Semiconductor device cutting and cleaning equipment and process

Abstract

The invention discloses semiconductor device cutting and cleaning equipment and process, and the process comprises the following steps: a loading step: packaging bodies cut on an adhesive film are directly mounted on a clamp platform of the cleaning equipment by taking the adhesive film as a carrier and are firmly fixed, and the packaging bodies are neatly arranged and are adhered to the surface of the adhesive film; a surface flushing step: adjusting the position of a spray head to enable the spray head to be located above the packaging body, and spraying cleaning liquid by the spray head to flush the surface of the packaging body; a side surface cleaning step: adjusting the position of the ejector rod to enable the ejector rod to be located between the adjacent packaging bodies, controlling the ejector rod to vertically and upwards jack up the adhesive film from the bottom of the adhesive film, enlarging the distance between the adjacent packaging bodies, and washing the side surfaces of the packaging bodies with cleaning liquid; according to the method, the nozzle moves forwards and backwards, leftwards and rightwards and upwards and downwards, the cleaning liquid is sprayed while the nozzle moves, it is guaranteed that the packaging body at each position on the adhesive film is washed clean, and the cleaning effect is guaranteed.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor device cleaning, and in particular relates to a semiconductor device cutting and cleaning device and a process. Background Art

[0002] The packaging process generally arranges multiple bare chips neatly, and then uses a series of technologies to achieve the layout, connection, and encapsulation of each bare chip. After the encapsulation is cured, the encapsulation needs to be cut into product units. Cutting is to vertically cut the encapsulation material as a whole on the cutting path in the safe area through the cutting process until the final product unit is formed. In order to prevent flying materials from appearing in the product during cutting, the encapsulation as a whole needs to be adhered to the adhesive film for cutting, and the cutting is carried out down to the upper part of the adhesive film without cutting off to ensure that the product unit is completely cut. After the cutting is completed, the surface of the product is prone to adhere to cutting waste and dust, and it needs to be cleaned with cleaning equipment to ensure that the appearance of the product is qualified.

[0003] After the product is cut into units, the existing cleaning equipment does not peel the product units from the adhesive film, but directly uses a spray head to spray and rinse all the product units. The spray head and the fixture platform are fixed, the flushing direction is single, and cutting gaps are formed between adjacent product units. Due to the existence of surface tension on the product surface, it is difficult for the cleaning liquid to enter the cutting gap to rinse the product side, so it is impossible to effectively clean the various sides of the product unit. Dust or waste mixed on the side of the product is difficult to be cleaned, affecting the appearance of the product; other equipment such as centrifugal cleaning equipment is not suitable for cleaning products with larger particles, because large-particle chips adhered to the film are easily peeled off and thrown away during the centrifugal process, resulting in difficulties in subsequent process operations, such as subsequent packaging operations such as product feeding trays, and even causing damage to the product appearance. Summary of the invention

[0004] In order to solve the above problems in the prior art, the present invention provides a semiconductor device cutting and cleaning equipment and process.

[0005] To achieve the above object, the present invention provides a semiconductor device cutting and cleaning process, comprising the following steps: Loading step: directly mounting the package body cut on the adhesive film on the fixture platform of the cleaning equipment with the adhesive film as a carrier and fixing it firmly, and the package body is neatly arranged and adhered to the surface of the adhesive film; Surface washing step: adjust the nozzle position so that the nozzle is located above the package body, and spray the cleaning liquid to wash the surface of the package body; Side cleaning step: adjust the position of the ejector pin so that it is located between adjacent packages, control the ejector pin, and lift the adhesive film vertically upward from the bottom of the adhesive film to expand the distance between adjacent packages, and rinse the side of the package with cleaning liquid; Drying step: The nozzle stops spraying the cleaning liquid and starts blowing air instead. The tilt angle of the fixture platform is adjusted, and the ejector rod is used to lift the adhesive film to dry the residual cleaning liquid.

[0006] Furthermore, in the loading step, a magnetic ring is first used to clamp the edge of the adhesive film for initial fixation, corner clamps are installed around the fixture platform, and the magnetic ring is clamped in the corner clamp and fixed to the fixture platform by tightening bolts.

