Method, equipment, medium and product for improving silicon wafer stains

Abstract

The embodiment of the invention relates to the technical field of semiconductor manufacturing, and discloses a method and equipment for improving silicon wafer stains, a medium and a product. The method comprises the following steps: mounting a corrosion cage in a corrosion machine; fixing a silicon wafer in the corrosion cage; carrying out corrosion treatment on the silicon wafer in the corrosion cage by adopting a corrosion machine; and after corrosion is completed, the corrosion cage is adopted to carry out automatic wafer reversing treatment on the silicon wafer so as to carry out cleaning operation on the silicon wafer. By adopting the scheme, automatic wafer reversing in the etching machine is realized through the etching cage, the wafer reversing efficiency can be improved, the problem that the etched silicon wafer is exposed in the air to form stains after etching is avoided, and the product yield of the silicon wafer is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a method, device, medium and product for improving silicon wafer contamination. Background Art

[0002] In recent years, with the rapid development of Internet technology, the field of semiconductor manufacturing has developed rapidly. In the processing of semiconductor material silicon wafers, chemical etching of silicon wafers is one of the important processes.

[0003] Chemical etching of silicon surface generally adopts wet etching method, and the surface of silicon wafer is corroded to form randomly distributed tiny batteries. Currently, mixed acid etching solution of hydrofluoric acid (HF), nitric acid (HNO3) and acetic acid (CH3COOH) is mainly used.

[0004] Corrosion is divided into alkaline corrosion and acid corrosion. At present, most corrosion stains occur in acid corrosion, mainly because the silicon wafer is not cleaned and soaked with a large amount of pure water after corrosion. In addition, the insertion and removal of silicon wafers by personnel will also cause stains, especially when the wafers are exposed to the air after corrosion, which will increase the residual liquid on the surface of the silicon wafer after corrosion, which is the stain after corrosion. Summary of the invention

[0005] One purpose of the present application is to provide a method, device, medium and product for improving silicon wafer stains, at least to solve the problem of post-corrosion stains on the surface of silicon wafers due to exposure to the air caused by manual insertion of silicon wafers. The present application comprises installing an etching cage in an etching machine; fixing a silicon wafer in the etching cage; using an etching machine to perform etching treatment on the silicon wafer in the etching cage; and after etching is completed, using the etching cage to automatically flip the silicon wafer to clean the silicon wafer. By adopting this solution, automatic flipping in the etching machine is achieved through the etching cage, which can improve the flipping efficiency, avoid the problem of post-corrosion stains formed when the silicon wafer is exposed to the air after etching, and improve the product yield of the silicon wafer.

[0006] To achieve the above objectives, some embodiments of the present application provide the following aspects:

[0007] In a first aspect, some embodiments of the present application further provide a method for improving silicon wafer stains, comprising:

[0008] Installing the corrosion cage in the corrosion machine;

[0009] Fixing the silicon wafer in the etching cage;

[0010] Using an etching machine to perform etching treatment on the silicon wafer in the etching cage;

[0011] After the etching is completed, the etching cage is used to automatically flip the silicon wafer to clean the silicon wafer.

[0012] In a second aspect, some embodiments of the present application further provide an electronic device, comprising: one or more processors; and a memory storing computer program instructions, wherein the computer program instructions, when executed, cause the processor to perform the steps of the method described above.

[0013] In a third aspect, some embodiments of the present application further provide a computer-readable medium having computer program instructions stored thereon, wherein the computer program instructions can be executed by a processor to implement the method as described above.

[0014] In a fourth aspect, some embodiments of the present application further provide a computer program product, comprising a computer program / instruction, which implements the steps of the method described above when executed by a processor.

[0015] Compared with the related art, the solution provided in the embodiment of the present application is to install the etching cage in the etching machine; fix the silicon wafer in the etching cage; use the etching machine to perform etching treatment on the silicon wafer in the etching cage; after the etching is completed, use the etching cage to automatically flip the silicon wafer to clean the silicon wafer. By adopting this solution, the automatic flipping in the etching machine can be realized through the etching cage, which can improve the flipping efficiency, avoid the problem of stains formed by the silicon wafer being exposed to the air after etching, and improve the product yield of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0017] Figure 1 An exemplary flow chart of a method for improving silicon wafer stains according to some embodiments of the present application;

