LED lamp bead, lamp panel, display device and manufacturing method of lamp panel

Abstract

The invention discloses an LED lamp bead, a lamp panel, a display device and a manufacturing method of the lamp panel, and relates to the technical field of display device.The LED lamp bead comprises a light-emitting assembly and a packaging adhesive layer; the light-emitting assembly comprises three light-emitting chips arranged at intervals, the three light-emitting chips are used for emitting red light, green light and blue light respectively, each light-emitting chip comprises a chip body and a chip bonding pad arranged on the chip body, and the chip bonding pads are used for being welded to substrate bonding pads on the PCB substrate. And the packaging adhesive layer coats the chip main bodies of the three light-emitting chips. In the technical scheme of the invention, picture color and brightness uniformity and heat dissipation efficiency can be considered.

Description

Technical Field

[0001] The present invention relates to the technical field of display devices, and in particular to an LED lamp bead, a lamp board, a display device and a method for manufacturing the lamp board. Background Art

[0002] With the continuous updating and maturity of LED production technology and the development of domestic industrialization, LED displays have become ubiquitous in our lives. Direct full-color LED displays have the advantages of high brightness, three-color full color, unlimited size expansion, and outdoor application, and are widely used in various places.

[0003] There are a huge number of LED lamp beads in the direct display screen, and the cost, process, and reliability of LED lamp beads are important factors restricting development. The lamp beads are generally formed using COB packaging technology and MIP packaging technology. For COB packaging technology, since the chip is directly mounted on the PCB board, it is impossible to perform light separation and color separation after mounting, so that the display screen of the direct display screen is prone to uneven color and brightness. MIP packaging technology is to encapsulate the chip in a bracket. Although it can perform light separation and color separation before mounting, since the chip is not in direct contact with the PCB board, it leads to slow heat conduction and low heat dissipation efficiency. It is difficult to achieve compatible color and brightness uniformity and heat dissipation efficiency in related technologies. Summary of the invention

[0004] The main purpose of the present invention is to propose an LED lamp bead, a lamp board, a display device and a manufacturing method of the lamp board, aiming to at least solve the technical problem in the related technology that it is difficult to achieve compatibility between picture color and brightness uniformity and heat dissipation efficiency.

[0005] To achieve the above object, the present invention provides an LED lamp bead, comprising:

[0006] A light-emitting component, comprising three light-emitting chips arranged at intervals, the three light-emitting chips being used to emit red light, green light and blue light respectively, the light-emitting chip comprising a chip body and a chip pad arranged on the chip body, the chip pad being used to be welded to a substrate pad on a PCB substrate; and

[0007] The packaging adhesive layer covers the chip bodies of the three light-emitting chips.

[0008] In one embodiment, the thickness of the encapsulation adhesive layer is not greater than 3 mm; and / or,

[0009] The colloid of the packaging adhesive layer includes silica gel or epoxy glue.

[0010] The present invention further provides a lamp board, the lamp board comprising a PCB substrate and at least one LED lamp bead, the LED lamp bead comprising:

[0011] A light-emitting component, comprising three light-emitting chips arranged at intervals, the three light-emitting chips being used to emit red light, green light and blue light respectively, the light-emitting chip comprising a chip body and a chip pad arranged on the chip body; and

[0012] An encapsulation adhesive layer, covering the chip bodies of the three light-emitting chips;

[0013] Wherein, a substrate pad is arranged on the PCB substrate, the LED lamp bead is arranged on one side of the PCB substrate, and the chip pad is welded to the substrate pad.

[0014] The present invention also provides a display device, which includes the above-mentioned light board.

[0015] The present invention also provides a method for manufacturing a lamp panel, comprising the following steps:

[0016] Providing a carrier board and a plurality of light-emitting chips, fixing the plurality of light-emitting chips on the carrier board at intervals to form a plurality of light-emitting components, each of the light-emitting components comprising three light-emitting chips for emitting red light, green light and blue light respectively;

[0017] Providing packaging glue, and covering the packaging glue on the carrier to form a collective glue layer covering the multiple light-emitting components;

[0018] Removing the plurality of light-emitting components covered by the collective adhesive layer from the carrier board;

[0019] Cutting the collective adhesive layer to form an LED lamp bead, wherein the LED lamp bead includes a light-emitting component and an encapsulation adhesive layer covering the light-emitting component;

[0020] Detecting the light-emitting parameters of the plurality of LED lamp beads, and sorting the plurality of LED lamp beads according to the light-emitting parameters;

[0021] A PCB substrate is provided, and the LED lamp beads are welded to substrate pads on the PCB substrate via chip pads on the light-emitting chip to form a lamp board.

