Circuit board processing method, device and system

Abstract

The invention discloses a circuit board processing method, device and system, and the method comprises the steps: recognizing an image mark of a to-be-processed target circuit board, and determining the identification information of the target circuit board; determining software information needing to be burnt of the target circuit board based on the identification information; burning a preset chip based on the software information to obtain a burnt target chip; transmitting the target chip and the target circuit board to a preset chip mounter; and mounting the target chip on the target circuit board through a chip mounter. According to the embodiment of the invention, the labor cost in the circuit board processing process can be reduced.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a circuit board processing method, device and system. Background Art

[0002] With the continuous development of society, the application of consumer electronics industry in people's lives is becoming more and more extensive. At present, in the production process of consumer electronic products required by some consumer electronics industries, it is necessary to rely on manual special processing of the circuit boards of consumer electronic products, which results in a large amount of labor costs. Summary of the invention

[0003] The embodiments of the present application provide a circuit board processing method, device and system, which can reduce the labor cost in the circuit board processing process.

[0004] In a first aspect, an embodiment of the present application provides a circuit board processing method, the method comprising:

[0005] Identify the image mark of the target circuit board to be processed and determine the identification information of the target circuit board;

[0006] Based on the identification information, determine the software information that needs to be burned on the target circuit board;

[0007] Burn the preset chip based on the above software information to obtain the burned target chip;

[0008] Transmitting the target chip and the target circuit board to a preset placement machine;

[0009] The target chip is mounted on the target circuit board by the chip mounter.

[0010] In some embodiments, the determining of the software information that needs to be burned on the target circuit board based on the identification information includes:

[0011] Sending the above identification information to the control device;

[0012] The control device searches for the software storage address associated with the identification information from a preset identification space based on the identification information as the software information.

[0013] In some embodiments, the above-mentioned burning of a preset chip based on the above-mentioned software information to obtain a burned target chip includes:

[0014] Sending the software storage address to a preset burner through the control device;

[0015] Obtaining the burning software through the burner based on the software storage address;

[0016] The burning software is burned into a preset chip by the burner to obtain a burned target chip.

[0017] In some embodiments, it also includes:

[0018] The burning process of the burning software in the preset chip is monitored by the burning device;

[0019] When the programming process does not meet the preset programming conditions, the programming error information is generated by the programming device, and the programming error information is sent to the control device;

[0020] The control device performs a burning error prompt operation based on the burning error information.

[0021] In some embodiments, the step of identifying the image mark of the target circuit board to be processed and determining the identification information of the target circuit board includes:

[0022] Scanning the image mark of the target circuit board through a preset scanning device to obtain an image scanning result;

[0023] The scanning device identifies the image scanning result to obtain the identification information of the target circuit board;

[0024] The sending of the identification information to the control device comprises:

[0025] The identification information is sent to the control device via the scanning device.

[0026] In some embodiments, mounting the target chip on the target circuit board by the chip mounter includes:

[0027] Obtaining chip information of the target chip through a control device, and determining mounting position indication information of the target chip based on the chip information and identification information of the target circuit board;

[0028] Sending the above-mentioned mounting position indication information to the above-mentioned mounting machine through the above-mentioned control device;

[0029] The target chip is mounted on a corresponding mounting position on the target circuit board by the chip mounter based on the mounting position indication information.

[0030] In some embodiments, the above-mentioned transferring the above-mentioned target chip and the above-mentioned target circuit board to a preset placement machine includes:

[0031] The target chip and the target circuit board are transmitted to a preset placement machine through a transmission device.

[0032] In some embodiments, after the preset chip is burned based on the above software information to obtain the burned target chip, the method further includes:

[0033] Obtain the chip code of the target chip and the burning log of the target chip;

[0034] The chip code, the identification information and the burning log are stored in association.

[0035] In a second aspect, an embodiment of the present application further provides a circuit board processing device, the device comprising:

[0036] A mark recognition module is used to recognize the image mark of the target circuit board to be processed and determine the identification information of the target circuit board;

[0037] An information determination module, used to determine the software information that needs to be burned on the target circuit board based on the identification information;

[0038] A burning module is used to burn the preset chip based on the above software information to obtain a burned target chip;

[0039] The chip mounting module is used to transmit the target chip and the target circuit board to a preset chip mounting machine, and mount the target chip on the target circuit board through the chip mounting machine.

