Packaging structure of semiconductor chip and packaging process thereof

Abstract

The invention discloses a packaging structure of a semiconductor chip and a packaging process thereof in the technical field of chip production, a manipulator carries a plurality of vacuum adsorption machines and cooperates with a first positioning mechanism used for finely adjusting the positions of the vacuum adsorption machines, so that the manipulator moves between a welding device and a wafer disc at a time, and the welding efficiency is improved. In the process that the mounting grooves in the base are filled and the base on the welding device is replaced, the manipulator moves between the welding device and the wafer disc and supplements the wafers on the vacuum adsorption machine, so that the working continuity of the equipment is higher, and the working efficiency of the equipment is improved. And unnecessary displacement of the manipulator is reduced, the working efficiency of the welding device can be effectively utilized, and then the working efficiency of equipment is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a packaging structure of a semiconductor chip and a packaging process thereof. Background Art

[0002] The packaging of semiconductor chips is done by using a vacuum adsorption machine to suck the wafer from the wafer tray, and then the vacuum adsorption machine places the wafer at the predetermined welding position on the base with high positioning accuracy, and then uses a welding device to weld the wafer and the base. Finally, after the processes of plastic wrapping and segmentation, the packaged chip is obtained.

[0003] In the traditional welding process, a vacuum adsorption machine needs to be controlled by a robotic arm to complete the actions of wafer suction, wafer placement, and wafer welding between the wafer plate and the welding device. During this process, in order to ensure the position accuracy of the wafer, the vacuum adsorption machine can only complete the welding of one wafer at a time, which causes a large amount of work travel of the equipment to be wasted on the repeated transportation between the wafer plate and the welding device, reducing the working efficiency of the equipment. Summary of the invention

[0004] The purpose of the present invention is to provide a packaging structure of a semiconductor chip and a packaging process thereof, so as to solve the problem that the traditional welding process proposed in the above-mentioned background technology requires a vacuum adsorption machine to be controlled by a mechanical arm to complete the actions of wafer suction-wafer placement-wafer welding between a wafer disk and a welding device. During this process, in order to ensure the position accuracy of the wafer, the vacuum adsorption machine can only complete the welding of one wafer at a time, which causes a large amount of work stroke of the equipment to be wasted on repeated transportation between the wafer disk and the welding device, thereby reducing the working efficiency of the equipment.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a packaging structure of a semiconductor chip and a packaging process thereof, comprising a supporting mechanism, a welding device, a manipulator, a wafer disk and a base, wherein the welding device and the manipulator are both arranged at the upper end of the supporting mechanism, the base is fixedly clamped on the welding device, the upper end of the base is provided with mounting grooves arranged in an array, a plurality of wafers are placed on the upper end of the wafer disk, and also comprises a mounting plate, the mounting plate is fixedly connected to the manipulator, a driving mechanism is arranged on the mounting plate, the driving mechanism is provided with vacuum adsorption machines distributed in a circular array with the same number as the mounting grooves, the mounting plate is provided with a first positioning mechanism, the driving mechanism is used to control a plurality of vacuum adsorption machines to circulate to the first positioning mechanism, and the first positioning mechanism is used to fine-tune the position of the vacuum adsorption machine.

[0006] As a further solution of the present invention, the driving mechanism includes a driving motor, the driving motor is fixedly connected to the upper end of the mounting plate, the lower end of the mounting plate is provided with an output shaft, the output shaft vertically penetrates the mounting plate and is transmission-connected to the driving motor, the side wall of the output shaft is fixedly connected to a first sleeve, the side wall of the first sleeve is fixedly connected to a number of driving telescopic rods distributed in a circumferential array that is the same as the vacuum adsorption machine along the radial direction of the first sleeve, the driving telescopic rod has a built-in driving unit for controlling the extension and retraction of the driving telescopic rod, the side wall of the output shaft is fixedly connected to a second sleeve located above the first sleeve, the side wall of the second sleeve is fixedly connected to a number of first elastic telescopic rods distributed in a circumferential array that is the same as the vacuum adsorption machine along the radial direction of the second sleeve; the first elastic telescopic rods are respectively located at the angular bisector positions of two adjacent driving telescopic rods, the ends of the first elastic telescopic rods are all rotationally connected to horizontally arranged transmission wheels, the multiple transmission wheels are commonly transmission-connected to a transmission belt, one of the transmission wheels is externally connected to a driving device, the ends of the driving telescopic rods are all fixedly connected to a tensioning mechanism, the tensioning mechanism engages the transmission belt; the vacuum adsorption machine is fixedly connected to the lower end of the transmission belt.

