Ozone water supply unit and substrate processing apparatus including same

Abstract

The invention discloses an ozone water supply unit and a substrate processing apparatus including the same. The ozone water supply unit can maintain stable ozone concentration of ozone water supplied to a substrate. The substrate processing apparatus includes: a chamber for performing liquid processing on a substrate loaded in a processing space using a liquid containing ozone water; and an ozone water supply unit for supplying ozone water to the treatment space, in which the ozone water supply unit comprises: an ozone water generator for generating ozone water; an ozone water supply line for supplying the ozone water generated by the ozone water generator to the treatment space; and a cooler provided in the ozone water supply line to cool the ozone water flowing through the ozone water supply line.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2023-0101237 filed in the Korean Intellectual Property Office on August 2, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present invention relates to an apparatus and method for liquid-treating a substrate, and more particularly, to an apparatus for treating a substrate by using ozone water, and an ozone water supply unit for supplying ozone water used therein. Background Art

[0004] In order to manufacture semiconductor devices or liquid crystal displays, various processes such as photolithography, ashing, ion implantation, thin film deposition and cleaning are performed on a substrate. The cleaning process consists of a chemical treatment operation, a rinsing operation and a drying operation performed in sequence. In the chemical treatment operation, chemicals are supplied to the substrate to etch a thin film formed on the substrate or remove foreign matter on the substrate, and in the rinsing treatment operation, a rinsing liquid such as pure water is supplied to the substrate.

[0005] On the other hand, a treatment solution containing ozone water is used as a treatment solution used during the process to clean organic matter. Ozone water is mixed with pure water or hydrogen fluoride, filtered by a filter, and then used. Ozone water is highly active and unstable, so it is difficult to supply ozone water to the substrate while maintaining the concentration of ozone water at a set concentration. In addition, when ozone water passes through the filter, bubbles are easily generated due to pressure changes, and ozone in the ozone water is easily decomposed. Summary of the invention

[0006] The present invention is directed to providing an ozone water supply unit for effectively treating a substrate, and a substrate treating apparatus including the ozone water supply unit.

[0007] The present invention is also directed to providing an ozone water supply unit capable of improving the ability to clean a substrate by ozone water, and a substrate processing apparatus including the ozone water supply unit.

[0008] The present invention is also directed to providing an ozone water supply unit capable of maintaining a stable ozone concentration of ozone water supplied to a substrate, and a substrate processing apparatus including the ozone water supply unit.

[0009] The present invention is also directed to providing an ozone water supply unit capable of preventing the ozone concentration in ozone water from decreasing when the ozone water passes through a filter, and a substrate processing apparatus including the ozone water supply unit.

[0010] The present invention is not limited thereto, and a person skilled in the art will clearly understand other unmentioned purposes from the following description.

[0011] An exemplary embodiment of the present invention provides a substrate processing apparatus, which includes: a chamber for liquid processing a substrate loaded into a processing space using a liquid containing ozone water; and an ozone water supply unit for supplying ozone water to the processing space, wherein the ozone water supply unit includes: an ozone water generator for generating ozone water; an ozone water supply line for supplying the ozone water generated by the ozone water generator to the processing space; and a cooler disposed in the ozone water supply line to cool the ozone water flowing through the ozone water supply line.

[0012] According to an exemplary embodiment, the cooler may adjust the temperature of the ozone water to a temperature lower than room temperature.

[0013] According to an exemplary embodiment, the ozone water supply unit may further include a filter installed in the ozone water supply line, and the filter may be installed downstream of the cooler.

[0014] According to an exemplary embodiment, the filter may be located adjacent to the cooler.

[0015] According to an exemplary embodiment, the ozone water supply unit may further include a heat serving member for maintaining a temperature of the ozone water supply line constant, and the heat serving member may be disposed to be wrapped around the ozone water supply line downstream of the cooler.

[0016] According to an exemplary embodiment, the substrate treating apparatus may further include: a treating solution supply source for storing the treating solution; a treating solution supply line for supplying the treating solution from the treating solution supply source to the ozone water supply line; and a mixer installed in the ozone water supply line to mix the ozone water with the treating solution.

[0017] According to an exemplary embodiment, a mixer may be provided upstream of the cooler.

[0018] According to an exemplary embodiment, the mixer may include an inline mixer.

[0019] According to an exemplary embodiment, the treatment solution may be deionized water.

[0020] According to an exemplary embodiment, the treatment solution may be a chemical solution.

[0021] According to an exemplary embodiment, the chemical solution may be hydrogen fluoride.

[0022] According to an exemplary embodiment, the chamber may include: a shell provided with an internal space; a cup for providing a processing space; a support unit for supporting a substrate; a nozzle for supplying ozone water to the substrate; and the ozone water supply line may be connected to the nozzle.

[0023] Another exemplary embodiment of the present invention provides a unit for supplying a treatment solution, the unit comprising: a treatment solution supply source, the treatment solution supply source being used to provide a treatment solution; a treatment solution supply pipeline, the treatment solution supply pipeline being used to supply a treatment solution from the treatment solution supply source; a cooler, the cooler being used to cool the treatment solution; and a filter, wherein the cooler and the filter can be arranged in the treatment solution supply pipeline.

