Circuit board welding structure
By setting through holes in the wave soldering pads to adjust the thermal conduction area and heat conduction, the problem of too low temperature in the plug-in hole is solved, and the reliability of solder fill and solder joints is improved.
Patent Information
- Application Number
- CN202411400234.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-09
- Publication Date
- 2025-02-14
AI Technical Summary
During the wave soldering process, the single-layer connecting copper plate will have the problem of heat loss in the plug-in holes too quickly, resulting in too low temperature and insufficient solder filling, which will affect the mechanical strength and reliability of the solder joints.
By providing the first through hole and the second through hole in the pad of the solder body, the thermal conduction area and heat conduction path of the soldering body are adjusted to ensure that the temperature in the plug-in hole is within a preset range and is suitable for solder filling.
It effectively avoids the problem of excessive heat loss caused by excessive thermal conductivity of the pad, ensures the appropriate temperature in the plug-in hole, improves the filling of solder, and enhances the mechanical strength and reliability of the solder joints.
Smart Images
Figure CN119450905A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of wave soldering of circuit boards, and in particular to a circuit board soldering structure. Background Art
[0002] In the electronic assembly process, when it comes to the steps of inserting circuit products in circuit boards and inserting mixed circuit products, wave soldering technology is one of the most common electronic assembly processes for soldering electronic components on circuit boards. Wave soldering is to make the soldering surface of the plug-in board directly contact with the high-temperature liquid solder to achieve the purpose of soldering. The high-temperature liquid solder maintains an inclined surface, and a special device makes the high-temperature liquid solder form a wave-like phenomenon, so as to achieve the soldering of electronic components and plug-in boards. Compared with other welding technologies, wave soldering technology has good thermal conductivity because a large amount of solder is in a flowing state, so that the soldered surface of the printed circuit board can fully contact the solder, and thus has good thermal conductivity, which significantly shortens the contact time between the solder and the printed circuit board, and the transmission system for transporting the printed circuit board only performs linear motion, which is simple to manufacture, and can complete high-speed welding, which is suitable for batch welding products. Using plug-in holes to solder electronic components, the components in the through holes can have enough soldering space, so that the welding effect is good and reliable solder joints are formed. And the cost is low, it is one of the main welding technologies for large-scale welding products.
[0003] However, during the wave soldering operation, the single-layer connecting copper plate will have the problem of too fast heat dissipation in the plug-in hole. In addition, with the continuous thickening of the circuit board of electronic assembly products, the continuous increase in the number of layers of copper plates connecting the plug-in holes and the promotion of lead-free processes, the plug-in holes of the circuit board will be insufficiently filled with solder due to low temperature and uneven heating in the plug-in holes. Insufficient solder filling will seriously affect the mechanical strength of the solder joint, deteriorate the conductive performance of the device, and reduce the reliability of the solder joint on the circuit board. Summary of the invention
[0004] The purpose of this application is to provide a circuit board welding structure, which solves the problem of insufficient solder filling due to too low temperature in the circuit board plug-in hole, and enhances the mechanical strength and reliability of the circuit board solder joints. To achieve the purpose of this application, this application provides the following technical solutions:
[0005] In a first aspect, the present application provides a circuit board welding structure, comprising:
[0006] A welding body, comprising at least one layer of solder pads, wherein the solder pads comprise at least one plug-in hole, and the plug-in hole is used to fill solder;
[0007] Wherein, in the case where the welding body includes a layer of pads, the pads further include at least one first through hole, the first through hole is located on the peripheral side of the plug-in hole, and the shape of the first through hole is a closed figure;
[0008] In the case where the welding body includes at least two layers of pads, the plug-in holes of the pads are connected, and the pads further include at least one second through hole;
[0009] The first through hole and the second through hole are both used to make the temperature in the plug-in hole fall within a preset range during the welding process.
[0010] In one embodiment, the first through hole includes one or more.
[0011] In one embodiment, a plurality of the first through holes are evenly arranged around the plug-in hole.
[0012] In one embodiment, the plurality of first through holes are symmetrically arranged about the geometric center of the plug-in hole.
[0013] In one embodiment, the second through hole is in a closed shape, and at least one of the second through holes of different pads is connected.
[0014] In one embodiment, the second through hole is connected to the plug-in hole, and at least one of the second through holes of different pads is connected to each other.
