Common-edge cutting process method and related equipment thereof

Abstract

The embodiment of the invention provides a common-edge cutting process method and related equipment thereof. In the embodiment of the invention, the method comprises the following steps: acquiring workpiece feature information of a to-be-cut workpiece; based on the workpiece feature information, determining a common-edge cutting path of a laser processing head; based on workpiece material information and workpiece deformation information in the workpiece feature information, the cutting distance between a laser machining head and the surface of the to-be-cut workpiece is determined; and in the whole process of controlling the laser processing head to cut the workpiece to be cut according to the common-edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is kept as the cutting distance.

Description

Technical Field

[0001] The present invention relates to the field of laser processing technology, and in particular to a common edge cutting process method and related equipment. Background Art

[0002] Common edge cutting is a process in which multiple materials to be cut are placed on the same workbench at the same time during the laser cutting process and cut by common edge method. For example, when cutting adjacent workpieces, the cutting path can be shared by common edge method to improve cutting efficiency and reduce cutting costs.

[0003] In the related art, the height of the lower end face of the nozzle used in the laser processing head from the surface of the workpiece to be cut is generally low, usually about 1mm. When cutting a workpiece that is easily deformed, such as a long strip, if the workpiece is deformed, the warped part of the workpiece may collide with the nozzle of the laser processing head due to the large amplitude of the warping, causing damage to the nozzle of the laser processing head, which in turn leads to problems such as increased cutting costs and unstable cutting. Summary of the invention

[0004] In view of the above problems, embodiments of the present invention are proposed to provide a common edge cutting process method and related equipment that overcome the above problems or at least partially solve the above problems.

[0005] In order to solve the above problems, an embodiment of the present invention discloses a common edge cutting process method, comprising: Acquire workpiece feature information of the workpiece to be cut; Based on the workpiece feature information, determining a common edge cutting path of a laser processing head; Determining a cutting distance between a laser processing head and a surface of the workpiece to be cut based on workpiece material information and workpiece deformation information in workpiece feature information of the workpiece to be cut; During the entire process of controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is maintained as the cutting distance.

[0006] As a preferred solution, the step of obtaining a common edge cutting path of a workpiece to be cut includes: Acquire a workpiece contour from the workpiece feature information; Based on the workpiece contour, determining common edge information of the workpiece to be cut; Based on the workpiece contour and the common edge information of the workpiece to be cut, a common edge cutting path of the laser processing head is determined.

[0007] As a preferred embodiment, the method further comprises: When controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, monitoring the distance between the laser processing head and the surface of the workpiece to be cut; When it is monitored that the distance between the laser processing head and the surface of the workpiece to be cut is less than or equal to a preset distance threshold, the step size is adjusted according to the preset distance, the cutting distance is increased, and the distance between the laser processing head and the surface of the workpiece to be cut is maintained at the increased cutting distance.

[0008] As a preferred solution, the workpiece feature information also includes a cutting shape, and the method further includes: Based on the workpiece material information and cutting shape of the workpiece to be cut, a first cutting parameter of the laser processing head is determined, wherein the first cutting parameter includes at least one of gas parameters, cutting speed, laser beam power, laser focus, laser frequency and laser duty cycle.

[0009] As a preferred solution, the cutting distance ranges from 4 mm to 20 mm, especially from 8 mm to 20 mm.

[0010] As a preferred solution, the cutting distance is greater than the minimum distance between the laser processing head and the surface of the workpiece to be cut when the laser processing head moves along the common edge cutting path.

[0011] As a preferred solution, the cutting of the workpiece to be cut by the laser processing head according to the common edge cutting path includes: If the common edge cutting path includes a corner path, when the laser processing head cuts the corner path of the workpiece to be cut, determining a second cutting parameter that matches the corner range of the corner path, and adjusting the cutting parameter of the laser processing head based on the target cutting parameter; The laser processing head is controlled to cut the workpiece to be cut according to the corner path in the common edge cutting path based on the adjusted cutting parameters.

[0012] An embodiment of the present invention further discloses an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the steps in the common edge cutting process method when executed by the processor.

[0013] The embodiment of the present invention further discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps in the common edge cutting process method are implemented.

[0014] The embodiment of the present invention further discloses a computer program product, including a computer program, which implements the steps in the common edge cutting process method when executed by a processor.

