Equipment modeling method and system

Abstract

The invention provides an equipment modeling method and system. The method comprises the following steps: acquiring input of appearance characteristics of a skeleton model of each unit structure in equipment; obtaining structural characteristics of each unit structure according to the appearance characteristics of the skeleton model of each unit structure and a predetermined incidence relation between structural characteristics of a parameterized universal unit structure and the appearance characteristics of the corresponding skeleton model; and constructing a three-dimensional model of each unit structure according to the structural features of each unit structure. Design or modification of the equipment basic model is completed through one key, the process is simple, the design efficiency is high, and the research and development cost is greatly saved.

Description

Technical Field

[0001] The present invention relates to the technical field of modular design, and in particular to a device modeling method and system. Background Art

[0002] Modular design is to decompose the whole machine into multiple independent units according to function, and standardize and serialize these units. This can achieve the reusability and combination of structures, improve design efficiency and production efficiency, and also reduce product costs and shorten product development cycles.

[0003] Units divided by various functions will present different sizes and shapes in the actual design process according to the functions they implement, the PCB (Printed Circuit Board) layout and the space inside the whole machine. The existing technology generally adopts a bottom-up modeling method. Figure 1 As shown, the modeling process of the equipment is generally as follows: determine the unit shape → design the unit external installation structure → design the unit internal structure → output the PCB shape → improve the internal structure according to the final PCB layout → draw parts and assembly drawings. The existing technology has the following disadvantages

[0004] The above process needs to be repeated every time a unit is designed or modified, which results in cumbersome process, low design efficiency and high R&D cost.

[0005] The iterative design process involves many steps and a long cycle, making it difficult to ensure accuracy and consistency between units;

[0006] It adopts a bottom-up construction approach, first building each molecular component and its characteristics, and then assembling the whole part. It is difficult to control the degree of adaptation of the unit in the whole machine in the initial design stage. If problems are found in the later stage, it is difficult and labor-intensive to modify the overall solution. Summary of the invention

[0007] The present invention provides an equipment modeling method and system to solve the defects of equipment modeling in the prior art, such as being time-consuming, labor-intensive, error-prone, and difficult to maintain. The present invention adopts a parametric and universal equipment modeling method to complete the design or modification of the basic model with one click. The process is simple, the design efficiency is high, the R&D cost is greatly saved, and the maintenance is convenient.

[0008] The present invention provides a device modeling method, comprising:

[0009] Obtaining input of the shape features of the skeleton model of each unit structure in the device;

[0010] According to the appearance features of the skeleton model of each unit structure and the correlation between the predetermined structural features of the parameterized universal unit structure and the appearance features of the corresponding skeleton model, the structural features of each unit structure are obtained;

[0011] According to the structural features of each unit structure, a three-dimensional model of each unit structure is constructed.

[0012] According to a device modeling method provided by the present invention, the structural features of the parameterized universal unit structure include one or more of installation structure features, internal structure features and PCB appearance features.

[0013] According to a device modeling method provided by the present invention, the installation structure features include the size and shape of the upper cover, the size and shape of the lower shell, the screw installation position of the upper cover, the screw installation position of the lower shell, and the PCB screw installation position;

[0014] The PCB appearance features include the size and shape of the PCB board.

[0015] According to a device modeling method provided by the present invention, the upper cover screw installation position is located on the top corner and edge of the upper cover, and the lower shell screw installation position is located on the top corner and edge of the lower shell;

[0016] The upper cover screw installation positions correspond to the lower shell screw installation positions one by one, and the screws pass through the corresponding screw holes at the upper cover screw installation positions and the lower shell screw installation positions.

[0017] According to a device modeling method provided by the present invention, the screws located at the top corners are used to fix the unit structure to the entire device, while pressing the upper cover and the lower shell;

[0018] The screws located on the edge are used to lock the upper cover and the lower shell of the unit structure.

[0019] According to a device modeling method provided by the present invention, the structural features of each unit structure are obtained according to the appearance features of the skeleton model of each unit structure and the predetermined association relationship between the structural features of the parameterized universal unit structure and the appearance features of the corresponding skeleton model, including:

[0020] Obtaining input of the cross-sectional shape of the skeleton model of each unit structure;

[0021] Determine the association relationship corresponding to the input cross-sectional shape of the skeleton model according to the predetermined correspondence between the cross-sectional shape of the skeleton model and the association relationship;

[0022] The structural features of each unit structure are obtained according to the association relationship corresponding to the cross-sectional shape of the skeleton model and the appearance features of the skeleton model.

