Display device and method for manufacturing display device

Abstract

The invention discloses a display device and a manufacturing method of the display device, and belongs to the technical field of display, the display device comprises a display panel and a bridge circuit board located on the back face of the display panel, and the bridge circuit board is electrically connected with the display panel. The bridge circuit board comprises a circuit structure, a first alignment mark, a substrate layer and a shading pattern, the circuit structure and the first alignment mark are located on the side, away from the display panel, of the substrate layer, and the shading pattern is located on the side, close to the display panel, of the first alignment mark; the orthographic projection of the first alignment mark on the back face of the display panel is located in the orthographic projection of the shading pattern on the back face of the display panel. In this way, some structures between the first alignment mark and the back face of the display panel in the display device can be shielded by the shading patterns, it is avoided that the structures affect recognition of the first alignment mark, the problem that in the related technology, the alignment precision of the display device is poor is solved, and the effect of improving the alignment precision of the display device is achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display device and a method for manufacturing the display device. Background Art

[0002] A display device is a device that has the function of displaying images.

[0003] A display device comprises a display panel and a bridge circuit board, wherein the bridge circuit board is bonded to the back of the display panel via an adhesive layer, wherein the bridge circuit board comprises an alignment mark, and the alignment mark is used for alignment operation in subsequent processes.

[0004] However, the adhesive layer is prone to produce twisted lines after lamination, thereby affecting the recognition of the alignment mark and resulting in poor alignment accuracy. Summary of the invention

[0005] The embodiments of the present application provide a display device and a method for manufacturing the display device, which can solve the problem of poor alignment accuracy of the display device in the related art. The technical solution is as follows:

[0006] According to a first aspect of the present application, a display device is provided, comprising:

[0007] A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel;

[0008] The bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern, wherein the circuit structure and the first alignment mark are located on a side of the base layer away from the display panel, the shading pattern is located on a side of the first alignment mark close to the display panel, and an orthographic projection of the first alignment mark on the back of the display panel is located in an orthographic projection of the shading pattern on the back of the display panel.

[0009] Optionally, the display device further includes an adhesive layer, wherein the adhesive layer is located between the base layer and the back surface of the display panel, and the adhesive layer is respectively bonded to the base layer and the back surface of the display panel.

[0010] Optionally, the base layer includes a first sub-base layer, a barrier layer, a second sub-base layer and a buffer layer which are sequentially stacked in a direction away from the display panel.

[0011] Optionally, the light shielding pattern is located between the first sub-base layer and the circuit structure.

[0012] Optionally, the light shielding pattern is located between the barrier layer and the second sub-base layer.

[0013] Optionally, the display panel includes a second alignment mark, and an orthographic projection of the second alignment mark on the back side of the display panel is located outside an orthographic projection of the light shielding pattern on the back side of the display panel.

[0014] Optionally, the display device further includes a stress pattern, and an orthographic projection of the stress pattern on the back of the display panel is outside an orthographic projection of the circuit structure on the back of the display panel, and the stress pattern is used to improve the flatness of the bridge circuit board.

[0015] Optionally, the stress pattern and the light shielding pattern are in the same layer structure.

[0016] Optionally, the circuit structure includes a binding area, and an orthographic projection of the binding area on the back surface of the display panel is located in an orthographic projection of the light shielding pattern on the back surface of the display panel.

[0017] Optionally, the bridge circuit board also includes an insulating layer, which is located on a side of the circuit structure away from the display panel, and the insulating layer has an opening, and the orthographic projection of the binding area on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

[0018] Optionally, the color of the shading pattern is different from the color of the first alignment mark.

[0019] Optionally, the first alignment mark and the circuit structure are in the same layer.

[0020] Optionally, the material of the light-shielding pattern includes at least one of acrylic, silicone film or metal film.

[0021] According to another aspect of the present application, another display device is provided, the display device comprising:

[0022] A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel;

[0023] The bridge circuit board includes a circuit structure on the back of the display panel, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the contrast mark are located on a side of the base layer away from the display panel. The adhesive layer is located between the base layer and the back of the display panel, and the adhesive layer is respectively bonded to the base layer and the back of the display panel. The adhesive layer has an opening, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

[0024] According to another aspect of the present application, a method for manufacturing a display device is provided, the method comprising:

[0025] forming a bridge circuit board on a substrate;

[0026] separating the bridge circuit board from the substrate;

[0027] Disposing the bridge circuit board on the back of the display panel, and electrically connecting the bridge circuit board to the display panel;

[0028] Among them, the bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern, the circuit structure and the contrast mark are located on the side of the base layer away from the display panel, the shading pattern is located on the side of the first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel.