[0015] The common edge cutting process method provided by the embodiment of the present invention, after acquiring the characteristic information of the workpiece to be cut, can determine the common edge cutting path of the laser processing head based on the workpiece characteristic information, and determine the cutting distance between the laser processing head and the surface of the workpiece to be cut based on the workpiece material information and the workpiece deformation information in the workpiece characteristic information of the workpiece to be cut, so that the determined cutting distance can avoid the laser processing head from colliding with the workpiece to be cut when the workpiece to be cut is deformed, and in the whole cutting process of controlling the laser processing head to cut according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is kept as the cutting distance, which can effectively avoid the damage of the nozzle and other components of the laser processing head caused by the deformation generated during the cutting of the workpiece to be cut, thereby ensuring the stability of laser cutting.

[0016] The laser cutting device provided in the embodiment of the present invention has the same features as the common edge cutting process method, and therefore also has the beneficial effects of the common edge cutting process method. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of a process flow of a common edge cutting process method provided by an embodiment of the present invention; Figure 2 A schematic structural diagram of a laser cutting device provided by an embodiment of the present invention; Figure 3 An exemplary structural schematic diagram of a laser processing head provided by an embodiment of the present invention; Figure 4 A schematic diagram of an exemplary structure of another laser processing head provided by an embodiment of the present invention; Figure 5 An exemplary structural schematic diagram of another laser processing head provided by an embodiment of the present invention; Figure 6 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0020] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0021] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0022] In order to prevent the deformation of the workpiece during cutting from causing it to warp too much, so that the warped part of the workpiece collides with the nozzle of the laser processing head and causes damage to the laser processing head, the related technology adopts the overcut method, that is, the cutting size of the workpiece to be processed is increased based on the pre-set cutting path. However, after the overcut method is adopted, the increased cutting size will cause the increase of the cutting path, which will lead to a decrease in the efficiency of laser cutting, and in this process, there will still be a situation where the nozzle of the laser processing head is collided.

[0023] In order to solve the above problems, the related technology also adopts the method of adding micro-connections, by incompletely cutting off the cutting path of the workpiece to be cut, to prevent the cutting edge of the workpiece to be cut from warping, and then avoid the laser processing head from colliding with it. However, this cutting method usually has requirements for the position and length of the micro-connections, which will also increase the cutting time, and also affect the efficiency of laser cutting. In addition, the related technology also considers the use of a frog-leaping common edge cutting process method, that is, during the cutting process, the laser processing head adjusts the cutting distance in real time according to the actual distance between it and the workpiece to be cut, which will cause the laser processing head to constantly jump up and down during the cutting process, which puts higher requirements on the cutting distance adjustment accuracy of the laser processing head, and the up and down adjustment process will also affect the stability and accuracy of laser cutting.

[0024] Based on this, an embodiment of the present invention proposes a common edge cutting process method, which can obtain workpiece feature information of the workpiece to be cut, and determine the common edge cutting path of the laser processing head based on the workpiece feature information, and determine the cutting distance between the laser processing head and the surface of the workpiece to be cut based on the workpiece deformation information in the workpiece feature information, so that the determined cutting distance can avoid colliding with the laser processing head when the workpiece to be cut is deformed, and in the entire cutting process of controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is kept as the cutting distance, which can effectively avoid damage to components such as the nozzle of the laser processing head caused by the deformation of the workpiece to be cut, thereby ensuring the stability of laser cutting.

[0025] See also Figure 1 The embodiment of the present invention provides a common edge cutting process method, comprising: Step 110, obtaining workpiece feature information of the workpiece to be cut.

[0026] For example, the workpiece feature information includes the cutting shape of the workpiece to be cut, the workpiece material information of the workpiece to be cut, and the workpiece deformation information of the workpiece to be cut. Among them, the workpiece material information of the workpiece to be cut may include the workpiece material type and the workpiece material thickness of the workpiece to be cut. The workpiece deformation information of the workpiece to be cut is used to indicate the deformation information of the workpiece to be cut during laser cutting, and the deformation information can be characterized by the warping range that can be generated by the cutting edge of the workpiece to be cut during laser cutting.

[0027] It should be understood that if the cutting shapes and workpiece material information of multiple workpieces cut under the same laser cutting parameters are consistent, then the deformations of these workpieces during laser cutting are also similar, that is, the warping ranges of the cutting edges of these workpieces during laser cutting are generally consistent. Based on this, the embodiment of the present invention can obtain cutting data within a historical time period to determine from the cutting data the warping range of the cutting edges of the cut workpieces that match the material and cutting shape of the workpiece to be cut during laser cutting as the workpiece deformation information of the workpiece to be cut. Specifically, obtaining the workpiece feature information of the workpiece to be cut includes: Acquire cutting data of a workpiece that matches workpiece material information and a cutting shape of the workpiece to be cut within a historical time period; From the cutting data, a warping range of the workpiece matching the workpiece material information and the cutting shape of the workpiece to be cut is obtained; The warping range of the workpiece matching the workpiece material and cutting shape of the workpiece to be cut is used as the workpiece deformation information of the workpiece to be cut, and the workpiece deformation information, workpiece material information and cutting shape of the workpiece to be cut are used as the workpiece feature information of the workpiece to be cut.

