Miniaturized capacitor with built-in lead

Abstract

The invention discloses a miniaturized capacitor with built-in leads. The miniaturized capacitor comprises a carrier plate, a capacitor body, two conductive pieces and two leads, the capacitor body is arranged on the carrier plate and comprises a capacitor unit and a packaging structure. The packaging structure wraps the capacitor unit. The two conductive members pass through the carrier plate. The two leads pass through the packaging structure, and the capacitor unit is respectively connected with the two conductive members through the two leads.

Description

Technical Field

[0001] The invention relates to a capacitor, in particular to a miniaturized capacitor with built-in leads. Background Art

[0002] Capacitors are a common passive component, which are widely used in various circuits to provide various functions. Existing capacitor packaging structures mainly include metal shell packaging structures and epoxy resin injection packaging structures.

[0003] Metal shell packaging structure: This capacitor includes a cylindrical metal shell, a capacitor unit (element), two guide pins and a rubber plug. The capacitor unit is connected to the two guide pins, and the two guide pins pass through the rubber plug. The cylindrical metal shell is combined with the rubber plug so that the capacitor unit can be set between the cylindrical metal shell and the rubber plug. However, although the rubber plug can provide a sealing effect, it will increase the thickness of the capacitor. In addition, the two guide pins are exposed to the cylindrical metal shell, and a plastic plate is required to isolate the two guide pins from the cylindrical metal shell. The above structure will also increase the thickness of the capacitor. Therefore, this capacitor cannot meet the requirements of miniaturization. In addition, if this capacitor is used as a surface adhesive component, the two guide pins need to be flattened and bent, which will destroy the structure of the capacitor and reduce the reliability of the capacitor.

[0004] Epoxy resin injection packaging structure: Although this capacitor can reduce the height, it still cannot meet the requirements of miniaturization because its guide pins are still exposed on the surface of the capacitor. Similarly, if this capacitor is used as a surface mount component, the two guide pins need to be flattened and bent, which will damage the structure of the capacitor and reduce the reliability of the capacitor. Summary of the invention

[0005] An object of the present invention is to provide a miniaturized capacitor with built-in leads.

[0006] The present invention provides a miniaturized capacitor with built-in leads, which comprises a carrier, a capacitor body, two conductive members and two leads. The capacitor body is arranged on the carrier and comprises a capacitor unit and a packaging structure. The packaging structure covers the capacitor unit. The two conductive members pass through the carrier. The two leads pass through the packaging structure, and the capacitor unit is connected to the two conductive members through the two leads respectively.

[0007] In one embodiment, each conductive member includes a first conductive pad, at least one through hole, and a second conductive pad. The first conductive pad is disposed on an upper surface of the carrier, the second conductive pad is disposed on a lower surface of the carrier, and the first conductive pad is connected to the second conductive pad through the at least one through hole.

[0008] In one embodiment, the two leads are covered by the capacitor unit, the packaging structure and the carrier.

[0009] In one embodiment, each lead is L-shaped.

[0010] In one embodiment, each lead includes a bendable portion, a welding portion, and a wire portion. The bendable portion is connected to the wire portion through the welding portion, and the wire portion is electrically bonded to the corresponding conductive element.

[0011] In one embodiment, the welding portion includes a connection area or a welding area, the connection area is connected to the welding area, and the wire portion is welded to the welding area.

[0012] In one embodiment, the bendable portion, the welding portion and the wire portion are flat.

[0013] In one embodiment, the thickness of the welding portion and the wire portion is greater than the thickness of the bendable portion.

[0014] In one embodiment, the packaging structure is an insulating material.

[0015] In one embodiment, the carrier is a printed circuit board, a flexible circuit board or other similar components.

[0016] As can be seen from the above, the structure of the capacitor integrates the carrier and the built-in lead, and the above integrated structure does not require a rubber plug and a plastic plate, and can significantly reduce the height of the capacitor. Therefore, the size of the capacitor can be significantly reduced to meet the needs of miniaturization. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 1 is a perspective view of a miniaturized capacitor with built-in leads according to an embodiment of the present invention.

[0018] Figure 2 FIG. 1 is a first cross-sectional view of a miniaturized capacitor with built-in leads according to an embodiment of the present invention.

[0019] Figure 3 FIG. 1 is a perspective view of leads of a miniaturized capacitor with built-in leads according to an embodiment of the present invention.

[0020] Figure 4 FIG. 2 is a second cross-sectional view of a miniaturized capacitor with built-in leads according to an embodiment of the present invention.

[0021] Figure 5 FIG. 4 is a cross-sectional view of a miniaturized capacitor with built-in leads according to another embodiment of the present invention.

