Non-adhesive micro-slice manufacturing method

Abstract

The invention belongs to the technical field of circuit board manufacturing, particularly relates to a manufacturing method of a glue-free micro-section, and provides the following scheme aiming at the problems that an existing traditional micro-section glue pouring method is tedious in process and high in cost, and observation position deviation, in-hole glue interference, uneven observation surface and the like are easily caused. Comprising the following steps: S1, selecting a proper position on a circuit board, marking the position of a micro-section to be manufactured, and then cutting and sampling the marked position to obtain a micro-section sample; s2, the cut micro-section sample is subjected to surface treatment, it is ensured that the micro-section sample is regular in shape and clean in surface, and the area to be observed is obvious, and according to the manufacturing method of the non-glue micro-section, the manufacturing time and cost are remarkably reduced, and the tedious process of traditional glue pouring is abandoned; the micro-slice is fixed by adopting the transparent acrylic plate and the silica gel sheet, and an efficient and stable fixing effect is realized by combining with the adjustable clamp; in addition, the glue-free design prevents interference of foreign matters in the hole, and accuracy and reliability of observation are improved.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board manufacturing, and in particular to a method for manufacturing glue-free micro-slices. Background Art

[0002] In the manufacturing and development of electronic products, the quality of circuit boards, the occurrence and resolution of problems, process improvements, etc. all require microsectioning as a basis for observation, research and judgment. The traditional microsectioning method usually uses a glue pouring method, that is, the microsection sample is fixed in a mold, and then epoxy resin glue or acrylic powder is poured in for curing. However, this method has many shortcomings:

[0003] First, the glue pouring process is cumbersome and requires a lot of time for operations such as glue mixing, stirring, vacuuming and curing, which increases the production cost; second, the colloid can easily flow into the hole during the glue pouring process, affecting the effective observation of foreign matter and characteristic information in the hole; in addition, the samples fixed by glue pouring are prone to deviation and edge copper grinding during the grinding process, resulting in the observation surface not being on the same level, which in turn affects the clarity and accuracy of metallographic observation.

[0004] In view of the above problems, the present invention document proposes a method for making glue-free micro-sectioning. Summary of the invention

[0005] The purpose of the present invention is to solve the shortcomings of the traditional micro-slice glue filling method in the prior art, such as complicated process, high cost, easy to cause observation position deviation, colloid interference in the hole and uneven observation surface, and to propose a glue-free micro-slice production method.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A method for making glue-free microsections, comprising the steps of:

[0008] S1, selecting a suitable position on the circuit board, marking the position of the micro-slice to be produced, and then cutting and sampling the marked position to obtain a micro-slice sample;

[0009] S2. Surface treatment is performed on the cut micro-section samples to ensure that they have regular shapes, clean surfaces, and obvious areas to be observed;

[0010] S3, fixing the surface-treated micro-section sample, using two transparent silicone sheets and two transparent acrylic plates to match the micro-section sample to form a combination of transparent acrylic plates, transparent silicone sheets, micro-section samples, transparent silicone sheets, and transparent acrylic plates stacked in sequence, and then using two clamps to clamp and fix the combination;

[0011] S4. Further processing the assembly, including grinding, polishing, and micro-etching, to ensure that the area to be observed is obvious;

[0012] S5. Perform metallographic or SEM observation on the processed micro-section samples.

[0013] In a possible design, the clamp consists of a mounting frame, a first clamping plate and a second clamping plate, the first clamping plate is fixedly mounted on one side of the mounting frame, the second clamping plate is located above the first clamping plate, a moving block is fixedly mounted on one side of the second clamping plate, a sliding groove is opened on one side of the mounting frame, one end of the moving block passes through the sliding groove and is slidably connected to the inner wall of the sliding groove, a moving plate is fixedly mounted on one end of the moving block, the moving plate is located in the mounting frame, a screw is rotatably penetrated at the top of the mounting frame, one end of the screw is rotatably connected to the bottom inner wall of the mounting frame, the moving plate is threadedly connected to the outer wall of the screw, for completing the height adjustment of the second clamping plate, a knob is fixedly mounted on the top of the screw, and the knob is used to facilitate the rotation of the screw.

[0014] In a possible design, rubber pads are fixedly mounted on the sides of the first clamping plate and the second clamping plate that are close to each other, and the two rubber pads cooperate with each other to ensure stable clamping of the assembly and avoid damage to the assembly.