[0028] Step 120: determining a common edge cutting path of the laser processing head based on the workpiece feature information.

[0029] For example, the common edge cutting path of the workpiece to be cut can be generated by the cutting nesting software. Specifically, the workpiece contour map and cutting requirements of the workpiece to be cut can be input into the cutting nesting software, and the algorithm built into the cutting nesting software generates the common edge cutting path of the workpiece to be cut based on the workpiece contour map and cutting requirements of the workpiece to be cut. As an example, the generated common edge cutting path of the workpiece to be cut can include the perforation information of each starting position of the workpiece to be cut, the path sequence, the path direction, and the cutting process, etc.

[0030] In some exemplary embodiments, the workpiece feature information may further include a workpiece contour of the workpiece to be cut. Specifically, obtaining a cutting path of the workpiece to be cut includes: Obtaining a workpiece contour from workpiece feature information; Based on the workpiece contour, determine the common edge information of the workpiece to be cut; Based on the workpiece contour and common edge information of the workpiece to be cut, a common edge cutting path of the laser processing head is determined.

[0031] For example, the common edge cutting path may include perforation information of the starting position of the cutter, the path sequence, the path direction, and the cutting process. The workpiece to be cut may be preprocessed to obtain the workpiece contour of the workpiece to be cut, and whether the workpiece to be cut needs to be common edge cut may be determined based on the workpiece contour of the workpiece to be cut. Specifically, it may be determined whether the workpiece to be cut is suitable for common edge cutting based on the preset common edge cutting conditions, for example, based on the common edge cuttable workpiece contour set in the preset common edge cutting conditions, it may be determined whether the workpiece contour of the workpiece to be cut belongs to the common edge cuttable workpiece contour set in the preset common edge cutting conditions.

[0032] As an example, the workpiece contours that can be cut with common edges set in the preset common edge cutting conditions may include squares, rectangles, or workpieces with a side length that is a long straight line. When it is determined that the workpiece to be cut is suitable for common edge cutting, the common edge tool paths of at least two workpieces to be cut that can be cut with common edges can be merged through nesting software that can process graphics, such as AutoCAD (a drawing tool software), and then the workpiece contours of the workpiece to be cut after the merged processing are imported into the cutting nesting software, and the optimal common edge cutting path of the workpiece to be cut is generated by the algorithm built into the cutting nesting software as the common edge cutting path of the workpiece to be cut.

[0033] Step 130 , determining a cutting distance between the laser processing head and the surface of the workpiece to be cut based on the workpiece material information and the workpiece deformation information in the workpiece feature information of the workpiece to be cut.

[0034] The workpiece material information may include the workpiece material type and workpiece material thickness of the workpiece to be cut. The workpiece deformation information is used to characterize the degree of deformation that may be generated by the cutting edge of the workpiece to be cut during laser cutting. As an example, the deformation degree can be used to characterize the warping amplitude of the cutting edge of the workpiece to be cut during laser cutting. Generally, the cutting distance is mainly determined by the workpiece material type of the workpiece to be cut. After the approximate cutting distance is determined based on the workpiece material type, in order to avoid the warping amplitude of the cutting edge of the workpiece to be cut being too large during laser cutting, causing the warped part to touch the laser processing head and cause damage to the laser processing head, the embodiment of the present invention can further fine-tune the cutting distance according to the material thickness of the workpiece to be cut and the workpiece deformation information to obtain the final cutting distance. It should be understood that the determined cutting distance between the laser processing head and the surface of the workpiece to be cut should be greater than the warping amplitude of the cutting edge of the workpiece to be cut during laser cutting. Optionally, the cutting distance is greater than the minimum distance between the laser processing head and the surface of the workpiece to be cut when it moves along the common edge cutting path.

[0035] As an example, the cutting distance ranges from 4 mm to 20 mm, in particular 8 mm-20 mm.

[0036] Step 140 , during the entire process of controlling the laser processing head to cut the workpiece according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is maintained as the cutting distance.

[0037] The entire cutting process may at least include a cutting process in which the laser processing head cuts the workpiece to be cut according to a common edge cutting path, and an idle travel process in which the laser processing head moves from one part to the cutting position of another part when the workpiece to be cut includes at least two parts.

