Pressure sensor power supply method and device based on signal frequency division and SIP packaging structure

Abstract

The invention discloses a pressure sensor power supply method and device based on signal frequency division and an SIP packaging structure. The device comprises a high-frequency signal source, a pressure sensor, a frequency divider, a rectifier, a filter, an LDO and an A / D converter. The high-frequency signal source and the pressure sensor are arranged at intervals, the power supply end of the pressure sensor is connected with a coil, the output end of the pressure sensor is connected with the input end of the frequency divider, the high-frequency output end of the frequency divider is sequentially connected with the rectifier, the filter and the LDO, the output end of the LDO is connected with the power supply end of the A / D converter, and the low-frequency output end of the frequency divider is connected with the input end of the A / D converter. According to the pressure sensor, wireless power supply can be carried out while pressure measurement and result processing are carried out, the pressure sensor is suitable for a complex scene where a power supply is inconvenient to place, and the power supply cost of the pressure sensor is reduced.

Description

Technical Field

[0001] The invention belongs to the field of signal processing and relates to a pressure sensor power supply method and device based on signal frequency division and a SIP packaging structure. Background Art

[0002] The thin film pressure sensor is a sensor based on the principle of thin film deformation. Its sensitive element is a metal film with elastic properties. When external force acts on the surface of the film, it will cause the film to deform and cause strain inside the film. This deformation and strain will change the electrical properties of the film, thereby causing changes in the corresponding circuit parameters, such as capacitance and resistance. By measuring these circuit parameters, the size of the applied pressure can be determined. It is widely used in automotive, medical, industrial control, environmental monitoring and other fields.

[0003] With the extensive application of pressure sensors in various industries in recent years, wired power supply and battery-driven power supply are also the mainstream power supply methods for sampling pressure sensors in the field of data acquisition. However, in some specific scenarios such as concrete pouring walls, bridge inspections, etc., batteries are often damaged or lose their effectiveness due to large changes in temperature or pressure. Therefore, traditional sensors cannot perform line layout in closed spaces or complex environments to collect pressure data. Summary of the invention

[0004] The purpose of the present invention is to overcome the shortcomings of the above-mentioned prior art and to provide a pressure sensor power supply method, device and SIP packaging structure based on signal frequency division. While measuring the pressure and processing the results, the pressure can be wirelessly powered. It is suitable for complex scenarios where it is inconvenient to place a power supply, thereby reducing the cost of powering the pressure sensor.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions: A pressure sensor power supply device based on signal frequency division, comprising a high-frequency signal source, a pressure sensor, a frequency divider, a rectifier, a filter, an LDO and an A / D converter; The high-frequency signal source is arranged at intervals from the pressure sensor, the power supply end of the pressure sensor is connected to a coil, the output end of the pressure sensor is connected to the input end of the frequency divider, the high-frequency output end of the frequency divider is connected to a rectifier, a filter and an LDO in sequence, the output end of the LDO is connected to the power supply end of the A / D converter, and the low-frequency output end of the frequency divider is connected to the input end of the A / D converter.

[0006] Preferably, the pressure sensor is a thin film pressure sensor.

[0007] A pressure sensor power supply method based on signal frequency division includes the following processes: S1: Send high-frequency electromagnetic wave signals to the pressure sensor, and the pressure sensor converts the high-frequency electromagnetic wave signals into electrical energy for its own use through electromagnetic resonance coupling; S2: pressure sensor collects external pressure signals; S3: After the pressure sensor completes collecting the pressure signal, the signal output by the pressure sensor is divided into a high-frequency signal and a low-frequency signal; S4: Processing the high frequency signal into a DC voltage to power the A / D converter; S5: Process the low-frequency signal into pressure data output.

[0008] Preferably, in S1, the high-frequency electromagnetic wave signal is no greater than 10 khz.

[0009] Preferably, in S3, the high frequency signal is not greater than 10 khz, and the low frequency signal is not less than 100 hz.