[0018] Figure 2 A schematic diagram of a corrosion cage provided according to some embodiments of the present application;

[0019] Figure 3 A schematic diagram of an automatic film rewinding machine provided according to some embodiments of the present application;

[0020] Figure 4 An exemplary structural diagram of the electronic device is disclosed. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] First embodiment

[0023] The first embodiment of the present application relates to a method for improving silicon wafer contamination. Figure 1 As shown, the method may include the following steps:

[0024] Step S101, installing the corrosion cage in the corrosion machine;

[0025] The silicon wafer etching machine is a device used to perform etching treatment on silicon wafers. It uses chemical substances to react with the surface of the silicon wafer to remove the unnecessary parts of the silicon wafer surface, thereby forming a specific structure or pattern on the silicon wafer. For example, strong acids (such as hydrofluoric acid, nitric acid, etc.) or strong alkaline solutions are used as corrosive agents. These corrosive agents can react chemically with substances on the surface of the silicon wafer to dissolve or convert them into other removable substances. In addition, by applying an electric field between the silicon wafer and the electrode, the substances on the surface of the silicon wafer undergo an oxidation-reduction reaction under the action of electrolysis, thereby achieving corrosion. This method can more accurately control the speed and depth of corrosion, but the equipment and process are relatively complex.

[0026] The etching machine mainly includes wet etching machine, which immerses the silicon wafer in chemical etching liquid for etching. The advantage of this method is that the etching speed is relatively fast, and the silicon wafer can be uniformly etched over a large area. It is suitable for occasions where the etching precision is not particularly high, such as the silicon wafer texturing process in solar cell manufacturing, which forms a dense pyramid velvet surface of micron size on the surface of the silicon wafer by etching, thereby increasing the silicon wafer's absorption of sunlight. The equipment structure is relatively simple, mainly including etching liquid storage tanks, delivery pipelines, reaction tanks, and temperature, stirring and other control devices. However, after wet etching, a lot of cleaning work needs to be done on the silicon wafer to remove the residual etching liquid. There are also dry etching machines, which use dry processes such as plasma for etching. In the vacuum reaction chamber, specific gases (such as halogen gases, fluorine-based gases, etc.) are introduced, and under the action of the high-frequency electric field generated by the electrode sheet, the gas molecules are ionized to form plasma. The active particles in the plasma react chemically or physically bombard with the substances on the surface of the silicon wafer to achieve corrosion. The advantages of dry etching are high etching accuracy and selectivity, which can achieve fine processing of silicon wafers and is suitable for fields with high process accuracy requirements such as semiconductor integrated circuit manufacturing. However, dry etching equipment is expensive and relatively complex to operate and maintain.

[0027] The etching machine includes a reaction chamber, which is the main place for silicon wafers to undergo etching reactions. For wet etching machines, the reaction chamber is usually a tank for holding etching liquid; for dry etching machines, the reaction chamber is a vacuum-sealed space to ensure the stable generation and action of plasma. The silicon wafer carrier is used to fix and carry the silicon wafer to ensure that the silicon wafer remains stable during the etching process. Common carriers include chucks, clamps, etc. In dry etching machines, chucks usually use electrostatic adsorption or mechanical clamping to fix silicon wafers. The etchant supply system, in a wet etching machine, includes a storage tank, a delivery pump, a pipeline, and a nozzle for the etching liquid, which are responsible for delivering the etching liquid to the reaction chamber and ensuring the uniform distribution of the etching liquid; in a dry etching machine, it includes a gas storage tank, a gas flow controller, an air intake pipeline, etc., which are used to accurately control the flow rate and mixing ratio of the gas. The temperature control system, because the speed and effect of the etching reaction are greatly affected by temperature, the etching machine is usually equipped with a temperature control device, such as a heating element, a cooling device, a temperature sensor, etc., to maintain the temperature of the reaction chamber within a set range. The monitoring and control system, including various sensors (such as temperature sensors, pressure sensors, liquid level sensors, etc.) and controllers, is used to monitor the parameters of the corrosion process in real time, and control and adjust the operation of the equipment according to preset programs to ensure the stability and consistency of the corrosion process.