[0038] Since the determined cutting distance can be greater than the warping amplitude of the cutting edge of the workpiece to be cut during laser cutting, when the distance between the laser processing head and the surface of the workpiece to be cut is fixed based on the cutting distance, it can effectively avoid that when the laser processing head cuts the workpiece to be cut according to the cutting path, the warped cutting edge of the workpiece to be cut during laser cutting will collide with the laser processing head, causing damage to the laser processing head.

[0039] In some exemplary embodiments, the workpiece feature information further includes a cutting shape, and the method provided by the embodiment of the present invention further includes: Based on the workpiece material information and cutting shape of the workpiece to be cut, a first cutting parameter of the laser processing head is determined, the first cutting parameter including at least one of gas parameters, cutting speed, laser beam power, laser focus, laser frequency and laser duty cycle.

[0040] Then, during the entire process of controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is maintained as the cutting distance, including: The laser processing head is set based on the second cutting parameter of the laser processing head to complete the setting of the cutting parameter of the laser processing head; During the entire process of the laser processing head cutting the workpiece to be cut according to the common edge cutting path after the control setting, the distance between the laser processing head and the surface of the workpiece to be cut is maintained as the cutting distance.

[0041] For example, the gas parameters may include parameters such as gas pressure and gas pressure type.

[0042] Specifically, during the entire process of controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, maintaining the distance between the laser processing head and the surface of the workpiece to be cut as the cutting distance may include: First, the laser processing head is turned on, and the distance between the laser processing head and the surface of the workpiece to be cut is fixed as the cutting distance. For example, the distance between the lower blade edge of the laser processing head and the surface of the workpiece to be cut can be adjusted to a cutting distance within the range of 4-20 mm, especially 8 mm-20 mm. The specific cutting distance can be determined according to the morphological information of the workpiece to be cut. As an example, the distance between the lower blade edge of the laser processing head and the surface of the workpiece to be cut can be adjusted to 15 mm.

[0043] Then, based on the set cutting distance and the workpiece material and cutting shape of the workpiece to be cut, the gas parameters, cutting speed, laser beam power, laser focus, laser frequency and laser duty cycle of the laser processing head are determined, and based on the gas parameters, cutting speed, laser beam power, laser focus, laser frequency and laser duty cycle of the laser processing head, the laser processing head is set to complete the setting of the cutting parameters of the laser processing head.

[0044] Finally, the laser processing head with set cutting parameters completes the entire cutting process of the workpiece to be cut according to the common edge cutting path.

[0045] For example, the workpiece to be cut is cut by the laser processing head according to the common cutting path. Specifically, the workpiece to be cut can be slid-cut by the laser processing head according to the common cutting path. Sliding cutting means that during the laser cutting process, the laser processing head does not need to change the cutting distance, that is, it does not need to lift up or move down, and laser cutting is performed according to the set cutting speed. It should be understood that in the process of constantly adjusting the cutting distance between the laser processing head and the workpiece to be cut, the cutting speed of the laser processing head is often affected. For example, it is necessary to reduce the cutting speed of the laser processing head when adjusting the cutting distance. In the embodiment of the present invention, since the set cutting distance can cover (that is, greater than) the warping amplitude of the workpiece to be cut, there is no need to adjust the cutting distance between the laser processing head and the workpiece to be cut during this process, and thus the cutting speed of the laser processing head will not be affected, thereby effectively improving the laser cutting efficiency.

[0046] In some exemplary embodiments, when the common edge cutting path includes a corner path, in order to avoid the problem of overcutting and other problems that affect the cutting effect due to the excessively fast cutting speed when cutting the corner of the workpiece to be cut, the embodiments of the present invention can adapt to adjust the cutting parameters of the laser processing head when cutting to the corner path. For example, in order to improve the efficiency of adjusting the cutting parameters of the corner path and thus improve the cutting efficiency, the embodiments of the present invention can pre-set corresponding cutting parameters for corner paths with different corner ranges, that is, establish a mapping relationship between the corner range and the corresponding cutting parameters. Specifically, cutting the workpiece to be cut according to the common edge cutting path by the laser processing head includes: If the common edge cutting path includes a corner path, when the laser processing head cuts to the corner path of the workpiece to be cut, determining a second cutting parameter that matches the corner range of the corner path, and adjusting the cutting parameter of the laser processing head based on the target cutting parameter; The laser processing head is controlled to cut the workpiece to be cut according to the corner path in the common edge cutting path based on the adjusted cutting parameters.