[0040] In a third aspect, an embodiment of the present application further provides a circuit board processing system, the system comprising: a control device, a scanning device, a burner, a placement machine, and a transmission mechanism;

[0041] The scanning device is used to identify the image mark of the target circuit board to be processed, determine the identification information of the target circuit board, and send the identification information to the control device;

[0042] The control device is used to receive the identification information, determine the software information that needs to be burned on the target circuit board based on the identification information, and send the software information to the burner;

[0043] The burner is used to receive the software information and burn the preset chip based on the software information to obtain a burned target chip;

[0044] The transmission mechanism is used to transmit the target chip and the target circuit board to a preset placement machine;

[0045] The chip mounter is used to mount the target chip on the target circuit board.

[0046] In a fourth aspect, an embodiment of the present application further provides an electronic device, comprising a memory storing a computer program, wherein when the computer program is executed by a processor, the processor executes any one of the circuit board processing methods provided in the embodiments of the present application.

[0047] In a fifth aspect, an embodiment of the present application further provides a computer-readable storage medium, which includes a computer program. When the computer program runs on an electronic device, the computer program is used to enable the electronic device to execute any circuit board processing method provided in the embodiment of the present application.

[0048] In an embodiment of the present application, the image mark of the target circuit board to be processed is identified to determine the identification information of the target circuit board; based on the identification information, the software information that needs to be burned on the target circuit board is determined; based on the software information, a preset chip is burned to obtain a burned target chip; the target chip and the target circuit board are transmitted to a preset placement machine; the target chip is mounted on the target circuit board by the placement machine, so that the target circuit board is automatically identified and processed, the chip is burned in a manner that matches the circuit board, and the chip is automatically mounted on the target circuit board, so as to reduce the labor cost in the circuit board processing process through an automated circuit board processing method. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0050] Figure 1 It is a schematic diagram of an embodiment of a circuit board processing method provided in an embodiment of the present application;

[0051] Figure 2 is a schematic diagram of the structure of a circuit board processing device provided in an embodiment of the present application;

[0052] Figure 3 It is a schematic diagram of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0053] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0054] Before explaining the embodiments of the present application in detail, some terms involved in the embodiments of the present application are first explained.

[0055] In the description of the embodiments of the present application, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or apparatuses.

[0056] The embodiments of the present application provide a circuit board processing method, device and system. Specifically, the circuit board processing method of the embodiments of the present application can be executed by an electronic device, wherein the electronic device can be a device such as a terminal or a server, or a circuit board processing system composed of at least one device, and the electronic device can have functions such as identifying image marks, burning chips, and transmission components.

[0057] For example, the electronic device can identify the image mark of the target circuit board to be processed and determine the identification information of the target circuit board; based on the identification information, determine the software information that needs to be burned on the target circuit board; based on the software information, burn a preset chip to obtain a burned target chip; transmit the target chip and the target circuit board to a preset placement machine; and mount the target chip on the target circuit board through the placement machine.

[0058] Based on the above problems, the embodiments of the present application provide a circuit board processing method, device and system, which can reduce the labor cost in the circuit board processing process.

[0059] The following is a detailed description of the embodiments in conjunction with the accompanying drawings. It should be noted that the description order of the following embodiments is not intended to limit the preferred order of the embodiments. Although the logical order is shown in the flow chart, in some cases, the steps shown or described may be performed in an order different from that shown in the accompanying drawings.

[0060] In this embodiment, an electronic device is taken as an example for description. This embodiment provides a circuit board processing method, such as Figure 1 As shown, the specific process of the circuit board processing method can be as follows:

[0061] 101. Identify an image mark of a target circuit board to be processed, and determine identification information of the target circuit board.

[0062] Among them, the above-mentioned target circuit board to be processed is a circuit board that currently needs to undergo chip mounting. There may be multiple target circuit boards, and multiple target circuit boards may be arranged in sequence on the production line so that the electronic equipment arranged on the production line can identify the target circuit boards arranged on the production line in sequence.

[0063] In this embodiment, in order to improve the efficiency of information transmission, enhance data security, and improve portability, the electronic device can identify the image mark of the target circuit board, and the image mark of the target circuit board is used to indicate information related to the target circuit board, such as the identification information of the target circuit board. The identification information of the target circuit board includes but is not limited to the serial number (SN number) of the target circuit board, the order number of the order to which the target circuit board belongs, etc. The specific setting can be based on demand and is not limited here.

[0064] The image mark may be a QR code, a barcode or a specific graphic or other image that can represent the target circuit board mark, which can be set according to the requirements and is not limited here.