[0007] As a further solution of the present invention, the tensioning mechanism includes a connecting block, a connecting plate is fixedly connected to the lower end of the connecting block, and the lower end of the connecting plate is rotatably connected to the side close to and away from the output shaft with a tensioning wheel, and the tensioning wheel is respectively located on the inner and outer side walls of the transmission belt.

[0008] As a further solution of the present invention, the first positioning mechanism includes a slide groove vertically penetrating along the radial direction of the output shaft and arranged on the mounting plate, the slide groove is slidably connected with a positioning device with a built-in drive, the lower end of the positioning device is transmission-connected with a positioning plate close to the output shaft, the positioning device can control the vertical displacement of the positioning plate and can perform high-precision adjustment of the horizontal position of the positioning plate, and the lower end of the positioning plate is vertically fixedly connected with two positioning pins; the upper end of the vacuum adsorption machine is fixedly connected with a positioning block, the upper end of the positioning block is vertically provided with two pin holes away from the output shaft, the two pin holes can be engaged with the two positioning pins, the upper end of the positioning block is connected with a displacement mechanism, the displacement mechanism is connected to the lower end of the transmission belt, and the displacement mechanism can cause the vacuum adsorption machine to be displaced in the horizontal direction relative to the transmission belt;

[0009] The shifting mechanism includes a connecting rod, the upper end of the connecting rod is fixedly connected to the lower end of the transmission belt, the lower end of the connecting rod is vertically fixedly connected to a connecting shell, the lower end of the connecting shell is provided with a through hole, a first connecting column is vertically arranged in the through hole, the side wall of the first connecting column is fixedly connected to a limiting ring, the limiting ring is fitted with the bottom inner wall of the connecting shell, the first connecting column is fixedly connected to four second elastic telescopic rods distributed in a circular array, the second elastic telescopic rod is fixedly connected to the inner side wall of the connecting shell, the lower end of the first connecting column is fixedly connected to a torsion plate, the lower end of the torsion plate is elastically rotatably connected to the second connecting column, and the lower end of the second connecting column is fixedly connected to the upper end of the positioning block.

[0010] As a further solution of the present invention, it also includes a second positioning mechanism, which includes a third sleeve, and the third sleeve is fixedly connected to the side wall of the output shaft and is located at the lower end of the second sleeve. The side wall of the third sleeve is located below the six first elastic telescopic rods and is fixedly connected with a Y-shaped block. The opening direction of the Y-shaped block is away from the output shaft, and the positioning block is chamfered on the side close to the output shaft. The deepest end of the opening of the Y-shaped block can engage with one end of the positioning block with the chamfer.

[0011] A semiconductor chip packaging process, the process is as follows:

[0012] S1, the robot drives the mounting plate to move above the wafer plate, and cooperates with the first positioning mechanism to make all vacuum adsorption machines absorb one wafer;

[0013] S2, then the robot drives the mounting plate to move above the welding device, and cooperates with the first positioning mechanism to place the wafers sucked by the vacuum adsorption machine into the respective mounting grooves on the base for welding;

[0014] S3. Finally, the robot drives the mounting plate to move above the wafer disk and replaces the welded base in the welding device at the same time.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention uses a manipulator to carry multiple vacuum adsorption machines, and cooperates with a first positioning mechanism for fine-tuning the position of the vacuum adsorption machine, so that the manipulator can absorb the wafers corresponding to the number of mounting slots on the base at one time by moving between the welding device and the wafer disk once, and after the mounting slots on the base are filled and the base on the welding device is replaced, the manipulator moves between the welding device and the wafer disk to replenish the wafers on the vacuum adsorption machine, so that the equipment works more continuously, reduces unnecessary displacement of the manipulator, can effectively utilize the working efficiency of the welding device, and thus effectively improve the working efficiency of the equipment.

[0017] 2. The present invention changes the movement mode and movement path of the vacuum adsorption machine by gathering or dispersing multiple vacuum adsorption machines toward the output shaft, and then adapts to the working mode above the wafer or the base respectively, so that the equipment can effectively improve the working efficiency while ensuring normal operation.

