Testing device

Abstract

The invention discloses a testing device, and the device comprises a light beam generation assembly which comprises a plurality of light sources; the light beam adjusting assembly is used for adjusting the transmission direction of light beams emitted by the multiple light sources, and multiple first light beams are formed to irradiate the preset positions of the heating surface of the heat dissipation module; one preset position corresponds to one hot spot position of a heating source in the electronic equipment under the condition that the heat dissipation module is applied to the electronic equipment, one light source corresponds to one preset position, and a first light beam corresponding to the light source is used for adjusting the temperature of the preset position. Simulating the temperature of the hot spot position corresponding to the preset position; and the detection assembly is used for detecting performance parameters of the heat dissipation module, and the performance parameters represent the heat dissipation capability of the heat dissipation module.

Description

Technical Field

[0001] The present application relates to the field of testing technology, and in particular to a testing device. Background Art

[0002] With the development of science and technology, electronic chips are widely used in the microelectronics and electronic information industries. At the same time, it also brings severe heat dissipation problems. If the waste heat generated by the electronic chip cannot be dissipated in time, the performance release of the chip will be severely restricted, and even the life and reliability of the chip will be reduced. It can be seen that the thermal design of the chip plays an important role in giving full play to the chip computing power, improving life and reliability, making the performance test of the chip's heat dissipation module an indispensable part of the chip's thermal design. Correspondingly, how to test the heat transfer performance of the heat dissipation module has become a research hotspot for people in this field. Summary of the invention

[0003] In view of the above problems, this application provides the following technical solutions:

[0004] A testing device, comprising:

[0005] a light beam generating assembly, the light beam generating assembly comprising a plurality of light sources;

[0006] A beam adjustment component, the beam adjustment component is used to adjust the transmission direction of the light beams emitted by the multiple light sources, so as to form multiple first light beams to irradiate preset positions of the heating surface of the heat dissipation module, one of the preset positions corresponds to a hot spot position of a heat source in the electronic device when the heat dissipation module is applied to the electronic device, one of the light sources corresponds to one of the preset positions, and the first light beam corresponding to the light source is used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position;

[0007] A detection component is used to detect performance parameters of the heat dissipation module, and the performance parameters represent the heat dissipation capacity of the heat dissipation module.

[0008] Optionally, also include:

[0009] The light spot adjustment component is used to adjust the light spots of the light beams output by the multiple light sources so that the light spot area formed by the first light beam corresponding to the light source irradiating the preset position matches the area of ​​the hot spot position.

[0010] Optionally, the light spot adjustment component includes a plurality of light spot adjustment elements, one of the light spot adjustment elements corresponds to one of the light sources, and the light spot adjustment element includes a beam expander arranged along a transmission direction of a light beam emitted by the corresponding light source.

[0011] Optionally, the beam adjustment component includes a plurality of beam adjustment elements, one beam adjustment element corresponds to one first beam, and is used to adjust a transmission direction of the first beam so as to adjust a position where the first beam irradiates the heating surface of the heat dissipation module.

[0012] Optionally, the beam adjustment element includes a first reflector group and a second reflector group, wherein the first reflector group is used to adjust the position of the light spot of the first light beam in the heating surface of the heat dissipation module in a first direction, and the second reflector group is used to adjust the position of the light spot of the first light beam in the heating surface of the heat dissipation module in a second direction, the first direction and the second direction are parallel to the heating surface of the heat dissipation module, and the first direction and the second direction are different.

[0013] Optionally, it also includes: a first driving component, the first driving component includes multiple first driving elements, one first driving element corresponds to a beam adjusting element, and is used to adjust the inclination angle of the beam adjusting element to adjust the transmission direction of the light beam output by the beam adjusting element to adjust the position of the first light beam irradiated on the heat dissipation module.

[0014] Optionally, also include:

[0015] The processing component is also used to control the first driving element to adjust the tilt angle of the beam adjusting element based on the hot spot distribution of the heat source to be simulated when the heat dissipation module is applied to the electronic device.

[0016] Optionally, it also includes: a second driving component, which is used to control the light beam adjustment component to move in a direction parallel to the plane where the heat dissipation module is located and in a direction perpendicular to the plane where the heat dissipation module is located.

[0017] Optionally, among some of the multiple light sources, one light source corresponds to one preset position, and the first light beam corresponding to the light source is used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position; among some of the multiple light sources, one light source corresponds to at least two preset positions, and the first light beam corresponding to the light source is used to adjust the temperature of the corresponding preset position to simulate the temperature of the hot spot position corresponding to the preset position.

[0018] Optionally, a processing component is further included, wherein the processing component is used to determine whether the temperature of the heat dissipation module meets a preset condition when the temperature of the heat dissipation module reaches a stable state, and when the temperature of the heat dissipation module reaches a stable state, the difference between the highest temperature and the lowest temperature at the same position in the heat dissipation module is not greater than 10°C;

[0019] The preset condition includes at least one of the following conditions:

[0020] When the temperature of the heat dissipation module reaches a stable state, the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module is lower than a first value, and there is a first distance between the proximal end of the preset position and the preset position, and the larger the first distance, the smaller the first value;

[0021] The difference between the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is greater than a second value, and there is a first distance between the proximal end of the preset position and the preset position, and the greater the first distance, the greater the second value;

[0022] When the temperature of the heat dissipation module reaches a stable state, the temperature of the far end of the preset position of the heating surface of the heat dissipation module is higher than a third value, and there is a second distance between the far end of the preset position and the preset position, and the greater the second distance, the smaller the third value;