[0065] It can be understood that by determining the identification information of the target circuit board, the electronic device can clarify the processing method that needs to be performed on the target circuit board. Alternatively, the electronic device can clarify the material information currently required for the target circuit board, so that the electronic device can perform subsequent processing on the target circuit board based on the identification information of the target circuit board.

[0066] In some embodiments, a scanning device is provided in the electronic device or is associated with the electronic device. The above-mentioned identifying the image mark of the target circuit board to be processed and determining the identification information of the target circuit board may include: the electronic device may scan the image mark of the target circuit board through a preset scanning device to obtain an image scanning result; and then, the image scanning result is identified through the scanning device to obtain the identification information of the target circuit board.

[0067] Exemplarily, the scanning device may be a barcode scanner.

[0068] It can be understood that after the scanning device obtains the identification information of the target circuit board through scanning, the identification information can be sent to a control device used to manage the production line. The control device can also be set in an electronic device, or connected to an electronic device to transmit information to each other. The control device can be a factory digital production system (MES system). After obtaining the identification information of the target circuit board, the control device can process the identification information. Alternatively, the scanning device can directly send the identification information to a device that needs to use the identification information for processing, such as a burner. The burner can also determine the information to be burned based on the identification information, etc. The specific setting can be made according to the needs and is not limited here.

[0069] Among them, the above-mentioned MES system is a production information management system for the workshop execution layer of manufacturing enterprises. The MES system may include but is not limited to manufacturing data management, planning and scheduling management, production scheduling management, inventory management, quality management, human resources management, work center / equipment management, tool and tooling management, procurement management, cost management, project kanban management, production process control, underlying data integration analysis or upper-level data integration decomposition and other management modules, so as to create a solid, reliable, comprehensive and feasible manufacturing collaborative management platform.

[0070] 102. Based on the identification information, determine the software information that needs to be burned into the target circuit board.

[0071] The software information may be information for indicating the burning software and / or the burning method, or may be directly the burning software to be burned. The specific setting may be made according to the requirements and is not limited here.

[0072] In this embodiment, after obtaining the identification information, the electronic device can clarify the software information currently required to be burned on the target circuit board based on the identification information, so as to enable the target circuit board to have the capability corresponding to the software information.

[0073] Specifically, the above-mentioned determination of the software information to be burned into the above-mentioned target circuit board based on the above-mentioned identification information may include: the terminal may send the above-mentioned identification information to the control device, and then the above-mentioned control device may search for the software storage address associated with the above-mentioned identification information from the preset identification space based on the above-mentioned identification information as the above-mentioned software information. In the preset identification space, an association relationship between the identification information and the software storage address is pre-established so that the identification information corresponds to the software storage address one by one.

[0074] Wherein, when the image mark of the target circuit board is scanned by a scanning device, sending the identification information to the control device may include: sending the identification information to the control device by the scanning device.

[0075] It can be understood that since multiple target circuit boards on a production line may belong to the same order, the functions required by the multiple target circuit boards may be the same, that is, the software information that needs to be burned on the multiple target circuit boards may be the same. Therefore, the identification information for determining the software information above can be the order number of the order to which the target circuit board belongs. The order numbers of the orders to which multiple target circuit boards on the same batch or the same production line belong can be the same. Then, the order number is associated and bound with the corresponding software storage address, wherein the above order number can be presented in the form of a barcode.

[0076] Specifically, the above-mentioned determination of the software information to be burned into the target circuit board based on the above-mentioned identification information may include: the terminal may send the above-mentioned identification information to the burner, and then the burner may search for the software storage address associated with the above-mentioned identification information from the preset identification space based on the above-mentioned identification information as the above-mentioned software information. In the preset identification space, an association relationship between the identification information and the software storage address is pre-established so that the identification information corresponds to the software storage address one by one.

[0077] Specifically, the software information that needs to be burned into the target circuit board based on the identification information may include: the terminal may send the identification information to the burner, the identification information may include a software storage address, and the burner directly uses the software storage address in the identification information as the software information. In the preset identification space, an association relationship between the identification information and the software storage address is pre-established so that the identification information corresponds to the software storage address one by one.

[0078] 103. Burn the preset chip based on the above software information to obtain a burned target chip.

[0079] In this embodiment, after obtaining the software information, the electronic device can burn the preset chip based on the software information to obtain a burned target chip. The target chip can be burned directly by the electronic device or by a device associated with the electronic device, etc., which can be set according to the needs and is not limited here.

[0080] It is understandable that the electronic device burns the preset chip to accurately obtain the material information currently required for the target circuit board, thereby automatically generating the materials currently required for the target circuit board.

