Mining lamp, glue filling device and glue filling process

Abstract

The invention relates to the technical field of lamp processing, and provides a mining lamp, a glue filling device and a glue filling technology. A plurality of light emitting bodies mounted on the loading substrate; the light-transmitting plate is installed on the loading substrate, the light-transmitting plate comprises a glue pouring area and reflection cups which are arranged towards the loading substrate, and the number of the reflection cups corresponds to that of the light-emitting bodies; and the colloid is poured into the colloid pouring area, and any luminous body is isolated from the colloid pouring area through the reflection cup when the light-transmitting plate is assembled on the loading substrate. According to the mining lamp, external water vapor and dust are prevented from invading, so that the waterproof and dustproof capacity of the mining lamp in a humid and dust-dense severe environment is improved, the luminous body and other electronic components can be protected against corrosion, in addition, when the lamp is vibrated or impacted through the colloid, internal components are not prone to displacement or even damage, and the service life of the mining lamp is prolonged. Therefore, the anti-seismic performance of the mining lamp is improved, and the stability and the service life of the whole mining lamp are further improved.

Description

Technical Field

[0001] The invention relates to the technical field of lamp processing, and in particular to an industrial and mining lamp, a glue pouring device and a glue pouring process. Background Art

[0002] Industrial and mining lamps are lighting fixtures designed for large spaces. Traditional industrial and mining lamps usually use high-intensity gas discharge lamps such as metal halide lamps. These lamps have problems such as 360-degree light emission, large light loss, and serious energy waste. With the continuous advancement of LED technology, LED industrial and mining lamps have gradually replaced traditional metal halide lamps with their advantages of directional light emission, low power consumption, good driving characteristics, fast response speed, high seismic resistance, long service life, and green environmental protection, becoming an important part of modern industrial lighting.

[0003] However, traditional mining lamps often face multiple challenges in harsh working environments. Traditional mining lamps that have not undergone effective protection usually have poor waterproof performance and are prone to internal circuit short circuit or failure due to water vapor intrusion; secondly, due to the lack of good dustproof design, dust is easily accumulated inside the lamp in dusty industrial environments, which not only reduces the lighting efficiency but also accelerates the aging of the lamp; thirdly, the shock resistance is weak, and the lack of buffer materials makes the internal components of the lamp easily displaced or even damaged when it is vibrated or impacted; in addition, the corrosion resistance is poor. In a humid or corrosive gas environment, the metal parts of the lamp are easily corroded, shortening the service life. Summary of the invention

[0004] In view of the deficiencies in the prior art, the object of the present invention is to provide a mining lamp that is moisture-proof, dust-proof and has good shock resistance, a glue pouring device for pouring glue on the mining lamp, and a glue pouring process with better effect.

[0005] To solve the above problems, the present invention provides the following technical solutions:

[0006] A mining lamp, comprising:

[0007] loading a substrate;

[0008] A light emitting body is mounted on the loading substrate, and the light emitting body is provided in a plurality;

[0009] A light-transmitting plate, mounted on the loading substrate, the light-transmitting plate comprising a glue-filling area and a reflective cup arranged toward the loading substrate, the number of the reflective cups corresponding to the number of the illuminants;

[0010] The colloid is poured into the glue pouring area, and any of the luminous bodies is isolated from the glue pouring area by the reflective cup when the light-transmitting plate is assembled on the loading substrate.

[0011] In one embodiment, the reflective cup extends from the bottom of the glue pouring area to the notch of the glue pouring area, and the diameter of the reflective cup gradually decreases from the bottom of the glue pouring area to the notch of the glue pouring area.

[0012] In one embodiment, a floating plate is further included, and the floating plate is installed in the glue pouring area to limit the colloid poured into the glue pouring area.

[0013] In one embodiment, the floating plate includes a rigid floating plate, and the rigid floating plate is provided with an embedding hole corresponding to the reflective cup. The rigid floating plate is engaged with the side of the reflective cup away from the bottom of the glue pouring area through the embedding hole and is spaced apart from the bottom of the glue pouring area. The colloid is poured into the glue pouring area and is located on the side of the rigid floating plate facing the bottom of the glue pouring area.

