Semiconductor package including resin and electronic device including semiconductor package

Abstract

An electronic device according to an embodiment includes: a printed circuit board including a first side and a second side perpendicular to the first side; a plurality of solder balls disposed on one surface of the printed circuit board to be spaced apart from the first side and the second side; an electronic component including at least one circuit and disposed on at least some of the plurality of solder balls; and a resin disposed along the first side and filling a portion of a space disposed between the one surface of the printed circuit board and the electronic component, in which the printed circuit board includes a blocking structure disposed between the plurality of solder balls and the first side and extending along the first side to space at least some of the plurality of solder balls and the resin from each other.

Description

Technical Field

[0001] The present disclosure relates to a semiconductor package including a resin and an electronic device including the semiconductor package. Background Art

[0002] An electronic device may include various electronic components to provide various functions to a user. As electronic devices are miniaturized, electronic components may be provided in the electronic device in the form of semiconductor packages. The semiconductor package may include a printed circuit board and electronic components provided on the printed circuit board. For example, the electronic components may be electrically connected to the printed circuit board by a soldering process. Summary of the invention

[0003] Technical issues

[0004] When solder balls are disposed between electronic components and printed circuit boards, a space may be formed between the electronic components and the printed circuit boards. Resin may be disposed in the space between the electronic components and the printed circuit boards to protect the electronic components. In the case where the resin contacts the solder balls, damage to the solder balls may occur due to the difference in physical properties between the resin and the solder balls, and thus the electronic components may not be able to perform pre-designed functions. Electronic devices and semiconductor packages may require a structure in which solder balls and resin are spaced apart from each other.

[0005] The technical problems to be solved in this document are not limited to those described above, and other technical problems not mentioned herein will be clearly understood by ordinary technicians in the field to which the present disclosure belongs from the following description.

[0006] Technical Solution

[0007] According to an embodiment, an electronic device may include: a printed circuit board including a first side and a second side perpendicular to the first side; a plurality of solder balls arranged on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit and arranged on at least some of the plurality of solder balls; and a resin arranged along the first side and filling a portion of a space arranged between the surface of the printed circuit board and the electronic component, and wherein the printed circuit board may include: a blocking structure arranged between the plurality of solder balls and the first side and extending along the first side to separate at least some of the plurality of solder balls from the resin.

[0008] According to an embodiment, a semiconductor package may include: a printed circuit board including a first side and a second side perpendicular to the first side; a plurality of solder balls disposed on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit and disposed on at least some of the plurality of solder balls; and a resin disposed along the first side and filling a portion of a space disposed between the surface of the printed circuit board and the electronic component, and wherein the printed circuit board may include: a blocking structure disposed between the plurality of solder balls and the first side and extending along the first side to separate at least some of the plurality of solder balls from the resin.

[0009] Beneficial Effects

[0010] The semiconductor package and the electronic device according to the embodiment may provide a structure capable of improving the life of the electronic component since at least some of the plurality of solder balls are spaced apart from the resin.

[0011] Effects that can be obtained from the present disclosure are not limited to those described above, and any other effects not mentioned herein will be clearly understood by a person of ordinary skill in the art to which the present disclosure pertains from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0013] Figure 2 is a diagram illustrating an electronic device according to an embodiment.

[0014] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0015] Figure 4a is a perspective view of a semiconductor package according to an embodiment.

[0016] Figure 4b is a top plan view of a printed circuit board of a semiconductor package according to an embodiment.

[0017] Figure 5a is a diagram showing a method according to an embodiment of the present invention. Figure 4a 1 is a cross-sectional view of an example of a semiconductor package taken along line AA.

[0018] Figure 5b is a diagram showing a method according to an embodiment of the present invention. Figure 4a 1 is a cross-sectional view of an example of a semiconductor package taken along line BB.

[0019] Figure 6a is a top plan view of a printed circuit board of a semiconductor package according to an embodiment.

[0020] Figure 6b is a diagram showing a method according to an embodiment of the present invention. Figure 6a 2 is a cross-sectional view of an example of a semiconductor package taken along line CC'.

[0021] Figure 6c is a diagram showing a method according to an embodiment of the present invention. Figure 6a 2 is a cross-sectional view of an example of a semiconductor package taken along line DD′. DETAILED DESCRIPTION

[0022] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0023] Reference Figure 1 , the electronic device 101 in the network environment 100 may communicate with the electronic device 102 via the first network 198 (e.g., a short-range wireless communication network), or communicate with at least one of the electronic device 104 or the server 108 via the second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a user identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one of the above components (e.g., the connection terminal 178) may be omitted from the electronic device 101, or one or more other components may be added to the electronic device 101. In some embodiments, some of the above-described components (eg, sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (eg, display module 160).

[0024] The processor 120 may run, for example, software (e.g., program 140) to control at least one other component (e.g., hardware component or software component) of the electronic device 101 connected to the processor 120, and may perform various data processing or calculations. According to an embodiment, as at least part of the data processing or calculation, the processor 120 may store a command or data received from another component (e.g., sensor module 176 or communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store the resultant data in the non-volatile memory 134. According to an embodiment, the processor 120 may include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operationally independent or combined with the main processor 121. For example, when the electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or adapted to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or as part of the main processor 121.

[0025] When the main processor 121 is in an inactive (e.g., sleep) state, the auxiliary processor 123 (rather than the main processor 121) may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190), or when the main processor 121 is in an active state (e.g., running an application), the auxiliary processor 123 may control at least some of the functions or states related to at least one component among the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) together with the main processor 121. According to an embodiment, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., a camera module 180 or a communication module 190) that is functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (e.g., a neural processing unit) may include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model may be generated by machine learning. For example, such learning may be performed by the electronic device 101 where the artificial intelligence is executed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, for example. The artificial intelligence model may include multiple artificial neural network layers. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q network or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include a software structure in addition to a hardware structure.

[0026] The memory 130 may store various data used by at least one component of the electronic device 101 (e.g., the processor 120 or the sensor module 176). The various data may include, for example, software (e.g., the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

[0027] The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system (OS) 142 , middleware 144 , or applications 146 .

[0028] The input module 150 may receive commands or data to be used by other components (e.g., the processor 120) of the electronic device 101 from outside (e.g., a user) of the electronic device 101. The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus).

[0029] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. Depending on the embodiment, the receiver can be implemented as a separate part from the speaker, or as part of the speaker.

[0030] The display module 160 may visually provide information to the outside of the electronic device 101 (e.g., a user). The display module 160 may include, for example, a display, a holographic device, or a projector, and a control circuit for controlling a corresponding one of the display, the holographic device, and the projector. According to an embodiment, the display module 160 may include a touch sensor adapted to detect a touch or a pressure sensor adapted to measure the strength of a force caused by a touch.

[0031] The audio module 170 may convert sound into an electrical signal, or vice versa. According to an embodiment, the audio module 170 may obtain sound via the input module 150, or output sound via the sound output module 155 or an earphone of an external electronic device (e.g., electronic device 102) directly (e.g., wired) or wirelessly connected to the electronic device 101.

[0032] The sensor module 176 may detect an operating state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) outside the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0033] The interface 177 may support one or more specific protocols to be used to connect the electronic device 101 directly (e.g., wired) or wirelessly with an external electronic device (e.g., the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0034] The connection end 178 may include a connector, wherein the electronic device 101 can be physically connected to an external electronic device (e.g., the electronic device 102) via the connector. According to an embodiment, the connection end 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0035] The haptic module 179 may convert the electrical signal into mechanical stimulation (eg, vibration or motion) or electrical stimulation that can be recognized by the user via his sense of touch or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0036] The camera module 180 may capture still images or moving images. According to embodiments, the camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0037] The power management module 188 may manage power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0038] The battery 189 may power at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0039] The communication module 190 may support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. The communication module 190 may include one or more communication processors capable of operating independently from the processor 120 (e.g., an application processor (AP)) and supporting direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 may include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wireless Fidelity (Wi-Fi) Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip), or these various types of communication modules can be implemented as multiple components separated from each other (e.g., multiple chips). The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network (such as the first network 198 or the second network 199) using user information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0040] The wireless communication module 192 can support 5G networks after 4G networks and next-generation communication technologies (e.g., new radio (NR) access technology). NR access technology can support enhanced mobile broadband (eMBB), massive machine type communication (mMTC), or ultra-reliable low-latency communication (URLLC). The wireless communication module 192 can support high-frequency bands (e.g., millimeter wave bands) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for ensuring performance on high-frequency bands, such as, for example, beamforming, massive multiple-input multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. The wireless communication module 192 can support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 may support a peak data rate for implementing eMBB (e.g., 20 Gbps or greater), loss coverage for implementing mMTC (e.g., 164 dB or less), or U-plane delay for implementing URLLC (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip).