[0081] The above-mentioned preset chip can be a blank chip or a chip with other software burned in it, which can be set according to the requirements and is not limited here. And the above-mentioned preset chip can match the number of target circuit boards, that is, based on the number of target circuit boards, a corresponding number of chips can be transferred from the location of the storage chip to the electronic device, or to a burner associated with the electronic device that can be burned, so as to meet the production line requirements.

[0082] Specifically, the electronic device is provided with a burner, or is associated with the electronic device, and the above-mentioned burning of the preset chip based on the above-mentioned software information to obtain the burned target chip may include: the electronic device can send the above-mentioned software storage address to the preset burner through the above-mentioned control device, so that it can obtain the burning software from the storage space associated with the burner itself through the above-mentioned burner based on the above-mentioned software storage address. Finally, the above-mentioned burning software is burned in the preset chip through the above-mentioned burner to obtain the burned target chip.

[0083] It can be understood that the above-mentioned burning software is used to write corresponding program codes or data into the chip so that the chip can execute specific tasks or functions corresponding to the burning software.

[0084] In some embodiments, since abnormal factors may occur during the chip burning process, resulting in chip burning failure, the electronic device can also monitor the chip burning process based on the burner, so that when the chip burning fails, this situation can be discovered and reported to ensure the safety of chip burning and avoid the chip that fails to burn being mounted on the target circuit board.

[0085] Specifically, the electronic device can monitor the burning process of burning the burning software in a preset chip through the above-mentioned burner, and judge in real time whether the burning process meets the preset burning conditions, such as the condition that the time spent in the burning process is less than or equal to the preset burning time. If the above-mentioned burning process does not meet the preset burning conditions through the above-mentioned burner, such as the time spent in the burning process is greater than the preset burning time, it means that the burning time is too long, and there may be burning abnormality, and it is necessary to generate burning error information, and send the above-mentioned burning error information to the above-mentioned control device so as to prompt the relevant user, that is, the above-mentioned control device performs the burning error prompt operation based on the above-mentioned burning error information.

[0086] In some embodiments, in order to ensure that the production process of the target circuit board can be traced, so as to avoid the situation where the production process, such as the burning process, cannot be traced and anomalies occur, and the cause cannot be accurately determined, the electronic device needs to record the accurate process during the material preparation of the target circuit board. Specifically, after burning the preset chip based on the above software information to obtain the burned target chip, it can also include: the electronic device can obtain the chip code (such as IC material number) of the above target chip, and the burning log of the above target chip, and then store the above chip code, the above identification information and the above burning log in association.

[0087] The burning log includes but is not limited to the burning time, the storage space occupied by the burning software, and the code of the production line currently being burned.

[0088] 104. Transmit the target chip and the target circuit board to a preset placement machine.

[0089] In this embodiment, when the electronic device prepares the target chip to be mounted on the target circuit board, it needs to transfer the target chip and the target circuit board to the same position, that is, the position of the preset placement machine. The placement machine is used to mount the target chip, that is, to mount the target chip on the target circuit board.

[0090] Among them, the above-mentioned target chip and the above-mentioned target circuit board can be transmitted to the preset placement machine at the same time, and the above-mentioned target chip and the above-mentioned target circuit board can also be transmitted to the preset placement machine one after another. The specific setting can be made according to the needs and is not limited here.

[0091] In some embodiments, the above-mentioned transmitting the above-mentioned target chip and the above-mentioned target circuit board to a preset placement machine includes: transmitting the above-mentioned target chip and the above-mentioned target circuit board to the preset placement machine through a transmission device.

[0092] 105. Mount the target chip on the target circuit board by the chip mounter.

[0093] In this embodiment, the electronic device can mount the target chip on the target circuit board through the placement machine, thereby improving the processing efficiency of the target circuit board by setting the burner and the placement machine on the same production line, and the control device needs to be connected to the burner and the placement machine respectively, so as to control the burner or the placement machine at any time, and can automatically process the target circuit board, saving labor costs, avoiding abnormal processing of the target circuit board that may be caused by human control, and realizing fully automatic assembly line production of consumer-grade electronic motherboards, creating efficient, accurate, quality, precise and intelligent production.

