Semiconductor process machine and process method

Abstract

The invention discloses a semiconductor process machine table and a process method. The machine table comprises a bonding head used for receiving a to-be-bonded chip, the bonding head is provided with a first identifier, and the chip is provided with a second identifier; the visual component is positioned above the bonding head so as to detect an offset value of the first identifier and the second identifier; the magnetic levitation motion platform is located below the wafer to be bonded so as to drive the bonding head to move in any direction on the magnetic levitation motion platform; the controller is connected with the bonding head, the visual component and the magnetic levitation motion platform, and is configured to obtain an offset value of the first identifier and the second identifier based on the visual component; adjusting the pose of the bonding head and / or the chip to compensate the offset value of the first identifier and the second identifier; according to the wafer graph of the wafer, driving the bonding head to move to a target bonding position on the magnetic suspension motion platform; and bonding the chip and the wafer. According to the invention, the intermediate compensation amount can be reduced, the productivity can be greatly improved, and a bonding chip with a smaller size can be compatible.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor equipment, and in particular to a semiconductor process machine, a semiconductor process method, and a computer-readable storage medium. Background Art

[0002] In the die to wafer bonding process in the semiconductor process, the photolithography and dicing completed chips need to be picked up one by one from the adhesive film material (such as UV film) and then mounted on the wafer. In the semiconductor process machine, the pick up module and the bonding module are two separate parts. The pick up module is mainly responsible for removing the chip from the UV film, while the bonding module is mainly responsible for bonding the chip to the wafer. Since the bonding accuracy requirements are usually at the nanometer level, the accuracy requirements for the bonding module are very high. With the development of technology and processes, there are also higher requirements for the output of semiconductor process machines, and the production capacity of the machine needs to be greatly improved.

[0003] There are still some problems in the current semiconductor process machines. First, the production capacity of the machine is still low. The reason is that since the existing bonding module needs to have a higher bonding accuracy, a large number of optical components are added to the bonding module to assist in multiple compensation and calibration. However, the addition of optical components will lead to an increase in measurement points, which will further increase the measurement time and the number of steps for compensation calculation, which will reduce the production capacity limit in disguise, thus leading to the bottleneck of production. Secondly, the optical sensor system of the machine is difficult to design. In the semiconductor process machine, it is necessary to be compatible with chips of different sizes, so the optical system also needs to be compatible with various chip sizes. Although the traditional bonding head is compatible with many optical components, it limits the compatibility of the bonding head assembly with smaller chips and cannot meet the bonding requirements of smaller chips. Due to limited space, smaller chips cannot be detected. Moreover, most of the existing bonding heads are driven by linear motors and can only perform translational movements in the X and Y directions.

[0004] In order to solve the above-mentioned problems existing in the prior art, the art urgently needs an improved semiconductor process technology that can achieve high-precision and high-freedom positioning of the bonding head, thereby eliminating the calibration process, reducing the intermediate compensation amount, greatly improving production capacity, and simplifying the component structure of the bonding head, thereby being compatible with smaller chip bonding. Summary of the invention

[0005] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0006] In order to overcome the above-mentioned defects of the prior art, the present invention provides a semiconductor process machine, a semiconductor process method, and a computer-readable storage medium, which can achieve high-precision and high-freedom positioning of the bonding head, thereby eliminating the calibration process, reducing the intermediate compensation amount, greatly improving the production capacity, and simplifying the component structure of the bonding head, thereby being compatible with the bonding of smaller chips.

[0007] Specifically, the above-mentioned semiconductor process machine provided according to the first aspect of the present invention includes: a bonding head, used to receive the chip to be bonded, wherein the bonding head is provided with a first mark, and the chip is provided with a second mark; a visual component, located above the bonding head, used to detect the offset value of the first mark and the second mark; a magnetic levitation motion platform, located below the wafer to be bonded, used to drive the bonding head to move in any direction on the magnetic levitation motion platform; and a controller, connected to the bonding head, the visual component and the magnetic levitation motion platform, configured to: obtain the offset value of the first mark and the second mark based on the visual component; adjust the posture of the bonding head and / or the chip to compensate for the offset value of the first mark and the second mark; drive the bonding head to move to the target bonding position on the magnetic levitation motion platform according to the wafer map of the wafer to be bonded; and bond the chip and the wafer.

[0008] In addition, the semiconductor process method provided according to the second aspect of the present invention includes the following steps: based on the visual component in the semiconductor process machine provided by the first aspect of the present invention, obtaining the offset value of the first mark on the bonding head and the second mark on the chip to be bonded; adjusting the posture of the bonding head and / or the chip to compensate for the offset value of the first mark and the second mark; according to the wafer map of the wafer to be bonded, driving the bonding head to move to the target bonding position on the magnetic levitation motion platform; and bonding the chip and the wafer.