[0047] In some exemplary embodiments, in order to avoid the laser processing head cutting the corner path at too high a speed, resulting in cutting errors, the preset cutting speed may be zero, or close to zero, and after adjusting the cutting parameters of the laser processing head according to the second cutting parameters associated with the corner path, the corner path of the workpiece to be cut is cut according to the adjusted cutting speed. Specifically, when the laser processing head cuts the corner path of the workpiece to be cut, determining the second cutting parameter that matches the corner range of the corner path, and adjusting the cutting parameters of the laser processing head based on the target cutting parameters include: When the laser processing head cuts to the corner path of the workpiece to be cut, the cutting speed of the laser processing head is adjusted to a preset cutting speed, and a second cutting parameter associated with the corner range of the corner path is determined; the value of the preset cutting speed is zero or close to zero; Based on the second cutting parameter, the cutting parameter of the laser processing head is adjusted; wherein the second cutting parameter includes at least one of a cutting speed, a cutting power, a cutting gas pressure and a cutting frequency.

[0048] In some exemplary embodiments, in order to further protect the laser processing head and prevent the laser processing head from being hit by the raised portion of the workpiece to be cut during the cutting process, the method provided by the embodiment of the present invention further includes: When controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, monitoring the distance between the laser processing head and the surface of the workpiece to be cut; When it is monitored that the distance between the laser processing head and the surface of the workpiece to be cut is less than or equal to a preset distance threshold, the step size is adjusted according to the preset distance, the cutting distance is increased, and the distance between the laser processing head and the surface of the workpiece to be cut is maintained at the increased cutting distance.

[0049] For example, during the laser cutting process, the distance between the laser processing head and the surface of the workpiece to be cut can be monitored in real time by a capacitive sensor. When the distance between the laser processing head and the surface of the workpiece to be cut is less than or equal to a preset distance threshold, the cutting distance can be increased, so as to fix the distance between the laser processing head and the surface of the workpiece to be cut based on the increased cutting distance, so as to prevent the workpiece to be cut from warping too much and colliding with the laser processing head.

[0050] The common edge cutting process method provided by the embodiment of the present invention, after acquiring the characteristic information of the workpiece to be cut, can determine the common edge cutting path of the laser processing head based on the workpiece characteristic information, and determine the cutting distance between the laser processing head and the surface of the workpiece to be cut based on the workpiece material information and the workpiece deformation information in the workpiece characteristic information of the workpiece to be cut, so that the determined cutting distance can avoid the laser processing head from colliding with the workpiece to be cut when the workpiece to be cut is deformed, and in the whole cutting process of controlling the laser processing head to cut according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is kept as the cutting distance, which can effectively avoid the damage of the nozzle and other components of the laser processing head caused by the deformation generated during the cutting of the workpiece to be cut, thereby ensuring the stability of laser cutting.

[0051] See also Figure 2 The embodiment of the present invention further provides a laser cutting device 200, which includes: a cutting system controller 201 and a laser processing head 202, wherein: The cutting system controller 201 is used to obtain workpiece feature information of the workpiece to be cut; determine the common edge cutting path of the laser processing head 202 based on the workpiece feature information; and determine the cutting distance between the laser processing head 202 and the surface of the workpiece to be cut based on the workpiece material information and the workpiece deformation information in the workpiece feature information of the workpiece to be cut; The laser processing head 202 is used to fix the distance between the laser processing head 202 and the surface of the workpiece to be cut based on the cutting distance during the process of controlling the laser processing head 202 to cut the workpiece to be cut according to the common edge cutting path.

[0052] Optionally, the device further comprises a height detection module 203, and the height detection module 203 is used to monitor the distance between the laser processing head 202 and the surface of the workpiece to be cut when controlling the laser processing head 202 to cut the workpiece to be cut according to the common edge cutting path.

[0053] For example, the height detection module 203 may be composed of at least a photoelectric sensor and / or a capacitive sensor.

[0054] Optionally, the laser processing head 202 includes a support body and a nozzle, the nozzle is installed at the end of the support body, the laser channel includes an inlet end and an outlet end that are relatively arranged, and a stable section, a convergent section and a divergent section that are sequentially connected from the inlet end to the outlet end, the stable section is formed in the support body, the divergent section is formed in the nozzle, and the outlet end is formed in the nozzle, and an anti-collision component is arranged at the gap position between the laser channel and the support body.

[0055] In order to further protect the nozzle of the laser processing head 202 and reduce the probability of damage to the laser processing head 202, an anti-collision component may be provided in the gap between the laser channel and the support body in the embodiment of the present invention. Optionally, the structure of the anti-collision component includes at least one of the following: Ceramic ring anti-collision structure; Elastic floating structure.

