Novel inductor and inductor integration module
By designing a new inductor, using the electrodes of the built-in conductor to be distributed on the non-single surface, the problems of large module size and high line loss caused by inductors in the prior art are solved, and the inductor integration is achieved with miniaturization, low cost and high efficiency Module.
Patent Information
- Application Number
- CN202411917612.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-24
- Publication Date
- 2025-02-14
AI Technical Summary
In existing servers and power modules, the design of power inductors leads to large overall size, high line loss, low efficiency, and high cost and difficult process for punching devices through Pin pins or PCBs.
Design a new type of inductor, including magnets, built-in conductors and external conductors. The electrodes of the built-in conductors are distributed on non-same patch surfaces, such as two patch surfaces parallel or perpendicular to each other on opposite sides to realize the inductance and surroundings. Direct connection of the device.
It reduces the overall volume of the module, reduces manufacturing costs and circuit losses, and improves volume utilization and efficiency.
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Figure CN119446738A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of inductors, and in particular to a novel inductor and an inductor integrated module. Background Art
[0002] Currently, servers and power modules are increasingly inclined towards miniaturization, low loss, and high efficiency. Servers and power modules usually contain power inductors, MOS tubes, capacitors and other devices. Among them, conventional power inductors usually have two or more electrodes concentrated on one surface of the patch in the circuit, and need to be connected through pins or PCB built-in circuits in the application circuit. If the devices are not on the same surface of the patch, part pins or PCB punching are also required to conduct the surrounding and upper and lower devices through the copper deposition process.
[0003] Among them, if the inductor electrode is connected to each device through the same patch surface, and a pin needle or a PCB built-in line is required as a medium for connection, the overall volume of the application module will be large, the line loss will be high, and the overall efficiency will be low. In order to meet the requirements of small overall volume and high utilization, other devices except the inductor (such as MOS tubes and capacitors) need to be very close to the inductor, where the inductor is connected to the PCB board through the bottom. If other devices are placed on the top of the inductor, part pins or PCB punching are required to connect the upper and lower parts through the copper plating process; however, the pin solution still cannot minimize the module volume, and the PCB punching costs a lot and the process is difficult.
[0004] The disclosure of the above background technology content is only used to assist in understanding the concept and technical solution of the present invention. It does not necessarily belong to the prior art of this patent application. In the absence of clear evidence that the above content has been disclosed on the filing date of this patent application, the above background technology should not be used to evaluate the novelty and creativity of the present application. Summary of the invention
[0005] In order to solve the above technical problems, the present invention proposes a novel inductor and an inductor integrated module, which can reduce the overall volume of the module, lower the manufacturing cost and reduce the circuit loss.
[0006] In order to achieve the above object, the present invention adopts the following technical solutions:
[0007] In the first aspect, the present invention discloses a new type of inductor, including a magnet, a built-in conductor and an external conductor, wherein the built-in conductor is at least partially built-in the magnet, and the two ends of the built-in conductor are respectively led out from the opposite ends of the magnet to form a first patch surface and a second patch surface that are parallel to each other, electrodes are respectively provided on the first patch surface and the second patch surface, the external conductor is placed on the opposite sides of the magnet, and the two ends of the external conductor are respectively located at the two ends corresponding to the first patch surface and the second patch surface.
[0008] In a further embodiment, the number of the built-in conductors is two, and the two built-in conductors are arranged inside the magnet in a spaced-apart manner and in parallel with each other.
[0009] In a further embodiment, the external conductors are divided into two groups, each group has at least two external conductors, and the two groups of external conductors are respectively and parallelly disposed on opposite sides of the magnet.
[0010] In a further embodiment, the electrodes respectively disposed on the first patch surface and the second patch surface are internal conductive copper, a metallization layer or external conductive copper.
[0011] In a further embodiment, the first patch surface and the second patch surface protrude from the top and bottom of the magnet, respectively.
[0012] In a second aspect, the present invention discloses an inductor integrated module, comprising a MOS tube, a PCB board and the novel inductor described in the first aspect, wherein the MOS tube is connected and arranged on the first patch surface and is electrically connected to the first patch surface and the first end of the external conductor at the same time, and the PCB board is connected and arranged on the second patch surface and is electrically connected to the second patch surface and the second end of the external conductor at the same time.