[0009] In addition, according to the third aspect of the present invention, there is also provided a computer-readable storage medium on which computer instructions are stored. When the computer instructions are executed by a processor, the semiconductor process method provided by the second aspect of the present invention is implemented. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0011] Figure 1 A schematic structural diagram of a semiconductor process machine provided according to some embodiments of the present invention is shown;

[0012] Figure 2 A top view of a magnetic levitation motion platform including a bonding head provided according to some embodiments of the present invention is shown;

[0013] Figure 3 Shows Figure 2 A top view of the magnetic levitation motion platform without the bonding head shown;

[0014] Figure 4A A schematic diagram of the structure of a bonding head in a semiconductor process machine in the prior art is shown;

[0015] Figure 4B Shows Figure 4A The optical path schematic diagram of chip identification on the bonding head is shown;

[0016] Figure 5 A schematic structural diagram of a bonding head provided according to some embodiments of the present invention is shown;

[0017] Figure 6 A schematic structural diagram of an ejector lifting assembly provided according to some embodiments of the present invention is shown;

[0018] Figure 7 A flowchart showing a bonding method provided according to some embodiments of the present invention; and

[0019] Figure 8 A schematic diagram of the process of multi-chip interfacing and bonding provided according to some embodiments of the present invention is shown.

[0020] Reference numerals:

[0021] 100 semiconductor process equipment;

[0022] 110, 410 bonding head;

[0023] 120 visual components;

[0024] 130 Magnetic levitation platform;

[0025] 140 Passive vibration reduction platform;

[0026] 150 marble platform;

[0027] 210 magnet array;

[0028] 211 first three-phase coil;

[0029] 212 second three-phase coil;

[0030] 230 plane grating;

[0031] 231 first reading head;

[0032] 232 second reading head;

[0033] 240 Spectral Confocal Sensor;

[0034] 250 Optical system;

[0035] 420 Traditional Visual Components;

[0036] 430 small size chip;

[0037] 510 mobile station;

[0038] 520 Rotating motor;

[0039] 530 lifting motor;

[0040] 540 pressure sensor;

[0041] 600 Ejector lifting assembly;

[0042] 610 lifting ejector pin;

[0043] 620 Inverted tray;

[0044] 630 Vacuum support;

[0045] Steps S710 to S740;

[0046] 810 wafer stage;

[0047] 820 first chip;

[0048] 821 First Pickup Head;

[0049] 822 second pickup head;

[0050] 823 third chip;

[0051] 831 first bonding head;

[0052] 832 a second bonding head; and

[0053] 840 wafers. DETAILED DESCRIPTION

[0054] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0055] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0057] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0058] As mentioned above, there are still some problems in the current semiconductor process machines. First, the production capacity of the machine is still low. The reason is that since the existing bonding module needs to have a higher bonding accuracy, a large number of optical components are added to the bonding module to assist in multiple compensation and calibration. However, the addition of optical components will lead to an increase in measurement points, which will further increase the measurement time and the number of steps for compensation calculation, which will reduce the production capacity limit in disguise, thus leading to the bottleneck of production. Secondly, the optical sensor system of the machine is difficult to design. In the semiconductor process machine, it is necessary to be compatible with chips of different sizes, so the optical system also needs to be compatible with various chip sizes. Although the traditional bonding head is compatible with many optical components, it limits the compatibility of the bonding head assembly with smaller chips and cannot meet the bonding requirements of smaller chips. Due to limited space, smaller chips cannot be detected. Moreover, most of the existing bonding heads are driven by linear motors and can only perform translational movements in the X and Y directions.

[0059] In order to solve the above-mentioned problems existing in the prior art, the present invention provides a semiconductor process machine, a semiconductor process method, and a computer-readable storage medium, which can achieve high-precision and high-freedom positioning of the bonding head, thereby eliminating the calibration process, reducing the intermediate compensation amount, greatly improving the production capacity, and simplifying the component structure of the bonding head, thereby being compatible with smaller chip bonding.

[0060] In some non-limiting embodiments, the semiconductor process tool provided by the first aspect of the present invention may be used to implement the semiconductor process method provided by the second aspect of the present invention.

[0061] Specifically, in some non-limiting embodiments, the computer-readable storage medium provided in the third aspect of the present invention stores computer instructions, which, when executed by a processor, can be used to implement the semiconductor process method provided in the second aspect of the present invention.

[0062] The working principle of the semiconductor process machine described above will be described below in conjunction with some embodiments of semiconductor process methods. Those skilled in the art will understand that these embodiments of semiconductor process methods are only some non-limiting implementation methods provided by the present invention, and are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all working modes or all functions of the semiconductor process machine. Similarly, the semiconductor process machine is only a non-limiting implementation method provided by the present invention, and does not constitute a limitation on the implementation subject of each step in these semiconductor process methods.

[0063] Please see Figure 1 , Figure 1A schematic structural diagram of a semiconductor process machine provided according to some embodiments of the present invention is shown.

[0064] like Figure 1 As shown, in some embodiments of the present invention, the semiconductor process tool 100 may include: a bonding head 110, a visual component 120, a magnetic levitation motion platform 130 and a controller ( Figure 1 (not shown in the figure). The bonding head 110 is used to receive the chip to be bonded, wherein the bonding head 110 may be provided with a first mark, and the chip may be provided with a second mark. The visual component 120 may be arranged above the bonding head 110, and is used to detect the offset value of the first mark and the second mark. The magnetic levitation motion platform 130 may be located below the wafer to be bonded, and is used to drive the bonding head 110 to move in any direction on the magnetic levitation motion platform 130. The controller may connect the bonding head 110, the visual component 120 and the magnetic levitation motion platform 130, and is configured to: obtain the offset value of the first mark and the second mark based on the visual component 120. Then, adjust the posture of the bonding head 110 and / or the chip to compensate for the offset value of the first mark and the second mark. Afterwards, the bonding head 110 may be driven to move to the target bonding position on the magnetic levitation motion platform 130 according to the wafer map of the wafer to be bonded. Finally, bond the chip and the wafer.