[0056] For example, the anti-collision component is arranged at a gap position between the stabilizing section of the laser channel and the support body; and / or; The anti-collision component is arranged at a gap position between the convergent section of the laser channel and the support body; and / or; The anti-collision component is arranged at a gap position between the divergent section of the laser channel and the support body.

[0057] See also Figure 3A laser channel for passing a laser beam and an auxiliary gas is provided in the laser processing head 202. The laser processing head includes a support body 200 and a nozzle 300. The nozzle 300 is installed at the end of the support body 200. The split arrangement facilitates replacement of the nozzle 300 after it is damaged. The laser channel includes an inlet end 110 and an outlet end 120 that are relatively arranged, and a stable section 130, a convergent section 150 and a divergent section 160 that are sequentially connected from the inlet end 110 to the outlet end 120. The stable section 130 is formed in the support body 200, the divergent section 160 is formed in the nozzle 300, and the outlet end 120 is formed in the nozzle 300.

[0058] Optionally, the inner diameter of the stable section 130 remains unchanged from the inlet end 110 to the outlet end 120, the inner diameter of the convergent section 150 gradually decreases from the inlet end 110 to the outlet end 120, and the inner diameter of the divergent section 160 gradually increases from the inlet end 110 to the outlet end 120.

[0059] It can be understood that since the inner diameter of the stable section 130 remains unchanged from the inlet end 110 to the outlet end 120, in the stable section 130, the airflow of the auxiliary gas is rectified in the stable section 130 to reduce the turbulence of the airflow. Since the inner diameter of the convergent section 150 gradually decreases from the inlet end 110 to the outlet end 120, the airflow is accelerated in the convergent section 150. Since the inner diameter of the divergent section 160 gradually increases from the inlet end 110 to the outlet end 120, the airflow release pressure in the divergent section 160 is converted into kinetic energy, and the airflow pressure at the outlet end 120 is balanced with the external static pressure to maximize the kinetic energy of the auxiliary gas airflow, reduce the shock wave energy consumption factor, and ensure that the airflow kinetic energy of the auxiliary gas ejected at the outlet end 120 is sufficient, so that the anti-slag dirt splashed toward the outlet end 120 can be blown out, protecting the protective mirror from damage, extending the service life of the protective mirror, and solving the problem that the protective mirror in the existing laser processing head is easily contaminated by anti-slag dirt.

[0060] In addition, since the auxiliary gas ejected at the outlet end 120 has sufficient kinetic energy, the nozzle 300 can be controlled to be farther away from the plate during the laser processing. On the one hand, the reflected blue light can be reduced to affect the follow-up stability of the laser processing system. On the other hand, the probability of the nozzle 300 colliding with the plate can be reduced, thereby ensuring the stability of the laser processing.

[0061] In one embodiment, the converging section 150 includes a first converging portion 151 formed within the support 200 and a second converging portion 152 formed within the nozzle 300, such that the extension length of the converging section 150 is relatively long, ensuring that the acceleration distance of the airflow within the converging section 150 is sufficient. Of course, in other embodiments, the converging section 150 may also include only the first converging portion 151 formed within the support 200, or the converging section 150 may also include only the second converging portion 152 formed within the nozzle 300. In this case, it is conducive to the independent processing of the converging section 150 within the support 200 or the nozzle 300, and the processing cost can be reduced.

[0062] In one embodiment, the laser channel further includes a transition section 140 formed between the stabilizing section 130 and the converging section 150. The inner diameter of the transition section 140 gradually decreases from the inlet end 110 to the outlet end 120 direction. The transition section 140 is used to convey the airflow rectified by the stabilizing section 130 to the converging section 150.

[0063] Furthermore, the variation amplitude of the inner diameter in the transition section 140 is smaller than the variation amplitude of the inner diameter in the converging section 150, such that the airflow is also rectified during the process of passing through the transition section 140. Further, the variation amplitude of the inner diameter in the diverging section 160 is small and smaller than the variation amplitude of the inner diameter in the transition section 140.

[0064] Specifically, the inner diameter dimension at the junction of the converging section 150 and the diverging section 160 is D, the extension length of the converging section 150 is L0, 3D < L0 < 4D, the extension length of the diverging section 160 is L1, 2D < L1 < 3D, thereby ensuring sufficient kinetic energy of the airflow of the auxiliary gas ejected at the outlet end 120. Further, L0 = 3.1D, 3.3D, 3.5D, 3.7D or 3.9D; L1 = 2.1D, 2.3D, 2.5D, 2.7D or 2.9D. It can be understood that in this embodiment, the stabilizing section 130, the transition section 140, the converging section 150 and the diverging section 160 are continuous and have an arc transition, thereby ensuring the smoothness of the passage of the auxiliary gas airflow. By setting it in this way, the airflow can reach the speed of sound at the junction of the converging section 150 and the diverging section 160, and further ensure sufficient kinetic energy of the airflow of the auxiliary gas ejected at the outlet end 120.