[0023] When the temperature of the heat dissipation module reaches a stable state, the difference between the temperature of the far end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is less than a fourth value, and there is a second distance between the far end of the preset position and the preset position, and the larger the second distance, the larger the fourth difference;

[0024] Wherein, the second distance is greater than the first distance. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0026] Figure 1 A schematic diagram of the optical path of a test device provided in this application;

[0027] Figure 2 A schematic diagram of the structure of a beam adjustment component and a spot adjustment component in a test device provided in the present application;

[0028] Figure 3 for Figure 2 A top view of

[0029] Figure 4 A schematic diagram of the structure of a test device provided in this application;

[0030] Figure 5 A schematic diagram of the optical path of another testing device provided in this application;

[0031] Figure 6 A flowchart of a testing method provided by one embodiment of the present application. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0033] It is obvious to those skilled in the art that various modifications and changes can be made in this application without departing from the spirit or scope of this application. Therefore, this application is intended to cover modifications and changes of this application that fall within the scope of the corresponding claims (technical solutions claimed for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of this application can be combined with each other without contradiction.

[0034] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0035] As described in the background technology section, how to test the heat transfer performance of a heat dissipation module has become a research hotspot for researchers in this field.

[0036] As thermal design moves towards refinement, chip thermal design engineers need to consider the impact of local hot spots of the chip on the structural design of the heat dissipation module. In some applications, different areas of the electronic chip bear different amounts of computing when working. Areas with large amounts of computing have high power consumption, and accordingly, the local heat flux density will also be greater. Most of the existing heat transfer performance test equipment for heat dissipation modules use electric heating heat source modules based on the Joule thermal effect (such as electric heating rods, ceramic heating blocks, silicone heating sheets, and thin-film electric heating sheets, etc.) to simulate heat sources. However, the thermal temperature field of the heating surface of such heating sources is difficult to control, and it is impossible to accurately simulate the distribution of hot spots on the heating surface, making it difficult to guide the refined design of heat dissipation modules for today's high heat flux density chips.

[0037] In view of this, an embodiment of the present application provides a testing device, such as Figure 1 As shown, the test device includes:

[0038] A light beam generating assembly 10, wherein the light beam generating assembly 10 comprises a plurality of light sources 11;

[0039] A beam adjustment component 20, the beam adjustment component 20 is used to adjust the transmission direction of the light beams emitted by the multiple light sources 11, forming multiple first light beams 201 to irradiate preset positions of the heating surface 41 of the heat dissipation module 40, one of the preset positions corresponds to a hot spot position of a heat source in the electronic device when the heat dissipation module 40 is applied to the electronic device, one of the light sources 11 corresponds to one of the preset positions, and the first light beam 201 corresponding to the light source 11 is used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position;

[0040] The detection component 50 is used to detect the performance parameters of the heat dissipation module 40 , and the performance parameters represent the heat dissipation capability of the heat dissipation module 40 .

[0041] Optionally, in one embodiment of the present application, the detection component 50 may include a temperature measuring component, which is used to monitor the temperature of a preset position of the heat dissipation module during the heating process, wherein the temperature measuring component may be an infrared temperature measuring device or a thermocouple temperature measuring device, etc., but the present application does not limit this, and it depends on the specific situation.

[0042] In the test device provided in the embodiment of the present application, the beam generating component 10 includes multiple light sources 11, and the beam adjusting component 20 adjusts the transmission direction of the light beam emitted by the light source 11 to form multiple first light beams 201 to irradiate the preset positions of the heating surface 41 of the heat dissipation module 40. One of the preset positions corresponds to a hot spot position of the heat source in the electronic device when the heat dissipation module 40 is applied to the electronic device. One of the light sources 11 corresponds to one of the preset positions, that is, in this embodiment, one light source 11 corresponds to one hot spot position, and the light emitted by the light source 11 is used to simulate the temperature of the corresponding hot spot position, so that when the test device simulates the temperature of each hot spot position, the power of the light source 11 corresponding to the hot spot position can be adjusted separately without affecting each other, so as to simulate the heating effect of uneven heat sources such as electronic chips, provide a more realistic working condition for the test of the heat dissipation module 40, and make the test results more accurate.

[0043] It should be noted that the inventor of the present application has found that if a light source is used to generate multiple light beams and irradiate multiple preset positions of the heating surface of the heat dissipation module to simulate the temperature of multiple hot spots through a light source, it is necessary to add an integral element (such as an integral mirror, the integral element is an important optical element, through a specific design and working principle, it can realize the integration and focusing of the light beam, improve the transmission efficiency and energy utilization of the light beam) between the light source and the heat dissipation module to adjust the direction and energy of the light beam emitted by a light source, so as to meet the simulation of different temperatures at different hot spots. However, the manufacturing of the integral element involves high-precision optical design and processing technology, usually uses high-quality optical materials for manufacturing, and the production process is complicated. The cost is very high, and the simulation scenes of different temperatures require different beam integration and energy distribution. Therefore, when an integral element is used to adjust the direction and energy of the light beam emitted by a light source to meet the simulation of different temperatures at different hot spots, when it is applied to simulation scenes of different temperatures, it is necessary to rebuild the optical path system in the integral element, and the versatility is poor.

[0044] In the test device provided in the embodiment of the present application, multiple light sources are used to irradiate multiple preset positions on the heating surface of the heat dissipation module. One light source corresponds to a hot spot position to simulate the temperature of the corresponding hot spot position. No integral elements are required, and the cost is low.