[0014] In one embodiment, the floating plate includes a flexible floating plate, which is installed at the bottom end of the glue pouring area. The colloid is poured into the glue pouring area and is located on the side of the flexible floating plate facing the bottom of the glue pouring area. The flexible floating plate can float up as the colloid in the glue pouring area increases.

[0015] In one embodiment, a sealing strip is further included. An embedding groove is provided on the peripheral side of the light-transmitting plate facing the loading substrate. The sealing strip is installed in the embedding groove. When the light-transmitting plate is assembled on the loading substrate, the sealing strip is abutted by the loading substrate and confined in the embedding groove.

[0016] A glue filling device, applied to the above-mentioned industrial and mining lamp, comprising:

[0017] A glue filling plate is detachably mounted on the light-transmitting plate and arranged toward the glue filling area. The glue filling plate is provided with a glue filling channel and an air outlet channel, and the gas generated when the glue is filled into the glue filling area is discharged through the air outlet channel;

[0018] A glue pouring head, used for pouring glue into the glue pouring area, the glue pouring head is installed on the glue pouring board;

[0019] The glue pouring head extends into the glue pouring channel to pour glue into the glue pouring area, the floating plate fits against one side of the glue pouring plate, and / or the floating plate gradually approaches the glue pouring plate when the colloid is poured into the glue pouring area.

[0020] In one embodiment, a sensor is further included, and the sensor is electrically connected to the glue filling head. The sensor is used to determine whether the glue in the glue filling area is full, thereby controlling the operation of the glue filling head.

[0021] In one embodiment, a cutting piece is further included for cutting the colloid overflowing into the air outlet channel. The cutting piece is electrically connected to the sensor. The cutting piece is installed on the glue filling plate and is located at one end of the air outlet channel away from the glue filling area. The sensor is used to determine whether the glue in the glue filling area is full, thereby controlling the operation of the cutting piece.

[0022] A glue filling process, applied to the industrial and mining lamp as described above, comprises the following steps:

[0023] S1: Glue the glue area through the glue filling head;

[0024] S2: Vibrate the light-transmitting plate through a vibrator to make the colloid spread evenly in the glue filling area;

[0025] S3: Detect through the sensor that the glue fills the glue filling area and stop glue filling;

[0026] S4: assembling the light-transmitting plate by controlling the loading substrate through the robot arm to encapsulate the glue filling area;

[0027] S5: Rapid condensation of the colloid is achieved through a condenser.

[0028] The beneficial effects of the present invention are as follows: by injecting colloid into the glue filling area, the glue filling area is filled, so that after the colloid solidifies in the glue filling area, the glue filling area can be sealed to prevent external water vapor and dust from invading, thereby improving the waterproof and dustproof capabilities of the mining lamp in a humid, dusty and harsh environment, and protecting the light-emitting body and other electronic components from corrosion. In addition, the colloid makes it difficult for the internal components of the lamp to be displaced or even damaged when it is vibrated or impacted, thereby improving the seismic resistance of the mining lamp and further improving the stability and life of the overall mining lamp. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A three-dimensional diagram of one embodiment of a mining lamp of the present invention;

[0030] Figure 2 A cross-sectional view of one embodiment of a mining lamp of the present invention;

[0031] Figure 3 An exploded view of one embodiment of a mining lamp of the present invention;

[0032] Figure 4 A cross-sectional view of another embodiment of a mining lamp of the present invention;

[0033] Figure 5 This is a schematic diagram of the installation of one embodiment of the sealing ring of the present invention;

[0034] Figure 6This is a working schematic diagram of one embodiment of a glue filling device of the present invention;

[0035] Figure 7 The figure is a schematic structural diagram of one embodiment of a glue filling device of the present invention.

