Semiconductor process equipment and electrode introduction device thereof

Abstract

The invention provides semiconductor process equipment and an electrode introducing device thereof, the electrode introducing device is applied to the semiconductor process equipment, the electrode introducing device comprises a second supporting assembly and an electrode introducing assembly, the second supporting assembly is used for being fixed between two adjacent processing stations in the semiconductor process equipment, and the processing stations are used for placing crystal boats; the electrode leading-in assembly is arranged on the second supporting assembly and is provided with two electric contact parts, and the two electric contact parts are used for being in electric contact with boat feet of the two crystal boats respectively; the electrode introduction assembly is used for loading radio frequency power provided by the radio frequency power supply to the two crystal boats through the two electric contact parts. The second supporting assembly introduces radio frequency to the wafer boat from the middle of the cavity body and supports the wafer feet of the wafer boat, so that the length of the electrode introduction assembly is shortened, the structure of the electrode introduction assembly is simplified, the deformation quantity of the electrode introduction assembly at high temperature is reduced, the electric contact part is in full contact with the wafer feet of the wafer boat, radio frequency discharge abnormity is avoided, and the service life of the wafer boat is prolonged. And thus, the product yield and the productivity are improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing, and in particular, to a semiconductor process equipment and an electrode introduction device thereof. Background Art

[0002] In the manufacturing process of solar cells, silicon wafers are often used as the main body of the cell to prepare various film layers, and the coating process is carried out in a high-temperature vacuum environment.

[0003] With the increase in production capacity, solar cell coating equipment tends to develop in the direction of larger sizes, and various processes and equipment are aimed at large production capacity. Silicon wafer cells are placed on graphite boats for batch operation during the coating process of tubular PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment, and the coating process is completed by connecting the graphite boat to the RF power supply. Due to the processing limitations of large-sized graphite boats, the current mainstream tubular equipment uses two graphite boats. During the process, the RF power supply needs to be connected to the two graphite boats at the same time, and the tubular PECVD equipment needs to be set up with an electrode structure to introduce the RF power supply to the two graphite boats.

[0004] The existing tubular PECVD equipment uses two sets of electrode structures to introduce radio frequency from the furnace door or furnace tail respectively, and contact the boat feet at both ends of the graphite boat, so as to introduce radio frequency into the graphite boat. In order to introduce radio frequency, the electrode structure needs to be set to a longer length, and the electrode structure also needs to be designed to be more complex. Because the introduction path of the electrode structure is too long, it is not easy to eliminate the deformation of the electrode structure caused by high temperature at a process temperature above 500°C, resulting in poor process caused by abnormal radio frequency discharge, reducing product yield and affecting production capacity.

[0005] Therefore, how to improve product yield and increase production capacity is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0006] The present application aims to solve at least one of the technical problems existing in the prior art, and proposes a semiconductor process equipment and an electrode introduction device thereof. The electrode introduction device introduces radio frequency from the middle of the semiconductor process equipment, shortens the introduction path, reduces deformation caused by high temperature, and thereby improves product yield and production capacity.

[0007] To achieve the purpose of the present application, an electrode introduction device is provided, which is applied to semiconductor process equipment, and includes a second support component and an electrode introduction component, wherein the second support component is used to be fixed between two adjacent processing stations in the semiconductor process equipment, and the processing station is used to place a wafer boat;

[0008] The electrode introduction assembly is arranged on the second supporting assembly, and the electrode introduction assembly has two electrical contact parts, and the two electrical contact parts are respectively used to electrically contact with the boat feet of the two wafer boats; the electrode introduction assembly is used to be electrically connected to the RF power supply, and the RF power provided by the RF power supply is loaded to the two wafer boats through the two electrical contact parts.

[0009] In some embodiments, the second supporting assembly includes an annular fixing portion and a supporting portion, the fixing portion being used to be fixedly connected to the chamber body of the semiconductor process equipment, and the supporting portion being fixedly connected to the fixing portion to support the wafer boat.

[0010] In some embodiments, the number of the support parts is two, the number of the electrode introduction components is also two, and each of the electrode introduction components includes two electrical contact parts and a connection structure;

[0011] The two electrode introduction components are respectively arranged close to the two supporting parts, and the two electrical contact parts of the electrode introduction components are respectively located at the two ends of the corresponding supporting parts. The connecting structure is connected to the two electrical contact parts and is used to electrically connect the electrical contact parts with the RF power supply.

[0012] In some embodiments, the connection structure includes an electrode connector, a cable connector and an introduction rod, the two ends of the electrode connector are respectively connected to the electrical contact parts at the two ends of the support part, one end of the introduction rod is connected to the middle part of the electrode connector, the fixing part has a through hole penetrating in the radial direction, the introduction rod passes through the through hole and the chamber body and extends to the outside of the chamber body, the cable connector is connected to one end of the introduction rod away from the electrode connector, and is used to connect the RF power supply.