[0065] Specifically, see Figure 2 , Figure 2 A top view of a magnetically levitated motion platform including a bonding head provided according to some embodiments of the present invention is shown.

[0066] like Figure 2 As shown, in some embodiments, the magnetic levitation motion platform 130 may include a magnet array 210. The magnet array 210 extends along a horizontal plane. The bonding head 110 may include a first three-phase coil 211 and a second three-phase coil 212. Further, the bonding head 110 may be provided with a first three-phase coil 211 on both sides along the first direction, and a second three-phase coil 212 on both sides along the second direction. The first three-phase coil 211 interacts with the magnet array 210 to generate thrust along the horizontal first direction and the vertical direction. The second three-phase coil 212 interacts with the magnet array 210 to generate thrust along the horizontal second direction and the vertical direction, so that the bonding head 110 can be suspended above the magnetic levitation motion platform 130, and drive the bonding head 110 to perform six degrees of freedom in the magnetic levitation motion platform 130, that is, translation in the first direction, the second direction and the vertical direction, and rotation around the first direction, the second direction and the vertical direction. The first direction and the second direction are orthogonal to each other. The magnetic levitation motion platform 130 can provide nanometer-level ultra-high precision movement and positioning for the bonding head 110 .

[0067] like Figure 2 As shown, further, in some preferred embodiments, the bonding head 110 may further include a plane grating 230. Correspondingly, the magnetic levitation motion platform 130 may include a reading head for reading the coordinates of the plane grating 230.

[0068] Specifically, see Figure 3 , Figure 3 Shows Figure 2 The top view of the magnetic levitation motion platform without the bonding head is shown. Figure 3 As shown, the magnetic levitation motion platform 130 may include a first reading head 231 and a second reading head 232, which are used to read the coordinates of the plane grating 230 in the bonding head 110 in the first direction and the second direction respectively. When a first reading head 231 and a second reading head 232 are provided below the plane grating 230, the translation of the bonding head 110 in the first direction and the second direction can be calculated and controlled according to the read horizontal coordinate values ​​in the first direction and the second direction.

[0069] Further, on this basis, preferably, a plurality of first reading heads 231 for reading the first direction coordinates and / or second reading heads 232 for reading the second direction coordinates can be added below the plane grating 230, so that the rotation of the bonding head 110 around the first direction and / or the second direction can be controlled according to the displacement signals read by the plurality of reading heads.

[0070] Please continue as Figure 3 As shown, optionally, the magnetic levitation motion platform 130 may further include a spectral confocal sensor 240. The spectral confocal sensor 240 may be located below the plane grating 230, and is used to read the coordinates of the plane grating 230 in the bonding head 110 in the vertical direction. The use of the spectral confocal sensor 240 to replace the Hall sensor, eddy current displacement sensor, etc. can greatly improve the measurement accuracy in the vertical direction.

[0071] Furthermore, if Figure 3As shown, in some preferred embodiments, at least three non-collinear spectral confocal sensors 240 (such as four non-collinear spectral confocal sensors 240) may be included below the plane grating 230 to read the rotation angle of the plane grating 230 in the bonding head 110 around the first direction and / or the second direction. As long as there are always three non-collinear spectral confocal sensors 240 located below the plane grating 230, the three spectral confocal sensors 240 can respectively read the coordinates of the three positions on the surface of the plane grating 230 corresponding to them in the vertical direction. A plane can be determined based on the three non-collinear points, and the spectral confocal sensor 240 can feed back at least three vertical displacement signals to the controller, and the controller can control the translation of the bonding head 110 in the vertical direction and the rotation around the first direction and / or the second direction. That is to say, no matter reading the coordinates of the bonding head 110 in the first horizontal direction, the second direction or the vertical direction, they can all be accurately obtained through the detection component of the plane grating 230, and the plane grating 230 is used as a unified object to be measured, thereby achieving a unified measurement reference.

[0072] Please continue as Figure 2 As shown, in some optional embodiments of the present invention, the first three-phase coil 211 and the second three-phase coil 212 are sequentially arranged outside the plane grating 230, so that the first three-phase coil 211 and the second three-phase coil 212 and the plane grating 230 can be basically located in the same plane, thereby, not only can the interaction effect between the coil group and the magnet array 210 be ensured at a smaller height, but also the mutual coordination between the reading head, the spectral confocal sensor 240 and the plane grating 230 can be achieved.

[0073] In the above embodiment, the bottom of the semiconductor process machine 100 in the present invention adopts a high-precision motion control system as a whole. By driving the bond head 110 to perform high-precision and high-flexibility displacement through the magnetic levitation motion platform 130, the motion control accuracy of the bond head 110 can be effectively improved, so that the bond head 110 can move to the target position quickly and accurately. In addition, in combination with the plane grating 230 configured in the bond head 110 as a detection component, high-precision detection and positioning of the bond head 110 can be achieved, thereby eliminating the steps of a large number of optical components in the prior art to assist in multiple compensation and calibration, reducing the amount of intermediate compensation and greatly improving production capacity.