[0023] According to a device modeling method provided by the present invention, when the cross-sectional shape of the skeleton model is a rectangle, the appearance features of the skeleton model include the length X, width Y and height Z of the skeleton model;

[0024] The association relationship includes that the length and width of the upper cover are X and Y respectively, and the length and width of the lower shell are X and Y respectively; the distances between the upper cover screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the top corner of the upper cover are Xa and Yb respectively, and the distances between the lower shell screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the top corner are Xa and Yb respectively, a is a first preset constant, and b is a second preset constant; the upper cover screw installation positions and the lower shell screw installation positions on the edge are the center positions on each edge or are arranged at equal intervals; the length of the PCB board is Xc, the width of the PCB board is Yc, and c is a third preset constant; the distances between the PCB screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the PCB board are Xd and Yd respectively, and d is a fourth preset constant; the distance between the PCB board and the lower shell is Z / 2.

[0025] According to a device modeling method provided by the present invention, when the cross-sectional shape of the skeleton model is L-shaped, trapezoidal or triangular, the appearance features of the skeleton model include the length of each side and the height Z of the cross-sectional shape of the skeleton model;

[0026] The association relationship includes that the length of each side of the upper cover and the lower shell is equal to the length of each side of the cross section of the skeleton model; the distance between two adjacent upper cover screw installation positions located at the top corner of the upper cover is the length of the corresponding edge minus e, and is symmetrical about the perpendicular bisector of the corresponding edge; the distance between two adjacent lower shell screw installation positions located at the top corner of the lower shell is the length of the corresponding edge minus e, and is symmetrical about the perpendicular bisector of the corresponding edge, and e is the fifth preset constant; the upper cover screw installation position and the lower shell screw installation position on the edge are the center position on each edge or are arranged at equal intervals; the length of each side of the PCB board is equal to the length of each side of the cross section of the skeleton model minus f, and f is the sixth preset constant; the distance between two adjacent PCB screw installation positions located on the PCB board is the length of the corresponding edge minus g, and g is the seventh preset constant; the distance between the PCB board and the lower shell is Z / 2.

[0027] A device modeling method provided by the present invention also includes:

[0028] The engineering drawing of the parameterized universal unit structure is updated according to the structural features of each unit structure to obtain the engineering drawing of each unit structure, wherein the engineering drawing of the parameterized universal unit structure includes one or more of a parts engineering drawing, an assembly engineering drawing and a PCB appearance layout drawing.

[0029] The present invention also provides a device modeling system, comprising:

[0030] An acquisition module, used to obtain input of the appearance features of the skeleton model of each unit structure in the device;

[0031] A calculation module, for obtaining the structural features of each unit structure according to the appearance features of the skeleton model of each unit structure and the association relationship between the structural features of the predetermined parameterized universal unit structure and the appearance features of the corresponding skeleton model;

[0032] A construction module is used to construct a three-dimensional model of each unit structure according to the structural characteristics of each unit structure.

[0033] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, any of the device modeling methods described above is implemented.

[0034] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the device modeling method described in any one of the above is implemented.

[0035] The present invention also provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor, the device modeling method described above is implemented.

[0036] The equipment modeling method and system provided by the present invention parameterize and associate the structural features of the equipment parameterized universal unit structure with the appearance features of the corresponding universal skeleton model. Only the appearance features of the skeleton model need to be input, and the design or modification of the equipment basic model can be completed with the skeleton model with one click. The process is simple, the design efficiency is high, and the research and development cost is greatly saved. The accuracy and consistency between the unit structures using the same skeleton model are high. A top-down approach is adopted to build, first with a rough unit as a whole, and then the lower-level part structure is gradually refined. This can ensure the correctness of the overall design idea, discover problems in advance, and avoid or reduce later modification plans. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1It is a flow chart of a device modeling method in the prior art;

[0039] Figure 2 It is one of the flow charts of the device modeling method provided by the present invention;

[0040] Figure 3 This is the second flow chart of the device modeling method provided by the present invention;

[0041] Figure 4 It is a schematic diagram of the installation positions of the upper cover screws and the lower shell screws of the unit structure in the device modeling method provided by the present invention;