[0041] The antenna module 197 may transmit or receive a signal or power to or from the outside of the electronic device 101 (e.g., an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a radiating element formed of a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as the first network 198 or the second network 199) may be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). A signal or power may then be transmitted or received between the communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element may be additionally formed as part of the antenna module 197.

[0042] According to various embodiments, the antenna module 197 may form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a specified high frequency band (e.g., millimeter wave band), and the plurality of antennas are disposed on a second surface (e.g., top surface or side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving signals of the specified high frequency band.

[0043] At least some of the above components may be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicatively transmit signals (e.g., commands or data) therebetween.

[0044] According to an embodiment, a command or data may be sent or received between the electronic device 101 and the external electronic device 104 via the server 108 connected to the second network 199. Each of the electronic device 102 or the electronic device 104 may be a device of the same type as the electronic device 101, or a device of a different type from the electronic device 101. According to an embodiment, all or some operations to be executed in the electronic device 101 may be executed in one or more of the external electronic device 102, the external electronic device 104, or the server 108. For example, if the electronic device 101 should automatically execute a function or service or should execute a function or service in response to a request from a user or another device, the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service instead of executing the function or service, or the electronic device 101 may request the one or more external electronic devices to execute at least part of the function or service in addition to executing the function or service. The one or more external electronic devices receiving the request may execute at least part of the requested function or service, or execute another function or another service related to the request, and transmit the result of the execution to the electronic device 101. The electronic device 101 may provide the result as at least a partial reply to the request in the case of further processing the result or in the case of not further processing the result. To this end, cloud computing technology, distributed computing technology, mobile edge computing (MEC) technology or client-server computing technology, for example, may be used. The electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, the external electronic device 104 may include an Internet of Things (IoT) device. The server 108 may be an intelligent server using machine learning and / or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199. The electronic device 101 may be applied to intelligent services (e.g., smart homes, smart cities, smart cars or health care) based on 5G communication technology or IoT-related technologies.

[0045] Figure 2 is a diagram illustrating an electronic device according to an embodiment.

[0046] refer to Figure 2 , the electronic device 200 according to the embodiment may include a housing forming the appearance of the electronic device 200. For example, the housing may include a first surface (or front surface) 200A, a second surface (or rear surface) 200B, and a third surface (or side surface) 200C surrounding a space between the first surface 200A and the second surface 200B. In an embodiment, the housing may refer to a structure (e.g., Figure 3frame structure 240).

[0047] The electronic device 200 according to the embodiment may include a substantially transparent front plate 202. In the embodiment, the front plate 202 may form at least a portion of the first surface 200A. In the embodiment, the front plate 202 may include, for example, a glass plate or a polymer plate including various coatings, but is not limited thereto.

[0048] The electronic device 200 according to an embodiment may include a substantially opaque back plate 211. In an embodiment, the back plate 211 may form at least a portion of the second surface 200B. In an embodiment, the back plate 211 may be formed of coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS) or magnesium) or a combination of at least two of the above materials.

[0049] The electronic device 200 according to the embodiment may include a side frame structure (or side member) 218 ​​(eg, Figure 3 In an embodiment, the side frame structure 218 may be coupled to the front plate 202 and / or the rear plate 211 to form at least a portion of the third surface 200C of the electronic device 200. For example, the side frame structure 218 may form the entire third surface 200C of the electronic device 200, and for another example, the side frame structure 218 may form the third surface 200C of the electronic device 200 together with the front plate 202 and / or the rear plate 211.

[0050] Unlike the illustrated embodiment, in the case where the third surface 200C of the electronic device 200 is partially formed by the front plate 202 and / or the rear plate 211, the front plate 202 and / or the rear plate 211 may include an area that is bent from the edge of the front plate 202 and / or the rear plate 211 toward the rear plate 211 and / or the front plate 202 and extends seamlessly. The extension area of ​​the front plate 202 and / or the rear plate 211 may be located at both ends of the long side of the electronic device 200, for example, but is not limited to the above example.

[0051] In an embodiment, the side frame structure 218 may include metal and / or polymer. In an embodiment, the rear plate 211 and the side frame structure 218 may be integrally formed and may include the same material (e.g., a metal material such as aluminum), but is not limited thereto. For example, the rear plate 211 and the side frame structure 218 may be formed in separate configurations and / or may include different materials.

[0052] In an embodiment, the electronic device 200 may include at least one of the display 201, audio modules 203, 204, and 207, a sensor module (not shown), camera modules 205, 212, and 213, a key input device 217, a light emitting element (not shown), and / or a connector hole 208. In another embodiment, the electronic device 200 may omit at least one of the components (e.g., the key input device 217 or the light emitting element (not shown)), or may additionally include another component.

[0053] In an embodiment, the display 201 (eg, Figure 1 The display module 160 of the front panel 202 may be visually exposed through a substantial portion of the front panel 202. For example, at least a portion of the display 201 may be visible through the front panel 202 forming the first surface 200A. In an embodiment, the display 201 may be disposed on the back side of the front panel 202.

[0054] In an embodiment, the outer edge shape of the display 201 may be formed substantially the same as the outer edge shape of the front panel 202 adjacent to the display 201. In an embodiment, in order to expand the area in which the display 201 is visually exposed, the distance between the outer edge of the display 201 and the outer edge of the front panel 202 may be formed substantially the same.

[0055] In an embodiment, the display 201 (or the first surface 200A of the electronic device 200) may include a screen display area 201A. In an embodiment, the display 201 may provide visual information to the user through the screen display area 201A. In the illustrated embodiment, when the first surface 200A is observed from the front, the screen display area 201A is described as being spaced apart from the outer edge of the first surface 200A and being located inside the first surface 200A, but is not limited thereto. In another embodiment, when the first surface 200A is observed from the front, at least a portion of the outer edge of the screen display area 201A may be substantially consistent with the edge of the first surface 200A (or the front plate 202).

[0056] In an embodiment, the screen display area 201A may include a sensing area 201B configured to obtain biometric information of the user. Here, the meaning of "the screen display area 201A includes the sensing area 201B" can be understood to mean that at least a portion of the sensing area 201B can overlap with the screen display area 201A. For example, the sensing area 201B can mean an area that can display visual information through the display 201 like other areas of the screen display area 201A and also obtain biometric information (e.g., fingerprint) of the user. In another embodiment, the sensing area 201B can be formed in the key input device 217.

[0057] In an embodiment, the display 201 may include a first camera module 205 (eg, Figure 1 In an embodiment, an opening may be formed in the area of ​​the display 201, and the first camera module 205 (e.g., a perforated camera) may be at least partially disposed in the opening to face the first surface 200A. In this case, the screen display area 201A may surround at least a portion of the edge of the opening. In another embodiment, the first camera module 205 (e.g., an under-screen camera (UDC)) may be disposed under the display 201 to overlap with an area of ​​the display 201. In this case, the display 201 may provide visual information to the user through the area, and additionally, the first camera module 205 may obtain an image corresponding to a direction toward the first surface 200A through the area of ​​the display 201.

[0058] In an embodiment, display 201 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer that detects a magnetic field type stylus.

[0059] In an embodiment, audio modules 203, 204, and 207 (e.g., Figure 1 The audio module 170 ) may include microphone holes 203 and 204 and a speaker hole 207 .

[0060] In an embodiment, the microphone holes 203 and 204 may include a first microphone hole 203 formed in a partial area of ​​the third surface 200C and a second microphone hole 204 formed in a partial area of ​​the second surface 200B. A microphone (not shown) for obtaining external sound may be provided in the microphone holes 203 and 204. The microphone may include a plurality of microphones to sense the direction of the sound.

[0061] In an embodiment, the second microphone hole 204 formed in a partial area of ​​the second surface 200B may be disposed adjacent to the camera modules 212 and 213. For example, the second microphone hole 204 may obtain sound according to the operation of the camera modules 212 and 213. However, it is not limited thereto.