[0022] The steps of providing a carrier board and a plurality of light-emitting chips, and fixing the plurality of light-emitting chips on the carrier board at intervals specifically include:

[0023] Adhere one side of the plurality of light-emitting chips provided with chip pads to the carrier by glue;

[0024] The glue is cured to fix the light emitting chip on the carrier.

[0025] In one embodiment, the steps before curing the glue include:

[0026] The other sides of the plurality of light emitting chips are pressed together.

[0027] In one embodiment, the step of removing the plurality of light-emitting components covered by the collective adhesive layer from the carrier includes:

[0028] Heating the connection between the glue and the carrier board to soften the assembled glue layer and the glue;

[0029] The plurality of light-emitting components covered by the collective adhesive layer are removed from the carrier.

[0030] In one embodiment, the steps before the collective glue layer is cut to form an LED lamp bead, wherein the LED lamp bead includes a light-emitting component and a packaging glue layer covering the light-emitting component include:

[0031] The assembled adhesive layer is polished to a preset thickness.

[0032] In one embodiment, the light emitting parameters include voltage, brightness and wavelength.

[0033] In the technical solution of the present invention, the LED lamp beads are coated with the chip body of the three-color light-emitting chip by the packaging glue layer, that is, the packaging glue layer does not cover the chip pad of the light-emitting chip. Before the LED lamp beads are fixed on the PCB substrate, the LED lamp beads can be sorted to ensure the uniformity of the subsequent light emission of the lamp board. At the same time, the LED lamp beads can be directly welded and fixed to the substrate pad on the PCB substrate through the chip pad of the light-emitting chip. The light-emitting chip is in direct contact with the PCB substrate, and the thermal resistance is low. Such a setting can take into account the uniformity of picture color and brightness as well as heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0035] Figure 1 A schematic diagram of the structure of an embodiment of an LED lamp bead provided by the present invention;

[0036] Figure 2 A schematic structural diagram of an embodiment of a light board provided by the present invention;

[0037] Figure 3 A schematic diagram of a process of an embodiment of a method for manufacturing a light panel provided by the present invention;

[0038] Figure 4 A schematic diagram of a structure in which a plurality of light-emitting chips are fixed on a carrier board;

[0039] Figure 5 It is a schematic diagram of the structure of multiple light-emitting components and an integrated adhesive layer;

[0040] Figure 6 for Figure 5 Schematic diagram of the structure after the middle collective glue layer is polished.

[0041] Description of Figure Numbers:

[0042] 1000, lamp board; 100, LED lamp bead; 1, light-emitting chip; 11, chip body; 12, chip pad; 2, packaging adhesive layer; 3, PCB substrate; 31, substrate pad; 4, carrier board; 5, assembly adhesive layer.

[0043] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0044] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0045] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0046] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0047] With the continuous updating and maturity of LED production technology and the development of domestic industrialization, LED displays have become ubiquitous in our lives. Direct full-color LED displays have the advantages of high brightness, three-color full color, unlimited size expansion, and outdoor application, and are widely used in various places.

[0048] There are a large number of LED lamp beads in direct display screens. The cost, process and reliability of LED lamp beads are important factors restricting their development. The lamp beads are generally formed by COB packaging technology and MIP packaging technology.

[0049] The MIP packaging technology is to package the three-color chip in a bracket to form an SMD surface mount component, and then use the traditional carrier form to mount the component, and solder the lamp beads on the PCB board for reflow soldering; the lamp beads can be separated and colored before mounting, but due to the setting of the bracket, the light-emitting chip is not in direct contact with the PCB board, and the thermal resistance is relatively high.

[0050] COB packaging technology is different from MIP packaging technology. It is directly mounted on the PCB board through a die bonding machine. It has no bracket part and low thermal resistance. However, it cannot separate the light and color of the lamp beads, and the color and brightness consistency of the picture are affected.

[0051] In summary, it is difficult to balance the uniformity of picture color and brightness as well as heat dissipation efficiency in the related art.

[0052] The main purpose of the present invention is to propose an LED lamp bead, a lamp board, a display device and a manufacturing method of the lamp board, aiming to at least solve the technical problem in the related technology that it is difficult to achieve compatibility between picture color and brightness uniformity and heat dissipation efficiency.

