High-isolation miniaturized internal calibration assembly

Abstract

The invention discloses a high-isolation miniaturized internal calibration assembly which comprises a chip, a resistance-capacitance device, a gold wire, an LTCC substrate, a cover plate, an absorber, an enclosure frame, a bottom plate and a connector. And the chip is glued in the dug cavity of the LTCC substrate and is bonded with the micro-strip bonding pad in the LTCC substrate through the gold wire. According to the internal calibration assembly, high-performance calibration is achieved, and various amplitude-phase control such as direct connection, amplification and attenuation is provided; comprising a power supply interface, a control interface and a microwave interface, and has the characteristics of high isolation, high-speed control, multiple functions, miniaturization and the like; the complexity and development cost of the internal calibration system can be greatly reduced, high-precision multi-mode calibration measurement of the antenna array plane is realized, and the array plane test efficiency is improved.

Description

Technical Field

[0001] The invention belongs to the field of antenna and microwave technology, and in particular relates to a high-isolation miniaturized internal calibration component. Background Art

[0002] Spaceborne radar is a radar system installed on artificial satellites, which can effectively improve air surveillance capabilities. The coverage area of ​​one spaceborne radar is equivalent to that of dozens of ground radars of the same size. In addition, the carrier has strong survivability and is not easily destroyed.

[0003] As the development of spaceborne radars shows a trend of high integration, large aperture, and high power, the interconnection complexity and multi-wavelength testing of active phased array antennas require a lot of time and cost. In addition, a large number of cables will be disassembled and assembled during the antenna's entry and exit of the darkroom and assembly and transportation process, causing amplitude and phase changes, which cannot meet the system accuracy requirements. Therefore, the antenna array surface is required to have a calibration function to achieve the measurement of parameters such as the amplitude and phase errors of the RF transceiver system; at the same time, due to the increase in integration and power, the local electromagnetic environment is becoming increasingly complex, and the mutual coupling problem between calibration links is gradually highlighted. Conventional calibration systems can no longer achieve high isolation and miniaturized calibration measurements in a limited space. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a high-isolation miniaturized internal calibration component, including a chip, a resistor and capacitor component, a gold wire, an LTCC substrate, a cover plate, an absorber, a frame, a bottom plate, and a connector; the chip is glued into the cavity of the LTCC substrate and bonded to the microstrip pad inside the LTCC substrate through the gold wire.

[0005] Specifically, the connector is arranged on the side of the frame, and the calibration signal enters the strip lines of different layers in the substrate through the connector, and is transmitted up and down through the gold wire, chip, and LTCC substrate to achieve high isolation characteristics.

[0006] Specifically, the power control signal enters the chip on the surface of the LTCC substrate through the connector, and realizes real-time high-speed control of different calibration modes under the impedance matching, filtering and energy storage of the resistor and capacitor components.

[0007] Specifically, the resistor and capacitor components are welded on the surface of the LTCC substrate, the chip is glued, and after the gold wire bonds are completed, they are integrated with the connector, frame, bottom plate, cover plate, and absorber through a micro-assembly process.

[0008] Specifically, the external interfaces of the connector include a power interface, a control interface, and a radio frequency interface.

[0009] Specifically, a multi-stage switch chip, an attenuator chip, a coupler chip, a low noise amplifier chip, a power amplifier, and a circulator chip are used to realize the RF channel switching function of different calibration signals on a multi-layer circuit board carrier, and it has reference calibration, transmission calibration, and reception calibration modes; the RF channel switching function includes pass-through, attenuation, amplification, and coupling.

[0010] Specifically, the chip includes a single-ended to differential chip. The power supply and control signals are routed through layers inside the LTCC substrate through resistors and capacitors and the single-ended to differential chip, thereby controlling the on, off, amplification and attenuation functions of the RF signal in real time and at high speed.