[0042] Figure 5 It is a schematic diagram of the contact surface between the upper cover and the lower shell of the unit structure in the device modeling method provided by the present invention;

[0043] Figure 6 It is an optimized schematic diagram of the upper cover and lower shell structure of the unit structure in the device modeling method provided by the present invention;

[0044] Figure 7 It is a schematic diagram of PCB board screw avoidance of a unit structure in the device modeling method provided by the present invention;

[0045] Figure 8 It is a schematic diagram of the shape of a parameterized general unit structure in the device modeling method provided by the present invention;

[0046] Fig. 9 It is a structural schematic diagram of the equipment modeling system provided by the present invention;

[0047] Fig.10 It is a structural schematic diagram of the electronic device provided by the present invention. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0049] Combine the following Figure 2 A device modeling method of the present invention is described, comprising:

[0050] Step 201, obtaining input of the appearance features of the skeleton model of each unit structure in the device;

[0051] A complete device includes multiple unit structures, and the skeleton model of each unit structure is the outer contour of each unit structure. The appearance characteristics of the skeleton model can be the shape and size of the skeleton model, which is not limited in this embodiment. The appearance characteristics of the skeleton model can be input by selection or keyboard input.

[0052] Step 202, obtaining the structural features of each unit structure according to the appearance features of the skeleton model of each unit structure and the association relationship between the structural features of the predetermined parameterized universal unit structure and the appearance features of the corresponding skeleton model;

[0053] The structural features of the parameterized universal unit structure are parameterized and associated with the appearance features of the corresponding skeleton model in advance. After the appearance features of the skeleton model are determined, the structural features of the parameterized universal unit structure are adaptively adjusted along with the adjustment of the appearance features of the skeleton model according to the predetermined association relationship, thereby obtaining the structural features of the unit structure of the device.

[0054] Step 203: construct a three-dimensional model of each unit structure according to the structural characteristics of each unit structure.

[0055] According to the structural features of each unit structure after adjustment, a three-dimensional model of each unit structure is constructed. The internal structure of the equipment can be improved according to the final layout of the PCB board, such as adding conductive heat dissipation bosses, heat dissipation teeth, and fans to the heat dissipation equipment. The design process of the equipment is simplified from the original 6 steps to 2 steps: determine the unit shape → improve the internal structure according to the final PCB layout, as shown in the following example. Figure 3 As shown, the design process is greatly shortened and the design workload is reduced.

[0056] After adjusting the 3D model of the equipment with one click, the measurement tools provided by the CREO software can be used to perform necessary self-checks. Generally, after the entire unit structure design is completed, the interference analysis tools provided by the CREO software will also be used to perform structural interference checks.

[0057] This embodiment parametrically associates the structural features of the equipment's parameterized universal unit structure with the appearance features of the corresponding universal skeleton model. Only the appearance features of the skeleton model need to be input to complete the design or modification of the equipment's basic model with the skeleton model in one click. The process is simple, the design efficiency is high, and the R&D cost is greatly saved. The unit structures using the same skeleton model have high accuracy and consistency. A top-down approach is adopted to build the structure, with a rough unit as a whole and then gradually refining the lower-level parts structure. This can ensure the correctness of the overall design approach, discover problems in advance, and avoid or reduce later modification plans.

[0058] On the basis of the above-mentioned embodiments, the structural features of the parameterized universal unit structure described in this embodiment include one or more of installation structural features, internal structural features and PCB appearance features.

[0059] The installation structural features of each unit structure may include the size of each unit structure and the features of the installation components (such as the size and position of the screw holes); the internal structural features may include the internal design of each unit structure, such as internal protrusions and grooves; the PCB appearance features may include the shape and size of the PCB board.

[0060] On the basis of the above embodiment, the installation structure features described in this embodiment include the size and shape of the upper cover, the size and shape of the lower shell, the screw installation position of the upper cover, the screw installation position of the lower shell, and the PCB screw installation position;

[0061] The PCB appearance features include the size and shape of the PCB board.

[0062] Each unit structure includes an upper cover, a lower shell and a PCB board. The upper cover and the lower shell are provided with screw holes, and the screw installation positions on the upper cover and the lower shell are the same. The screw holes are used to install screws to lock the upper cover and the lower shell. The PCB board is provided with PCB screw holes for installing screws to fix the PCB board. The screw installation position of the upper cover, the screw installation position of the lower shell and the PCB screw installation position are set as required.

