Glass wafer grinding device and process

Abstract

The invention discloses a glass wafer grinding device and process, and relates to the field of glass wafer grinding, the glass wafer grinding device comprises a machine body, a bearing plate is rotationally arranged on the machine body, a containing groove used for containing a jig disc is formed in the bearing plate, a mounting plate is further arranged on the machine body in a lifting mode, a first motor is arranged in the mounting plate, and a second motor is arranged in the mounting plate. A sleeve is coaxially fixed to an output shaft of the first motor, a rotating rod is arranged in the sleeve in a sleeved mode, inserting blocks are arranged on the peripheral side of the rotating rod, inserting grooves are formed in the sleeve, the inserting blocks are matched with the inserting grooves in an inserting mode, adjusting springs are arranged in the sleeve, and the adjusting springs are located on the upper side of the rotating rod. And one end of the adjusting spring is connected with the rotating rod, the other end of the adjusting spring is connected with the inner wall of the sleeve, and a grinding wheel is coaxially fixed to the lower end of the rotating rod. The grinding equipment is higher in applicability, and the grinding efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the field of glass wafer grinding, and in particular to a glass wafer grinding device and process. Background Art

[0002] Glass wafers need to be ground during processing, and existing grinding devices include a rotatable jig and a rotatable grinding wheel. The jig is used to place the round glass wafer and fix it using vacuum adsorption, and then the grinding wheel rotates to grind the surface of the glass wafer.

[0003] In the existing grinding device, the lifting height of the grinding wheel is fixed and set by the control program. When the thickness of the glass wafer changes, the parameters in the control program need to be changed accordingly so that the lowering height of the grinding wheel can adapt to the glass wafer. That is, when the thickness of the glass wafer changes, the lowering distance of the grinding wheel needs to be reset, which is quite troublesome. That is, the existing grinding device is not very applicable. Summary of the invention

[0004] In order to achieve highly adaptive changes in the grinding wheel and improve the applicability of the grinding device, the present application provides a glass wafer grinding device and process.

[0005] The present application provides a glass wafer grinding device and process using the following technical solutions: A glass wafer grinding device comprises a body, a supporting plate is rotatably arranged on the body, a receiving groove for placing a jig disk is provided on the supporting plate, a mounting plate is also lifted and lowered on the body, a first motor is arranged in the mounting plate, a sleeve is coaxially fixed on the output shaft of the first motor, a rotating rod is sleeved in the sleeve, a plug-in block is arranged on the circumferential side of the rotating rod, a plug-in groove is provided in the sleeve, the plug-in block is plugged and matched with the plug-in groove, an adjusting spring is arranged in the sleeve, the adjusting spring is located on the upper side of the rotating rod, one end of the adjusting spring is connected to the rotating rod, and the other end of the adjusting spring is connected to the inner wall of the sleeve, a grinding wheel is coaxially fixed to the lower end of the rotating rod; a plurality of placement grooves for placing glass wafers are arranged in a circular array on the jig disk, and the rotation trajectory of the edge of the grinding wheel passes through the center of the jig disk.

[0006] By adopting the above technical solution, the jig plate is placed in the accommodating groove, and then the glass wafer is placed in the placement groove of the jig plate, and then the mounting plate is lowered, the lowering stroke of the mounting plate is fixed, the grinding wheel abuts against the surface of the glass wafer, and then the supporting plate is rotated, and the grinding wheel rotates at the same time, so that the grinding operation of the glass wafer can be realized; when the thickness of the glass wafer increases, after the grinding wheel abuts against the glass wafer, the lowering stroke of the mounting plate has not yet ended, and at this time the adjusting spring is compressed, and the sleeve moves downward relative to the rotating rod until the lowering stroke of the mounting plate ends; that is, the adjusting spring is used to make the grinding wheel adaptive to the thickness of the glass wafer, and there is no need to change the parameters in the control program, which has strong applicability and helps to improve efficiency.

[0007] Preferably, a screw slide is provided on the machine body along the vertical direction, and the mounting plate is fixedly connected to the slide of the screw slide.

[0008] By adopting the above technical solution, the motor drives the screw rod to rotate, and the screw rod drives the slide table to rise and fall, so that the lifting movement of the installation plate can be realized.

[0009] Preferably, a connecting shaft is rotatably connected in the body, the connecting shaft is coaxially fixed with the supporting plate, a second motor is installed in the body, a first pulley is coaxially fixed on the second motor, a second pulley is coaxially fixed on the connecting shaft, and a first belt is wound around the first pulley and the second pulley; a connecting hole is vertically provided in the connecting shaft, a plurality of adsorption holes are provided on the bottom wall of the supporting plate located in the accommodating groove, the connecting holes are connected with all the adsorption holes, a connecting pipe is connected to the lower end of the connecting shaft via a rotating joint, a vacuum pump is provided in the body, the exhaust port of the vacuum pump is connected with the connecting pipe, a third pulley is coaxially fixed on the output shaft of the second motor, a fourth pulley is coaxially fixed on the input shaft of the vacuum pump, and a second belt is wound around the third pulley and the fourth pulley.

[0010] By adopting the above technical solution, the second motor is operated to drive the first pulley and the third pulley to rotate. The first pulley drives the second pulley to rotate through the first belt, that is, the supporting plate is driven to rotate through the connecting shaft, that is, the fixture disk drives the glass wafer to rotate, and cooperates with the rotation of the grinding wheel to help improve the grinding efficiency; the third pulley drives the fourth pulley to rotate through the second belt, and the fourth pulley drives the input shaft of the vacuum pump to rotate, thereby realizing the operation of the vacuum pump, and the vacuum pump is evacuated to generate negative pressure at the adsorption hole, thereby realizing the adsorption and fixation of the fixture disk and the glass wafer; that is, the rotation of the supporting plate and the adsorption and fixation of the fixture disk and the glass wafer can be realized while the second motor is running.