[0018] 3. The present invention uses an independent positioning device to cooperate with multiple vacuum adsorption machines to complete the one-time positioning of multiple vacuum adsorption machines, and integrates the positioning device with each vacuum adsorption machine through pin connection, so that the positioning device controls the vacuum adsorption machine to complete high-precision displacement, thereby effectively improving the stability and processing accuracy of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 for Figure 1 A schematic diagram of the structure enlargement in the middle;

[0021] Figure 3 It is a structural schematic diagram of the driving mechanism and the vacuum adsorption machine;

[0022] Figure 4 for Figure 3 Schematic diagram of the structure without the mounting plate;

[0023] Figure 5 It is a structural schematic diagram of a vacuum adsorption machine and its associated components;

[0024] Figure 6 for Figure 5 Schematic diagram of the cross-section structure;

[0025] Figure 7 is a schematic diagram of the structure of the positioning device;

[0026] Figure 8 It is a schematic diagram of the process flow of the present invention.

[0027] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0028] Support mechanism 11, welding device 12, manipulator 13, wafer disk 14, base 15, mounting groove 16, wafer 17, mounting plate 18, vacuum adsorption machine 19, drive motor 21, output shaft 22, first sleeve 23, drive telescopic rod 24, second sleeve 25, first elastic telescopic rod 26, transmission wheel 27, transmission belt 28, connecting block 31, connecting plate 32, tensioning wheel 33, slide groove 41, positioning device 42, positioning plate 43, positioning pin 44, positioning block 45, connecting rod 46, connecting shell 47, through hole 48, first connecting column 49, limiting ring 410, second elastic telescopic rod 411, torsion plate 412, second connecting column 413, pin hole 414, third sleeve 51, Y-shaped block 52. DETAILED DESCRIPTION

[0029] See also Figure 1-8 The present invention provides a technical solution: a semiconductor chip packaging structure and a packaging process thereof, comprising a support mechanism 11, a welding device 12, a manipulator 13, a wafer disk 14 and a base 15, wherein the welding device 12 and the manipulator 13 are both arranged at the upper end of the support mechanism 11, the base 15 is fixedly clamped on the welding device 12, the upper end of the base 15 is provided with mounting grooves 16 arranged in an array, a plurality of wafers 17 are placed on the upper end of the wafer disk 14, and a mounting plate 18 is also included, wherein the mounting plate 18 is fixedly connected to the manipulator 13, a driving mechanism is arranged on the mounting plate 18, and vacuum adsorption machines 19 distributed in a circumferential array with the same number as the mounting grooves 16 are arranged on the driving mechanism, and a first positioning mechanism is arranged on the mounting plate 18, wherein the driving mechanism is used to control the plurality of vacuum adsorption machines 19 to circulate to the first positioning mechanism, and the first positioning mechanism is used to fine-tune the position of the vacuum adsorption machine 19.

[0030] The driving mechanism controls a vacuum adsorption machine 19 to arrive at the first positioning mechanism, and then the manipulator 13 drives the vacuum adsorption machine 19 at the first positioning mechanism to reach above one of the wafers 17 on the wafer plate 14 by controlling the movement of the mounting plate 18, and then the position of the vacuum adsorption machine 19 is finely adjusted by the first positioning mechanism, so that the vacuum adsorption machine 19 is aligned with the wafer 17, and then the vacuum adsorption machine 19 moves downward and absorbs the wafer 17, and then the driving mechanism controls the next vacuum adsorption machine 19 to arrive at the first positioning mechanism, and absorbs the wafer 17, and so on and so forth, so that all the vacuum adsorption machines 19 absorb one wafer 17; then the manipulator 13 drives the mounting plate 18 to move to the welding mounting mechanism The first positioning mechanism is used to place the wafers 17 sucked by the vacuum adsorption machine 19 in the mounting grooves 16 on the base 15, and the first positioning mechanism is used to place the wafers 17 sucked by the vacuum adsorption machine 19 in the mounting grooves 16 on the base 15. During this process, the vacuum adsorption machine 19 at the first positioning mechanism places the sucked wafer 17 in a mounting groove 16 on the base 15, and then the driving mechanism controls the next vacuum adsorption machine 19 to move to the first positioning mechanism, and at the same time, the welding device 12 welds the mounting groove 16 where the wafer 17 has been placed, so that the wafer 17 and the mounting groove 16 are welded and fixed to each other, and then the welding device 12 controls the base 15 to translate, so that the next mounting groove 16 on the base 15 moves to the position of the mounting groove 16 where the previous wafer 17 has been placed to wait for the placement of the wafer 17.