[0015] In one of the embodiments, at least one of the second through holes of the pad comprises a plurality of holes; and / or,
[0016] At least one of the pads comprises a second through hole.
[0017] In one of the embodiments, when the pad includes a plurality of the second through holes, the plurality of the second through holes are evenly arranged around the plug-in hole.
[0018] In one of the embodiments, when the pad includes one second through hole, the second through hole is ring-shaped.
[0019] In one embodiment, the diameter of the second through hole is smaller than the diameter of the plug-in hole.
[0020] The circuit board welding structure of the present application comprises a welding body, the welding body comprises at least one layer of pads, the pads comprise at least one plug-in hole, and the plug-in hole is used to fill solder. In the case where the welding body comprises a layer of pads, by arranging at least one first through hole on the peripheral side of the plug-in hole, the heat conduction area of the pads can be reduced, thereby effectively avoiding the problem that the heat dissipation rate is fast through the pads due to the excessive thermal conductivity of the pads in the plug-in hole during the wave soldering process. And in the case where the welding body comprises at least two layers of pads, by arranging at least one second through hole in the pads, a heat conduction space can be formed between different pads through the second through hole during the wave soldering process, so that heat can be conducted to each pad through the second through hole, and then heat can be provided to the plug-in hole by heating the pad. Therefore, the problem that the temperature in the plug-in hole cannot reach the preset range due to the excessive heat conduction area of the pads, the excessive heat dissipation, the increase in the number of pad layers, and the low heat conduction efficiency can be solved, so that the temperature in the plug-in hole can be ensured to be within the preset temperature, and can be adapted to the temperature of solder filling, so that the solder filling in the plug-in hole is sufficient, the quality and reliability of the solder joints are improved, and then the conductive performance of the device is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0022] Figure 1 is a schematic diagram of a top view of a circuit board welding structure provided in an embodiment;
[0023] Figure 2 is a schematic diagram of a top view of another circuit board welding structure provided in an embodiment;
[0024] Figure 3 is a schematic cross-sectional structure diagram of another circuit board welding structure provided in an embodiment;
[0025] Figure 4 is a top view structural schematic diagram of another circuit board welding structure provided in an embodiment;
[0026] Figure 5 It is a schematic cross-sectional structure diagram of another circuit board welding structure provided in an embodiment.
[0027] Description of Reference Numerals
[0028] 10. Solder pad; 20. Plug-in hole; 30. First through hole; 40. Second through hole. DETAILED DESCRIPTION
[0029] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are given in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0031] It should be understood that when an element or layer is referred to as being "on, adjacent to, connected to or coupled to other elements or layers, it may be directly on, adjacent to, connected to or coupled to other elements or layers, or there may be intervening elements or layers. On the contrary, when an element is referred to as being "directly on, directly adjacent to, directly connected to or directly coupled to other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers, doping types and / or parts, these elements, components, regions, layers, doping types and / or parts should not be limited by these terms. These terms are merely used to distinguish one element, component, region, layer, doping type or part from another element, component, region, layer, doping type or part. Therefore, without departing from the teachings of the present invention, the first element, component, region, layer, doping type or portion discussed below may be represented as a second element, component, region, layer or portion; for example, the first doping type may be referred to as the second doping type, and similarly, the second doping type may be referred to as the first doping type; the first doping type and the second doping type are different doping types, for example, the first doping type may be P-type and the second doping type may be N-type, or the first doping type may be N-type and the second doping type may be P-type.
[0032] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0033] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that when the terms "consisting of" and / or "comprising" are used in this specification, the presence of the features, integers, steps, operations, elements and / or parts can be determined, but the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups is not excluded. At the same time, when used herein, the term "and / or" includes any and all combinations of the relevant listed items.
[0034] Embodiments of the invention are described herein with reference to cross-sectional views which are schematic diagrams of ideal embodiments (and intermediate structures) of the invention, such that variations in the shapes shown due to, for example, manufacturing techniques and / or tolerances are anticipated. Thus, embodiments of the invention should not be limited to the specific shapes of the regions shown herein, but rather include deviations in shapes due to, for example, manufacturing techniques. For example, an implanted region shown as a rectangle typically has rounded or curved features and / or an implant concentration gradient at its edges rather than a binary change from an implanted region to a non-implanted region. Similarly, a buried region formed by implantation may result in some implantation in the region between the buried region and the surface through which the implantation is performed. Thus, the regions shown in the figures are schematic in nature, their shapes do not represent the actual shape of the region of the device, and do not limit the scope of the invention.