[0013] In some embodiments, a protective tube is fixedly connected to the through hole of the fixed part, and the connection structure also includes an insulating sleeve, which is sleeved on the outer periphery of the introduction rod, and the protective tube is sleeved on the outer periphery of the insulating sleeve, and the insulating sleeve is used for insulation between the introduction rod and the fixed part.

[0014] In some embodiments, the connection structure also includes a sealing assembly, which is sleeved on the outer periphery of the introduction rod and connected to the end of the protective tube away from the through hole, and is used to cooperate and seal with the end face of the insulating sleeve and the outer periphery of the introduction rod.

[0015] In some embodiments, the sealing assembly includes a connecting sleeve, a pressing piece, a sealing block and a sealing ring, the sealing ring includes a first sealing ring and a second sealing ring, the connecting sleeve is sleeved on the end of the protective tube away from the through hole and is sealed and connected to the protective tube, the connecting sleeve has a sealing cavity inside, the insulating sleeve has a sealing protrusion on the end away from the through hole, the first sealing ring is located between the sealing protrusion and the side wall of the sealing cavity close to the through hole, the sealing block is located on the side of the sealing protrusion away from the through hole, and is sleeved on the outer periphery of the introduction rod, the side of the sealing block close to the sealing protrusion has a sealing groove arranged close to and around the introduction rod, the second sealing ring is arranged in the sealing groove, the pressing piece is located on the side of the sealing block away from the sealing protrusion, and the pressing piece cooperates with the connecting sleeve to compress the sealing block and the sealing protrusion.

[0016] In some embodiments, the electrode connector includes an electrode connecting rod and a connecting portion, wherein the two ends of the electrode connecting rod are respectively connected to the electrical contact portions located at the two ends of the supporting portion, and the connecting portion is located in the middle of the electrode connecting rod and is used to electrically connect the electrode connecting rod and the introduction rod.

[0017] In some embodiments, the connection structure further includes an insulating protective sleeve, which is disposed on the outer periphery of the electrode connecting rod to protect the electrode connecting rod.

[0018] In some embodiments, the fixing portion has cooling cavities distributed along the circumferential direction, and the fixing portion is also provided with a cooling liquid pipe for connecting the cooling cavity with the cooling system.

[0019] In some embodiments, the end surface of the fixing portion has a cooling groove arranged along its circumference, and a sealing ring is provided at the notch of the cooling groove, and the cooling cavity is formed between the sealing ring and the cooling groove.

[0020] In some embodiments, the cooling grooves are provided on both side end surfaces of the fixed portion, the interiors of the two cooling grooves are connected, the cooling liquid pipe includes an inlet pipe and an outlet pipe, the inlet pipe is connected to one of the cooling grooves, and the outlet pipe is connected to the other cooling groove.

[0021] The present application also provides a semiconductor process equipment, comprising a chamber body, two first support assemblies and any one of the above-mentioned electrode introduction devices, wherein the two first support assemblies are respectively arranged at the head and tail ends of the chamber body, and each of the first support assemblies and the electrode introduction device jointly support the wafer boat between the two;

[0022] The first support assembly includes a fixed flange and a support rod. The fixed flanges of the two first support assemblies are fixedly connected to the head and tail ends of the chamber body respectively. The support rod extends into the interior of the chamber body to support the wafer boat.

[0023] This application has the following beneficial effects:

[0024] The electrode introduction device provided in the present application is applied to semiconductor process equipment, including a second support component and an electrode introduction component, the second support component is used to be fixed between two adjacent processing stations in the semiconductor process equipment, and the processing station is used to place a wafer boat; the electrode introduction component is arranged on the second support component, and the electrode introduction component has two electrical contact parts, and the two electrical contact parts are respectively used to electrically contact the boat feet of the two wafer boats; the electrode introduction component is used to be electrically connected to a radio frequency power supply, and the radio frequency power provided by the radio frequency power supply is loaded to the two wafer boats through the two electrical contact parts.

[0025] The second support assembly is used to introduce radio frequency into the wafer boat from the middle of the chamber body and to support the wafer boat's crystal pins. The boat pins between the wafer boats do not need to introduce radio frequency power from both ends of the chamber body, thus shortening the length of the electrode introduction assembly, simplifying its structure, and reducing its deformation at high temperatures, so that the electrical contact part is in full contact with the boat pins of the wafer boat, avoiding abnormal radio frequency discharge, and thus improving product yield and production capacity.