[0094] In some embodiments, the above-mentioned mounting the target chip on the target circuit board by the above-mentioned mounting machine may include: the electronic device may obtain chip information of the target chip by the control device, and determine the mounting position indication information of the above-mentioned target chip based on the above-mentioned chip information and the identification information of the above-mentioned target circuit board, and the mounting position indication information is used to indicate the position where the target chip is mounted on the target circuit board. Then, the above-mentioned mounting position indication information is sent to the above-mentioned mounting machine by the above-mentioned control device, and finally, the above-mentioned mounting machine mounts the above-mentioned target chip on the corresponding mounting position on the above-mentioned target circuit board based on the above-mentioned mounting position indication information.

[0095] From the above content, it can be seen that the identification information of the target circuit board to be processed is determined by identifying the image mark of the target circuit board to be processed; based on the above identification information, the software information that needs to be burned on the target circuit board is determined; based on the above software information, the preset chip is burned to obtain the burned target chip; the target chip and the target circuit board are transmitted to the preset placement machine; the target chip is mounted on the target circuit board by the placement machine, so that the target circuit board is automatically identified and processed, the chip is burned in a manner that matches the circuit board, and the chip is automatically mounted on the target circuit board, so as to reduce the labor cost in the circuit board processing process through automated circuit board processing.

[0096] In order to better implement the above method, an embodiment of the present application further provides a circuit board processing device, which can be specifically integrated into an electronic device.

[0097] For example, the method of the embodiment of the present application is described in detail. The embodiment provides a circuit board processing device, such as Figure 2 As shown, the circuit board processing device may include:

[0098] The mark recognition module 201 is used to recognize the image mark of the target circuit board to be processed and determine the identification information of the target circuit board;

[0099] An information determination module 202 is used to determine the software information that needs to be burned on the target circuit board based on the identification information;

[0100] The burning module 203 is used to burn the preset chip based on the above software information to obtain a burned target chip;

[0101] The chip mounting module 204 is used to transmit the target chip and the target circuit board to a preset chip mounting machine, and mount the target chip on the target circuit board through the chip mounting machine.

[0102] In some embodiments, the information determination module 202 is specifically used to:

[0103] Sending the above identification information to the control device;

[0104] The control device searches for the software storage address associated with the identification information from a preset identification space based on the identification information as the software information.

[0105] In some embodiments, the burning module 203 is specifically used for:

[0106] Sending the software storage address to a preset burner through the control device;

[0107] Obtaining the burning software through the burner based on the software storage address;

[0108] The burning software is burned into a preset chip by the burner to obtain a burned target chip.

[0109] In some embodiments, the circuit board processing device further includes a monitoring module, and the monitoring module is specifically used for:

[0110] The burning process of the burning software in the preset chip is monitored by the burning device;

[0111] When the programming process does not meet the preset programming conditions, the programming error information is generated by the programming device, and the programming error information is sent to the control device;

[0112] The control device performs a burning error prompt operation based on the burning error information.

[0113] In some embodiments, the above-mentioned sign recognition module 201 is specifically used for:

[0114] Scanning the image mark of the target circuit board through a preset scanning device to obtain an image scanning result;

[0115] The scanning device identifies the image scanning result to obtain the identification information of the target circuit board;

[0116] The patch module 204 is specifically used for:

[0117] The identification information is sent to the control device via the scanning device.

[0118] In some embodiments, the patch module 204 is specifically used for:

[0119] Obtaining chip information of the target chip through a control device, and determining mounting position indication information of the target chip based on the chip information and identification information of the target circuit board;

[0120] Sending the above-mentioned mounting position indication information to the above-mentioned mounting machine through the above-mentioned control device;

[0121] The target chip is mounted on a corresponding mounting position on the target circuit board by the chip mounter based on the mounting position indication information.

[0122] In some embodiments, the patch module 204 is specifically used for:

[0123] The target chip and the target circuit board are transmitted to a preset placement machine through a transmission device.

[0124] In some embodiments, the circuit board processing device further includes a storage module, and the storage module is specifically used for:

[0125] Obtain the chip code of the target chip and the burning log of the target chip;

[0126] The chip code, the identification information and the burning log are stored in association.

[0127] As can be seen from the above, the circuit board processing device of this embodiment identifies the image mark of the target circuit board to be processed to determine the identification information of the above target circuit board; based on the above identification information, determines the software information that needs to be burned on the above target circuit board; based on the above software information, burns the preset chip to obtain the burned target chip; transmits the above target chip and the above target circuit board to the preset placement machine; mounts the above target chip on the above target circuit board through the above placement machine, thereby automatically identifying and processing the target circuit board, burning the chip in a manner that matches the circuit board, and automatically mounting the chip on the target circuit board, so as to reduce the labor cost in the circuit board processing process through automated circuit board processing.