[0029] The beneficial effects brought by the technical solution provided by the embodiment of the present application include at least:

[0030] By setting a shading pattern on a side of the first alignment mark close to the display panel, the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel, so that some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0032] Figure 1 It is a schematic diagram of a top view structure of a display device;

[0033] Figure 2 yes Figure 1 A schematic cross-sectional structure diagram of a display device is provided;

[0034] Figure 3 is a schematic diagram of a top view of a display device provided in an embodiment of the present application;

[0035] Figure 4 yes Figure 3 A schematic diagram of a cross-sectional structure of a display device is provided;

[0036] Figure 5 is a schematic diagram of a top view of another display device provided in an embodiment of the present application;

[0037] Figure 6 yes Figure 5 A schematic diagram of a cross-sectional structure of a display device is provided;

[0038] Figure 7 is a schematic diagram of a top view of another display device provided in an embodiment of the present application;

[0039] Figure 8 yes Figure 7 A schematic top view of the structure of the shading pattern and the stress pattern in the display device shown;

[0040] Fig. 9 is a top view schematic diagram of another shading pattern provided in an embodiment of the present application;

[0041] Fig.10 is a top view schematic diagram of another stress pattern provided in an embodiment of the present application;

[0042] Fig.11 yes Figure 5 A schematic top view of a bridge circuit board in the display device shown;

[0043] Fig.12 yes Fig.11 A schematic diagram of the cross-sectional structure of the bridge circuit board provided;

[0044] Fig.13 is a schematic diagram of a three-dimensional structure of a display device provided in an embodiment of the present application;

[0045] Fig.14 is a schematic diagram of a top view of another display device provided in an embodiment of the present application;

[0046] Fig.15 yes Fig.14 A schematic diagram of a cross-sectional structure of a display device is provided;

[0047] Fig.16 is a schematic cross-sectional structure diagram of another display device provided in an embodiment of the present application;

[0048] Fig.17 is a flow chart of a method for manufacturing a display device provided in an embodiment of the present application;

[0049] Fig.18 is a flow chart of another method for manufacturing a display device provided in an embodiment of the present application;

[0050] Fig.19 is a cross-sectional structural diagram of a part of the structure in a method for manufacturing a display device provided in an embodiment of the present application;

[0051] Fig. 20 is a top view of a partial structure of another method for manufacturing a display device provided in an embodiment of the present application;

[0052] Fig.21 yes Fig. 20 A schematic cross-sectional view of a partial structure in a method for manufacturing a display device is provided;

[0053] Fig. 22 It is a top view of another bridge circuit board provided in an embodiment of the present application;

[0054] Fig.23 yes Fig.21 A schematic diagram of the cross-sectional structure of the bridge circuit board provided;

[0055] Fig.24 is a schematic diagram of an array pattern in a display panel provided in an embodiment of the present application;

[0056] Fig.25 It is a schematic diagram of a bridge circuit board combined with a display panel provided in an embodiment of the present application;

[0057] Fig.26 This is a schematic diagram of an electrical connection between a bridge circuit board and a display panel provided in an embodiment of the present application;

[0058] Fig. 27 It is a schematic diagram of the structure of a protective layer in a display device provided in an embodiment of the present application.

[0059] The above drawings have shown clear embodiments of the present application, which will be described in more detail later. These drawings and text descriptions are not intended to limit the scope of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments. DETAILED DESCRIPTION

[0060] In order to make the objectives, technical solutions and advantages of the present application clearer, the implementation methods of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0061] Please refer to Figure 1 and Figure 2 , Figure 2 yes Figure 1 A schematic diagram of the cross-sectional structure at C1-C1 (to clearly show the circuit structure and the first alignment mark, Figure 1The insulating layer is not shown, but this is not limited to the above). The display device 10 includes: a display panel 11, a bridge circuit board 12 and an adhesive layer 13. The bridge circuit board 11 is electrically connected to the display panel 12. The adhesive layer 13 is located between the display panel 11 and the bridge circuit board 12, and the adhesive layer 23 is bonded to the display panel 11 and the bridge circuit board 12, respectively. The bridge circuit board 12 includes a base layer 121, a circuit structure 122, an alignment mark 123 and an insulating layer 124. The circuit structure 122 and the first alignment mark 123 are located on a side of the base layer 121 away from the display panel 11, and the circuit structure 122 and the first alignment mark 123 are in the same layer structure. The base layer 121 includes a first sub-base layer 1211, a barrier layer 1212, a second sub-base layer 1213 and a buffer layer 1214, which are stacked in sequence in a direction away from the display panel 11.

[0062] like Figure 1 and Figure 2 As shown, the display panel 11 and the bridge circuit board 12 in the display device 10 need to be pressed after being bonded by the adhesive layer 13, and the adhesive layer 13 will produce twisted lines N after the pressing process. The twisted lines N can be observed through the various film layers of the bridge circuit board 12 along the top-view direction D1 through the black and white lens used to identify the alignment mark. These twisted lines N will affect the boundary recognition of the alignment mark 123, resulting in poor alignment accuracy. In addition, the bridge circuit board 12 includes multiple film layers, and the stress in the film layers will cause the flatness of the bridge circuit board 12 to be poor, which is not conducive to the bonding of the display panel 11 and the bridge circuit board 12.

[0063] The present application embodiment provides a display device, please refer to Figure 3 and Figure 4 , Figure 4 yes Figure 3 A schematic diagram of the cross-sectional structure at C1-C1 (to clearly show the circuit structure and the first alignment mark, Figure 3 The insulating layer is not shown, but this is not limiting). The display device 20 may include: a display panel 21 and a bridge circuit board 22 located on the back of the display panel 21 , and the bridge circuit board 22 is electrically connected to the display panel 21 .