[0011] Preferably, the machine body is provided with a surrounding plate around the supporting plate, the surrounding plate is formed on the machine body to form a liquid collecting trough, the upper end of the supporting plate is higher than the machine body table; the machine body is provided with a liquid leakage port on the table, a drain pipe connected to the liquid leakage port is provided in the machine body, a flared portion is formed on the drain pipe, the drain pipe is rotatably connected to a rotating column in the flared portion, a plurality of collecting frames are arranged in a circular array around the rotating column, and a collecting net is arranged on the collecting frame.

[0012] By adopting the above technical scheme, during the grinding process, the grinding liquid is in a state of being sprayed all the time, and the grinding liquid will accumulate in the liquid collecting tank and enter the drain pipe from the liquid leakage port for discharge. Because broken glass fragments and abrasive particles will be generated during the grinding process, in order to prevent blockage in the drain pipe, when the grinding liquid flows in the drain pipe, the glass fragments and abrasive particles will be collected by the collecting net, and in the process of being collected, the impurities will block the mesh of the collecting net, that is, the mesh area of ​​the collecting net will decrease, thereby increasing the force of the water flow acting on the collecting net, and the water flow can drive the collecting net to rotate, thereby increasing the instantaneous rotation speed of the collecting net, and then the subsequent collecting nets continue to collect; in the initial situation, because there are more meshes on the collecting net, the collection net rotates slowly when the water flow acts on the collecting net; and in practice, when the collecting net rotates, there will be a situation where the collected impurities fall from the collecting net, but the existence of multiple collecting nets can buffer and block the impurities in the grinding liquid, prevent the impurities from piling up and flowing downward, and also prevent blockage from occurring.

[0013] Preferably, a liquid outlet pipe is provided on the machine body, the end of the liquid outlet pipe is inclined downward, and the liquid outlet of the liquid outlet pipe faces the jig disk; a liquid inlet pipe is provided in the machine body, one end of the liquid inlet pipe is connected with the liquid outlet pipe, and the other end of the liquid outlet pipe is connected with the grinding liquid, a containing chamber is formed on the liquid inlet pipe, an opening and closing plate for opening and closing the liquid inlet pipe is slidably provided in the containing chamber, a compression spring is also provided in the containing chamber, one end of the compression spring is connected with the opening and closing plate, and the other end of the compression spring is connected with the inner wall of the containing chamber.

[0014] By adopting the above technical solution, the liquid inlet pipe can be opened by sliding the opening and closing plate to realize the supply of grinding liquid. When the grinding is completed, the compression spring acts on the opening and closing plate, the opening and closing plate is reset, and the liquid inlet pipe is closed.

[0015] The second transmission gear of the second end is connected with the gear of the first end to the second transmission gear of the second end, and the gear of the second end is connected with the gear of the first end to the second transmission gear of the second end. A first arc groove is provided, a curvature center of the first arc groove is located at the center of the first driving wheel, the bottom wall of the first arc groove is in the shape of a wedge-shaped surface, a first driving rod is eccentrically arranged on the second driving wheel, and the first driving rod is slidably matched with the first arc groove; a third driving wheel is coaxially fixed on the second rotating shaft, and a fourth driving wheel is rotatably connected to the second connecting rod, and a second arc groove is provided on the third driving wheel, and the curvature center of the second arc groove is located at the center of the third driving wheel, and the bottom wall of the second arc groove is in the shape of a wedge-shaped surface, and the fourth driving wheel is eccentrically arranged with a second driving rod, and the second driving rod is slidably matched with the second arc groove; a height difference between a higher end and a lower end of the second arc groove is greater than a height difference between a higher end and a lower end of the first arc groove; an avoidance opening is formed on the active lever, and when the active lever is extended to cooperate with the second driven lever, the avoidance opening enables the active lever to avoid the first driven lever.

[0016] By adopting the above technical solution, when the connecting shaft rotates, the expansion and contraction amount of the active lever relative to the connecting shaft changes due to the change in the rotation speed of the connecting shaft. When the connecting shaft rotates faster, the active lever expands and contracts more outward. In practice, according to actual grinding needs, the connecting shaft has two rotation speeds. When it is slower, the active lever cooperates with the first driven lever to drive the first driven wheel to rotate. When it is faster, the active lever cooperates with the second driven lever to drive the second driven wheel to rotate. When the first driven wheel rotates, the first driving wheel rotates, and the first driving rod slides through the cooperation of the wedge-shaped surface of the bottom wall of the first arc groove. The sliding distance of the first driving rod is the height difference between the higher end and the lower end of the first arc groove. The first driving rod drives the first connecting rod to slide, thereby realizing the sliding of the opening and closing plate and the liquid inlet pipe. Open; when the second driven wheel rotates, the third driving wheel rotates, and the second driving rod slides through the cooperation of the wedge-shaped surface of the bottom wall of the second arc groove. The sliding distance of the second driving rod is the height difference between the higher end and the lower end of the second arc groove. The second driving rod drives the second connecting rod to slide, that is, the sliding of the opening and closing plate is realized, and the opening of the liquid inlet pipe is realized. Because the height difference between the higher end and the lower end of the first arc groove is smaller than the height difference between the higher end and the lower end of the second arc groove, when the speed of the connecting shaft is faster, that is, when the second connecting rod slides, the moving stroke of the opening and closing plate becomes larger, and the flow opening of the liquid inlet pipe is enlarged, so as to realize the flow regulation; that is, when the speed is faster, the spray amount of the grinding liquid will also become larger to ensure the supply of grinding liquid during grinding, and when the speed is slower, the spray amount of the grinding liquid will decrease to prevent the waste of grinding liquid.