[0013] In a third aspect, the present invention discloses a new type of inductor, comprising a magnet and a built-in conductor, wherein the built-in conductor is at least partially built into the magnet, and two ends of the built-in conductor are respectively led out from two adjacent vertical side surfaces of the magnet to form a first patch surface and a second patch surface that are perpendicular to each other, and electrodes are respectively provided on the first patch surface and the second patch surface.
[0014] In a further embodiment, the number of the built-in conductors is two, and the two built-in conductors are arranged inside the magnet in a spaced-apart manner and in parallel with each other.
[0015] In a further embodiment, the electrodes respectively disposed on the first patch surface and the second patch surface are internal conductive copper, a metallization layer or external conductive copper.
[0016] In a fourth aspect, the present invention discloses an inductor integrated module, characterized in that it comprises a MOS tube, a PCB board and the novel inductor described in the third aspect, wherein the MOS tube is connected and arranged on the first patch surface and is electrically connected to the first patch surface, the PCB board is connected and arranged on the second patch surface and is electrically connected to the second patch surface, and the MOS tube is electrically connected to the PCB board.
[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: the new inductor and inductor integrated module disclosed by the present invention, wherein the corresponding electrodes in the built-in conductor contained in the new inductor are distributed on non-same patch surfaces, such as two patch surfaces parallel to each other on two opposite sides or two patch surfaces perpendicular to each other, so that the inductor can be directly connected to surrounding devices, reducing the overall volume of the module, reducing manufacturing costs and reducing circuit losses. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 is a schematic diagram of the structure of a novel inductor disclosed in Embodiment 1 of the present invention;
[0019] Figure 2 is a schematic structural diagram of an inductor integrated module disclosed in Embodiment 2 of the present invention;
[0020] Figure 3 is a structural schematic diagram of the inductor integrated module disclosed in the second embodiment of the present invention from another perspective;
[0021] Figure 4 is a schematic structural diagram of a novel inductor disclosed in Embodiment 3 of the present invention;
[0022] Figure 5 It is a schematic diagram of the structure of the inductor integrated module disclosed in the fourth embodiment of the present invention. DETAILED DESCRIPTION
[0023] The following is a detailed description of the embodiments of the present invention. It should be emphasized that the following description is only exemplary and is not intended to limit the scope and application of the present invention.
[0024] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it can be directly on the other component or indirectly on the other component. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element. In addition, connection can be used for both fixing and circuit / signal communication.
[0025] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0026] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0027] like Figure 1 As shown, the first embodiment of the present invention discloses a novel inductor 10, including a magnet 11, a built-in conductor 12 and an external conductor 13. The built-in conductor 12 is at least partially built into the magnet 11, and two ends of the built-in conductor 12 are respectively led out from the opposite ends of the magnet 11 to form a first patch surface 121 and a second patch surface 122 which are parallel to each other. Electrodes are respectively provided on the first patch surface 121 and the second patch surface 122. The external conductor 13 is externally arranged on the opposite sides of the magnet 11, and the two ends of the external conductor 13 are respectively located at the two ends corresponding to the first patch surface 121 and the second patch surface 122.
[0028] Furthermore, the number of built-in conductors 12 is two, and the two built-in conductors 12 are arranged in parallel with each other in the magnet 11. In this embodiment, except for the electrode part formed by the first patch surface 121 and the second patch surface 122, the other parts of the built-in conductor 12 are built inside the magnet 11; and the built-in conductor 12 located inside the magnet 11 is arranged along a direction parallel to multiple surfaces of the magnet 11 to minimize line loss. In this specific embodiment, the built-in conductor 12 is divided into three sections, wherein the middle section is arranged parallel to the top surface, and the head and tail sections are arranged parallel to the side surfaces.
[0029] The external conductors 13 are divided into two groups, each group of external conductors 13 has at least two external conductors 13 , and the two groups of external conductors 13 are respectively and parallelly arranged on two opposite sides of the magnet 11 .
[0030] Among them, the electrodes respectively arranged on the first patch surface 121 and the second patch surface 122 are internal conductive copper, metallization layer (such as electroplated metallization layer, PVD metallization layer, etc.) or external conductive copper. In a specific embodiment, they can be adjusted according to high inductance feasibility and low cost.