[0062] In an embodiment, the speaker hole 207 may include an external speaker hole 207 and a call receiver hole (not shown). The external speaker hole 207 may be formed in a portion of the third surface 200C of the electronic device 200. In another embodiment, the external speaker hole 207 may be implemented as one hole with the microphone hole 203. Although not shown, the call receiver hole (not shown) may be formed on another portion of the third surface 200C. For example, the call receiver hole may be formed on the opposite side of the external speaker hole 207 on the third surface 200C. For example, based on Figure 2 , the external speaker hole 207 may be formed on the third surface 200C corresponding to the lower portion of the electronic device 200, and the call receiver hole may be formed on the third surface 200C corresponding to the upper portion of the electronic device 200. However, it is not limited thereto, and in another embodiment, the call receiver hole may be formed at a position other than the third surface 200C. For example, the call receiver hole may be formed by a separated space between the front plate 202 (or the display 201) and the side frame structure 218.

[0063] In an embodiment, the electronic device 200 may include at least one speaker (not shown) configured to output sound to the outside of the housing through the external speaker hole 207 and / or a call receiver hole (not shown).

[0064] In an embodiment, a sensor module (not shown) (e.g., Figure 1 The sensor module 176 of the electronic device 200 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state of the electronic device 200. For example, the sensor module may include at least one of a proximity sensor, an HRM sensor, a fingerprint sensor, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illumination sensor.

[0065] In an embodiment, camera modules 205, 212, and 213 (e.g., Figure 1 The camera module 180 may include a first camera module 205, a second camera module 212 and a flash 213, the first camera module 205 is arranged to face the first surface 200A of the electronic device 200, and the second camera module 212 is arranged to face the second surface 200B.

[0066] In an embodiment, the second camera module 212 may include a plurality of cameras (eg, dual cameras, triple cameras, or quad cameras). However, the second camera module 212 is not necessarily limited to include a plurality of cameras, and may include one camera.

[0067] In an embodiment, the first camera module 205 and the second camera module 212 may include one or more lenses, image sensors, and / or image signal processors.

[0068] In an embodiment, the flash 213 may include, for example, a light emitting diode or a xenon lamp. In another embodiment, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on a surface of the electronic device 200 .

[0069] In an embodiment, the key input device 217 (e.g., Figure 1 The input module 150 of the electronic device 200 may be provided on the third surface 200C of the electronic device 200. In another embodiment, the electronic device 200 may not include some or all of the key input devices 217, and the key input devices 217 not included may be implemented on the display 201 in another form such as soft keys.

[0070] In an embodiment, the connector hole 208 may be formed on the third surface 200C of the electronic device 200 to accommodate a connector of an external device. Figure 1 The connection end 178 of the embodiment may be disposed in the connector hole 208. The electronic device 200 according to the embodiment may include an interface module (eg, Figure 1 interface 177).

[0071] According to an embodiment, the electronic device 200 may include a light emitting element (not shown). For example, the light emitting element (not shown) may be disposed on the first surface 200A of the housing. The light emitting element (not shown) may provide status information of the electronic device 200 in an optical form. In another embodiment, the light emitting element (not shown) may provide a light source in combination with the operation of the first camera module 205. For example, the light emitting element (not shown) may include an LED, an IR LED, and / or a xenon lamp.

[0072] Figure 3 is an exploded perspective view of an electronic device according to an embodiment.

[0073] Hereinafter, overlapping descriptions of configurations having the same reference numerals as those of the above-described configurations will be omitted.

[0074] refer to Figure 3 , the electronic device 200 according to the embodiment may include a frame structure 240 , a first printed circuit board 250 , a second printed circuit board 252 , a cover plate 260 , and a battery 270 .

[0075] In an embodiment, the frame structure 240 may include a structure forming the appearance of the electronic device 200 (eg, Figure 2 The frame structure 240 may include a side wall 241 and a support portion 243 extending inwardly from the side wall 241. In an embodiment, the frame structure 240 may be disposed between the display 201 and the rear plate 211. In an embodiment, the side wall 241 of the frame structure 240 may surround a space between the rear plate 211 and the front plate 202 (and / or the display 201), and the support portion 243 of the frame structure 240 may extend from the side wall 241 in the space.

[0076] In an embodiment, the frame structure 240 may support or accommodate other components included in the electronic device 200. For example, the display 201 may be provided on a surface of the frame structure 240 facing one direction (e.g., +z direction), and the display 201 may be supported by the support portion 243 of the frame structure 240. For another example, the first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 may be provided on another surface of the frame structure 240 facing a direction opposite to the direction (e.g., -z direction). The first printed circuit board 250, the second printed circuit board 252, the battery 270, and the second camera module 212 may be respectively placed in recesses defined by the sidewall 241 and / or the support portion 243 of the frame structure 240.

[0077] In an embodiment, the first printed circuit board 250, the second printed circuit board 252, and the battery 270 may be respectively coupled to the frame structure 240. For example, the first printed circuit board 250 and the second printed circuit board 252 may be fixedly disposed in the frame structure 240 by a coupling member such as a screw. For example, the battery 270 may be fixedly disposed in the frame structure 240 by an adhesive member (e.g., a double-sided tape), but it is not limited to the above example.

[0078] In an embodiment, the cover plate 260 may be disposed between the first printed circuit board 250 and the rear plate 211. In an embodiment, the cover plate 260 may be disposed on the first printed circuit board 250. For example, the cover plate 260 may be disposed on a surface of the first printed circuit board 250 facing the -z direction.

[0079] In an embodiment, the cover plate 260 may at least partially overlap the first printed circuit board 250 with respect to the z-axis. In an embodiment, the cover plate 260 may cover at least a portion of the area of ​​the first printed circuit board 250. Therefore, the cover plate 260 may protect the first printed circuit board 250 from physical impact or prevent a connector (not shown) coupled to the first printed circuit board 250 from being detached.

[0080] In an embodiment, the cover plate 260 may be fixedly disposed on the first printed circuit board 250 by a coupling member (eg, a screw), or may be coupled to the frame structure 240 together with the first printed circuit board 250 by a coupling member.

[0081] In an embodiment, the display 201 may be disposed between the frame structure 240 and the front plate 202. For example, the front plate 202 may be disposed on one side (eg, +z direction) of the display 201, and the frame structure 240 may be disposed on the other side (eg, -z direction).

[0082] In an embodiment, the front plate 202 may be coupled to the display 201. For example, the front plate 202 and the display 201 may be bonded to each other with an optical bonding member (eg, optically clear adhesive (OCA) or optically clear resin (OCR)) interposed therebetween.

[0083] In an embodiment, the front plate 202 may be coupled to the frame structure 240. For example, when viewed in the z-axis direction, the front plate 202 may include an outer edge portion extending outside the display 201, and may be attached to the frame structure 240 by an adhesive member (e.g., double-sided tape) disposed between the outer edge portion of the front plate 202 and the frame structure 240 (e.g., the side wall 241). However, it is not limited to the above example.

[0084] In an embodiment, the first printed circuit board 250 and / or the second printed circuit board 252 may be equipped with a processor (eg, Figure 1 processor 120), memory (e.g., Figure 1 Memory 130) and / or interfaces (e.g., Figure 1 Interface 177). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. The memory may include, for example, a volatile memory or a non-volatile memory. The interface may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / MMC connector, or an audio connector. In an embodiment, the first printed circuit board 250 and the second printed circuit board 252 may be operably or electrically connected to each other by a connecting member (e.g., a flexible printed circuit board).

[0085] In an embodiment, the battery 270 (e.g., Figure 1 The battery 270 may supply power to at least one component of the electronic device 200. For example, the battery 270 may include a rechargeable battery or a fuel cell. At least a portion of the battery 270 may be disposed on substantially the same plane as the first printed circuit board 250 and / or the second printed circuit board 252.

[0086] The electronic device 200 according to the embodiment may include an antenna module (not shown) (eg, Figure 1Antenna module 197). In an embodiment, the antenna module may be disposed between the rear plate 211 and the battery 270. The antenna module may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. For example, the antenna module may perform short-range communication with an external device, or wirelessly output and receive power with an external device.

[0087] In an embodiment, the first camera module 205 (eg, front camera) may be disposed on at least a portion of the frame structure 240 (eg, the support portion 243) so that the lens may be viewed through the front panel 202 (eg, Figure 2 A partial area (e.g., camera area 237) of the front surface 200A receives external light.