[0017] Preferably, a plurality of sliding grooves are provided on the circumferential side of the connecting shaft, the active lever slides in the corresponding sliding grooves, a return spring is provided in the connecting shaft located in the sliding groove, one end of the return spring is connected to the inner wall of the sliding groove, and the other end of the return spring is connected to the active lever.

[0018] By adopting the above technical solution, the active lever slides in the sliding groove and is connected by a reset spring. When the connecting shaft rotates, the active lever slides outward due to the action of centrifugal force. Since the centrifugal force increases with the rotation speed, the active lever cooperates with the first driven lever when the rotation speed is low. When the rotation speed is high, the active lever slides outward a lot and cooperates with the second driven lever.

[0019] A glass wafer grinding process, using the above-mentioned grinding device, comprises the following steps: S1: Fine engraving of glass wafers; S2: After fine carving, check the thickness and whether there are gaps and chipping on the side; S3: grinding using a grinding device; S4: Inspection after grinding, check the thickness and whether there are notches and chipping on the circumference; S5: polishing; S6: cleaning after polishing; S7: Laser coding: S8: cleaning; S9: Coding inspection, inspecting the coding angle length and character height, width and spacing; S10: Finished product packaging.

[0020] In summary, the present application includes at least one of the following beneficial technical effects: 1. The adjusting spring is used to make the rotating rod float in the sleeve, that is, the floating of the grinding wheel is realized. When the thickness of the glass wafer increases, the grinding wheel first contacts the surface of the glass wafer, and then the mounting plate continues to descend. At this time, the adjusting spring is compressed. In this way, there is no need to additionally change the descending stroke of the mounting plate, and the grinding wheel can adaptively adjust the thickness of the glass wafer. It has strong applicability and helps to improve processing efficiency. 2. The second motor runs to drive the first pulley and the third pulley to rotate. The first pulley realizes the rotation of the connecting shaft through the first belt and the second pulley. The third pulley realizes the operation of the vacuum pump through the second belt and the fourth pulley. That is, when the support plate rotates, negative pressure is generated at the adsorption hole to achieve adsorption and fixation of the glass wafer and the fixture plate. 3. According to the two rotational speeds of the connecting shaft, the active lever cooperates with the first driven lever and the second driven lever respectively. When the rotational speed of the connecting shaft is slow, the active lever cooperates with the first driven lever and drives the opening and closing plate to move. When the rotational speed of the connecting shaft is fast, the active lever cooperates with the second driven lever and drives the opening and closing plate to slide. Under different rotational speeds, the sliding distance of the opening and closing plate is different, that is, the opening and closing degree of the liquid inlet pipe is different, and the flow of the liquid spray pipe is adaptively adjusted. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present application; Figure 2 This is a partial structural diagram of Embodiment 1 of the present application, which mainly reflects the structure of the sleeve and the rotating rod; Figure 3 This is a schematic cross-sectional structural diagram of the machine body in Example 1 of the present application; Figure 4 This is a schematic cross-sectional structural diagram of the connecting shaft and the supporting plate in the first embodiment of the present application; Figure 5 This is a schematic cross-sectional structural diagram of the liquid discharge pipe in Example 1 of the present application; Figure 6 This is a schematic cross-sectional view of the machine body in the first embodiment of the present application, which mainly reflects the structure of the storage compartment; Figure 7 This is a partial structural diagram of the first embodiment of the present application, which mainly reflects the structure of the opening and closing plate; Figure 8This is a schematic diagram of the overall structure of the first embodiment of the present application, which mainly reflects the structure of the active lever; Fig. 9 This is a partial structural diagram of Embodiment 1 of the present application; Fig.10 This is a partial structural diagram of Embodiment 2 of the present application; Fig.11 This is a schematic cross-sectional structural diagram of the linkage plate in the second embodiment of the present application; Fig.12 This is a partial structural diagram of the second embodiment of the present application, which mainly reflects the structures of the first, second and third waist-shaped grooves; Fig.13 for Fig.12 A partial enlarged view of middle A.

[0022] Figure numerals: 1, body; 11, enclosure; 111, liquid collecting tank; 12, screw slide; 13, liquid outlet pipe; 14, second motor; 141, first pulley; 142, third pulley; 15, liquid leakage port; 16, support plate; 2, support plate; 21, receiving tank; 22, fixture plate; 221, placement tank; 23, adsorption hole; 3, mounting plate; 31, first motor; 4, sleeve; 41, plug-in slot; 42, adjustment spring; 5, rotating rod; 51, plug-in block; 52, grinding wheel; 6, connecting shaft; 61, second pulley; 611, first belt; 62, connecting hole; 63, connecting pipe; 64, active lever; 641, avoidance port; 65, sliding groove; 66, reset spring; 7, vacuum pump; 71, fourth pulley; 72, second belt; 8, drain pipe; 81, flaring portion; 82, rotating column; 83, collecting frame; 84, collecting net; 9, liquid inlet pipe; 91, containing chamber; 92, opening and closing plate; 921, connecting plate; 92 2. first connecting rod; 9221. second driving wheel; 9222. first driving rod; 923. second connecting rod; 9231. fourth driving wheel; 9232. second driving rod; 93. compression spring; 94. hose; 10. first rotating shaft; 101. first driven wheel; 1011. first driven lever; 102. first driving wheel; 1021. first arc groove; 20. second rotating shaft; 201. second driven wheel; 2011. second driven lever; 2 02, third driving wheel; 2021, second arc groove; 30, vertical plate; 301, rotating plate; 302, sliding groove; 40, sliding rod; 401, extrusion wheel; 50, linkage rod; 60, linkage plate; 601, first waist-shaped groove; 6011, lifting groove; 6012, abutting spring; 602, second waist-shaped groove; 6021, baffle; 603, third waist-shaped groove; 6031, connecting port; 70, wedge block; 701, wedge surface; 702, blocking surface. DETAILED DESCRIPTION

[0023] The following combination Figure 1-Figure 13 This application is described in further detail.