[0010] Preferably, in S4, full-wave rectification is performed on the divided high-frequency signal to rectify the high-frequency signal into a direct current signal.

[0011] Furthermore, the DC signal is filtered to remove noise in the pressure signal acquisition process.

[0012] Furthermore, the filtered signal is converted into a DC voltage through an LDO.

[0013] Preferably, in S5, the low-frequency signal is converted through A / D conversion to convert the continuously changing analog signal into a discrete digital signal output.

[0014] The invention discloses a SIP packaging structure of a pressure sensor based on signal frequency division. A frequency divider, a rectifier, a filter, an LDO and an A / D converter are sealed by the SIP packaging structure.

[0015] Compared with the prior art, the present invention has the following beneficial effects: When the pressure sensor collects pressure signals, the present invention sends a high-frequency electromagnetic wave signal to the current pressure sensor, thereby powering the pressure sensor, and divides the pressure signal collected at this time. The high-frequency signal after frequency division is processed as a voltage-stabilized power supply to power the remaining components, and the low-frequency signal after frequency division is processed as a pressure signal measured by the current pressure sensor. The above method can wirelessly power the pressure while measuring and processing the measurement results, which is suitable for complex scenarios where it is inconvenient to place a power supply, reducing the cost of powering the pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic structural diagram of a power supply device for a thin film pressure sensor based on signal frequency division proposed in an embodiment of the present invention; Figure 2 A flow chart of a pressure sensor power supply method based on signal frequency division proposed in an embodiment of the present invention; Figure 3 Schematic diagram of a thin film pressure sensor power supply SIP (System In Package) packaging structure based on signal frequency division proposed in an embodiment of the present invention Among them: 1-high frequency signal source; 2-thin film pressure sensor; 3-frequency divider; 4-rectifier; 5-filter; 6-LDO; 7-A / D converter. DETAILED DESCRIPTION

[0017] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0018] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs. The terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. The term "and / or" used in this article includes any and all combinations of one or more related listed items. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0020] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0021] The disclosure below provides many different embodiments or examples to realize different structures of the present invention. In order to simplify the disclosure of the present invention, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present invention. In addition, the present invention can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present invention provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0022] Example 1 In Example 1, Figure 1 As shown, the present application provides a pressure sensor power supply device based on signal frequency division, which specifically includes: a high-frequency signal source 1, a pressure sensor, a frequency divider 3, a rectifier 4, a filter 5, an LDO 6 (Low-dropout regulator, low voltage difference linear regulator) and an A / D converter 7.

[0023] The high-frequency signal source 1 is arranged at an interval with the pressure sensor, the power supply end of the pressure sensor is connected to a coil, the output end of the pressure sensor is connected to the input end of the divider 3, the high-frequency output end of the divider 3 is connected to the rectifier 4, the filter 5 and the LDO6 in sequence, the output end of the LDO6 is connected to the power supply end of the A / D converter 7, and the low-frequency output end of the divider 3 is connected to the input end of the A / D converter 7.

[0024] In this embodiment, the pressure sensor is a thin film pressure sensor 2 .

[0025] Among them, in the embodiment of the present application, a frequency divider 3 is used to divide the signal, and a capacitor frequency division can also be used to divide the signal, which is not specifically limited in the embodiment of the present application.

[0026] Among them, the high-frequency signal source 1 is used to send a high-frequency electromagnetic wave signal to the thin film pressure sensor 2, the thin film pressure sensor 2 is used to collect the pressure signal, and a divider 3 is arranged outside the thin film pressure sensor 2. The divider 3 is used to divide the pressure output signal into different frequency bands. The pressure output signal is divided. The divider 3 divides the current output signal into a high-frequency signal and a low-frequency signal. The rectifier 4 is used to rectify the signal into a DC signal. The processor is used to perform signal processing on the high-frequency signal and the low-frequency signal after the output signal is divided.