[0074] Those skilled in the art can understand that the solution of the high-precision motion control platform of the above-mentioned magnetic levitation motion platform is only a non-limiting implementation method provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific solution that is convenient for the public to implement, rather than to limit the scope of protection of the present invention. Optionally, in other embodiments, those skilled in the art can also adopt other high-precision motion control platforms based on the concept of the present invention to enable the bonding head to achieve ultra-high precision movement and positioning.

[0075] Please continue to return Figure 1 ,like Figure 1 As shown, preferably, the magnetic levitation motion platform 130 can be placed on the passive vibration reduction platform 140, that is, supported by the passive vibration reduction platform 140. The passive vibration reduction platform 140 can filter vibrations, so that it can be used to limit the coupling ability between external vibrations and the magnetic levitation motion platform 130, which is conducive to enabling the bonding head 110 on the magnetic levitation motion platform 130 to achieve higher bonding accuracy requirements. The magnetic levitation motion platform 130 and the passive vibration reduction platform 140 can both be set on the marble platform 150 and the bracket to provide good installation accuracy and stability.

[0076] Next, see Figure 4A and Figure 4B , Figure 4A The figure shows a schematic diagram of the structure of a bonding head in a semiconductor process machine in the prior art. Figure 4B Shows Figure 4A Schematic diagram of the optical path for chip identification on the bonding head.

[0077] like Figure 4A As shown, in the prior art, in order to identify at least two marks in the chip on the bonding head 410, two traditional visual components 420 are usually attached to both sides of the bonding head 410. Figure 4B As shown, when bonding a small-sized chip 430 , the structure of the overall bonding head 410 is difficult to design due to factors such as the lens size of the traditional visual component 420 and the need to avoid the middle area.

[0078] In this regard, the present invention also improves the bonding head 110 in the bonding module. Figure 5 , Figure 5 A schematic structural diagram of a bonding head provided according to some embodiments of the present invention is shown.

[0079] like Figure 5As shown, optionally, a moving platform 510 may be provided at the bottom of the bonding head 110 to accommodate the above-mentioned plane grating 230, the first three-phase coil 211 and the second three-phase coil 212. A rotating motor 520 may be included above the moving platform 510, which can be used to adjust the position and / or posture of the bonding head 110 so that the first mark on the bonding head 110 is aligned with the second mark on the chip to ensure subsequent high-precision bonding. A Z-axis lifting motor 530 may be provided above the rotating motor 520 to drive the bonding head 110 to rise so as to lift the chip on the bonding head 110 and press-bond it with the wafer located above it. Furthermore, the bonding head 110 may also include a pressure sensor 540, which can be used to measure the pressure when the chip and the wafer are bonded to provide a suitable bonding pressure to avoid excessive bonding pressure causing damage to the chip or wafer, or too little bonding pressure causing the chip to fall off.

[0080] Furthermore, please combine Figure 1 As shown, in the embodiment of the present invention, since the visual component 120 is arranged on the upper support of the semiconductor process machine 100, the offset value between the first mark on the bonding head 110 and the second mark on the chip can be directly detected by the middle visual component 120, and then the offset value is directly compensated by the motion system of the high-precision magnetic levitation motion platform 130, and then the chip can be accurately moved to the bottom of the bonding position of the wafer for direct bonding. Therefore, the present invention can eliminate the traditional visual component 420 attached to the bonding head 110, simplify the component structure of the bonding head 110, and directly use the high-precision movable bonding head 110, and can also reduce multiple calibration compensation calculation process steps, and the bonding head 110 has no optical components and can be compatible with chips with larger size spans, meeting the bonding requirements for smaller chips.

[0081] Please continue to return Figure 1 Optionally, the semiconductor processing machine 100 may further include a pin lifting assembly 600, which is located on a marble support above the magnetic levitation motion platform 130 and is used for wafer transfer. Figure 6 As shown, Figure 6 The schematic diagram of the structure of the ejector pin lifting assembly provided according to some embodiments of the present invention is shown. The lifting ejector pin 610 can drive the inverted tray 620 to descend to receive the wafer to be bonded, and after receiving, the inverted tray 620 can continue to be driven to rise to the position to be bonded. In some optional embodiments, on the marble support, the ejector pin lifting assembly 600 can also move in the X and Y directions to fine-tune the wafer.

[0082] Furthermore, if Figure 6As shown, optionally, a vacuum support 630 may be further included above the inverted tray 620. The vacuum support 630 is provided with three vacuum ejector pins 631 for adsorbing and fixing the wafer. Preferably, an adsorption structure may also be provided in the inverted tray 620, that is, the inverted tray 620 is a vacuum adsorbed wafer carrier for further adsorbing and fixing the back side of the wafer so that the bonding surface to be bonded faces downward.