[0063] This embodiment adopts a top-down approach to construct a three-dimensional model of each unit structure. The sizes and shapes of the upper cover, lower shell and PCB board of the parameterized general unit structure are all referenced from the shape features of the same skeleton model for parameter association, and the parameter association between the respective installation screw hole features and the shape features of the skeleton model is constructed in advance.

[0064] By changing the appearance features of the skeleton model, the sizes and shapes of the upper cover, lower shell and PCB of the parameterized general unit structure are refreshed, and the upper shell screw installation position and features, lower shell screw installation position and features, and PCB screw installation position and features can be changed synchronously. The size can be changed with one click, the modeling efficiency is greatly improved, and the model accuracy and consistency are extremely strong.

[0065] Based on the above embodiment, in this embodiment, the upper cover screw installation position is located on the top corner and edge of the upper cover, and the lower shell screw installation position is located on the top corner and edge of the lower shell;

[0066] The upper cover screw installation positions correspond to the lower shell screw installation positions one by one, and the screws pass through the corresponding screw holes at the upper cover screw installation positions and the lower shell screw installation positions.

[0067] Screws are provided on the top corners and edges of each unit structure, and after being tightened, the upper cover is connected to the lower shell, thereby ensuring the closing effect of the entire unit structure and ensuring electromagnetic compatibility.

[0068] like Figure 4 As shown in the circled part, a screw is set at the four vertices of the parameterized general unit structure and the middle position of each edge. The screw installation position is parameter-associated with the shape characteristics of the skeleton model, and the screw installation position on each edge is 1 / 2 of the edge.

[0069] In order to further improve the shielding performance of the unit structure, the contact surface between the upper cover and the lower shell of the parameterized general unit structure is a nested structure, such as Figure 5 As shown in the circled portion, the fitting clearance between the upper cover and the lower shell caused by tolerance and surface roughness can be greatly reduced.

[0070] On the basis of the above embodiment, the screws located at the top corners in this embodiment are used to fix the unit structure to the entire device and simultaneously press the upper cover and the lower shell;

[0071] The screws located on the edge are used to lock the upper cover and the lower shell of the unit structure.

[0072] When the size of the unit structure is constant, the higher the internal space utilization rate, the larger the size left for the PCB board layout. The screws of the unit structure are generally divided into two types: screws that lock the upper cover to the lower shell and screws that fix the unit structure to the whole machine. Figure 4 The red circle in the middle is the screw that locks the upper cover to the lower shell, and the blue circle is the screw that fixes the unit structure to the entire machine.

[0073] In order to improve the internal space utilization of the unit structure, the parameterized universal unit structure optimizes the upper cover and lower shell structure so that the fixing screws of the whole machine can simultaneously press the upper cover and lower shell when they are locked, acting as the cover locking screws, such as Figure 6 As shown in the red circle.

[0074] This embodiment reduces the size of the screws used by the PCB to lock the cover plate to the bottom plate while ensuring that the number of screws on the upper cover and the lower shell is sufficient to meet the electromagnetic compatibility effect of the unit structure. Figure 7 As shown, the PCB board only needs to avoid the four locations in the red circles.

[0075] On the basis of the above embodiment, the structural features of each unit structure are obtained according to the appearance features of the skeleton model of each unit structure and the predetermined association relationship between the structural features of each unit structure and the appearance features of the corresponding skeleton model in this embodiment, including:

[0076] Obtaining input of the cross-sectional shape of the skeleton model of each unit structure;

[0077] Determine the association relationship corresponding to the input cross-sectional shape of the skeleton model according to the predetermined correspondence between the cross-sectional shape of the skeleton model and the association relationship;

[0078] The structural features of each unit structure are obtained according to the association relationship corresponding to the cross-sectional shape of the skeleton model and the appearance features of the skeleton model.

[0079] The user can input the cross-sectional shape of the skeleton model by selection or keyboard input. The shape of the upper cover, lower shell, and PCB board in the parametric universal unit structure is the same as the cross-sectional shape of the skeleton model. In order to further adapt to various devices and various internal layouts of the whole machine, a variety of basic parametric universal unit structures are designed, such as square, rectangular, L-shaped, etc. The schematic diagrams of the three basic parametric universal unit structures are shown in the figure below. Figure 8 shown.

