Punching process of high-precision atomizer foam

Abstract

The invention relates to a high-precision atomizer foam punching technology which comprises the steps that a release film punching cutter line is obtained, a first milling cutter is used for conducting first-time punching on a raw material release film along the release film punching cutter line, waste removal is conducted, and a finished product release film obtained after punching is obtained; a foam adhesive, the finished release film and a foam bottom film are tightly attached together in sequence, an atomizer foam raw material is obtained, and the adhesive face of the foam adhesive faces the finished release film; a foam punching cutter line is obtained, a second milling cutter is used for punching the foam rubber for the second time along the foam punching cutter line, waste is removed, and finished foam is obtained. The high-precision atomizer foam punching device has the high-precision atomizer foam punching effect.

Description

Technical Field

[0001] The present application relates to the technical field of punching of atomizer foam, and in particular to a punching process of high-precision atomizer foam. Background Art

[0002] At present, atomizers are used more and more widely, and foam is one of the important components. The smaller the atomizer, the higher the requirement for the refinement of the foam.

[0003] As the requirements for foam refinement become increasingly higher, the existing punching and cutting process cannot solve the problems of difficulty in removing waste from high-precision atomizer foam and wire drawing and edge pulling, resulting in a very low yield rate for high-precision atomizer foam punching.

[0004] With respect to the above-mentioned related technologies, the inventors believe that there is a defect that the yield rate of high-precision atomizer foam punching is low. Summary of the invention

[0005] In order to improve the yield rate of high-precision atomizer foam, the present application provides a punching process for high-precision atomizer foam.

[0006] The above-mentioned invention objective of the present application is achieved through the following technical solutions: Obtaining a release film punching line, using a first milling cutter to perform a first punching cut on the raw release film along the release film punching line, and removing waste to obtain a punched finished release film; The foam glue, the finished release film and the foam base film are sequentially and tightly attached together to obtain an atomizer foam raw material, wherein the adhesive surface of the foam glue faces the finished release film; A foam punching cutter line is obtained, and the foam glue is punched for a second time along the foam punching cutter line using a second milling cutter, and waste is removed to obtain a finished foam.

[0007] By adopting the above technical scheme, the raw material release film is punched out along the set release film punching line by using the first milling cutter, and waste is removed, so that the release film holes corresponding to the required foam shape are left on the release film, and the finished release film is obtained, which is convenient for the subsequent waste removal of the punched foam, thereby reducing the difficulty of waste removal of the foam glue after the second punching; by closely attaching the foam glue, the finished release film and the foam base film together in sequence, a sheet-shaped atomizer foam raw material is obtained, which further reduces the subsequent waste treatment of the foam glue The difficulty of removing waste after the second punching is reduced; obtaining the foam punching knife line, using the second milling cutter to punch the foam glue for the second time along the foam punching knife line, and removing waste to obtain the finished foam, and punching the foam glue with the milling cutter, but not cutting the foam base film and the processed release film, so that the foam waste can be taken away when the foam base film is subsequently pulled away, further reducing the difficulty of removing waste after the second punching of the foam glue, reducing the probability of defects in the finished product caused by waste removal, thereby improving the yield rate of high-precision atomizer foam.

[0008] In a preferred example, the present application can be further configured as follows: The raw material release film includes a release film base film and a release film; The release film punching line is half-cut to the release film base film.

[0009] By adopting the above technical solution, when punching the raw release film with a milling cutter, the punching is performed along the punching line of the release film. At the same time, only the release film is punched without cutting the release film base film, so that the raw release film can be discarded after the first punching.

[0010] In a preferred example, the present application can be further configured as follows: The release film base film / foam base film is pulled away, and the release film waste / foam waste is taken away at the same time to obtain the finished release film / the finished foam.

[0011] By adopting the above technical solution, the method for removing waste after punching the raw release film and after punching the foam glue is to pull away the corresponding base film, thereby taking away the corresponding waste remaining on the base film to obtain the corresponding finished product, thereby simplifying the steps of removing waste from the raw release film / foam raw material.

