Manufacturing process for assisting mounting of SMD lamp beads

Abstract

The invention discloses a manufacturing process for assisting installation of surface-mounted lamp beads, and relates to the technical field of XX, and the manufacturing process comprises the following steps: carrying out the pretreatment of a PCB, and guaranteeing the cleanliness of the surface of the PCB to meet the subsequent welding requirements; fixing the steel mesh above the PCB, uniformly scraping the solder paste through the steel mesh by using a scraper, and printing the solder paste on a bonding pad of the PCB through meshes of the steel mesh; the method has the advantages that an efficient quality management and control system is constructed by means of an optical three-dimensional measurement technology and a data analysis algorithm, the welding quality trend can be deeply analyzed based on the rich data, potential problems can be pre-judged in advance, the reject ratio of pseudo soldering, continuous tin soldering and the like can be effectively reduced by about 30%, and once a product has quality flaws, the quality of the product can be effectively improved. By means of data backstepping, specific error steps such as bubble residues and steel mesh blockage deformation in a solder paste printing link or temperature curve abnormity in a reflow soldering link can be accurately backtracked in a short time, and the process adjustment is rapid and accurate.

Description

Technical Field

[0001] The invention relates to the technical field of SMD lamp beads, and in particular to a manufacturing process for assisting the installation of SMD lamp beads. Background Art

[0002] In today's era of rapid development of lighting and display technology, the application field of SMD lamp beads has shown a very wide trend, widely involving many important fields such as indoor and outdoor lighting fixtures, diversified electronic display screens and automotive lighting. Its own significant advantages such as miniaturization, high light efficiency and low power consumption have injected strong impetus into the development process of related products in terms of thinness, energy saving and high performance. However, with the increasingly fierce competition in the industry and the continuous advancement of the wave of technological innovation, the installation of SMD lamp beads faces a series of new and severe challenges. The market's demand for product refinement is increasing day by day. In the field of high-end lighting, it is even more required that the precision error of SMD lamp bead welding must be controlled within a very small range to ensure the high consistency of the light angle and the uniformity of the light intensity distribution. In the large-scale and mass production process, once quality problems occur, the entire batch of products will often fall into quality difficulties. If they are not corrected in time, it will cause product backlogs, which will lead to more serious losses. In addition, for those PCB boards with quality problems, due to the lack of corresponding identification records in the subsequent rework process, the rework work has to be checked one by one, which undoubtedly greatly consumes time and energy and seriously affects production efficiency and cost control. For this reason, we propose a manufacturing process for auxiliary SMD lamp bead installation. Summary of the invention

[0003] The purpose of the present invention is to provide a manufacturing process for assisting the installation of SMD lamp beads.

[0004] In order to solve the problems raised in the above background technology, the present invention provides the following technical solutions: a manufacturing process for auxiliary SMD lamp bead installation, comprising the following steps: Step 1: Pre-treat the PCB board to ensure that the cleanliness of the PLC board surface meets the subsequent welding requirements; Step 2: Fix the steel mesh above the PCB board, use a scraper to evenly scrape the solder paste through the steel mesh, and print the solder paste through the mesh holes of the steel mesh onto the pads of the PCB board; Step 3: Check the solder paste printing quality through AOI equipment, and make corresponding adjustments or rework according to the inspection results; Step 4: Place the SMD lamp beads in the material tray of the SMD machine according to the correct polarity and position; Step 5: Send the PCB with SMD lamp beads into the reflow oven, and then put the soldered PCB into the reflow zone for cooling; Step 6: Take out the PLC board after cooling and test the electrical properties of the lamp beads; Step 7: In the above steps, optical 3D measurement technology is introduced to accurately measure the shape and height of solder joints to achieve a more comprehensive and accurate assessment of solder joint quality. For each inspection operation, detailed records and storage of data information including solder joint images, electrical performance indicators, defect categories, etc. are recorded and stored; Step 8. Use data analysis algorithms to determine the trend of welding quality and make quality predictions in the production process. At the same time, these data can be effectively applied to the product quality traceability system to help accurately locate the root causes of quality problems and provide strong support for timely optimization and improvement of production processes.

[0005] As a further solution of the present invention: in the step 2, before the solder paste is used, tiny bubbles in the solder paste need to be removed by a vacuum degassing machine, and the steel mesh needs to be cleaned by a steel mesh cleaning device after each solder paste printing. At the same time, the steel mesh with insufficient tension or blocked or deformed openings needs to be replaced in time to ensure the uniformity of solder paste scraping.