[0080] On the basis of the above embodiment, in this embodiment, when the cross-sectional shape of the skeleton model is a rectangle, the appearance features of the skeleton model include the length X, width Y and height Z of the skeleton model;

[0081] The association relationship includes that the length and width of the upper cover are X and Y respectively, and the length and width of the lower shell are X and Y respectively; the distances between the upper cover screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the top corner of the upper cover are Xa and Yb respectively, and the distances between the lower shell screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the top corner are Xa and Yb respectively, a is a first preset constant, and b is a second preset constant; the upper cover screw installation positions and the lower shell screw installation positions on the edge are the center positions on each edge or are arranged at equal intervals; the length of the PCB board is Xc, the width of the PCB board is Yc, and c is a third preset constant; the distances between the PCB screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the PCB board are Xd and Yd respectively, and d is a fourth preset constant; the distance between the PCB board and the lower shell is Z / 2.

[0082] For example, a and b are 7mm, c is 5mm, and d is 12mm. The upper cover and lower shell wall thickness of the unit structure can be defaulted to 1, the unit mounting screws can be defaulted to M3, the cover locking screws can be defaulted to M2.5, the PCB thickness can be defaulted to 1.6, and the PCB mounting hole diameter can be defaulted to 2.8.

[0083] This embodiment can simultaneously complete the change by changing the length, width and height of the skeleton model, refreshing the upper cover, lower shell, PCB size and shape, upper shell screw installation position and characteristics, lower shell screw installation position and characteristics, PCB screw installation position and characteristics, upper cover, lower shell parts engineering drawings, unit assembly engineering drawings, and PCB shape layout drawings. Changing the size with one click greatly shortens the design process, greatly improves modeling efficiency, and makes the model and drawings extremely accurate and consistent.

[0084] On the basis of the above embodiment, in this embodiment, when the cross-sectional shape of the skeleton model is L-shaped, trapezoidal or triangular, the appearance features of the skeleton model include the length of each side and the height Z of the cross-sectional shape of the skeleton model;

[0085] The association relationship includes that the length of each side of the upper cover and the lower shell is equal to the length of each side of the cross section of the skeleton model; the distance between two adjacent upper cover screw installation positions located at the top corner of the upper cover is the length of the corresponding edge minus e, and is symmetrical about the perpendicular bisector of the corresponding edge; the distance between two adjacent lower shell screw installation positions located at the top corner of the lower shell is the length of the corresponding edge minus e, and is symmetrical about the perpendicular bisector of the corresponding edge, and e is the fifth preset constant; the upper cover screw installation position and the lower shell screw installation position on the edge are the center position on each edge or are arranged at equal intervals; the length of each side of the PCB board is equal to the length of each side of the cross section of the skeleton model minus f, and f is the sixth preset constant; the distance between two adjacent PCB screw installation positions located on the PCB board is the length of the corresponding edge minus g, and g is the seventh preset constant; the distance between the PCB board and the lower shell is Z / 2.

[0086] In the case where the cross-sectional shape of the skeleton model is a polygon, the above-mentioned association relationship can be used to automatically determine the structural features of the unit structure.

[0087] This embodiment can simultaneously complete the change by changing the length, width and height of the skeleton model, refreshing the upper cover, lower shell, PCB size and shape, upper shell screw installation position and characteristics, lower shell screw installation position and characteristics, PCB screw installation position and characteristics, upper cover, lower shell parts engineering drawings, unit assembly engineering drawings, and PCB shape layout drawings. Changing the size with one click greatly shortens the design process, greatly improves modeling efficiency, and makes the model and drawings extremely accurate and consistent.

[0088] Based on the above embodiments, this embodiment also includes:

[0089] The engineering drawing of the parameterized universal unit structure is updated according to the structural features of each unit structure to obtain the engineering drawing of each unit structure, wherein the engineering drawing of the parameterized universal unit structure includes one or more of a parts engineering drawing, an assembly engineering drawing and a PCB appearance layout drawing.

[0090] By changing the appearance features of the skeleton model, the structural features of the parametric universal unit structure are updated according to the parametric association between the appearance features of the skeleton model and the parametric universal unit structure, and the structural features of the unit structure are obtained. At the same time, the part engineering drawings, unit assembly engineering drawings and PCB appearance layout drawings of the parametric universal unit structure (upper cover and lower shell) are synchronously changed according to the structural features of each unit structure. The part engineering drawings, unit assembly engineering drawings and PCB appearance layout drawings of the parametric universal unit structure are prepared in advance. Changing the size with one click greatly shortens the design process, greatly improves the modeling efficiency, and makes the model and drawings extremely accurate and consistent.