[0011] Compared with the prior art, the present invention has the following advantages:

[0012] 1. Miniaturization. Traditional calibration systems use cables and mechanical switches to form calibration networks, which are complex and occupy an area orders of magnitude higher than that of micro-assembly components. As spaceborne radars develop towards multi-functional, micro-systems, miniaturized internal calibration components are easier to integrate in a tiny array space.

[0013] 2. Multi-function and high precision. The mechanical switches and cables used in the traditional calibration system have a large number of cross-connections, and the coupling between the calibration paths is serious and cannot be accurately tested. In addition, the calibration mode is single and cannot be controlled in real time. Under environmental stress, the amplitude and phase drift is serious, resulting in the calibration accuracy failing to meet system requirements.

[0014] 3. Good consistency. The traditional calibration mode uses cable routing to form a calibration network. The routing length is long and the cable processing accuracy is not high. Different environmental stresses such as mechanics and temperature have a great impact on the phase and amplitude of the cable transmission signal, so it is difficult to ensure consistency between batches. The micro-assembly internal calibration component uses chips + multi-layer circuit boards to achieve calibration signal phase and amplitude control. The process control accuracy is orders of magnitude higher than that of the traditional calibration system.

[0015] 4. High reliability. The micro-assembly internal calibration component uses chips, substrates, and connectors to be packaged in the structural parts, and is led out through gold wires, multi-layer circuit substrates, chips, and connectors. It is a mature packaging process. Compared with traditional calibration forms such as cables and mechanical switches, it has stronger environmental adaptability and higher reliability.

[0016] 5. Versatile and easy to integrate into the system. Due to the integrated design based on the micro-assembly process, the internal multi-layer circuits, chips, resistors and capacitors, gold wires, etc. can be modularly packaged, and even multi-channels, multiple amplitude and phase control modes, and multiple export forms can be expanded according to different application scenarios. It has high versatility and is easy to integrate into the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a principle block diagram of the high-isolation miniaturized internal calibration component proposed by the present invention.

[0018] Figure 2 This is a block diagram of the reference calibration signal of the internal calibration component proposed in the present invention.

[0019] Figure 3 This is a block diagram of the transmission calibration signal of the internal calibration component proposed in the present invention.

[0020] Figure 4 This is a block diagram of the received calibration signal of the internal calibration component proposed in the present invention.

[0021] Figure 5 This is a three-dimensional schematic diagram of the internal calibration component proposed in the present invention.

[0022] The markings in the figure are:

[0023] Chip 1, resistor and capacitor component 2, gold wire 3, LTCC substrate 4, cover plate 5, absorber 6, frame 7, bottom plate 8, connector 9. DETAILED DESCRIPTION

[0024] The present invention is applied to the internal calibration design of spaceborne phased array radar, and its purpose is to provide a high-isolation, miniaturized, and multifunctional internal calibration component design and implementation method. The present invention aims to solve the problems of large calibration system volume, single calibration mode, and poor measurement accuracy caused by coupling between calibration links, and provides a high-isolation miniaturized internal calibration component with multiple calibration modes such as reference, reception, and transmission, integrating multi-stage high-power switches, attenuators, low-noise amplifiers, power amplifiers, circulators, modulators, controllers, substrates, and structural parts. The component is designed with a micro-assembly process, and the ports are well matched. The internal calibration path switches different transmission circuits by switches. High-precision calibration of the antenna array is achieved, while meeting the requirements of spaceborne application environment conditions.

[0025] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0027] It can be understood that the terms "first", "second", etc. used in the present application can be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0028] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.

[0029] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.

[0030] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0031] In order to make the purpose, technical solution and advantages of the present application clearer, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0032] This embodiment provides a high-isolation miniaturized internal calibration component, and innovatively applies the microassembly process as a packaging method to the internal calibration system, thereby achieving the design of a high-isolation internal calibration component with multiple calibration modes in a limited space.