[0045] In addition, in the test device provided in the embodiment of the present application, multiple light sources are used to irradiate multiple preset positions on the heating surface of the heat dissipation module. One light source corresponds to a hot spot position, which is used to simulate the temperature of the corresponding hot spot position. When applied to simulation scenes with different temperatures, it is only necessary to change the power of the light source, which has strong versatility.

[0046] The light source is an optical element that can emit electromagnetic waves within a certain wavelength range. In order to make the light emitted by the light source irradiate the preset position, the temperature of the hot spot position corresponding to the preset position can be simulated. Optionally, in one embodiment of the present application, the light source can be a laser, a plasma lamp, etc., and the light beam emitted by the light source can be a circular flat-top beam, but the present application does not limit this, depending on the specific circumstances. It should be noted that in the present embodiment, one light source corresponds to one hot spot position. Therefore, in the test device provided in the embodiment of the present application, the position of the light source is fixed during the simulation test of a scene, so that the position and movement speed of the light source are not involved. Adjustment, moreover, in a single test process, the incident angle of the light beam emitted by the laser is fixed, thereby reducing the influence of the adjustment of factors such as movement and incident angle on the test results, and improving the accuracy of the test results.

[0047] Optionally, in one embodiment of the present application, the laser may be a medium or low power laser, such as the laser may include at least one of a 100W blue laser, a 200W blue laser, a 100W green laser and a 200W green laser, so as to reduce the cost of the beam generating component on the basis of satisfying that the energy output by the light source can simulate the temperature of the hot spot position. The more lasers there are, the higher the cost of the beam generating component. Therefore, the test device provided in this embodiment can provide a more realistic working condition for the test of the heat dissipation module in the case of simulating the distribution of hot spots with a small number and high power consumption, so that the test result is more accurate, and the cost of the test device is lower, thereby making the test device provided in this embodiment more advantageous in the simulation scenario of the distribution of hot spots with a small number and high power consumption.

[0048] It should be noted that, in possible applications, the spot area formed when the light beam emitted by the light source irradiates the preset position of the heating surface of the heat dissipation module does not necessarily match the irradiation area required at the preset position. Therefore, in one embodiment of the present application, Figure 1 As shown, the testing device may further include: a light spot adjustment component 30, which can be used to adjust the light spots output by the multiple light sources 11, so that the light spot area formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position matches the irradiation area required for the preset position, wherein the irradiation area required for the preset position is the area of ​​the hot spot position corresponding to it, that is, the light spot area formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position matches the area of ​​the hot spot position, so that when the light beam emitted by the light source 11 irradiates the preset position of the heating surface 41 of the heat dissipation module 40, the temperature and area of ​​the hot spot position can be accurately simulated, and at the same time, it is avoided that the light spot area when the light beam emitted by the light source 11 irradiates the preset position of the heating surface 41 of the heat dissipation module 40 is too large, resulting in waste of energy of the light source 11 and inaccurate hot spot simulation. Among them, the matching of the area of ​​the spot formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position and the area of ​​the hotspot position can include that the area of ​​the spot formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position is the same as the area of ​​the hotspot position, and the area of ​​the spot formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position is basically the same as the area of ​​the hotspot position.

[0049] In some applications, when the heat dissipation module is applied to an electronic device, the areas of different hot spots may be different. Accordingly, the heating areas when different light sources are irradiated onto the heat dissipation module are also different. Therefore, based on the above embodiment, in one embodiment of the present application, the following is continued: Figure 1As shown, the light spot adjustment component 30 may include a plurality of light spot adjustment elements 31, and one of the light spot adjustment elements 31 may correspond to one of the light sources 11, and is used to adjust the light spot area of ​​the light beam emitted by the corresponding light source 11 irradiating the heat dissipation module 40, so that the heating area formed by the light beam of the light source 11 irradiating the heating surface of the heat dissipation module 40 can match the area of ​​the hot spot position it simulates, thereby better simulating the heating effect of uneven heat sources such as electronic chips, providing a more realistic working condition for the test of the heat dissipation module 40, and making the test result more accurate. Among them, the heating area formed by the light beam of the light source 11 irradiating the heating surface 41 of the heat dissipation module 40 matches the area of ​​the hot spot position it simulates, which may include that the area of ​​the light spot formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position is the same as the area of ​​the hot spot position, or may include that the area of ​​the light spot formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position is basically the same as the area of ​​the hot spot position. For example, the difference between the area of ​​the light spot formed when the first light beam 201 corresponding to the light source 11 irradiates the preset position and the area of ​​the hot spot position may be within 10% or within 5%. The present application does not impose any limitation on this, and it depends on the specific circumstances.

[0050] Optionally, in one embodiment of the present application, continue as Figure 1 As shown, the spot adjustment element 31 includes a beam expander 311 arranged along the transmission direction of the light beam emitted by its corresponding light source 11; wherein, the beam expander 311 can expand the diameter of the light beam emitted by the light source 11 to adjust the size of the light spot irradiated on the heated surface 41 of the heat dissipation module 40, and the magnification of the beam expander 311 is adjustable; optionally, the spot adjustment element 31 may also include a reflector 312 located in the transmission direction of the output light beam of the beam expander 311, and the reflector 312 is used to adjust the propagation direction of the output light beam of the beam expander 311, and the light beam reflected by the reflector 312 is emitted from the spot adjustment element 31 and is emitted into the light beam adjustment component 20. Optionally, the reflective surface of the reflector 312 can be coated to make its reflectivity above 99% to reduce the energy loss of the light beam during propagation.