[0091] The device modeling system provided by the present invention is described below. The device modeling system described below and the device modeling method described above can be referenced to each other.

[0092] like Fig. 9 As shown, the system includes an acquisition module 901, a calculation module 902 and a construction module 903, wherein:

[0093] The acquisition module 901 is used to obtain the input of the appearance features of the skeleton model of each unit structure in the device;

[0094] The calculation module 902 is used to obtain the structural features of each unit structure according to the appearance features of the skeleton model of each unit structure and the association relationship between the structural features of the predetermined parameterized universal unit structure and the appearance features of the corresponding skeleton model;

[0095] The construction module 903 is used to construct a three-dimensional model of each unit structure according to the structural characteristics of each unit structure.

[0096] This embodiment parametrically associates the structural features of the equipment's parameterized universal unit structure with the appearance features of the corresponding universal skeleton model. Only the appearance features of the skeleton model need to be input to complete the design or modification of the equipment's basic model with the skeleton model in one click. The process is simple, the design efficiency is high, and the R&D cost is greatly saved. The unit structures using the same skeleton model have high accuracy and consistency. A top-down approach is adopted to build the structure, with a rough unit as a whole and then gradually refining the lower-level parts structure. This can ensure the correctness of the overall design approach, discover problems in advance, and avoid or reduce later modification plans.

[0097] Fig.10An example of a physical structure diagram of an electronic device is shown in FIG. Fig.10 As shown, the electronic device may include: a processor 1010, a communication interface 1020, a memory 1030 and a communication bus 1040, wherein the processor 1010, the communication interface 1020 and the memory 1030 communicate with each other through the communication bus 1040. The processor 1010 may call the logic instructions in the memory 1030 to execute the device modeling method, which includes: obtaining the input of the appearance features of the skeleton model of each unit structure in the device; obtaining the structural features of each unit structure according to the appearance features of the skeleton model of each unit structure and the association relationship between the structural features of the predetermined parameterized general unit structure and the appearance features of the corresponding skeleton model; and constructing the three-dimensional model of each unit structure according to the structural features of each unit structure.

[0098] In addition, the logic instructions in the above-mentioned memory 1030 can be implemented in the form of software functional units and can be stored in a computer-readable storage medium when sold or used as an independent product. Based on such an understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, which is stored in a storage medium and includes several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk.

[0099] On the other hand, the present invention also provides a computer program product, which includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the device modeling method provided by the above-mentioned methods, which includes: obtaining input of the appearance characteristics of the skeleton model of each unit structure in the device; obtaining the structural characteristics of each unit structure based on the appearance characteristics of the skeleton model of each unit structure, and the correlation between the structural characteristics of the predetermined parameterized general unit structure and the appearance characteristics of the corresponding skeleton model; and constructing a three-dimensional model of each unit structure based on the structural characteristics of each unit structure.

[0100] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to execute the device modeling method provided by the above-mentioned methods, the method comprising: obtaining an input of the appearance features of the skeleton model of each unit structure in the device; obtaining the structural features of each unit structure based on the appearance features of the skeleton model of each unit structure and the correlation between the structural features of a predetermined parameterized general unit structure and the appearance features of the corresponding skeleton model; and constructing a three-dimensional model of each unit structure based on the structural features of each unit structure.

[0101] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0102] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0103] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A device modeling method, characterized in that: include: Obtaining input of the shape features of the skeleton model of each unit structure in the device; According to the appearance features of the skeleton model of each unit structure and the correlation between the predetermined structural features of the parameterized universal unit structure and the appearance features of the corresponding skeleton model, the structural features of each unit structure are obtained; According to the structural features of each unit structure, a three-dimensional model of each unit structure is constructed.

2. The device modeling method according to claim 1, characterized in that: The structural features of the parameterized universal unit structure include one or more of mounting structural features, internal structural features and PCB appearance features.

3. The device modeling method according to claim 2, characterized in that: The installation structure features include the size and shape of the upper cover, the size and shape of the lower shell, the screw installation position of the upper cover, the screw installation position of the lower shell, and the PCB screw installation position; The PCB appearance features include the size and shape of the PCB board.