[0007] Furthermore, in the surface flushing step, one or more nozzles are provided and arranged evenly spaced, and the nozzles move horizontally or vertically during the spraying process, so that each surface of the package is flushed.

[0008] Furthermore, in the side cleaning step, one or more ejector rods are arranged evenly spaced, the ejector rods and the nozzles are always kept on the same vertical line, and after synchronous horizontal movement, the ejector rods move vertically to lift the bottom of the adhesive film upward, and the nozzles keep flushing the side of the package body at the lifted position.

[0009] Furthermore, in the surface flushing step and the side cleaning step, the nozzle is connected to the liquid pipe and the air pipe.

[0010] A semiconductor device cutting and cleaning device, comprising a machine platform, and also comprising: A fixture platform, wherein one side edge of the bottom of the fixture platform is rotatably connected by a hydraulic rod, so that the inclination angle of the fixture platform is adjustable, and the fixture platform fixes the adhesive film on the machine table, and the adhesive film serves as a carrier, and the packaging bodies neatly arranged after cutting are bonded to the surface; A nozzle, the position of which is adjustable and located above the package body, a screw rod component is installed on the machine platform so that the position of the nozzle can be moved left and right and front and back, and an electric telescopic rod is installed so that the nozzle can be moved vertically up and down, and the nozzle is close to or away from the top of the package body, and the nozzle sprays cleaning liquid to clean the surface of the package body; A push rod, the position of which is adjustable and moves synchronously with the nozzle. The push rod moves in a vertical direction to lift the adhesive film from the bottom of the adhesive film to expand the distance between adjacent packaging bodies. The nozzle sprays a cleaning liquid to wash the side of the packaging body. The nozzle stops spraying the cleaning liquid and starts blowing air instead, the fixture platform is adjusted to be tilted at a certain angle, and the ejector rod is also used to lift the adhesive film to dry the residual cleaning liquid.

[0011] Furthermore, the edge of the adhesive film is initially fixed by clamping with a magnetic ring, and corner clamps are installed around the fixture platform. The magnetic ring is clamped in the corner clamp and fixed to the fixture platform by tightening bolts.

[0012] Furthermore, one or more nozzles are provided and arranged evenly spaced, and the nozzles move horizontally or vertically during the spraying process, so that the surface of each package is washed.

[0013] Furthermore, one or more push rods are arranged evenly spaced, the push rods are displaced synchronously with the nozzles, and the positions of the push rods and the nozzles are always maintained on the same vertical line.

[0014] Furthermore, the ejector rod is also synchronously displaced with the nozzle through the screw rod component and the electric telescopic rod installed on the machine. The ejector rod moving vertically upwards lifts the bottom of the adhesive film upwards, and the nozzle keeps flushing the side of the package body at the lifted position.

[0015] Furthermore, the nozzle is connected to the liquid pipe and the air pipe.

[0016] The present invention: 1. Move the nozzle forward and backward, left and right, and up and down, spraying the cleaning liquid while moving, ensuring that the package at each position on the adhesive film is rinsed clean and the cleaning effect is guaranteed; 2. The ejector rod and the nozzle move horizontally or vertically synchronously. The ejector rod moves vertically upward to lift the bottom of the adhesive film upward, expanding the distance between adjacent packages. The nozzle moves vertically downward to approach the package for flushing, so that the side of the package can also be flushed cleanly, and the dust or waste mixed on the side of the product can also be cleaned, ensuring the appearance of the product is qualified and simplifying the process; 3. The fixture platform can be tilted at a certain angle, so that each side of the package can be fully rinsed, which is also conducive to the inclined outflow of the cleaning liquid. Combined with the nozzle blowing, the drying is faster and the drying effect is better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A process flow chart of a semiconductor device cutting and cleaning process of the present invention; Figure 2 A three-dimensional diagram of a semiconductor device cutting and cleaning device according to the present invention; Figure 3 A schematic diagram of the structure of a nozzle of a semiconductor device cutting and cleaning device of the present invention; Figure 4 A schematic structural diagram of a fixture platform of a semiconductor device cutting and cleaning device according to the present invention; Figure 5 The present invention is a schematic structural diagram of an adhesive film for semiconductor device cutting and cleaning equipment.