[0024] The embodiment of the present application discloses a glass wafer grinding device.

[0025] Example 1 Reference Figure 1 and Figure 2 The glass wafer grinding device includes a machine body 1, three panels 11 are arranged on the table of the machine body 1, and the three panels 11 cooperate with the back plate to form a liquid collecting tank 111 on the table. The machine body 1 is located on the table and is rotatably connected to a supporting plate 2, the upper end of the supporting plate 2 is higher than the table, and a receiving groove 21 for placing a fixture plate 22 is opened on the supporting plate 2, and a plurality of placement grooves 221 for placing glass wafers are arranged on the fixture plate 22; a screw slide 12 is installed on the machine body 1 in a vertical direction, and a mounting plate 3 is installed on the slide of the screw slide 12, and a first motor 31 is installed in the mounting plate 3, and the first motor A sleeve 4 is coaxially fixed on the output shaft of 31, a rotating rod 5 is sleeved in the sleeve 4, a plug-in block 51 is integrally formed on the circumference of the rotating rod 5, a plug-in slot 41 is opened in the sleeve 4, the plug-in block 51 is plugged into and slidably fit with the plug-in slot 41, an adjusting spring 42 is arranged in the sleeve 4, the adjusting spring 42 is located on the upper side of the rotating rod 5, one end of the adjusting spring 42 is connected to the rotating rod 5, and the other end is connected to the inner wall of the sleeve 4; a grinding wheel 52 is coaxially fixed to the lower end of the rotating rod 5; a liquid outlet pipe 13 is installed on the body 1, the end of the liquid outlet pipe 13 is tilted downward, and the liquid outlet faces the fixture disk 22.

[0026] The jig plate 22 is placed in the receiving groove 21 of the support plate 2, and the jig plate 22 and the support plate 2 rotate coaxially, and then the glass wafer is placed in the placement groove 221 of the jig plate 22, and the mounting plate 3 drives the grinding wheel 52 to descend, and the descending stroke of the mounting plate 3 is fixed, and the grinding wheel 52 abuts against the surface of the glass wafer, and then the support plate 2 and the grinding wheel 52 rotate, and the grinding operation of the glass wafer can be realized. When the thickness of the glass wafer increases, after the grinding wheel 52 abuts against the glass wafer, the mounting plate 3 will continue to descend until the moving stroke ends. At this time, the adjustment spring 42 is compressed, that is, the grinding wheel 52 in this application can be adaptively adjusted to adapt to the thickness of the glass wafer, which is more applicable, and there is no need to adjust the descending stroke of the mounting plate 3, which helps to improve the processing efficiency. In practice, the rotation trajectory of the edge of the grinding wheel 52 passes through the center of the jig plate 22, so that each glass wafer can be fully ground during the grinding process.

[0027] Reference Figure 1 and Figure 3, a connecting shaft 6 is rotatably connected in the machine body 1, and the connecting shaft 6 is coaxially fixed with the lower end of the supporting plate 2. A second motor 14 is installed in the machine body 1. The second motor 14 is a double-headed motor, and a first output shaft and a second output shaft are formed on the double-headed motor. A first pulley 141 is coaxially fixed on the first output shaft, and a second pulley 61 is coaxially fixed on the connecting shaft 6. A first belt 611 is wound around the first pulley 141 and the second pulley 61. When the second motor 14 is running, the connecting shaft 6 can be rotated through the first pulley 141, the second pulley 61 and the first belt 611, thereby realizing the rotation of the supporting plate 2.

[0028] Reference Figure 3 and Figure 4 , the connecting shaft 6 is provided with a connecting hole 62 in the vertical direction, the supporting plate 2 is provided with a plurality of adsorption holes 23 in the receiving groove 21, the connecting hole 62 is connected with all the adsorption holes 23, the lower end of the connecting shaft 6 is connected with a connecting pipe 63 through a rotating joint, a vacuum pump 7 is also installed in the machine body 1, the air suction port of the vacuum pump 7 is connected with the connecting pipe 63, a third pulley 142 is coaxially fixed on the second output shaft of the double-headed motor, a fourth pulley 71 is coaxially fixed on the input shaft of the vacuum pump 7, and a second belt 72 is wound around the third pulley 142 and the fourth pulley 71. When the second motor 14 is running, the operation of the vacuum pump 7 can be realized through the third pulley 142, the fourth pulley 71 and the second belt 72, and negative pressure is generated at the adsorption hole 23, so as to realize the adsorption and fixation of the fixture plate 22 and the glass wafer. When the second motor 14 is running, the rotation of the supporting plate 2 and the adsorption and fixation of the fixture plate 22 and the glass wafer are realized at the same time.

[0029] Reference Figure 1 , Figure 3 and Figure 5 The machine body 1 is provided with a leakage port 15 on the table, and the table of the machine body 1 is inclined toward the leakage port 15, so that the grinding liquid can be discharged from the leakage port 15. A drain pipe 8 is installed in the machine body 1, and the drain pipe 8 is inclined. A flared portion 81 is formed on the drain pipe 8. The drain pipe 8 is located in the flared portion 81 and is rotatably connected to a rotating column 82. A plurality of collection frames 83 are arranged on the circumference of the rotating column 82, and a collection net 84 is arranged in the collection frame 83. During the grinding process, the liquid outlet pipe 13 continuously supplies the grinding liquid to the fixture plate 22, and the grinding liquid will flow into the liquid collecting tank 111 and enter the drain pipe 8 from the leakage port 15.