[0031] In this embodiment, the first patch surface 121 and the second patch surface 122 protrude from the top and bottom of the magnet 11 respectively, that is, the first patch surface 121 and the second patch surface 122 are respectively disposed on the upper and lower surfaces of the magnet 11 and are centrally symmetrical.
[0032] like Figure 2 and Figure 3As shown, the second embodiment of the present invention discloses an inductor integrated module, including a MOS tube 20, a PCB board 30 and the novel inductor 10 in the first embodiment, Figure 1 , wherein the MOS tube 20 is connected and arranged on the first patch surface 121 and is electrically connected to the first patch surface 121 and the first end of the external conductor 13 at the same time, and the PCB board 30 is connected and arranged on the second patch surface 122 and is electrically connected to the second patch surface 122 and the second end of the external conductor 13 at the same time.
[0033] The novel inductor 10 is a two-phase vertical inductor that is centrally symmetrical from top to bottom, wherein the module output Vin is connected from the input port of the PCB board 30 to the output port of the MOS tube 20 through the external conductor 13, and the output port of the MOS tube 20 is connected to the electrode on the top of the novel inductor 10 (i.e., the electrode set on the first patch surface 121), and then transmitted to the second patch surface 122 parallel to and opposite to the first patch surface 121 through the built-in conductor 12, and finally directly connected to the PCB board 30 as the output Vout through the electrode of the second patch surface 122. The volume utilization rate of the inductor integrated module is high, the redundant lines are few, and the line loss is low. Among them, the vertical inductor referred to in the present invention refers to an inductor with two patch surfaces in a parallel or vertical structure.
[0034] like Figure 4 As shown, embodiment three of the present invention discloses a novel inductor 40, including a magnet 41 and a built-in conductor 42, wherein the built-in conductor 42 is at least partially built into the magnet 41, and two ends of the built-in conductor 42 are respectively led out from two adjacent vertical side surfaces of the magnet 41 to form a first patch surface 421 and a second patch surface 422 that are perpendicular to each other, and electrodes are respectively provided on the first patch surface 421 and the second patch surface 422.
[0035] Furthermore, the number of built-in conductors 42 is two, and the two built-in conductors 42 are spaced apart from each other and are arranged in parallel with each other in the magnet 41. In this embodiment, except for the electrode portion formed by the first patch surface 421 and the second patch surface 422, the other parts of the built-in conductor 42 are built inside the magnet 41; and the built-in conductor 42 located inside the magnet 41 is arranged along a direction parallel to multiple surfaces of the magnet 41 to minimize line loss. In this specific embodiment, the built-in conductor 42 is divided into two sections, one of which is arranged parallel to the top surface, and the other is arranged parallel to the side surface.
[0036] Among them, the electrodes respectively provided on the first patch surface 421 and the second patch surface 422 are internal conductive copper, metallization layer (such as electroplated metallization layer, PVD metallization layer, etc.) or external conductive copper. In a specific embodiment, they can be adjusted according to high inductance feasibility and low cost.
[0037] In this embodiment, the first patch surface 421 and the second patch surface 422 are respectively arranged on two adjacent perpendicular surfaces of the magnet 41, wherein the first patch surface 421 is protruded on the side surface of the magnet 41, and the second patch surface 422 is protruded on the bottom surface of the magnet 41.
[0038] like Figure 5 As shown, embodiment 4 of the present invention discloses an inductor integrated module, including a MOS tube 50, a PCB board 60 and the novel inductor 40 in embodiment 3, wherein the MOS tube 50 is connected and arranged on the first patch surface 421 and is electrically connected to the first patch surface 421, the PCB board 60 is connected and arranged on the second patch surface 422 and is electrically connected to the second patch surface 422, and the MOS tube 50 is electrically connected to the PCB board 60.
[0039] The novel inductor 40 is a two-phase vertical inductor with left and right central symmetry, wherein the module output Vin is directly connected to the MOS tube 50 from the input port of the PCB board 60, and the output port of the MOS tube 50 is connected to the electrode on the side of the novel inductor 40 (i.e., the electrode set on the first patch surface 421), and then transmitted to the second patch surface 422 at the bottom which is perpendicular to the first patch surface 421 through the built-in conductor 42, and finally directly connected to the PCB board 60 as the output Vout through the electrode of the second patch surface 422. The inductor integrated module has high volume utilization, few redundant routes, and low line loss.