[0031] The present invention uses a robot 13 equipped with multiple vacuum adsorption machines 19, and cooperates with a first positioning mechanism for fine-tuning the position of the vacuum adsorption machine 19, so that the robot 13 can absorb the wafers 17 corresponding to the number of mounting grooves 16 on the base 15 at one time by moving between the welding device 12 and the wafer disk 14 once, and after the mounting grooves 16 on the base 15 are filled and the base 15 on the welding device 12 is replaced, the robot 13 moves between the welding device 12 and the wafer disk 14 to replenish the wafers 17 on the vacuum adsorption machine 19, so that the equipment operation is more consistent, the unnecessary displacement of the robot 13 is reduced, the working efficiency of the welding device 12 can be effectively utilized, and the working efficiency of the equipment can be effectively improved.

[0032] As a further solution of the present invention, the driving mechanism includes a driving motor 21, the driving motor 21 is fixedly connected to the upper end of the mounting plate 18, the lower end of the mounting plate 18 is provided with an output shaft 22, the output shaft 22 vertically penetrates the mounting plate 18 and is transmission-connected to the driving motor 21, the side wall of the output shaft 22 is fixedly connected to a first sleeve 23, the side wall of the first sleeve 23 is fixedly connected along the radial direction of the first sleeve 23 with a number of driving telescopic rods 24 distributed in a circumferential array that is the same as the vacuum adsorption machine 19, the driving telescopic rod 24 has a built-in driving unit for controlling the extension and retraction of the driving telescopic rod 24, and the side wall of the output shaft 22 is located above the first sleeve 23 and is fixedly connected to a first sleeve 23. The second sleeve 25, the side wall of the second sleeve 25 is fixedly connected with the first elastic telescopic rods 26 distributed in a circular array in the same number as the vacuum adsorption machine 19 along the radial direction of the second sleeve 25; the first elastic telescopic rods 26 are respectively located at the angular bisector positions of two adjacent driving telescopic rods 24, and the ends of the first elastic telescopic rods 26 are rotatably connected with horizontally arranged transmission wheels 27, and multiple transmission wheels 27 are commonly connected with a transmission belt 28, one of which is externally connected to a driving device, and the ends of the driving telescopic rods 24 are fixedly connected with a tensioning mechanism, and the tensioning mechanism engages the transmission belt 28; the vacuum adsorption machine 19 is fixedly connected to the lower end of the transmission belt 28.

[0033] When the vacuum suction machine 19 is ready to absorb the wafer 17 above the wafer disk 14, the driving device first controls each vacuum suction machine 19 to move to the end position of each first elastic telescopic rod 26 through the transmission belt 28, and then multiple driving telescopic rods 24 shrink synchronously, and the tensioning mechanism drives the engagement point on the transmission belt 28 with the tensioning mechanism to move toward the output shaft 22, and then the transmission belt 28 will pull each transmission wheel 27 toward the output shaft 22, and compress the first elastic telescopic rod 26. At this time, each vacuum suction machine 19 closes toward the output shaft 22, and finally the driving motor 21 controls the output shaft 22 to rotate, further driving each vacuum suction machine 19 to rotate around the output shaft 22, so that each vacuum suction machine 19 can quickly complete the position switching relative to the transmission belt 28 drive mode, so that after one vacuum suction machine 19 completes the adsorption of the wafer 17, the next vacuum suction machine 19 can quickly reach the first fixed position. The wafer 17 is adsorbed at the positioning mechanism; when the vacuum adsorption machine 19 is ready to place the wafer 17 in the mounting groove 16 on the base 15, multiple driving telescopic rods 24 are extended synchronously, and at the same time, the first elastic telescopic rod 26 is extended under the action of elastic force. At this time, the transmission belt 28 is a regular polygon. Then the driving device drives the transmission belt 28 to move, so that multiple vacuum adsorption machines 19 pass through the first positioning mechanism in sequence along the trajectory of the transmission belt 28 to place the wafer 17. In this process, since there are structures such as welding guns and clamps on the welding device 12, the way in which the vacuum adsorption machine 19 moves along the trajectory of the transmission belt 28 can enable the vacuum adsorption machine 19 to effectively avoid related components on the welding device 12. At the same time, in the process of the vacuum adsorption machine 19 reaching the first positioning mechanism along the trajectory of the transmission belt 28, time can be provided for the welding work of the welding device 12, so that the equipment will not reduce the work efficiency due to the decrease in the position change speed of the vacuum adsorption machine 19.