[0128] In order to better implement the above method, the embodiment of the present application further provides a circuit board processing system. For example, the method of the embodiment of the present application is described in detail. The present embodiment provides a circuit board processing system, which may include: a control device, a scanning device, a burner, a placement machine, and a transmission mechanism;

[0129] The scanning device is used to identify the image mark of the target circuit board to be processed, determine the identification information of the target circuit board, and send the identification information to the control device;

[0130] The control device is used to receive the identification information, determine the software information that needs to be burned on the target circuit board based on the identification information, and send the software information to the burner;

[0131] The burner is used to receive the software information and burn the preset chip based on the software information to obtain a burned target chip;

[0132] The transmission mechanism is used to transmit the target chip and the target circuit board to a preset placement machine;

[0133] The chip mounter is used to mount the target chip on the target circuit board.

[0134] In some embodiments, the control device is specifically used to: based on the identification information, search for a software storage address associated with the identification information from a preset identification space as the software information.

[0135] In some embodiments, the control device is specifically used to send the software storage address to a preset burner; the burner is specifically used to obtain the burning software based on the software storage address, and burn the burning software in a preset chip to obtain a burned target chip.

[0136] In some embodiments, the above-mentioned burner is also used to monitor the burning process of burning the above-mentioned burning software in a preset chip, and when the above-mentioned burning process does not meet the preset burning conditions, it generates burning error information and sends the above-mentioned burning error information to the above-mentioned control device; the above-mentioned control device is also used to receive the above-mentioned burning error information, and perform a burning error prompt operation based on the above-mentioned burning error information.

[0137] In some embodiments, the scanning device is specifically used to: scan the image mark of the target circuit board to obtain an image scanning result, and identify the image scanning result through the scanning device to obtain identification information of the target circuit board.

[0138] In some embodiments, the control device is further used to obtain chip information of the target chip, and based on the chip information and identification information of the target circuit board, determine the mounting position indication information of the target chip, and send the mounting position indication information to the placement machine;

[0139] The above-mentioned placement machine is also used to receive the above-mentioned placement position indication information, and based on the above-mentioned placement position indication information, place the above-mentioned target chip on the corresponding placement position on the above-mentioned target circuit board.

[0140] In some embodiments, the control device is further used to obtain the chip code of the target chip and the burning log of the target chip, and store the chip code, the identification information and the burning log in association with each other.

[0141] As can be seen from the above, the circuit board processing device of this embodiment identifies the image mark of the target circuit board to be processed to determine the identification information of the above target circuit board; based on the above identification information, determines the software information that needs to be burned on the above target circuit board; based on the above software information, burns the preset chip to obtain the burned target chip; transmits the above target chip and the above target circuit board to the preset placement machine; mounts the above target chip on the above target circuit board through the above placement machine, thereby automatically identifying and processing the target circuit board, burning the chip in a manner that matches the circuit board, and automatically mounting the chip on the target circuit board, so as to reduce the labor cost in the circuit board processing process through automated circuit board processing.

[0142] Accordingly, an embodiment of the present application also provides an electronic device. Figure 3 As shown, Figure 3 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application. The electronic device 300 includes a processor 301 having one or more processing cores, a memory 302 having one or more computer-readable storage media, and a computer program stored in the memory 302 and executable on the processor. The processor 301 is electrically connected to the memory 302. Those skilled in the art will appreciate that the electronic device structure shown in the figure does not constitute a limitation on the electronic device, and may include more or fewer components than shown, or combine certain components, or arrange components differently.

[0143] The processor 301 is the control center of the electronic device 300. It uses various interfaces and lines to connect various parts of the entire electronic device 300, executes various functions of the electronic device 300 and processes data by running or loading software programs and / or modules stored in the memory 302, and calling data stored in the memory 302, thereby monitoring the electronic device 300 as a whole.

[0144] In the embodiment of the present application, the processor 301 in the electronic device 300 will load the computer program corresponding to the process of one or more application programs into the memory 302 according to the following steps, and the processor 301 will run the application program stored in the memory 302 to implement various functions:

[0145] Identify the image mark of the target circuit board to be processed and determine the identification information of the target circuit board;

[0146] Based on the identification information, determine the software information that needs to be burned on the target circuit board;

[0147] Burn the preset chip based on the above software information to obtain the burned target chip;

[0148] Transmitting the target chip and the target circuit board to a preset placement machine;

[0149] The target chip is mounted on the target circuit board by the chip mounter.