[0030] Because broken glass fragments and abrasive particles are generated during the grinding process, in order to prevent impurities from clogging the drain pipe 8, when the grinding liquid passes through the collection net 84, the impurities will be collected by the collection net 84, and when the impurities are collected on the collection net 84, the mesh of the collection net 84 is filled, and the effective area of ​​the water flow on the collection net 84 becomes larger, which can drive the collection net 84 to rotate, increase the rotation speed of the collection net 84, and as the collection net 84 rotates, the impurities can be continuously collected. In the initial situation, the water flow acts on the collection net 84, and due to the presence of several meshes, the rotation speed of the collection net 84 is slow. In practice, when the collection net 84 rotates, there will be a situation where impurities fall from the collection net 84, but the rotation of multiple collection nets 84 can play a buffering and blocking role for the impurities in the grinding liquid, so that the impurities are separated, and the impurities are prevented from piling up together, and the blockage can also be prevented.

[0031] Reference Figure 1 , Figure 6 and Figure 7 A liquid inlet pipe 9 is installed in the machine body 1, one end of the liquid inlet pipe 9 is connected to the liquid outlet pipe 13, and the other end is connected to the external grinding liquid. A receiving chamber 91 is formed on the liquid inlet pipe 9, and an opening and closing plate 92 for opening and closing the liquid inlet pipe 9 is slidably arranged in the receiving chamber 91. A compression spring 93 is arranged in the receiving chamber 91, and one end of the compression spring 93 is connected to the opening and closing plate 92, and the other end is connected to the inner wall of the receiving chamber 91. The opening of the liquid inlet pipe 9 is realized by the sliding of the opening and closing plate 92, and then the supply of the grinding liquid is realized. When the grinding is completed, the opening and closing plate 92 is reset under the action of the compression spring 93 to close the liquid inlet pipe 9.

[0032] Reference Figure 3 and Figure 4 , a plurality of active levers 64 are telescopically arranged on the circumference of the connecting shaft 6, and all active levers 64 are arranged in a circular array on the circumference of the connecting shaft 6; a plurality of sliding grooves 65 are provided on the circumference of the connecting shaft 6, and the sliding grooves 65 correspond to the active levers 64 one by one, and the active levers 64 slide in the sliding grooves 65, and a return spring 66 is arranged in the sliding grooves 65 of the connecting shaft 6, and one end of the return spring 66 is connected to the inner wall of the sliding groove 65, and the other end is connected to the active lever 64. When the connecting shaft 6 rotates, the active lever 64 will slide outward due to the action of centrifugal force, and the sliding amount of the active lever 64 will also change due to the different rotation speeds and the different centrifugal force sizes. In practice, the connecting shaft 6 has two rotation speeds to adapt to different requirements for grinding glass wafers. When the rotation speed of the connecting shaft 6 is faster, the active lever 64 will slide outward more.

[0033] Reference Figure 6 and Figure 8The first rotating shaft 10 and the second rotating shaft 20 are rotatably connected in the machine body 1, the first rotating shaft 10 is coaxially fixed with a first driven wheel 101, the first driven wheel 101 has a plurality of first driven levers 1011 arranged in a circumferential array, the second rotating shaft 20 is coaxially fixed with a second driven wheel 201, the second driven wheel 201 has a plurality of second driven levers 2011 arranged in a circumferential array, and the second driven wheel 201 is located on a side of the first driven wheel away from the connecting shaft 6. When the connecting shaft 6 rotates, the active lever 64 can cooperate with the first driven lever 1011 or the second driven lever 2011, thereby realizing the rotation of the first driven wheel 101 or the second driven wheel 201. An avoidance opening 641 is formed on the active lever 64. When the connecting shaft 6 rotates at a faster speed, the active lever 64 slides outward to cooperate with the second driven lever 2011. At this time, the avoidance opening 641 is used to avoid the first driven lever 1011. When the connecting shaft 6 rotates at a slower speed, the active lever 64 cooperates with the first driven lever 1011.

[0034] Reference Figure 7 , Figure 8 and Fig. 9 The opening and closing plate 92 extends out of the accommodating chamber 91 to form a connecting plate 921, and a first connecting rod 922 and a second connecting rod 923 are fixedly connected to the connecting plate 921. A first driving wheel 102 is coaxially fixed to the first rotating shaft 10, and the first connecting rod 922 is rotatably connected to the second driving wheel 9221. A first arc-shaped groove 1021 is formed on the first driving wheel 102, and the center of curvature of the first arc-shaped groove 1021 is located at the center of the first driving wheel 102. The bottom wall of is in the shape of a wedge surface. The second driving wheel 9221 is fixedly connected with a first driving rod 9222. The first driving rod 9222 is eccentrically arranged. The first driving rod 9222 slides with the first arc groove 1021. The end of the first arc groove 1021 away from the second driving wheel 9221 is the lower end, and the end of the first arc groove 1021 close to the second driving wheel 9221 is the higher end. In the initial state, the first driving rod 9222 is located at the lower end of the first arc groove 1021. The first driven wheel 101 drives the first driving wheel 102 to rotate through the first rotating shaft 10. When the first driving wheel 102 rotates, the first driving rod 9222 slides in the first arc groove 1021 and slides from the lower end to the higher end. Due to the height difference between the lower end and the higher end, the first driving rod 9222 drives the first connecting rod 922 to slide, thereby realizing the sliding of the opening and closing plate 92 and opening the liquid inlet pipe 9.