[0027] The specific working principle of a power supply device for a thin film pressure sensor 2 based on signal frequency division proposed in the embodiment of the present application includes: when the thin film pressure sensor 2 is working, a high-frequency electromagnetic wave signal, specifically a high-frequency signal of 10khz, is sent to the thin film pressure sensor 2 to perform inductive power supply with the coil inside the thin film pressure sensor 2, so that the thin film pressure sensor 2 can be wirelessly powered. When the thin film pressure sensor 2 is subjected to pressure, the resistance changes, and a pressure signal is generated. The signal under the current pressure is collected, and the pressure signal collected by the thin film pressure sensor 2 at this time is passed through the frequency divider 3, and the frequency divider 3 divides the current pressure signal into a high-frequency signal of 10khz and a low-frequency signal of 200hz.

[0028] The 10khz high-frequency signal is full-wave rectified into a DC signal by a rectifier 4, and then the current DC signal is filtered out by a filter 5 to remove the noise generated by the thin film pressure sensor 2 when collecting the pressure signal. The output voltage of the current signal is adjusted to a stable voltage by LDO6, and the A / D converter 7 is powered, thereby achieving the purpose of wirelessly powering the pressure sensor and outputting the signal normally.

[0029] In addition, the value obtained after the 200 Hz low-frequency signal is converted into a digital form by the A / D converter 7 is used to measure the pressure of the object under force, and the current data is output.

[0030] Example 2 like Figure 2As shown, based on a pressure sensor power supply device based on signal frequency division proposed in Example 1 of the present application, this embodiment provides a pressure sensor power supply method based on signal frequency division, which specifically includes the following steps: S1: Send a high-frequency electromagnetic wave signal to the pressure sensor, and the pressure sensor converts the high-frequency electromagnetic wave signal into electrical energy for its own use through electromagnetic resonance coupling.

[0031] S2: The pressure sensor collects external pressure signals.

[0032] S3: After the pressure sensor completes collecting the pressure signal, the signal output by the pressure sensor is divided into a high-frequency signal and a low-frequency signal.

[0033] S4: The high frequency signal is processed into a DC voltage to supply power to the A / D converter 7.

[0034] S5: The low-frequency signal is processed and output as pressure data.

[0035] Specifically, in step S1, the high-frequency electromagnetic wave signal is not greater than 10 khz.

[0036] Specifically, in the embodiment of the present application, the pressure sensor is a thin film pressure sensor 2, which is used to collect pressure signals and power the coil.

[0037] Specifically, in step S3, the signal is divided into a high-frequency signal and a low-frequency signal by a frequency divider 3 or a capacitor, which is not specifically limited in the embodiment of the present application.

[0038] Specifically, in step S3, the high frequency signal is not greater than 10 khz, and the low frequency signal is not less than 100 hz.

[0039] Specifically, in step S4, the high-frequency signal processing process includes: full-wave rectifying the divided high-frequency signal, rectifying the current signal into a DC signal, filtering the DC signal to remove noise in the pressure signal acquisition process, converting the filtered signal into a stable DC voltage through a voltage stabilizing unit, and using the current DC voltage to power the A / D converter 7.

[0040] Specifically, in step S5, the low-frequency signal is A / D converted to convert the continuously changing analog signal into a discrete digital signal output.

[0041] In this embodiment, the circuit for dividing the collected pressure signal by using the frequency divider 3 is as follows: Figure 1 As shown, in the embodiment of the present application, the frequency divider 3 is specifically a passive frequency divider 3, and may also be an active frequency divider 3, which is not specifically limited in the embodiment of the present application.

[0042] Example 3 In one embodiment, based on a pressure sensor power supply device based on signal frequency division proposed in an embodiment of the present application, the present application proposes a pressure sensor power supply device implemented by SIP, such as Figure 3 As shown, the device includes a frequency divider 3, a rectifier 4, a filter 5, an LDO 6 and an A / D converter 7, which are packaged together in a SIP manner. By packaging the current structure, the pressure sensor can be wirelessly powered by the device while outputting the measured value of the pressure sensor. The volume of the pressure sensor power supply device can be reduced, and the pressure sensor can be wirelessly powered when placed in a complex environment.