[0024] According to an exemplary embodiment, the filter may be located near the cooler, but may be located downstream of the cooler.

[0025] According to an exemplary embodiment, the cooler may cool the ozone water to a temperature below room temperature.

[0026] According to an exemplary embodiment, the ozone water supply unit may further include a heat insulation member, and the heat insulation member may be disposed to be wound around the ozone water supply line downstream of the cooler.

[0027] According to an exemplary embodiment, the treatment solution may include ozone water.

[0028] Another exemplary embodiment of the present invention provides an apparatus for processing a substrate, the apparatus comprising: a chamber for liquid processing a substrate loaded into a processing space using a processing solution; and an ozone water supply unit for supplying a liquid containing ozone water to the processing space, wherein the ozone water supply unit may include: an ozone water generator for generating ozone water; a first ozone water supply line for connecting the ozone water generator to a first nozzle for supplying ozone water to the processing space; a first cooler disposed in the first ozone water supply line to cool the ozone water flowing through the first ozone water supply line; a first heat-insulating member disposed to be wound around the first ozone water supply line downstream of the first cooler to maintain the temperature of the first ozone water supply line; a pure water supply line for supplying pure water to the first ozone water supply line; a pure water supply source for supplying pure water to the first ozone water supply line; pure water is supplied to the pure water supply line; a first mixer, which is arranged in the first ozone water supply line and is located upstream of the first cooler, and mixes the pure water with the ozone water; a second ozone water supply line, which connects the ozone water generator with a second nozzle that supplies ozone water to the processing space; a second cooler, which is arranged in the second ozone water supply line to cool the ozone water flowing through the second ozone water supply line; a second heat preservation member, which is arranged to be wound around the second ozone water supply line downstream of the second cooler to maintain the temperature of the second ozone water supply line; a chemical solution supply line, which is used to provide a chemical solution to the second ozone water supply line; a chemical solution supply source, which is used to provide a chemical solution to the chemical solution supply line; and a second mixer, which is arranged in the second ozone water supply line and is located upstream of the second cooler, and mixes the chemical solution with the ozone water.

[0029] According to an exemplary embodiment, the substrate treating apparatus may further include: a first filter disposed downstream of the first cooler and near the first cooler; and a second filter disposed downstream of the first cooler and near the second cooler.

[0030] According to an exemplary embodiment, the first treatment solution may be a chemical solution including ozone water, and the second treatment solution may be a chemical solution including hydrogen fluoride.

[0031] According to the exemplary embodiments of the present invention, a substrate can be efficiently processed.

[0032] Further, according to the exemplary embodiments of the present invention, the ability of the processing solution to clean the substrate can be improved.

[0033] Further, according to the exemplary embodiment of the present invention, substrate cleaning performance can be improved by ozone water.

[0034] Further, according to the exemplary embodiment of the present invention, the ozone concentration of the ozone water supplied to the substrate can be stably maintained.

[0035] Further, according to the exemplary embodiment of the present invention, a filter having improved filterability can be used.

[0036] The effects of the present invention are not limited to the above-mentioned effects, and unmentioned effects will be clearly understood from the specification and the accompanying drawings by those skilled in the art. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] By reviewing the detailed description in conjunction with the accompanying drawings, various features and advantages of the non-limiting exemplary embodiments of the present specification may become apparent. The accompanying drawings are for illustrative purposes only and should not be construed as limiting the scope of the claims. Unless explicitly stated, the drawings are not to be considered drawn to scale. For clarity, the various dimensions in the drawings may be exaggerated.

[0038] Figure 1 FIG. 1 is a top view schematically showing a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0039] Figure 2 FIG. 1 is a diagram schematically showing a liquid processing chamber according to an exemplary embodiment of the present invention.

[0040] Figure 3 FIG. 2 is a diagram schematically showing an ozone water supply unit according to an exemplary embodiment of the present invention.

[0041] Figure 4 FIG. 2 is a diagram schematically showing an ozone water supply unit according to another exemplary embodiment of the present invention.

[0042] Figure 5 FIG. 2 is a diagram schematically showing an ozone water supply unit according to still another exemplary embodiment of the present invention.

[0043] Figure 6 FIG. 2 is a diagram schematically showing an ozone water supply unit according to still another exemplary embodiment of the present invention. DETAILED DESCRIPTION

[0044] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments are provided so that the disclosure is thorough and the scope is fully conveyed to those skilled in the art. Many specific details (such as examples of specific components, equipment, and methods) are set forth to provide a thorough understanding of the embodiments of the present disclosure. It will be apparent to those skilled in the art that specific details need not be adopted, and example embodiments can be embodied in many different forms, and specific details should not be construed as limiting the scope of the present disclosure. In some example embodiments, known processes, known equipment structures, and known technologies are not described in detail.