[0065] In one embodiment, a cooling channel 410 is provided within the support 200, and a blowing port 420 communicating with the cooling channel 410. The blowing port 420 is formed at the end of the support 200 and is used to blow air onto the nozzle 300 to cool the nozzle 300.

[0066] Furthermore, a cooling cavity 430 connected to the cooling channel 410 is provided in the support body 200. The cooling cavity 430 is arranged around the axis of the nozzle 300. The blowing port 420 is arranged around the axis of the nozzle 300 and is connected to the cooling cavity 430, thereby increasing the cooling range of the nozzle 300 and improving the cooling effect of the nozzle 300.

[0067] Specifically, the nozzle 300 includes an injection side 310 and a mounting side 320 that are relatively arranged. The outlet end 120 is formed on the injection side 310. A connecting structure 321 for detachably connecting to the support body 200 is formed on the mounting side 320. When the connecting structure 321 is connected to the support body 200, a gap is provided between the end of the support body 200 and the mounting side 320 for blowing air to the mounting side 320, so that the gap is filled with cooling airflow, thereby accelerating the cooling of the nozzle 300.

[0068] In this embodiment, the blowing port 420 may be a continuous annular hole. Of course, a plurality of blowing ports 420 may be provided and distributed at intervals in the circumferential direction.

[0069] In one embodiment, the support body 200 includes a first support structure 210, and a second support structure 220 detachably connected to the first support structure 210, the laser channel extends in a straight direction, the second support structure 220 is formed with at least part of the laser channel, and the inlet end 110 is formed at the end of the first support structure 210. Through the split setting, it is convenient to replace the second support structure 220 after it is damaged. Specifically, the support body 200 is a ceramic ring. Further, the nozzle 300 is threadedly connected to the end of the support body 200, so as to facilitate the replacement of the nozzle 300. Of course, in other embodiments, the nozzle 300 can also be magnetically connected to the end of the support body 200.

[0070] In one embodiment, a cavity 211 and a mounting port communicating with the cavity 211 are provided in the first support structure 210, and the second support structure 220 can be inserted into the cavity 211 through the mounting port. The laser processing head also includes a mounting ring 230, which is disposed in the cavity 211 and abuts against the limiting protrusion of the cavity 211. The second support structure 220 is threadedly connected to the mounting ring 230 to detachably connect the second support structure 220 to the first support structure 210. Of course, in other embodiments, the laser processing head may also include a fixing member, which passes through the second support structure 220 and is connected to the first support structure 210 to install the second support structure 220 on the first support structure 210.

[0071] In one embodiment, the laser processing head may further include a first sealing ring 510 and a second sealing ring 520. The first sealing ring 510 is arranged in an annular manner on the laser channel and elastically abuts between the first supporting structure 210 and the second supporting structure 220, thereby sealing the laser channel; the second sealing ring 520 is arranged in an annular manner on the cooling channel 410 and elastically abuts between the first supporting structure 210 and the second supporting structure 220, thereby sealing the cooling channel 410.

[0072] Figure 5 It is a schematic diagram of the structure in which an anti-collision component 330 is provided at the gap position between the laser channel and the support body. Figure 5 The anti-collision component 330 can be set at the gap between the stable section 130 of the laser channel and the support body 200; or, the anti-collision component 330 can also be set at the gap between the convergent section 150 of the laser channel and the support body 200; or, the anti-collision component is set at the gap between the divergent section 160 of the laser channel and the support body 200. Or, Figure 5 The anti-collision component 330 can be simultaneously arranged at the gap position between the stabilizing section 130 of the laser channel and the supporting body 200, the gap position between the converging section 150 of the laser channel and the supporting body 200, and the gap position between the diverging section 160 of the laser channel and the supporting body 200. Alternatively, Figure 5 The anti-collision component 330 can be set at any two of the above three positions at the same time.

[0073] Optionally, in order to simplify the internal structure of the laser processing head, a laser channel for the laser beam and auxiliary gas to pass through is provided in the laser processing head, and the laser channel adopts an integrated channel structure. Figure 3 The stable section 130, the convergent section 150 and the divergent section 160 connected in sequence from the inlet end 110 to the outlet end 120 are set as an integrated structure, Figure 4 The laser processing head with integrated laser channel shown in FIG. Figure 4 The structure of the laser processing head shown can be Figure 3 Improvements based on Figure 4 The structure of the laser processing head shown can also be Figure 5 Improvements are made on this basis.