[0018] In the figure: 1. machine platform; 2. fixture platform; 3. adhesive film; 4. packaging body; 5. nozzle; 6. ejector rod; 7. magnetic ring; 8. corner clamp; 9. first support rod; 10. first slide block; 11. second support rod; 12. second slide block; 13. electric telescopic rod; 14. vertical rod; 15. hydraulic rod. DETAILED DESCRIPTION

[0019] The content of the present invention will be explained below in conjunction with specific embodiments, examples of which are shown in the accompanying drawings, wherein the same or similar numbers throughout represent the same or similar components or components with the same or similar functions.

[0020] The directional terms mentioned in the present invention, such as: up, down, left, right, front, back, inside, outside, front, back, side, etc., are only reference directions of the drawings. The embodiments described below with reference to the drawings and the directional terms used are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention. In addition, the various specific process and material examples provided in the present invention are all those skilled in the art who can recognize the application of other processes and / or the use of other materials.

[0021] In order to better understand the purpose, structure and function of the present invention, the following Figure 1 -Attached Figure 5 , a semiconductor device cutting and cleaning equipment and process proposed in the present invention are further described in detail.

[0022] Before each step in the semiconductor packaging method of the present invention is carried out, it is necessary to first form a unitized packaging body 4 as a basis for subsequent process implementation, and obtain the unitized packaging body 4 in the semiconductor packaging method through a product cutting step.

[0023] Specifically, the bare chip is packaged through layer-by-layer packaging technology to form a packaging board as a whole. The bare chip can be an optoelectronic device (Optoelectronic Devices), a micro-electromechanical system (MEMS), a power amplifier chip, a power management chip, a biometric device, a microfluidic system (Microfluidic Systems), a light-emitting diode (Light-Emitting Diodes, LEDs), a resistor, a capacitor, etc., but is not limited to these. The selection is made according to the specific product and the safety area reserved according to the product design. The safety area refers to the area that does not damage the product unit when cutting, that is, the bare chip and the wiring layer and pins electroplated on the bare chip do not exceed the safety area. There is only packaging material in the safety area. Cutting the packaging material makes the product unitized. A cutting path is designed in the safety area. The width of the safety area is greater than the width of the cutting path. It is a common cutting path and safety area design in this packaging field. The packaging material is cut at the cutting path position.

[0024] First, the packaged package board is peeled off from the carrier board, and then adhered to the adhesive film 3. The adhesive film 3 is made of a commonly used material in the art, such as polyimide (PI), polyethylene terephthalate (PET), silicone or blue glue, etc. Then, a cutting blade commonly used in the art is used to cut the packaging board at the cutting line position, and the cutting blade is cut perpendicularly to the adhesive film 3 from top to bottom until the packaging board is completely cut off and part of the adhesive film 3 is cut off; After cutting, the unitized product packaging bodies 4 are still adhered to the original position of the adhesive film 3. The packaging bodies 4 are evenly spaced and neatly arranged and adhered to the surface of the adhesive film 3. The adhesive film 3 is removed from the cutting platform as a whole and waits for the next cleaning process.

[0025] Please see attached Figure 1 The semiconductor device cutting and cleaning process comprises the following steps: Loading step: directly mounting the package body 4 cut on the adhesive film 3 on the fixture platform 2 of the cleaning equipment with the adhesive film 3 as a carrier and fixing it firmly, and the package body 4 is neatly arranged and adhered to the surface of the adhesive film 3; Surface washing step: adjusting the position of the nozzle 5 so that the nozzle 5 is located above the package body 4, and the nozzle 5 sprays the cleaning liquid to wash the surface of the package body 4; Side cleaning step: adjusting the position of the push rod 6 so that the push rod 6 is located between adjacent packaging bodies 4, controlling the push rod 6, and vertically lifting the adhesive film 3 from the bottom of the adhesive film 3 to expand the distance between adjacent packaging bodies 4, and washing the side of the packaging body 4 with the cleaning liquid; Drying step: the nozzle 5 stops spraying the cleaning liquid and starts blowing air instead, the tilt angle of the fixture platform 2 is adjusted, and the push rod 6 is used to lift the adhesive film 3 to dry the residual cleaning liquid.