[0051] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 1 As shown, the beam adjustment component 20 may include a plurality of beam adjustment elements 21, and one beam adjustment element 21 may correspond to one first beam 201, and is used to adjust the transmission direction of the first beam 201, so as to adjust the position of the first beam 201 irradiated to the heating surface 41 of the heat dissipation module 40, so that the first beam 201 can irradiate to its corresponding preset position, thereby better simulating the hot spot distribution of uneven heat sources such as electronic chips.

[0052] In some applications, the hotspot distribution on different heat sources may be different. Therefore, in one embodiment of the present application, the beam adjustment component 20 may include a plurality of beam adjustment elements 21, and one beam adjustment element 21 corresponds to one first light beam 201, which is used to adjust the transmission direction of the corresponding first light beam 201 to adjust the position of the first light beam 201 irradiated to the heating surface 41 of the heat dissipation module 40, so that the transmission optical path of the light beam corresponding to each of the light sources 11 can be adjusted separately, thereby making the beam generating component 10 and the beam adjustment component 20 in the test device can be applied to the simulation of heat sources with different hotspot distributions, thereby improving the versatility of the test device.

[0053] Based on the above embodiment, in one embodiment of the present application, continue as follows Figure 1 As shown, the beam adjustment element 21 may include a first reflector group 211 and a second reflector group 212, wherein the first reflector group 211 may be used to adjust the position of the light spot of the first light beam 201 on the heating surface 41 of the heat dissipation module 40 in a first direction X, and the second reflector group 212 may be used to adjust the position of the light spot of the first light beam 201 on the heating surface 41 of the heat dissipation module 40 in a second direction Y, the first direction X and the second direction Y are parallel to the heating surface 41 of the heat dissipation module 40, and the first direction X and the second direction Y are different, so that the light beam emitted by the light source 11 can be irradiated to various positions of the heating surface 41 of the heat dissipation module 40 through the adjustment of the beam adjustment element 21, thereby making the beam generating component 10 and the beam adjustment component 20 in the test device can be applied to the simulation of heat sources with different hot spot distributions, thereby improving the versatility of the test device. It should be noted that Figure 1 In the figure, the number of reflectors in the beam adjustment component 20 and the spot adjustment component 30 is only for illustration, and the present application does not impose any limitation thereto, and the specific number will be determined according to the actual situation.

[0054] Optionally, in one embodiment of the present application, the first reflector group may be an x-axis reflector, which can rotate along the rotation axis to change the position of the light spot of the first light beam irradiated on the heated surface of the heat dissipation module in the x-axis direction by changing the incident angle of the corresponding first light beam, wherein the reflective surface of the x-axis reflector may be coated so that its reflectivity is above 99%, thereby reducing the energy loss of the first light beam during transmission; the second reflector group may be a y-axis reflector, which can rotate along the rotation axis to change the position of the light spot of the first light beam irradiated on the heated surface of the heat dissipation module in the y-axis direction by changing the incident angle of the corresponding first light beam, wherein the reflective surface of the y-axis reflector may be coated so that its reflectivity is 98%, thereby reducing the energy loss of the first light beam during transmission.

[0055] Based on any of the above embodiments, in one embodiment of the present application, the testing device may further include a focusing lens assembly located in the beam output direction of the beam adjustment assembly, which is used to adjust the spot size and the divergence angle of the light beam irradiated on the heated surface of the heat dissipation module to reduce the energy waste of the light source, but the present application does not limit this and it depends on the specific situation.

[0056] In some applications, since different preset positions require different spot areas, in one embodiment of the present application, the focusing lens assembly may include multiple focusing lenses, and the focusing lenses may correspond one-to-one to the beam adjusting elements to adjust the spot size and divergence angle of the output light beam of the corresponding beam adjusting element, but the present application does not limit this and it depends on the specific situation.

[0057] It should be noted that in some application scenarios, the hotspot distribution on heat sources such as electronic chips may change. Taking the CPU as an example, the CPU may include a first heat source and a second heat source. In a first time period, the electronic device where the CPU is located may be in one state, such as a video playback state. Accordingly, the temperature of the first heat source in the CPU is higher, and the position where the first heat source is located is a hotspot. In a second time period, the electronic device where the CPU is located may be in another state, such as a 3D modeling state. Accordingly, the temperature of the second heat source in the CPU is higher, and the position where the second heat source is located is a hotspot.

[0058] Therefore, in one embodiment of the present application, the testing device may further include: a first driving component, the first driving component may include multiple first driving elements, one first driving element may correspond to a beam adjusting element, and is used to adjust the inclination angle of the beam adjusting element to adjust the transmission direction of the light beam output by the beam adjusting element to adjust the position of the first light beam irradiated onto the heating surface of the heat dissipation module, so that when the hot spot distribution on the heat source such as the electronic chip changes, the preset position on the heating surface of the heat dissipation module corresponding to each first light beam also changes synchronously, thereby realizing the dynamic simulation of the hot spot distribution on the heat source, but the present application does not limit this, and it depends on the specific situation.

[0059] Optionally, based on the above embodiments, in one embodiment of the present application, the testing device may further include: a processing component, which may control the first driving element to adjust the inclination angle of the beam adjusting element based on the hotspot distribution of the heat source to be simulated when the heat dissipation module is applied to the electronic device, so as to automatically realize the dynamic simulation of the hotspot distribution on the heat source.