[0012] In a preferred example, the present application can be further configured as follows: The finished release film has honeycomb-shaped release film holes after waste removal, and the edge line of the release film holes, that is, the release film hole line, coincides with the release film punching knife line.

[0013] By adopting the above technical scheme, after the raw release film is punched and removed, the release film is covered with release film holes, and the edge line of the release film holes, that is, the release film hole line, coincides with the release film punching knife line, and the release film punching knife line is the same as the shape of the required foam product, so as to facilitate the subsequent waste removal after punching the foam glue. When pulling down the foam bottom film, the foam glue is evenly stressed, thereby avoiding damage to the foam glue caused by uneven force, thereby improving the yield rate of high-precision atomizer foam.

[0014] In a preferred example, the present application can be further configured as follows: The foam waste is the area encircled by the foam punching knife lines where the ends are connected, and the edge of the foam waste is parallel to the release film hole line.

[0015] By adopting the above technical scheme, the foam punching knife lines are connected end to end to circle out the foam waste, so that the unnecessary part of the foam is completely separated from the foam body, and the edge of the foam waste is parallel to the hole line of the release film to facilitate the removal of the foam waste. When the foam bottom film is pulled down, the force on the foam glue is uniform, avoiding damage to the foam glue due to uneven force, and further improving the yield rate of high-precision atomizer foam.

[0016] In a preferred example, the present application can be further configured as follows: The foam punching knife line gives way to the release film hole line by 0.08 mm, and the foam waste is slightly smaller than the corresponding release film hole position.

[0017] By adopting the above technical solution, the foam punching knife line and the release film hole line are given way, and the foam punching knife line is set in the inner circle of the release film hole line, so that the foam waste is slightly smaller than the corresponding release film hole position, and the foam waste falls completely on the foam base film, so that when the foam waste is removed and the foam base film is pulled down, the foam waste can be taken away completely, avoiding damage to the foam caused by drawing and pulling the edges, thereby improving the yield rate of high-precision atomizer foam.

[0018] In a preferred example, the present application can be further configured as follows: The foam waste is adhered to the foam base film through the holes of the release film.

[0019] By adopting the above technical solution, the positions of the foam waste and the holes of the release film correspond to each other, so that the foam waste can pass through the holes of the release film and stick to the foam base film, so that when the foam base film is pulled down, the foam waste can be completely taken away to avoid damage to the foam caused by drawing and pulling, thereby further improving the yield rate of high-precision atomizer foam.

[0020] In a preferred example, the present application can be further configured as follows: The diameter of the second milling cutter is 0.1-0.2 mm.

[0021] By adopting the above technical solution, a milling cutter with a diameter of 0.1-0.2mm is customized, which is finer than the conventional milling cutter with a diameter of 0.3-0.5mm, so that the gap between the cutter and the die is more precise, thereby improving the accuracy of the atomizer foam.

[0022] In a preferred example, the present application can be further configured as follows: The hardness of the second milling cutter is 60°.

[0023] By adopting the above technical solution, a milling cutter with a higher hardness than the traditional 53° milling cutter is selected, so that the milling cutter is not easy to break during the punching process, which greatly reduces the loss of high-precision atomizer foam raw materials.

[0024] In a preferred example, the present application can be further configured as follows: The blade surface of the second milling cutter needs to be subjected to Teflon electroplating treatment.

[0025] By adopting the above technical solution, the blade surface of the second milling cutter is electroplated with Teflon, which reduces the risk of sticking of the membrane to the knife in the small gap of the foam, making the punching process smoother, thereby further improving the quality of the high-precision atomizer foam punching.