[0088] In an embodiment, the second camera module 212 (e.g., a rear camera) may be disposed between the frame structure 240 and the rear plate 211. In an embodiment, the second camera module 212 may be electrically connected to the first printed circuit board 250 via a connecting member (e.g., a connector). In an embodiment, the second camera module 212 may be disposed so that a lens may receive external light through the camera region 284 of the rear plate 211 of the electronic device 200.

[0089] In an embodiment, the camera area 284 may be formed on a surface of the rear plate 211 (eg, Figure 2 In an embodiment, the camera region 284 may be at least partially transparently formed so that external light may be incident on the lens of the second camera module 212. In an embodiment, at least a portion of the camera region 284 may protrude from the surface of the rear plate 211 at a predetermined height. However, it is not limited thereto, and in another embodiment, the camera region 284 may form a substantially same plane as the surface of the rear plate 211.

[0090] In an embodiment, the housing of the electronic device 200 may mean a configuration or structure that forms at least a portion of the appearance of the electronic device 200. In this regard, at least a portion of the front plate 202, the frame structure 240, and / or the rear plate 211 that form the appearance of the electronic device 200 may be referred to as the housing of the electronic device 200.

[0091] Figure 4a is a perspective view of a semiconductor package according to an embodiment, and Figure 4b is a top plan view of a printed circuit board of a semiconductor package according to an embodiment.

[0092] Reference Figure 4a and Figure 4b, a semiconductor package 400 according to an embodiment may include a printed circuit board 410, an electronic component 420, a plurality of solder balls 430, a resin 440 and / or a barrier structure 450. The semiconductor package 400 may be provided in an electronic device (eg, Figure 2 For example, the semiconductor package 400 may be disposed on a first printed circuit board (eg, Figure 3 For another example, the semiconductor package 400 may define at least a portion of the first printed circuit board 250.

[0093] The printed circuit board 410 may form electrical connections between components of the semiconductor package 400. According to an embodiment, the printed circuit board 410 may support components of the semiconductor package 400. According to an embodiment, the printed circuit board 410 may include a first side 411, a second side 412, a third side 413, and / or a fourth side 414. The first side 411, the second side 412, the third side 413, and / or the fourth side 414 may define a boundary of the printed circuit board 410. The first side 411 may extend in a first direction (e.g., +y direction). The second side 412 may be substantially perpendicular to the first side 411. The second side 412 may extend from an end of the first side 411 in a second direction (e.g., +x direction) substantially perpendicular to the first direction. The third side 413 may be substantially vertically connected to the second side 412. For example, the third side 413 may be connected to an end of the second side 412 facing the second direction. The third side 413 may be substantially parallel to the first side 411. The third side 413 may face away from the first side 411 and may be spaced apart from the first side 411 in the second direction. The fourth side 414 may extend from the other end of the first side 411 facing the first direction to the end of the third side 413 facing the first direction. The fourth side 414 may be substantially perpendicular to the first side 411 and the third side 413. The fourth side 414 may be substantially parallel to the second side 412. For example, the fourth side 414 may face away from the second side 412 and may be spaced apart from the second side 412 in the first direction. According to an embodiment, the length of the first side 411 may be substantially the same as the length of the third side 413. The length of the second side 412 may be substantially the same as the length of the fourth side 414. According to an embodiment, the length of each of the first side 411 and the third side 413 may be longer than the length of each of the second side 412 and the fourth side 414.

[0094] The electronic component 420 may include at least one circuit for implementing various functions of the electronic device 200. According to an embodiment, the electronic component 420 may be disposed on the surface 410a of the printed circuit board 410. For example, the electronic component 420 may be spaced apart from the surface 410a of the printed circuit board 410 in the direction (e.g., +z direction) that the surface 410a of the printed circuit board 410 faces. According to an embodiment, the electronic component 420 may include a plurality of chips stacked in the direction that the surface 410a of the printed circuit board 410 faces. For example, the plurality of chips may include a processor for recording (e.g., Figure 1 The memory device may include, for example, at least one of a static random access memory (SRAM), a dynamic random access memory (DRAM), a resistive random access memory (RRAM), a used random access memory (used RAM), a ferroelectric random access memory (ferroelectric RAM), a fast cycle random access memory (fast cycle RAM), a phase change random access memory (phase change RAM), a magnetic random access memory (magnetic RAM), and a NAND flash memory, but is not limited thereto. According to an embodiment, a plurality of chips may be electrically connected to each other through silicon vias. The electronic component 420 may be referred to as, for example, a multi-chip package (MCP).

[0095] A plurality of solder balls 430 may electrically connect the printed circuit board 410 and the electronic component 420. According to an embodiment, a plurality of solder balls 430 may be disposed on the surface 410a of the printed circuit board 410. For example, a plurality of solder balls 430 may be interposed between the printed circuit board 410 and the electronic component 420. According to an embodiment, each of the plurality of solder balls 430 may be disposed on the surface 410a of the printed circuit board 410 by a reflow process. For example, each of the plurality of solder balls 430 may include at least one of lead (Pb), tin (Sn), silver (Ag), copper (Cu), aluminum (Al), and an alloy of lead (Pb) and tin (Sn). According to an embodiment, the plurality of solder balls 430 may be spaced apart from the first side 411 and the second side 412. For example, the plurality of solder balls 430 may be surrounded by the first side 411, the second side 412, the third side 413, and the fourth side 414.

[0096] According to an embodiment, the electronic component 420 may be disposed on at least some of the plurality of solder balls 430. For example, the plurality of solder balls 430 may include a plurality of signal solder balls 431 and at least one dummy solder ball 432. Each of the plurality of signal solder balls 431 may electrically connect the electronic component 420 to the printed circuit board 410. At least one dummy solder ball 432 may be electrically disconnected from the electronic component 420. According to an embodiment, at least one dummy solder ball 432 may be disposed at an edge of a first region 410b of the printed circuit board 410 where the plurality of solder balls 430 are disposed. For example, at least one dummy solder ball 432 may surround the plurality of signal solder balls 431. For another example, at least one dummy solder ball 432 may be disposed outside a second region 410c of the printed circuit board 410 where the plurality of signal solder balls 431 are disposed. Among the first region 410b of the printed circuit board 410 where the plurality of solder balls 430 are disposed, the second region 410c may mean a portion of the first region 410b where the plurality of signal solder balls 431 are disposed. In other words, the second region 410c may be included in the first region 410b. According to an embodiment, when the printed circuit board 410 is viewed from above (e.g., in the -z direction or the +z direction), at least one dummy solder ball 432 may overlap with the electronic component 420, but is not limited thereto. According to an embodiment, when the printed circuit board 410 is viewed from above, at least one dummy solder ball 432 may be spaced apart from the electronic component 420 without overlapping with the electronic component 420.

[0097] According to an embodiment, the number of solder balls 430 spaced apart from the first side 411 by the shortest distance among the plurality of solder balls 430 may be less than the number of solder balls spaced apart from the second side 412 by the shortest distance among the plurality of solder balls. According to an embodiment, each of the plurality of solder balls 430 may be spaced apart from the first side 411 in the second direction (e.g., +x direction). A portion (or set) of the plurality of solder balls 430 may be closer to the first side 411 than the remaining portion of the plurality of solder balls 430. For example, a first distance d1 between a portion (or set) 433 of the plurality of solder balls 430 and the first side 411 may be shorter than a distance between the remaining portion of the plurality of solder balls 430 and the first side 411. The first distance d1 may be parallel to the second direction. According to an embodiment, each of the plurality of solder balls 430 may be spaced apart from the second side 412 in the first direction (e.g., +y direction). Another portion (or another set) 434 of the plurality of solder balls 430 may be closer to the second side 412 than the remaining portion of the plurality of solder balls 430. For example, the second distance d2 between the other portion 434 of the plurality of solder balls 430 and the second side 412 may be shorter than the distance between the remaining portion of the plurality of solder balls 430 and the second side 412. The second distance d2 may be parallel to the first direction. According to an embodiment, the number of the portion 433 of the plurality of solder balls 430 may be less than the number of the other portion 434 of the plurality of solder balls 430. The portion 433 of the plurality of solder balls 430 may include only dummy solder balls 432.