[0026] The present application also provides a semiconductor process including the above-mentioned electrode introduction device, and has the above-mentioned advantages. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the structure inside a semiconductor process equipment provided for a specific implementation of the present application;

[0028] Figure 2 for Figure 1 A schematic structural diagram of the second supporting assembly;

[0029] Figure 3 for Figure 1 A top view of the second support assembly;

[0030] Figure 4 for Figure 1 A partial enlarged view of the second support assembly;

[0031] Figure 5 for Figure 1 A partial cross-sectional view of the second support assembly.

[0032] in, Figures 1 to 5 The reference numerals in the drawings are:

[0033] Fixed flange 100, second support assembly 200, intermediate flange 210, cooling groove 211, sealing ring 212, coolant pipe 213, clamping seat 214, ceramic protective seat 215, electrical contact part 220, electrode connector 230, electrode connecting rod 231, connecting piece 232, insulating protective sleeve 233, introduction rod 240, protective steel pipe 241, insulating sleeve 242, sealing protrusion 243, cable connector 250, sealing assembly 260, connecting sleeve 261, sealing block 262, first sealing ring 263, second sealing ring 264, threaded sleeve 265, insulating tube 266, ceramic support tube 270, support rod 300, and crystal boat 400. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the technical solution of the present application, the semiconductor process equipment provided by the present application is described in detail below in conjunction with the accompanying drawings.

[0035] The electrode introduction device provided in this application is applied to semiconductor process equipment. Figure 1 and Figure 2 As shown, the electrode introduction device includes a second support component and an electrode introduction component. The second support component is fixed in the semiconductor process equipment. The semiconductor process equipment includes at least two processing stations, the processing station is used to place the wafer boat, and the second support component is fixed between two adjacent processing stations.

[0036] The electrode introduction assembly is disposed on the second support assembly 200, and the electrode introduction assembly has two electrical contacts 220. When the second support assembly 200 and the two first support assemblies jointly support the two wafer boats 400, the two electrical contacts 220 are respectively in electrical contact with the boat feet of the two wafer boats 400. The electrode introduction assembly is used to load the RF power provided by the RF power supply to the two wafer boats 400 respectively through the two electrical contacts 220. The RF power supply is usually located outside the chamber body, and the electrode introduction assembly is electrically connected to the RF power supply through the side wall of the chamber body. The two electrode introduction assemblies cooperate to load the RF power to the two ends of the wafer boat 400 respectively. The electrode introduction assembly introduces the RF power into the two wafer boats from the middle of the chamber body, and the length required for the electrode introduction assembly is shorter, so the deformation of the electrode introduction assembly is also smaller at high temperatures.

[0037] The two ends of the wafer boat 400 are usually provided with two boat feet, and the second support assembly 200 can support the two boat feet. In addition, the second support assembly 200 can be provided with two electrode introduction assemblies, and the electrode introduction assemblies load the radio frequency power to the two boat feet respectively. The polarities of the radio frequency loaded by the two electrode introduction assemblies are opposite, and the polarities of the radio frequency loaded by the two electrical contacts 220 in the same electrode introduction assembly are the same.

[0038] In the prior art, the length of the electrode structure is relatively long, and the deformation of the electrode structure is relatively large under high temperature, which affects the reliability of the contact between the electrode structure and the boat foot of the crystal boat, and is likely to cause abnormal RF discharge, thereby causing poor process, reducing product yield, and affecting production capacity. In this embodiment, a second support assembly 200 is provided in the chamber body, and the second support assembly 200 is located between two adjacent processing stations, and is used to support the crystal boat 400 on the two processing stations together with the first support assembly. The second support group 200 is also provided with an electrode introduction assembly, and the RF power provided by the RF power supply is loaded to the two crystal boats 400 respectively through two electrical contact parts 220. The electrode introduction assembly introduces the RF power from the middle of the chamber body into the boat foot of the crystal boat 400, thereby shortening the length of the electrode introduction assembly, reducing its deformation in a high temperature environment, and reducing the risk of poor contact between the electrical contact part 220 and the boat foot, thereby improving product yield and production capacity.

[0039] In some embodiments, the second support assembly 200 includes a fixing portion and a supporting portion. Figure 1 As shown, the fixing portion may be an intermediate flange 210, which is annular and coaxially arranged with the chamber body, and the outer edge of the intermediate flange 210 may be fixedly connected to the inner wall of the chamber body. The supporting portion is a ceramic support tube 270, which is arranged in the annular hole of the intermediate flange 210 and fixedly connected to the intermediate flange 210. The ceramic support tube 270 is arranged along the axial direction of the chamber body, and the two ends of the ceramic support tube 270 respectively support the boat feet of the wafer boat 400 on both sides of the intermediate flange 210, thereby supporting the wafer boat 400 together with the first support assembly. Of course, the fixing portion may also adopt other shapes, such as arc shape, etc., as long as the fixing portion and the chamber body are fixedly and sealed.