[0083] Please continue to return Figure 1 , and combined with Figure 3 It is commonly understood that in some embodiments of the present invention, an optical system 250 may also be provided in the magnetic levitation motion platform 130 to obtain a wafer map of the wafer above it that has reached the position to be bonded. A wafer map refers to the process of making a circuit on a wafer through various complex physical and chemical methods. In the final stage of production, different electrical function tests will be performed to ensure the functionality of the product. The pattern generated by using these test results and combining them with the shape of the wafer is a wafer map. The wafer map can be based on the chip, and the results of the test can be marked at the position of each chip with different colors, shapes or codes. In this embodiment, a third mark may be included on the wafer map to indicate the target bonding position of the chip. In a high-precision motion system using a photolithography machine, the optical system 250 scans the wafer from bottom to top, and the controller can obtain relevant position information (third mark) on the wafer, so that it can determine where to position the bonding head 110 for bonding.

[0084] Alternatively, if Figure 1 As shown, in other embodiments of the present invention, in order to improve the production capacity of the machine, two bonding heads 110 may be provided on the magnetic levitation motion platform 130 in the semiconductor process machine 100. Correspondingly, the semiconductor process machine 100 may also include two pickup heads (not shown in the drawings) to correspond to the two bonding heads 110 respectively, so as to improve the efficiency of picking up and bonding. Each pickup head can move along the X-axis direction, the Y-axis direction, the Z-axis direction and the Rz direction, wherein the X-axis direction can transfer the chip and be used for the two pickup heads to move toward each other, the Y-axis direction can realize the avoidance function of the two pickup heads when the two pickup heads move toward each other, the Y-axis direction can be used for the pickup head to press down to pick up, and the Rz direction can control the rotation angle of the pickup head.

[0085] In the prior art, since the precision of the moving axis is easily affected by the acceleration force in the same direction, in order to ensure the bonding precision during the bonding process, other modules (such as the pickup module) are required to be as still as possible. However, in the bonding process projects with high requirements for timing control, it is difficult to balance the unit hourly output (Units Per Hour, UPH) and bonding precision.

[0086] In this regard, in some preferred embodiments, an asynchronous timing multi-chip handover and bonding process can be performed based on two sets of pick-up heads and bonding heads in the semiconductor process machine 100. Specifically, when the first pick-up head picks up the first chip at the chip picking position, the second pick-up head can hand over the second chip with its corresponding second bonding head at the handover position, and at the same time, the first bonding head corresponding to the first pick-up head can prepare or perform bonding of the third chip at the bonding position.

[0087] Optionally, the semiconductor process machine 100 may also include a downward camera. The downward camera may be arranged above the chip picking position, and is used to obtain the position and posture of the first chip before the first pickup head picks up the first chip. Further, the downward camera may also move in the X-axis and / or Y-axis and / or Z-axis directions, so that the downward camera can align and focus on the first chip, and obtain the position and posture of the first chip before picking up. Further, the position of the wafer stage may also be adjusted to correct the position of the first chip to be picked up, so that it corresponds to the chip picking position and is convenient for the pickup head to pick up the chip. After the controller obtains the position and posture of the first chip via the downward camera, the first pickup head may then be controlled to pick up the first chip at the chip picking position. Those skilled in the art will appreciate that the first pickup head and the second pickup head may both pick up different chips at the chip picking position, and here only the first pickup head picking up the first chip is taken as an example for illustration.

[0088] In some other optional embodiments, the semiconductor process machine 100 may further include a posture correction camera. The posture correction camera may be disposed above the handover position to identify the current position and posture of the second chip located on the second pickup head at the handover position. Then, based on the current position and posture of the second chip, the controller may correct the position of the second chip through the second pickup head, and after the second chip completes the position correction, control the second pickup head to hand over the second chip to the second bonding head. By configuring the posture correction camera, the handover accuracy may be improved.

[0089] In the above preferred embodiment of the present invention, two sets of pick-up heads and bonding heads are used to perform asynchronous timing multi-chip handover and bonding processes, which can ensure that more than 3000 UPH can be achieved under the premise of handover accuracy of ±5μm. In addition, the visual system (downward-looking camera and posture correction camera) can be used to perform accuracy correction during chip picking and handover.

[0090] Next, see Figure 7 In order to better introduce the semiconductor process machine 100 provided by the present invention, Figure 7 A flow chart of a semiconductor process method provided according to some embodiments of the present invention is shown.

[0091] In some embodiments of the present invention, when executing Figure 7Before step S710 in the above, the chip to be bonded needs to be transferred to the bonding head.

[0092] However, in current bonding machines, the pick-up module and the bonding module are usually installed on the same machine. In situations where the bonding accuracy is high, the pick-up module needs to stop moving during bonding. The reason is that the acceleration force of the pick-up module's picking action can easily affect the moving axis in the bonding head, causing the bonding accuracy to decrease. Therefore, in high-precision bonding processes, other modules need to be kept as still as possible. However, this limitation has led to the fact that in bonding process projects with high requirements for timing control, the bonding machine often cannot take into account both UPH and bonding accuracy.

[0093] In this regard, in some preferred embodiments, in order to ensure bonding accuracy while improving the UPH of the semiconductor process machine 100, two bonding heads 110 may be provided on the magnetic levitation motion platform 130 in the semiconductor process machine 100. Correspondingly, the semiconductor process machine 100 may also include two pickup heads to correspond to the two bonding heads 110 respectively, and perform asynchronous timing multi-chip handover and bonding operations on multiple chips bonded to the same wafer, thereby improving the timing planning, handover method and mounting logic, thereby improving the bonding efficiency and the machine production capacity.