[0015] In a possible design, in step S1, the actual cutting position should be 2 to 5 mm away from the position to be observed.

[0016] In a possible design, the surface treatment in step S2 further includes preliminary grinding of the burrs of the cut micro-section sample, and ensuring that the observation side thereof is ground to a distance of 10 um to 50 um from the edge of the observation position.

[0017] In a possible design, the surface treatment in step S2 further includes performing pure water ultrasonic cleaning on the ground micro-section sample for 2-4 minutes, and drying the cleaned micro-section sample.

[0018] In a possible design, the thickness of the transparent acrylic plate is 1.8 mm to 2.2 mm, and the thickness of the transparent silicone sheet is 0.8 mm to 1.2 mm.

[0019] In a possible design, in step S4, when grinding the assembly, sandpaper with mesh sizes from low to high should be used in sequence, generally P120, P400, P800, P1200, P2400, and P4000.

[0020] Beneficial effects: In the present invention, the glue-free micro-slice production method eliminates the glue pouring process of the traditional glue pouring method, avoids the cumbersome glue mixing, stirring, vacuuming and curing operations, thereby significantly reducing the production time and cost;

[0021] In the present invention, the glue-free micro-sectioning method achieves an effect similar to that of glue-filling fixation by fixing the micro-sectioning sample with a transparent acrylic plate and a transparent silicone sheet; at the same time, by fixing with a clamp, the operation is simple, the clamp can adapt to assemblies of various thicknesses, the clamping force is adjustable, and damage to the micro-sectioning sample can be avoided, thereby ensuring a good fixation effect on the micro-sectioning sample;

[0022] In the present invention, the glue-free micro-sectioning method can more effectively observe foreign matter and characteristic information in the hole because no glue flows into the hole, thereby improving the accuracy and reliability of observation; at the same time, since supporting materials are provided on both sides of the sample during the grinding process, problems such as deviation and edge copper grinding are avoided, ensuring that the observation surface is on the same horizontal plane, thereby improving the clarity and accuracy of metallographic observation;

[0023] In the present invention, the glue-free micro-sectioning production method significantly reduces the production time and cost, and abandons the cumbersome process of traditional glue filling; by using transparent acrylic plates and silicone sheets to fix the micro-sections, combined with adjustable clamps, an efficient and stable fixing effect is achieved to avoid sample damage; in addition, the glue-free design prevents interference from foreign matter in the hole, improves the accuracy and reliability of observation, and at the same time, supports are provided on both sides of the sample to avoid offset and edge copper grinding during the grinding process, ensuring the level of the observed surface, thereby significantly improving the clarity and accuracy of metallographic observation. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A schematic diagram of the three-dimensional structure of a method for making glue-free micro-sectioning proposed by the present invention;

[0025] Figure 2 A schematic cross-sectional view of a method for making glue-free micro-sectioning according to the present invention;

[0026] Figure 3 This is a schematic diagram of a fixture structure for a method for making glue-free micro-sectioning proposed by the present invention.

[0027] In the figure: 1. microsection sample; 2. transparent silicone sheet; 3. transparent acrylic plate; 4. fixture; 5. mounting frame; 6. first clamping plate; 7. screw; 8. knob; 9. slide groove; 10. moving plate; 11. moving block; 12. second clamping plate; 13. rubber pad. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0029] Example 1: Reference Figure 1-3 , a micro-sectioning method, the specific steps include:

[0030] S1. Mark the position of the micro-slice to be produced. Select a suitable position on the circuit board and mark it with a marking pen or a laser marking machine to ensure that the marked position is accurate. Then, use a precision cutting tool to cut and sample the marked position to obtain a micro-slice sample 1.

[0031] S2. Surface treatment is performed on the cut micro-slice sample 1. Specifically, the burrs of the micro-slice sample 1 are preliminarily ground to ensure that the shape is regular. Then, the micro-slice sample 1 is cleaned using a pure water ultrasonic cleaning device for 3 minutes to remove impurities and stains generated during the grinding process. After cleaning, the micro-slice sample 1 is dried using a drying device to ensure that the surface is clean and the area to be observed is obvious.

[0032] S3, fix the surface treated micro-section sample 1. Use two transparent silicone sheets 2 and two transparent acrylic plates 3 to match the micro-section sample 1 to form a combination of transparent acrylic plates 3, transparent silicone sheets 2, micro-section sample 1, transparent silicone sheets 2, and transparent acrylic plates 3 stacked in sequence. Then, use two clamps 4 to clamp and fix the combination.