[0006] As a further solution of the present invention: in step three, the AOI equipment uses a high-resolution camera to comprehensively scan the PCB board to accurately detect the shape, size, position, and presence of bridging and insufficient tin defects of the solder paste.

[0007] As a further solution of the present invention: in the step four, it is necessary to use various types of special suction nozzles according to the different sizes and shapes of the SMD lamp beads, and classify and organize the SMD lamp beads according to their models and specifications to ensure the compatibility and stability of the material tray and avoid damage to the lamp beads or misalignment of their positions during transportation and loading.

[0008] As a further solution of the present invention: in step five, the PCB mounted with the SMD lamp beads is sent to a reflow oven, and then the soldered PCB board is placed in a reflow zone for cooling so that the solder joints are quickly cooled and solidified to form a reliable soldering connection.

[0009] As a further solution of the present invention: In step six, a multimeter is used to comprehensively detect the key electrical parameters of the lamp beads, such as conductivity, luminous characteristics, forward voltage, reverse current, etc., and the lamp beads that do not meet the standards are marked and recorded for subsequent repair or replacement to ensure that the SMD lamp beads on the entire PCB board can work normally and meet the electrical performance requirements of the product.

[0010] As a further solution of the present invention: a database needs to be established in step seven. When the optical three-dimensional measuring device completes the measurement of the solder joint, an image file format containing the solder joint image in high resolution is automatically generated, and a unique serial number is assigned to each PCB board. The identification code is associated with the corresponding inspection data and stored in the database for subsequent query and tracing.

[0011] As a further solution of the present invention: Step eight carries out comparative analysis based on the information in the database and the pre-set standard value. Once the target value is significantly greater than or significantly less than the standard value, the data reverse deduction mechanism can be used to accurately trace the specific production step where the error occurred, thereby enabling faster and more effective adjustment measures to be implemented.

[0012] By adopting the above technical solution, compared with the prior art, the beneficial effects of the present invention are: 1. The present invention builds an efficient quality control system by using optical three-dimensional measurement technology and data analysis algorithms. Based on these rich data, it can deeply analyze the trend of welding quality, predict potential problems in advance, and effectively reduce the defective rates of cold soldering and bridging by about 30%. Once a product has quality defects, it can be accurately traced back to the bubble residue in the solder paste printing process, the blockage and deformation of the steel mesh, or the position deviation of the lamp beads in the patch process, or the abnormal temperature curve and solder joint offset in the reflow soldering process in a short time by using data reverse induction, so as to promote rapid and accurate process adjustment, thereby increasing the product's one-time pass rate by about 25%, significantly reducing rework costs and waste losses, and greatly improving production efficiency; 2. The present invention adopts special nozzles for different patch lamp beads and classifies and organizes the material trays, which effectively prevents the lamp beads from being damaged and dislocated, and controls the patch accuracy within ±0.05mm. In addition, the database is established to realize the whole process traceability and big data management of quality, providing a detailed basis for the continuous optimization of the process. The long-term accumulated data can help optimize the process parameters; BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Schematic diagram of the process flow in an embodiment of the present invention. DETAILED DESCRIPTION

[0014] The specific embodiments of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0015] Example 1, please refer to the attached Figure 1 The present invention provides a technical solution: a manufacturing process for assisting the installation of SMD lamp beads, characterized in that it includes the following steps: Step 1: Pre-treat the PCB board to ensure that the cleanliness of the PLC board surface meets the subsequent welding requirements; Step 2: Fix the steel mesh above the PCB board, use a scraper to evenly scrape the solder paste through the steel mesh, and print the solder paste through the mesh holes of the steel mesh onto the pads of the PCB board; Step 3: Check the solder paste printing quality through AOI equipment, and make corresponding adjustments or rework according to the inspection results; Step 4: Place the SMD lamp beads in the material tray of the SMD machine according to the correct polarity and position; Step 5: Send the PCB with SMD lamp beads into the reflow oven, and then put the soldered PCB into the reflow zone for cooling; Step 6: Take out the PLC board after cooling and test the electrical properties of the lamp beads; Step 7: In the above steps, optical 3D measurement technology is introduced to accurately measure the shape and height of solder joints to achieve a more comprehensive and accurate assessment of solder joint quality. For each inspection operation, detailed records and storage of data information including solder joint images, electrical performance indicators, defect categories, etc. are recorded and stored; Step 8. Use data analysis algorithms to determine the trend of welding quality and make quality predictions in the production process. At the same time, these data can be effectively applied to the product quality traceability system to help accurately locate the root causes of quality problems and provide strong support for timely optimization and improvement of production processes.