[0028] The corrosion cage is usually made of corrosion-resistant materials, such as polytetrafluoroethylene and polypropylene. It is generally a cage-like structure with a certain size and shape to accommodate silicon wafers of different specifications. There may be multiple small holes or grids on the cage to ensure that the etching liquid can fully contact all parts of the silicon wafer, while at the same time preventing the silicon wafers from shifting or colliding with each other during the corrosion process to a certain extent.

[0029] During the etching process, the silicon wafer needs to maintain a stable position to ensure the uniformity and consistency of the etching effect. The etching cage can firmly fix the silicon wafer in it to prevent the silicon wafer from moving under the flow or stirring of the etching liquid, thereby avoiding the problem of uneven etching caused by the change of the silicon wafer position.

[0030] It is convenient to pick up and carry silicon wafers. Operators can put multiple silicon wafers into the etching cage at the same time, and then put them into the etching equipment for processing. After the processing is completed, they can be taken out as a whole, which greatly improves the operation efficiency. At the same time, the etching cage can also be used as a carrier for transferring silicon wafers between different processes, reducing the risk of damage caused by direct contact of silicon wafers.

[0031] During the etching process, the silicon wafer is prevented from being damaged by direct contact with other objects. For example, in wet etching, if the silicon wafer directly contacts the inner wall of the etching tank, it may be scratched or damaged due to friction or collision. The etching cage can isolate the silicon wafer from the surrounding environment and play a protective role.

[0032] Through reasonable design, the etching cage can make the etching liquid flow evenly around the silicon wafer, thereby improving the uniformity of etching. For example, the small holes or grids on the cage can control the flow rate and direction of the etching liquid, so that the etching liquid can evenly cover the surface of the silicon wafer, ensuring that the degree of corrosion is consistent in each part.

[0033] Etching cages are mainly used in wet and dry etching processes of silicon wafers. They are widely used in semiconductor manufacturing, solar cell manufacturing, MEMS device manufacturing and other fields. For example, in semiconductor wafer factories, etching cages are used to perform various etching treatments on silicon wafers to prepare different structural layers of integrated circuits; in solar cell production lines, etching cages are used in processes such as texturing and edge etching of silicon wafers to improve the performance of solar cells.

[0034] In a preferred embodiment, the etching cage is provided with grooves, and the grooves are used to fix the silicon wafer.

[0035] The grooves can fix the silicon wafer in parallel in the etching cage and are used to fix the edge of the silicon wafer so as not to affect the etching effect of the silicon wafer.

[0036] Through such a setting, the present solution can improve the stability of batch operation of silicon wafers through the corrosion cage, avoid mutual scratches between silicon wafers, and improve the product yield of silicon wafers.

[0037] Step S102, fixing the silicon wafer in the etching cage;

[0038] In this solution, it can be fixed manually or by machine equipment. Specifically, a batch of silicon wafers can be inserted into the etching cage along the grooves of the etching cage to fix the wafers through the grooves in the etching cage.

[0039] Step S103, using an etching machine to perform etching treatment on the silicon wafer in the etching cage;

[0040] Specifically, the corrosion cage may be inserted into the corrosion region. It is understandable that the corrosion region may be filled with a corrosion liquid, such as an acidic corrosion liquid or an alkaline corrosion liquid.

[0041] The etching machine is used to perform etching treatment on the silicon wafer in the etching cage, and the silicon wafer can be immersed in the etching liquid for a specified period of time to perform the etching treatment.

[0042] Step S104, after the etching is completed, the etching cage is used to automatically flip the silicon wafer to clean the silicon wafer.

[0043] The etching cage can be removed from the etching solution and moved into clean water to clean the wafer. It can be understood that the removal is performed in batches, so the efficiency of moving the silicon wafers can be improved. At the same time, there is no need to insert and remove them one by one, and it can also avoid the occurrence of stains on the surface of the silicon wafer caused by improper insertion and removal.

[0044] The technical solution provided in this embodiment is to install the etching cage in the etching machine; fix the silicon wafer in the etching cage; use the etching machine to perform etching treatment on the silicon wafer in the etching cage; after the etching is completed, use the etching cage to automatically flip the silicon wafer to clean the silicon wafer. By adopting this solution, the automatic flipping in the etching machine can be realized through the etching cage, which can improve the flipping efficiency, avoid the problem of stains formed by the silicon wafer being exposed to the air after etching, and improve the product yield of the silicon wafer.

[0045] In a preferred embodiment, the automatic film reversing process is carried out in water.