[0060] It should be noted that the test device provided in the embodiment of the present application includes a beam adjustment component, and the beam adjustment component includes multiple beam adjustment elements, one beam adjustment element corresponds to one first beam, so that the beam adjustment element corresponding to each first beam can be used to adjust its transmission direction, thereby reducing the restriction on the direction of the outgoing beam of the light source, and facilitating the flexible setting of each light source in the beam generating component.

[0061] Optionally, in one embodiment of the present application, the distance between the packaging shells of adjacent beam adjustment elements among the multiple beam adjustment elements gradually decreases in the direction approaching the heated surface, that is, the packaging shells of each beam adjustment element among the multiple beam adjustment elements are arranged in a cone, so that the testing device can be applied to the testing of some heat dissipation modules with a smaller heated surface area, and facilitates the compact design of the multiple beam adjustment elements and reduces the volume of the beam adjustment elements.

[0062] On the basis of the above embodiments, in one embodiment of the present application, the beam adjustment element and the light spot adjustment element can be integrated in the same packaging shell to improve the integration of the test device. Optionally, a beam adjustment element and its corresponding light spot adjustment element are packaged in the same packaging shell, and different beam adjustment elements and their corresponding light spot adjustment elements are packaged in different packaging shells.

[0063] Based on the above embodiments, in a possible embodiment of the present application, as Figure 2 and Figure 3 As shown, Figure 3 for Figure 2 In the top view, the distance between adjacent packaging shells 70 gradually decreases along the direction close to the heated surface of the heat dissipation module, that is, the packaging shells of the multiple beam adjustment elements are arranged in a cone, and the beam direction is the w direction, so that the test device can be applied to the test of some heat dissipation modules with smaller heated surface areas, and facilitate the compact design of the multiple beam adjustment elements and reduce the volume of the beam adjustment elements.

[0064] Optionally, in one embodiment of the present application, Figure 4 As shown, the testing device may include a workbench 100, and the workbench 100 may have a accommodating cavity. The heat dissipation module may be placed on the workbench 100, and the light beam generating element 10 may be located in the accommodating cavity of the workbench 100, and transmitted to a packaging shell that encapsulates the light beam adjusting element and the light spot adjusting element through a signal transmission element, but the present application does not limit this, and it depends on the specific situation.

[0065] In some possible applications, the position of the irradiation area formed by the light beam generated by the light beam generating assembly after being adjusted by the light beam adjusting assembly does not necessarily match the position of the area where the heating surface of the heat dissipation module is located, that is, the position of the irradiation area formed by the light beam generated by the light beam generating assembly after being adjusted by the light beam adjusting assembly does not necessarily cover the area where the heating surface of the heat dissipation module is located. Therefore, in one embodiment of the present application, Figure 4 As shown, the testing device may further include: a second driving component 80, which may be used to control the beam adjustment component to move in a direction parallel to the plane where the heat dissipation module is located (i.e., the workbench) and perpendicular to the plane where the heat dissipation module is located, so that the irradiation area formed by the beam generated by the beam generating component after adjustment by the beam adjustment component can cover the area where the heated surface of the heat dissipation module is located.

[0066] Optionally, in one embodiment of the present application, the second drive assembly can be a three-axis linear module, which is composed of linear modules in three directions of X, Y, and Z, respectively realizing left-right, front-back, and up-and-down linear motion, so as to control the movement of the beam adjustment assembly in a direction parallel to the plane where the heat dissipation module is located and perpendicular to the plane where the heat dissipation module is located, but the present application does not limit this, and it depends on the specific circumstances. Among them, the linear module, also known as a linear module or a linear motion system, is a transmission device for realizing linear motion, which is composed of a series of interconnected transmission components, and is driven by a motor or other power source to realize precise linear motion. The linear module usually includes key components such as guide rails, sliders, screws or transmission belts, and drive devices, which work together to ensure that the module performs reciprocating linear motion in a given direction.

[0067] In some possible applications, the heating surface of the heat dissipation module may be parallel to the placement plane of the heat dissipation module, may be perpendicular to the placement plane of the heat dissipation module, or may be at other angles to the placement plane of the heat dissipation module. Therefore, in one embodiment of the present application, continue as follows Figure 4 As shown, the testing device may further include: a third driving component 90, which may be used to control the flipping of the beam adjustment component so that no matter what angle the heated surface of the heat dissipation module is with the placement plane of the heat dissipation module, the outgoing light beam of the beam adjustment component may be irradiated onto the heated surface of the heat dissipation module.

[0068] Optionally, in one embodiment of the present application, the third driving assembly may be a flipping mechanism to control the flipping of the light beam adjustment assembly, but the present application does not limit this, and it depends on the specific circumstances. Specifically, in one embodiment of the present application, the packaging shell of the light beam adjustment assembly may be fixedly connected to the third driving assembly through a fixing element, but the present application does not limit this, and it depends on the specific circumstances.

[0069] Based on any of the above embodiments, in one embodiment of the present application, continue as follows Figure 4 As shown, the testing device may further include: a fixture flipping assembly 110, which can be used to fix the heat dissipation module, flip the heat dissipation module, and adjust the direction of the heating surface of the heat dissipation module to facilitate the heating surface of the heat dissipation module to receive the light beam irradiation, but the present application does not limit this, and it depends on the specific situation.