[0035] In the electronic assembly process, when it comes to the steps of inserting circuit products in circuit boards and inserting mixed circuit products, wave soldering technology is one of the most common electronic assembly processes for soldering electronic components on circuit boards. Wave soldering is to make the soldering surface of the plug-in board directly contact with the high-temperature liquid solder to achieve the purpose of soldering. The high-temperature liquid solder maintains an inclined surface, and a special device makes the high-temperature liquid solder form a wave-like phenomenon, so as to achieve the soldering of electronic components and plug-in boards. Compared with other welding technologies, wave soldering technology has good thermal conductivity because a large amount of solder is in a flowing state, so that the soldered surface of the printed circuit board can fully contact the solder, and thus has good thermal conductivity, which significantly shortens the contact time between the solder and the printed circuit board, and the transmission system for transporting the printed circuit board only performs linear motion, which is simple to manufacture, and can complete high-speed welding, which is suitable for batch welding products. Using plug-in holes to solder electronic components, the components in the through holes can have enough soldering space, so that the welding effect is good and reliable solder joints are formed. And the cost is low, it is one of the main welding technologies for large-scale welding products.
[0036] However, during the wave soldering operation, the single-layer connecting copper plate will have the problem of too fast heat dissipation in the plug-in hole. In addition, with the continuous thickening of the circuit board of electronic assembly products, the continuous increase in the number of layers of copper plates connecting the plug-in holes and the promotion of lead-free processes, the plug-in holes of the circuit board will be insufficiently filled with solder due to low temperature and uneven heating in the plug-in holes. Insufficient solder filling will seriously affect the mechanical strength of the solder joint, deteriorate the conductive performance of the device, and reduce the reliability of the solder joint on the circuit board.
[0037] The present application embodiment provides a circuit board welding structure. Figures 1 to 5 The circuit board welding structure may include: a welding body, including at least one layer of welding pads 10, the welding pads 10 including at least one plug-in hole 20, and the plug-in hole 20 is used to fill solder; wherein, in the case where the welding body includes one layer of welding pads 10, the welding pads 10 also include at least one first through hole 30, the first through hole 30 is located on the peripheral side of the plug-in hole 20, and the shape of the first through hole 30 is a closed figure; in the case where the welding body includes at least two layers of welding pads 10, the plug-in holes 20 of the welding pads 10 are connected, and the welding pads 10 also include at least one second through hole 40; the first through hole 30 and the second through hole 40 are both used to make the temperature in the plug-in hole 20 within a preset range during the welding process.
[0038] Exemplarily, the material of the pad 10 may be a copper pad 10. The length of the pad 10 may be 20 mm to 80 mm, for example, the length of the pad 10 may be 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm or 80 mm, and the width of the pad 10 may be 20 mm to 80 mm, for example, the width of the pad 10 may be 20 mm, 30 mm, 40 mm, 50 mm, 60 mm, 70 mm or 80 mm, specifically, in the present embodiment, the length of the pad 10 is 50 mm, and the width of the pad 10 is 50 mm.
[0039] Exemplarily, the diameter of the plug-in hole 20 may be 1 mm to 5 mm. For example, the diameter of the plug-in hole 20 may be 1 mm, 2 mm, 3 mm, 4 mm or 5 mm. Specifically, in the present embodiment, the diameter of the plug-in hole 20 is 3 mm.
[0040] For example, see Figure 1 When there are multiple first through holes 30, the multiple first through holes 30 surround the plug-in hole 20 in a circumferential direction, and the shape of the first through hole 30 is a closed figure. Specifically, in this embodiment, the shape of the first through hole 30 is an arc that surrounds the plug-in hole 20 in a circumferential direction. More specifically, the straight side length L2 of the arc can be greater than or equal to 0.2 mm, for example, the straight side length L2 of the arc can be 0.2 mm, 0.3 mm or 0.4 mm. In this embodiment, the straight side length L2 of the arc is 2 mm. The distance between the first through hole 30 and the plug-in hole 20 can be 0.5 mm to 1.5 mm. For example, the distance between the first through hole 30 and the plug-in hole 20 can be 0.5 mm, 1.0 mm or 1.5 mm. Specifically, in this embodiment, the distance between the first through hole 30 and the plug-in hole 20 is 1 mm. The distance L1 between adjacent first through holes 30 can be 0.25mm~1.0mm. For example, the distance L1 between adjacent first through holes 30 can be 0.25mm, 0.5mm, 7.5mm or 10mm. Specifically, in this embodiment, the distance L1 between adjacent first through holes 30 is 0.75mm. The smaller the distance L1 between adjacent first through holes 30, the better the thermal insulation effect.