[0045] The terms used herein are only for the purpose of describing specific example embodiments, and are not intended to be restrictive. As used herein, unless the context clearly indicates otherwise, the singular forms "a, an" and "the" may be intended to also include plural forms. The terms "comprises, comprising", "including" and "having" are inclusive, and therefore specifically refer to the presence of the features, integers, steps, operations, elements and / or components, but do not exclude the presence or increase of one or more other features, integers, steps, operations, elements, components and / or combinations thereof. Unless explicitly identified as an execution order, the method steps, processes and operations described herein should not be interpreted as having to be performed in the specific order discussed or illustrated. It should also be understood that additional or alternative steps may be adopted.

[0046] When an element or layer is referred to as being "on another element or layer," "engaged to another element or layer," "connected to another element or layer," or "coupled to another element or layer," the element or layer may be directly on, engaged to, connected to, or coupled to other elements or layers, or there may be intermediate elements or layers. In contrast, when an element is referred to as being "directly on another element or layer," "directly engaged to another element or layer," "directly connected to another element or layer," or "directly coupled to another element or layer," there may be no intermediate elements or layers. Other words used to describe the relationship between elements should be interpreted in a similar manner (e.g., "between" versus "directly between," "adjacent" versus "directly adjacent," etc.). As used herein, the term "and / or" includes any and all combinations of one or more of the relevant listed items.

[0047] Although the terms first, second, third, etc. can be used to describe different elements, components, regions, layers and / or sections in this article, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer and / or section from another region, layer or section. When used in this article, unless the context clearly indicates, terms such as "first", "second" and other numerical items do not imply order or sequence. Therefore, without departing from the teaching of the example embodiment, the first element, the first component, the first area, the first layer or the first section discussed below can be referred to as the second element, the second component, the second area, the second layer or the second section.

[0048] For ease of description, spatially relative terms such as "inside," "outside," "below," "beneath," "below," "above," and the like may be used herein to describe the relationship of one element or feature to another element or feature, as shown in the figures. Spatially relative terms may be intended to encompass different orientations of the device in use or operation in addition to the orientations described in the accompanying drawings. For example, if the device in the figure is flipped, an element described as being "below" or "beneath" other elements or features will subsequently be oriented to be "above" the other elements or features. Thus, the example term "below" is able to encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or oriented in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0049] When the terms "same" or "identical" are used in the description of the exemplary embodiments, it should be understood that some imprecision may exist. Thus, when an element or value is referred to as being the same as another element or value, it should be understood that the element or value is the same as the other element or value within a manufacturing or operating tolerance range (e.g., ±10%).

[0050] When the term "approximately" or "substantially" is used with a numerical value, it should be understood that the associated numerical value includes a manufacturing or operating tolerance (e.g., ±10%) around the numerical value. In addition, when the words "generally" and "substantially" are used in connection with geometric shapes, it should be understood that the precision of the geometric shape is not required, but the latitude of the shape is within the scope of the present disclosure.

[0051] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the example embodiments belong. It should also be understood that terms (including those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and will not be interpreted in an idealized or overly formal sense unless explicitly defined herein.

[0052] In the present exemplary embodiment, a wafer will be described as an example of an object to be processed. However, the technical essence of the present invention can also be applied to equipment used for processing other types of substrates in addition to wafers.

[0053] Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

[0054] Figure 1 FIG. 2 is a schematic top view of a substrate W processing apparatus according to an exemplary embodiment of the present invention. Figure 1 , the substrate W processing apparatus includes an index module 10, a processing module 20, and a controller 30. According to an exemplary embodiment, the index module 10 and the processing module 20 are arranged in one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are arranged is referred to as a first direction 92, and when viewed from above, a direction perpendicular to the first direction 92 is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0055] The index module 10 transfers the substrate W from the container 80 containing the substrate W therein to the process module 20, and causes the substrate W that has been completely processed in the process module 20 to be contained in the container 80. The longitudinal direction of the index module 10 is arranged along the second direction 94. The index module 10 includes a loading port 12 and an index frame 14. The loading port 12 is located at an opposite side of the process module 20 based on the index frame 14. The container 80 containing the substrate W therein is placed on the loading port 12. The loading port 12 may be provided in plural, and the plural loading ports 12 may be arranged along the second direction 94.

[0056] As the container 80, an airtight container such as a front opening unified pod (FOUP) can be used. The container 80 can be placed on the load port 12 by a transport device (not shown) such as an overhead transport, an overhead conveyor, or an automated guided vehicle, or by an operator.

[0057] The index robot 120 is provided to the index frame 14. A guide rail 140 whose longitudinal direction is the second direction 94 is provided inside the index frame 14, and the index robot 120 may be provided to be movable on the guide rail 140. The index robot 120 includes a hand 122 on which the substrate W is placed, and the hand 122 may be provided to be movable in the forward and backward directions, rotatable about the third direction 96, and movable in the third direction 96. A plurality of hands 122 are provided to be spaced apart from each other in the vertical direction, and the hands 122 may be moved forward and backward independently of each other.

[0058] The processing module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides a space in which a substrate W loaded into the processing module 20 and a substrate W unloaded from the processing module 20 temporarily stay. The processing chamber 400 performs a treatment process of liquid-treating the substrate W by supplying liquid onto the substrate W. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid-treating chamber 400.