[0046] The automatic wafer flipping process can be carried out in water. For example, the movement of the corrosion cage can be controlled in an area filled with water. This not only allows batch flipping, but also ensures that the silicon wafers will not be exposed to the air and form stains.

[0047] Through such a setting, the present solution can improve the product yield of silicon wafers, and can realize automatic wafer reversal in water, thereby avoiding the problem that the silicon wafers are exposed to the air, which affects the corrosion effect and causes corrosion stains.

[0048] In a preferred embodiment, the corrosion cage is fixed in an automatic film rewinding machine, and is used to control the movement of the corrosion cage through the automatic film rewinding machine to achieve automatic film rewinding processing.

[0049] In one solution, an automatic wafer reversing machine is usually used in conjunction with an etching cage when handling silicon wafers. The automatic wafer reversing machine can place silicon wafers into the etching cage or remove silicon wafers from the etching cage. During this process, the automatic wafer reversing machine needs to accurately identify and operate the etching cage to ensure that the silicon wafers can be transferred safely and quickly. The design of the etching cage will also take into account the operating requirements of the automatic wafer reversing machine. For example, the shape and size of the etching cage should be convenient for the automatic wafer reversing machine to grab and place, and there may be some specific markings or structures on the cage so that the automatic wafer reversing machine can accurately identify and locate it. Together, they ensure the safe and efficient flow of silicon wafers during the production process. The etching cage ensures the stability and uniformity of the silicon wafers during the etching process, and the automatic wafer reversing machine is responsible for quickly and accurately handling the silicon wafers between different processes. They work together to ensure the smooth progress of the entire production process.

[0050] In another solution, an automatic film rewinding machine can be used to fix the corrosion cage and control the corrosion cage, so as to better control the movement of the corrosion cage in the corrosion machine.

[0051] Through such a setting, the present scheme can accurately control the movement of the silicon wafer in the etching machine through the setting of the automatic wafer reversing machine, realize automatic wafer reversing, and do not require manual operation by the staff, thereby improving the production efficiency of the silicon wafer and reducing the risk of affecting the production quality of the silicon wafer due to improper operation.

[0052] In a preferred embodiment, the method further comprises:

[0053] Get the specification parameter information of the corrosion machine;

[0054] The size of the etching cage is determined according to the specification parameter information so that the automatic film rewinding machine can control the etching cage to perform automatic film rewinding processing in the etching machine.

[0055] In this solution, the specification parameter information of the corrosion machine may include information such as the length and width of the corrosion area filled with corrosion liquid to determine the size of the corrosion cage so that during the use of the corrosion cage, it can be moved and controlled in the corrosion machine without bumps and the like.

[0056] Through such a setting, this scheme can improve the rationality of the size of the corrosion cage and provide a guarantee for the stability of subsequent operation.

[0057] In a preferred embodiment, the method further comprises:

[0058] The etching cage is used to load the test silicon wafer to perform an automatic wafer flipping test operation and obtain the test result;

[0059] When the test results meet the set requirements, a test pass report is generated.

[0060] In this solution, before using the automatic wafer rewinding machine for automatic wafer rewinding, it is necessary to load the test silicon wafer in the etching cage to perform the automatic wafer rewinding test operation. For example, the etching cage can be used to hold multiple batches of test silicon wafers for testing, and the operation data and result data during the test can be recorded. When both the operation process and the test results can achieve automatic wafer rewinding, a relevant report on passing the test is generated.

[0061] In a preferred embodiment, the test silicon wafers loaded in the etching cage include at least two types.

[0062] It can be understood that the types of test silicon wafers can be set to multiple types, preferably to include all types of silicon wafers that need to be etched by the current etching machine.

[0063] Through such a setting, the present scheme can be tested before production to ensure stable production and avoid damage to silicon wafers due to omissions in the setting of production operations.

[0064] This embodiment also provides a preferred solution.

[0065] Figure 2 This is a schematic diagram of a corrosion cage provided according to some embodiments of the present application. This solution transforms a corrosion cage that can be installed on an etching machine and can be turned over to make different types of dummy films for test processing. After the test results are ok, the product is tested and confirmed. After confirming that there is no problem with the corrosion cage, a film turning machine is customized for batch processing.

[0066] Figure 3 It is a schematic diagram of an automatic film rewinding machine provided according to some embodiments of the present application.