[0016] Please refer to the attached Figure 1 In step 2, before using the solder paste, it is necessary to use a vacuum degassing machine to remove tiny bubbles in the solder paste, and the steel mesh cleaning equipment is required to clean the steel mesh after each solder paste printing. At the same time, the steel mesh with insufficient tension or blocked or deformed openings must be replaced in time to ensure the uniformity of solder paste scraping. In step 3, the AOI equipment uses a high-resolution camera to comprehensively scan the PCB board to accurately detect the shape, size, position, and presence of tin-connected and insufficient tin defects of the solder paste. In step 4, it is necessary to use various types of special suction nozzles according to the different sizes and shapes of SMD lamp beads, and classify and sort the SMD lamp beads according to the models and specifications to ensure the compatibility and stability of the material tray and avoid damage to the lamp beads or position confusion during transportation and loading. In step 5, the PCB with SMD lamp beads is sent to the reflow oven, and then the soldered PCB board is placed in the reflow zone for cooling to quickly cool and solidify the solder joints to form a reliable welding connection; In this embodiment, the optical three-dimensional measurement equipment is precisely installed at a key position after the welding process is completed and before the electrical performance test. The equipment is equipped with multiple groups of cameras, which synchronously collect light pattern images modulated by the weld from different angles. Based on the principle of triangulation, the three-dimensional coordinates of each point on the surface of the weld are accurately calculated by deeply analyzing the light propagation path and the deformation details of the light pattern in the image, thereby accurately obtaining the shape information of the weld. At the same time, the laser triangulation technology uses a laser beam to irradiate the weld, and by measuring the changes in the imaging position of the reflected light on the sensor, and combining the existing relationship between the laser emission angle and the sensor position, the height and shape data of the weld are calculated in detail. All collected data will be transmitted to the database in real time. After receiving the data, the database will first normalize the data, and then use statistical process control technology to set the upper and lower control limits of the control chart. Once the quality data point exceeds the control limit, it means that the production process is very likely to have abnormal fluctuations. For example, when a batch of products presents When there are a large number of cold solder joints, data tracing can be used to thoroughly check whether the solder paste used in the batch of products is damp during storage, whether there are abnormal fluctuations in the temperature of the reflow soldering furnace during the corresponding time period, and whether the AOI equipment has missed inspections in the solder paste printing quality inspection link. With this comprehensive and in-depth tracing and analysis method, the root cause of the quality problem can be accurately identified, and corrective measures can be implemented in a timely manner to effectively prevent similar problems from occurring again in subsequent production processes. In addition, the early warning mechanism is based on advanced algorithms to build a quality prediction model based on machine learning algorithms. The solder joint shape, height, electrical performance indicators in the historical inspection data and the corresponding qualified or unqualified product quality results are used as training data input models, so that the model can deeply learn the inherent laws and characteristic patterns contained in the data. After sufficient training with a large amount of data, the model can accurately predict the product quality status based on the new solder joint inspection data. In this way, through the dual guarantee mechanism of data comparison and model construction, the stability and reliability of product quality are effectively ensured.

[0017] When in use, an efficient quality control system is built with the help of optical 3D measurement technology and data analysis algorithms. Based on these rich data, the trend of welding quality can be deeply analyzed, potential problems can be predicted in advance, and the defective rates of cold soldering and bridging can be effectively reduced by about 30%. Once a product has quality defects, data reverse inference can be used to accurately trace back to specific error steps such as bubble residue in solder paste printing, steel mesh blockage and deformation, or lamp bead position deviation in patching, or abnormal temperature curve and solder joint offset in reflow soldering in a short time, so as to make the process adjustment quick and accurate, thereby increasing the product's one-time pass rate by about 25%, significantly reducing rework costs and waste losses, and greatly improving production efficiency.