[0094] Specifically, please combine Figure 8 Common understanding, Figure 8 A schematic diagram of the process of multi-chip interfacing and bonding provided according to some embodiments of the present invention is shown.

[0095] like Figure 8 As shown in the A and B areas in the figure, the wafer stage 810 has the functions of UV film expansion and wafer rotation, and has XY movement to ensure that the chip picking position is fixed. A pin structure is provided under the wafer stage 810 to lift the chip to remove the chip from the film. In this embodiment, the chip picking position and the handover position of the two pick-up heads are at the same point. Taking the complete picking, handover and bonding process of the first chip 820 as an example, Figure 8 As shown in the A area in FIG. 1 , the first pickup head 821 performs a downward pressing picking action in the Z-axis direction at the chip picking position, and does not flip the first chip 820 after picking it up from the wafer stage 810, but continues to perform the positive X-axis ( Figure 8 The first chip 820 is moved to the handover position and handed over to the corresponding first bonding head 831 located below it. Then, after the first bonding head 831 obtains the first chip 820, it does not turn over and continues to move in the positive direction of the X axis ( Figure 8 The first chip 820 is moved to the bonding area by moving the first chip 820 to the right in the bonding area. Then, the first chip 820 is bonded to the wafer 840 from bottom to top in the bonding area.

[0096] Furthermore, since the semiconductor process tool 100 may include two sets of pick-up heads and bonding heads, and the two sets of pick-up heads and bonding heads do not interfere with each other, Figure 8 As shown in the A and B areas in FIG. 1 , in order to ensure that the maximum UPH is achieved, when the first pick-up head 821 picks up the first chip 820 at the chip picking position, its corresponding first bonding head 831 can prepare for bonding of the third chip 823 at the bonding position. At this time, another set of pick-up head bonding heads, i.e., the second pick-up head 822 and the second bonding head 832 can perform the handover action of the second chip at the handover position.

[0097] Preferably, the semiconductor process machine 100 may include a downward camera. The step of the first pickup head 821 picking up the first chip 820 at the chip picking position may further include: identifying the position and posture of the first chip 820 at the chip picking position by the downward camera, and then the controller may adjust the downward camera in the direction of the X-axis and / or the Y-axis and / or the Z-axis to align and focus the downward camera on the first chip 820. After the controller obtains the position and posture of the first chip via the downward camera, it may then control the first pickup head 821 to pick up the first chip 820 at the chip picking position.

[0098] Preferably, the semiconductor process machine 100 may further include a posture correction camera. The posture correction camera may identify the current position and posture of the second chip on the second pick-up head 822 at the handover position. Then, based on the current position and posture of the second chip, the controller may correct the position of the second chip through the second pick-up head, and after the position correction of the second chip is completed, control the second pick-up head 822 to hand over the second chip to the second bonding head 832, thereby improving the handover accuracy.

[0099] Furthermore, if Figure 8 As shown, preferably, after the two groups of pickup heads (the first pickup head 821 and the second pickup head 822) respectively complete the film picking and handover processes, the first pickup head 821 and the second pickup head 822 can simultaneously move toward each other in the X-axis direction to exchange positions, that is, the first pickup head 821 moves to the handover position, and the second pickup head 822 moves to the film picking position. Since the film picking positions of the two pickup heads are in the same position, before the two pickup heads move toward each other, one of the pickup heads needs to move in the Y-axis direction to avoid first, and then the two pickup heads can move toward each other in the X-axis direction. In this embodiment, the offset of the acceleration force brought about by the simultaneous movement of the two groups of pickup heads toward each other can further meet the timing requirements, improve the setting time of the machine, thereby improving the bonding efficiency and the production capacity of the machine.

[0100] Optionally, during the process of transferring the wafer between the pick-up module and the bonding head, the optical system 250 in the magnetic levitation motion platform 130 can scan the wafer image of the wafer to be bonded located above it to obtain multiple third identifications on the wafer image to determine the target bonding positions of multiple chips (for example, the first chip, the second chip, and the third chip).

[0101] After the chip to be bonded is transferred to the bonding head, Figure 7 As shown, step S710 may be performed: based on a visual component in a semiconductor process tool, an offset value between a first mark on a bonding head and a second mark on a chip to be bonded is obtained.

[0102] Continue with Figure 8 Taking the embodiment shown as an example, Figure 8 As shown in area A in FIG. 8 , the first bonding head 831 receiving the third chip 823 moves to below the intermediate visual component 120 , and the controller can detect and calculate the offset value of the first mark on the first bonding head 831 and the second mark on the third chip 823 based on the visual component 120 .

[0103] Then, continue as Figure 7 As shown, step S720 may be performed: adjusting the posture of the bonding head and / or the chip to compensate for the offset value of the first mark and the second mark.

[0104] Specifically, optionally, the position and / or posture of the bond head can be adjusted by a rotary motor in the first bond head 831 to compensate for the offset value of the first mark and the second mark. Optionally, in some other embodiments, the position and / or posture of the third chip 823 can also be adjusted by an external manipulator or other auxiliary device to compensate for the offset value of the first mark and the second mark.

[0105] Then, step S730 may be performed: according to the wafer map of the wafer to be bonded, driving the bonding head to move to the target bonding position on the magnetic levitation motion platform.

