Divided mechanical drilling method and substrate
By dividing the substrate surface into multiple processing areas and drilling in step by step of positioning holes and through holes in these areas, the accuracy reduction and deviation problems caused by heat accumulation in drilling operations are solved, and a higher degree of substrate yield.
Patent Information
- Application Number
- CN202411291600.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-02-14
AI Technical Summary
During the drilling process, long-term drilling leads to heat accumulation and temperature increase, which leads to a decrease in drilling accuracy and an increase in hole position deviation, which easily leads to substrate scrapping.
By using the split mechanical drilling method, the substrate surface is divided into multiple identical processing areas, and a cycle is formed through the first drilling operation and the second drilling operation. First, drill the set hole in the processing area, and then drill the conduction holes, shorten the drilling interval between positioning holes and through holes, and reduce the influence of temperature rise.
It effectively alleviates drilling deviation, improves drilling accuracy, reduces the possibility of substrate scrapping, and thus improves the yield rate of substrate.
Smart Images
Figure CN119450927A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of circuit board processing, and in particular to a segmentation mechanical drilling method and a substrate. Background Art
[0002] During the drilling operation, FC-BGA (Flip Chip Ball Grid Array) substrates generally use the whole board drilling method. In order to meet the electrical design requirements of the substrate, the substrate needs to be drilled with a large number of holes. The problem is that the large number of holes requires a long drilling time. During the drilling process, heat will gradually accumulate and cause the temperature to rise, which will cause the expansion of components such as the drill bit and the positioning ruler. In turn, the drilling accuracy will gradually decrease as the drilling operation proceeds. There is a large deviation between the hole positions obtained over a long period of time, which can easily lead to the scrapping of the substrate. Summary of the invention
[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a separation mechanical drilling method, which can alleviate drilling deviation and is beneficial to improving the yield rate of the substrate.
[0004] The segmentation mechanical drilling method according to the embodiment of the present application includes three steps: partitioning, a first drilling operation, and a second drilling operation; Partitioning: Divide the substrate surface into multiple identical processing areas; The first drilling operation: drilling positioning holes in a part of the processing area; The second drilling operation: drilling a via hole in the processing area where the positioning hole is drilled; Among them, the first drilling operation step and the second drilling operation step constitute the first drilling cycle, and the first drilling cycle is executed after the partitioning step. The split mechanical drilling method executes the first drilling cycle at least twice until the positioning holes and the via holes in each processing area are drilled.
[0005] The split mechanical drilling method according to the embodiment of the present application has at least the following beneficial effects: by dividing the surface of the substrate into partitions, the first drilling operation and the second drilling operation constitute a first drilling cycle. The present application drills positioning holes and via holes in each processing area by executing at least two first drilling cycles. Compared with the drilling scheme of drilling positioning holes in each processing area in turn and then drilling via holes in each processing area in turn, the split mechanical drilling method in the present application can effectively shorten the drilling interval between positioning holes and via holes, reduce the temperature rise caused by the long drilling operation, and is beneficial to alleviate the drilling deviation generated during the drilling operation and improve the accuracy of the drilling operation.
[0006] According to some embodiments of the present application, the first drilling cycle is executed a number of times equal to the number of processing areas.
[0007] According to some embodiments of the present application, the processing areas are arranged adjacent to each other in sequence, and holes are drilled in the adjacent processing areas in sequence through a first drilling cycle.
[0008] According to some embodiments of the present application, in the second drilling operation step, via holes are drilled simultaneously in a plurality of processing areas in which positioning holes are drilled.
[0009] According to another embodiment of the present application, the segmentation mechanical drilling method includes four steps: partitioning, third drilling operation, positioning and collection, and fourth drilling operation; Partitioning: Divide the substrate surface into multiple identical processing areas; The third drilling operation: drilling positioning holes in each processing area in turn; Positioning acquisition: grab the coordinates of the positioning holes in the processing area; The fourth drilling operation: based on the coordinates, drill a via hole in the processing area where the coordinates are located.