[0070] On the basis of any of the above embodiments, in one embodiment of the present application, the testing device may further include a processing component, and the processing component determines whether the heat dissipation design in the electronic device meets the preset conditions based on the performance parameters of the heat dissipation module. Optionally, the processing component may determine whether the temperature of the heat dissipation module meets the preset conditions when the temperature of the heat dissipation module reaches a stable state, so as to determine whether the heat dissipation design in the electronic device meets the requirements. Wherein, when the temperature of the heat dissipation module reaches a stable state, the temperature at the same position in the heat dissipation module no longer changes, or changes little. For example, when the temperature of the heat dissipation module reaches a stable state, the difference between the highest temperature and the lowest temperature at the same position in the heat dissipation module is not greater than 10°C, or not greater than 5°, etc. This application does not limit this, and it depends on the specific circumstances.

[0071] In some applications, the processing component determines the heat dissipation capacity of the heat dissipation module based on the performance parameters of the heat dissipation module. In this embodiment, the preset condition includes at least one of the following:

[0072] When the temperature of the heat dissipation module reaches a stable state, the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module is lower than a first value, and there is a first distance between the proximal end of the preset position and the preset position, and the larger the first distance, the smaller the first value;

[0073] The difference between the temperature at the proximal end of the preset position of the heating surface of the heat dissipation module and the temperature at the preset position is greater than a second value. There is a first distance between the proximal end of the preset position and the preset position. The larger the first distance, the larger the second value.

[0074] It should be noted that, when the temperature of the heat dissipation module reaches a stable state, the temperature near the preset position of the heating surface of the heat dissipation module is lower than the first value, indicating that the heat dissipation efficiency of the heat dissipation module is high and the heat dissipation capacity is strong; the difference between the temperature near the preset position of the heating surface of the heat dissipation module and the temperature to be simulated at the hot spot position corresponding to the preset position is greater than the second value, indicating that the heat dissipation efficiency of the heat dissipation module is high and the heat dissipation capacity is strong.

[0075] In some other applications, the processing component determines the heat transfer capacity of the heat dissipation module based on the performance parameters of the heat dissipation module. In this embodiment, the preset condition includes at least one of the following:

[0076] When the temperature of the heat dissipation module reaches a stable state, the temperature of the far end of the preset position of the heating surface of the heat dissipation module is higher than a third value, and there is a second distance between the far end of the preset position and the preset position, and the greater the second distance, the smaller the third value;

[0077] When the temperature of the heat dissipation module reaches a stable state, the difference between the temperature of the far end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is less than a fourth value, and there is a second distance between the far end of the preset position and the preset position, and the larger the second distance, the larger the fourth difference.

[0078] It should be noted that, when the temperature of the heat dissipation module reaches a stable state, the temperature at the far end of the preset position of the heating surface of the heat dissipation module is higher than the third value, indicating that the thermal conductivity of the heat dissipation module is strong; the difference between the temperature at the far end of the preset position of the heating surface of the heat dissipation module and the temperature to be simulated at the hot spot position corresponding to the preset position is less than the fourth value, indicating that the thermal conductivity of the heat dissipation module is strong.

[0079] In some other applications, the processing component determines at least one of the heat dissipation capacity and the heat transfer capacity of the heat dissipation module based on the performance parameters of the heat dissipation module. In this embodiment, the preset condition includes at least one of the following:

[0080] When the temperature of the heat dissipation module reaches a stable state, the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module is lower than a first value, and there is a first distance between the proximal end of the preset position and the preset position, and the larger the first distance, the smaller the first value;

[0081] The difference between the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is greater than a second value, and there is a first distance between the proximal end of the preset position and the preset position, and the greater the first distance, the greater the second value;

[0082] When the temperature of the heat dissipation module reaches a stable state, the temperature of the far end of the preset position of the heating surface of the heat dissipation module is higher than a third value, and there is a second distance between the far end of the preset position and the preset position, and the greater the second distance, the smaller the third value;

[0083] When the temperature of the heat dissipation module reaches a stable state, the difference between the temperature of the far end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is less than a fourth value, and there is a second distance between the far end of the preset position and the preset position, and the larger the second distance, the larger the fourth difference.

[0084] It should be noted that in the above embodiments, the second distance is greater than the first distance, that is, the distal end of the preset position is a position in the heat dissipation module that is farther away from the preset position, and the proximal end of the preset position is a position in the heat dissipation module that is closer to the preset position.

[0085] In other embodiments of the present application, the preset condition may further include other conditions, which are not limited in the present application and depend on the specific application scenario.

[0086] Optionally, in one embodiment of the present application, continue as Figure 4 As shown, the testing device further includes an industrial computer 120, and the processing component can be integrated in the industrial computer, which is not limited in the present application and depends on the specific circumstances.

[0087] In one embodiment of the present application, when multiple heat dissipation modules to be tested are placed on the workbench, the industrial computer can also be used for automated testing of the multiple heat dissipation modules, that is, the heat dissipation capacity of each heat dissipation module is tested one by one according to a certain path trajectory, but the present application does not limit this and it depends on the specific situation.

[0088] Based on any of the above embodiments, in one embodiment of the present application, the testing device may further include a power monitoring component for monitoring the power of the light beam generating component, but the present application does not limit this and it depends on the specific circumstances.

[0089] It should be noted that the beam generating component continuously emits a beam, which will also generate heat. When the heat generated by the beam generating component is high and is not discharged in time, resulting in the temperature of the beam generating component being too high, it will also affect the working efficiency of the beam generating component. Therefore, in one embodiment of the present application, the test device may also include: a cooling component, which can be used to dissipate heat for the light source to avoid the temperature of the light source being too high and affecting the operation of the light source. Optionally, the cooling component may be a horizontal laser chiller or other cooling device, but the present application does not limit this, and it depends on the specific situation.