[0053] See also Figure 1 and Figure 2In one embodiment of the present invention, the LED lamp bead includes a light-emitting component and a packaging adhesive layer 2; the light-emitting component includes three light-emitting chips 1 arranged at intervals, and the three light-emitting chips 1 are used to emit red light, green light and blue light respectively. The light-emitting chip 1 includes a chip body 11 and a chip pad 12 arranged on the chip body 11, and the chip pad 12 is used to be welded with the substrate pad 31 on the PCB substrate, and the packaging adhesive layer 2 covers the chip body 11 of the three light-emitting chips 1.

[0054] In the technical solution of the present invention, the LED lamp beads are coated with the chip body 11 of the three-color light-emitting chip 1 through the packaging glue layer 2, that is, the packaging glue layer 2 does not cover the chip pad 12 of the light-emitting chip 1. Before the LED lamp beads are fixed on the PCB substrate, the LED lamp beads can be sorted to ensure the uniformity of the subsequent light emission of the lamp board 1000. At the same time, the LED lamp beads can be directly welded and fixed to the substrate pad 31 on the PCB substrate through the chip pad 12 of the light-emitting chip 1. The light-emitting chip 1 is in direct contact with the PCB substrate, and the thermal resistance is low. Such a setting can take into account the uniformity of picture color and brightness as well as heat dissipation efficiency.

[0055] The packaging adhesive layer 2 is used to protect the light-emitting chip 1, and can play the role of waterproof, moisture-proof and dust-proof. There are many types of packaging adhesive layer 2, which can be silicone or epoxy adhesive; silicone has good cold resistance, oil resistance, weather aging resistance and other characteristics, while epoxy adhesive has high mechanical strength and chemical corrosion resistance. When selecting the colloid of the packaging adhesive layer 2, you can choose according to the required performance.

[0056] Although the existing encapsulation glue is mostly transparent, it still affects the light of the light emitting chip 1. If the thickness of the encapsulation glue layer 2 is thick, the overall light transmittance of the encapsulation glue layer 2 will be low, affecting the clarity and brightness of the display device. Therefore, the thickness of the encapsulation glue layer 2 is not greater than 3mm, that is, the thickness of the encapsulation glue layer 2 can be 2mm, 2.5mm and 3mm, etc. When the thickness of the encapsulation glue layer 2 is 3mm, it can well protect the light emitting chip 1 while also having a considerable light transmittance. Of course, the thickness of the encapsulation glue layer 2 should be greater than the thickness of the light emitting chip 1 to ensure its protective performance for the light emitting chip 1.

[0057] The present invention also proposes a lamp board 1000, which includes a PCB substrate and at least one LED lamp bead, wherein the LED lamp bead includes a light-emitting component and a packaging adhesive layer 2; the light-emitting component includes three light-emitting chips 1 arranged at intervals, and the three light-emitting chips 1 are used to emit red light, green light and blue light respectively, and the light-emitting chip 1 includes a chip body 11 and a chip pad 12 arranged on the chip body 11, and the chip pad 12 is used to be welded with a substrate pad 31 on the PCB substrate, and the packaging adhesive layer 2 covers the chip body 11 of the three light-emitting chips 1; wherein a substrate pad 31 is arranged on the PCB substrate, the LED lamp bead is arranged on one side of the PCB substrate, and the chip pad 12 is welded to the substrate pad 31.

[0058] In the technical solution of the present invention, the LED lamp bead is formed by encapsulating the chip body 11 of the three-color light-emitting chip 1 through the encapsulation adhesive layer 2, that is, the encapsulation adhesive layer 2 does not encapsulate the chip pad 12 of the light-emitting chip 1. Before the LED lamp bead is fixed on the PCB substrate, the LED lamp bead is tested and suitable LED lamp bead is selected to ensure the uniformity of the light emission of the lamp board 1000. After the sorting is completed, the chip pad 12 of the light-emitting chip 1 and the substrate pad 31 are welded together by reflow soldering to complete the assembly of the LED lamp bead on the PCB board. Since the chip pad 12 is in direct contact with the substrate pad 31, the heat of the light-emitting chip 1 can be better transferred to the PCB substrate, and then dissipated into the air, and the overall heat dissipation efficiency of the lamp board 1000 is better.

[0059] The number of the LED lamp beads on one PCB board is not limited to one, and can be two or even more, depending on actual needs.