[0040] Optionally, the number of the ceramic support tubes 270 is two. Figure 2 and Figure 3 As shown, two ceramic support tubes 270 can be arranged near the lower part of the middle flange 210, and the heights of the two ceramic support tubes 270 are the same. When the ceramic support tubes 270 support the wafer boat 400, the wafer boat 400 can be kept horizontal. The middle flange 210 can be made of materials such as stainless steel. Of course, the fixing part and the support part can also be made of other materials, and the support part can also be in other shapes, such as a rod shape, etc., which are not limited here.

[0041] Optionally, the inner side wall of the middle flange 210 may be provided with a clamping seat 214, and the ceramic support tube 270 is fixedly connected to the middle flange 210 via the clamping seat 214. Figure 4As shown, the clamping seat 214 is tubular and includes an upper jacket and a lower jacket. The cross section of the ceramic support tube 270 is circular, and the shape of the clamping seat 214 is adapted to the ceramic support tube 270. The cross sections of the upper jacket and the lower jacket are both semicircular, and the upper jacket and the lower jacket cooperate to clamp and fix the middle part of the rod-shaped ceramic support tube 270. The lower jacket can be fixedly connected to the middle flange 210 by bolts, and the upper jacket and the lower jacket are connected by bolts. Of course, the ceramic support tube 270 can be fixedly connected to the middle flange 210 by other methods, and the ceramic support tube 270 and the clamping seat 214 can also be of other shapes, which are not limited here.

[0042] Optionally, the electrode introduction assembly includes a connecting structure and two electrical contact portions 220, and the number of electrode introduction assemblies is also two, and the two electrode introduction assemblies are respectively arranged near two ceramic support tubes 270. The two electrical contact portions 220 of the electrode introduction assembly are respectively sleeved on both ends of the ceramic support tube 270 corresponding to the electrode introduction assembly. The connecting structure can adopt a T-shaped structure, which has three connecting ends, two of which are connected to the two electrical contact portions 220, and the other connecting end passes through the chamber body and is electrically connected to the RF power supply. When the ceramic support tube 270 supports the boat feet of the two crystal boats 400, the two electrical contact portions 220 are respectively in contact with the two boat feet, and the RF power provided by the RF power supply is loaded to the boat feet through the connecting structure and the electrical contact portions 220.

[0043] Optionally, the outer side wall of the electrical contact portion 220 has a support plane, and when the wafer boat 400 is dropped and placed on the ceramic support tube 270, the support plane fits with the boat foot, the RF power is introduced from the boat foot, and the stability of the support for the wafer boat 400 is improved. In addition, the electrical contact portion 220 can be rotatably connected to the ceramic support tube 270. When placing the wafer boat 400, the electrical contact portion 220 can be rotated to a certain angle to adapt to the placement angle of the boat foot, further improving the stability of the support for the wafer boat 400, making the electrical contact portion 220 better in contact with the boat foot, and reducing the occurrence of abnormal RF discharge.

[0044] In some embodiments, Figure 4 As shown, the connection structure includes an electrode connector 230, a cable connector 250 and an introduction rod 240, all of which are made of conductive materials. The intermediate flange 210 and the chamber body have through holes that penetrate in the radial direction, and the positions of the through holes of the two correspond. The electrode connector 230 is arranged close to the ceramic support tube 270, and the two ends of the electrode connector 230 are respectively connected to the electrical contact parts 220 at the two ends of the ceramic support tube 270. The introduction rod 240 is inserted into the through holes of the intermediate flange 210 and the chamber body, one end of the introduction rod 240 is connected to the middle part of the electrode connector 230, and the introduction rod 240 extends through the through hole to the outside of the chamber body, and the cable connector 250 is connected to the end of the introduction rod 240 away from the electrode connector 230 for connecting the RF power supply.

[0045] Optionally, the electrode connector 230 includes an electrode connecting rod 231 and a connecting portion. Figure 5 As shown, the electrical contact part 220 has a connection hole parallel to the axial direction of the chamber body, and the electrode connecting rod 231 is plugged and fixedly connected to the electrical contact part 220 through the connection hole. Specifically, the connection hole and the motor connecting rod can be fixedly connected by threads, and of course, the two can also be connected by interference fit or welding, which is not limited here.

[0046] The connection portion is located in the middle of the electrode connecting rod 231. Exemplarily, the connection portion may be an L-shaped connection piece 232, and the connection piece 232 includes a first side wall and a second side wall. Among them, the first side wall extends radially along the middle flange 210, and one end of the first side wall away from the second side wall is fixedly connected to the middle of the electrode connecting rod 231, and the second side wall is perpendicular to the first side wall. The second side wall of the connection piece 232 has a lead-out hole that penetrates in the radial direction, and the introduction rod 240 passes through the introduction hole and cooperates with the fixing nut, so as to be fixedly connected to the connection piece 232. The connection portion may also adopt other structures, such as U-shaped, etc., which are not limited here.