[0026] In the loading step, the unitized packaging body 4 obtained by the above-mentioned pre-product cutting step is installed on the machine table 1 of the cleaning equipment with the adhesive film 3 as the carrier, and the edge position of the adhesive film 3 is clamped using the magnetic ring 7, and then the magnetic ring 7 is installed in the corner clamp 8 on the fixture platform 2 of the cleaning equipment, and the bolts passing through the corner clamp 8 are adjusted to clamp the magnetic ring 7, so as to fix the adhesive film 3 firmly. Multiple fixture platforms 2 can be set on the machine table 1 at the same time to increase the cleaning amount at one time. This application takes the setting of one fixture platform 2 as an example.

[0027] In the surface washing step, a first support rod 9 is installed on the machine 1, and a screw component is installed at one end of the first support rod 9. The output shaft of the screw rotates inside the first support rod 9, driving the first slider 10 with a spiral fit to translate back and forth on the first support rod 9. Another screw component is installed above the first slider 10. Similarly, the output shaft of the screw rotates inside the second support rod 11, driving the second slider 12 with a spiral fit to translate left and right on the second support rod 11. An electric telescopic rod 13 is installed on the side of the second slider 12. A nozzle 5 is installed on the output end of the electric telescopic rod 13. The nozzle 5 is located above the packaging body 4 and its position is adjustable. It can move forward and backward, left and right, and up and down. The nozzle 5 is connected to the liquid pipe and the air pipe. During cleaning, the nozzle 5 sprays cleaning liquid to wash the surface of the packaging body 4. The cleaning liquid sprayed by the nozzle 5 is pure water or ultrapure water.

[0028] Pure water refers to water that has both strong dielectrics that are easy to remove and weak electrolytes such as silicate that are difficult to remove removed to a certain extent. The salt content of pure water is below 1.0 mg / L and the conductivity is less than 5.0 μs / cm.

[0029] Ultrapure water (also known as high-purity water or UP water) refers to water in which almost all conductive media have been removed and the non-dissociated colloids, gases and organic matter in the water have been removed to a very low level. The salt content of ultrapure water is below 0.3 mg / L and the conductivity is less than 0.2 μs / cm.

[0030] In the side cleaning step, a push rod 6 is also provided on the machine 1. The connection structure of the push rod 6 and the nozzle 5 is the same. The push rod 6 is located below the package body 4. The positions of the push rod 6 and the nozzle 5 are always kept on the same vertical line. The number of the push rod 6 and the nozzle 5 can be configured with one or more and arranged evenly spaced according to the actual production needs. This application takes the configuration of one as an example. The cleaning equipment system controls the screw rod component connected to the nozzle 5 and the screw rod component connected to the push rod 6 to run synchronously to ensure that the push rod 6 and the nozzle 5 are synchronously displaced horizontally to ensure that the package body 4 at each position on the adhesive film 3 is uniform. It can be rinsed to ensure the cleaning effect. The system controls the electric telescopic rod 13 connected to the nozzle 5 and the electric telescopic rod 13 connected to the push rod 6 to run synchronously to ensure that the push rod 6 and the nozzle 5 are vertically displaced synchronously. The nozzle 5 is vertically displaced downward to approach the package body 4 for rinsing. The push rod 6 is vertically displaced upward to lift the bottom of the adhesive film 3 upward, and the distance between adjacent package bodies 4 is expanded, so that the side of the package body 4 can also be rinsed clean. All sides of the product unit can be effectively cleaned, and the dust or waste mixed on the side of the product is also cleaned, ensuring the appearance of the product and simplifying the process.