[0106] Specifically, if Figure 8 As shown, in some embodiments, since the controller has previously acquired the wafer map of the wafer 840 to be bonded through the optical system 250, the controller can acquire the third identifier corresponding to the third chip 823 according to the wafer map, which is used to locate the target bonding position to which the first bonding head 831 that has received the third chip 823 is to move. Subsequently, the controller can control the first bonding head 831 to move precisely to the target bonding position of the third chip 823 under the wafer 840 on the magnetic levitation motion platform 130, that is, to locate the third chip 823 where to bond.

[0107] Finally, step 740 may be performed: bonding the chip and the wafer.

[0108] Specifically, combined Figure 1 , Figure 5 and Figure 8 As shown, after the first bonding head 831 moves to the target bonding position, the Z-axis lifting motor can be used to drive the first bonding head 831 to rise, thereby lifting the third chip 823 on the first bonding head 831 and pressing it against the wafer 840 located above it to complete the bonding.

[0109] Preferably, after the two groups of bond heads (the first bond head 831 and the second bond head 832) respectively complete the handover and bonding processes, the first bond head 831 and the second bond head 832 can also simultaneously move toward each other in the X-axis direction to exchange positions, that is, the first bond head 831 moves to the handover position, and the second bond head 832 moves to the bonding position. In this embodiment, during the movement of the bond heads, the two bond heads need to move relative to each other as much as possible during motion control. The offset of the acceleration force brought about by the simultaneous opposite movement of the two groups of bond heads can not only meet the timing requirements and improve the setting time of the machine, but also reduce the vibration due to the offset of the acceleration force, ensure the positioning accuracy and the accuracy of subsequent bonding, thereby improving the bonding efficiency and the production capacity of the machine.

[0110] In the process of the two pick-up heads or the two bonding heads moving towards each other at the same time to quickly exchange positions, the acceleration forces between the two pick-up heads or the two bonding heads are respectively ensured to be in opposite directions. Since F=ma, the travel of the pick-up heads or the two bonding heads can be controlled by ensuring that the mass of the two pick-up heads or the two bonding heads is inversely proportional to the acceleration as much as possible.

[0111] Those skilled in the art will understand that Figure 8 The scheme in which the first pickup head 821 is used for picking up the film, the second pickup head 822 and the second bonding head 832 are used for handover, and the first bonding head 831 is used for bonding is only a non-limiting implementation method provided by the present invention, which is intended to clearly demonstrate the main concept of the present invention and provide a specific scheme that is convenient for the public to implement, rather than to limit the protection scope of the present invention. Each pickup head can be located at the film picking position to pick up the film, or at the handover position to handover, and each bonding head can also be located at the handover position to handover, or at the bonding position to bond.

[0112] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0113] Those skilled in the art will further appreciate that the steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be directly embodied in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0114] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0115] In summary, the present invention provides a semiconductor process machine, a semiconductor process method, and a computer-readable storage medium, which can achieve high-precision and high-freedom positioning of the bonding head, thereby eliminating the calibration process, reducing the intermediate compensation amount, and greatly improving the production capacity. It is expected that the production capacity can be increased from 2000pcs / h to about 3000pcs / h, and the component structure of the bonding head can be simplified, thereby being compatible with the bonding of smaller chips.

[0116] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor process machine, characterized in that: include: A bonding head, used for receiving a chip to be bonded, wherein the bonding head is provided with a first mark, and the chip is provided with a second mark; A visual component, located above the bonding head, used to detect the offset value of the first mark and the second mark; A magnetic levitation motion platform, located below the wafer to be bonded, and used to drive the bonding head to move in any direction on the magnetic levitation motion platform; and A controller is connected to the bonding head, the visual component and the magnetic levitation motion platform, and is configured to: obtain the offset value of the first identifier and the second identifier based on the visual component; adjust the posture of the bonding head and / or the chip to compensate for the offset value of the first identifier and the second identifier; drive the bonding head to move to a target bonding position on the magnetic levitation motion platform according to a wafer map of a wafer to be bonded; and bond the chip and the wafer.

2. The semiconductor processing machine according to claim 1, wherein: The magnetic levitation motion platform includes a magnet array, and the bonding head includes a first three-phase coil and a second three-phase coil, wherein the first three-phase coil interacts with the magnet array to generate thrust along a first horizontal direction and a vertical direction, and the second three-phase coil interacts with the magnet array to generate thrust along a second horizontal direction and a vertical direction, and the first direction and the second direction are orthogonal.

3. The semiconductor processing machine according to claim 2, wherein: The bonding head also includes a plane grating, and the magnetic levitation motion platform also includes a first reading head and a second reading head, which are used to read the coordinates of the plane grating in the bonding head in the first direction and the second direction respectively.

4. The semiconductor processing machine according to claim 3, wherein: The magnetic levitation motion platform also includes a spectral confocal sensor, which is located below the plane grating and is used to read the coordinates of the plane grating in the bonding head in the vertical direction.

5. The semiconductor processing machine according to claim 4, wherein: At least three non-collinear spectral confocal sensors are included below the plane grating, which are used to read the rotation angle of the plane grating in the bonding head around the first direction and / or the second direction.