[0059] The transfer chamber 300 may be arranged such that the longitudinal direction is the first direction 92. The buffer unit 200 may be arranged between the index module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 are provided, and the plurality of liquid processing chambers are provided on the side of the transfer chamber 300. The liquid processing chamber 400 and the transfer chamber 300 may be arranged along the second direction 94. The buffer unit 200 may be located at one end of the transfer chamber 300.

[0060] According to an example, the liquid processing chambers 400 are respectively disposed on both sides of the transfer chamber 300. On each of the two sides of the transfer chamber 300, the liquid processing apparatus 400 may be disposed in an array of A×B (each of A and B is a natural number of 1 or greater) along the first direction 92 and the third direction 96.

[0061] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 having a longitudinal direction along the first direction 92 is provided in the transfer chamber 300, and the transfer robot 320 may be provided to be movable on the guide rail 340. The transfer robot 320 includes a hand 322 in which the substrate W is placed, and the hand 322 may be provided to be movable forward and backward, rotatable about a third direction 96, and movable along the third direction 96. A plurality of hands 322 are provided to be spaced apart from each other in the vertical direction, and the hands 322 may be moved forward and backward independently of each other.

[0062] The buffer unit 200 includes a plurality of buffer zones 220 on which the substrate W is placed. The buffer zones 220 may be disposed while being spaced apart from each other along the third direction 96. The front and rear of the buffer unit 200 are open. The front is a surface facing the index module 10, and the rear is a surface facing the transfer chamber 300. The index robot 120 may approach the buffer unit 200 through the front, and the transfer robot 320 may approach the buffer unit 200 through the rear.

[0063] Figure 2 FIG. 4 is a diagram schematically showing a liquid processing chamber 400 according to an exemplary embodiment of the present invention. Figure 2 The liquid processing chamber 400 has a housing 410, a cup 420, a support unit 440, a nozzle unit 460, a lifting unit 480, an ozone water supply unit 1000, and a controller.

[0064] The housing 410 is provided in a substantially rectangular parallelepiped shape. The cup 420 , the support unit 440 , and the liquid supply unit 460 are provided in the housing 410 .

[0065] The cup 420 has a processing space with an open top, and the substrate W is subjected to liquid processing in the processing space. The support unit 440 supports the substrate W in the processing space. The liquid processing unit 460 supplies liquid to the substrate W supported by the support unit 440. The liquid may be provided in various types and may be sequentially supplied to the substrate W. The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440.

[0066] According to an example, the cup 420 includes a plurality of collection containers 422, 424, and 426. Each of the collection containers 422, 424, and 426 has a collection space for collecting liquid for processing the substrate W. Each of the collection containers 422, 424, and 426 is disposed in a ring shape around the support unit 440. When the liquid treatment process is performed, the treatment solution sputtered by the rotation of the substrate W is introduced into the collection space through the inlets 422a, 424a, and 426a of the corresponding collection containers 422, 424, and 426, respectively. According to an example, the cup 420 includes a first collection container 422, a second collection container 424, and a third collection container 426. The first collection container 422 is disposed around the support unit 440, the second collection container 424 is disposed around the first collection container 422, and the third collection container 426 is disposed around the second collection container 424. The second inlet 424a introducing liquid into the second collection container 424 may be located above the first inlet 422a introducing liquid into the first collection container 422, and the third inlet 426a introducing liquid into the third collection container 426 may be located above the second inlet 424a.

[0067] The support unit 440 includes a support plate 442 and a drive shaft 444. The upper surface of the support plate 442 may be set to a substantially circular shape and may have a diameter larger than the diameter of the substrate W. In the central portion of the support plate 442, a support pin 442a is provided to support the rear surface of the substrate W, and the support pin 442a is provided so that its upper end protrudes from the support plate 442 so that the substrate W is spaced a certain distance from the support plate 442. A chuck pin 442b is provided at the edge of the support plate 442. The chuck pin 442b is provided to protrude upward from the support plate 442 and support the lateral portion of the substrate W so that when the substrate W rotates, the substrate W will not be separated from the support unit 440. The drive shaft 444 driven by the driver 446 is connected to the center of the bottom surface of the substrate W and rotates the support plate 442 about its central axis.

[0068] The nozzle unit 460 includes a first nozzle 462 and a second nozzle 464. The first nozzle 462 supplies a first treatment solution onto the substrate W. The first treatment solution may be a solution having a temperature lower than room temperature. In one example, the first treatment solution may be ozone water. The ozone water may be ozone (O 3 ) gas dissolved in water. The water may be pure water or deionized water. The second nozzle 464 supplies the second treatment solution onto the substrate W. The second treatment solution may be hydrogen fluoride (HF). Alternatively, the second treatment solution may be a mixture of ozone water and hydrogen fluoride.

[0069] The first nozzle 462 and the second nozzle 464 are supported on different arms 461, respectively, and the arms 461 can move independently. Alternatively, the first nozzle 462 and the second nozzle 464 can be mounted on the same arm and move simultaneously.