[0064] The bridge circuit board 22 includes a circuit structure 223, a first alignment mark 224, and a stacked base layer 221 and a shading pattern 222. The circuit structure 223 and the first alignment mark 224 are located on a side of the base layer 221 away from the display panel 21, the shading pattern 222 is located on a side of the first alignment mark 224 close to the display panel 21, and the orthographic projection of the first alignment mark 224 on the back of the display panel 21 is located in the orthographic projection of the shading pattern 222 on the back of the display panel 21, that is, when the bridge circuit board 22 is observed along the top-down direction D2 through a black and white lens for identifying the alignment mark, some structures between the first alignment mark 224 and the back of the display panel 21 are blocked by the shading pattern 222, so that some structures between the first alignment mark 224 and the back of the display panel 21 can be avoided from affecting the recognition of the first alignment mark 224, wherein the display panel 21 includes a front side A and a back side B, the front side A of the display panel 21 can be a side having a display area, and the back side B of the display panel 21 can be the other side opposite to the front side A.

[0065] To summarize, the display device provided in the embodiment of the present application, by setting a shading pattern on the side of the first alignment mark close to the display panel, the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0066] The present application embodiment provides another display device, please refer to Figure 5 and Figure 6 , Figure 6 yes Figure 5 A schematic diagram of the cross-sectional structure at C1-C1 (to clearly show the circuit structure and the first alignment mark, Figure 5 The insulating layer is not shown, but this is not limited to this. The display device 20 includes: a display panel 21, a bridge circuit board 22 located on the back of the display panel 21, an adhesive layer 23 and a stress pattern 24, wherein the bridge circuit board 21 is electrically connected to the display panel 22. The bridge circuit board 22 includes a first surface A' and a second surface B', the first surface A' can be used to prepare a circuit, and the second surface B' can be used to set the adhesive layer 33.

[0067] In the embodiment of the present application, the adhesive layer 23 is located between the base layer 221 and the back of the display panel 21, and the adhesive layer 23 is respectively bonded to the base layer 221 and the back of the display panel 21, so as to realize the connection and fixation between the display panel 21 and the bridge circuit board 22. The display panel 21 and the bridge circuit board 22 in the display device 20 are bonded by the adhesive layer 23 and then subjected to a lamination process, and the adhesive layer 22 will produce distorted lines after the lamination process, and the bridge circuit board 12 is observed along the top-view direction D2 through a black and white lens for identifying the alignment mark, and the shading pattern 222 coincides with the first alignment mark 224, that is, the shading pattern 222 can block the adhesive layer 22 at the position corresponding to the first alignment mark 224, so the distorted lines generated by the adhesive layer 22 will not affect the boundary recognition of the first alignment mark 224. Exemplarily, the adhesive layer 23 can be at least one of hot melt adhesive, silicone and light curing adhesive.

[0068] Optionally, the bridge circuit board 22 may include a circuit structure 223, a first alignment mark 224, and a stacked base layer 221 and a light shielding pattern 222. The base layer 221 includes a first sub-base layer 2211, a barrier layer 2212, a second sub-base layer 2213, and a buffer layer 2214 stacked in sequence in a direction away from the display panel 21.

[0069] The first sub-base layer 2211 is located on the side of the adhesive layer 23 away from the display panel 21. The first sub-base layer 2211 can play the role of protection, moisture-proof, radiation-resistant and insulating. Exemplarily, the material of the first sub-base layer 2211 may include polyimide (PI). The first sub-base layer 2211 may be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0070] The barrier layer 2212 is located on a side of the first sub-base layer 2211 away from the display panel 21. The barrier layer 2212 can isolate the heat generated inside the display panel, thereby increasing the service life. Exemplarily, the barrier layer 2212 can be made of silicon nitride or silicon oxide.

[0071] The second sub-base layer 2213 is located on the side of the shading pattern 222 away from the display panel 21. The second sub-base layer 2213 is similar to the first sub-base layer 2211, and can play the role of protection, moisture-proof, radiation-resistant and insulating. Exemplarily, the second sub-base layer 2213 can be a polyimide film. The second sub-base layer 2213 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0072] The buffer layer 2214 is located on the side of the second sub-base layer 2213 away from the display panel 21. The buffer layer 2214 can make the surface of the bridge circuit board 22 flat, prevent the bridge circuit board 22 from warping, and thus improve the stability of the bridge circuit board 22 being bonded to the display panel 21. In addition, the buffer layer 2214 can also isolate water and oxygen. Exemplarily, the material of the buffer layer 2214 can be silicon oxide (such as SiO), silicon nitride (such as SiN) or silicon oxynitride (such as SiON).

[0073] Optionally, the shading pattern 222 is located between the first sub-base layer 2211 and the circuit structure 223 , so that the shading pattern 222 can shield the adhesive layer 23 and is not directly bonded to the adhesive layer 23 , thereby avoiding the problem of uneven bonding surface.