[0010] The segmented mechanical drilling method according to the embodiment of the present application has at least the following beneficial effects: by dividing the surface of the substrate into partitions, the third drilling operation step is used to drill positioning holes in each processing area in turn, and the positioning acquisition step is used to capture the coordinates of the positioning holes in the processing area, which is used to correct the position of the positioning holes before executing the fourth drilling operation, so as to reduce the influence of temperature rise on the accuracy of the drill bit, optical ruler and screw, which is beneficial to improving the accuracy of the drilling operation.
[0011] According to some embodiments of the present application, the coordinates of a positioning hole in a portion of the processing area are captured in the positioning and acquisition step, and the positioning and acquisition step and the fourth drilling operation step constitute a second drilling cycle. The second drilling cycle is executed after the third drilling operation step, and the split mechanical drilling method executes the second drilling cycle at least twice until the drilling of the conductive holes in each processing area is completed.
[0012] According to some embodiments of the present application, the second drilling cycle is executed a number of times equal to the number of processing areas.
[0013] According to some embodiments of the present application, a target grabbing step is further included after the partitioning step, and the target grabbing step is performed before the fourth drilling operation step. In the target grabbing step, a target in a processing area where a positioning hole is drilled is grabbed.
[0014] According to some embodiments of the present application, the target grabbing step is located after the third drilling operation step and before the fourth drilling operation step, and the number of executions of the target grabbing step is equal to the number of processing areas.
[0015] The substrate according to the embodiment of the present application is manufactured by the segmentation mechanical drilling method in any of the above embodiments.
[0016] The substrate according to the embodiment of the present application has at least the following beneficial effects: the substrate is manufactured by a split mechanical drilling method, which can effectively alleviate drilling deviation and avoid scrapping of the substrate after drilling, thereby improving the yield rate of the substrate.
[0017] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] The present application is further described below with reference to the accompanying drawings and embodiments, wherein: Figure 1 This is a schematic diagram of the substrate structure after a first drilling cycle is performed in an embodiment of the present application; Figure 2 This is a schematic diagram of the substrate structure after executing two first drilling cycles in an embodiment of the present application; Figure 3 This is a schematic diagram of the substrate structure after executing three first drilling cycles in an embodiment of the present application; Figure 4 This is a schematic diagram of the substrate structure after the drilling operation is completed in the embodiment of the present application; Figure 5 This is a schematic diagram of the substrate structure after the partitioning step in the embodiment of the present application; Figure 6 This is a schematic diagram of the structure of the substrate of an embodiment of the present application; Figure 7 This is a schematic diagram of the structure of the substrate after the third drilling operation step of the embodiment of the present application; Figure 8 This is a schematic diagram of the substrate structure after executing a second drilling cycle in an embodiment of the present application; Fig. 9 A schematic diagram of the substrate structure after executing two second drilling cycles in an embodiment of the present application; Fig.10 This is a schematic diagram of the substrate structure after executing three second drilling cycles in an embodiment of the present application.
[0019] Reference numerals: substrate 100 , processing area 110 , positioning holes 111 , and conductive hole distribution area 112 . DETAILED DESCRIPTION
[0020] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0021] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0022] In the description of this application, "several" means more than one, "more" means two or more, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.
[0023] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.