[0047] Optionally, the connection structure further includes an insulating protective sleeve 233, which is disposed on the outer periphery of the electrode connecting rod 231 to protect the electrode connecting rod 231. Figure 5 As shown, the insulating protective sleeve 233 is located between the two electrical contact parts 220, and the two ends of the insulating protective sleeve 233 can respectively abut against the two electrical contact parts 220, thereby protecting the electrode connecting rod 231. The connecting piece 232 can pass through the middle of the insulating protective sleeve 233. The insulating protective sleeve 233 can adopt a splicing structure, and the two insulating protective sleeves 233 are respectively sleeved on the outer periphery of the electrode connecting rod 231 from the two ends of the electrode connecting rod 231. The ends of the two insulating protective sleeves 233 are reserved with a clearance groove for the connecting piece 232 to make way. When the ends of the two insulating protective sleeves 233 are fitted, the two clearance grooves are spliced ​​to form a clearance hole, and the connecting piece 232 passes through the clearance hole for connecting with the introduction rod 240. The insulating protective sleeve 233 can be made of high-temperature resistant insulating materials such as ceramics. The insulating protective sleeve 233 can play the role of insulating and protecting the electrode connecting rod 231, preventing the electrode connecting rod 231 from directly contacting the process gas in the chamber body, and extending the service life of the electrode connecting rod 231. Of course, the user may also use other structures to protect the electrode connecting rod 231, which is not limited here.

[0048] Optionally, the inner side wall of the middle flange 210 is also provided with a ceramic baffle, which is located on both sides of the connecting piece 232 and is perpendicular to the axial direction of the chamber body, and is used to protect the connection part between the connecting piece 232 and the introduction rod 240. Specifically, a ceramic protective seat 215 is provided on the inner side of the middle flange 210, and a protective groove is provided in the ceramic protective seat 215. The side wall of the protective groove forms a ceramic baffle, and the connecting piece 232 can be inserted into the protective groove. The ceramic protective seat 215 can be fixedly connected to the middle flange 210 by bolts, and a through hole is provided at the bottom of the protective groove, which can correspond to the position of the through hole of the middle flange 210 and the chamber body. The introduction rod 240 passes through the through hole at the bottom of the protective groove and is fixedly connected to the connecting piece 232 in the protective groove. The ceramic protective seat 215 can protect the connection part between the connecting piece 232 and the introduction rod 240. When the connecting plate 232 and the introduction rod 240 are connected by the fixing nut, the bolt preload of the fixing nut can make the ceramic protective seat 215 and the insulating protective sleeve 233 fit together, and a frame structure is formed between the ceramic baffle and the insulating protective sleeve 233, which can improve the connection strength between the electrode connector 230 and the intermediate flange 210 and reduce the risk of damage between the two.

[0049] Optionally, a protective tube is fixedly connected to the through hole of the middle flange 210, and the protective tube is sleeved on the outer periphery of the introduction rod 240 to protect the introduction rod 240. In a specific embodiment of the present application, the protective tube is a protective steel tube 241, which is inserted into the through hole of the middle flange 210 and extends to the outside of the chamber body through the through hole of the chamber body. The protective steel tube 241 can be welded and fixed to the middle flange 210. The connection structure also includes an insulating sleeve 242, such as Figure 5 As shown, the insulating sleeve 242 is sleeved between the introduction rod 240 and the protective steel pipe 241, and the insulating sleeve 242 blocks the introduction rod 240 from contacting the protective steel pipe 241, thereby achieving insulation between the introduction rod 240 and the protective steel pipe 241. In addition, the insulating sleeve 242 can also be inserted into the through hole of the ceramic protective seat 215 to block the contact between the introduction rod 240 and the intermediate flange 210. The insulating sleeve 242 can be made of ceramic material, which can withstand high temperatures. The protective steel pipe 241 and the insulating sleeve 242 can protect the introduction rod 240, and the protective steel pipe 241 has sufficient strength to withstand a large bending moment. The insulating sleeve 242 can not only play an insulating role between the introduction rod 240 and the protective steel pipe 241, but also can further improve the strength of the connection structure to prevent the introduction rod 240 from being damaged due to the bending moment.

[0050] Optionally, the outer edge of the middle flange 210 can be sealed with the inner wall of the chamber body to prevent the process gas in the chamber body from leaking out of the chamber body through the through hole. The protective steel pipe 241 is welded and fixed to the through hole of the middle flange 210, and is sealed to prevent the process gas from leaking between the through hole of the middle flange 210 and the protective steel pipe 241.