[0070] Alternatively, the liquid supply unit may further include one or more nozzles in addition to the first nozzle 462 and the second nozzle 464. Additional nozzles may be added to supply different types of processing solutions to the substrate W. For example, another type of processing solution may be an acid solution or an alkaline solution for removing foreign matter from the substrate W. In addition, another type of processing solution may be an alcohol having a surface tension lower than that of water. For example, the alcohol may be isopropyl alcohol.

[0071] The lifting unit 480 moves the cup 420 in the vertical direction. By the vertical movement of the cup 420, the relative height between the cup 420 and the substrate W is changed. Therefore, since the collection containers 422, 426, and 427 for collecting the processing solution are changed according to the type of liquid supplied to the substrate W, the liquid can be separated and collected. Different from the above, the cup 420 can be fixedly installed, and the lifting unit 480 can move the support unit 440 in the vertical direction.

[0072] Figure 3 is a diagram illustrating an ozone water supply unit according to an exemplary embodiment of the present invention.

[0073] The ozone water supply unit 1000 includes an ozone water generator 1100, a first ozone water supply line 1200, a second ozone water supply line 1300, and a controller. The ozone water generator 1100 supplies ozone water to the first ozone water supply line 1200 and the second ozone water supply line 1300. In the first ozone water supply line 1200, a first mixer 1210, a first cooler 1220, a first filter 1230, and a first heat preservation member 1240 are installed. The pure water supply line 1400 is connected to the first ozone water supply line 1200. In the second ozone water supply line 1300, a second mixer 1310, a second cooler 1320, a second filter 1330, and a second heat preservation member 1340 are installed. The chemical solution supply line 1500 is connected to the second ozone water supply line 1300. The ozone water supply unit 1000 supplies the treatment solution to the liquid treatment chamber 400. The treatment solution may be a solution containing ozone water. The amount of ozone dissolved in the ozone water contained in the treatment solution is provided as a preset value. For example, the amount of dissolved ozone may be provided as 30ppm or 80ppm. Alternatively, the amount of dissolved ozone may be provided as 80ppm or more. The amount of ozone dissolved in the treatment solution may vary depending on the type of film formed on the substrate W.

[0074] The ozone water generator 1100 generates ozone water. In one example, the ozone water generator 1100 may be an ozone water generator that dissolves ozone gas in water. The ozone water generator may dissolve ozone gas in water under high pressure. Alternatively, the ozone water generator may dissolve ozone gas in water by using electrical energy. The water may be pure water or deionized water. The ozone water generator generates and delivers ozone water at a set concentration. The amount of ozone dissolved in the ozone water may vary depending on the type of process and the type of film formed on the substrate W.

[0075] One end of the first ozone water supply line 1200 is connected to the ozone water generator 1100, and the other end of the first ozone water supply line 1200 is connected to the first nozzle 462 in the plurality of liquid processing chambers 400. In addition, the pure water supply line 1400 is connected to the first ozone water supply line 1200. The first ozone water supply line 1200 supplies ozone water from the ozone water generator 1100 to the plurality of liquid processing chambers 400. The first ozone water supply line 1200 may also supply a mixed solution of pure water and ozone water to the plurality of liquid processing chambers 400. The first nozzle 462 supplies ozone water or the mixed solution to the substrate W. The first ozone water supply line 1200 and the pure water supply line 1400 may be provided with a flow meter (or liquid flow controller) 1260 and / or a valve. The first ozone water supply line 1200 may be provided with a first mixer 1210, a first cooler 1220, a first filter 1230, and a first heat preservation member 1240. The first mixer 1210, the first cooler 1220, the first filter 1230, the first heat preservation member 1240, the flow meter 1260, and the valve may be controlled by a controller.

[0076] The pure water supply line 1400 connects the pure water supply source 1410 to the first ozone water supply line 1200. The pure water supply line 1400 may be connected to the first ozone water supply line 1200 upstream of the first mixer 1210. The pure water supply line 1400 supplies the first ozone water supply line 1200 with pure water.

[0077] The first mixer 1210 is installed on the first ozone water supply line 1200. The first mixer 1210 may be located upstream of the first cooler 1220 and the first filter 1230. The first mixer 1210 may be located downstream of the point where the pure water supply line 1400 is connected to the first ozone water supply line 1200. The first mixer 1210 mixes ozone water and pure water. The first mixer 1210 may be an inline mixer.

[0078] The first cooler 1220 is installed in the first ozone water supply line 1200. The first cooler 1220 may be located downstream of the first mixer 1210 (to be described later) on the first ozone water supply line 1200. The first cooler 1220 cools the treatment solution. The first cooler 1220 cools the treatment solution to a temperature below room temperature. In one example, the first cooler 1220 cools the treatment solution to a temperature between 4°C and 20°C. For example, the first cooler 1220 may cool the treatment solution to 15°C. The first cooler 1220 is provided with a chiller 1221 and a pipe 1222. The ozone water flowing through the first ozone water supply line 1200 may be cooled by heat exchange between the pipe 1222 through which the cooling water flows and the first ozone water supply line 1200 through which the ozone water flows.