4. The device modeling method according to claim 3, characterized in that: The upper cover screw installation positions are located at the top corners and edges of the upper cover, and the lower cover screw installation positions are located at the top corners and edges of the lower cover; The upper cover screw installation positions correspond to the lower shell screw installation positions one by one, and the screws pass through the corresponding screw holes at the upper cover screw installation positions and the lower shell screw installation positions.

5. The device modeling method according to claim 4, characterized in that: The screws located at the top corners are used to fix the unit structure to the entire device and simultaneously press the upper cover and the lower shell; The screws located on the edge are used to lock the upper cover and the lower shell of the unit structure.

6. The device modeling method according to claim 3, characterized in that: The obtaining of the structural features of each unit structure according to the appearance features of the skeleton model of each unit structure and the predetermined association relationship between the structural features of the parameterized universal unit structure and the appearance features of the corresponding skeleton model comprises: Obtaining input of the cross-sectional shape of the skeleton model of each unit structure; Determine the association relationship corresponding to the input cross-sectional shape of the skeleton model according to the predetermined correspondence between the cross-sectional shape of the skeleton model and the association relationship; The structural features of each unit structure are obtained according to the association relationship corresponding to the cross-sectional shape of the skeleton model and the appearance features of the skeleton model.

7. The device modeling method according to claim 6, characterized in that: When the cross-sectional shape of the skeleton model is a rectangle, the appearance features of the skeleton model include the length X, width Y and height Z of the skeleton model; The association relationship includes that the length and width of the upper cover are X and Y respectively, and the length and width of the lower shell are X and Y respectively; the distances between the upper cover screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the top corner of the upper cover are Xa and Yb respectively, and the distances between the lower shell screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the top corner are Xa and Yb respectively, a is a first preset constant, and b is a second preset constant; the upper cover screw installation positions and the lower shell screw installation positions on the edge are the center positions on each edge or are arranged at equal intervals; the length of the PCB board is Xc, the width of the PCB board is Yc, and c is a third preset constant; the distances between the PCB screw installation positions that are symmetrically centered on the horizontal axis and the vertical axis on the PCB board are Xd and Yd respectively, and d is a fourth preset constant; the distance between the PCB board and the lower shell is Z / 2.

8. The device modeling method according to claim 6, characterized in that: When the cross-sectional shape of the skeleton model is L-shaped, trapezoidal or triangular, the appearance features of the skeleton model include the length of each side and the height Z of the cross-sectional shape of the skeleton model; The association relationship includes that the length of each side of the upper cover and the lower shell is equal to the length of each side of the cross section of the skeleton model; the distance between two adjacent upper cover screw installation positions located at the top corner of the upper cover is the length of the corresponding edge minus e, and is symmetrical about the perpendicular bisector of the corresponding edge; the distance between two adjacent lower shell screw installation positions located at the top corner of the lower shell is the length of the corresponding edge minus e, and is symmetrical about the perpendicular bisector of the corresponding edge, and e is the fifth preset constant; the upper cover screw installation position and the lower shell screw installation position on the edge are the center position on each edge or are arranged at equal intervals; the length of each side of the PCB board is equal to the length of each side of the cross section of the skeleton model minus f, and f is the sixth preset constant; The distance between two adjacent PCB screw installation positions on the PCB board is the length of the corresponding edge minus g, where g is the seventh preset constant; the distance between the PCB board and the lower shell is Z / 2.

9. The device modeling method according to any one of claims 1 to 8, characterized in that: Also includes: The engineering drawing of the parameterized universal unit structure is updated according to the structural features of each unit structure to obtain the engineering drawing of each unit structure, wherein the engineering drawing of the parameterized universal unit structure includes one or more of a parts engineering drawing, an assembly engineering drawing and a PCB appearance layout drawing.

10. A device modeling system, characterized in that: include: An acquisition module, used to obtain input of the appearance features of the skeleton model of each unit structure in the device; A calculation module, for obtaining the structural features of each unit structure according to the appearance features of the skeleton model of each unit structure and the correlation between the structural features of the predetermined parameterized universal unit structure and the appearance features of the corresponding skeleton model; A construction module is used to construct a three-dimensional model of each unit structure according to the structural characteristics of each unit structure.

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