts; a plurality of fins are provided below the radiator 6 to improve heat dissipation efficiency.

[0063] The high-power-density aluminum-based substrate connection device and inverter provided by this invention utilizes a current-carrying board 1 and a transfer electronic board 2 to replace traditional wire connections, thus avoiding stress concentration issues. The high-power-density aluminum-based substrate connection device is mounted on a bottom heat sink 6 and transformer 5, enabling bidirectional current carrying between the transformer 5 and the power flow electronic board 4.

[0064] The current-carrying board 1 and the transfer electronic board 2 utilize a stacked dual-cantilever design concept, using the floating cantilever elements to offset thermal expansion and contraction. This innovative structural upgrade improves the aluminum substrate connection solution by achieving high power density, low stress, and low cost compared to the original design. This increases the overall effective PCBA area by over 20% and reduces system costs by over 25%.

[0065] The above description of the disclosed embodiments is intended to enable one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not limited to the embodiments shown herein but is intended to conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A high power density aluminum substrate connection device, characterized in that: include: A current-carrying plate (1) is conductively connected to a power supply device in the transformer (5); The transfer electronic board (2) has an overlapping area with the current-carrying board (1) and is relatively fixedly connected, and the transfer electronic board (2) is conductively connected to the current-carrying board (1); An aluminum substrate (3) is heat-conductingly mounted on a heat sink (6), wherein the aluminum substrate (3) and the adapter electronic board (2) have an overlapping area and are relatively fixedly connected; the aluminum substrate (3) and the adapter electronic board (2) are electrically conductively connected; The power flow electronic board (4) has an overlapping area with the aluminum substrate (3) and is relatively fixedly connected thereto; the power flow electronic board (4) is conductively connected to the aluminum substrate (3).

2. The high power density aluminum substrate connection device according to claim 1, characterized in that: The transfer electronic board (2) is arranged above the current-carrying board (1) and the aluminum base plate (3), and the power flow electronic board (4) is arranged above the transfer electronic board (2).

3. The high power density aluminum substrate connection device according to claim 1, characterized in that: The current-carrying plate (1) is provided with a first current-carrying column (11), the adapter electronic board (2) is fixedly connected to the first current-carrying column (11) by means of bolts, and the first current-carrying column (11) supports the adapter electronic board (2).

4. The high power density aluminum substrate connection device according to claim 3, characterized in that: The current-carrying plate (1) or the transformer (5) is provided with a conductive column (51), and the conductive column (51) is respectively conductively connected to a power supply device in the transformer (5) and the current-carrying plate (1); The conductive column (51) and the first current-carrying column (11) are respectively located at two opposite sides of the current-carrying plate (1), so that the side where the first current-carrying column (11) is located forms a cantilever.

5. The high power density aluminum substrate connection device according to claim 4, characterized in that: A stop current-carrying boss (31) is provided on the aluminum substrate (3), and the stop current-carrying boss (31) and the transfer electronic board (2) are mutually engaged and clamped; One side edge of the transfer electronic board (2) is supported by the stop current-carrying boss (31), and the other side edge opposite to it forms a cantilever, the edge of the cantilever being connected to the current-carrying board (1).

6. The high power density aluminum substrate connection device according to claim 5, characterized in that: The stop current-carrying boss (31) comprises a lower support column (311) and an upper positioning column (312); the cross-sectional area of ​​the lower support column (311) is larger than the cross-sectional area of ​​the upper positioning column (312); and the upper positioning column (312) is provided with a positioning slot (313); The transfer electronic board (2) is provided with a stop notch (21) that cooperates with the upper positioning column (312), and the stop notch (21) is provided with a positioning block (211); the positioning block (211) and the positioning slot (313) cooperate with each other to clamp and position.

7. The high power density aluminum substrate connection device according to claim 1, characterized in that: The width of the aluminum substrate (3) is equal to the width of the power flow electronic board (4); The width of the aluminum substrate (3) is greater than the width of the transfer electronic board (2); The width of the transfer electronic board (2) is equal to the width of the current-carrying board (1).

8. The high power density aluminum substrate connection device according to any one of claims 1 to 7, characterized in that: The power flow electronic board (4) extends above the current-carrying board (1) and the adapter electronic board (2); and an avoidance channel (41) is provided on the power flow electronic board (4).

9. The high power density aluminum substrate connection device according to claim 8, characterized in that: A second current-carrying column (32) is arranged on the aluminum substrate (3), and the second current-carrying column (32) is used to support the power flow electronic board (4) and realize conductive connection.

10. An inverter, characterized in that: A high power density aluminum substrate connection device comprising any one of claims 1 to 9, further comprising a transformer (5) matched with the current-carrying plate (1), and a heat sink (6) matched with the aluminum substrate (3); A positioning groove (61) for positioning the aluminum substrate (3) is provided on the surface of the heat sink (6), and the aluminum substrate (3) is fixed and pressed into the positioning groove (61) by means of bolts.

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