[0079] The first filter 1230 is installed on the first ozone water supply line 1200. The first filter 1230 may be located downstream of the first cooler 1220. The first filter 1230 filters foreign matter in the ozone water. Foreign matter is filtered through the holes in the second filter 1330. The smaller the size of the hole, the greater the filtering capacity of the second filter 1330. Since the temperature of the ozone water is low, the pore size can be further reduced.

[0080] The first heat preservation member 1240 is disposed on the first ozone water supply line 1200. The first heat preservation member 1240 may be disposed in the first ozone water supply line 1200 downstream of the first cooler 1220. When the first filter 1230 is installed downstream of the first cooler 1220, the first heat preservation member 1240 may be disposed between the first filter 1230 and the first cooler 1220, and between the first filter 1230 and the first nozzle 462. The first heat preservation member 1240 may be disposed to be wound around the first ozone water supply line 1200. The first heat preservation member 1240 may be wound around the treatment solution supply line 1100 in a unidirectional winding manner. The first heat preservation member 1240 may be provided by polyvinyl chloride or styrofoam material. The first heat preservation member 1240 prevents the first ozone water supply line 1200 from contacting the outside. The first heat preservation member 1240 prevents heat exchange between the treatment solution supply line 1100 and the outside. The first heat retaining member 1240 maintains the first ozone water supply line 1200 at a constant temperature.

[0081] One end of the second ozone water supply line 1300 is connected to the ozone water generator 1100, and the other end of the second ozone water supply line 1300 is connected to the second nozzle 464 in the plurality of liquid processing chambers 400. In addition, the chemical solution supply line 1500 is connected to the second ozone water supply line 1300. The second ozone water supply line 1300 supplies ozone water from the ozone water generator 1100 to the plurality of liquid processing chambers 400. The second ozone water supply line 1300 may also supply a mixed solution of a chemical solution and ozone water to the plurality of liquid processing chambers 400. The second nozzle 464 supplies ozone water or the mixed solution to the substrate W. The second ozone water supply line 1300 and the chemical solution water supply line 1400 may be provided with a flow meter (or liquid flow controller) 1360 and / or a valve. The second ozone water supply line 1300 may be provided with a second mixer 1310, a second cooler 1320, a second filter 1330, and a second heat preservation member 1340. The second mixer 1310, the second cooler 1320, the second filter 1330, the second heat preservation member 1340, the flow meter 1360, and the valve may be controlled by a controller.

[0082] The chemical solution supply line 1500 connects the chemical solution supply source 1510 and the second ozone water supply line 1300. The chemical solution supply line 1500 may be connected to the second ozone water supply line 1300 upstream of the second mixer 1310. The chemical solution supply line 1500 supplies the chemical solution to the second ozone water supply line 1300. In one example, the chemical solution may be hydrogen fluoride (HF).

[0083] The second mixer 1310 is installed on the second ozone water supply line 1300. The second mixer 1310 may be located upstream of the second cooler 1320 and the second filter 1330. The second mixer 1310 may be located downstream of the point where the chemical solution supply line 1500 is connected to the second ozone water supply line 1300. The second mixer 1310 mixes ozone water and chemical solution. The second mixer 1310 may be an inline mixer.

[0084] The second cooler 1320 is installed in the second ozone water supply line 1300. The second cooler 1320 may be located downstream of the second mixer 1310 (to be described later) on the second ozone water supply line 1300. The second cooler 1320 cools the treatment solution. The second cooler 1320 cools the treatment solution to a temperature below room temperature. In one example, the second cooler 1320 cools the treatment solution to a temperature between 4°C and 20°C. For example, the second cooler 1320 may cool the treatment solution to 15°C. The second cooler 1320 is provided with a refrigerator 1321 and a pipe 1322. The ozone water flowing through the second ozone water supply line 1300 may be cooled by heat exchange between the pipe 1322 through which the cooling water flows and the second ozone water supply line 1300 through which the ozone water flows.

[0085] The second filter 1330 is installed on the second ozone water supply line 1300. The second filter 1330 may be located downstream of the second cooler 1320. The second filter 1330 filters foreign matter in the ozone water. The second filter 1330 includes holes. Foreign matter is filtered through the holes in the second filter 1330. The smaller the size of the hole, the greater the filtering capacity of the second filter 1330. Since the temperature of the ozone water is low, the pore size can be further reduced.

[0086] The second heat preservation member 1340 is disposed on the second ozone water supply line 1300. The second heat preservation member 1340 may be disposed in the second ozone water supply line 1300 downstream of the second cooler 1320. When the second filter 1330 is installed downstream of the second cooler 1320, the second heat preservation member 1340 may be disposed between the second filter 1330 and the second cooler 1320, and between the second filter 1330 and the second nozzle 464. The second heat preservation member 1340 may be disposed to be wound around the second ozone water supply line 1300. The second heat preservation member 1340 may be wound around the treatment solution supply line 1100 in a unidirectional winding manner. The second heat preservation member 1340 may be provided by polyvinyl chloride or foamed polystyrene material. The second heat preservation member 1340 prevents contact between the second ozone water supply line 1300 and the outside. The second heat preservation member 1340 prevents heat exchange between the outside of the treatment solution supply line 1100. The second heat retaining member 1340 maintains the second ozone water supply line 1300 at a constant temperature.