[0098] According to an embodiment, among the plurality of solder balls 430, the shortest distance between the plurality of signal solder balls 431 electrically connected to the electronic component 420 and the second side 412 may be shorter than the shortest distance between the plurality of signal solder balls 431 and the first side 411. Each of the plurality of signal solder balls 431 may be spaced apart from the first side 411 in the second direction (e.g., +x direction). A portion (or set) 431a of the plurality of signal solder balls 431 may be closer to the first side 411 than the remaining portion of the plurality of signal solder balls 431. For example, a third distance d3 between a portion 431a of the plurality of signal solder balls 431 and the first side 411 may be shorter than a distance between the remaining portion of the plurality of signal solder balls 431 and the first side 411. The third distance d3 may be parallel to the second direction. Each of the plurality of signal solder balls 431 may be spaced apart from the second side 412 in the first direction. Another portion (or another set) 431b of the plurality of signal solder balls 431 may be closer to the second side 412 than the remaining portion of the plurality of signal solder balls 431. The other portion 431b of the plurality of signal solder balls 431 may mean a plurality of solder balls 430 excluding at least one dummy solder ball 432 from another portion 434 of the plurality of solder balls 430. For example, a fourth distance d4 between the other portion 431b of the plurality of signal solder balls 431 and the second side 412 may be shorter than a distance between the remaining portion of the plurality of signal solder balls 431 parallel to the first direction and the second side 412. The fourth distance d4 may be parallel to the first direction. According to an embodiment, the fourth distance d4 may be shorter than the third distance d3.

[0099] The resin 440 may protect the printed circuit board 410 and the electronic component 420 from impacts transmitted from the outside of the semiconductor package 400. According to an embodiment, the resin 440 may be disposed between the printed circuit board 410 and the electronic component 420. For example, the resin 440 may fill a portion of the space disposed between the surface 410a of the printed circuit board 410 and the electronic component 420. For example, the resin 440 may include an epoxy resin. According to an embodiment, the resin 440 may be referred to as an underfill resin. For example, the resin 440 may be disposed on the printed circuit board 410 by a capillary underfill (CUF) method. When the semiconductor package 400 is manufactured, the resin 440 may be disposed on the printed circuit board 410 in a molten state to be adjacent to the electronic component 420. The molten resin 440 may be introduced into the space between the electronic component 420 and the printed circuit board 410 by a capillary phenomenon. The resin introduced into the space between the electronic component 420 and the printed circuit board 410 may be cooled and fill a portion of the space disposed between the electronic component 420 and the surface 410a of the printed circuit board 410.

[0100] According to an embodiment, the resin 440 may be disposed along the first side 411 and the third side 413 to minimize the number of solder balls contacting the resin 440. For example, when manufacturing the semiconductor package 400, the resin 440 may be introduced based on the first side 411 and the third side 413. According to an embodiment, the resin 440 may include a first coverage area 441 disposed along the first side 411 and a second coverage area 442 disposed along the third side 413. The first coverage area 441 may be spaced apart from the first side 411 and may extend in a first direction substantially parallel to the first side 411. The second coverage area 442 may be spaced apart from the first coverage area 441. For example, the second coverage area 442 may be spaced apart from the first coverage area 441 in the second direction. The second coverage area 442 may be spaced apart from the third side 413 and may extend in a first direction substantially parallel to the third side 413. For example, when manufacturing the semiconductor package 400, in the case where the resin 440 is introduced based on the second side 412, since the number of solder balls close to the second side 412 is greater than the number of solder balls close to the first side 411, the number of solder balls in contact with the resin 440 may increase. As the number of solder balls in contact with the resin 440 increases, the possibility of a decrease in the life of the semiconductor package 400 may increase. For example, since the thermal expansion coefficient of the resin 440 is different from the thermal expansion coefficient of the plurality of solder balls 430, as the number of solder balls in contact with the resin 440 increases, damage to the plurality of solder balls 430 may occur due to thermal expansion or thermal contraction of the resin 440. The semiconductor package 400 according to the embodiment may provide a structure capable of increasing the life of the semiconductor package 400 by the resin 440 provided along the first side 411 and the third side 413.

[0101] According to an embodiment, a ratio of an area of ​​a portion of the surface 410a of the printed circuit board 410 in contact with the resin 440 to an area of ​​the surface 410a of the printed circuit board 410 may be about 20% to 40%. For example, a ratio of an area of ​​a portion of the surface 410a of the printed circuit board 410 in contact with the resin 440 to an area of ​​the surface 410a of the printed circuit board 410 may be about 30%. For example, in a case where the amount of the resin 440 disposed on the printed circuit board 410 is too small, the semiconductor package 400 may be sensitive to a physical impact transmitted from outside the semiconductor package 400. In a case where the amount of the resin 440 disposed on the printed circuit board 410 is too large, the semiconductor package 400 may be sensitive to thermal stress. The semiconductor package 400 according to an embodiment may provide a structure robust to physical impact and / or thermal stress by including an appropriate amount of the resin 440.

[0102] When manufacturing the semiconductor package 400, the blocking structure 450 may delay the movement of the molten resin 440. For example, when manufacturing the semiconductor package 400, the blocking structure 450 may delay the inflow of the molten resin 440 disposed along the first side 411 in the second direction. For another example, when manufacturing the semiconductor package 400, the blocking structure 450 may delay the inflow of the molten resin 440 disposed along the third side 413 in a direction opposite to the second direction (e.g., -x direction). According to an embodiment, the blocking structure 450 may be disposed between the plurality of solder balls 430 and the first side 411. The blocking structure 450 may be disposed between the plurality of solder balls 430 and the third side 413. For example, the blocking structure 450 may be spaced apart from the first side 411 in the second direction. For another example, the blocking structure 450 may be spaced apart from the third side 413 in a direction opposite to the second direction (e.g., -x direction). In the case where the blocking structure 450 is not provided, the resin 440 and the portions of the plurality of signal solder balls 431 may contact each other by the movement of the molten resin 440 provided along the first side 411. In the case where the portions of the resin 440 and the plurality of signal solder balls 431 contact each other, damage to the portions of the plurality of signal solder balls 431 may occur due to the difference in thermal expansion coefficients between the resin 440 and the plurality of signal solder balls 431. As damage to the portions of the plurality of signal solder balls 431 may occur, the electronic component 420 may not be able to perform a pre-designed function. In the case where the blocking structure 450 is provided between the first side 411 and the plurality of solder balls 430, as the movement of the molten resin 440 is delayed by the blocking structure 450, the molten resin 440 may be cooled before contacting the plurality of signal solder balls 431. As the molten resin 440 is cooled before contacting the plurality of signal solder balls 431, damage to the plurality of signal solder balls 431 caused by thermal deformation of the resin 440 may be prevented.

[0103] According to an embodiment, the blocking structure 450 may separate at least a portion of the plurality of solder balls 430 from the resin 440. For example, through the blocking structure 450, the resin 440 may be spaced apart from the plurality of signal solder balls 431 and may contact at least one dummy solder ball 432, but is not limited thereto. According to an embodiment, the resin 440 may be spaced apart from all of the plurality of solder balls 430 by the blocking structure 450. According to an embodiment, when the printed circuit board 410 is viewed from above (e.g., in the -z direction or the +z direction), the blocking structure 450 may overlap with the electronic component 420, but is not limited thereto. According to an embodiment, when the printed circuit board 410 is viewed from above, the blocking structure 450 may be spaced apart from the electronic component 420. For example, when the printed circuit board 410 is viewed from above, the blocking structure 450 may be spaced apart from the electronic component 420 in a direction (e.g., in the -x direction) toward the first side 411. For example, when the printed circuit board 410 is viewed from above, the blocking structure 450 may be spaced apart from the electronic component 420 in a direction (e.g., +x direction) toward the third side 413. According to an embodiment, the blocking structure 450 may extend along the first side 411. The blocking structure 450 may extend along the third side 413. For example, the blocking structure 450 may have a shape extending in a first direction (e.g., +y direction) along the first side 411. For another example, the blocking structure 450 may have a shape extending in the first direction along the third side 413.