[0090] It should also be noted that in some applications, when the number of hot spots on the heat source is slightly greater than the number of light sources in the light beam generating assembly, so that the light sources and the hot spots cannot satisfy a one-to-one correspondence, the test device provided in the embodiment of the present application can also add a spectroscope in part of the light path of the light spot adjustment assembly to use the spectroscope to split the light emitted by a light source, so that one light source can simulate the distribution of two hot spots. Optionally, Figure 5 As shown, the test device can also add a beam splitter 313 in the optical path of the partial spot adjustment element 31 of the spot adjustment component 30, so that the light beam emitted by a light source 11 can be divided into two first light beams 201, thereby simulating the distribution of two hot spots. Figure 5 As shown, in the present embodiment, among some of the multiple light sources 11, one of the light sources 112 may correspond to one of the preset positions, and the first light beam 201 corresponding to the light source 112 may be used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position; among some of the multiple light sources 11, one of the light sources 111 may correspond to at least two of the preset positions, and the first light beam 201 corresponding to the light source 111 may be used to adjust the temperature of the preset position corresponding to the preset position to simulate the temperature of the hot spot position corresponding to the preset position, so as to utilize a smaller number of light sources 11 to simulate the temperatures of more hot spot positions, thereby reducing the cost of the testing device while improving the versatility of the testing device.

[0091] It should be noted that in some applications, in the test device, one light source may correspond to two preset positions to simulate the temperature of two hot spot positions, or two light sources may correspond to two preset positions to simulate the temperature of two hot spot positions, or other numbers of light sources may correspond to other numbers of preset positions to simulate the temperature of other numbers of hot spot positions, such as two light sources corresponding to three preset positions, or three light sources corresponding to four preset positions, or three light sources corresponding to five preset positions, etc. The present application does not limit this and it depends on the specific circumstances.

[0092] From the above, it can be seen that the testing device provided in the embodiment of the present application can process the light beams generated by multiple light sources and irradiate them onto the heating surface of the heat dissipation module, thereby simulating the heating effect of uneven heat sources such as electronic chips with multiple hot spots, providing a more realistic working condition for the testing of the heat dissipation module and making the test results more accurate.

[0093] In addition, the present application embodiment also provides a testing method, which can be applied to the testing device provided in any of the above embodiments. Figure 6 As shown, the test method includes:

[0094] Fixing the heat dissipation module to be tested on a workbench in the test device;

[0095] The beam adjustment component in the test device is adjusted so that after the beam generating component of the test device is subsequently started, the beam adjustment component can adjust the transmission direction of the beams emitted by the multiple light sources in the beam generating component to form multiple first beams to irradiate the preset positions of the heating surface of the heat dissipation module, one of the preset positions corresponds to a hot spot position of a heat source in the electronic device when the heat dissipation module is applied to the electronic device, one of the light sources corresponds to one of the preset positions, and the first beam corresponding to the light source is used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position;

[0096] activating a light beam generating component of the testing device;

[0097] After the temperature of the heat dissipation module reaches a stable state, the performance parameters of the heat dissipation module are detected by using the detection component in the test device. The performance parameters characterize the heat dissipation capacity of the heat dissipation module, so as to determine the quality of the heat transfer performance of the heat dissipation module. When the temperature of the heat dissipation module reaches a stable state, the temperature at the same position in the heat dissipation module no longer changes, or changes slightly. For example, when the temperature of the heat dissipation module reaches a stable state, the difference between the highest temperature and the lowest temperature at the same position in the heat dissipation module is not greater than 10°C, or not greater than 5°, etc. This application does not limit this, and it depends on the specific situation.

[0098] Uninstalling the heat dissipation module;

[0099] Turn off the beam generating assembly.

[0100] Optionally, in one embodiment of the present application, the beam adjustment component may include a plurality of beam adjustment elements, and the beam adjustment elements correspond one to one with the light sources in the beam generating element. In this embodiment, Figure 6As shown, adjusting the light beam adjustment component may include: adjusting the x-axis reflector and the y-axis reflector of each light beam adjustment element so that the light beam emitted by each light source can be irradiated to its corresponding preset position.

[0101] Based on the above embodiments, in one embodiment of the present application, Figure 6 As shown, the method may also include, before adjusting the beam adjustment component: adjusting the magnification of the beam expander of the spot adjustment component in the test device to adjust the spot size of the light beam output by each light source so that the spot area formed when it is irradiated to the preset position matches the area of ​​its corresponding hot spot position.

[0102] Based on any of the above embodiments, in one embodiment of the present application, Figure 6 As shown, before adjusting the beam adjustment component and the spot adjustment component, the method may also include: starting the temperature measuring component in the test device to monitor the temperature of each preset position after starting the beam generating component, and starting the power monitoring component in the test device to monitor the power of each light source in the beam generating component after starting the beam generating component; and closing the temperature measuring component and the power monitoring component after unloading the heat dissipation module.