[0060] The present invention also proposes a display device, which includes a lamp board 1000. The specific structure of the lamp board 1000 refers to the above embodiments. Since the display device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0061] The present invention also provides a first embodiment of a method for manufacturing a lamp panel 1000, please refer to Figures 3 to 6 The manufacturing method of the light board 1000 includes the following steps:

[0062] S10: Provide a carrier board 4 and a plurality of light-emitting chips 1, and fix the plurality of light-emitting chips 1 on the carrier board 4 at intervals to form a plurality of light-emitting components, each of which includes three light-emitting chips 1 for emitting red light, green light and blue light respectively.

[0063] In this step, if Figure 4 As shown, when the plurality of light-emitting chips 1 are fixed on the carrier board 4, they need to be installed in a certain order (different fillings in the figure represent the light-emitting chips 1 emitting different lights), such as red, green and blue. Since a display device requires a lot of the light boards 1000, if the order of the light-emitting chips 1 in different light boards 1000 is different, it will undoubtedly affect the color uniformity of the final display device. Of course, for the uniformity of color and brightness, the plurality of light-emitting chips 1 also need to be installed in a certain spacing layout.

[0064] It should be noted that the surface of the carrier board 4 needs to be as flat as possible to ensure that in each group of the light-emitting components, the three light-emitting chips 1 are at the same level.

[0065] S20: providing packaging glue, and covering the packaging glue on the carrier 4 to form a collective glue layer 5 covering the plurality of light-emitting components.

[0066] In this step, before the encapsulation glue is covered on the carrier board 4, the encapsulation glue needs to be prepared according to the requirements of light transmittance and hardness, and the silica gel or epoxy resin colloid is proportioned with a colorant, a hardener, an accelerator, a diffusion powder, etc. to form the encapsulation glue. In the process of preparing the encapsulation glue, it is inevitable that a lot of bubbles will be generated. The presence of bubbles will refract the light emitted by the light-emitting chip 1, thereby affecting the uniformity of the color and brightness of the display device. Therefore, before covering, the encapsulation glue needs to be vacuum stirred and degassed to make the encapsulation glue evenly mixed without bubbles.

[0067] S30 : removing the plurality of light-emitting components covered by the collective adhesive layer 5 from the carrier board 4 .

[0068] S40: cutting the collective adhesive layer 5 to form an LED lamp bead, wherein the LED lamp bead includes a light-emitting component and a packaging adhesive layer 2 covering the light-emitting component.

[0069] S50: Detecting the light-emitting parameters of the plurality of LED lamp beads, and sorting the plurality of LED lamp beads according to the light-emitting parameters.

[0070] Wherein, the luminous parameters include voltage, brightness and wavelength. Due to process limitations, the voltage, brightness, wavelength, etc. of the RGB wafer have fluctuation ranges, which leads to differences in the luminous parameters of the LED lamp beads. There will be many LED lamp beads in a display device. If the luminous parameters between the LED lamp beads are very different, it will affect the consistency of the color and brightness of the display device; therefore, it is necessary to sort the multiple LED lamp beads produced. Of course, the luminous parameters of different LED lamp beads are affected by many factors and will not be exactly the same, so when sorting, just set a suitable range.

[0071] S60: providing a PCB substrate, and soldering the sorted LED lamp beads to the substrate pads 31 on the PCB substrate through the chip pads 12 on the light-emitting chip 1 to form a lamp board 1000.

[0072] It should be noted that, since the three light-emitting chips 1 of each LED lamp bead are arranged on the carrier board 4, that is, arranged on the same plane, the three light-emitting chips 1 remain flat as a whole, and during overcurrent soldering, the three light-emitting chips 1 are welded together, and the overall volume and weight are large, and not easy to shift or tilt. In contrast, the COB packaging technology in the related art is to weld the light-emitting chips 1 one by one, and each of the light-emitting chips 1 is prone to shifting and tilting. The accumulation of the three light-emitting chips 1 will affect the uniformity of their light emission, which is likely to lead to scrap. In summary, the lamp board 1000 produced by the technical solution of the present application has high reliability, high yield, and high efficiency.

[0073] In the technical solution of the present invention, before the LED lamp beads are fixed on the PCB substrate, the LED lamp beads are tested and suitable LED lamp beads are selected to ensure the uniformity of the light emission of the lamp board 1000. After the sorting is completed, the chip pad 12 of the light-emitting chip 1 and the substrate pad 31 are welded together by reflow soldering to complete the assembly of the LED lamp beads on the PCB board to form the lamp board 1000. Since the chip pad 12 is in direct contact with the substrate pad 31, the heat of the light-emitting chip 1 can be better transferred to the PCB substrate and then dissipated into the air, and the overall heat dissipation efficiency of the lamp board 1000 is better. That is, the lamp board 1000 manufactured by this method can take into account the uniformity of picture color and brightness as well as heat dissipation efficiency.