[0034] The present invention changes the movement mode and movement path of the vacuum adsorption machine 19 by gathering or dispersing multiple vacuum adsorption machines 19 toward the output shaft 22, and then adapts to the working mode above the wafer 17 or the base 15 respectively, so that the equipment can effectively improve the working efficiency while ensuring normal operation.

[0035] As a further solution of the present invention, the tensioning mechanism includes a connecting block 31, the lower end of the connecting block 31 is fixedly connected to a connecting plate 32, and the lower end of the connecting plate 32 is rotatably connected to one side close to and away from the output shaft 22 with a tensioning wheel 33, and the tensioning wheel 33 is respectively located on the inner and outer side walls of the transmission belt 28.

[0036] As a further solution of the present invention, the first positioning mechanism includes a slide groove 41 vertically penetrating the radial direction of the output shaft 22 and arranged on the mounting plate 18, a positioning device 42 with a built-in drive is slidably connected in the slide groove 41, a positioning plate 43 is drivingly connected to the lower end of the positioning device 42 near the output shaft 22, the positioning device 42 can control the vertical displacement of the positioning plate 43 and can adjust the horizontal position of the positioning plate 43 with high precision, and two positioning pins 44 are vertically fixedly connected to the lower end of the positioning plate 43; the upper end of the vacuum adsorption machine 19 is fixedly connected with a positioning block 45, and two pin holes 414 are vertically arranged on the upper end of the positioning block 45 away from the output shaft 22. The two pin holes 414 can be engaged with the two positioning pins 44, and the upper end of the positioning block 45 is connected with a displacement mechanism, and the displacement mechanism is connected to the lower end of the transmission belt 28, and the displacement mechanism can cause the vacuum adsorption machine 19 to be displaced in the horizontal direction relative to the transmission belt 28;

[0037] The displacement mechanism includes a connecting rod 46, the upper end of which is fixedly connected to the lower end of the transmission belt 28, the lower end of which is vertically fixedly connected to a connecting shell 47, the lower end of which is provided with a through hole 48, a first connecting column 49 is vertically arranged in the through hole 48, the side wall of the first connecting column 49 is fixedly connected to a limiting ring 410, the limiting ring 410 is fitted with the inner wall of the bottom of the connecting shell 47, the first connecting column 49 is fixedly connected to four second elastic telescopic rods 411 distributed in a circular array, the second elastic telescopic rods 411 are fixedly connected to the inner wall of the connecting shell 47, the lower end of the first connecting column 49 is fixedly connected to a torsion plate 412, the lower end of the torsion plate 412 is elastically rotatably connected to a second connecting column 413, the lower end of the second connecting column 413 is fixedly connected to the upper end of the positioning block 45.

[0038] The vacuum adsorption machine 19 is first moved to the positioning plate 43 by the driving device or the driving motor 21, and the corresponding positioning block 45 reaches the bottom of the positioning plate 43, and then the positioning plate 43 is driven downward by the positioning device 42, so that the positioning pin 44 at the lower end of the positioning plate 43 is inserted into the pin hole 414 at the upper end of the positioning block 45. During the insertion process, the first connecting column 49 overcomes the elastic force of the second elastic telescopic rod 411 and is horizontally displaced relative to the connecting shell 47, thereby completing the position correction of the vacuum adsorption machine 19 relative to the positioning plate 43, so that the positioning device 42 drives the vacuum adsorption machine 19 through the positioning plate 43 to complete high-precision displacement in the horizontal plane, so that the vacuum adsorption machine 19 can be accurately aligned with the mounting slot 16 or the wafer 17.

[0039] The present invention uses an independent positioning device 42 to cooperate with multiple vacuum adsorption machines 19 to complete the one-time positioning of multiple vacuum adsorption machines 19, and integrates the positioning device 42 with each vacuum adsorption machine 19 through pin connection, so that the positioning device 42 controls the vacuum adsorption machine 19 to complete the action of high-precision displacement, thereby effectively improving the stability and processing accuracy of the equipment.