[0022] Explanation of the reference numerals: 1-capacitor; 11-carrier; 12-capacitor body; 121-capacitor unit; 122-packaging structure; 13-conductive member; 131-first conductive pad; 132-through hole; 133-second conductive pad; 14-lead; 141-bendable portion; 142-welding portion; 1421-connecting area; 1422-welding area; 143-wire portion. DETAILED DESCRIPTION

[0023] The following will refer to the relevant drawings to illustrate the embodiments of the miniaturized capacitor with built-in leads according to the present invention. For the sake of clarity and convenience of the drawings, the components in the drawings may be exaggerated or reduced in size and proportion. In the following description and / or claims, when it is mentioned that an element is "connected" or "coupled" to another element, it may be directly connected or coupled to the other element or there may be an intervening element; and when it is mentioned that an element is "directly connected" or "directly coupled" to another element, there is no intervening element, and other words used to describe the relationship between elements or layers should be interpreted in the same way. For ease of understanding, the same elements in the following embodiments are illustrated with the same symbols.

[0024] See also Figure 1 and Figure 2 , which are respectively a three-dimensional view and a first cross-sectional view of a miniaturized capacitor with built-in leads according to an embodiment of the present invention. As shown in the figure, the capacitor 1 includes a carrier 11, a capacitor body 12, two conductive members 13 and two leads 14. The structural design of the capacitor 1 can be applied to film capacitors, aluminum solid winding capacitors, aluminum solid stacked capacitors, tantalum capacitors, etc.

[0025] The capacitor body 12 is disposed on the carrier 11. The capacitor body 12 includes a capacitor unit (element) 121 and a packaging structure 122. The packaging structure 122 covers the capacitor unit 121. In one embodiment, the packaging structure 122 can be an insulating material, such as an insulating glue. In one embodiment, the carrier 11 can be a printed circuit board or other similar components. In another embodiment, the carrier 11 can also be a flexible circuit board or other similar components.

[0026] The two conductive members 13 pass through the carrier 11. Each conductive member 13 includes a first conductive pad 131, a plurality of through holes 132 (the conductive member 13 of this embodiment has three through holes 132, but is not limited thereto) and a second conductive pad 133. The first conductive pad 131 is disposed on the upper surface of the carrier 11, and the second conductive pad 133 is disposed on the lower surface of the carrier 11. The first conductive pad 132 is connected to the second conductive pad 133 through the plurality of through holes 132. In another embodiment, the structure of the conductive member 13 may also be changed according to actual needs. In one embodiment, the material of the conductive member 13 may be copper, tin, iron, aluminum or other various metal or non-metal conductive materials.

[0027] The two leads 14 pass through the packaging structure 122, and each lead 14 may be L-shaped. One of the leads 14 may be arranged on one side of the other lead 14, that is, the two leads 14 may be arranged side by side. In this way, the capacitor unit 121 is connected to the two conductive members 13 through the two leads 14 respectively. In one embodiment, the material of the lead 14 may be copper, tin, iron or other various conductive materials.

[0028] As can be seen from the above, the two leads 14 are arranged in the packaging structure 122 and are located between the capacitor unit 121, the packaging structure 122 and the carrier 11. In this way, the two leads 14 are covered by the capacitor unit 121, the packaging structure 122 and the carrier 11, so that the two leads 14 will not be exposed on the surface of the capacitor 1. Through the above structure, the capacitor 1 can effectively integrate the carrier 11 and multiple built-in leads 14, so there is no need for rubber plugs and plastic skin. In this way, the overall structure of the capacitor 1 is simplified, and the height of the capacitor 1 is greatly reduced. Therefore, the size of the capacitor 1 can be greatly reduced to meet the needs of miniaturization.

[0029] In addition, the two leads 14 of the capacitor 1 are built-in so that they are not exposed on the surface of the capacitor 1. In addition, the capacitor 1 has a plurality of conductive members 13 disposed at the bottom of the carrier 11. Through the above structure, the capacitor 1 can be directly electrically connected to other components through the plurality of conductive members 13. Therefore, when the capacitor 1 is used as a surface-mounted component, the two leads 14 of the capacitor 1 do not need to be flattened or bent, which can avoid damaging the structure of the capacitor 1. Therefore, the capacitor 1 can achieve higher structural stability, so that the reliability of the capacitor 1 can be effectively improved.

[0030] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the miniaturized capacitor with built-in leads according to this embodiment should still be included in the scope of the present invention.