[0036] Reference numerals:

[0037] 100, mining lamp; 110, loading substrate; 111, luminous body; 112, light-transmitting plate; 11a, glue filling area; 121, reflective cup; 113, colloid; 114, floating plate; 122, rigid floating plate; 13a, embedding hole; 123, flexible floating plate; 131, elastic wall; 115, sealing strip; 124, sealing ring; 11b, embedding groove; 132, heat dissipation fin; 133, heat dissipation channel; 200, glue filling device; 211, glue filling board; 21a, glue filling channel; 21b, air outlet channel; 212, glue filling head; 213, sensor; 214, cutting part. DETAILED DESCRIPTION

[0038] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0039] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0040] Example 1: Please refer to Figure 1-5As shown, this embodiment provides a mining lamp 100, which includes: a loading substrate 110, a light-emitting body 111, a light-transmitting plate 112 and a colloid 113; wherein the light-emitting body 111 is mounted on the loading substrate 110, and the light-emitting body 111 is provided in plurality, and the plurality of light-emitting bodies 111 form a light-emitting array mounted on the loading substrate 110. In this embodiment, a plurality of light-emitting arrays are mounted on the loading substrate 110, and the specific implementation process of one of them can be described in detail; further, the light-transmitting plate 112 is mounted on the loading substrate 110 and one of the plurality of light-emitting arrays is mounted on the loading substrate 110. The light-emitting array composed of light-emitting bodies 111 is covered, and the light-transmitting plate 112 includes a glue-filling area 11a and a reflective cup 121 arranged toward the loading substrate 110. The number of the reflective cups 121 corresponds to the number of the light-emitting bodies 111. A part of the light emitted by any light-emitting body 111 is reflected by the reflective cup 121 and then emitted outward through the light-transmitting plate 112. Furthermore, the colloid 113 is poured into the glue-filling area 11a, and any light-emitting body 111 is isolated from the glue-filling area 11a by the reflective cup 121 when the light-transmitting plate 112 is assembled on the loading substrate 110.

[0041] According to the above scheme, it can be understood that in this embodiment, the glue filling area 11a is filled by injecting the colloid 113 into the glue filling area 11a, so that after the colloid 113 solidifies in the glue filling area 11a, the glue filling area 11a can be sealed to prevent the invasion of external water vapor and dust, thereby improving the waterproof and dustproof capabilities of the mining lamp 100 in humid and dusty harsh environments, and protecting the light-emitting body 111 and other electronic components from corrosion. In addition, the colloid 113 makes it difficult for the internal components of the lamp to be displaced or even damaged when it is vibrated or impacted, thereby improving the seismic resistance of the mining lamp 100 and further improving the stability and life of the overall mining lamp 100.

[0042] Optionally, in this embodiment, the light-transmitting plate 112 includes a lens arranged in the reflective cup 121. The light of the light-emitting plate is reflected by the inner wall of the reflective cup 121 and emitted outward from the lens. The purpose of designing the lens is to concentrate the light of the light-emitting plate reflected by the inner wall of the reflective cup 121 and then emit it outward, thereby enhancing the focusing effect of the illumination of the light-emitting body 111.

[0043] Preferably, the reflective cup 121 extends from the bottom of the glue pouring area 11a to the notch of the glue pouring area 11a, and the diameter of the reflective cup 121 gradually decreases from the bottom of the glue pouring area 11a to the notch of the glue pouring area 11a; it can be understood that when the colloid 113 is poured into the glue pouring area 11a, the reflective cup 121 in the glue pouring area 11a is designed to gradually decrease from the bottom of the glue pouring area 11a to the notch of the glue pouring area 11a, so that the colloid 113 is poured into the glue pouring area 11a. 1a, a larger contact area with the reflective cup 121 can be achieved, so that the colloid 113 has a better sealing effect in the glue filling area 11a; further, the colloid 113 has a larger contact area with the reflective cup 121 during the process of dispersion after being poured into the glue filling area 11a, so that the colloid 113 that has been poured into the glue filling area 11a has stronger adhesion in the glue filling area 11a, thereby improving the sealing effect of the colloid 113 on the glue filling area 11a.

[0044] Preferably, the colloid 113 in this embodiment adopts epoxy resin potting glue, a room temperature curing two-component epoxy resin potting material, which has excellent electrical properties after curing, high surface gloss, simple and convenient operation, can be cured at room temperature or heated, SGS test passes the EU ROHS standard, the cured product has high hardness, smooth surface, good gloss, and has the characteristics of fixation, insulation, waterproof, oil-proof, dust-proof, anti-theft, corrosion-resistant, aging-resistant, and cold and hot shock-resistant. It is used for electronic transformers, AC capacitors, negative ion generators, aquarium water pumps, ignition coils, and electronic modules.