[0024] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0025] The following is an introduction to the embodiments of the present application in conjunction with the accompanying drawings: refer to Figures 1 to 6According to an embodiment of the present application, a segmentation mechanical drilling method includes three steps: partitioning, a first drilling operation and a second drilling operation. The partitioning step is used to divide a plurality of identical processing areas 110 on the surface of a substrate 100. The first drilling operation step is used to drill positioning holes 111 in a part of the processing area 110. The second drilling operation step is used to drill a via hole in the processing area 110 drilled with the positioning hole 111. The first drilling operation step and the second drilling operation step constitute a first drilling cycle. The first drilling cycle is executed after the partitioning step, and the first drilling cycle can be executed multiple times during the substrate drilling process. The segmentation mechanical drilling method of the present application executes the first drilling cycle at least twice until the drilling of the positioning holes 111 and the via holes in each processing area 110 is completed. Compared to first drilling the positioning holes 111 in each processing area 110 in sequence, and then drilling the via holes in each processing area 110 in sequence, the drilling method of the present application shortens the time interval between drilling the positioning holes 111 and the via holes in any processing area 110, thereby reducing the temperature difference when drilling the positioning holes 111 and the via holes. Therefore, when drilling in any processing area 110, the drill bit, optical ruler, etc. are less affected by temperature changes, which is beneficial to improving the accuracy of drilling. In addition, compared with drilling holes by moving the entire substrate 100 surface, drilling in different areas is beneficial to reducing the positioning error caused by the optical ruler or screw when moving over a long distance.
[0026] Specifically, the partitioning step divides the surface of the substrate 100 into four identical processing areas 110. The size of each processing area 110 can be a rectangular area of 240 mm×241 mm. The partition drilling shortens the moving path of the mechanical drill for the drilling part, which is beneficial to reduce error accumulation and facilitates more uniform and stable drilling operations. The first drilling operation step is used to drill positioning holes 111 in a part of the processing area 110. For example, the first drilling operation step is used to drill positioning holes 111 in one, two or three of the four processing areas 110. There can be four distribution areas of the positioning holes 111. The distribution areas of the positioning holes 111 are located at the edges of the processing area 110, corresponding to the positions of the four corners of the processing area 110. After the positioning hole 111 in the processing area 110 selected in the first drilling operation step is drilled, the second drilling operation step is performed to drill a via hole in the processing area 110 with the positioning hole 111 (and the processing area 110 without the via hole). The via hole is located in the via hole distribution area 112, which is beneficial to shorten the drilling interval between the positioning hole 111 and the via hole, avoid the drilling interval between the positioning hole 111 and the via hole in the processing area 110 being too long and being affected by the expansion of the drill bit due to the temperature rise, and avoid the accumulation of positioning errors caused by the temperature rise of the optical ruler and the screw, which is beneficial to improve the drilling accuracy. When the second drilling operation step is completed, the execution of the first drilling cycle is completed in sequence. The split mechanical drilling method of the present application can achieve continuous drilling operations in four processing areas 110 by executing at least two first drilling cycles.
[0027] It should be noted that there are intervals between the processing areas 110, the substrate 100 includes the processing area 110 and the part outside the processing area 110, and the processing areas 110 are physically connected through the part outside the processing area 110. Fixing the edge of the substrate 100 can simultaneously fix the processing areas 110, which facilitates the drilling operation and is beneficial to ensuring the stability of the drilling.
[0028] In addition, the sameness of each processing area 110 can be understood as different processing areas 110 having the same shape and size. The segmented mechanical drilling method of the present application divides the surface of the substrate 100 into multiple processing areas 110, and drills positioning holes 111 and conductive holes in each processing area 110 in turn, thereby reducing the impact of temperature rise on the mechanical drill rig. On the basis of the unchanged performance of the mechanical drill rig, the accuracy of the drilling operation is improved, and thus, some mechanical drill rigs with relatively backward performance can also meet the drilling operation requirements of the substrate 100, thereby extending the service life of the mechanical drill rig.
[0029] refer to Figures 1 to 6In other embodiments, the partitioning step divides the surface of the substrate 100 into a plurality of identical processing areas 110, and the number of the processing areas 110 may be four. In the first drilling operation step, the positioning holes 111 can be drilled in two or three processing areas 110 at the same time, which is beneficial to improving the drilling efficiency. After the positioning holes 111 are drilled, the second drilling operation step is used to drill the via holes in the two or three processing areas 110 where the positioning holes 111 are drilled at the same time, that is, the continuous drilling of the positioning holes 111 and the via holes in the processing areas 110 is realized, the drilling efficiency is improved, and the drilling deviation caused by the long time interval between the drilling of the positioning holes 111 and the via holes, which causes the drill bit to be greatly affected by the temperature rise, can be further reduced.