[0031] See also Figure 3 and Figure 4 , which are respectively a three-dimensional view of the lead of a miniaturized capacitor with built-in leads and a second cross-sectional view of the miniaturized capacitor according to an embodiment of the present invention. Figure 3 Indicates that the lead wire 14 has not yet been combined with the capacitor unit 121. Figure 3As shown, the lead 14 includes a bendable portion 141, a welding portion 142 and a wire portion 143. The bendable portion 141, the welding portion 142 and the wire portion 143 are flat, and the materials of the bendable portion 141, the welding portion 142 and the wire portion 143 may be the same or different. The bendable portion 141 is connected to the wire portion 143 through the welding portion 142; the wire portion 143 may be welded to the welding portion 142. In this embodiment, the thickness of the welding portion 142 and the wire portion 143 is greater than the thickness of the bendable portion 141. In another embodiment, the thickness of the welding portion 142 and the wire portion 143 may be less than or equal to the thickness of the bendable portion 141.

[0032] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the lead structure of the miniaturized capacitor according to this embodiment should still be included in the scope of the present invention.

[0033] Figure 4 1 shows the structure after the lead wire 14 is combined with the capacitor unit 121. Figure 4 As shown, the lead 14 of the capacitor 1 is L-shaped (only one of the leads 14 is shown in the figure). As mentioned above, the lead 14 includes a bendable portion 141, a welding portion 142 and a wire portion 143; Figure 4 As shown, the bendable portion 141 has been bent at an angle. The welding portion 142 includes a connecting area 1421 and / or a welding area 1422 , so the wire portion 143 can be welded to the welding area 1422 of the welding portion 142 .

[0034] The capacitor units 121 are connected to the corresponding conductive members 13 through the leads 14. The wire portion 143 of the lead 14 is electrically bonded to the corresponding conductive member 13; for example, the wire portion 143 can be welded to the conductive member 13 so that the wire portion 143 is electrically bonded to the conductive member 13; for another example, the wire portion 143 can be bonded to the conductive member 13 through a conductive adhesive so that the wire portion 143 is electrically bonded to the conductive member 13. As mentioned above, the wire portion 143 is flat, so the contact area with the conductive member 13 (first conductive pad 131) can be increased to achieve better electrical bonding.

[0035] As can be seen from the above, the lead 14 has a bendable portion 141, so that the lead 14 can be L-shaped to form a bridge structure that can effectively utilize space. The above structure can electrically connect the capacitor unit 121 and the conductive member 13 to reduce the overall height of the capacitor 1 as much as possible.

[0036] In addition, a person of ordinary skill in the art should understand that the guide pins of the existing capacitors include part A, part B, and a CP line. Part B needs to be inserted into the corresponding hole of the rubber plug, so part B needs to be in the shape of a thick cylinder so that it can achieve an interference fit with the hole of the rubber plug. The above structure makes it impossible to reduce the overall size of the existing capacitor. In addition, the guide pins are exposed to the cylindrical metal shell, and a plastic plate is required to isolate the two guide pins from the cylindrical metal shell. The above structure will also increase the thickness of the capacitor. Furthermore, if the existing capacitor is used as a surface-mounted component, the two guide pins need to be flattened and bent, which will destroy the structure of the capacitor and reduce the reliability of the capacitor.

[0037] On the contrary, the lead wire 14 of the present embodiment is flat, so that the overall size of the capacitor 1 can be reduced. The lead wire 14 has a bendable portion 141, so that the lead wire 14 can be L-shaped to form a bridge structure that can effectively utilize space, which can reduce the overall height of the capacitor 1. Therefore, the size of the capacitor 1 can be reduced to meet the needs of miniaturization, so that it can be more widely used and more flexible in use.

[0038] In addition, the two leads 14 of the capacitor 1 are not exposed on the surface of the capacitor 1. If the capacitor 1 is used as a surface-mounted component, the capacitor 1 can be directly electrically connected to other components through the two conductive members 13, and there is no need to flatten or bend the two leads 14. The above structure can avoid damaging the structure of the capacitor 1. Therefore, the capacitor 1 can achieve higher structural stability, so that the reliability of the capacitor 1 can be effectively improved.

[0039] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the miniaturized capacitor with built-in leads according to this embodiment should still be included in the scope of the present invention.

[0040] See also Figure 5 , which is a cross-sectional view of a miniaturized capacitor with built-in leads according to another embodiment of the present invention. As shown in the figure, the capacitor 1 includes a carrier 11, a capacitor body 12, two conductive members 13 and two leads 14.