[0040] As a further solution of the present invention, it also includes a second positioning mechanism, which includes a third sleeve 51, and the third sleeve 51 is fixedly connected to the side wall of the output shaft 22 and is located at the lower end of the second sleeve 25. The side wall of the third sleeve 51 is located below the six first elastic telescopic rods 26 and is fixedly connected with a Y-shaped block 52. The opening direction of the Y-shaped block 52 is away from the output shaft 22, and the positioning block 45 is chamfered on the side close to the output shaft 22. The deepest end of the opening of the Y-shaped block 52 can engage with the chamfered end of the positioning block 45.

[0041] During the closing process of the vacuum suction machine 19, the vacuum suction machine 19 first reaches the end of the first elastic telescopic rod 26 through the movement of the transmission belt 28, and then during the closing process, the positioning block 45 at the upper end of the vacuum suction machine 19 will enter the opening of the Y-shaped block 52 and engage with the deepest part of the opening of the Y-shaped block 52, thereby adjusting the angle and position of the vacuum suction machine 19 and the positioning block 45, thereby ensuring that the positioning block 45 can engage with the positioning plate 43.

[0042] A semiconductor chip packaging process, the process is as follows:

[0043] S1, the robot 13 drives the mounting plate 18 to move above the wafer plate 14, and cooperates with the first positioning mechanism to make all the vacuum adsorption machines 19 absorb a wafer 17;

[0044] S2, then the robot 13 drives the mounting plate 18 to move above the welding device 12, and cooperates with the first positioning mechanism to place the wafers 17 sucked by the vacuum adsorption machine 19 into the respective mounting grooves 16 on the base 15 and weld them;

[0045] S3 , finally the robot arm 13 drives the mounting plate 18 to move above the wafer plate 14 , and replaces the welded base 15 in the welding device 12 at the same time.

Claims

1. A semiconductor chip packaging structure and packaging process thereof, comprising a support mechanism (11), a welding device (12), a manipulator (13), a wafer plate (14) and a base (15), wherein the welding device (12) and the manipulator (13) are both arranged at the upper end of the support mechanism (11), the base (15) is fixedly clamped on the welding device (12), the upper end of the base (15) is provided with mounting grooves (16) arranged in an array, and a plurality of wafers (17) are placed at the upper end of the wafer plate (14), characterized in that: The invention comprises a mounting plate (18), wherein the mounting plate (18) is fixedly connected to a manipulator (13), wherein a driving mechanism is arranged on the mounting plate (18), wherein the driving mechanism is provided with vacuum adsorption machines (19) whose number is the same as that of the mounting slots (16) and which are distributed in a circular array, wherein the mounting plate (18) is provided with a first positioning mechanism, wherein the driving mechanism is used to control a plurality of vacuum adsorption machines (19) to circulate to the first positioning mechanism, and wherein the first positioning mechanism is used to fine-tune the position of the vacuum adsorption machines (19).

2. The semiconductor chip packaging structure and packaging process according to claim 1, characterized in that: The driving mechanism comprises a driving motor (21), the driving motor (21) being fixedly connected to the upper end of the mounting plate (18), the lower end of the mounting plate (18) being provided with an output shaft (22), the output shaft (22) vertically penetrating the mounting plate (18) and being transmission-connected to the driving motor (21), the side wall of the output shaft (22) being fixedly connected to a second sleeve (25), the side wall of the second sleeve (25) being fixedly connected to a number of first elastic telescopic rods (26) distributed in a circumferential array which is the same as that of the vacuum adsorption machine (19) along the radial direction of the second sleeve (25); the ends of the first elastic telescopic rods (26) are all rotationally connected to horizontally arranged transmission wheels (27), one of the transmission wheels (27) being externally connected to a driving device, the plurality of transmission wheels (27) being commonly transmission-connected to a transmission belt (28), and the vacuum adsorption machine (19) being fixedly connected to the lower end of the transmission belt (28).

3. The semiconductor chip packaging structure and packaging process according to claim 2, characterized in that: The driving mechanism further comprises a first sleeve (23), the first sleeve (23) being fixedly connected to the side wall of the output shaft (22) and being located at the upper end of the second sleeve (25), the side wall of the first sleeve (23) being fixedly connected along the radial direction of the first sleeve (23) with driving telescopic rods (24) whose number is the same as that of the vacuum adsorption machine (19) and which are distributed in a circumferential array, the driving telescopic rods (24) having built-in driving units for controlling the telescopic movement of the driving telescopic rods (24), the driving telescopic rods (24) being respectively located at the angular bisector positions of two adjacent first elastic telescopic rods (26), the ends of the driving telescopic rods (24) being fixedly connected with tensioning mechanisms, the tensioning mechanisms engaging the transmission belt (28).