[0041] It should be noted that in the wave soldering process, the solder filled in the plug-in hole 20 is in liquid state. The liquid solder needs to be in a temperature within a preset range to maintain the liquid state. The liquid solder is conducive to the flow of the solder in the plug-in hole, and is therefore conducive to the filling of the solder in the plug-in hole. When the temperature in the plug-in hole 20 is lower than the preset range, the solder changes from a liquid state to a solid state. When the temperature in the plug-in hole decreases too quickly, the solder does not fill the plug-in hole sufficiently and changes to a solid state. At the same time, the solid solder will block the plug-in hole 20, which is not conducive to the continued filling of the solder in the plug-in hole 20. In the case where the welding body includes a layer of solder pads 10, by providing at least one first through hole 30 on the peripheral side of the plug-in hole 20, the heat conduction area of the solder pad 10 can be reduced, thereby effectively avoiding the problem of fast heat dissipation rate through the solder pad 10 due to excessive thermal conductivity of the solder pad 10 in the plug-in hole 20 during wave soldering, thereby making the temperature in the plug-in hole 20 within a preset range, and the temperature within the preset range is adapted to the solder filling temperature, so that the solder remains in a liquid state at a suitable filling temperature, thereby making the solder in the plug-in hole 20 sufficiently filled, thereby improving the welding quality and reliability of the solder joint.
[0042] Exemplarily, in the case where the soldering body includes at least two layers of solder pads 10 , the plug-in holes 20 of the solder pads 10 are connected, and the solder filled in the plug-in holes 20 penetrates the at least two layers of solder pads 10 .
[0043] For example, during the wave soldering process, the smaller the distance between the second through hole 40 and the plug-in hole 20, the more heat is provided to the plug-in hole 20 through the first through hole 30, and thus the temperature inside the plug-in hole 20 is higher. Therefore, the distance between the second through hole 40 and the plug-in hole 20 can be adjusted according to actual conditions so that the temperature inside the plug-in hole 20 is most suitable for the filling temperature of the solder.
[0044] It should be noted that, due to the increase in the number of layers of the pads 10, during the wave soldering process, there will be problems such as slow heating rate of the pads 10 and low temperature of the inner pads 10 due to uneven heating, which will cause the solder to solidify too quickly when filling the inner pads 10, resulting in insufficient or uneven solder filling in the plug-in holes 20, affecting the quality of the solder joints. By providing a second through hole 40 in the pad 10, a heat conduction space can be formed between different pads 10 through the second through hole 40 during the wave soldering process, so that heat can be conducted to each pad 10 through the second through hole 40, and then heat can be provided to the plug-in holes 20 by heating the pads 10, thereby ensuring that the temperature in the plug-in holes 20 is within the preset temperature, adapted to the temperature of solder filling, so that the solder filling is sufficient.
[0045] The circuit board welding structure provided in the embodiment of the present application includes a welding body, the welding body includes at least one layer of pads 10, the pads 10 include at least one plug-in hole 20, and the plug-in hole 20 is used to fill solder. In the case where the welding body includes a layer of pads 10, by providing at least one first through hole 30 on the peripheral side of the plug-in hole 20, the heat conduction area of the pads 10 can be reduced, thereby effectively avoiding the problem of a fast heat dissipation rate through the pads 10 due to excessive thermal conductivity of the pads 10 in the plug-in hole 20 during the wave soldering process. And when the welding body includes at least two layers of pads 10, by setting at least one second through hole 40 in the pad 10, a heat conduction space can be formed between different pads 10 through the second through hole 40 during the wave soldering process, so that heat can be conducted to each pad 10 through the second through hole 40, and then the plug-in hole 20 can be provided with heat by heating the pad 10. Therefore, the problem that the temperature in the plug-in hole 20 cannot reach the preset range due to the excessive heat conduction area of the pad 10, too fast heat dissipation, increased number of layers, and low heat conduction efficiency can be solved, so that the temperature in the plug-in hole 20 can be ensured to be within the preset temperature, which can be adapted to the temperature of solder filling, so that the solder filling in the plug-in hole 20 is sufficient, the quality and reliability of the solder joint are improved, and the conductive performance of the device is improved.