[0074] The laser cutting device provided by the embodiment of the present invention, after the cutting system controller 201 obtains the workpiece feature information of the workpiece to be cut, is able to determine the common edge cutting path of the laser processing head based on the workpiece feature information, and determine the cutting distance between the laser processing head 202 and the surface of the workpiece to be cut based on the workpiece material information and the workpiece deformation information in the workpiece feature information of the workpiece to be cut, so that the determined cutting distance can avoid the laser processing head 202 from colliding with the workpiece to be cut when the workpiece to be cut is deformed, and in the entire cutting process of controlling the laser processing head 202 to follow the common edge cutting path for the workpiece to be cut, the distance between the laser processing head 202 and the surface of the workpiece to be cut is kept as the cutting distance, thereby effectively avoiding damage to components such as the nozzle of the laser processing head 202 caused by the deformation generated during the cutting of the workpiece to be cut, thereby ensuring the stability of laser cutting.

[0075] See also Figure 6 , provides an electronic device, comprising: Processor 601; and A memory 602, used to store executable instructions of the processor; The processor 601 is configured to execute the above-mentioned method by executing the executable instructions.

[0076] The processor 601 can communicate with the memory 602 via the bus 603 .

[0077] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the above-mentioned method is implemented.

[0078] An embodiment of the present invention further provides a computer program product, on which a computer program is stored. When the computer program is executed by a processor, the above-mentioned method is implemented.

[0079] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the embodiments of the present invention.

[0080] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or terminal device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or terminal device including the elements.

[0081] The above is a detailed introduction to a common edge cutting process method and related equipment provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the idea of ​​the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A common edge cutting process method, characterized in that: include: Acquire workpiece feature information of the workpiece to be cut; Based on the workpiece feature information, determining a common edge cutting path of a laser processing head; Determining a cutting distance between a laser processing head and a surface of the workpiece to be cut based on workpiece material information and workpiece deformation information in the workpiece feature information; During the entire process of controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, the distance between the laser processing head and the surface of the workpiece to be cut is maintained as the cutting distance.

2. The common edge cutting process method according to claim 1, characterized in that: The step of obtaining a common edge cutting path of a workpiece to be cut comprises: Acquire a workpiece contour from the workpiece feature information; Based on the workpiece contour, determining common edge information of the workpiece to be cut; Based on the workpiece contour and the common edge information of the workpiece to be cut, a common edge cutting path of the laser processing head is determined.

3. The common edge cutting process method according to claim 1, characterized in that: The method further comprises: When controlling the laser processing head to cut the workpiece to be cut according to the common edge cutting path, monitoring the distance between the laser processing head and the surface of the workpiece to be cut; When it is monitored that the distance between the laser processing head and the surface of the workpiece to be cut is less than or equal to a preset distance threshold, the step size is adjusted according to the preset distance, the cutting distance is increased, and the distance between the laser processing head and the surface of the workpiece to be cut is maintained at the increased cutting distance.

4. The common edge cutting process method according to claim 1, characterized in that: The workpiece feature information also includes a cutting shape, and the method further includes: Based on the workpiece material information and cutting shape of the workpiece to be cut, a first cutting parameter of the laser processing head is determined, wherein the first cutting parameter includes at least one of gas parameters, cutting speed, laser beam power, laser focus, laser frequency and laser duty cycle.

5. The common edge cutting process according to any one of claims 1 to 4, characterized in that: The cutting distance ranges from 4 mm to 20 mm, in particular from 8 mm to 20 mm.

6. The common edge cutting process according to any one of claims 1 to 5, characterized in that: The cutting distance is greater than a minimum distance between the laser processing head and the surface of the workpiece to be cut when the laser processing head moves along the common edge cutting path.

7. The common edge cutting process method according to claim 1, characterized in that: The step of cutting the workpiece to be cut according to the common edge cutting path by the laser processing head includes: If the common edge cutting path includes a corner path, when the laser processing head cuts the corner path of the workpiece to be cut, determining a second cutting parameter that matches the corner range of the corner path, and adjusting the cutting parameter of the laser processing head based on the target cutting parameter; The laser processing head is controlled to cut the workpiece to be cut according to the corner path in the common edge cutting path based on the adjusted cutting parameters.

8. An electronic device, characterized in that: The method comprises a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program implements the steps in the method according to any one of claims 1 to 7 when executed by the processor.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps in the method according to any one of claims 1 to 7 are implemented.

10. A computer program product, characterized in that The method comprises a computer program, which, when executed by a processor, implements the steps of the method according to any one of claims 1 to 7.

Images