[0035] The third driving wheel 202 is coaxially fixed on the second rotating shaft 20, the fourth driving wheel 9231 is rotatably connected to the second connecting rod 923, the third driving wheel 202 is provided with a second arc groove 2021, the curvature center of the second arc groove 2021 is located at the center of the third driving wheel 202, the bottom wall of the second arc groove 2021 is wedge-shaped, the fourth driving wheel 9231 is fixedly connected with a second driving rod 9232, the second driving rod 9232 is eccentrically arranged, and the second driving rod 9232 is slidably matched with the second arc groove 2021. The height difference between the higher end and the lower end of the second arc groove 2021 is greater than the height difference between the higher end and the lower end of the first arc groove 1021.

[0036] When the connecting shaft 6 rotates at a faster speed, the active lever 64 cooperates with the second driven lever 2011 to drive the third driving wheel 202 to rotate, and the third driving wheel 202 slides in the second arc groove 2021, and then drives the second driving rod 9232 to rotate, and the second driving rod 9232 moves from the lower end of the second arc groove 2021 to the higher end, that is, drives the second connecting rod 923 to slide, and realizes the opening of the opening and closing plate 92. Because the height difference between the higher end and the lower end of the second arc groove 2021 is greater than the height difference between the higher end and the lower end of the first arc groove 1021, the moving distance of the opening and closing plate 92 becomes larger, that is, the flow opening of the liquid inlet pipe 9 increases, and the spraying amount of the grinding liquid increases. By switching the two rotation speeds of the connecting shaft 6, the first connecting rod 922 or the second connecting rod 923 moves, thereby realizing the change of the moving distance of the opening and closing plate 92, and realizing the adjustment of the flow rate of the grinding liquid. That is, when the rotation speed is faster, the amount of grinding fluid sprayed will also increase, ensuring the supply of grinding fluid during grinding. When the rotation speed is slower, the amount of grinding fluid sprayed will decrease, preventing waste of grinding fluid.

[0037] The implementation principle of a glass wafer grinding device in an embodiment of the present application is as follows: the jig disk 22 is placed in the receiving groove 21 of the supporting plate 2, and then the glass wafer is placed in the placement groove 221 of the jig disk 22, and the mounting plate 3 is lowered to drive the grinding disk to abut against the glass wafer. If the thickness of the glass wafer is relatively large, the mounting plate 3 will continue to descend after the grinding disk abuts against the glass wafer. At this time, the adjusting spring 42 is compressed until the descending stroke of the mounting plate 3 ends. That is, by adjusting the setting of the spring 42, the grinding wheel 52 can adapt to the thickness of the glass wafer, and there is no need to adjust the descending stroke of the mounting plate 3. It has strong applicability and helps to improve processing efficiency.

[0038] Example 2 Reference Fig.10 and Fig.11The difference between this embodiment and embodiment 1 is that a support plate 16 is fixedly installed in the body 1, a hose portion 94 is formed on the liquid inlet pipe 9, the diameter of the hose portion 94 is larger than the diameter of the liquid outlet pipe 13, and the hose portion 94 is fixed on the support plate 16. A vertical plate 30 is fixedly connected to the support plate 16. A rotating plate 301 is hinged on the vertical plate 30 through a torsion spring, and in the initial state, the rotating plate 301 is tilted upward, and a sliding groove 302 is opened on the rotating plate 301 along its length direction. The vertical plate 30 is located in the sliding groove 302 and is slidably connected to a sliding rod 40, and an extrusion wheel 401 is coaxially fixed to the sliding rod 40. A linkage rod 50 is fixedly connected to the lower side of the mounting plate 3, and a linkage plate 60 is fixedly connected to the middle position of the linkage rod 50. The linkage plate 60 surrounds the peripheral side of the support plate 16, and a first waist-shaped groove 601 is opened on the linkage plate 60 in the horizontal direction. A second waist-shaped groove 602 is also opened on the linkage plate 60 in the vertical direction. The lower end of the second waist-shaped groove 602 is connected to the end of the first waist-shaped groove 601. In the initial state, the sliding rod 40 is located in the first waist-shaped groove 601.

[0039] When the linkage rod 50 descends, the linkage plate 60 descends, and the linkage plate 60 drives the sliding rod 40 to move downward through the first waist groove 601, and drives the rotating plate 301 to rotate downward. When the rotating plate 301 rotates and is set to be tilted downward and overlapped on the support plate 16, when the linkage plate 60 descends, the sliding rod 40 will slide downward along the sliding groove 302, and the squeezing wheel 401 will move and squeeze the hose part 94. Under the squeezing action, the grinding liquid will be sprayed out from the liquid outlet pipe 13 and sprinkled on the surface of the glass wafer, which can ensure that the glass wafer will have polishing liquid before the grinding wheel 52 abuts against the glass wafer, ensuring the grinding effect and preventing the glass wafer surface contacting the grinding wheel 52 from being without polishing liquid when the grinding wheel 52 initially rotates. After the sliding rod 40 enters the second waist groove 602, under the action of the torsion spring, the rotating plate 301 is reset, and the squeezing wheel 401 no longer squeezes the hose part 94, preventing the subsequent delivery of the grinding liquid from being affected.

[0040] Reference Fig.11 and Fig.12 A third waist-shaped groove 603 is also provided on the linkage plate 60. The third waist-shaped groove 603 is inclined. One end of the third waist-shaped groove 603 is connected to one end of the first waist-shaped groove 601 away from the second waist-shaped groove 602 to form a connecting port 6031. The other end of the third waist-shaped groove 603 is connected to the second waist-shaped groove 602.