[0033] In this embodiment, the clamp 4 is composed of a mounting frame 5, a first clamping plate 6 and a second clamping plate 12. The first clamping plate 6 is fixedly mounted on one side of the mounting frame 5, and the second clamping plate 12 is located above the first clamping plate 6 and is slidably connected to the mounting frame 5. The screw rod 7 is rotated by rotating the knob 8, so that the moving plate 10 drives the moving block 11 to slide along the slide groove 9, thereby adjusting the height of the second clamping plate 12 to achieve stable clamping of the assembly.

[0034] S4. Further process the assembly. Grind the assembly with sandpaper of mesh size P120, P400, P800, P1200, P2400, and P4000 in turn to ensure that the area to be observed is obvious. Then, polish the assembly to remove scratches and stains generated during the grinding process. Finally, use micro-etching liquid to micro-etch the assembly to further highlight the details of the area to be observed.

[0035] S5. Perform metallographic or SEM observation on the processed micro-section sample 1. Place the assembly on a stage of a metallographic microscope or a scanning electron microscope, adjust observation parameters, and observe and analyze the micro-section sample 1.

[0036] The present application can be used in the field of circuit board manufacturing technology, and can also be used in other fields applicable to the present application.

[0037] Example 2: Reference Figure 1 , 3 , based on the improvement of Example 1: a method for making glue-free micro-slices, which is applied to the technical field of circuit board manufacturing;

[0038] In this embodiment, in step S1, the actual cutting position should be 2-5 mm away from the position to be observed to ensure that the area to be observed will not be damaged during the cutting process.

[0039] In this embodiment, a rubber pad 13 is fixedly mounted on the side where the first clamping plate 6 and the second clamping plate 12 of the clamp 4 are close to each other. The rubber pad 13 can increase the friction between the clamp 4 and the assembly to ensure the stability of the clamping of the assembly. At the same time, the rubber pad 13 can also play a buffering role to prevent the clamp 4 from causing damage to the assembly.

[0040] In this embodiment, the thickness of the transparent acrylic plate 3 is 2 mm, and the thickness of the transparent silicone sheet 2 is 1 mm. This ensures that the overall thickness of the assembly is moderate, which is convenient for subsequent processing and observation.

[0041] The working principle and use process of this technical solution are as follows: First, select a suitable position on the circuit board to accurately mark the position of the micro-slice to be produced. After the marking is completed, the marked position is cut and sampled to obtain a micro-slice sample 1. The actual cutting position should be 2 to 5 mm away from the position to be observed to ensure that the observation area will not be damaged during the cutting process;

[0042] Then, the cut micro-slice sample 1 is surface treated to achieve the purpose of regular shape, clean surface and obvious observation area. The specific treatment steps include: preliminary grinding of the burrs of the micro-slice sample 1 to 10um to 50um away from the edge of the observation position to ensure that the edge of the micro-slice sample 1 is regular and the observation area is obvious; then, the ground micro-slice sample 1 is ultrasonically cleaned with pure water for 3 minutes to completely remove impurities and grinding particles on the sample surface; finally, the cleaned micro-slice sample 1 is dried to ensure that the sample surface is dry and free of moisture;

[0043] Next, the surface-treated micro-section sample 1 is fixed. Specifically, two transparent silicone sheets 2 and two transparent acrylic plates 3 are used to cooperate with the micro-section sample 1 to form a combination of the transparent acrylic plate 3, the transparent silicone sheet 2, the micro-section sample 1, the transparent silicone sheet 2, and the transparent acrylic plate 3 stacked in sequence; the thickness of the transparent acrylic plate 3 is controlled to be 2 mm, and the thickness of the transparent silicone sheet 2 is controlled to be 1 mm;

[0044] Next, the assembly is clamped and fixed by two clamps 4; when the clamp 4 is in use, the height of the second clamping plate 12 can be adjusted by turning the knob 8 at the top of the screw rod 7, and then the assembly is clamped between the first clamping plate 6 and the second clamping plate 12, and then the knob 8 is turned in the opposite direction to achieve the clamping of the assembly; a rubber pad 13 is fixedly installed on the side where the first clamping plate 6 and the second clamping plate 12 are close to each other to ensure the stability of the clamping of the assembly and avoid damage to the assembly;

[0045] After that, the fixed assembly is further processed, including grinding, polishing and micro-etching. During the grinding process, sandpaper with low to high grit should be used in sequence, generally P120, P400, P800, P1200, P2400, P4000, to ensure the flatness and smoothness of the surface of the assembly. Polishing and micro-etching are used to further remove surface grinding marks, defects and impurities, making the area to be observed more obvious.