[0031] Moreover, the fixture platform 2 arranged on the cleaning equipment machine has support members at the four corners of its bottom. The support members at the two corners on the same side are vertical rods 14, and the ends of the vertical rods 14 are rotatably connected to the fixture platform 2. The support members at the two corners on the other side are hydraulic rods 15. Through the synchronous operation of the two hydraulic rods 15, the fixture platform 2 can be tilted at a certain angle to ensure that all sides of the package body 4 can be completely rinsed.

[0032] During the drying step, the nozzle 5 stops spraying the cleaning liquid and starts blowing air instead. The blowing may be nitrogen or other stable gases. At the same time, the push rod 6 continues to lift the adhesive film 3 vertically upward at the blowing position of the nozzle, so that the distance between adjacent packaging bodies 4 is enlarged, and the residual cleaning liquid is completely blown away, with good drying effect. In combination with the fixture platform 2 being tilted at a certain angle, it is beneficial for the cleaning liquid to leave the fixture platform 2 more quickly, and the drying efficiency is high.

[0033] The present invention controls the synchronous horizontal displacement of the push rod 6 and the nozzle 5 to ensure that the package 4 at each position on the adhesive film 3 can be rinsed to ensure the cleaning effect. The push rod 6 and the nozzle 5 are synchronously displaced vertically. The nozzle 5 is vertically displaced downward to approach the package 4 for flushing. The push rod 6 is vertically displaced upward to lift the bottom of the adhesive film 3 upward, thereby expanding the distance between adjacent package bodies 4, so that the side of the package body 4 can also be rinsed clean, and the dust or waste mixed on the side of the product is also cleaned, thereby ensuring the product appearance and simplifying the process. The fixture platform 2 can be tilted at a certain angle for more comprehensive flushing. The nozzle 5 blows air so that the residual cleaning liquid is completely blown away, and the drying effect is good. The fixture platform 2 is tilted at a certain angle, which is conducive to faster separation of the cleaning liquid from the fixture platform 2 and high drying efficiency.

[0034] The packaging process used in the package body 4 of the present invention is to form a package by injection molding of plastic packaging materials. Packaging refers to the process of installing a shell used for a semiconductor integrated circuit chip, pasting, fixing and connecting the chip layout, and finally forming an overall three-dimensional structure. The packaging process plays an important role in the field of semiconductor manufacturing. When the chip is packaged, the electrical properties of the chip are led out of the package body 4 through the metal circuit layer, and the metal located outside the package body 4 becomes a pin, which is a port for electrically connecting the entire package structure to the outside.

[0035] The packaging material used in the present invention can be epoxy resin, cyanate, polyimide, etc., which has low cost and good curing performance. The packaging process plays an important role in the field of semiconductor manufacturing, mainly in protection, connection, support, reliability and promotion of technological progress. The protection function means that the chip packaging can protect the chip from mechanical damage, moisture, dust and other external environmental factors, ensuring the normal operation of the chip in extreme environments; the connection function means that the packaging provides a way to connect the chip with other electronic components, so that the chip can be installed and used on the circuit board; the support function means that the packaging can fix the chip while supporting the chip to prevent it from being damaged; reliability means that the reliability requirements for packaging materials and processes are getting higher and higher, so as to ensure that the chip can operate normally in various extreme environments.

[0036] After the packaging body 4 completes the cleaning process, a series of operations are required, such as finished product testing after packaging is completed, usually through incoming inspection (Incoming), testing (Test) and product feeding tray packaging (Packing) and other processes, and finally storage and shipment.