[0041] The vertical plate 30 is located in the second waist-shaped groove 602 and is hinged with a baffle 6021 through a torsion spring. The baffle 6021 is tilted and its tilting direction is consistent with that of the third waist-shaped groove 603. The baffle 6021 can only rotate upward. The linkage rod 50 drives the linkage plate 60 to rise and reset. Before resetting, the sliding rod 40 will abut against the baffle 6021, and then the linkage plate 60 continues to rise until it is reset, driving the rotating plate 301 to rotate upward. At this time, the tilting direction of the sliding groove 302 is consistent with that of the third waist-shaped groove 603. The sliding rod 40 enters the connecting port 6031 along the third waist-shaped groove 603. Subsequently, under the action of the torsion spring, the rotating plate 301 is reset, driving the sliding rod 40 to move a certain distance in the first waist-shaped groove 601 and disengage from the connecting port 6031. If the sliding rod 40 is located at the connecting opening 6031, then when the linkage plate 60 descends, the sliding rod 40 may directly enter the third waist-shaped groove 603 from the connecting opening 6031, affecting normal operation. In practice, when the linkage plate 60 rises and resets, the rotating plate 301 rotates upward by a certain distance, and at this time the torsion spring will generate a force on the rotating plate 301, that is, at this time the rotating plate 301 generates a certain extrusion force on the sliding rod 40 and the inner wall of the third waist-shaped groove 603, but this extrusion force is small, that is, the friction between the sliding rod 40 and the third waist-shaped groove 603 and the sliding groove 302 is small, and the sliding rod 40 may slip under the gravity component of the extrusion wheel 401.

[0042] Reference Fig.12 and Fig.13 The linkage plate 60 is located on the bottom wall of the first waist-shaped groove 601 and is provided with a lifting groove 6011. The linkage plate 60 is located in the lifting groove 6011 and is provided with a wedge block 70 for lifting and sliding. The linkage plate 60 is located in the lifting groove 6011 and is provided with an abutment spring 6012. One end of the abutment spring 6012 is connected to the bottom of the wedge block 70, and the other end of the compression spring 93 is connected to the bottom wall of the lifting groove 6011. A wedge surface 701 is formed on the side of the wedge block 70 close to the connecting port 6031, and a blocking surface 702 is formed on the side of the wedge block 70 away from the connecting port 6031.

[0043] When the sliding rod 40 slides from the third waist-shaped groove 603 into the connecting opening 6031, and then the rotating plate 301 is reset to drive the sliding rod 40 to slide in the first waist-shaped groove 601, the sliding rod 40 contacts the wedge surface 701 of the wedge block 70, so that the wedge block 70 slides into the lifting groove 6011 to avoid the sliding of the sliding rod 40. When the sliding rod 40 is separated from the wedge block 70, the compression spring 93 acts, and the wedge block 70 extends out of the lifting groove 6011. At this time, the blocking surface 702 can limit the direction of the sliding of the sliding rod 40; because the initial state of the rotating plate 301 is inclined upward, when the linkage plate 60 descends, if there is no wedge block 70 to block the sliding rod 40, the sliding rod 40 may slide in the direction of the connecting opening 6031, resulting in the rotating plate 301 being unable to rotate downward.

[0044] The present application also discloses a glass wafer grinding process, which uses the above-mentioned grinding device and includes the following steps: S1: Fine engraving of glass wafers; S2: After fine carving, check the thickness and whether there are gaps and chipping on the side; S3: grinding using a grinding device; S4: Inspection after grinding, check the thickness and whether there are notches and chipping on the circumference; S5: polishing; S6: cleaning after polishing; S7: Laser coding: S8: cleaning; S9: Coding inspection, inspecting the coding angle length and character height, width and spacing; S10: Finished product packaging.

[0045] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A glass wafer grinding device, characterized in that: The invention comprises a machine body (1), a supporting plate (2) is rotatably provided on the machine body (1), a receiving groove (21) for placing a fixture plate (22) is provided on the supporting plate (2), a mounting plate (3) is also lifted and lowered on the machine body (1), a first motor (31) is provided in the mounting plate (3), a sleeve (4) is coaxially fixed on the output shaft of the first motor (31), a rotating rod (5) is sleeved in the sleeve (4), a plug-in block (51) is provided on the peripheral side of the rotating rod (5), a plug-in groove (41) is provided in the sleeve (4), and the plug-in block (51) is provided on the peripheral side of the rotating rod (5), a plug-in groove (41) is provided in the sleeve (4), and the plug-in block (51) is provided on the peripheral side of the rotating rod (5). ) is plugged into the plug-in slot (41), an adjusting spring (42) is arranged in the sleeve (4), the adjusting spring (42) is located on the upper side of the rotating rod (5), one end of the adjusting spring (42) is connected to the rotating rod (5), the other end of the adjusting spring (42) is connected to the inner wall of the sleeve (4), and a grinding wheel (52) is coaxially fixed to the lower end of the rotating rod (5); a plurality of placement grooves (221) for placing glass wafers are arranged in a circular array on the fixture disk (22), and the rotation trajectory of the edge of the grinding wheel (52) passes through the center of the fixture disk (22).

2. A glass wafer grinding device according to claim 1, characterized in that: A screw slide (12) is arranged on the machine body (1) in the vertical direction, and the mounting plate (3) is fixedly connected to the slide of the screw slide (12).

3. A glass wafer grinding device according to claim 1, characterized in that: A connecting shaft (6) is rotatably connected in the body (1), and the connecting shaft (6) is coaxially fixed with the supporting plate (2). A second motor (14) is installed in the body (1), and a first pulley (141) is coaxially fixed on the output shaft of the second motor (14). A second pulley (61) is coaxially fixed on the connecting shaft (6), and a first belt (611) is wound around the first pulley (141) and the second pulley (61); a connecting hole (62) is opened in the vertical direction in the connecting shaft (6), and the supporting plate (2) is located at the bottom wall opening of the accommodating groove (21). A plurality of adsorption holes (23) are provided, the connection hole (62) is connected to all the adsorption holes (23), the lower end of the connection shaft (6) is connected to a connection pipe (63) via a rotary joint, a vacuum pump (7) is provided in the machine body (1), the air suction port of the vacuum pump (7) is connected to the connection pipe (63), a third pulley (142) is coaxially fixed on the output shaft of the second motor (14), a fourth pulley (71) is coaxially fixed on the input shaft of the vacuum pump (7), and a second belt (72) is wound around the third pulley (142) and the fourth pulley (71).