[0051] Optionally, the connection structure further includes a sealing component 260, which is sleeved on the outer circumference of the introduction rod 240 and connected to the end of the protective steel pipe 241 away from the through hole. The sealing component 260 cooperates with the end surface of the insulating sleeve 242 and the outer circumference of the introduction rod 240 to seal, thereby achieving sealing between the insulating sleeve 242 and the protective steel pipe 241 and between the introduction rod 240 and the insulating sleeve 242, and preventing the process gas from leaking to the outside of the chamber body along the connection structure.

[0052] Optionally, the sealing assembly 260 includes a connecting sleeve 261, a pressing member, a sealing block 262 and a sealing ring. Figure 5 As shown, the connecting sleeve 261 is sleeved on the end of the protective steel pipe 241 away from the through hole, and the connecting sleeve 261 can be sealed and connected to the protective steel pipe 241 by means of threaded connection or welding. The connecting sleeve 261 has a sealing cavity inside, and the end of the insulating sleeve 242 away from the through hole has a sealing protrusion 243 extending radially. The end of the insulating sleeve 242 away from the through hole is inserted into the sealing cavity of the connecting sleeve 261, and the side wall of the sealing cavity close to the through hole forms a sealing surface for cooperating with the sealing protrusion 243. The sealing ring includes a first sealing ring 263 and a second sealing ring 264. The first sealing ring 263 is located between the sealing protrusion 243 and the sealing surface. The sealing protrusion 243 and the sealing surface cooperate to press the first sealing ring 263 to achieve the sealing between the connecting sleeve 261 and the insulating sleeve 242, that is, the sealing between the protective steel pipe 241 and the insulating sleeve 242. The sealing block 262 can be annular and is located in the sealing cavity. As shown Figure 5 As shown, the sealing block 262 is located on the side of the sealing protrusion 243 away from the through hole, and is sleeved on the outer periphery of the introduction rod 240. The sealing block 262 can fit with the sealing protrusion 243. The side of the sealing block 262 close to the sealing protrusion 243 has a sealing groove, which is arranged along the edge of the inner hole of the sealing block 262 and surrounds the inner hole. The second sealing ring 264 is arranged in the sealing groove, and the sealing block 262 fits with the sealing protrusion 243 to press the second sealing ring 264. After the second sealing ring 264 is elastically deformed, it fits with the sealing protrusion 243, the sealing block 262 and the introduction rod 240, thereby achieving the sealing between the insulating sleeve 242 and the introduction rod 240. The pressing member is located on the side of the sealing block 262 away from the sealing protrusion 243. The pressing member cooperates with the connecting sleeve 261 to apply a thrust to the sealing block 262 toward the sealing protrusion 243, thereby pressing the sealing block 262 and the sealing protrusion 243. Of course, the sealing assembly 260 may also adopt other sealing structures, such as a packing seal, etc., which is not limited here.

[0053] Optionally, the pressing member may be a threaded pressing sleeve 265, which is sleeved on the outer circumference of the introduction rod 240. One end of the threaded pressing sleeve 265 penetrates into the sealing cavity and is threadedly matched with the connecting sleeve 261. Rotating the threaded pressing sleeve 265 can increase the length of the threaded pressing sleeve 265 that penetrates into the sealing cavity, thereby pressing the sealing block 262 and the sealing protrusion 243, and pressing the sealing protrusion 243 and the sealing surface, thereby improving the sealing effect of the connection structure and preventing the process gas from leaking out of the chamber body along the connection structure.

[0054] Optionally, due to the long length of the lead-in rod 240, if the insulating sleeve 242 adopts an integrated structure, its processing difficulty is high and the yield rate is low, resulting in an increase in the manufacturing cost of the equipment. In the present application, the insulating sleeve 242 can be set as a split structure. Figure 5 In the specific embodiment shown, the insulating sleeve 242 is formed of a three-stage tubular structure, thereby reducing the processing difficulty of the insulating sleeve 242 and reducing the equipment manufacturing cost. Of course, the insulating sleeve 242 can also adopt an integrated structure or other multi-stage structure, which is not limited here.

[0055] Optionally, the threaded sleeve 265 and the connecting sleeve 261 can be made of metal materials, and the sealing block 262 can be made of insulating materials such as resin, and the sealing block 262 can achieve insulation between the connecting sleeve 261 and the introduction rod 240. In addition, an insulating tube 266 is also provided between the threaded sleeve 265 and the introduction rod 240. The insulating tube 266 can be made of insulating materials such as resin to achieve insulation between the threaded sleeve 265 and the introduction rod 240. The cable connector 250 can be connected to the threaded sleeve 265 by means of threaded connection or the like, and the conductor in the cable connector 250 is in contact with the introduction rod 240 to achieve electrical connection, so as to conduct the RF power to the introduction rod 240. The structure of the cable connector 250 can refer to the prior art and will not be described in detail here.