6. The semiconductor processing machine according to claim 1, wherein: The magnetic levitation motion platform is supported via a passive vibration reduction platform, which is used to limit the coupling ability between external vibration and the magnetic levitation motion platform.

7. The semiconductor processing machine according to claim 1, wherein: The bonding head includes a rotating motor for adjusting the posture of the bonding head so that the first mark is aligned with the second mark on the chip.

8. The semiconductor processing machine according to claim 1, wherein: The bonding head comprises a lifting motor for driving the bonding head to rise, so that the chip on the bonding head is lifted up for pressure bonding with the wafer above the bonding head.

9. The semiconductor processing machine according to claim 8, wherein: The bonding head also includes a pressure sensor for measuring the pressure when the chip and the wafer are bonded.

10. The semiconductor processing machine according to claim 1, wherein: Also includes: The ejector pin lifting assembly is located above the magnetic levitation motion platform, and drives the inverted tray to descend by lifting the ejector pins to receive the wafer to be bonded, and drives the inverted tray to rise to the position to be bonded after receiving.

11. The semiconductor processing machine according to claim 10, wherein: An optical system is provided in the magnetic levitation motion platform for acquiring a wafer map of the wafer above it that has reached the position to be bonded, wherein the wafer map includes a third mark for indicating the target bonding position of the chip.

12. The semiconductor processing machine according to claim 1, wherein: Two bonding heads are provided on the magnetic levitation motion platform, and the semiconductor process machine also includes two pick-up heads, which correspond to the two bonding heads respectively, and are used to perform asynchronous timing multi-chip handover and bonding processes, wherein the first pick-up head picks up the first chip at the chip picking position, the second pick-up head performs handover of the second chip with its corresponding second bonding head at the handover position, and the first bonding head corresponding to the first pick-up head prepares for bonding of the third chip at the bonding position.

13. The semiconductor processing machine according to claim 12, wherein: Also includes: The downward-looking camera is disposed above the chip picking position and is used to obtain the position and posture of the first chip before the first pickup head picks up the first chip.

14. The semiconductor processing machine according to claim 13, wherein: Also includes: A posture correction camera is arranged above the handover position, and is used to obtain the position and posture of the second chip when the second pickup head and the second bonding head handover the second chip.

15. A semiconductor process method, characterized in that: The following steps are involved: Based on the visual component in the semiconductor process tool according to any one of claims 1 to 14, obtaining an offset value between a first mark on the bonding head and a second mark on the chip to be bonded; Adjusting the posture of the bonding head and / or the chip to compensate for the offset value of the first mark and the second mark; According to the wafer map of the wafer to be bonded, driving the bonding head to move to a target bonding position on the magnetic levitation motion platform; as well as The chip and the wafer are bonded.

16. The semiconductor process method according to claim 15, wherein: The magnetic levitation motion platform is provided with two bonding heads, and the semiconductor process machine also includes two pickup heads corresponding to the two bonding heads respectively. The step of obtaining the offset value of the first mark on the bonding head and the second mark on the chip to be bonded based on the visual component in the semiconductor process machine includes: The first pick-up head picks up the first chip at the chip picking position, the second pick-up head exchanges the second chip with the second bonding head at the exchange position, and the first bonding head corresponding to the first pick-up head prepares for bonding of the third chip at the bonding position; and Based on the visual component, an offset value of a first mark on the first bonding head and a second mark on the third chip is obtained.

17. The semiconductor process method according to claim 16, wherein: The semiconductor process machine includes a downward-looking camera, and the step of the first pickup head picking up the first chip at the chip picking position further includes: Identifying the position and posture of the first chip at the chip picking position by the downward-looking camera; Adjusting the downward-looking camera in the direction of the X-axis and / or the Y-axis and / or the Z-axis so that the downward-looking camera is aligned and focuses on the first chip; and In response to the downward-looking camera aligning and focusing on the first chip, the first pickup head picks up the first chip at a chip picking position.

18. The semiconductor process method according to claim 16, wherein: The semiconductor process machine includes a posture correction camera, and the step of the second pick-up head handing over the second chip with the second bonding head at the handover position further includes: Identifying the current position and posture of the second chip on the second pickup head at the handover position by means of the posture correction camera; Based on the current position and posture of the second chip, correcting the position of the second chip by the second pickup head; and In response to the second chip completing position correction, the second pickup head delivers the second chip to the second bonding head.

19. The semiconductor process method according to claim 16, wherein: After the steps that the first pick-up head picks up the first chip at the chip picking position, the second pick-up head performs handover of the second chip with the second bonding head at the handover position, and the first bonding head corresponding to the first pick-up head prepares for bonding of the third chip at the bonding position, the method further includes: In response to the first pickup head completing the film picking and the second pickup head completing the handover, the first pickup head and the second pickup head simultaneously move toward each other in the X-axis direction to exchange positions, the first pickup head moves to the handover position, and the second pickup head moves to the film picking position.

20. The semiconductor process method according to claim 16, wherein: After the step of bonding the chip and the wafer, the method further includes: In response to the second bond head completing the handover and the first bond head completing the bonding, the first bond head and the second bond head simultaneously move toward each other in the X-axis direction to exchange positions, the first bond head moves to the handover position, and the second bond head moves to the bonding position.

21. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the semiconductor process method according to any one of claims 15 to 20 is implemented.

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