[0045] Preferably, it also includes a floating plate 114, which is installed in the glue filling area 11a and is used to limit the colloid 113 poured into the glue filling area 11a. Through the limiting effect of the floating plate 114, the colloid 113 poured into the glue filling area 11a is limited between the bottom of the glue filling area 11a and the floating plate 114, thereby preventing the colloid 113 from spilling or overflowing during the filling process, which will affect the assembly of the light-transmitting plate 112 and the loading substrate 110.

[0046] According to the above scheme, preferably, in some embodiments, the floating plate 114 includes a rigid floating plate 122. The rigid floating plate 122 in this embodiment is made of a relatively hard material. The rigid floating plate 122 is provided with an embedding hole 13a corresponding to the reflective cup 121. Before the colloid 113 is poured, the rigid floating plate 122 is engaged with the side of the reflective cup 121 away from the bottom of the glue pouring area 11a through the embedding hole 13a and is spaced from the bottom of the glue pouring area 11a. The colloid 113 is poured into the glue pouring area 11a and is located on the rigid floating plate 12 2 is toward the side of the bottom of the glue filling area 11a; it can be understood that the purpose of setting the rigid floating plate 122 is to engage with the top of the reflective cup 121 through the embedding hole 13a of the rigid floating plate 122, so that the lower side of the rigid floating plate 122 reserves a space for the glue filling area 11a for the colloid 113 to be poured. This structure is that the pouring space of the colloid 113 can be limited, so that the colloid 113 can form a fixed and preset structural shape after pouring, so as to meet the pouring requirements of users with different structures of the industrial and mining lamp 100.

[0047] Please refer to Figure 4 As shown, preferably, the floating plate 114 includes a flexible floating plate 123, which is installed at the bottom end of the glue pouring area 11a. The colloid 113 is poured into the glue pouring area 11a and is located on the side of the flexible floating plate 123 facing the bottom of the glue pouring area 11a. The flexible floating plate 123 can float up as the colloid 113 in the glue pouring area 11a increases; further, an elastic member 131 attached to the outer wall of the reflective cup 121 is provided on the flexible floating plate 123, and the attachment area between the elastic wall 131 and the reflective cup 121 decreases as the flexible floating plate 123 moves upward.

[0048] Please refer to Figure 4-5As shown, preferably, in the above two different embodiments, the mining lamp 100 includes a sealing ring 124. In the first embodiment, the sealing ring 124 is installed on the inner side wall of the embedding hole 13a. When the embedding hole 13a is engaged with the top of the reflective cup 121, the sealing ring 124 is clamped between the surrounding side of the embedding hole 13a and the reflective cup 121, so as to seal the part where the top of the reflective cup 121 contacts the side wall of the embedding hole 13a. Further, in the second embodiment, the sealing ring 124 is installed on the outer side of the top of the reflective cup 121, and the sealing ring 124 abuts against the elastic wall 131 of the flexible floating plate 123 attached to the outer side wall of the reflective cup 121. It can be understood that when the colloid 113 is in When pouring into the glue pouring area 11a, the attachment area between the elastic wall 131 and the reflective cup 121 decreases as the flexible floating plate 123 moves upward. When the attachment area between the elastic wall 131 and the reflective cup 121 is reduced to a minimum, the sealing ring 124 is inserted into the top of the reflective cup 121 and abuts against the elastic wall 131, so that the elastic wall 131 is subjected to the abutment force of the sealing ring 124 and cannot continue to reduce the contact area with the reflective cup 121, thereby stopping the pouring of the colloid 113. This structure can not only limit the glue pouring space of the colloid 113, but also does not need to use the rigid floating plate 122, thereby reducing the use of materials, and can be applied to industrial and mining lamps 100 with a larger space in the glue pouring area 11a.

[0049] Preferably, in other embodiments, a flexible float 123 and a rigid float 122 may be provided simultaneously. By providing the flexible float 123 at the lower side of the rigid float 122, the flexible float 123 is closer to the side where the colloid 113 is poured. The design advantage of this structure is that the flexible float 123 can compensate for the defects of the rigid float 122, thereby ensuring that the space within the glue pouring area 11a is completely sealed by using the double float 114, thereby preventing the glue pouring area 11a from being connected to the outside world, causing bubbles or overflow of the colloid 113.