[0046] After the processing is completed, the micro-section sample 1 is subjected to metallographic or SEM observation; through the observation, the tiny structures and details inside the circuit board can be clearly seen, which can provide strong support for the research and development and improvement of the circuit board.

[0047] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A method for making glue-free micro-sectioning, characterized in that: Includes steps: S1, selecting a suitable position on the circuit board, marking the position of the micro-slice to be produced, and then cutting and sampling the marked position to obtain a micro-slice sample (1); S2. Surface treatment is performed on the cut micro-section sample (1) to ensure that the sample has a regular shape, a clean surface, and a clear area to be observed; S3, fixing the surface-treated micro-section sample (1), using two transparent silicone sheets (2), two transparent acrylic plates (3) to cooperate with the micro-section sample (1), to form a combination of the transparent acrylic plate (3), the transparent silicone sheet (2), the micro-section sample (1), the transparent silicone sheet (2), and the transparent acrylic plate (3) stacked in sequence, and then using two clamps (4) to complete the clamping and fixing of the combination; S4. Further processing the assembly, including grinding, polishing, and micro-etching, to ensure that the area to be observed is obvious; S5. Perform metallographic or SEM observation on the processed micro-section sample (1).

2. The method for making glue-free micro-sectioning according to claim 1, characterized in that: The clamp (4) is composed of a mounting frame (5), a first clamping plate (6) and a second clamping plate (12), wherein the first clamping plate (6) is fixedly mounted on one side of the mounting frame (5), the second clamping plate (12) is located above the first clamping plate (6), a moving block (11) is fixedly mounted on one side of the second clamping plate (12), a sliding groove (9) is provided on one side of the mounting frame (5), one end of the moving block (11) passes through the sliding groove (9) and is slidably connected to the inner wall of the sliding groove (9), and the moving block (11) is fixedly mounted on one side of the second clamping plate (12). ) is fixedly mounted on one end thereof with a movable plate (10), the movable plate (10) being located in the mounting frame (5), the top of the mounting frame (5) being rotatably penetrated by a screw rod (7), one end of the screw rod (7) being rotatably connected to the bottom inner wall of the mounting frame (5), the movable plate (10) being threadedly connected to the outer wall of the screw rod (7) for completing the height adjustment of the second clamping plate (12), the top end of the screw rod (7) being fixedly mounted with a knob (8), the knob (8) being used for facilitating the rotation of the screw rod (7).

3. The method for making glue-free micro-sectioning according to claim 2, characterized in that: A rubber pad (13) is fixedly mounted on one side of the first clamping plate (6) and the second clamping plate (12) that are close to each other. The two rubber pads (13) cooperate with each other to ensure stable clamping of the assembly and avoid damage to the assembly.

4. The method for making glue-free microsectioning according to claim 1, characterized in that: In the step S1, the actual cutting position should be 2-5 mm away from the position to be observed.

5. The method for making glue-free micro-sectioning according to claim 1, characterized in that: The surface treatment in step S2 also includes preliminary grinding of the burrs of the cut micro-section sample (1), and ensuring that the observation side thereof is ground to a distance of 10 um to 50 um from the edge of the observation position.

6. The method for making glue-free micro-sectioning according to claim 5, characterized in that: The surface treatment in step S2 further comprises performing pure water ultrasonic cleaning on the ground micro-section sample (1), the cleaning time being 2-4 minutes, and drying the cleaned micro-section sample (1).

7. The method for making glue-free micro-sectioning according to claim 1, characterized in that: The thickness of the transparent acrylic plate (3) is 1.8 mm to 2.2 mm, and the thickness of the transparent silicone sheet (2) is 0.8 mm to 1.2 mm.

8. The method for making glue-free micro-sectioning according to claim 1, characterized in that: In the step S4, when grinding the assembly, sandpaper with mesh sizes from low to high should be used in sequence, generally P120, P400, P800, P1200, P2400, and P4000.

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