[0067] In order to improve the stains on silicon wafers after etching, this solution uses an automatic wafer reversing machine to perform automatic wafer reversing operations. At the same time, it also proves a problem that the wafer cannot be exposed to the air for a long time. The automatic wafer reversing is carried out in water, and the manual insertion and removal of the wafer is directly exposed to the air. Moreover, the manual insertion time takes about 6-7 minutes per cage, and the automatic wafer reversing machine can basically complete it in 3-4 minutes, which also saves 2-3 minutes. The silicon wafer needs to be cleaned as soon as possible after etching, so the automatic wafer reversing machine plays an important role.

[0068] In addition, some embodiments of the present application also provide an electronic device. The electronic device may be a digital computer in various forms, such as a laptop computer, a desktop computer, a workbench, a personal digital assistant, a server, a blade server, a mainframe computer, etc. The electronic device may also be a mobile device in various forms, such as a personal digital assistant, a cellular phone, a smart phone, a wearable device, and other similar computing devices.

[0069] The electronic device includes: one or more processors; and a memory storing computer program instructions, wherein when the computer program instructions are executed, the processor executes the steps of the method provided in any one or more of the above embodiments. Figure 4 An exemplary structural diagram of the electronic device is disclosed. Figure 4As shown, the electronic device includes: one or more processors 401, memory 402, and interfaces for connecting various components, including high-speed interfaces and low-speed interfaces. The various components are connected to each other using different buses and can be installed on a common mainboard or installed in other ways as needed. The processor can process instructions executed in the electronic device, including instructions stored in or on the memory to display the graphical information of the GUI on an external input / output device (such as a display device coupled to the interface). In some other embodiments, if necessary, multiple processors and / or multiple buses can be used together with multiple memories and multiple memories. Similarly, multiple electronic devices can be connected, and each device provides some necessary operations (for example, as a server array, a group of blade servers, or a multi-processor system). Among them, the components shown in this article, their connections and relationships, and their functions are only used as examples, and are not intended to limit the implementation of the present application described and / or required herein.

[0070] The electronic device may further include: an input device 403 and an output device 404. The processor 401, the memory 402, the input device 403 and the output device 404 may be connected via a bus or other means. Figure 4 The example of connecting through bus is taken in the following.

[0071] The input device 403 can receive input digital or character information, and generate key signal input related to the user settings and function control of the electronic device, such as a touch screen, a keypad, a mouse, a track pad, a touch pad, an indicator bar, one or more mouse buttons, a trackball, a joystick and other input devices. The output device 404 may include a display device, an auxiliary lighting device (e.g., an LED) and a tactile feedback device (e.g., a vibration motor), etc. The display device may include, but is not limited to, a liquid crystal display (LCD), a light emitting diode (LED) display and a plasma display. In some embodiments, the display device may be a touch screen.

[0072] To provide interaction with a user, the electronic device may be a computer. The computer has: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or a trackball), through which the user can provide input to the computer. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0073] In the embodiments of the present application, a computer program / instruction is stored on a computer-readable medium, and when the computer program / instruction is executed by a processor, the steps of the method provided by any one or more of the above embodiments are implemented. The computer-readable medium may be included in the electronic device described in the above embodiments; or it may exist independently without being assembled into the device. The above computer-readable medium carries one or more computer-readable instructions.

[0074] The memory 402 can be used as a non-transient computer-readable storage medium, which can be used to store non-transient software programs, non-transient computer executable programs and modules. The processor 401 executes various functional applications and data processing of the server by running the non-transient software programs, instructions and modules stored in the memory 402, so as to implement the program instructions / modules corresponding to the method provided by any one or more of the above embodiments in the embodiments of the present application.

[0075] The memory 402 may include a program storage area and a data storage area, wherein the program storage area may store an operating system, an application required for at least one function; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory 402 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory 402 may optionally include a memory remotely arranged relative to the processor 401, and these remote memories may be connected to the electronic device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0076] It should be noted that the computer-readable medium described in the present application may be a computer-readable signal medium or a computer-readable storage medium or any combination of the above two. The computer-readable medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared or semiconductor system, device or device, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, device or device.