[0040] The novel inductor proposed by the present invention has a built-in conductive structure to form a patch electrode that directly matches other devices in the application module, such as a MOS tube, without additional lines, low line loss, low process difficulty, low cost, small module size, and high space utilization. Therefore, on the one hand, the novel inductor of each embodiment of the present invention reduces line loss, and on the other hand, the novel inductor also minimizes the size of the entire inductor integrated module, minimizes the cost of miniaturization, and minimizes the process difficulty of miniaturization.
[0041] The novel inductor proposed in the above-mentioned embodiments of the present invention includes a built-in conductor in which corresponding electrodes are distributed on non-same patch surfaces, such as two patch surfaces parallel to each other on two opposite sides or two patch surfaces perpendicular to each other, and can be directly connected to devices such as MOS tubes and PCB tubes, thereby achieving low circuit loss, high volume utilization and low manufacturing cost of the application module.
[0042] The background section of the present invention may contain background information about the problem or environment of the present invention, rather than describing the prior art by others. Therefore, the content contained in the background section is not an admission by the applicant that the prior art is available.
[0043] The above content is a further detailed description of the present invention in combination with specific / preferred embodiments, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, without departing from the concept of the present invention, it can also make several substitutions or modifications to these described embodiments, and these substitutions or modifications should be regarded as belonging to the protection scope of the present invention. In the description of this specification, the description of reference terms "an embodiment", "some embodiments", "preferred embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in combination with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily target the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, in the absence of mutual contradiction, the technical personnel in this field can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples. Although the embodiments of the present invention and their advantages have been described in detail, it should be understood that various changes, substitutions and modifications can be made herein without departing from the scope defined by the attached claims.
Claims
1. A new type of inductor, characterized in that: It includes a magnet, an internal conductor and an external conductor, wherein the internal conductor is at least partially internally built into the magnet, and two ends of the internal conductor are respectively led out from opposite ends of the magnet to form a first patch surface and a second patch surface parallel to each other, electrodes are respectively provided on the first patch surface and the second patch surface, and the external conductor is placed on opposite sides of the magnet, and the two ends of the external conductor are respectively located at two ends corresponding to the first patch surface and the second patch surface.
2. The novel inductor according to claim 1 is characterized in that: The number of the built-in conductors is two, and the two built-in conductors are arranged in the magnet in a manner spaced apart from each other and parallel to each other.
3. The novel inductor according to claim 1 is characterized in that: The external conductors are divided into two groups, each group has at least two external conductors, and the two groups of external conductors are respectively and parallelly arranged on opposite sides of the magnet.
4. The novel inductor according to claim 1 is characterized in that: The electrodes respectively arranged on the first patch surface and the second patch surface are internal conductive copper, metallization layers or external conductive copper.
5. The novel inductor according to claim 1 is characterized in that: The first patch surface and the second patch surface protrude from the top and bottom of the magnet respectively.
6. An inductor integrated module, characterized in that: It comprises a MOS tube, a PCB board and the novel inductor according to any one of claims 1 to 5, wherein the MOS tube is connected and arranged on the first patch surface and is electrically connected to the first patch surface and the first end of the external conductor at the same time, and the PCB board is connected and arranged on the second patch surface and is electrically connected to the second patch surface and the second end of the external conductor at the same time.
7. A new type of inductor, characterized in that: It includes a magnet and a built-in conductor, wherein the built-in conductor is at least partially built into the magnet, and two ends of the built-in conductor are respectively led out from two adjacent vertical side surfaces of the magnet to form a first patch surface and a second patch surface that are perpendicular to each other, and electrodes are respectively provided on the first patch surface and the second patch surface.
8. The novel inductor according to claim 7 is characterized in that: The number of the built-in conductors is two, and the two built-in conductors are arranged in the magnet in a manner spaced apart from each other and parallel to each other.
9. The novel inductor according to claim 7 is characterized in that: The electrodes respectively arranged on the first patch surface and the second patch surface are internal conductive copper, metallization layers or external conductive copper.
10. An inductor integrated module, characterized in that: The invention comprises a MOS tube, a PCB board and the novel inductor according to any one of claims 7 to 9, wherein the MOS tube is connected and arranged on the first patch surface and is electrically connected to the first patch surface, the PCB board is connected and arranged on the second patch surface and is electrically connected to the second patch surface, and the MOS tube is electrically connected to the PCB board.