[0074] For example, Figure 6 As shown, in the embodiment of the present application, the shading pattern 222 is located between the second sub-base layer 2213 and the barrier layer 2212, but the embodiment of the present application is not limited to this. The shading pattern 222 can also be located between the first sub-base layer 2211 and the barrier layer 2212, or between the second sub-base layer 2213 and the buffer layer 2214, or between the buffer layer 2214 and the circuit structure 223. Figure 7 and Figure 8 As shown, the orthographic projection of the first alignment mark 224 on the back of the display panel 21 is located in the orthographic projection of the shading pattern 222 on the back of the display panel 21, that is, some structures between the first alignment mark 224 and the back of the display panel 21 are blocked by the shading pattern 222. Exemplarily, the shading pattern 222 may be formed by magnetron sputtering, chemical vapor deposition, or lamination of existing film materials, etc.; the material of the shading pattern 222 may be acrylic, silicone film, metal film, etc. Optionally, the color of the shading pattern is different from the color of the first alignment mark, so that when the shading pattern 222 is observed along the top-view direction D2 through a black and white lens for identifying the alignment mark, the difference between the shading pattern 222 and the first alignment mark 224 is obvious, which is conducive to the identification of the first alignment mark 224. Exemplarily, the first alignment mark may be silver, and the color of the shading pattern 222 may be black. At this time, the shading pattern 222 may be composed of a black matrix, and the material of the black matrix is ​​the same as that of the black matrix in the color filter substrate.

[0075] In addition, if Fig. 9 As shown, the shape of the shading pattern 222 can be a regular shape or an irregular shape such as a rectangle, a fan shape, a circle, a diamond shape, a regular hexagon, etc. The shading pattern 222 can also be a shape corresponding to some other structures in the bridge circuit board, so as to avoid other structures.

[0076] like Figure 7 and Figure 8 As shown (to clearly show the circuit structure and the first alignment mark, Figure 7 The insulating layer is not shown, but this is not a limitation), the display device 20 also includes a stress pattern 24, the orthographic projection of the stress pattern 24 on the back side of the display panel 21 is located outside the orthographic projection of the circuit structure 223 on the back side of the display panel 21, that is, when the bridge circuit board 12 is observed along the top-down direction D2 through a black and white lens for identifying the alignment mark, the stress pattern 24 does not overlap with the circuit structure 223. The bridge circuit board 22 includes a plurality of film layers, and the stress existing in the plurality of film layers is not conducive to the attachment of the bridge circuit board 22 to the back side of the display panel 21 through the adhesive layer 23, and may reduce the flatness of the bridge circuit board 22, causing the bridge circuit board 22 to warp and other problems. Therefore, the flatness of the bridge circuit board 22 can be improved by setting the stress pattern 24. For example, Fig.10 As shown, the stress pattern 24 may include a whole pattern or a combination of multiple patterns; the shape of the stress pattern 24 may be a regular shape or an irregular shape such as a rectangle, a sector, a circle, a rhombus, a regular hexagon, etc., and the shape, setting position, and size of the stress pattern may be determined by simulation or experiment, etc., so as to effectively improve the influence of the film layer stress on the flatness of the bridge circuit board 22. In addition, the stress pattern 24 and the shading pattern 222 are in the same layer structure, so the shading pattern 222 and the stress pattern 24 may be processed simultaneously through a single process, saving a single process, thereby improving production efficiency and saving costs. Figure 7 and Figure 8 It is shown that the stress pattern 24 and the shading pattern 222 are in the same layer structure, but the embodiments of the present application are not limited to this. For example, the stress pattern 24 can also be located between the first sub-base layer 2211 and the barrier layer 2212, or the stress pattern 24 can also be located between the second sub-base layer 2213 and the buffer layer 2214, or the stress pattern 24 can also be located between the buffer layer 2214 and the circuit structure 223.

[0077] The circuit structure is located on the side of the buffer layer away from the display panel, such as Fig.11 As shown (to clearly show the circuit structure and the first alignment mark, Fig.11 The insulating layer is not shown, but this is not limited to this), the circuit structure 223 includes a first connection terminal L1, a second connection terminal L2 and a fan-out trace L3, the first connection terminal L1 is connected to one end of the fan-out trace L3 in a one-to-one correspondence, and the second connection terminal L2 is connected to the other end of the fan-out trace L3 in a one-to-one correspondence. For example, Fig.26 As shown, the first connection terminal L1 can be electrically connected to the display panel 21 through the line 25. Fig.11 and Fig.13 As shown (it should be noted that Fig.13L3 is a fan-out trace covered and blocked by an insulating layer), the binding area 2231 includes a plurality of second connection terminals L2, and the orthographic projection of the binding area 2231 on the back of the display panel 21 is located in the orthographic projection of the shading pattern on the back of the display panel 21, that is, some structures between the binding area 2231 and the back of the display panel 21 are blocked by the shading pattern 222, then these structures will not affect the recognition of the binding area 2231; the binding area 2231 is connected to one end of the flexible circuit board 27, and the other end of the flexible circuit board 27 is connected to other external components, so as to provide power and signals for the display device. Exemplarily, the circuit structure 223 can be formed by a patterning process. In the embodiment of the present application, the patterning process involved may include photoresist coating, exposure, development, etching and photoresist stripping. In addition, the first alignment mark 224 and the circuit structure 223 are in the same layer structure, so the first alignment mark 224 and the circuit structure 223 can be processed simultaneously through one composition process, saving one composition process, thereby improving production efficiency and saving costs.