[0050] Optionally, the flexible floating plate 123 in this embodiment is made of a flexible film material.

[0051] Preferably, a sealing strip 115 is further included. An embedding groove 11b is provided on the peripheral side of the light-transmitting plate 112 facing the loading substrate 110. The sealing strip 115 is installed in the embedding groove 11b. When the light-transmitting plate 112 is assembled on the loading substrate 110, the sealing strip 115 is abutted by the loading substrate 110 and confined in the embedding groove 11b. Further, the mining lamp 100 also includes a fixing screw, which passes through the sealing strip 115 and the embedding groove 11b and is fixed to the loading substrate 110 by the fixing screw, so that the sealing strip 115 is fixed in the embedding groove 11b, thereby improving the fixing effect of the sealing strip 115 to ensure that the sealing strip 115 will not be displaced or fall out, so that the sealing strip 115 maintains its sealing effect for a long time.

[0052] Preferably, a heat sink 132 extends upward from the side of the loading substrate 110 away from the light-emitting body 111, and a plurality of heat sink fins 132 are extended, and any two adjacent heat sink fins 132 are spaced apart to form a heat sink channel 133. The heat sink fins 132 increase the heat dissipation area of ​​the loading substrate 110 for the light-emitting body 111, and the air flow is realized through the heat sink channel 133, which further accelerates the heat transfer from the light-emitting body 111 to the heat sink fins 132, thereby accelerating the heat dissipation effect.

[0053] Embodiment 2: This embodiment provides a glue filling device 200, which is applied to the industrial and mining lamp 100 of embodiment 1, please refer to Figure 5-7 As shown, it includes: a glue filling plate 211 and a glue filling head 212, wherein the glue filling plate 211 is detachably mounted on the light-transmitting plate 112 and is arranged toward the glue filling area 11a, and a glue filling channel 21a and an air outlet channel 21b are provided on the glue filling plate 211, and the gas generated when the glue filling area 11a is filled with the colloid 113 is discharged through the air outlet channel 21b; the glue filling head 212 is used to fill the glue filling area 11a with glue, and the glue filling head 212 is installed on the glue filling plate 211; wherein the glue filling head 212 extends into the glue filling channel 21a to fill the glue filling area 11a with glue, the floating plate 114 is in contact with one side of the glue filling plate 211, and / or the floating plate 114 gradually approaches the glue filling plate 211 when the colloid 113 is poured into the glue filling area 11a.

[0054] According to the above scheme, it can be understood that the colloid 113 is poured into the glue pouring area 11a through the glue pouring head 212, and the glue pouring head 212 is connected to the external glue cylinder. The purpose of designing the glue pouring plate 211 is to achieve the sealing of the glue pouring area 11a through the glue pouring channel 21a on the glue pouring plate 211, thereby improving the uniformity of the glue pouring head 212 on the glue pouring plate 211 through the glue pouring channel 21a, and avoiding the glue pouring head 212 causing The glue filling in the glue filling area 11a is uneven; it can be understood that during the glue filling process, the floating plate 114 is fitted with one side of the glue filling plate 211 and / or the floating plate 114 gradually approaches the glue filling plate 211 when the glue 113 is poured into the glue filling area 11a. This structure enables the glue filling plate 211 and the floating plate 114 to form a mutually penetrating structure, so that the glue filling channel 21a is directly connected to the floating plate 114 and penetrates the floating plate 114 and then connects to the glue filling area 11a, which helps to simplify the glue filling process.

[0055] Preferably, a sensor 213 is further included. The sensor 213 is electrically connected to the glue filling head 212 . The sensor 213 is used to determine whether the glue 113 in the glue filling area 11 a is full, thereby controlling the operation of the glue filling head 212 .

[0056] Optionally, in this embodiment, a pressure sensor 213 can be arranged on one side of the glue filling plate 211 of the glue filling device 200, and the pressure sensor 213 can be connected to the space in the glue filling area 11a, so that the air pressure under the floating plate 114 is detected by the pressure sensor 213, and the air pressure is detected to determine whether the glue filling area 11a is filled with the colloid 113, thereby controlling the glue filling head 212 to continue working or controlling the glue filling head 212 to stop.