[0037] Please refer to the attached Figure 2 -Attached Figure 5 Through the above semiconductor device cutting and cleaning process, a semiconductor device cutting and cleaning device is obtained. The cleaning device includes a machine 1 and also includes: The clamp platform 2, one side edge of the bottom of the clamp platform 2 is rotatably connected by a hydraulic rod 15, so that the inclination angle of the clamp platform 2 is adjustable, the edge position of the adhesive film 3 is first clamped by a magnetic ring 7 for initial fixation, and corner clamps 8 are installed around the upper surface of the clamp platform 2. After the magnetic ring 7 clamps the adhesive film 3, it is stuck in the corner clamp 8 and fixed by screwing the bolts on the corner clamp 8. The clamp platform 2 fixes the adhesive film 3 on the machine table 1. The adhesive film 3 is used as a carrier, and the surface of the packaging body 4 that is neatly arranged after cutting is bonded; The nozzle 5 is adjustable in position and is located above the package body 4. A screw component is installed on the machine 1 so that the position of the nozzle 5 can be moved left and right and forward and backward, and an electric telescopic rod 13 is installed so that the nozzle 5 can be moved vertically up and down. The nozzle 5 is close to or away from the top of the package body 4. The nozzle 5 sprays cleaning liquid to clean the surface of the package body 4. One nozzle 5 or multiple nozzles arranged evenly at intervals are provided. The nozzle 5 can move horizontally or vertically during the spraying process. Each surface of the package body 4 is rinsed. The nozzle 5 moves vertically downward to approach the package body 4 for rinsing. The nozzle 5 is connected to the liquid pipe and the air pipe. The cleaning equipment system controls the solenoid valve in the pipeline to open the liquid pipe to spray the cleaning liquid or open the air pipe to blow and dry. The sprayed cleaning liquid is pure water or ultrapure water, and the blowing air is nitrogen or other stable gas. The push rod 6 is adjustable in position and moves horizontally synchronously with the nozzle 5. The push rod 6 moves in the vertical direction and lifts the adhesive film 3 upward from the bottom of the adhesive film 3 to expand the distance between adjacent packaging bodies 4. The nozzle 5 sprays cleaning liquid to wash the side of the packaging body 4. One push rod 6 or multiple push rods evenly arranged at intervals are provided. The push rod 6 moves horizontally synchronously with the nozzle 5. The positions of the push rod 6 and the nozzle 5 are always kept on the same vertical line. The push rod 6 also realizes synchronous horizontal displacement with the nozzle 5 through the screw rod component and the electric telescopic rod 13 installed on the machine 1. Therefore, the displacement drive connection structure of the nozzle 5 is the same as the displacement drive connection structure of the push rod 6. The push rod 6 moves vertically upward to lift the adhesive film 3 upward, and the distance between adjacent packaging bodies 4 is expanded. The nozzle 5 keeps washing the side of the packaging body 4 at the lifted position; The nozzle 5 stops spraying the cleaning liquid and starts blowing air instead, the fixture platform 2 is adjusted to be tilted at a certain angle, and the push rod 6 is used to lift the adhesive film 3 to dry the residual cleaning liquid.

[0038] The selection, installation requirements and connection methods of all the above electrical components are common knowledge in existing mechanical design and are not the focus of protection of this application. This application does not limit them and will not elaborate on them.

[0039] The present invention ensures that the package body 4 at each position on the adhesive film 3 can be cleaned by moving the nozzle 5 forward and backward, left and right, and up and down, spraying the cleaning liquid while moving, and ensures the cleaning effect. The push rod 6 and the nozzle 5 are controlled to move horizontally or vertically synchronously by the screw rod component, and the push rod 6 moves vertically upward to push the bottom of the adhesive film 3 upward, expand the distance between adjacent package bodies 4, and expose the side of the package body 4. The nozzle 5 moves vertically downward to approach the package body 4 for washing, so that the side of the package body 4 can also be cleaned, and the dust or waste mixed on the side of the product is also cleaned, so as to ensure the appearance of the product is qualified and simplify the process. The fixture platform 2 can be tilted at a certain angle, so that the nozzle 5 can rinse more comprehensively, and when drying, it is more conducive to the cleaning liquid flowing out of the fixture platform 2, so that the drying effect is good and the drying efficiency is higher.

[0040] It is to be understood that the present invention is described by some embodiments, and it is known to those skilled in the art that various changes or equivalent substitutions may be made to these features and embodiments without departing from the spirit and scope of the present invention. In addition, under the teachings of the present invention, these features and embodiments may be modified to adapt to specific circumstances and materials without departing from the spirit and scope of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present invention are within the scope of protection of the present invention.