[0074] Based on the first embodiment of the manufacturing method of the lamp board 1000, the present invention further proposes a second embodiment of the manufacturing method of the lamp board 1000. In this embodiment, step S10 specifically includes the following steps:

[0075] S100: bonding the sides of the plurality of light-emitting chips 1 provided with the chip pads 12 to the carrier 4 by glue.

[0076] In this step, glue can be directly applied to the corresponding positions of the carrier board 4 and the light-emitting chip 1 by a die bonding machine, which is convenient and fast and does not require additional equipment.

[0077] S110 : curing the glue to fix the light emitting chip 1 on the carrier board 4 .

[0078] In this step, the curing method of the glue is selected according to the type of glue, which can be thermal curing or ultraviolet curing. It should be noted that when the glue is cured by ultraviolet light, the carrier 4 needs to be a transparent plate, such as glass, so that ultraviolet light can pass through the carrier 4 for fixing. Since the fixing method of the packaging glue is usually to perform thermal curing in an oven or a baking furnace, the glue is preferably a thermal curing glue, so that no additional ultraviolet equipment is required.

[0079] The method of fixing the light emitting chip 1 on the carrier 4 is not limited to this. For example, double-sided tape can also be set on the chip pad 12 of the light emitting chip 1 and the carrier 4 for fixing. However, this fixing method often requires manual cutting of the double-sided tape, and then manually bonding the light emitting chips 1 one by one. Please refer to Figure 4 , there are many light-emitting chips 1 on one carrier board 4, and the light-emitting chips 1 themselves are very small, which is inconvenient to operate and has low efficiency. In the technical solution of this embodiment, the dispensing can be performed by a die bonding machine, which effectively utilizes existing equipment, saves labor, and improves efficiency.

[0080] Based on the second embodiment of the manufacturing method of the lamp board 1000, the present invention further proposes a third embodiment of the manufacturing method of the lamp board 1000. In this embodiment, the steps before curing the glue include:

[0081] S109: Pressing the other sides of the plurality of light-emitting chips 1 .

[0082] The other side of the light emitting chip 1 refers to the side opposite to the chip pad 12 . In this process, a plurality of the light emitting chips 1 are pressed simultaneously by a pressing machine.

[0083] Regardless of whether the light-emitting chip 1 is fixed to the carrier 4 by glue or tape, even if the surface of the carrier 4 is very flat, the tilt angle of each light-emitting chip 1 may be different after curing. As can be seen from the above, the different tilt angles of the light-emitting chip 1 will affect the consistency of the color and brightness of the display device. In the technical solution of this embodiment, by pressing the plurality of light-emitting chips 1 before the glue is cured, the light-emitting chips 1 are kept in one plane as much as possible, which is conducive to ensuring the consistency of color and brightness.

[0084] Based on the second embodiment of the manufacturing method of the lamp board 1000, the present invention further proposes a fourth embodiment of the manufacturing method of the lamp board 1000. In this embodiment, step S30 specifically includes:

[0085] S300: heating the connection between the glue and the carrier board 4 to soften the assembled glue layer 5 and the glue.

[0086] S310 : removing the plurality of light-emitting components covered by the collective adhesive layer 5 from the carrier 4 .

[0087] In the technical solution of this embodiment, during disassembly, the collective adhesive layer 5 can be separated from the carrier 4 by heating and softening, and the light-emitting chip 1 can also be separated from the carrier 4 at the same time, that is, the separation of multiple light-emitting components from the carrier 4 is achieved, which is convenient and quick.

[0088] The method of separating the plurality of light-emitting components from the carrier 4 is not limited thereto. The glue layer formed by the glue between the light-emitting chip 1 and the carrier 4 may also be directly cut by cutting, or the light-emitting chip 1 and the carrier 4 may be disassembled.

[0089] It is understandable that if the packaging glue is directly covered on the carrier 4, the packaging glue layer 2 will eventually adhere to the carrier 4, and the packaging glue layer 2 and the carrier 4 will need to be removed later; therefore, in an embodiment of the present invention, before step S20, an anti-sticking film may be provided on the outer peripheral side of the chip pad 12 of the light-emitting chip 1 to prevent the packaging glue from directly adhering to the carrier 4.