[0104] According to an embodiment, the blocking structure 450 may include at least one blocking groove 451. The at least one blocking groove 451 may be formed by recessing the surface 410a of the printed circuit board 410 inwardly. For example, the at least one blocking groove 451 may be formed by recessing a portion of the printed circuit board 410 in a direction (e.g., -z direction) from the electronic component 420 toward the printed circuit board 410. When the semiconductor package 400 is manufactured, the molten resin 440 may be accommodated in the at least one blocking groove 451. As the molten resin 440 is accommodated in the at least one blocking groove 451, the movement of the resin 440 by an amount corresponding to the volume of the at least one blocking groove 451 may be delayed. As the movement of the molten resin 440 is delayed, the molten resin 440 may be cooled in the at least one blocking groove 451. According to an embodiment, the at least one blocking groove 451 may be formed by removing portions of a plurality of layers included in the printed circuit board 410. For example, the at least one blocking groove 451 may be formed by removing portions of a plurality of conductive layers and portions of a plurality of non-conductive layers included in the printed circuit board 410. For example, as portions of the plurality of layers included in the printed circuit board 410 are removed, portions of the plurality of non-conductive layers may be exposed to the outside of the printed circuit board 410 through at least one blocking groove 451. For example, as portions of the plurality of layers included in the printed circuit board 410 are removed, portions of the plurality of conductive layers may be exposed to the outside of the printed circuit board 410 through at least one blocking groove 451.

[0105] As described above, the semiconductor package 400 according to the embodiment may provide a structure capable of increasing the lifespan of the semiconductor package 400 through the barrier structure 450 disposed between the first side 411 and / or the third side 413 and the plurality of solder balls 430 .

[0106] Figure 5a It is shown along Figure 4a A cross-sectional view of an example of a semiconductor package taken along line AA of FIG. 1 , and Figure 5b It is shown along Figure 4a 1 is a cross-sectional view of an example of a semiconductor package taken along line BB.

[0107] refer to Figure 5a and Figure 5bAccording to an embodiment, the printed circuit board 410 may include at least one first conductive pad 415. The at least one first conductive pad 415 may be disposed on the surface 410a of the printed circuit board 410 and may be in contact with at least some of the plurality of solder balls 430. For example, the at least one first conductive pad 415 may protrude from the surface 410a of the printed circuit board 410 in a direction (e.g., +z direction) that the surface 410a of the printed circuit board 410 faces. According to an embodiment, the number of the at least one first conductive pad 415 may correspond to the number of the plurality of solder balls 430. For example, the number of the at least one first conductive pad 415 may be equal to the number of the plurality of signal solder balls 431 and the number of at least one dummy solder ball (e.g., Figure 4a and Figure 4b The at least one first conductive pad 415 may be electrically connected to a signal line (not shown) disposed inside the printed circuit board 410.

[0108] According to an embodiment, the electronic component 420 may include at least one second conductive pad 421. The at least one second conductive pad 421 may face the surface 410a of the printed circuit board 410. The at least one second conductive pad 421 may contact at least some of the plurality of solder balls 430. For example, the at least one second conductive pad 421 may contact the plurality of signal solder balls 431. The at least one second conductive pad 421 may be spaced apart from the at least one dummy solder ball 432. According to an embodiment, at least some of the plurality of solder balls 430 may electrically connect the printed circuit board 410 and the electronic component 420 by contacting the at least one first conductive pad 415 and the at least one second conductive pad 421.

[0109] According to an embodiment, at least one blocking groove 451 may include a plurality of blocking grooves 451a, 451b, and 451c spaced apart from each other along a first direction (e.g., +y direction) substantially parallel to the first side 411. For example, each of the plurality of blocking grooves 451a, 451b, and 451c may be disposed between the second side 412 and the fourth side 414 and spaced apart from each other. According to an embodiment, a signal line (not shown) electrically connected to the electronic component 420 may be disposed between the plurality of blocking grooves 451a, 451b, and 451c. Through the signal line, the electronic component 420 may receive data or power from the outside of the semiconductor package 400, or output data or power to the outside of the semiconductor package 400.

[0110] According to an embodiment, a height h1 of each of the plurality of solder balls 430 may be approximately 0.1 mm to 0.16 mm. The height h1 of each of the plurality of solder balls 430 may mean a length in a direction (eg, +z direction) facing the surface 410a of the printed circuit board 410.

[0111] According to an embodiment, a depth t1 of the at least one blocking groove 451 may be 0.05 mm. The depth t1 of the at least one blocking groove 451 may mean a length in a direction (eg, −z direction) from the electronic component 420 toward the printed circuit board 410 .

[0112] According to an embodiment, each of the plurality of signal solder balls 431 may be spaced apart from at least one blocking recess 451. For example, a fifth distance d5 between each of the plurality of signal solder balls 431 and a first side surface 451d of at least one blocking recess 451 may be less than or equal to five times the height h1 of each of the plurality of signal solder balls 431. The first side surface 451d of at least one blocking recess 451 may mean a side surface close to the plurality of signal solder balls 431 among at least one side surface 451d and 451e of the blocking recess 451 perpendicular to the second direction (e.g., +x direction). For another example, the fifth distance d5 may be about 0.5 mm or less, but is not limited thereto.

[0113] According to an embodiment, the width w1 of at least one blocking groove 451 may be greater than or equal to twice the height of each of the plurality of signal solder balls 431. The width w1 of at least one blocking groove 451 may mean a distance between a first side surface 451d of at least one blocking groove 451 and a second side surface 451e facing the first side surface 451d. The second side surface 451e may be spaced apart from the first side surface 451d in a direction opposite to the second direction (e.g., -x direction). The second side surface 451e may mean a side surface close to the first side 411 among the side surfaces 451d and 451e of at least one blocking groove 451 perpendicular to the second direction (e.g., +x direction). For example, the width w1 of at least one blocking groove 451 may be about 0.2 mm or more, but is not limited thereto.

[0114] According to an embodiment, a sixth distance d6 between the outer side surface 420a of the electronic component 420 and the at least one blocking groove 451 may be less than or equal to 10 times the height h1 of each of the plurality of signal solder balls 431. The outer side surface 420a of the electronic component 420 may mean a surface of the electronic component 420 that is substantially perpendicular to the second direction (e.g., +x direction) and faces the first side 411. For example, the sixth distance d6 between the second side surface 451e of the at least one blocking groove 451 and the outer side surface 420a of the electronic component 420 may be about 1 mm or less, but is not limited thereto.

[0115] According to an embodiment, a ratio of an area of ​​the surface 410a of the printed circuit board 410 in contact with the first side 411 and the resin 440 between the plurality of solder balls 430 to an area of ​​the surface 410a of the printed circuit board 410 may be about 15%. Although not shown in FIG. 5 , a ratio of an area of ​​the surface 410a of the printed circuit board 410 in contact with the third side (e.g., Figure 4a and Figure 4b A ratio of an area where the resin 440 contacts between the third side 413 of the printed circuit board 410 and the plurality of solder balls 430 to an area of ​​the surface 410a of the printed circuit board 410 may be about 15%.

[0116] As described above, the semiconductor package 400 according to the embodiment may provide a structure robust against thermal stress and / or physical impact by at least one blocking groove 451 separating at least a portion of the plurality of signal solder balls 431 from the resin 440 .

[0117] Figure 6a is a top plan view of a printed circuit board of a semiconductor package according to an embodiment, Figure 6b It is shown along Figure 6a A cross-sectional view of an example of a semiconductor package taken along line CC', and Figure 6c is a diagram showing a method according to an embodiment of the present invention. Figure 6a 2 is a cross-sectional view of an example of a semiconductor package taken along line DD′.

[0118] refer to Figure 6a , Figure 6b and Figure 6c According to an embodiment, the blocking structure 450 may include at least one blocking partition wall 452. The at least one blocking partition wall 452 may protrude from the surface 410a of the printed circuit board 410. For example, the at least one blocking partition wall 452 may protrude from the surface 410a of the printed circuit board 410 along a direction (e.g., +z direction) to which the surface 410a of the printed circuit board 410 faces. According to an embodiment, the at least one blocking partition wall 452 may extend along the first side 411. For example, the at least one blocking partition wall 452 may extend in a first direction (e.g., +y direction) between the first side 411 and the plurality of solder balls 430. According to an embodiment, the at least one blocking partition wall 452 may extend along the third side 413. For example, the at least one blocking partition wall 452 may extend in a first direction (e.g., +y direction) between the third side 413 and the plurality of solder balls 430. When the semiconductor package 400 is manufactured, the at least one blocking partition wall 452 may prevent the molten resin 440 disposed along the first side 411 from moving in a second direction (e.g., +x direction). With movement prevented by the at least one blocking partition wall 452 , the molten resin 440 may be cooled by being spaced apart from at least some of the plurality of solder balls 430 .