[0046] In some embodiments, please refer to Figure 1 , the first through hole 30 includes one or more.
[0047] As an example, the first through hole 30 may be one or more, and the number of the first through holes 30 may be set according to the actual temperature in the plug-in hole 20 during the wave soldering process. Under the same wave soldering environment and the same area of the first through holes 30, the more the first through holes 30 are, the slower the rate of heat dissipation in the plug-in hole 20 is, and the more conducive it is to the filling of solder in the plug-in hole 20. It should be noted that the more the first through holes 30 are, the larger the area of the pad 10 is occupied, which will cause a waste of the use area of the pad 10. At the same time, when the number of the first through holes 30 is increased, it is difficult to form them in one go during the drilling and copper plating processes, thereby increasing the difficulty of manufacturing the circuit board. Therefore, the number of the first through holes 30 can be reasonably set according to the requirements of the solder on the filling temperature, so that the difficulty and cost of manufacturing the circuit board can be simplified while the pad and the welding element are firmly welded.
[0048] The circuit board welding structure provided in the embodiment of the present application can control the temperature inside the plug-in hole 20 according to the situation during the actual wave soldering process by setting the number of the first through holes 30 to one or more, so that the temperature inside the plug-in hole 20 meets the filling temperature of the solder.
[0049] In some embodiments, please refer to Figure 1 , a plurality of first through holes 30 are evenly arranged around the plug-in hole 20 .
[0050] It should be noted that, due to the different size settings of the hole diameters of the plug-in holes 20, the plug-in holes 20 with larger sizes will have the problem of temperature differences in different parts inside the plug-in holes 20. The temperature differences in various parts inside the plug-in holes 20 will affect the filled solder. For example, if the temperature of the first part of the plug-in holes 20 is within the preset range, the first part of the plug-in holes 20 can be filled with solder normally. If the temperature of the second part of the plug-in holes 20 is lower than the temperature in the preset range, the solder filled in the second part will quickly transform from liquid to solid, and the solid solder cannot completely fill the plug-in holes 20, thereby causing insufficient or uneven solder filling in the plug-in holes 20.
[0051] As an example, multiple first through holes 30 are evenly arranged around the plug-in hole 20, and the first through holes 30 have the same barrier to heat loss in various parts of the plug-in hole 20, so the temperature of various parts in the plug-in hole 20 can be consistent without temperature difference, thereby making the solder filling in the plug-in hole 20 uniform.
[0052] In the circuit board welding structure provided in this embodiment, by evenly arranging multiple first through holes 30 around the plug-in hole 20, the temperature of each part in the plug-in hole 20 can be made consistent without temperature difference, thereby making the solder filling in the plug-in hole 20 uniform.
[0053] In some embodiments, please refer to Figure 1 , the plurality of first through holes 30 are symmetrically arranged about the geometric center of the plug-in hole 20 .
[0054] As an example, the symmetrical arrangement of the multiple first through holes 30 about the geometric center of the plug-in hole 20 can make the temperatures of various parts in the plug-in hole 20 similar, thereby reducing the temperature difference around the plug-in hole 20 and the solder melting difference around the plug-in hole 20, thereby making the solder filling in the plug-in hole 20 uniform.
[0055] In the circuit board welding structure provided in this embodiment, by arranging the plurality of first through holes 30 symmetrically about the geometric center of the plug-in hole 20, the temperature of each part in the plug-in hole 20 can be made consistent without temperature difference, thereby making the solder filling in the plug-in hole 20 uniform.
[0056] In some embodiments, see Figure 2 and Figure 3 The shape of the second through hole 40 is a closed figure, and at least one second through hole 40 of different pads 10 is connected.