[0090] Based on the second embodiment of the manufacturing method of the lamp board 1000, the present invention further proposes a fifth embodiment of the manufacturing method of the lamp board 1000. In this embodiment, the steps before step S40 include:

[0091] S39: Grinding the collective adhesive layer 5 to a preset thickness.

[0092] Please refer to Figure 5After covering the packaging glue, the upper surface of the formed collective glue layer 5 is uneven, and the light emitted by the light-emitting chip 1 will be emitted through the upper surface of the collective glue layer 5. The uneven glue layer will cause the light of the light-emitting chip 1 to be refracted to various directions. Therefore, the collective glue layer 5 needs to be polished and smoothed to ensure that the packaging glue layer 2 cut out subsequently is flat, thereby ensuring the lighting effect of the lamp board 1000.

[0093] It is understandable that when initially covering the packaging glue, the amount of the packaging glue needs to be larger than the amount corresponding to the preset thickness, so as to avoid the local thickness of the packaging glue layer 2 being less than the preset thickness and requiring rework. Therefore, the thickness of the collective glue layer 5 will inevitably be greater than the preset thickness; therefore, during polishing, the thickness of the collective glue layer 5 can be directly polished to the preset thickness.

[0094] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An LED lamp bead, characterized in that: include: A light-emitting component, comprising three light-emitting chips arranged at intervals, the three light-emitting chips being used to emit red light, green light and blue light respectively, the light-emitting chip comprising a chip body and a chip pad arranged on the chip body, the chip pad being used to be welded to a substrate pad on a PCB substrate; and The packaging adhesive layer covers the chip bodies of the three light-emitting chips.

2. The LED lamp bead according to claim 1, characterized in that: The thickness of the encapsulation adhesive layer is not greater than 3 mm; and / or, The colloid of the packaging adhesive layer includes silica gel or epoxy glue.

3. A light board, characterized in that: include: A PCB substrate is provided with a substrate pad, and At least one LED lamp bead, wherein the LED lamp bead comprises the LED lamp bead as claimed in claim 1 or 2; Wherein, the LED lamp bead is arranged on one side of the PCB substrate, and the chip pad is welded to the substrate pad.

4. A display device, characterized in that: Comprising the light panel as claimed in claim 3.

5. A method for manufacturing a light panel, characterized in that: The following steps are involved: Providing a carrier board and a plurality of light-emitting chips, fixing the plurality of light-emitting chips on the carrier board at intervals to form a plurality of light-emitting components, each of the light-emitting components comprising three light-emitting chips for emitting red light, green light and blue light respectively; Providing packaging glue, and covering the packaging glue on the carrier to form a collective glue layer covering the multiple light-emitting components; Removing the plurality of light-emitting components covered by the collective adhesive layer from the carrier board; Cutting the collective adhesive layer to form an LED lamp bead, wherein the LED lamp bead includes a light-emitting component and an encapsulation adhesive layer covering the light-emitting component; Detecting the light-emitting parameters of the plurality of LED lamp beads, and sorting the plurality of LED lamp beads according to the light-emitting parameters; A PCB substrate is provided, and the sorted LED lamp beads are welded to the substrate pads on the PCB substrate through the chip pads on the light-emitting chip to form a lamp board.

6. The method for manufacturing a light panel according to claim 5, characterized in that: The steps of providing a carrier board and a plurality of light-emitting chips, and fixing the plurality of light-emitting chips on the carrier board at intervals specifically include: Adhere one side of the plurality of light-emitting chips provided with chip pads to the carrier by glue; The glue is cured to fix the light emitting chip on the carrier.

7. The method for manufacturing a light panel according to claim 6, characterized in that: The steps before curing the glue include: The other sides of the plurality of light emitting chips are pressed together.

8. The method for manufacturing a light panel according to claim 6, characterized in that: The step of removing the plurality of light-emitting components covered by the collective adhesive layer from the carrier board comprises: Heating the connection between the glue and the carrier board to soften the assembled glue layer and the glue; The plurality of light-emitting components covered by the collective adhesive layer are removed from the carrier.

9. The method for manufacturing a light panel according to claim 5, characterized in that: The steps before the collective glue layer is cut to form an LED lamp bead, wherein the LED lamp bead includes a light-emitting component and a packaging glue layer covering the light-emitting component include: The assembled adhesive layer is polished to a preset thickness.

10. The method for manufacturing a light panel according to claim 5, characterized in that: The light emitting parameters include voltage, brightness and wavelength.

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