[0033] This internal calibration component (such as Figure 5 ), mainly includes chip 1, resistor and capacitor components 2, gold wire 3, LTCC substrate 4, cover plate 5, absorber 6, frame 7, bottom plate 8, connector 9.

[0034] Among them, the chip 1 is glued in the cavity of the LTCC substrate 4, and is bonded with the microstrip pad inside the LTCC substrate 4 through the gold wire 3. The connector 9 is arranged around the frame 7, and the calibration signal enters the strip line transmission of different layers in the substrate through the connector 9, and is transmitted up and down through the gold wire 3, the chip 1, and the LTCC substrate 4 to achieve high isolation characteristics. The power control signal enters the chip 1 on the surface of the LTCC substrate 4 through the connector 9, and realizes real-time high-speed control of different calibration modes under the impedance matching, filtering and energy storage of the resistor and capacitor components. The resistor and capacitor component 2 is welded on the surface of the LTCC substrate 4, the chip 1 is glued, and the gold wire 2 is bonded, and then it is integrated with the connector 9, the frame 7, the bottom plate 8, the cover plate 5, and the absorber 6 to form an internal calibration component. Figure 5 As shown, the internal calibration component is integrated and airtightly assembled using a micro-assembly process using a chip 1, a resistor and capacitor device 2, gold wire, a LTCC substrate 4, a frame 7, a bottom plate 8, a cover plate 5, etc. The external interfaces of the connector 9 mainly include a power interface, a control interface, and a radio frequency interface which are horizontally distributed on different sides of the component. The design of the internal calibration component is characterized by mature technology and good environmental adaptability.

[0035] exist Figure 1 In the internal calibration principle block diagram shown in the figure, multi-stage switch chips, attenuator chips, coupler chips, low noise amplifier chips, power amplifiers, and circulator chips are used on a multi-layer circuit board carrier to realize the RF channel switching functions such as direct pass, attenuation, amplification, and coupling of different calibration signals, and it has multiple calibration modes such as reference calibration, transmission calibration, and reception calibration. Figure 2 , Figure 3 , Figure 4 shown.

[0036] like Figure 1 In the internal calibration principle block diagram shown in FIG. 1, a single-ended to differential chip, includes a power supply and a control signal passing through a resistor and a capacitor 2, and a single-ended to differential chip routing through a layer inside a substrate, so as to control the conduction, closing, amplification, attenuation and other functions of the RF signal in real time and at high speed.

[0037] The internal calibration component design of this embodiment has the characteristics of miniaturization and high isolation: different from the traditional complex cable routing calibration system, it adopts chip, multi-layer circuit board, frame, base plate, and cover plate interconnection integration. The component area is much smaller than the traditional calibration system and is easy to integrate in different array systems.

[0038] The internal calibration component design of this embodiment has universal and expandable capabilities: the chip, multi-layer circuit board, frame, base plate, and cover plate are interconnected. Due to the simple design method and the size at the component level, different calibration modes, interface forms, amplitude and phase control requirements can be selected according to different application scenarios.

[0039] The internal calibration component design of this embodiment has high reliability capabilities: in the case of mass production, the micro-assembly process control capability is much higher than the cable network manufacturing process, and the chips, multi-layer circuit boards, and structural parts are much better at adapting to the environment after packaging than traditional cable-type calibration networks, thereby greatly improving system reliability.

[0040] Compared with the prior art, the present invention has the following beneficial effects:

[0041] Compared with the traditional calibration system, the main advantages of the high isolation miniaturized internal calibration component of the present invention are:

[0042] 1. Miniaturization. Traditional calibration systems use cables and mechanical switches to form calibration networks, which are complex and occupy an area orders of magnitude higher than that of micro-assembly components. As spaceborne radars develop towards multi-functional, micro-systems, miniaturized internal calibration components are easier to integrate in a tiny array space.