[0078] like Figure 7 and Figure 8 As shown, the display panel 21 also includes a second alignment mark 211. The second alignment mark 211 is an alignment mark in the display panel 21. The second alignment mark 211 can not only play a positioning role in the manufacturing process of the display panel 21, but also can achieve alignment in the manufacturing process of structures such as bridge circuit boards.

[0079] In the display device provided in the embodiment of the present application, the orthographic projection of the second alignment mark 211 on the back side of the display panel 21 is located outside the orthographic projection of the shading pattern 222 on the back side of the display panel, that is, when the bridge circuit board 22 is observed along the top-down direction D2 through a black and white lens for identifying the alignment mark, the second alignment mark 211 will not be blocked by the shading pattern 222, and therefore the second alignment mark 211 can be used for alignment in some subsequent processes.

[0080] The display device provided in the embodiment of the present application may further include an insulating layer 225, such as Fig.11 and Fig.12 As shown ( Fig.12 yes Fig.11In the cross-sectional structural schematic diagram at C2-C2, the insulating layer 225 is located on the side of the circuit structure 223 away from the base layer 221, and the insulating layer 225 has an opening E, and the orthographic projections of the first connection terminal L1 and the second connection terminal L2 on the back side of the display panel 21 are located in the orthographic projections of the opening E on the back side of the display panel 21, so the first connection terminal L1 and the second connection terminal L2 are not covered with the insulating layer, that is, the insulating layer 225 is used to cover and protect other positions except the first connection terminal L1 and the second connection terminal L2 that are subsequently connected to some other structures, wherein the insulating layer 225 can be formed by a composition process.

[0081] The present application embodiment provides another display device, please refer to Fig.14 and Fig.15 (To clearly show the circuit structure and the first alignment mark, Fig.14 The insulating layer is not shown, but this is not limiting), Fig.15 yes Fig.14 In the cross-sectional structural schematic diagram at C3-C3, the display device 30 includes: a display panel 31 and a bridge circuit board 32 located on the back of the display panel 31, the bridge circuit board 31 is electrically connected to the display panel 32; the bridge circuit board 32 includes a circuit structure 322, a first alignment mark 323, and a laminated adhesive layer 33 and a base layer 321 on the back of the display panel 31, and the circuit structure 322 and the first alignment mark 323 are located on the side of the base layer 321 away from the display panel, the adhesive layer 33 is located between the base layer 321 and the back of the display panel 31, and the adhesive layer 33 is respectively bonded to the base layer 321 and the back of the display panel 31, and an opening k is provided on the adhesive layer 33, and the orthographic projection of the first alignment mark 323 on the back of the display panel 31 is located in the orthographic projection of the opening k on the back of the display panel 31, that is, when the bridge circuit board 32 is observed along the top-down direction D3 through a black and white lens for identifying the alignment mark, the position corresponding to the first alignment mark 323 is the opening k. Thus, due to the existence of the opening k, there is no adhesive material at the position corresponding to the first alignment mark 323 , so even if the adhesive layer 33 is twisted after lamination, the recognition of the first alignment mark 323 will not be affected, thereby achieving the effect of improving the alignment accuracy.

[0082] To summarize, the embodiments of the present application provide another display device, by setting an opening on the adhesive layer, and setting the orthographic projection of the first alignment mark on the back of the display panel to be located in the orthographic projection of the opening on the back of the display panel, so that there is no adhesive material at the position corresponding to the alignment mark of the bridge circuit board in the display device, that is, under the black and white lens used to identify the alignment mark, there is no distortion texture effect beside the boundary of the alignment mark, thereby avoiding the adhesive layer from affecting the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0083] Optionally, Fig.14 and Fig.15 In another display device shown, the base layer 321 may include a first sub-base layer 3211 , a barrier layer 3212 , a second sub-base layer 3213 , and a buffer layer 3214 which are sequentially stacked in a direction away from the display panel 31 .

[0084] The first sub-base layer 3211 is located on the side of the adhesive layer 33 away from the display panel 31. The first sub-base layer 3211 can play the role of protection, moisture-proof, radiation-resistant and insulating. Exemplarily, the material of the first sub-base layer 3211 may include PI. The first sub-base layer 3211 may be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0085] The barrier layer 3212 is located on a side of the first sub-base layer 3211 away from the display panel 31. The barrier layer 3212 can isolate the heat generated inside the display panel, thereby increasing the service life. Exemplarily, the barrier layer 3212 can be made of silicon nitride or silicon oxide.

[0086] The second sub-base layer 3213 is located on the side of the shading pattern 222 away from the display panel 31. The second sub-base layer 3213 is similar to the first sub-base layer 3211, and can play the role of protection, moisture-proof, radiation-resistant and insulating. Exemplarily, the second sub-base layer 3213 can be a PI film. The second sub-base layer 3213 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0087] The buffer layer 3214 is located on the side of the second sub-base layer 3213 away from the display panel 31. The buffer layer 3214 can make the surface of the bridge circuit board 32 flat, prevent the bridge circuit board 22 from warping, and thus improve the stability of the bridge circuit board 32 and the display panel 31. In addition, the buffer layer 2214 can also isolate water and oxygen. Exemplarily, the material of the buffer layer 3214 can be silicon oxide (such as SiO), silicon nitride (such as SiN) or silicon oxynitride (such as SiON).