Claims

1. A semiconductor device cutting and cleaning process, characterized in that: The following steps are involved: Loading step: directly mounting the package body cut on the adhesive film on the fixture platform of the cleaning equipment with the adhesive film as a carrier and fixing it firmly, and the package body is neatly arranged and adhered to the surface of the adhesive film; Surface flushing step: adjust the nozzle position so that the nozzle is located above the package body, and spray the cleaning liquid to flush the surface of the package body; Side cleaning step: adjust the position of the ejector pin so that it is located between adjacent packages, control the ejector pin, and lift the adhesive film vertically upward from the bottom of the adhesive film to expand the distance between adjacent packages, and rinse the side of the package with cleaning liquid; Drying step: The nozzle stops spraying the cleaning liquid and starts blowing air instead. The tilt angle of the fixture platform is adjusted, and the ejector rod is used to lift the adhesive film to dry the residual cleaning liquid.

2. The semiconductor device cutting and cleaning process according to claim 1, characterized in that: In the loading step, the edge of the adhesive film is first clamped and fixed using a magnetic ring, and corner clamps are installed around the fixture platform. The magnetic ring is clamped in the corner clamp and fixed to the fixture platform by tightening bolts.

3. The semiconductor device cutting and cleaning process according to claim 1, characterized in that: In the surface flushing step, one or more nozzles are provided and arranged evenly spaced, and the nozzles move horizontally or vertically during the spraying process, so that each package surface is flushed.

4. The semiconductor device cutting and cleaning process according to claim 3, characterized in that: In the side cleaning step, one or more ejector rods are arranged evenly spaced, the ejector rods and the nozzles are always kept on the same vertical line, and after synchronous horizontal movement, the ejector rods move vertically to lift the bottom of the adhesive film upward, and the nozzles keep flushing the side of the package body at the lifted position.

5. The semiconductor device cutting and cleaning process according to claim 1, characterized in that: In the surface flushing step and the side cleaning step, the nozzle is connected to the liquid pipe and the air pipe.

6. A semiconductor device cutting and cleaning device, comprising a machine platform, characterized in that: Also included are: A fixture platform, wherein one side edge of the bottom of the fixture platform is rotatably connected by a hydraulic rod, so that the inclination angle of the fixture platform is adjustable, and the fixture platform fixes the adhesive film on the machine table, and the adhesive film serves as a carrier, and the packaging bodies neatly arranged after cutting are bonded to the surface; A nozzle, the position of which is adjustable and located above the package body, a screw rod component is installed on the machine platform so that the position of the nozzle can be moved left and right and front and back, and an electric telescopic rod is installed so that the nozzle can be moved vertically up and down, and the nozzle is close to or away from the top of the package body, and the nozzle sprays cleaning liquid to clean the surface of the package body; A push rod, the position of which is adjustable and moves horizontally synchronously with the nozzle. The push rod moves vertically to lift the adhesive film from the bottom of the adhesive film to expand the distance between adjacent packaging bodies. The nozzle sprays cleaning liquid to wash the side of the packaging body; The nozzle stops spraying the cleaning liquid and starts blowing air instead, the fixture platform is adjusted to be tilted at a certain angle, and the ejector rod is also used to lift the adhesive film to dry the residual cleaning liquid.

7. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that: The edge of the adhesive film is initially fixed by clamping with a magnetic ring, and corner clamps are installed around the fixture platform. The magnetic ring is clamped in the corner clamp and fixed on the fixture platform by tightening bolts.

8. The semiconductor device cutting and cleaning equipment according to claim 7, characterized in that: One or more nozzles are arranged evenly at intervals. The nozzles move horizontally or vertically during the spraying process, and the surface of each package is washed.

9. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that: One or more push rods are arranged evenly spaced, and the push rods and the nozzles are synchronously displaced horizontally, and the positions of the push rods and the nozzles are always kept on the same vertical line.

10. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that: The ejector rod also realizes synchronous horizontal displacement with the nozzle through the screw rod component and the electric telescopic rod installed on the machine platform. The ejector rod moving vertically upwards lifts the bottom of the adhesive film upwards, and the nozzle keeps flushing the side of the package body at the lifted position.

11. The semiconductor device cutting and cleaning equipment according to claim 6, characterized in that: The spray head is connected with the liquid pipe and the air pipe.

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