[0030] refer to Figures 1 to 6 In other embodiments, the partitioning step divides the surface of the substrate 100 into a plurality of identical processing areas 110, and the first drilling operation step sequentially drills positioning holes 111 in a portion of the processing areas 110. For example, four identical processing areas 110 are divided on the surface of the substrate 100 by the partitioning step, and then the first drilling operation step sequentially drills positioning holes 111 in two or three processing areas 110, that is, one of the processing areas 110 is drilled each time, and the first drilling operation step drills positioning holes 111 in two or three processing areas 110 in total. It should be noted that the more processing areas 110 there are in which positioning holes 111 are drilled in the first drilling operation step, the slower the first drilling operation step is. Therefore, selecting a portion of the processing areas 110 to drill positioning holes 111 can shorten the time from the first drilling operation step to the second drilling operation step, thereby shortening the drilling interval between the positioning holes 111 and the via holes, which is beneficial to reducing the impact of temperature rise on drilling and improving the accuracy of drilling. After the first drilling operation step is completed, the second drilling operation step is used to drill conductive holes in two or three processing areas 110 with positioning holes 111. When drilling the conductive holes, the conductive holes can be drilled in multiple processing areas 110 with positioning holes 111 at the same time, or the conductive holes can be drilled in each processing area 110 with positioning holes 111 in turn (that is, the conductive holes are drilled in one of the processing areas 110 each time). In addition, the processing areas 110 can be arranged adjacent to each other, which is beneficial to shorten the drill bit movement path and reduce the impact of temperature rise.
[0031] refer to Figures 1 to 6In some embodiments, the number of executions of the first drilling cycle is equal to the number of processing areas 110, that is, each cycle realizes the drilling of the positioning holes 111 and the via holes in one of the processing areas 110 until the drilling operation of each processing area 110 is completed. Therefore, the drilling of the positioning holes 111 and the via holes in a single processing area 110 is continuous, avoiding the interference of drilling in other processing areas 110. Furthermore, when drilling in a single processing area 110, the accuracy of the positioning holes 111 and the via holes is less affected by the temperature rise, which can effectively solve the problem of drilling center deviation.
[0032] Specifically, the partitioning step divides the substrate 100 into four identical processing areas 110, and the four processing areas 110 can be divided into a first area, a second area, a third area and a fourth area. The four processing areas 110 are arranged in two rows and two columns, and the row spacing is equal to the column spacing. The first area, the second area, the third area and the fourth area all include a via hole distribution area 112, and via holes are drilled in the via hole distribution area 112. The mechanical drill can perform drilling operations on the first area, the second area, the third area and the fourth area in a clockwise direction.
[0033] It should be noted that the segmented mechanical drilling method in the present application can at least achieve that the relative positions of the positioning holes 111 and the via holes in any processing area 110 meet the requirements.
[0034] refer to Figures 5 to 10 According to another embodiment of the present application, a segmented mechanical drilling method includes four steps: partitioning, a third drilling operation, positioning acquisition, and a fourth drilling operation. The partitioning step is used to divide a plurality of identical processing areas 110 on the surface of a substrate 100. After the partitioning is completed, positioning holes 111 are drilled in each processing area 110 in turn through the third drilling operation step. After the positioning holes 111 in each processing area 110 are drilled, the coordinates of the positioning holes 111 in the processing area 110 are captured through the positioning acquisition step. The coordinates are used for position correction before drilling the via hole to ensure the accuracy of the relative position between the positioning hole 111 and the via hole, and reduce the influence of temperature rise on the accuracy of drilling the via hole. After the coordinates of the positioning hole 111 are located and collected, the fourth drilling operation step is executed. The coordinates of the positioning hole 111 captured in the positioning and collecting step are used as a reference to drill a via hole in the processing area 110 of the captured coordinates. Compared with drilling the via hole according to the preset coordinates when drilling the positioning hole 111, the coordinates of the positioning hole 111 after being captured are used as a reference as the reference for drilling the via hole. This ensures that the positioning hole 111 and the via hole in each processing area 110 are under the same reference for drilling operations, effectively avoiding the problem of drilling offset and reducing the scrapping of the offset hole.