[0026] In summary, the present application includes at least one of the following beneficial technical effects: After the raw release film is punched and waste removed, the release film is covered with release film holes. The edge line of the release film hole, that is, the release film hole line, coincides with the release film punching knife line, and the release film punching knife line is the same as the shape of the required foam finished product, so as to facilitate the subsequent waste removal after punching the foam glue. When pulling down the foam base film, the foam glue is evenly stressed, thereby avoiding damage to the foam glue caused by uneven force. The foam punching knife lines are connected end to end to circle out the foam waste, so that the unnecessary part of the foam is completely separated from the foam body. The edge of the foam waste is parallel to the release film hole line, so that when pulling down the foam base film, the force on the foam glue is uniform, thereby avoiding damage to the foam glue, and the foam punching knife line is aligned with the release film hole line. The foam punching knife line is set at the inner circle of the release film hole line, so that the foam waste is slightly smaller than the corresponding release film hole position, so that the foam waste falls completely on the foam base film, so that when the foam waste is removed and the foam base film is pulled down, the foam waste can be completely taken away to avoid wire drawing and edge pulling. The position of the foam waste corresponds to the position of the release film hole position, so that the foam waste can pass through the release film hole position and stick to the foam base film, so that when the foam base film is pulled down, the foam waste can be completely taken away to avoid damage to the foam. The blade surface of the second milling cutter is electroplated with Teflon, which reduces the risk of sticking to the knife in the small gap of the foam gap, making the punching process smoother, thereby improving the yield rate of high-precision atomizer foam; When punching the raw release film with a milling cutter, punching is performed along the punching knife line of the release film, and at the same time, only the release film is punched without cutting the base film of the release film, so that the raw release film can be removed after the first punching. After the raw release film is punched and the foam adhesive is punched, the corresponding base film is pulled away, thereby taking away the corresponding waste material stuck on the base film to obtain the corresponding finished product, thereby simplifying the steps of removing the raw release film / foam raw material; 3. Customized milling cutters with a diameter of 0.1-0.2mm, which are more refined than conventional milling cutters with a diameter of 0.3-0.5mm, to make the gap between the cutter and the die more precise, thereby improving the precision of the atomizer foam; 4. A milling cutter with a hardness of 60°, which is higher than the traditional 53° milling cutter, is selected, so that the milling cutter is not easy to break during the punching process, which greatly reduces the loss of high-precision atomizer foam raw materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a flow chart of the punching process of high-precision atomizer foam in one embodiment of the present application.

[0028] Figure 2 It is a schematic diagram of the layers of the atomizer foam raw material in the punching process of the high-precision atomizer foam in one embodiment of the present application.

[0029] Figure 3It is a schematic diagram of the finished foam in the punching process of the high-precision atomizer foam in one embodiment of the present application.

[0030] Figure 4 It is a schematic diagram of the layers of the raw material release film in the punching process of the high-precision atomizer foam in one embodiment of the present application.

[0031] Figure 5 It is a schematic diagram of the second punching in the punching process of the high-precision atomizer foam in one embodiment of the present application.

[0032] Figure 6 It is a partial enlarged view of the second punching in the punching process of the high-precision atomizer foam in one embodiment of the present application.

[0033] Among them, 1. Atomizer foam raw materials; 11. Foam glue; 12. Finished product release film; 13. Foam bottom film; 2. Finished foam; 3. Raw material release film; 31. Release film; 32. Release film bottom film; 4. Foam waste; 5. Release film punching line; 6. Foam punching line DETAILED DESCRIPTION

[0034] The present application is further described in detail below with reference to the accompanying drawings.

[0035] In one embodiment, if Figure 1-6 As shown, the present application discloses a high-precision atomizer foam punching process, which specifically includes the following steps: S10: Obtain the release film punching line 5, use a first milling cutter to perform a first punching cut on the raw release film 3 along the release film punching line 5, and remove waste to obtain a punched finished release film 12.

[0036] Specifically, a release film punching line 5 is drawn according to the shape of the final foam product to be obtained, and a first milling cutter is used to punch the raw release film 3 along the drawn release film punching line 5. After punching, waste treatment is performed to remove unnecessary excess release film 31 to obtain a finished release film 12.