[0087] The ozone water may remove contaminants (eg, photoresist) remaining on the substrate W. The ozone water generated by the ozone water generator is supplied to the first ozone water supply line 1200 or the second ozone water supply line 1300. Hereinafter, a case where ozone water is supplied to the first ozone water supply line 1200 will be described as an example.

[0088] Ozone water is highly active and unstable, so it is difficult to supply ozone water to the substrate while maintaining the concentration of ozone water at a set concentration. In addition, the filter typically causes pressure loss in ozone water. Pressure loss causes the solubility of water as a solvent to ozone gas to decrease. According to an exemplary embodiment of the present invention, ozone water passes through the first filter 1230. The ozone water passing through the first filter 1230 has a pressure loss. After passing through the first filter 1230, the pressure loss causes the amount of ozone dissolved in the ozone water to decrease. Therefore, it is difficult to supply ozone water with a constant amount of dissolved ozone. According to an exemplary embodiment of the present invention, ozone water passes through the first mixer 1210, the first cooler 1220 and the first filter 1230 in sequence. The first cooler 1220 cools the ozone water to a temperature below room temperature. Since the solubility of ozone is inversely proportional to temperature, the solubility of ozone water increases as the temperature of ozone water decreases. When the ozone water is cooled to 15°C, the solubility of ozone is significantly higher than that at room temperature (e.g., 25°C). Since the first filter 1230 is disposed downstream of the first cooler 1220, even when the first filter 1230 reduces the solubility of the ozone water, the loss of the amount of dissolved ozone can be prevented. In addition, since the concentration of the ozone water cooled by the first heat-retaining member 1240 can be kept constant, the loss of the amount of dissolved ozone can be prevented. Therefore, the ozone water can be supplied while maintaining a constant amount of dissolved ozone. In addition, the cleaning ability of the ozone water to the substrate W can be improved, allowing the substrate W to be effectively processed.

[0089] Unlike when ozone water is supplied to the first ozone water supply line 1200, when ozone water is supplied to the second ozone water supply line 1300, the amount of ozone in the ozone water may be maintained constant as described above. Only the type and concentration of the chemical solution vary depending on the type of contaminants remaining on the substrate W.

[0090] In the example described above, the first cooler 1220 is shown as a constant temperature bath. However, alternatively, the first cooler 1220 may be provided with a temperature adjustment member that adjusts the temperature of the processing solution to a set temperature.

[0091] In the example described above, the first mixer 1210 and the second mixer 1310 are described as inline mixers. However, alternatively, the first mixer 1210 and / or the second mixer 1310 may include a storage tank and a circulation line, and ozone water and pure water or ozone water and a chemical solution may be mixed by being supplied into the storage tank and circulating along the circulation line.

[0092] In the examples described above, the liquid processing chamber 400 is shown as a single wafer type processing device. Figure 4As shown, the liquid processing chamber 400 may be configured as a batch type, and the substrate W may be processed by being immersed in a processing solution.

[0093] In the example described above, the present invention has been described based on the case where the first ozone water supply line 1200 and the second ozone water supply line 1300 are connected to the ozone water generator 1100 as an example. However, alternatively, only the first ozone water supply line 1200 or the second ozone water supply line 1300 may be connected, such as Figure 5 shown.

[0094] In the example described above, the present invention is described based on the case where the pure water supply line 1400 is connected to the first ozone water supply line 1200, and the chemical solution supply line 1500 is connected to the second ozone water supply line 1300 as an example. However, alternatively, Figure 6 As shown, the pure supply line 1400 and the chemical solution supply line 1500 may not be provided, and the first mixer 1210 and the second mixer 1310 may not be provided.

[0095] The foregoing detailed description illustrates the present invention. In addition, the above description shows and describes exemplary embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the present invention disclosed herein, within the scope equivalent to the written disclosure, and / or within the scope of the technology or knowledge in the art. The foregoing exemplary embodiments describe the best state of the technical spirit of the implementation of the present invention, and various changes required in the specific application fields and uses of the present invention are possible. Therefore, the above detailed description of the present invention is not intended to limit the present invention to the disclosed exemplary embodiments. In addition, the attached claims should be interpreted as also including other exemplary embodiments.

Claims

1. A substrate processing device, comprising: a chamber for performing liquid treatment on a substrate loaded into a treatment space using a liquid containing ozone water; as well as an ozone water supply unit for supplying ozone water to the processing space, Wherein, the ozone water supply unit comprises: An ozone water generator, wherein the ozone water generator is used to generate ozone water; an ozone water supply line for supplying ozone water generated by the ozone water generator to the processing space; and A cooler is provided in the ozone water supply line to cool the ozone water flowing through the ozone water supply line.