[0057] Optionally, a contact sensor 213 may be further provided in the present embodiment. The contact sensor 213 may be provided at the top of the floating plate 114 or in any other area where it can be detected that the colloid 113 fills the glue filling area 11a. The contact sensor 213 detects whether the colloid 113 is in contact, thereby determining whether the colloid 113 fills the glue filling area 11a, thereby controlling the glue filling head 212 to continue working or control the glue filling head 212 to stop. It can be understood that the present embodiment does not limit the installation position of the sensor 213.

[0058] Preferably, it also includes a cutting piece 214 for cutting the colloid 113 overflowing into the air outlet channel 21b, the cutting piece 214 is electrically connected to the sensor 213, the cutting piece 214 is installed on the glue filling plate 211 and is located at one end of the air outlet channel 21b away from the glue filling area 11a, and the sensor 213 is used to determine whether the glue filling area 11a is full of the colloid 113, so as to control the operation of the cutting piece 214; it can be understood that when the glue filling area 11a is full of the colloid 113, the glue filling head 212 will not stop immediately due to its non-stop operation. At this time, since the glue filling area 11a is full of the colloid 113, the subsequent filling into the glue filling area 11a is The colloid 113 in the glue area 11a will squeeze part of the colloid 113 into the air outlet channel 21b, thereby blocking the air outlet channel 21b. At this time, since the air outlet channel 21b is blocked, the sensor 213 will detect the air pressure change in the glue filling area 11a and the fullness of the colloid 113, thereby stopping the glue filling, and the cutting piece 214 will work to block the opening of the air outlet channel 21b close to the glue filling area 11a, so that a part of the colloid 113 in the air outlet channel 21b will not flow into the glue filling area 11a, causing the colloid 113 in the glue filling area 11a to overflow, thereby ensuring that the colloid 113 in the glue filling area 11a meets the standard.

[0059] Embodiment 3: This embodiment provides a glue filling process, which is applied to the industrial and mining lamp as in Embodiment 1, and includes the following steps:

[0060] S1: Glue the glue area through the glue filling head;

[0061] In this step, one or more glue pouring heads (also called glue dispensers) are used to pour liquid colloid into a predetermined area (ie, glue pouring area) on the light-transmitting plate.

[0062] S2: Vibrate the light-transmitting plate by a vibrator to make the colloid spread evenly during the process of pouring into the glue pouring area;

[0063] During the glue pouring process, the light-transmitting plate will be placed on a platform with a vibration function. Vibration with appropriate frequency and amplitude can help the colloid to be evenly distributed in the entire glue pouring area and remove bubbles to make the glue surface smoother. This step is critical to obtaining high-quality glue pouring results.

[0064] S3: Detect through the sensor that the glue fills the glue filling area and stop glue filling;

[0065] During the glue dispensing process, the glue dispensing head can be controlled by a program or a physical sensor to ensure the consistency of the glue amount and the accuracy of the position. The system uses optical sensors, contact sensors or other types of sensors to monitor whether the glue has completely filled the designated glue dispensing area. Once the sensor detects that the glue has reached the preset height or volume, it will send a signal to the control system to stop glue dispensing to prevent overfilling.

[0066] S4: assembling the light-transmitting plate by controlling the loading substrate through the robot arm to encapsulate the glue filling area;

[0067] When the colloid is laid and leveled, the robot arm will grab the corresponding loading substrate according to the programming instructions, accurately position it and align it with the light-transmitting plate below to complete the assembly. This operation can ensure a close fit between components and does not require the light-transmitting plate to move, thereby preventing the poured colloid from shaking and spilling, and preparing for the next step of condensation.

[0068] S5: Rapid condensation of the colloid is achieved through a condenser.

[0069] Finally, after the assembly is completed, the entire mining lamp will be sent to the condensing device. The condenser can provide a low temperature environment or a cooling medium under specific conditions, such as cold air flow or cooling liquid circulation, to promote the rapid solidification of the colloid, which not only saves time, but also enhances the bonding strength and stability of the product.