[0088] The present application embodiment provides another display device, such as Fig.16 As shown, the display device 40 includes: a stacked display panel 41 and a bridge circuit board 42, an adhesive layer 43 arranged between the display panel 41 and the bridge circuit board 42, at least one side trace 44, a shading pattern 45, a protective layer 46 and a first alignment mark 47.

[0089] The display panel 41 includes: a first substrate 411, and a first circuit layer 412 disposed on the first substrate 411, the first circuit layer 412 includes a driving element 4121, and at least one first connection pad 4122. The bridge circuit board 42 is disposed on a side of the first substrate 411 away from the first circuit layer 412, and the bridge circuit board 42 includes: an insulating layer 421, and a second circuit layer 422 and a substrate layer 423 disposed on the insulating layer 421. The second circuit layer 422 includes at least one second connection pad 4221 and at least one fan-out trace 4222. The substrate layer 423 includes an inorganic insulating layer 4231 and an organic insulating layer 4232.

[0090] The first alignment mark 47 can be a co-layer structure with the fan-out routing 4222 in the second circuit layer 422. The shading pattern 45 is arranged on the side of the base layer 423 away from the display panel 41, and the orthographic projection of the first alignment mark 47 on the back side of the display panel 21 is located in the orthographic projection of the shading pattern 45 on the back side of the display panel 21, that is, the adhesive layer 43 at the corresponding position of the first alignment mark 47 is blocked by the shading pattern 45, so the distorted pattern that may be generated by the adhesive layer 43 will not affect the first alignment mark 47.

[0091] In summary, an embodiment of the present application provides another display device, in which a shading pattern is set on a side of a first alignment mark close to a display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel are blocked by the shading pattern, thereby avoiding that some structures between the first alignment mark and the back of the display panel affect the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0092] The present application provides a method for manufacturing a display device. Fig.17 As shown, the method may include:

[0093] Step 1701: Form a bridge circuit board on a substrate.

[0094] Step 1702: separate the bridge circuit board from the substrate.

[0095] Step 1703: dispose a bridge circuit board on the back side of the display panel, and electrically connect the bridge circuit board to the display panel.

[0096] Among them, the bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the first alignment mark are located on a side of the base layer away from the display panel, the shading pattern is located on a side of the first alignment mark close to the display panel, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel, that is, the structure between the first alignment mark and the back of the display panel is blocked by the shading pattern, so that some structures between the first alignment mark and the back of the display panel can be prevented from affecting the recognition of the first alignment mark.

[0097] To summarize, an embodiment of the present application provides a method for manufacturing a display device, by setting a shading pattern on a side of a first alignment mark close to a display panel, wherein the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby preventing some structures between the first alignment mark and the back of the display panel from affecting the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0098] The present application embodiment provides another method for manufacturing a display device, such as Fig.18 As shown, the method may include:

[0099] Step 1801: Form a first sub-base layer on a substrate.

[0100] The first sub-base layer can be formed on a substrate, wherein the substrate is a component with a flat surface, which can play a supporting role, so as to facilitate the manufacture of various film layers in the bridge circuit board and ensure the flatness of the bridge circuit board 22. For example, the material of the substrate can include glass. Fig.19 The first sub-base layer 2211 is located on the substrate 226. The first sub-base layer 2211 can play the role of protection, moisture-proof, radiation-resistant and insulation. Exemplarily, the material of the first sub-base layer 2211 can include PI. The first sub-base layer 2211 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0101] Step 1802: forming a barrier layer on the first sub-base layer.

[0102] The barrier layer may be formed on the first sub-base layer, see Fig.19 The barrier layer 2212 is located on a side of the first sub-base layer 2211 away from the substrate 226. The barrier layer 2212 can isolate the heat generated inside the display panel, thereby improving the service life. Exemplarily, the material of the barrier layer 2212 can be silicon nitride or silicon oxide.

[0103] Step 1803: forming a light shielding pattern on the blocking layer.

[0104] The light shielding pattern can be formed on the barrier layer, please refer to Fig. 20 and Fig.21 , Fig.21 yes Fig. 20 Schematic diagram of the cross-sectional structure at C4-C4. The shading pattern 222 is located on the side of the blocking layer 2212 away from the substrate 226, and the orthographic projection of the first alignment mark formed by the subsequent process on the substrate 226 is located in the orthographic projection of the shading pattern 222 on the substrate 226, that is, some structures between the first alignment mark and the substrate 226 are blocked by the shading pattern 222. Exemplarily, the shading pattern 222 can be formed by magnetron sputtering, chemical vapor deposition, or lamination of existing film materials, etc.; the material of the shading pattern 222 can be acrylic, silicone film, metal film, etc. Fig. 9 As shown, Fig. 9 2 is a top view schematic diagram of another shading pattern provided in an embodiment of the present application. The shape of the shading pattern 222 can be a regular shape or an irregular shape such as a rectangle, a fan, a circle, a diamond, a regular hexagon, etc. In addition, the display device can also include a stress pattern 24, Fig. 20 and Fig.21 It is shown that the stress pattern 24 and the shading pattern 222 are in the same layer structure, but the embodiments of the present application are not limited to this. For example, the stress pattern 24 can also be located between the first sub-base layer 2211 and the barrier layer 2212, or between the second sub-base layer 2213 and the buffer layer 2214, or between the buffer layer 2214 and the circuit structure 223.