[0119] According to an embodiment, the printed circuit board 410 may include a support pad 416 disposed between the first side 411 and the plurality of solder balls 430. The support pad 416 may be disposed on the surface 410a of the printed circuit board 410. According to an embodiment, at least one blocking partition wall 452 may be disposed on the support pad 416. For example, at least one blocking partition wall 452 may be disposed on the surface of the support pad 416 facing the electronic component 420. According to an embodiment, at least one blocking partition wall 452 may be disposed on the support pad 416 by a reflow process. For example, at least one blocking partition wall 452 may include at least one of lead (Pb), tin (Sn), silver (Ag), copper (Cu), aluminum (Al), and an alloy of lead (Pb) and tin (Sn). However, it is not limited thereto, and the support pad 416 may be omitted according to an embodiment. In the case where the support pad 416 is omitted, at least one blocking partition wall 452 may contact the surface 410a of the printed circuit board 410.

[0120] According to an embodiment, at least one blocking partition wall 452 may be in contact with the electronic component 420. For example, at least one blocking partition wall 452 may be in contact with a surface 420b of the electronic component 420 that faces the surface 410a of the printed circuit board 410.

[0121] According to an embodiment, a height h2 of support pad 416 may be less than a height h1 of plurality of solder balls 430. For example, height h2 of support pad 416 may be about 0.02 mm, but is not limited thereto.

[0122] According to an embodiment, each of the plurality of signal solder balls 431 may be spaced apart from at least one blocking partition wall 452. For example, a seventh distance d7 between each of the plurality of signal solder balls 431 and a first side surface 452a of at least one blocking partition wall 452 may be less than or equal to 5 times the height h1 of each of the plurality of signal solder balls 431. The first side surface 452a of at least one blocking partition wall 452 may mean a side surface close to the plurality of signal solder balls 431 among side surfaces 452a and 452b of at least one blocking partition wall 452 substantially perpendicular to the second direction (e.g., +x direction). For another example, the seventh distance d7 may be about 0.5 mm or less, but is not limited thereto.

[0123] According to an embodiment, the width w2 of at least one blocking partition wall 452 may be greater than or equal to twice the height h1 of each of the plurality of signal solder balls 431. The width w2 of at least one blocking partition wall 452 may mean a distance between a first side surface 452a of at least one blocking partition wall 452 and a second side surface 452b facing the first side surface 452a. The second side surface 452b may be spaced apart from the first side surface 452a in a direction (e.g., -x direction) opposite to the second direction. The second side surface 452b may mean a side surface close to the first side 411 among the side surfaces 452a and 452b of at least one blocking partition wall 452 substantially perpendicular to the second direction (e.g., +x direction). The width w2 of at least one blocking partition wall 452 may be about 0.2 mm or more, but is not limited thereto.

[0124] According to an embodiment, an eighth distance d8 between the outer side surface 420a of the electronic component 420 and the at least one blocking partition wall 452 may be less than or equal to 10 times the height h1 of each of the plurality of signal solder balls 431. For example, the eighth distance d8 between the second side surface 452b of the at least one blocking partition wall 452 and the outer side surface 420a of the electronic component 420 may be about 1 mm or less, but is not limited thereto.

[0125] According to an embodiment, a ratio of an area of ​​the surface 410a of the printed circuit board 410 in contact with the resin 440 between the first side 411 and the plurality of solder balls 430 to an area of ​​the surface 410a of the printed circuit board 410 may be about 15%. Figure 6b 4. However, the surface 410a of the printed circuit board 410 is not shown in the figure, but the surface 410a of the printed circuit board 410 is connected to the third side (eg, Figure 6a A ratio of an area where the resin 440 contacts between the third side 413 of the printed circuit board 410 and the plurality of solder balls 430 to an area of ​​the surface 410a of the printed circuit board 410 may be about 15%.

[0126] As described above, the semiconductor package 400 according to the embodiment may provide a structure robust against thermal stress and / or physical impact by at least one barrier partition wall 452 separating at least a portion of the plurality of solder balls 430 from the resin 440 .

[0127] At the same time, Figure 6a , Figure 6b and Figure 6c , it is shown that one partition wall is provided along the first side 411 and one partition wall is provided along the third side 413, but the embodiment is not limited thereto. For example, at least one blocking partition wall 452 may include a plurality of blocking partition walls extending along the first side 411 and spaced apart from each other. For example, at least one blocking partition wall 452 may include a plurality of blocking partition walls extending along the third side 413 and spaced apart from each other.

[0128] According to an embodiment, an electronic device (e.g., Figure 2 The electronic device 200 may include: a printed circuit board (eg, Figure 4a and Figure 4b PCB 410), including a first side (eg, Figure 4a and Figure 4b a first side 411) and a second side perpendicular to the first side (eg, Figure 4a and Figure 4b a second side 412 of the semiconductor substrate); a plurality of solder balls (eg, Figure 4a and Figure 4b Solder balls 430) are disposed on a surface of a printed circuit board (eg, Figure 4a and Figure 4b 410a) and is spaced apart from the first side and the second side; an electronic component (eg, Figure 4a and Figure 4b electronic component 420), including at least one circuit and disposed on at least some of the plurality of solder balls; and a resin (eg, Figure 4a and Figure 4b The printed circuit board may include a resin 440 disposed along the first side and filling a portion of a space defined between a surface of the printed circuit board and the electronic component, and wherein the printed circuit board may include a blocking structure (e.g., Figure 4a and Figure 4b A barrier structure 450 is provided between the plurality of solder balls and the first side and extends along the first side to separate at least some of the plurality of solder balls from the resin.

[0129] According to an embodiment, the number of solder balls spaced apart from the first side at the shortest distance among the plurality of solder balls may be smaller than the number of solder balls spaced apart from the second side at the shortest distance among the plurality of solder balls.

[0130] According to an embodiment, a plurality of signal solder balls (eg, Figure 4a and Figure 4b The shortest distance between the plurality of signal solder balls 431 and the second side (eg, Figure 4b The fourth distance d4) may be greater than the shortest distance between the plurality of signal solder balls and the first side (eg, Figure 4b The third distance d3) is short.

[0131] According to an embodiment, the length of the second side may be shorter than the length of the first side.

[0132] According to an embodiment, the blocking structure may include at least one blocking groove (eg, Figure 4a and Figure 4b at least one blocking groove 451).

[0133] According to an embodiment, the at least one blocking groove may include a plurality of blocking grooves (eg, Figure 5b Multiple blocking grooves 451a, 451b and 451c).

[0134] According to an embodiment, the blocking structure may include a blocking partition wall (eg, Figure 6a , Figure 6b and Figure 6c of the blocking partition wall 452).

[0135] According to an embodiment, the printed circuit board may further include a support pad (eg, Figure 6b and Figure 6c According to an embodiment, the blocking partition wall may be disposed on the support pad.

[0136] According to an embodiment, the blocking partition wall may extend from a surface of the printed circuit board to a surface of the electronic component facing the printed circuit board (eg, Figure 6b surface 420b).

[0137] According to an embodiment, the electronic component may include a plurality of chips stacked along a direction in which a surface of a printed circuit board faces.

[0138] According to an embodiment, the plurality of solder balls may include a plurality of signal solder balls (eg, Figure 4a and Figure 4b A plurality of signal solder balls 431) and at least one dummy solder ball (eg, Figure 4a and Figure 4b According to an embodiment, the resin may be spaced apart from the plurality of signal solder balls and may be in contact with the at least one dummy solder ball.

[0139] According to an embodiment, the printed circuit board may further include at least one first conductive pad (eg, Figure 5a According to an embodiment, the electronic component may further include at least one second conductive pad (eg, Figure 5a The second conductive pad 421).

[0140] According to an embodiment, a ratio of an area of ​​a portion of the surface of the printed circuit board that contacts the resin to an area of ​​the surface of the printed circuit board may be 20% to 40%.

[0141] According to an embodiment, a thermal expansion coefficient of the resin may be different from a thermal expansion coefficient of the plurality of solder balls.

[0142] According to an embodiment, the printed circuit board may further include a third side (eg, Figure 4a and Figure 4b According to an embodiment, the resin may include a first coverage area disposed along the first side (eg, Figure 4a and Figure 4b A first coverage area 441) and a second coverage area (eg, Figure 4a and Figure 4b of the second coverage area 442).