[0070] In summary, the present invention provides an industrial and mining lamp, a glue filling device and a glue filling process, wherein the glue filling area is filled by pouring colloid into the glue filling area, so that after the colloid solidifies in the glue filling area, the glue filling area can be sealed to prevent the invasion of external water vapor and dust, thereby improving the waterproof and dustproof capabilities of the industrial and mining lamp in a humid and dusty harsh environment, and protecting the light-emitting body and other electronic components from corrosion. In addition, the colloid is used to prevent the internal components of the lamp from being displaced or even damaged when it is vibrated or impacted, thereby improving the seismic performance of the industrial and mining lamp, and further improving the stability and life of the overall industrial and mining lamp.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A mining lamp, characterized in that: include: loading a substrate; A light emitting body is mounted on the loading substrate, and the light emitting body is provided in a plurality; A light-transmitting plate, mounted on the loading substrate, the light-transmitting plate comprising a glue-filling area and a reflective cup arranged toward the loading substrate, the number of the reflective cups corresponding to the number of the illuminants; The colloid is poured into the glue pouring area, and any of the luminous bodies is isolated from the glue pouring area by the reflective cup when the light-transmitting plate is assembled on the loading substrate.

2. The mining lamp according to claim 1, characterized in that: The reflective cup extends from the bottom of the glue-filling area to the notch of the glue-filling area, and the diameter of the reflective cup gradually decreases from the bottom of the glue-filling area to the notch of the glue-filling area.

3. The mining lamp according to claim 2, characterized in that: It also includes a floating plate, which is installed in the glue pouring area and is used to limit the colloid poured into the glue pouring area.

4. The mining lamp according to claim 3, characterized in that: The floating plate includes a rigid floating plate, and an embedding hole corresponding to the reflective cup is provided on the rigid floating plate. The rigid floating plate is engaged with a side of the reflective cup away from the bottom of the glue pouring area through the embedding hole and is spaced apart from the bottom of the glue pouring area. The colloid is poured into the glue pouring area and is located on a side of the rigid floating plate facing the bottom of the glue pouring area.

5. The mining lamp according to claim 3 or 4, characterized in that: The floating plate includes a flexible floating plate, which is installed at the bottom of the glue pouring area. The colloid is poured into the glue pouring area and is located on the side of the flexible floating plate facing the bottom of the glue pouring area. The flexible floating plate can float up as the colloid in the glue pouring area increases.

6. The mining lamp according to claim 1, characterized in that: It also includes a sealing strip. The light-transmitting plate is provided with an embedding groove on the peripheral side facing the loading substrate. The sealing strip is installed in the embedding groove. When the light-transmitting plate is assembled on the loading substrate, the sealing strip is abutted by the loading substrate and limited in the embedding groove.

7. A glue filling device, applied to the mining lamp as claimed in claim 3, characterized in that: include: A glue filling plate is detachably mounted on the light-transmitting plate and arranged toward the glue filling area. The glue filling plate is provided with a glue filling channel and an air outlet channel, and the gas generated when the glue is filled into the glue filling area is discharged through the air outlet channel; A glue pouring head, used for pouring glue into the glue pouring area, the glue pouring head is installed on the glue pouring board; The glue pouring head extends into the glue pouring channel to pour glue into the glue pouring area, the floating plate fits against one side of the glue pouring plate, and / or the floating plate gradually approaches the glue pouring plate when the colloid is poured into the glue pouring area.

8. The glue pouring device according to claim 7, characterized in that: It also includes a sensor, which is electrically connected to the glue filling head. The sensor is used to determine whether the glue in the glue filling area is full, thereby controlling the operation of the glue filling head.

9. The glue pouring device according to claim 8, characterized in that: It also includes a cutting piece for cutting the colloid overflowing into the air outlet channel, the cutting piece is electrically connected to the sensor, the cutting piece is installed on the glue filling plate and is located at one end of the air outlet channel away from the glue filling area, and the sensor is used to determine whether the colloid in the glue filling area is full, thereby controlling the operation of the cutting piece.

10. A glue pouring process, characterized in that: The method is applied to the mining lamp according to any one of claims 1 to 6, comprising the following steps: S1: Glue the glue area through the glue filling head; S2: Vibrate the light-transmitting plate through a vibrator to make the colloid spread evenly in the glue filling area; S3: Detect through the sensor that the glue fills the glue filling area and stop glue filling; S4: assembling the light-transmitting plate by controlling the loading substrate through the robot arm to encapsulate the glue filling area; S5: Rapid condensation of the colloid is achieved through a condenser.

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