[0043] 2. Multi-function and high precision. The mechanical switches and cables used in the traditional calibration system have a large number of cross-connections, and the coupling between the calibration paths is serious and cannot be accurately tested. In addition, the calibration mode is single and cannot be controlled in real time. Under environmental stress, the amplitude and phase drift is serious, resulting in the calibration accuracy failing to meet system requirements.

[0044] 3. Good consistency. The traditional calibration mode uses cable routing to form a calibration network. The routing length is long and the cable processing accuracy is not high. Different environmental stresses such as mechanics and temperature have a great impact on the phase and amplitude of the cable transmission signal, so it is difficult to ensure consistency between batches. The micro-assembly internal calibration component uses chips + multi-layer circuit boards to achieve calibration signal phase and amplitude control. The process control accuracy is orders of magnitude higher than that of the traditional calibration system.

[0045] 4. High reliability. The micro-assembly internal calibration component uses chips, substrates, and connectors to be packaged in the structural parts, and is led out through gold wires, multi-layer circuit substrates, chips, and connectors. It is a mature packaging process. Compared with traditional calibration forms such as cables and mechanical switches, it has stronger environmental adaptability and higher reliability.

[0046] 5. Versatile and easy to integrate into the system. Due to the integrated design based on the micro-assembly process, the internal multi-layer circuits, chips, resistors and capacitors, gold wires, etc. can be modularly packaged, and even multi-channels, multiple amplitude and phase control modes, and multiple export forms can be expanded according to different application scenarios. It has high versatility and is easy to integrate into the system.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A high-isolation miniaturized internal calibration component, characterized in that: The invention comprises a chip (1), a resistor and capacitor component (2), a gold wire (3), an LTCC substrate (4), a cover plate (5), an absorber (6), a surrounding frame (7), a bottom plate (8), and a connector (9); the chip (1) is glued into a cavity of the LTCC substrate (4) and is bonded to a microstrip pad inside the LTCC substrate (4) via the gold wire (3).

2. The high isolation miniaturized internal calibration component according to claim 1, characterized in that: The connector (9) is arranged on the side of the surrounding frame (7), and the calibration signal enters the strip lines of different layers in the substrate through the connector (9) for transmission, and is transmitted through the layers up and down through the gold wire (3), the chip (1), and the LTCC substrate (4), thereby achieving high isolation characteristics.

3. The high isolation miniaturized internal calibration component according to claim 1, characterized in that: The power control signal enters the chip (1) on the surface of the LTCC substrate (4) through the connector (9), and realizes real-time high-speed control of different calibration modes under the impedance matching, filtering and energy storage of the resistor and capacitor device (2).

4. The high isolation miniaturized internal calibration component according to claim 1, characterized in that: After the resistor and capacitor components (2) are welded on the surface of the LTCC substrate (4), the chip (1) is glued, and the gold wire (2) is bonded, the substrate (4) is integrated with the connector (9), the surrounding frame (7), the bottom plate (8), the cover plate (5), and the absorber (6) through a micro-assembly process.

5. The high isolation miniaturized internal calibration component according to claim 1, characterized in that: The external interfaces of the connector (9) include a power interface, a control interface, and a radio frequency interface.

6. The high isolation miniaturized internal calibration component according to claim 1, characterized in that: A multi-stage switch chip, an attenuator chip, a coupler chip, a low noise amplifier chip, a power amplifier, and a circulator chip are used on a multi-layer circuit board carrier to realize the RF channel switching function of different calibration signals, and has reference calibration, transmission calibration, and reception calibration modes; the RF channel switching function includes pass-through, attenuation, amplification, and coupling.

7. The high isolation miniaturized internal calibration component according to claim 1, characterized in that: The chip (1) includes a single-ended to differential chip, and the power supply and control signal are routed through layers inside the LTCC substrate (4) through the resistor and capacitor device (2) and the single-ended to differential chip, thereby controlling the on, off, amplification and attenuation functions of the radio frequency signal in real time and at high speed.

Images