[0105] Step 1804 , forming a second sub-base layer on the light-shielding pattern.

[0106] The second sub-base layer can be formed on the light shielding pattern, please refer to Figure 6 , Fig. 22 and Fig.23 (It should be noted that, in order to clearly show the circuit structure and the first alignment mark, Fig. 22 The insulating layer is not shown, but this is not limiting), Fig.23 yes Fig. 22 Schematic diagram of the cross-sectional structure at C4-C4. The second sub-base layer 2213 is located on the side of the light shielding pattern 222 away from the display panel 21. The second sub-base layer 2213 is similar to the first sub-base layer 2211 and can play the role of protection, moisture-proof, radiation-resistant and insulation. Exemplarily, the second sub-base layer 2213 can be a PI film. The second sub-base layer 2213 can be made by a deposition process, and the deposition process includes chemical deposition or physical deposition.

[0107] Step 1805: forming a buffer layer on the second sub-base layer.

[0108] The buffer layer can be formed on the second sub-base layer, please refer to Figure 6 , Fig. 22 and Fig.23 The buffer layer 2214 is located on the side of the second sub-base layer 2213 away from the display panel 21. The buffer layer 2214 can make the surface of the bridge circuit board 22 flat and prevent the bridge circuit board 22 from warping, so that the bridge circuit board 22 can be better bonded to the display panel 21. In addition, the buffer layer 2214 can also isolate water and oxygen. Exemplarily, the material of the buffer layer 2214 can be silicon oxide (such as SiO), silicon nitride (such as SiN) or silicon oxynitride (such as SiON).

[0109] Step 1806: forming a circuit structure on the buffer layer.

[0110] The circuit structure can be formed on the buffer layer, please refer to Fig. 22 and Fig.23 The circuit structure 223 includes a binding area 2231, and the binding area 2231 is connected to other external components through a flexible circuit board 27, so as to provide power and signals for the display device. Exemplarily, the circuit structure 223 can be formed by a patterning process. In the embodiment of the present application, the patterning process involved may include photoresist coating, exposure, development, etching and photoresist stripping. In addition, the first alignment mark 224 and the circuit structure 223 are the same layer structure, so the first alignment mark 224 and the circuit structure 223 can be processed simultaneously through a single patterning process, which saves a single patterning process, thereby improving production efficiency and saving costs.

[0111] Step 1807: forming an insulating layer on the circuit structure.

[0112] Insulation layers can be formed on circuit structures, please refer to Fig.12 and Fig.23 The insulating layer 225 is located on a side of the circuit structure 223 away from the base layer 221, and the insulating layer 225 has an opening for connection with the flexible circuit board, that is, the insulating layer 225 is used to protect other locations except for the areas that need to be used later. Exemplarily, the insulating layer 225 can be formed by a patterning process.

[0113] Step 1808: separate the bridge circuit board from the substrate.

[0114] The bridge circuit board can be separated from the substrate by processes such as laser peeling, chemical peeling, mechanical peeling and ion beam, and laser cut into individual samples in preparation for bonding to the display panel.

[0115] Step 1809: forming an array pattern on the display panel.

[0116] The display panel can form an array pattern through a pattern process, such as Fig.24 As shown, the display panel 21 includes a front side A and a back side B. The front side A of the display panel 21 may be a side having a display area, and the back side B of the display panel 21 may be a side opposite to the front side A. An array pattern 24 is formed on the front side of the display panel 21. The array pattern 24 is used to form a circuit and is connected to the bridge circuit board 22.

[0117] Step 1810: Dispose the bridge circuit board on the back side of the display panel.

[0118] The bridge circuit board can be arranged on the back of the display panel, such as Fig.25 As shown, the back side B of the display panel 21 is combined with the second side B' of the bridge circuit board 22. The combination method may include providing an adhesive layer 23 on the back side of the bridge circuit board 22 and then bonding them together using a bonding device.

[0119] Step 1811, electrically connect the bridge circuit board to the display panel.

[0120] The bridge circuit board can be electrically connected to the display panel, such as Fig.26 As shown, the bridge circuit board 22 is electrically connected to the display panel 21 through the circuit 25, and the circuit 25 can be prepared by coating and then laser etching to achieve electrical connection. Alternatively, the circuit 25 can be formed by printing a metal material, or by printing a conductive composite material, or by pasting a pattern film layer with a patterned opening (the shape of the opening can be consistent with the circuit 25), forming a conductive material layer (such as a metal layer) on the film layer, and then removing the pattern film layer to form the circuit 25, etc., and the embodiment of the present application is not limited to this.

[0121] Step 1812: Set a protective layer on the electrically connected lines.

[0122] The protective layer can be provided on the electrical connection line, such as Fig.26 and Fig. 27 As shown, providing a protective layer 46 on the electrically connected circuit 25 can prevent the circuit 25 from being affected by external factors in subsequent harsh environments. Exemplarily, the protective layer 46 can be provided in a variety of ways such as pad printing and printing, and the material of the protective layer 46 can be at least one material that is anti-collision and anti-water oxygen.