[0037] S20: The foam adhesive 11 , the finished release film 12 and the foam base film 13 are sequentially and tightly attached together to obtain the atomizer foam raw material 1 , wherein the adhesive surface of the foam adhesive 11 faces the finished release film 12 .

[0038] In this embodiment, the foam adhesive 11 refers to foam with double-sided adhesive on one side.

[0039] Specifically, the foam glue 11, the finished release film 12 and the foam base film 13 are pasted together in order to form a sheet of atomizer foam raw material 1, wherein the adhesive side of the foam glue 11 is facing the direction of the finished release film 12, so that the foam glue 11 can pass through the holes of the release film and stick to the foam base film 13.

[0040] S30: Obtain the foam punching line 6, use a second milling cutter to perform a second punching on the foam glue 11 along the foam punching line 6, and remove waste to obtain a finished foam 2.

[0041] Specifically, a foam punching line 6 is drawn according to the required foam shape, and a second milling cutter is used for punching. During punching, only the foam glue 11 is cut without cutting the foam base film 13. After the punching is completed, waste removal is performed to obtain a finished foam 2.

[0042] In one embodiment, the first punching specifically includes: The raw material release film 3 includes a release film base film 32 and a release film 31; The release film punching line 5 is half-cut to the release film base film 32 .

[0043] Specifically, the raw release film 3 includes a release film base film 32 and a release film 31 . When punching the raw release film 3 , only the release film 31 is punched and cut, and the release film base film 32 is not cut, so as to facilitate the subsequent removal of waste release film.

[0044] In one embodiment, removing waste specifically includes: The release film base film 32 / foam base film 13 is pulled away, and the release film waste / foam waste 4 is taken away at the same time, to obtain a finished release film 12 / finished foam 2.

[0045] Specifically, when the release film 31 is removed, the release film base film 32 is pulled away, and the waste release film adhered thereto is taken away at the same time, so as to obtain a finished release film 12; When the foam waste is removed, the foam base film 13 is pulled away, and the foam waste 4 adhering thereto is taken away at the same time, so that the finished foam 2 is obtained.

[0046] In one embodiment, the finished release film 12 specifically includes: The finished release film 12 has honeycomb-shaped release film holes after the waste is removed, and the edge line of the release film holes, that is, the hole line of the release film 31, coincides with the release film punching knife line 5.

[0047] Specifically, after waste removal, the finished release film 12 has honeycomb-shaped release film holes, and the edges of the holes, that is, the release film punching line 5 during punching, are consistent in shape with the required foam shape, so that when the foam bottom film 13 is pulled down during subsequent waste removal, the foam is evenly stressed to prevent damage to the foam.

[0048] In one embodiment, the foam waste 4 specifically includes: The foam waste 4 is the area enclosed by the foam punching knife lines 6 , and the edge of the foam waste 4 is parallel to the hole line of the release film 31 .

[0049] Specifically, the foam waste 4, that is, the remaining waste separated from the required foam shape after the foam glue 11 is punched along the foam punching knife line 6, has an edge shape parallel to the hole line of the release film 31, so that when the foam bottom film 13 is pulled down during subsequent waste removal, the foam is evenly stressed to prevent damage to the foam.

[0050] In one embodiment, the foam punching line 6 specifically includes: The foam punching knife line 6 gives way to the hole line of the release film 31 by 0.08 mm, and the foam waste 4 is slightly smaller than the corresponding hole position of the release film.

[0051] Specifically, the foam punching knife line 6 gives way to the hole line of the release film 31 by 0.08 mm, and the foam waste 4 is slightly smaller than the corresponding hole position of the release film, so that the foam waste 4 can pass through the hole position of the release film and stick to the foam base film 13 completely. It is not easy to pull the edges when removing the waste, thereby reducing the risk of foam damage.

[0052] In one embodiment, the foam waste 4 specifically includes: The foam waste 4 is adhered to the foam base film 13 through the holes of the release film.