[0103] In summary, the test device and test method provided in the embodiments of the present application can focus on the heat transfer performance test link of the heat dissipation module, use light sources such as lasers as heating sources, and heat the heat dissipation module by multiple laser beams to simulate the multi-hotspot heating effect of uneven heat sources such as electronic chips. Each laser beam corresponds to an optical path, and each optical path completes the simulation of a hotspot. Each optical path is independently controlled and does not affect each other. The optical paths work together to achieve heating at the entire chip level, thereby providing a more realistic working condition for the power testing process of the heat dissipation module for electronic chips, so as to obtain a more accurate heat transfer performance evaluation result of the heat dissipation module.

[0104] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0105] It should be noted that in the description of the present application, it should be understood that the description of the drawings and embodiments is illustrative rather than restrictive. The same reference numerals throughout the embodiments of the specification identify the same structure. In addition, for the sake of understanding and ease of description, the drawings may exaggerate the thickness of some layers, films, panels, regions, etc. It is also understood that when an element such as a layer, film, region, or substrate is referred to as "on" another element, the element may be directly on the other element or there may be an intermediate element. In addition, "on" refers to positioning an element on or below another element, but does not essentially refer to positioning on the upper side of another element according to the direction of gravity.

[0106] The terms "upper", "lower", "top", "bottom", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0107] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0108] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A testing device, comprising: a light beam generating assembly, the light beam generating assembly comprising a plurality of light sources; A beam adjustment component, the beam adjustment component is used to adjust the transmission direction of the light beams emitted by the multiple light sources, so as to form multiple first light beams to irradiate preset positions of the heating surface of the heat dissipation module, one of the preset positions corresponds to a hot spot position of a heat source in the electronic device when the heat dissipation module is applied to the electronic device, one of the light sources corresponds to one of the preset positions, and the first light beam corresponding to the light source is used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position; A detection component is used to detect performance parameters of the heat dissipation module, and the performance parameters represent the heat dissipation capacity of the heat dissipation module.

2. The testing device according to claim 1, further comprising: The light spot adjustment component is used to adjust the light spots of the light beams output by the multiple light sources so that the light spot area formed by the first light beam corresponding to the light source irradiating the preset position matches the area of ​​the hot spot position.

3. According to the testing device of claim 2, the spot adjustment component comprises a plurality of spot adjustment elements, one of the spot adjustment elements corresponds to one of the light sources, and the spot adjustment element comprises a beam expander arranged along a transmission direction of the light beam emitted by the corresponding light source.

4. According to the testing device according to claim 1, the beam adjustment assembly includes multiple beam adjustment elements, one beam adjustment element corresponds to one first beam, and is used to adjust the transmission direction of the first beam to adjust the position of the first beam irradiated on the heating surface of the heat dissipation module.

5. The testing device according to claim 4, wherein the beam adjustment element comprises a first reflector group and a second reflector group, wherein: The first reflector group is used to adjust the position of the light spot of the first light beam in the first direction on the heated surface of the heat dissipation module, and the second reflector group is used to adjust the position of the light spot of the first light beam in the second direction on the heated surface of the heat dissipation module. The first direction and the second direction are parallel to the heated surface of the heat dissipation module, and the first direction and the second direction are different.

6. The testing device according to claim 4, further comprising: The first driving component includes a plurality of first driving elements, one of the first driving elements corresponds to one of the beam adjusting elements, and is used to adjust the inclination angle of the beam adjusting element to adjust the transmission direction of the light beam output by the beam adjusting element to adjust the position of the first light beam irradiated on the heat dissipation module.

7. The testing device according to claim 6, further comprising: The processing component is also used to control the first driving element to adjust the tilt angle of the beam adjusting element based on the hot spot distribution of the heat source to be simulated when the heat dissipation module is applied to the electronic device.

8. The testing device according to claim 1, further comprising: A second driving component, the second driving component is used to control the light beam adjustment component to move in a direction parallel to the plane where the heat dissipation module is located and in a direction perpendicular to the plane where the heat dissipation module is located.

9. The testing device according to claim 1, wherein among some of the multiple light sources, one light source corresponds to one preset position, and the first light beam corresponding to the light source is used to adjust the temperature of the preset position to simulate the temperature of the hot spot position corresponding to the preset position; wherein among some of the multiple light sources, one light source corresponds to at least two preset positions, and the first light beam corresponding to the light source is used to adjust the temperature of the corresponding preset position to simulate the temperature of the hot spot position corresponding to the preset position.

10. The testing device according to claim 1, further comprising a processing component, wherein the processing component is used to determine whether the temperature of the heat dissipation module meets a preset condition when the temperature of the heat dissipation module reaches a stable state, and when the temperature of the heat dissipation module reaches a stable state, the difference between the highest temperature and the lowest temperature at the same position in the heat dissipation module is not greater than 10°C; The preset condition includes at least one of the following conditions: When the temperature of the heat dissipation module reaches a stable state, the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module is lower than a first value, and there is a first distance between the proximal end of the preset position and the preset position, and the larger the first distance, the smaller the first value; The difference between the temperature of the proximal end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is greater than a second value, and there is a first distance between the proximal end of the preset position and the preset position, and the greater the first distance, the greater the second value; When the temperature of the heat dissipation module reaches a stable state, the temperature of the far end of the preset position of the heating surface of the heat dissipation module is higher than a third value, and there is a second distance between the far end of the preset position and the preset position, and the greater the second distance, the smaller the third value; When the temperature of the heat dissipation module reaches a stable state, the difference between the temperature of the far end of the preset position of the heating surface of the heat dissipation module and the temperature of the preset position is less than a fourth value, and there is a second distance between the far end of the preset position and the preset position, and the larger the second distance, the larger the fourth difference; Wherein, the second distance is greater than the first distance.

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