[0123] Step 1813: Bind the flexible circuit board to the bridge circuit board.

[0124] The embodiment of the present application can bind the flexible circuit board in the binding area on the bridge circuit board through the binding process, please refer to Fig.13The binding area 2231 is bound to one end of the flexible circuit board 27, and the other end of the flexible circuit board 27 can be connected to the power supply and control components, thereby providing power and signals for the display device.

[0125] To summarize, an embodiment of the present application provides a method for manufacturing a display device, by setting a shading pattern on a side of a first alignment mark close to a display panel, wherein the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel. In this way, some structures between the first alignment mark and the back of the display panel can be blocked by the shading pattern, thereby preventing some structures between the first alignment mark and the back of the display panel from affecting the recognition of the alignment mark, solving the problem of poor alignment accuracy of the display device in the related art, and achieving the effect of improving the alignment accuracy of the display device.

[0126] In this application, the term "at least one of A and B" is only a description of the association relationship of the associated objects, indicating that there can be three kinds of relationships. For example, at least one of A and B can be represented by: A exists alone, A and B exist at the same time, and B exists alone. Similarly, "at least one of A, B, and C" means that there can be seven kinds of relationships, which can be represented by: A exists alone, B exists alone, C exists alone, A and B exist at the same time, A and C exist at the same time, C and B exist at the same time, and A, B, and C exist at the same time.

[0127] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It is also understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it is understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it may be the only layer between the two layers or two elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0128] In the present application, the terms "first", "second" and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless otherwise clearly defined.

[0129] The above description is only an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A display device, characterized in that: The display device comprises: A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel; The bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern, wherein the circuit structure and the first alignment mark are located on a side of the base layer away from the display panel, the shading pattern is located on a side of the first alignment mark close to the display panel, and an orthographic projection of the first alignment mark on the back of the display panel is located in an orthographic projection of the shading pattern on the back of the display panel.

2. The display device according to claim 1, characterized in that The display device further includes an adhesive layer, which is located between the base layer and the back surface of the display panel, and the adhesive layer is respectively bonded to the base layer and the back surface of the display panel.

3. The display device according to claim 1, characterized in that The base layer includes a first sub-base layer, a barrier layer, a second sub-base layer, and a buffer layer which are sequentially stacked in a direction away from the display panel.

4. The display device according to claim 3, characterized in that: The light shielding pattern is located between the first sub-base layer and the circuit structure.

5. The display device according to claim 4, characterized in that: The light shielding pattern is located between the barrier layer and the second sub-base layer.

6. The display device according to claim 1, characterized in that: The display panel includes a second alignment mark, and an orthographic projection of the second alignment mark on the back side of the display panel is located outside the orthographic projection of the light shielding pattern on the back side of the display panel.

7. The display device according to claim 1, characterized in that The display device further comprises a stress pattern, and an orthographic projection of the stress pattern on the back of the display panel is outside an orthographic projection of the circuit structure on the back of the display panel, and the stress pattern is used to improve the flatness of the bridge circuit board.

8. The display device according to claim 7, characterized in that: The stress pattern and the light shielding pattern are in the same layer structure.

9. The display device according to claim 1, characterized in that: The circuit structure includes a binding area, and an orthographic projection of the binding area on the back surface of the display panel is located in an orthographic projection of the light shielding pattern on the back surface of the display panel.

10. The display device according to claim 9, characterized in that: The bridge circuit board also includes an insulating layer, which is located on a side of the circuit structure away from the display panel, and the insulating layer has an opening, and the orthographic projection of the binding area on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

11. The display device according to any one of claims 1 to 10, characterized in that: The color of the light shielding pattern is different from the color of the first alignment mark.

12. The display device according to any one of claims 1 to 10, characterized in that: The first alignment mark and the circuit structure are in the same layer structure.

13. The display device according to any one of claims 1 to 10, characterized in that: The material of the light shielding pattern includes at least one of acrylic, silicone film or metal film.

14. A display device, characterized in that: The display device comprises: A display panel and a bridge circuit board located on the back of the display panel, wherein the bridge circuit board is electrically connected to the display panel; The bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern. The circuit structure and the contrast mark are located on a side of the base layer away from the display panel. The adhesive layer is located between the base layer and the back of the display panel, and the adhesive layer is respectively bonded to the base layer and the back of the display panel. The adhesive layer has an opening, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the opening on the back of the display panel.

15. A method for manufacturing a display device, characterized in that: The method comprises: forming a bridge circuit board on a substrate; separating the bridge circuit board from the substrate; Disposing the bridge circuit board on the back of the display panel, and electrically connecting the bridge circuit board to the display panel; Among them, the bridge circuit board includes a circuit structure, a first alignment mark, and a stacked base layer and a shading pattern, the circuit structure and the contrast mark are located on the side of the base layer away from the display panel, the shading pattern is located on the side of the first alignment mark close to the substrate, and the orthographic projection of the first alignment mark on the back of the display panel is located in the orthographic projection of the shading pattern on the back of the display panel.

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