[0143] According to an embodiment, a semiconductor package (eg, Figure 4a and Figure 4b The semiconductor package 400 may include: a printed circuit board (eg, Figure 4a and Figure 4b PCB 410), including a first side (eg Figure 4a and Figure 4b a first side 411) and a second side perpendicular to the first side (eg Figure 4a and Figure 4b a second side 412 of the semiconductor substrate); a plurality of solder balls (eg, Figure 4a and Figure 4b Solder balls 430) are disposed on a surface of a printed circuit board (eg, Figure 4a and Figure 4b 410a) on the surface of the device and spaced apart from the first side and the second side; an electronic component (eg, Figure 4a and Figure 4b The electronic component 420 includes at least one circuit and is disposed on at least some of the plurality of solder balls; and a resin (eg, Figure 4a and Figure 4b The resin 440 is disposed along the first side and fills a portion of a space disposed between a surface of the printed circuit board and the electronic component, and wherein the printed circuit board may include: a blocking structure (eg, Figure 4a and Figure 4b A barrier structure 450 is provided between the plurality of solder balls and the first side and extends along the first side to separate at least some of the plurality of solder balls from the resin.

[0144] According to an embodiment, the number of solder balls spaced apart from the first side at the shortest distance among the plurality of solder balls may be smaller than the number of solder balls spaced apart from the second side at the shortest distance among the plurality of solder balls.

[0145] According to an embodiment, a plurality of signal solder balls (eg, Figure 4a and Figure 4b The shortest distance between the plurality of signal solder balls 431 and the second side (eg, Figure 4b The fourth distance d4) is greater than the shortest distance between the plurality of signal solder balls and the first side (eg, Figure 4b The third distance d3) is short.

[0146] According to an embodiment, the blocking structure may include at least one blocking groove (eg, Figure 4a and Figure 4b at least one blocking groove 451).

[0147] According to an embodiment, the blocking structure may include a blocking partition wall (eg, Figure 6a , Figure 6b and Figure 6c of the blocking partition wall 452).

[0148] The electronic device according to various embodiments may be one of various types of electronic devices. The electronic device may include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a household appliance. According to an embodiment of the present disclosure, the electronic device is not limited to those electronic devices described above.

[0149] It should be understood that the various embodiments of the present disclosure and the terms used therein are not intended to limit the technical features set forth herein to specific embodiments, but include various changes, equivalent forms or alternative forms for the corresponding embodiments. For the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that the nouns in the singular form corresponding to the term may include one or more things, unless the relevant context clearly indicates otherwise. As used herein, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C" and "at least one of A, B or C" may include any one or all possible combinations of the items listed together with the corresponding one of the multiple phrases. As used herein, terms such as "1st" and "2nd" or "first" and "second" may be used to simply distinguish the corresponding component from another component, and do not limit the component in other aspects (e.g., importance or order). It will be understood that if an element (e.g., a first element) is referred to as being "combined with" or "connected with" another element (e.g., a second element) when the term "operably" or "communicatively" is used or when the term "operably" or "communicatively" is not used, it means that the element can be directly (e.g., wired) connected to the other element, wirelessly connected to the other element, or connected to the other element via a third element.

[0150] As used in connection with various embodiments of the present disclosure, the term "module" may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with other terms (e.g., "logic," "logic block," "portion," or "circuit"). A module may be a single integrated component adapted to perform one or more functions or a minimum unit or portion of the single integrated component. For example, according to an embodiment, a module may be implemented in the form of an application specific integrated circuit (ASIC).

[0151] The various embodiments described herein may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). For example, under the control of a processor, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) may call at least one of the one or more instructions stored in the storage medium and execute the at least one instruction with or without the use of one or more other components. This enables the machine to operate to perform at least one function according to the at least one instruction called. The one or more instructions may include code generated by a compiler or code that can be run by an interpreter. A machine-readable storage medium may be provided in the form of a non-transitory storage medium. Among them, the term "non-transitory" only means that the storage medium is a tangible device and does not include signals (e.g., electromagnetic waves), but the term does not distinguish between a case where data is semi-permanently stored in a storage medium and a case where data is temporarily stored in a storage medium.

[0152] According to an embodiment, the method according to various embodiments of the present disclosure may be included and provided in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be released in the form of a machine-readable storage medium (e.g., a compact disk read-only memory (CD-ROM)), or may be downloaded via an application store (e.g., Play Store TM ) The computer program product may be published (e.g., downloaded or uploaded) online, or the computer program product may be distributed (e.g., downloaded or uploaded) directly between two user devices (e.g., smart phones). If published online, at least part of the computer program product may be temporarily generated, or at least part of the computer program product may be at least temporarily stored in a machine-readable storage medium (such as a memory of a manufacturer's server, an application store's server, or a forwarding server).

[0153] According to various embodiments, each of the above-mentioned components (e.g., a module or a program) may include a single entity or multiple entities, and some of the multiple entities may be separately arranged in different components. According to various embodiments, one or more of the above-mentioned components may be omitted, or one or more other components may be added. Alternatively or additionally, multiple components (e.g., a module or a program) may be integrated into a single component. In this case, according to various embodiments, the integrated component may still perform the one or more functions of each of the multiple components in the same or similar manner as a corresponding one of the multiple components performing one or more functions before integration. According to various embodiments, the operations performed by a module, a program or another component may be performed sequentially, in parallel, repeatedly or in a heuristic manner, or one or more of the operations may be run or omitted in a different order, or one or more other operations may be added.

Claims

1. Electronic devices, including: a printed circuit board comprising a first side and a second side perpendicular to the first side; a plurality of solder balls disposed on a surface of the printed circuit board and spaced apart from the first side and the second side; an electronic component including at least one circuit and disposed on at least some of the plurality of solder balls; as well as a resin disposed along the first side and filling a portion of a space disposed between the surface of the printed circuit board and the electronic component, and The printed circuit board includes a blocking structure disposed between the plurality of solder balls and the first side and extending along the first side to separate at least some of the plurality of solder balls from the resin.

2. The electronic device according to claim 1, in, The number of solder balls among the plurality of solder balls that are spaced apart from the first side at a shortest distance is less than the number of solder balls among the plurality of solder balls that are spaced apart from the second side at a shortest distance.

3. The electronic device according to any one of claims 1 and 2, in, A distance between a plurality of signal solder balls electrically connected to the electronic component among the plurality of solder balls and the second side is shorter than a distance between the plurality of signal solder balls and the first side.

4. The electronic device according to any one of claims 1 to 3, in, The length of the first side is longer than the length of the second side.

5. The electronic device according to any one of claims 1 to 4, in, The blocking structure includes at least one blocking groove formed by recessing the surface of the printed circuit board.

6. The electronic device according to claim 5, in, The at least one blocking groove includes a plurality of blocking grooves spaced apart from each other along a direction parallel to the first side.

7. The electronic device according to any one of claims 1 to 6, in, The blocking structure includes a blocking partition wall protruding in a direction in which the surface of the printed circuit board faces.

8. The electronic device according to claim 7, in, The printed circuit board also includes a support pad disposed between the first side and the plurality of solder balls, and Wherein, the blocking partition wall is arranged on the supporting pad.

9. The electronic device according to claim 7, in, The barrier partition wall is in contact with a surface of the electronic component facing the surface of the printed circuit board.

10. The electronic device according to any one of claims 1 to 9, in, The electronic component includes a plurality of chips stacked along a direction in which the surface of the printed circuit board faces.

11. The electronic device according to any one of claims 1 to 10, in, The plurality of solder balls include: a plurality of signal solder balls electrically connecting the electronic component to the printed circuit board; and at least one dummy solder ball electrically disconnected from the electronic component, and The resin is spaced apart from the plurality of signal solder balls and is in contact with the at least one dummy solder ball.

12. The electronic device according to any one of claims 1 to 11, in, The printed circuit board further includes at least one first conductive pad disposed on the surface of the printed circuit board and in contact with at least some of the plurality of solder balls, and The electronic component further includes at least one second conductive pad, which faces the surface of the printed circuit board and contacts at least some of the plurality of solder balls.

13. The electronic device according to any one of claims 1 to 12, in, A ratio of an area of ​​a portion of the surface of the printed circuit board that is in contact with the resin to an area of ​​the surface of the printed circuit board is 20% to 40%.

14. The electronic device according to any one of claims 1 to 13, in, The resin has a thermal expansion coefficient different from a thermal expansion coefficient of the plurality of solder balls.

15. The electronic device according to any one of claims 1 to 14, in, The printed circuit board further includes a third side parallel to the first side and vertically connected to the second side, and Wherein, the resin comprises: a first coverage area disposed along the first side; and A second coverage area is spaced apart from the first coverage area and disposed along the third side.

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