[0150] Therefore, the electronic device 300 provided in this embodiment can bring the following technical effects: reducing the labor cost in the circuit board processing process.

[0151] The specific implementation of the above operations can be found in the previous embodiments, which will not be described in detail here.

[0152] Optional, such as Figure 3 As shown, the electronic device 300 further includes: a touch screen 303, a radio frequency circuit 304, an audio circuit 305, an input unit 306, and a power supply 307. The processor 301 is electrically connected to the touch screen 303, the radio frequency circuit 304, the audio circuit 305, the input unit 306, and the power supply 307, respectively. Those skilled in the art can understand that Figure 3 The electronic device structure shown in the figure does not constitute a limitation of the electronic device, and may include more or less components than shown in the figure, or combine certain components, or arrange the components differently.

[0153] The touch display screen 303 can be used to display a graphical user interface and receive operation instructions generated by the user acting on the graphical user interface. The touch display screen 303 may include a display panel and a touch panel. Among them, the display panel can be used to display information input by the user or information provided to the user and various graphical user interfaces of the electronic device, and these graphical user interfaces can be composed of graphics, text, icons, videos and any combination thereof. Optionally, the display panel can be configured in the form of a liquid crystal display (LCD, Liquid Crystal Display), an organic light-emitting diode (OLED, Organic Light-Emitting Diode) and the like. The touch panel can be used to collect the user's touch operation on or near it (such as the user uses any suitable object or attachment such as a finger, a stylus, etc. on the touch panel or near the touch panel), and generate corresponding operation instructions, and the operation instructions execute corresponding programs. Optionally, the touch panel may include two parts: a touch detection device and a touch controller. Among them, the touch detection device detects the user's touch direction, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into the touch point coordinates, and then sends it to the processor 301, and can receive the command sent by the processor 301 and execute it. The touch panel can cover the display panel. When the touch panel detects a touch operation on or near it, it is transmitted to the processor 301 to determine the type of touch event, and then the processor 301 provides a corresponding visual output on the display panel according to the type of touch event. In an embodiment of the present application, the touch panel and the display panel can be integrated into the touch display screen 303 to realize the input and output functions. However, in some embodiments, the touch panel and the touch panel can be used as two independent components to realize the input and output functions. That is, the touch display screen 303 can also be used as a part of the input unit 306 to realize the input function.

[0154] The radio frequency circuit 304 may be used to send and receive radio frequency signals, so as to establish wireless communication with a network device or other electronic devices through wireless communication, and to send and receive signals with the network device or other electronic devices.

[0155] The audio circuit 305 can be used to provide an audio interface between the user and the electronic device through a speaker and a microphone. The audio circuit 305 can transmit the electrical signal converted from the received audio data to the speaker, which is converted into a sound signal for output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit 305 and converted into audio data, and then the audio data is output to the processor 301 for processing, and then sent to another electronic device through the radio frequency circuit 304, or the audio data is output to the memory 302 for further processing. The audio circuit 305 may also include an earplug jack to provide communication between an external headset and the electronic device.

[0156] The input unit 306 may be used to receive input numbers, character information or user feature information (such as fingerprint, iris, facial information, etc.), and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.

[0157] The power supply 307 is used to supply power to various components of the electronic device 300. Optionally, the power supply 307 can be logically connected to the processor 301 through a power management system, so as to manage charging, discharging, and power consumption through the power management system. The power supply 307 can also include one or more DC or AC power supplies, charging systems, power failure detection circuits, power converters or inverters, power status indicators, and other arbitrary components.

[0158] although Figure 3 Not shown, the electronic device 300 may also include a camera, a sensor, a wireless fidelity module, a Bluetooth module, etc., which will not be described in detail here.

[0159] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0160] Those skilled in the art will appreciate that all or part of the steps in the various methods of the above embodiments may be completed by a computer program, or by controlling related hardware through a computer program. The computer program may be stored in a computer-readable storage medium and loaded and executed by a processor.

[0161] To this end, an embodiment of the present application provides a computer-readable storage medium, in which a plurality of computer programs are stored, and the computer program can be loaded by a processor to execute any circuit board processing method provided in the embodiment of the present application. For example, the computer program can execute the following steps:

[0162] Identify the image mark of the target circuit board to be processed and determine the identification information of the target circuit board;

[0163] Based on the identification information, determine the software information that needs to be burned on the target circuit board;

[0164] Burn the preset chip based on the above software information to obtain the burned target chip;

[0165] Transmitting the target chip and the target circuit board to a preset placement machine;

[0166] The target chip is mounted on the target circuit board by the chip mounter.