[0056] The temperature inside the chamber body is relatively high, and the second support assembly 200 is easily damaged when operating at high temperatures. In some embodiments, the intermediate flange 210 has a cooling cavity extending along its circumference, and the intermediate flange 210 is also provided with a cooling liquid pipe 213, which can pass through the side wall of the chamber body to connect the cooling cavity with the cooling system. The coolant enters the cooling cavity through the cooling liquid pipe 213, exchanges heat with the intermediate flange 210, reduces the temperature of the intermediate flange 210, and thus prolongs the service life of the second support assembly 200.

[0057] Optional, such as Figure 4 and Figure 5As shown, the end face of the intermediate flange 210 has a cooling groove 211 arranged along its circumference, and the notch of the cooling groove 211 is provided with a sealing ring 212, which seals the cooling groove 211, so that a cooling cavity is formed inside the cooling groove 211. The cooling liquid pipe 213 includes a cooling liquid inlet pipe and a cooling liquid outlet pipe. The cooling liquid enters the cooling cavity through the cooling liquid inlet pipe and exchanges heat with the intermediate flange 210, and then flows out through the cooling liquid outlet pipe. The cooling system can cool the cooling liquid after heat exchange, and the circulating flow of the cooling liquid can effectively reduce the temperature of the intermediate flange 210, thereby extending the service life of components such as the electrode introduction assembly.

[0058] Optionally, cooling grooves 211 are provided on both side end surfaces of the middle flange 210, and the interiors of the two cooling grooves 211 are interconnected. The cooling liquid inlet pipe can be connected to one of the cooling grooves 211, and the cooling liquid outlet pipe can be connected to the other cooling groove 211. The coolant flows between the two cooling grooves 211, which can cool the middle flange 210 more fully and make the temperature on both sides of the middle flange 210 more uniform, thereby avoiding stress deformation of the middle flange 210 due to uneven heating, and extending the service life of the middle flange 210.

[0059] The present application also provides a semiconductor process chamber, comprising a chamber body, first support components respectively disposed at both ends of the chamber body, and a second support component 200 disposed in any of the above embodiments. Figure 1 As shown, each first support assembly and the second support assembly 200 are used to jointly support the wafer boat 400 between the two. One or more second support assemblies 200 may be arranged between the two first support assemblies, and two adjacent second support assemblies 200 may be used to jointly support the wafer boat 400 between the two. This application is described by taking an example in which a second support assembly 200 is arranged between two first support assemblies, and the second support assembly 200 and the two first support assemblies jointly support the two wafer boats 400.

[0060] The two first supporting assemblies are respectively fixed at the head and tail ends of the chamber body, and the two first supporting assemblies are respectively used to support the boat feet of the wafer boat 400 close to the head and tail ends of the chamber body.

[0061] The second support assembly 200 is fixed in the middle of the chamber body, and the first support assembly and the second support assembly 200 are respectively overlapped with the boat feet at both ends of the wafer to support the boat feet of the wafer boat 400. The chamber body has a processing station for placing two wafer boats 400, and the second support assembly 200 is located between the two processing stations and fixedly connected to the inner wall of the chamber body.

[0062] In some embodiments, the first support assembly includes a fixing flange 100 and a support rod 300. The fixing flanges 100 of the two first support assemblies are fixed at the head and tail ends of the chamber body, respectively. The support rod 300 is fixedly connected to the fixing flange 100 by welding or other methods, and extends toward the inside of the chamber body along the axial direction of the chamber body. The end of the support rod 300 away from the fixing flange 100 is suspended to support the wafer boat 400.

[0063] It is to be understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present application, but the present application is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and substance of the present application, and these modifications and improvements are also considered to be within the scope of protection of the present application.

Claims

1. An electrode introduction device, applied to semiconductor process equipment, characterized in that: It comprises a second support component and an electrode introduction component, wherein the second support component is used to be fixed between two adjacent processing stations in the semiconductor process equipment, and the processing station is used to place a wafer boat; The electrode introduction assembly is arranged on the second supporting assembly, and the electrode introduction assembly has two electrical contact parts, and the two electrical contact parts are respectively used to electrically contact with the boat feet of the two wafer boats; the electrode introduction assembly is used to be electrically connected to the RF power supply, and the RF power provided by the RF power supply is loaded to the two wafer boats through the two electrical contact parts.