[0057] As an example, the shape of the second through hole 40 is a closed figure, for example, the shape of the second through hole 40 can be a circle, a rectangle or other figures with a side number greater than or equal to three. Specifically, in this embodiment, the shape of the second through hole 40 is a circle, and the aperture of the second through hole 40 can be greater than or equal to 0.7 mm, for example, the aperture of the second through hole 40 can be 0.7 mm, 0.8 mm, 0.9 mm or 1.0 mm. The distance between the second through hole 40 and the plug-in hole 20 can be equal to or greater than 5 mm, for example, the distance between the second through hole 40 and the plug-in hole 20 can be 5 mm, 6 mm, 7 mm, 8 mm or 10 mm. The solder pads 10 with interconnected second through holes 40 may be arranged according to the heating conditions of each layer of solder pads 10 in the implementation situation. In one example, when the number of layers of solder pads 10 is too large, the temperature in the plug-in hole 20 of the inner solder pad 10 is too low due to the excessive number of layers of solder pads 10. In this case, the second through holes 40 of the inner solder pads 10 may be increased. The second through holes 40 form a heat-conducting space between different solder pads 10, so that heat can be conducted to each solder pad 10 through the second through holes 40. Then, heat can be provided to the plug-in hole 20 by heating the solder pad 10, so that the temperature in the plug-in hole 20 of the circuit board with a multi-layer solder pad 10 structure is uniform, thereby improving the welding quality of the solder.
[0058] In the circuit board welding structure provided in the present embodiment, by setting the shape of the second through hole 40 to a closed figure and arranging at least one second through hole 40 of different pads 10 to be connected, it can be ensured that heat is transferred to the plug-in hole 20 through the second through hole 40 during the wave soldering process, thereby solving the problem of slow heating rate of the pad 10 during the wave soldering process, and ensuring that the temperature in the plug-in hole 20 is within the preset temperature, adapted to the temperature of solder filling, so that the solder filling is sufficient.
[0059] In some embodiments, please refer to Figure 4 and Figure 5 The second through hole 40 is connected to the plug-in hole 20, and at least one second through hole 40 of different pads 10 is connected to each other.
[0060] As an example, when the second through hole 40 is connected to the plug-in hole 20, the aperture of the second through hole 40 can be half of the aperture of the plug-in hole 20. For example, when the aperture of the plug-in hole 20 is 3 mm, the aperture of the second through hole 40 is 1.5 mm. Since the second through hole 40 is connected to the plug-in hole 20, more heat is transferred to the plug-in hole 20 through the second through hole 40. Therefore, when the second through hole 40 is connected to the plug-in hole 20, the heat conduction effect is better.
[0061] In the circuit board welding structure provided in this embodiment, by connecting the second through hole 40 with the plug-in hole 20, the problem of slow heating rate of the pad 10 during wave soldering due to the increase in the number of layers of the pad 10 and low temperature of the internal pad 10 due to uneven heating can be solved, and the temperature inside the plug-in hole 20 can be ensured to be within the preset temperature, adapted to the temperature of solder filling, so that the solder filling is sufficient. In addition, the second through hole 40 and the plug-in hole 20 that are connected to each other transfer more heat, and the heat conduction effect is better.
[0062] In some embodiments, see Figure 2 and Figure 3 , the second through hole 40 of at least one pad 10 includes a plurality of holes; and / or, the second through hole 40 of at least one pad 10 includes one hole.
[0063] As an example, see Figure 2 and Figure 3 , at least one of the second through holes 40 of the pad 10 includes a plurality of through holes; and / or, at least one of the second through holes 40 of the pad 10 includes one through hole, which can be set according to the actual situation of filling the solder in the plug-in hole 20. It is not specifically limited here. In a specific embodiment, when the number of pads 10 is 5 layers, the number of second through holes 40 of the first pad, the second pad, and the third pad can be set to 8, the number of second through holes 40 of the fourth pad and the fifth pad can be set to 1, and the second through holes 40 of the first pad, the second pad, the third pad, the fourth pad, and the fifth pad are all connected. In another specific embodiment, as Figure 2 As shown in , when the number of pads 10 is 3 layers, the number of second through holes 40 of the first pad, the second pad and the third pad can be set to 8, and the second through holes 40 of the first pad, the second pad and the third pad are all connected.
[0064] In the circuit board welding structure provided in the present embodiment, the second through hole 40 of at least one soldering pad 10 includes a plurality of holes; and / or the second through hole 40 of at least one soldering pad 10 includes one hole, which can be set according to the actual situation of filling the solder in the plug-in hole 20, so as to achieve the temperature in the plug-in hole 20 that is most suitable for the filling temperature of the solder.
[0065] In some embodiments, please refer to Figure 2 and Figure 3 In the case where the pad 10 includes a plurality of second through holes 40 , the plurality of second through holes 40 are evenly arranged around the plug-in hole 20 .