[0077] Computer readable media include permanent and non-permanent, removable and non-removable media, and can be implemented by any method or technology to store information. Information can be computer readable instructions, data structures, modules of programs or other data. Examples of computer storage media include, but are not limited to, phase change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, read-only compact disk (CD-ROM), digital versatile disk (DVD) or other optical storage, magnetic cassettes, magnetic tape disk storage or other magnetic storage devices or any other non-transmission medium that can be used to store information that can be accessed by a computing device.

[0078] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages, such as Java, Smalltalk, C++, and conventional procedural programming languages, such as "C" language or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as an independent software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet).

[0079] In the above-described embodiments, it can be implemented in whole or in part by software, hardware, firmware or any combination thereof. For example, it can be implemented by using an application specific integrated circuit (ASIC), a general-purpose computer or any other similar hardware device. In certain embodiments, the software program of the present application can be executed by a processor to implement the above steps or functions. Similarly, the software program of the present application (including relevant data structures) can be stored in a computer-readable recording medium, for example, a RAM memory, a magnetic or optical drive or a floppy disk and similar devices. In addition, some steps or functions of the present application can be implemented by hardware, for example, as a circuit that cooperates with a processor to perform each step or function.

[0080] The computer program product provided in the embodiment of the present application includes one or more computer programs / instructions, and when the computer program / instructions are executed by the processor, the process or function described in the embodiment of the present application is generated in whole or in part. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions may be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium, for example, the computer instructions may be transmitted from a website site, a computer, a server or a data center by wired (e.g., coaxial cable, optical fiber, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) mode to another website site, computer, server or data center. The computer-readable storage medium may be any available medium that a computer can access or a data storage device such as a server or a data center that includes one or more available media integrations. The available medium may be a magnetic medium, (e.g., a floppy disk, a hard disk, a tape), an optical medium (e.g., a DVD), or a semiconductor medium (e.g., a solid-state drive so lid state di sk (SSD)), etc.

[0081] The flow chart or block diagram in the accompanying drawings shows the possible architecture, function and operation of the equipment, method and computer program product according to various embodiments of the present application. In this regard, each box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or flow chart, and the combination of the boxes in the block diagram and / or flow chart can be implemented with a dedicated system for hardware that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0082] The scope of the present application is defined by the appended claims rather than the above description, and it is intended that all changes that fall within the meaning and scope of the equivalent elements of the claims are included in the present application. Any figure mark in the claims should not be regarded as limiting the claims involved. In addition, it is clear that the word "comprising" does not exclude other units or steps, and the singular does not exclude the plural. Multiple units or devices stated in the device claim may also be implemented by one unit or device through software or hardware. The words "first", "second", etc. are only used to distinguish the description, and do not indicate any particular order, nor can they be understood as indicating or implying relative importance.

[0083] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily mention changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims, and the above embodiments should be regarded as exemplary and non-restrictive.

Claims

1. A method for improving silicon wafer stains, characterized in that: The method comprises: Installing the corrosion cage in the corrosion machine; Fixing the silicon wafer in the etching cage; Using an etching machine to perform etching treatment on the silicon wafer in the etching cage; After the etching is completed, the etching cage is used to automatically flip the silicon wafer to clean the silicon wafer.

2. The method according to claim 1, characterized in that The automatic film rewinding process is carried out in water.

3. The method according to claim 1, characterized in that The etching cage is provided with grooves, and the grooves are used to fix the silicon wafer.

4. The method according to claim 1, characterized in that: The corrosion cage is fixed in an automatic film rewinding machine and is used to control the movement of the corrosion cage through the automatic film rewinding machine to realize automatic film rewinding processing.

5. The method according to claim 4, characterized in that The method further comprises: Get the specification parameter information of the corrosion machine; The size of the etching cage is determined according to the specification parameter information so that the automatic film rewinding machine can control the etching cage to perform automatic film rewinding processing in the etching machine.

6. The method according to claim 5, characterized in that The method further comprises: The etching cage is used to load the test silicon wafer to perform an automatic wafer flipping test operation and obtain the test result; When the test results meet the set requirements, a test pass report is generated.

7. The method according to claim 6, characterized in that The test silicon wafers loaded in the etching cage include at least two types.

8. An electronic device, characterized in that: The electronic device comprises: one or more processors; and A memory storing computer program instructions, which, when executed, cause the processor to perform the steps of the method as claimed in any one of claims 1 to 7.

9. A computer readable medium having a computer program / instructions stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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