2. The electrode introduction device according to claim 1, characterized in that: The second supporting assembly includes an annular fixing portion and a supporting portion, wherein the fixing portion is used to be fixedly connected to a chamber body of the semiconductor process equipment, and the supporting portion is fixedly connected to the fixing portion to support the wafer boat.

3. The electrode introduction device according to claim 2, characterized in that: The number of the support parts is two, the number of the electrode introduction components is also two, and each of the electrode introduction components includes two electrical contact parts and a connection structure; The two electrode introduction components are respectively arranged close to the two supporting parts, and the two electrical contact parts of the electrode introduction components are respectively located at the two ends of the corresponding supporting parts. The connecting structure is connected to the two electrical contact parts and is used to electrically connect the electrical contact parts with the RF power supply.

4. The electrode introduction device according to claim 3, characterized in that: The connection structure includes an electrode connector, a cable connector and an introduction rod, wherein both ends of the electrode connector are respectively connected to the electrical contact parts at both ends of the support part, one end of the introduction rod is connected to the middle part of the electrode connector, the fixing part has a through hole penetrating in the radial direction, the introduction rod passes through the through hole and the chamber body and extends to the outside of the chamber body, and the cable connector is connected to one end of the introduction rod away from the electrode connector for connecting the radio frequency power supply.

5. The electrode introduction device according to claim 4, characterized in that: A protective tube is fixedly connected in the through hole of the fixed part, and the connection structure also includes an insulating sleeve, which is sleeved on the outer periphery of the introduction rod, and the protective tube is sleeved on the outer periphery of the insulating sleeve, and the insulating sleeve is used for insulation between the introduction rod and the fixed part.

6. The electrode introduction device according to claim 5, characterized in that: The connection structure also includes a sealing component, which is sleeved on the outer circumference of the introduction rod and connected to the end of the protection tube away from the through hole, and is used to cooperate and seal with the end face of the insulating sleeve and the outer circumference of the introduction rod.

7. The electrode introduction device according to claim 6, characterized in that: The sealing assembly includes a connecting sleeve, a pressing piece, a sealing block and a sealing ring, the sealing ring includes a first sealing ring and a second sealing ring, the connecting sleeve is sleeved on the end of the protective tube away from the through hole and is sealed and connected to the protective tube, the connecting sleeve has a sealing cavity inside, the insulating sleeve has a sealing protrusion on the end away from the through hole, the first sealing ring is located between the sealing protrusion and the side wall of the sealing cavity close to the through hole, the sealing block is located on the side of the sealing protrusion away from the through hole, and is sleeved on the outer periphery of the introduction rod, the side of the sealing block close to the sealing protrusion has a sealing groove arranged close to and around the introduction rod, the second sealing ring is arranged in the sealing groove, the pressing piece is located on the side of the sealing block away from the sealing protrusion, and the pressing piece cooperates with the connecting sleeve to compress the sealing block and the sealing protrusion.

8. The electrode introduction device according to claim 4, characterized in that: The electrode connector includes an electrode connecting rod and a connecting portion, wherein both ends of the electrode connecting rod are respectively connected to the electrical contact portions located at both ends of the supporting portion, and the connecting portion is located in the middle of the electrode connecting rod and is used to electrically connect the electrode connecting rod and the introduction rod.

9. The electrode introduction device according to claim 8, characterized in that: The connection structure further includes an insulating protective sleeve, which is arranged on the outer periphery of the electrode connecting rod and is used to protect the electrode connecting rod.

10. The electrode introduction device according to any one of claims 2 to 9, characterized in that: The fixing part has cooling cavities distributed along the circumferential direction, and the fixing part is also provided with a cooling liquid pipe for connecting the cooling cavity with a cooling system.

11. The electrode introduction device according to claim 10, characterized in that: The end surface of the fixing portion has a cooling groove arranged along its circumference, a sealing ring is arranged at the notch of the cooling groove, and the cooling cavity is formed between the sealing ring and the cooling groove.

12. The electrode introduction device according to claim 11, characterized in that: The cooling grooves are provided on both side end surfaces of the fixing portion, the interiors of the two cooling grooves are connected, the cooling liquid pipe includes an inlet pipe and an outlet pipe, the inlet pipe is connected to one of the cooling grooves, and the outlet pipe is connected to the other cooling groove.

13. A semiconductor process equipment, characterized in that: The chamber comprises a chamber body, two first support assemblies and the electrode introduction device according to any one of claims 1 to 12, wherein the two first support assemblies are respectively arranged at the head and tail ends of the chamber body, and each of the first support assemblies and the electrode introduction device jointly support the wafer boat between the two; The first support assembly includes a fixed flange and a support rod. The fixed flanges of the two first support assemblies are fixedly connected to the head and tail ends of the chamber body respectively. The support rod extends into the interior of the chamber body to support the wafer boat.

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