[0041] The above-mentioned components are similar to the above-mentioned embodiments, so they are not described in detail here. Unlike the above-mentioned embodiments, the leads 14 of this embodiment are arranged in a straight line instead of being arranged side by side. In addition, the lead 14 is a metal wire (the cross section can be circular or elliptical), such as copper, iron, aluminum, etc. The lead 14 can also adopt the structure of the above-mentioned embodiments; that is, the lead 14 is flat and includes a bendable portion 141, a welding portion 142 and a wire portion 143 (the cross section can be rectangular).

[0042] Of course, this embodiment is only used for illustration and does not limit the scope of the present invention. Equivalent modifications or changes made to the miniaturized capacitor with built-in leads according to this embodiment should still be included in the scope of the present invention.

[0043] In summary, according to an embodiment of the present invention, a capacitor has a carrier, a capacitor body, two conductive parts and two leads. The capacitor body is arranged on the carrier and includes a capacitor unit and a packaging structure. The packaging structure covers the capacitor unit. The two conductive parts pass through the carrier. The two leads pass through the packaging structure, and the capacitor unit is connected to the two conductive parts through the two leads respectively. As can be seen from the above, the structure of the capacitor integrates the carrier and the built-in leads, and the above-mentioned integrated structure does not require a rubber round plug and a plastic plate, and can greatly reduce the height of the capacitor. Therefore, the size of the capacitor can be greatly reduced to meet the needs of miniaturization.

[0044] In addition, according to an embodiment of the present invention, the capacitor has a plurality of built-in leads, and each lead is L-shaped, and the capacitor unit is connected to the plurality of conductive members through the plurality of leads. In this way, the space occupied by the plurality of leads of the capacitor can be minimized, so that the size of the capacitor can be further reduced to meet the requirements of miniaturization. Therefore, the application of the capacitor can be more extensive and the use is more flexible.

[0045] In addition, according to an embodiment of the present invention, the capacitor adopts a built-in lead and has a plurality of conductive parts arranged at the bottom of the carrier. Therefore, the plurality of leads of the capacitor are not exposed on the surface of the capacitor. Through the above structure, the capacitor can be directly electrically connected to other components through the plurality of conductive parts, so the plurality of leads of the capacitor do not need to be flattened and bent. The above structure can avoid damaging the structure of the capacitor. Therefore, the capacitor can achieve higher structural stability, so that the reliability of the capacitor can be effectively improved.

[0046] Furthermore, according to the embodiments of the present invention, the capacitor has a simple design, so the desired effect can be achieved without significantly increasing the cost. Therefore, the capacitor can achieve higher practicality and better meet the needs of practical applications.

[0047] It can be seen that the present invention has indeed achieved the desired improved effect by breaking through the prior art, and it is also not easy for ordinary technicians familiar with the art to think of.

[0048] The above description is for illustrative purposes only and is not intended to be limiting. Any other equivalent modifications or changes made thereto without departing from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. A miniaturized capacitor with built-in leads, characterized in that: Include: a carrier board; A capacitor body is disposed on the carrier and includes a capacitor unit and a packaging structure, wherein the packaging structure covers the capacitor unit; Two conductive members passing through the carrier board; and Two leads pass through the packaging structure, and the capacitor unit is connected to the two conductive members through the two leads respectively.

2. The miniaturized capacitor with built-in leads according to claim 1, wherein: Each of the conductive members includes a first conductive pad, at least one through hole and a second conductive pad. The first conductive pad is disposed on an upper surface of the carrier, the second conductive pad is disposed on a lower surface of the carrier, and the first conductive pad is connected to the second conductive pad through the at least one through hole.

3. The miniaturized capacitor with built-in leads according to claim 1, wherein: The two leads are covered by the capacitor unit, the packaging structure and the carrier.

4. The miniaturized capacitor with built-in leads according to claim 1, wherein: Each of the leads is L-shaped.

5. The miniaturized capacitor with built-in leads according to claim 1, wherein: Each of the leads includes a bendable portion, a welding portion and a wire portion. The bendable portion is connected to the wire portion through the welding portion, and the wire portion is electrically bonded to the corresponding conductive element.

6. The miniaturized capacitor with built-in leads according to claim 5, wherein: The welding part includes a connection area or a welding area, the connection area is connected to the welding area, and the wire part is welded to the welding area.

7. The miniaturized capacitor with built-in leads according to claim 5, wherein: The bendable portion, the welding portion and the wire portion are flat.

8. The miniaturized capacitor with built-in leads according to claim 7, wherein: The thickness of the welding portion and the wire portion is greater than the thickness of the bendable portion.

9. The miniaturized capacitor with built-in leads according to claim 1, wherein: The packaging structure is an insulating material.

10. The miniaturized capacitor with built-in leads according to claim 1, wherein: The carrier board is a printed circuit board or a flexible circuit board.

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