[0066] As an example, see Figure 2 and Figure 3In the case where the pad 10 includes a plurality of second through holes 40, the plurality of second through holes 40 are evenly arranged around the plug-in hole 20 so that the temperature of each part in the plug-in hole 20 is consistent and maintained within a preset range without temperature differences, thereby making the solder filling in the plug-in hole 20 uniform and improving the reliability of the solder joint.
[0067] In the circuit board welding structure provided in the present embodiment, when the soldering pad 10 includes a plurality of second through holes 40, by evenly arranging the plurality of second through holes 40 around the plug-in hole 20, the temperature of each part in the plug-in hole 20 can be made consistent without temperature difference, thereby making the solder filling in the plug-in hole 20 uniform.
[0068] In some embodiments, when the pad 10 includes one second through hole 40 , the second through hole 40 is in a ring shape.
[0069] As an example, when the pad 10 includes a second through hole 40, the second through hole 40 is in the shape of a ring, and the ring-shaped second through hole 40 circumferentially surrounds the plug-in hole 20, so that the temperature in the plug-in hole 20 is within a preset range. In another example, when the number of pads 10 is multiple layers, the number of second through holes 40 in each layer of pads 10 can be set according to actual conditions, and heat is evenly transferred to the plug-in hole 20, so that there is no temperature difference between various parts of the plug-in hole 20.
[0070] In the circuit board welding structure provided in the present embodiment, when the soldering pad 10 includes a second through hole 40, the shape of the second through hole 40 is set to be ring-shaped, so that the temperature of each part in the plug-in hole 20 can be consistent without temperature difference, thereby making the solder in the plug-in hole 20 evenly filled, thereby improving the reliability of the solder joint.
[0071] In some embodiments, see Figure 4 and Figure 5 The aperture of the second through hole 40 is smaller than the aperture of the plug-in hole 20 .
[0072] As an example, the diameter of the second through hole 40 is smaller than the diameter of the plug-in hole 20 to ensure that the liquid solder in the plug-in hole 20 is not easy to flow into the second through hole 40, so that the electronic components soldered in the plug-in hole 20 are more firmly soldered in the plug-in hole 20, thereby improving the mechanical strength of the solidified solder.
[0073] In the circuit board welding structure provided in this embodiment, by setting the aperture of the second through hole 40 to be smaller than the aperture of the plug-in hole 20, it can be ensured that the liquid solder in the plug-in hole 20 is not easy to flow into the second through hole 40, so that the electronic components welded in the plug-in hole 20 are more firmly welded in the plug-in hole 20, thereby improving the mechanical strength of the solidified solder.
[0074] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features of the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0075] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. A circuit board welding structure, characterized in that: include: A welding body, comprising at least one layer of solder pads, wherein the solder pads comprise at least one plug-in hole, and the plug-in hole is used to fill solder; Wherein, in the case where the welding body includes a layer of pads, the pads further include at least one first through hole, the first through hole is located on the peripheral side of the plug-in hole, and the shape of the first through hole is a closed figure; In the case where the welding body includes at least two layers of pads, the plug-in holes of the pads are connected, and the pads further include at least one second through hole; The first through hole and the second through hole are both used to make the temperature in the plug-in hole fall within a preset range during the welding process.
2. The circuit board welding structure according to claim 1, characterized in that: The first through hole includes one or more.
3. The circuit board welding structure according to claim 2, characterized in that: A plurality of the first through holes are evenly arranged around the plug-in hole.
4. The circuit board welding structure according to claim 2, characterized in that: The plurality of first through holes are symmetrically arranged about the geometric center of the plug-in hole.
5. The circuit board welding structure according to claim 1, characterized in that: The second through hole is in a closed shape, and at least one of the second through holes of different pads is connected.
6. The circuit board welding structure according to claim 1, characterized in that: The second through hole is communicated with the plug-in hole, and at least one of the second through holes of different pads is communicated with each other.
7. The circuit board welding structure according to claim 1, characterized in that: At least one of the second through holes of the pad comprises a plurality of holes; and / or, At least one of the pads comprises a second through hole.
8. The circuit board welding structure according to claim 7, characterized in that: In the case where the pad includes a plurality of the second through holes, the plurality of the second through holes are evenly arranged around the plug-in hole.
9. The circuit board welding structure according to claim 7, characterized in that: In the case where the pad includes one second through hole, the second through hole is in a ring shape.
10. The circuit board welding structure according to claim 6, characterized in that: The aperture of the second through hole is smaller than the aperture of the plug-in hole.