[0035] It should be noted that, in the positioning acquisition step, the coordinates of the positioning hole 111 drilled in the third drilling operation step are captured by a CCD (Charge-coupled Device). In addition, the third drilling operation step and the fourth drilling operation step in this embodiment have no execution order relationship with the first drilling operation step and the second drilling operation step in any of the above embodiments, and the first, second, third, and fourth are only used to distinguish different steps.
[0036] refer to Figures 5 to 10 In some embodiments, the positioning holes 111 in a part of the processing area 110 are captured in the positioning acquisition step. For example, the segmentation mechanical drilling method of the present application divides four identical processing areas 110 on the surface of the substrate 100 through the partitioning step. The positioning acquisition step can capture the coordinates of the positioning holes 111 in one, two or three processing areas 110. The above-mentioned capture process can capture the coordinates of the positioning holes 111 in one of the processing areas 110 each time, or can capture the coordinates of the positioning holes 111 in multiple processing areas 110 at the same time. After the coordinates of the positioning holes 111 are captured, the fourth drilling operation step is executed. Based on the coordinates of the captured positioning holes 111, the conductive holes are drilled in the processing area 110 corresponding to the position, which is beneficial to reduce the hole deviation caused by the temperature rise. After the fourth drilling operation step is executed, the third drilling operation step, the positioning acquisition step and the fourth drilling operation step can be executed again in a loop until the drilling operations of the positioning holes 111 and the conductive holes in each processing area 110 are completed.
[0037] refer to Figures 5 to 10 In other embodiments, the positioning and collecting step and the second drilling operation step constitute a second drilling cycle, the second drilling cycle is executed after the third drilling operation step, and the split mechanical drilling method executes at least two second drilling cycles until the via holes in each processing area 110 are drilled. It should be noted that the maximum number of the second drilling cycles is the number of processing areas 110, that is, each execution of the second drilling cycle realizes the drilling of the via hole in at least one of the processing areas 110.
[0038] refer to Figures 5 to 10 In some embodiments, the number of executions of the second drilling cycle is equal to the number of processing areas 110, that is, each execution of the second drilling cycle drills a via hole in one of the processing areas 110. Therefore, before drilling a via hole in each processing area 110, the coordinate position of the positioning hole 111 is collected through the positioning collection step, and then the via hole is drilled, so as to avoid the drilling deviation caused by the long interval between the drilling of the positioning hole 111 and the drilling of the via hole and the influence of temperature, and ensure that the drilling of the positioning hole 111 and the via hole is based on a closer reference, which is beneficial to ensure the yield rate of the substrate 100.
[0039] It should be noted that drilling the via holes takes a long time. Dividing the substrate 100 into multiple processing areas 110 for drilling can make the drilling references between the positioning holes 111 and the via holes tend to be consistent. Multiple processing areas 110 are the same, which ensures the consistency of the drilling operation of the substrate 100 and avoids frequent adjustments to drilling-related structures such as mechanical drills.
[0040] refer to Figures 5 to 10 In some embodiments, the segmented mechanical drilling method of the present application further includes a target grabbing step, which is performed after the partitioning step and before the fourth drilling operation step. The target grabbing step is used to grab the target in the processing area 110 drilled with the positioning hole 111, so as to provide a positioning reference for the drilling of the via hole in the fourth drilling operation step. Therefore, the segmented mechanical drilling method of the present application realizes positioning based on the coordinates of the positioning hole 111 and the target position, which is beneficial to further improve the drilling accuracy.