[0167] It can be seen that the computer program can be loaded by the processor to execute any circuit board processing method provided in the embodiments of the present application, thereby bringing the following technical effects: reducing the labor cost in the circuit board processing process.

[0168] The specific implementation of the above operations can be found in the previous embodiments, which will not be described in detail here.

[0169] The computer-readable storage medium may include: a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk, etc.

[0170] Since the computer program stored in the computer-readable storage medium can execute any circuit board processing method provided in the embodiments of the present application, the beneficial effects that can be achieved by any circuit board processing method provided in the embodiments of the present application can be achieved. Please refer to the previous embodiments for details and will not be repeated here.

[0171] The above is a detailed introduction to a circuit board processing method, device and system provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for technical personnel in this field, according to the ideas of the present application, there will be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A circuit board processing method, characterized in that: The method comprises: Identify the image mark of the target circuit board to be processed, and determine the identification information of the target circuit board; Based on the identification information, determining the software information that needs to be burned on the target circuit board; Burning a preset chip based on the software information to obtain a burned target chip; Transmitting the target chip and the target circuit board to a preset placement machine; The target chip is mounted on the target circuit board by the chip mounter.

2. The circuit board processing method according to claim 1, characterized in that: The step of determining software information that needs to be burned on the target circuit board based on the identification information includes: sending the identification information to a control device; The control device searches for the software storage address associated with the identification information from a preset identification space based on the identification information as the software information.

3. The circuit board processing method according to claim 2, characterized in that: The step of burning a preset chip based on the software information to obtain a burned target chip includes: Sending the software storage address to a preset burner through the control device; Obtaining the burning software based on the software storage address by the burner; The burning software is burned in a preset chip by the burner to obtain a burned target chip.

4. The circuit board processing method according to claim 3, characterized in that: Also includes: The burning process of burning the burning software into a preset chip is monitored by the burning device; When the burning process does not meet the preset burning conditions, the burning device generates burning error information, and sends the burning error information to the control device; The control device performs a burning error prompt operation based on the burning error information.

5. The circuit board processing method according to claim 2, characterized in that: The step of identifying the image mark of the target circuit board to be processed and determining the identification information of the target circuit board includes: Scanning the image mark of the target circuit board by a preset scanning device to obtain an image scanning result; Identifying the image scanning result by the scanning device to obtain identification information of the target circuit board; The sending the identification information to the control device comprises: The identification information is sent to the control device through the scanning device.

6. The circuit board processing method according to claim 1, characterized in that: The step of mounting the target chip on the target circuit board by the chip mounter comprises: Obtaining chip information of a target chip through a control device, and determining mounting position indication information of the target chip based on the chip information and identification information of the target circuit board; Sending the mounting position indication information to the placement machine through the control device; The target chip is mounted on a corresponding mounting position on the target circuit board by the mounting machine based on the mounting position indication information.

7. The circuit board processing method according to claim 1, characterized in that: The step of transmitting the target chip and the target circuit board to a preset placement machine includes: The target chip and the target circuit board are transmitted to a preset placement machine through a transmission device.

8. The circuit board processing method according to any one of claims 1 to 7, characterized in that: After burning the preset chip based on the software information to obtain the burned target chip, the method further includes: Obtaining the chip code of the target chip and the burning log of the target chip; The chip code, the identification information and the burning log are stored in association.

9. A circuit board processing device, characterized in that: The device comprises: A mark recognition module is used to recognize the image mark of the target circuit board to be processed and determine the identification information of the target circuit board; An information determination module, used for determining the software information that needs to be burned on the target circuit board based on the identification information; A burning module, used for burning a preset chip based on the software information to obtain a burned target chip; The chip mounting module is used to transfer the target chip and the target circuit board to a preset chip mounting machine, and mount the target chip on the target circuit board through the chip mounting machine.

10. A circuit board processing system, characterized in that: The system includes: a control device, a scanning device, a burner, a placement machine, and a transmission mechanism; The scanning device is used to identify the image mark of the target circuit board to be processed, determine the identification information of the target circuit board, and send the identification information to the control device; The control device is used to receive the identification information, and based on the identification information, determine the software information that needs to be burned on the target circuit board, and send the software information to the burner; The burner is used to receive the software information and burn a preset chip based on the software information to obtain a burned target chip; The transmission mechanism is used to transmit the target chip and the target circuit board to a preset placement machine; The chip mounter is used to mount the target chip on the target circuit board.

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