[0053] Specifically, the waste foam material 4 passes through the holes of the release film and is completely adhered to the foam base film 13 , so that in the subsequent waste removal step, when the foam base film 13 is pulled down, the waste foam material 4 can be completely removed.

[0054] In one embodiment, the second milling cutter specifically comprises: The diameter of the second milling cutter is 0.1-0.2 mm.

[0055] Specifically, since the mold gap of the high-precision atomizer foam is very small, such as 0.55mm, in order to meet the process requirements, the diameter of the milling cutter for custom-cutting the foam is 0.1-0.2mm.

[0056] In one embodiment, the second milling cutter further comprises: The hardness of the second milling cutter is 60°.

[0057] Specifically, the hardness of a conventional milling cutter is 53°, and it is easy to break when punching foam, causing the entire foam to be scrapped. Therefore, the hardness of a custom milling cutter for punching foam is 60°.

[0058] In one embodiment, the second milling cutter further comprises: The surface of the second milling cutter needs to be treated with Teflon electroplating.

[0059] Specifically, since the gaps between the finished foam 2 are very small, the common milling cutter is prone to sticking to the cutter after punching. Therefore, a milling cutter with a Teflon electroplated blade is used to punch the foam, thereby effectively improving the yield rate.

[0060] It should be understood that the size of the serial numbers of the steps in the above embodiments does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0061] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional units and modules is used as an example. In actual applications, the above-mentioned functions can be distributed and completed by different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above.

[0062] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A punching process for high-precision atomizer foam, characterized in that: The punching process of the high-precision atomizer foam includes: Obtaining a release film punching line (5), using a first milling cutter to perform a first punching cut on the raw release film (3) along the release film punching line (5), and removing waste, thereby obtaining a punched finished release film (12); The foam glue (11), the finished release film (12) and the foam base film (13) are sequentially and tightly bonded together to obtain an atomizer foam raw material (1), wherein the adhesive surface of the foam glue (11) faces the finished release film (12); A foam punching line (6) is obtained, and a second milling cutter is used to punch the foam glue (11) for a second time along the foam punching line (6), and waste is removed to obtain a finished foam (2).

2. The punching process of the high-precision atomizer foam according to claim 1, characterized in that: The first punching specifically includes: the raw material release film (3) includes a release film base film (32) and a release film (31), and the release film punching line (5) is half-cut to the release film base film (32).

3. The punching process of the high-precision atomizer foam according to claim 2, characterized in that: The waste removal specifically includes: pulling away the release film base film (32) / foam base film (13), and at the same time taking away the release film waste / foam waste (4), to obtain the finished release film (12) / the finished foam (2).

4. The punching process of the high-precision atomizer foam according to claim 3, characterized in that: The finished release film (12) has honeycomb-shaped release film holes after waste removal, and the edge line of the release film holes, i.e., the release film hole line, coincides with the release film punching knife line (5).

5. The punching process of the high-precision atomizer foam according to claim 4, characterized in that: The foam waste (4) is the area encircled by the foam punching knife line (6) where the ends are connected, and the edge of the foam waste (4) is parallel to the release film hole line.

6. The punching process of the high-precision atomizer foam according to claim 4, characterized in that: The foam punching knife line (6) gives way to the release film hole line by 0.08 mm, and the foam waste (4) is slightly smaller than the corresponding release film hole position.

7. The punching process of the high-precision atomizer foam according to claim 4, characterized in that: The foam waste (4) is adhered to the foam base film (13) through the holes in the release film.

8. The punching process of high-precision atomizer foam according to claim 1, characterized in that: The diameter of the second milling cutter is 0.1-0.2 mm.

9. The punching process of high-precision atomizer foam according to claim 1, characterized in that: The hardness of the second milling cutter is 60°.

10. The punching process of high-precision atomizer foam according to claim 1, characterized in that: The blade surface of the second milling cutter needs to be subjected to Teflon electroplating treatment.

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