4. A glass wafer grinding device according to claim 1, characterized in that: The machine body (1) is provided with a surrounding plate (11) on the surrounding side of the supporting plate (2), and the surrounding plate (11) is formed on the machine body (1) to form a liquid collecting tank (111), and the upper end of the supporting plate (2) is higher than the table top of the machine body (1); the machine body (1) is provided with a liquid leakage port (15) on the table top, and a liquid discharge pipe (8) connected to the liquid leakage port (15) is provided in the machine body (1), and a flared portion (81) is formed on the liquid discharge pipe (8), and the liquid discharge pipe (8) is rotatably connected to a rotating column (82) in the flared portion (81), and a plurality of collecting frames (83) are arranged in a circular array on the surrounding side of the rotating column (82), and a collecting net (84) is arranged on the collecting frame (83).

5. A glass wafer grinding device according to claim 3, characterized in that: The machine body (1) is provided with a liquid outlet pipe (13), the end of which is inclined downward, and the liquid outlet of the liquid outlet pipe (13) faces the fixture plate (22); a liquid inlet pipe (9) is provided inside the machine body (1), one end of the liquid inlet pipe (9) is connected to the liquid outlet pipe (13), and the other end of the liquid outlet pipe (13) is connected to the grinding liquid; a receiving chamber (91) is formed on the liquid inlet pipe (9), an opening and closing plate (92) for opening and closing the liquid inlet pipe (9) is slidably provided inside the receiving chamber (91), and a compression spring (93) is also provided inside the receiving chamber (91), one end of the compression spring (93) is connected to the opening and closing plate (92), and the other end of the compression spring (93) is connected to the inner wall of the receiving chamber (91).

6. A glass wafer grinding device according to claim 5, characterized in that: A plurality of active levers (64) are telescopically arranged on the circumference of the connecting shaft (6), and all of the active levers (64) are distributed in a circumferential array on the circumferential side of the connecting shaft (6). A first rotating shaft (10) and a second rotating shaft (20) are rotatably connected in the machine body (1). A first driven wheel (101) is coaxially fixed to the first rotating shaft (10), and a plurality of first driven levers (1011) are arranged in a circumferential array on the circumferential side of the first driven wheel (101). A second driven wheel (201) is coaxially fixed to the second rotating shaft (20), and a plurality of second driven levers (2011) are arranged in a circumferential array on the circumferential side of the second driven wheel (201). The second driven wheel (201) is located at the first driven wheel (101). The wheel (101) is located at a side away from the connecting shaft (6). When the connecting shaft (6) rotates, the active lever (64) can drive the corresponding first driven wheel (101) or the second driven wheel (201) to rotate through the first driven lever (1011) or the second driven lever (2011); the opening and closing plate (92) extends out of the accommodating chamber (91) to form a connecting plate (921), and the connecting plate (921) is provided with a first connecting rod (922) and a second connecting rod (923); the first driving wheel (102) is coaxially fixed to the first rotating shaft (10), the first connecting rod (922) is rotatably connected to the second driving wheel (9221), and the first driving wheel (102) is provided with a first connecting rod (923). an arc-shaped groove (1021), the center of curvature of the first arc-shaped groove (1021) is located at the center of the circle of the first driving wheel (102), the bottom wall of the first arc-shaped groove (1021) is in the shape of a wedge-shaped surface, a first driving rod (9222) is eccentrically arranged on the second driving wheel (9221), the first driving rod (9222) is slidably matched with the first arc-shaped groove (1021); a third driving wheel (202) is coaxially fixed on the second rotating shaft (20), a fourth driving wheel (9231) is rotatably connected to the second connecting rod (923), a second arc-shaped groove (2021) is opened on the third driving wheel (202), the center of curvature of the second arc-shaped groove (2 ... At the center of the third driving wheel (202), the bottom wall of the second arc-shaped groove (2021) is in a wedge-shaped surface shape; the fourth driving wheel (9231) is eccentrically provided with a second driving rod (9232); the second driving rod (9232) is slidably matched with the second arc-shaped groove (2021); the height difference between the higher end and the lower end of the second arc-shaped groove (2021) is greater than the height difference between the higher end and the lower end of the first arc-shaped groove (1021); and an avoidance opening (641) is formed on the active lever (64); when the active lever (64) is extended to match with the second driven lever (2011), the avoidance opening (641) enables the active lever (64) to avoid the first driven lever (1011).

7. A glass wafer grinding device according to claim 6, characterized in that: A plurality of sliding grooves (65) are provided on the peripheral side of the connecting shaft (6), and the active lever (64) slides in the corresponding sliding grooves (65). The connecting shaft (6) is provided with a return spring (66) in the sliding groove (65), one end of the return spring (66) is connected to the inner wall of the sliding groove (65), and the other end of the return spring (66) is connected to the active lever (64).

8. A glass wafer grinding process, using the glass wafer grinding device according to any one of claims 1 to 7, characterized in that: The method comprises the following steps: S1: Fine engraving of glass wafers; S2: After fine carving, check the thickness and whether there are gaps and chipping on the side; S3: grinding using a grinding device; S4: Inspection after grinding, check the thickness and whether there are notches and chipping on the circumference; S5: polishing; S6: cleaning after polishing; S7: Laser coding: S8: cleaning; S9: Coding inspection, inspecting the coding angle length and character height, width and spacing; S10: Finished product packaging.

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