[0041] Specifically, the target grabbing step can be performed before the third drilling operation step or after the third drilling operation. Through the target grabbing step and the positioning acquisition step, more accurate drilling positioning can be performed. In addition, in the target grabbing step, targets in multiple processing areas 110 can be grabbed at the same time, or targets in a part of the processing area 110 can be grabbed. For example, the partitioning step divides four identical processing areas 110, and the target grabbing step can grab targets in the four processing areas 110 at the same time, which is beneficial to improving the grabbing efficiency. Targets can also be grabbed in two or three processing areas 110 at the same time, which is convenient for adjustment according to the needs of the drilling operation, thereby improving the applicability of the segmented mechanical drilling method of this application.
[0042] It should be noted that the target may be located in the via distribution area 112 .
[0043] refer to Figures 5 to 10 In some embodiments, the target grabbing step is used to grab the target in the processing area 110. The target grabbing step is located after the third drilling operation step and before the fourth drilling operation step, that is, the target grabbing action is performed after drilling the positioning hole 111 and before drilling the via hole. The position of the target and the coordinates of the positioning hole 111 together provide a drilling reference for drilling the via hole. The target grabbing step is performed after the third drilling operation step to prevent the third drilling operation step from affecting the position accuracy of the target.
[0044] refer to Figures 5 to 10In some other embodiments, the target grabbing step is executed once for each processing area 110, that is, the target grabbing step is executed once for each processing area 110, and the processing area 110 can be divided into a first area, a second area, a third area and a fourth area. The positioning holes 111 are drilled in the first area, the second area, the third area and the fourth area in sequence through the third drilling operation step, and then the second drilling cycle is executed four times to sequentially grab the target in the first area, drill the conductive hole in the first area, grab the target in the second area, drill the conductive hole in the second area, grab the target in the third area, drill the conductive hole in the third area, grab the target in the fourth area, and drill the conductive hole in the first area.
[0045] In addition, the target grabbing step, the positioning acquisition step and the fourth drilling operation step constitute the third drilling cycle, or the positioning acquisition step, the target grabbing step and the fourth drilling operation step constitute the fourth drilling cycle. The segmented mechanical drilling direction of the present application can drill a through hole by executing multiple third drilling cycles or fourth drilling cycles. Through the two steps of target grabbing and positioning acquisition, the drilling accuracy can be further improved on the basis of the unchanged performance of the mechanical drilling rig, the accuracy of the mechanical drilling rig can be compensated, and it is beneficial to extend the service life of the mechanical drilling rig.
[0046] It should be noted that the positioning acquisition step and the target grabbing step can respectively obtain the coordinates of the positioning hole 111 and the target position. The relative position relationship between the coordinates of the positioning hole 111 and the target is certain. Therefore, the accuracy of the mechanical drill can also be corrected through the positioning acquisition step and the target grabbing step, which is beneficial to increase the drilling accuracy of the via hole.
[0047] refer to Figures 1 to 10 According to the substrate 100 of the embodiment of the present application, the substrate 100 is manufactured by the segmentation mechanical drilling method in any of the above embodiments, wherein the total size of the substrate 100 can be 510mm×515mm, and four identical processing areas 110 are divided on the surface of the substrate 100 by the segmentation mechanical drilling method in any of the above embodiments. The size of the processing area 110 can be 240mm×241mm, and there is a gap between each processing area 110 to reduce mutual interference between drilling holes in different processing areas 110, and each processing area 110 has a certain gap with the edge of the substrate 100 to avoid the poor structural stability of the edge of the substrate 100 affecting the drilling accuracy.