4. The semiconductor chip packaging structure and packaging process according to claim 3, characterized in that: The tensioning mechanism comprises a connecting block (31), the lower end of the connecting block (31) is fixedly connected to a connecting plate (32), the lower end of the connecting plate (32) is rotatably connected to a tensioning wheel (33) on one side close to and away from the output shaft (22), and the tensioning wheel (33) is respectively located at the inner and outer side walls of the transmission belt (28).

5. The semiconductor chip packaging structure and packaging process according to claim 4, characterized in that: The first positioning mechanism comprises a slide groove (41) which is vertically penetrated along the radial direction of the output shaft (22) and is provided on the mounting plate (18); a positioning device (42) with a built-in drive is slidably connected in the slide groove (41); a positioning plate (43) is drivingly connected to the lower end of the positioning device (42) near the output shaft (22); the positioning device (42) is capable of controlling the vertical displacement of the positioning plate (43) and of performing high-precision adjustment on the horizontal position of the positioning plate (43); and two positioning plates (43) are vertically fixedly connected to the lower end of the positioning plate (43). A positioning pin (44); the upper end of the vacuum adsorption machine (19) is fixedly connected with a positioning block (45); the upper end of the positioning block (45) is vertically provided with two pin holes (414) on the side away from the output shaft (22); the two pin holes (414) can be engaged with the two positioning pins (44); the upper end of the positioning block (45) is connected with a displacement mechanism, the displacement mechanism is connected to the lower end of the transmission belt (28), and the displacement mechanism can cause the vacuum adsorption machine (19) to be displaced in the horizontal direction relative to the transmission belt (28).

6. The semiconductor chip packaging structure and packaging process according to claim 4, characterized in that: The displacement mechanism comprises a connecting rod (46), the upper end of the connecting rod (46) is fixedly connected to the lower end of the transmission belt (28), the lower end of the connecting rod (46) is vertically fixedly connected to a connecting shell (47), the lower end of the connecting shell (47) is provided with a through hole (48), a first connecting column (49) is vertically arranged in the through hole (48), the side wall of the first connecting column (49) is fixedly connected to a limiting ring (410), and the limiting ring (410) is connected to the bottom of the connecting shell (47). The first connecting column (49) is fixedly connected to four second elastic telescopic rods (411) distributed in a circular array, the second elastic telescopic rods (411) are fixedly connected to the inner wall of the connecting shell (47), the lower end of the first connecting column (49) is fixedly connected to a torsion plate (412), the lower end of the torsion plate (412) is elastically rotatably connected to a second connecting column (413), and the lower end of the second connecting column (413) is fixedly connected to the upper end of the positioning block (45).

7. The semiconductor chip packaging structure and packaging process according to claim 6, characterized in that: The invention also comprises a second positioning mechanism, the second positioning mechanism comprising a third sleeve (51), the third sleeve (51) being fixedly connected to the side wall of the output shaft (22) and being located at the lower end of the second sleeve (25), the side wall of the third sleeve (51) being located below the six first elastic telescopic rods (26) and being fixedly connected to a Y-shaped block (52), the opening direction of the Y-shaped block (52) being away from the output shaft (22), the side of the positioning block (45) close to the output shaft (22) being provided with a chamfer, and the deepest part of the opening of the Y-shaped block (52) being able to engage with one end of the positioning block (45) provided with the chamfer.

8. A semiconductor chip packaging process, applicable to a semiconductor chip packaging structure according to claims 1-7, characterized in that: The process is as follows: S1, the robot (13) drives the mounting plate (18) to move above the wafer plate (14), and cooperates with the first positioning mechanism to make all the vacuum adsorption machines (19) absorb a wafer (17); S2, the robot (13) then drives the mounting plate (18) to move above the welding device (12), and cooperates with the first positioning mechanism to place the wafers (17) sucked by the vacuum adsorption machine (19) into the respective mounting grooves (16) on the base (15) and weld them; S3. Finally, the robot (13) drives the mounting plate (18) to move above the wafer disk (14), and at the same time replaces the welded base (15) in the welding device (12).

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