2. The substrate processing apparatus according to claim 1, wherein: The cooler adjusts the temperature of the ozone water to a temperature lower than room temperature.

3. The substrate processing apparatus according to claim 2, wherein: The ozone water supply unit further includes a filter installed in the ozone water supply line, and The filter is installed downstream of the cooler.

4. The substrate processing apparatus according to claim 3, wherein: The filter is located adjacent to the cooler.

5. The substrate processing apparatus according to claim 2, wherein: The ozone water supply unit further includes a heat preservation member for maintaining a constant temperature of the ozone water supply pipeline, and The heat-insulating member is configured to be wound around the ozone water supply line downstream of the cooler.

6. The substrate processing apparatus according to claim 4, wherein: The substrate processing device further comprises: a treatment solution supply source, the treatment solution supply source being used to store the treatment solution; a treatment solution supply line for supplying a treatment solution from the treatment solution supply source to the ozone water supply line; and A mixer is installed in the ozone water supply line to mix the ozone water with the treatment solution.

7. The substrate processing apparatus according to claim 6, wherein: The mixer is disposed upstream of the cooler.

8. The substrate processing apparatus according to claim 7, wherein: The mixer comprises an inline mixer.

9. The substrate processing apparatus according to claim 6, wherein: The treatment solution is deionized water.

10. The substrate processing apparatus according to claim 6, wherein: The treatment solution is a chemical solution.

11. The substrate processing apparatus according to claim 10, wherein: The chemical solution is hydrogen fluoride.

12. The substrate processing apparatus according to claim 1, wherein: The chamber comprises: A housing having an internal space; a cup-shaped member, the cup-shaped member being used to provide the processing space; A supporting unit, the supporting unit is used to support the substrate; a nozzle for supplying ozone water to the substrate; and The ozone water supply line is connected to the nozzle.

13. An ozone water supply unit, comprising: Ozone water supply source; Ozone water nozzle; an ozone water supply pipeline, the ozone water supply pipeline being used to connect the ozone water supply source and the ozone water nozzle; A cooler, the cooler is used to cool the ozone water; as well as Filters, Wherein, the cooler and the filter are arranged in the ozone water supply pipeline.

14. The ozone water supply unit according to claim 13, wherein: The filter is located adjacent to the cooler but downstream of the cooler.

15. The ozone water supply unit according to claim 14, wherein: The cooler cools the ozone layer water to a temperature below room temperature.

16. The ozone water supply unit according to claim 15, wherein: The ozone water supply unit further includes a heat preservation member, and The heat insulating member is disposed to be wound around the ozone water supply line downstream of the cooler.

17. The ozone water supply unit according to claim 15, further comprising: Chemical solution supply source; Chemical solution supply lines; as well as mixer, Wherein, the chemical solution supply source stores chemical solution, The chemical solution supply line supplies the chemical solution to the ozone water supply line, The mixer mixes the chemical solution with the ozone water, The mixer is installed downstream of the point where the chemical solution supply line is connected to the ozone water supply line, and The chemical solution is deionized water or hydrogen fluoride.

18. A substrate processing device, comprising: a chamber for liquid processing a substrate loaded into the processing space using a processing solution; as well as an ozone water supply unit for supplying liquid containing ozone water to the processing space, Wherein, the ozone water supply unit comprises: An ozone water generator, wherein the ozone water generator is used to generate ozone water; a first ozone water supply line for connecting the ozone water generator to a first nozzle for supplying the ozone water to the treatment space; a first cooler, the first cooler being disposed in the first ozone water supply line to cool the ozone water flowing through the first ozone water supply line; a first heat-insulating member, the first heat-insulating member being arranged to be wound around the first ozone water supply pipeline downstream of the first cooler to maintain the temperature of the first ozone water supply pipeline; a pure water supply line that supplies pure water to the first ozone water supply line; a pure water supply source, the pure water supply source being used to supply pure water to the pure water supply pipeline; a first mixer which is provided in the first ozone water supply line and is located upstream of the first cooler and mixes the pure water with the ozone water; a second ozone water supply line connecting the ozone water generator to a second nozzle that supplies the ozone water to the treatment space; a second cooler disposed in the second ozone water supply line to cool the ozone water flowing through the second ozone water supply line; a second heat-insulating member, the second heat-insulating member being arranged to be wound around the second ozone water supply pipeline downstream of the second cooler to maintain the temperature of the second ozone water supply pipeline; a chemical solution supply line for supplying a chemical solution to the second ozone water supply line; a chemical solution supply source for supplying a chemical solution to the chemical solution supply pipeline; and A second mixer is provided in the second ozone water supply line and is located upstream of the second cooler, and mixes the chemical solution with the ozone water.

19. The substrate processing apparatus according to claim 18, wherein: The substrate processing device further comprises: a first filter disposed downstream of the first cooler and adjacent to the first cooler; and A second filter is disposed near the second cooler downstream of the first cooler.

20. The substrate processing apparatus according to claim 19, wherein: The chemical solution is a chemical solution containing hydrogen fluoride.

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