[0048] It should be noted that the size of the substrate 100 is not limited to the above-mentioned size, and the staff can perform drilling operations on substrates 100 of different sizes as needed. Similarly, the size and number of the processing areas 110 can also be adjusted according to actual production needs. A plurality of identical processing areas 110 are divided on the surface of the substrate 100 for drilling operations, so that each processing area 110 can perform drilling operations independently, and each processing area 110 can independently calibrate the reference, which is beneficial to avoid excessive error accumulation due to the large size of the substrate 100, and is beneficial to improving the alignment accuracy of different process sites, wherein the manufacturing sites may include sites such as circuit exposure, laser drilling and solder mask exposure.
[0049] in addition, Figures 1 to 10 The middle processing area 11 and the via hole distribution area 112 are only examples, and the specific distribution method can be adjusted according to different drilling methods. Figures 1 to 3 The schematic diagram of the structure of the substrate 100 after the first drilling cycle is only a schematic diagram of the structure of the first drilling cycle for a single processing area 110. The present application also includes other structures of the substrate 100 after the first drilling cycle is executed. Figures 1 to 3 The drilling method in this application is not limited. Figures 8 to 10 The figure only shows one case of executing the second drilling cycle, and should not limit the drilling method in the present application. It can be understood from the above that executing the first drilling cycle or the second drilling cycle once may have multiple cases, and the same applies to executing multiple times.
[0050] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.
Claims
1. A segmentation mechanical drilling method, characterized in that: The following steps are involved: Partitioning: Divide the substrate surface into multiple identical processing areas; First drilling operation: drilling a positioning hole in a portion of the processing area; Second drilling operation: drilling a via hole in the processing area where the positioning hole is drilled; Among them, the first drilling operation step and the second drilling operation step constitute a first drilling cycle, the first drilling cycle is executed after the partitioning step, and the split mechanical drilling method executes the first drilling cycle at least twice until the drilling of the positioning holes and the conductive holes in each of the processing areas is completed.
2. The segmentation mechanical drilling method according to claim 1, characterized in that: The first drilling cycle is executed a number of times equal to the number of the processing areas.
3. The segmentation mechanical drilling method according to claim 2, characterized in that: The processing areas are arranged adjacent to each other in sequence, and holes are drilled in the adjacent processing areas in sequence through the first drilling cycle.
4. The segmentation mechanical drilling method according to claim 1, characterized in that: In the second drilling operation step, the via holes are drilled simultaneously in the processing areas where the positioning holes are drilled.
5. A segmentation mechanical drilling method, characterized in that: The following steps are involved: Partitioning: Divide the substrate surface into multiple identical processing areas; The third drilling operation: drilling positioning holes in each of the processing areas in sequence; Positioning acquisition: capturing the coordinates of the positioning holes in the processing area; The fourth drilling operation: taking the coordinates as a reference, drilling a via hole in the processing area where the coordinates are located.
6. The segmentation mechanical drilling method according to claim 5, characterized in that: In the positioning acquisition step, the coordinates of a portion of the positioning holes in the processing area are captured. The positioning acquisition step and the fourth drilling operation step constitute a second drilling cycle. The second drilling cycle is executed after the third drilling operation step. The split mechanical drilling method executes the second drilling cycle at least twice until the drilling of the conductive holes in each of the processing areas is completed.
7. The segmentation mechanical drilling method according to claim 6, characterized in that: The second drilling cycle is executed a number of times equal to the number of the processing areas.
8. The segmentation mechanical drilling method according to claim 5, characterized in that: A target grabbing step is also included after the partitioning step, and the target grabbing step is performed before the fourth drilling operation step. In the target grabbing step, the target in the processing area where the positioning hole is drilled is grabbed.
9. The segmentation mechanical drilling method according to claim 8, characterized in that: The target grabbing step is located after the third drilling operation step and before the fourth drilling operation step, and the number of executions of the target grabbing step is equal to the number of the processing areas.
10. A substrate, characterized in that: The substrate is produced by the segmentation mechanical drilling method according to any one of claims 1 to 9.