[0043] Through the above method, when the thin film pressure sensor 2 is placed in a complex scene, a high-frequency signal can be sent through the high-frequency signal source 1, and the collected pressure signal is processed into a power signal, and the pressure sensor is powered, thereby achieving the purpose of wireless power supply and reducing the cost of use.

[0044] The serial numbers of the above-mentioned embodiments of the present application are for description only and do not represent the advantages or disadvantages of the embodiments.

[0045] In the above embodiments of the present application, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, please refer to the relevant description of other embodiments.

[0046] In the several embodiments provided in this application, it should be understood that the disclosed technical content can be implemented in other ways. Among them, the device embodiments described above are only schematic. For example, the division of the units can be a logical function division. There may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of units or modules, which can be electrical or other forms.

[0047] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.

[0048] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

[0049] It should be understood that the above description is for illustration and not for limitation. Many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this patent should not be determined with reference to the above description, but rather with reference to the preceding claims and the full scope of equivalents to which such claims are entitled. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to be a waiver of such subject matter, nor should it be considered that the applicant has not considered such subject matter to be part of the disclosed inventive subject matter.

Claims

1. A pressure sensor power supply device based on signal frequency division, characterized in that: It includes a high-frequency signal source (1), a pressure sensor, a frequency divider (3), a rectifier (4), a filter (5), an LDO (6) and an A / D converter (7); The high-frequency signal source (1) is arranged at an interval with the pressure sensor, the power supply end of the pressure sensor is connected to a coil, the output end of the pressure sensor is connected to the input end of the frequency divider (3), the high-frequency output end of the frequency divider (3) is connected to the rectifier (4), the filter (5) and the LDO (6) in sequence, the output end of the LDO (6) is connected to the power supply end of the A / D converter (7), and the low-frequency output end of the frequency divider (3) is connected to the input end of the A / D converter (7).

2. The pressure sensor power supply device based on signal frequency division according to claim 1, characterized in that: The pressure sensor adopts a thin film pressure sensor (2).

3. A pressure sensor power supply method based on signal frequency division according to any one of claims 1 to 2, characterized in that: The process includes: S1: Send high-frequency electromagnetic wave signals to the pressure sensor, and the pressure sensor converts the high-frequency electromagnetic wave signals into electrical energy for its own use through electromagnetic resonance coupling; S2: pressure sensor collects external pressure signals; S3: After the pressure sensor completes collecting the pressure signal, the signal output by the pressure sensor is divided into a high-frequency signal and a low-frequency signal; S4: Processing the high frequency signal into a DC voltage to power the A / D converter (7); S5: Process the low-frequency signal into pressure data output.

4. The pressure sensor power supply method based on signal frequency division according to claim 3, characterized in that: In S1, the high-frequency electromagnetic wave signal is no greater than 10khz.

5. The pressure sensor power supply method based on signal frequency division according to claim 3, characterized in that: In S3, the high-frequency signal is not greater than 10khz and the low-frequency signal is not less than 100hz.

6. The pressure sensor power supply method based on signal frequency division according to claim 3, characterized in that: In S4, full-wave rectification is performed on the divided high-frequency signal to rectify the high-frequency signal into a DC signal.

7. The pressure sensor power supply method based on signal frequency division according to claim 6, characterized in that: The DC signal is filtered to remove the noise in the pressure signal acquisition process.

8. The pressure sensor power supply method based on signal frequency division according to claim 7, characterized in that: The filtered signal is converted into a DC voltage through LDO (6).

9. The pressure sensor power supply method based on signal frequency division according to claim 3, characterized in that: In S5, the low-frequency signal undergoes A / D conversion, converting the continuously changing analog signal into a discrete digital signal output.

10. A pressure sensor SIP packaging structure based on signal frequency division based on the device according to any one of claims 1-2, characterized in that: The frequency divider (3), the rectifier (4), the filter (5), the LDO (6) and the A / D converter (7) are sealed using a SIP packaging structure.

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