[0018] Example 2, please refer to the attached Figure 1The present invention provides a technical solution: a manufacturing process for assisting the installation of SMD lamp beads, characterized in that it includes the following steps: Step 1: Pre-treat the PCB board to ensure that the cleanliness of the PLC board surface meets the subsequent welding requirements; Step 2: Fix the steel mesh above the PCB board, use a scraper to evenly scrape the solder paste through the steel mesh, and print the solder paste through the mesh holes of the steel mesh onto the pads of the PCB board; Step 3: Check the solder paste printing quality through AOI equipment, and make corresponding adjustments or rework according to the inspection results; Step 4: Place the SMD lamp beads in the material tray of the SMD machine according to the correct polarity and position; Step 5: Send the PCB with SMD lamp beads into the reflow oven, and then put the soldered PCB into the reflow zone for cooling; Step 6: Take out the PLC board after cooling and test the electrical properties of the lamp beads; Step 7: In the above steps, optical 3D measurement technology is introduced to accurately measure the shape and height of solder joints to achieve a more comprehensive and accurate assessment of solder joint quality. For each inspection operation, detailed records and storage of data information including solder joint images, electrical performance indicators, defect categories, etc. are recorded and stored; Step 8. Use data analysis algorithms to determine the trend of welding quality and make quality predictions in the production process. At the same time, these data can be effectively applied to the product quality traceability system to help accurately locate the root causes of quality problems and provide strong support for timely optimization and improvement of production processes.

[0019] Please refer to the attached Figure 1 In step 6, a multimeter is used to comprehensively test the conductivity, luminous characteristics, forward voltage, reverse current and other key electrical parameters of the lamp beads. The lamp beads that do not meet the standards are marked and recorded for subsequent repair or replacement to ensure that the patch lamp beads on the entire PCB board can work normally and meet the electrical performance requirements of the product. In step 7, a database needs to be established. When the optical three-dimensional measurement equipment completes the measurement of the solder joints, it automatically generates an image file format containing the solder joint image in a high-resolution format, and assigns a unique serial number to each PCB board. The identification code is associated with the corresponding test data and stored in the database for subsequent query and traceability. In step 8, a comparative analysis is carried out based on the information in the database and the pre-set standard value. Once the target value is significantly greater than or significantly less than the standard value, the data reverse push mechanism can be used to accurately trace back to the specific production step where the error occurred, so that more rapid and effective adjustment measures can be implemented; In this embodiment, the above scheme can be used to assist the installation of SMD lamp beads. The specific form of the scheme is that first, the PCB board is pre-treated by cleaning to create a good foundation for subsequent welding, ensure that the welding surface is free of impurities, and improve the reliability and stability of welding. Then, in the solder paste printing process, a vacuum degassing machine is used to remove tiny bubbles in the solder paste, and the steel mesh is cleaned after printing, and the problematic steel mesh is handled in time to ensure that the solder paste is printed on the pad evenly and with high quality, providing material guarantee for the precise welding of SMD lamp beads. Subsequently, the high-resolution scanning of the AOI equipment can accurately detect the quality of solder paste printing, and timely discover defects such as tin connection and insufficient tin and feedback, so as to make adjustments or rework, and avoid subsequent poor welding due to solder paste problems. In the placement of SMD lamp beads, special suction nozzles are selected according to the different sizes and shapes of the lamp beads, and the material trays are sorted and organized to effectively prevent the lamp beads from being damaged or misplaced during transportation and loading, and ensure that the lamp beads can be accurately placed in the predetermined position. The reflow oven process completes the welding and cooling of the lamp beads and the PCB board to form a reliable connection. The subsequent electrical performance test uses a multimeter to comprehensively detect the key parts of the lamp beads. Electrical parameters, will not meet the standard lamp beads mark record, on the one hand can ensure that the electrical performance of the current product meets the standard, on the other hand also provides a basis for subsequent quality traceability and problem troubleshooting, optical three-dimensional measurement technology after welding, before electrical testing, multiple groups of cameras to collect solder joint pattern images from multiple angles and combine the principle of triangulation to obtain solder joint shape and height information, record including solder joint image, electrical performance indicators, defect categories and other data and establish a database, to achieve a comprehensive and accurate assessment of solder joint quality, for subsequent analysis to provide rich data resources, finally the data analysis algorithm by processing the database information, set the upper and lower limits of the control chart to monitor the quality fluctuations of the production process, once an abnormality occurs, it can be traced back to the specific production steps such as solder paste, patch, reflow soldering and timely correction; at the same time, build a quality prediction model, according to the historical data training can be new detection data for product quality prediction, early detection of potential problems and adjustment of the process, so as to effectively assist the entire patch lamp bead installation process, improve product quality, production efficiency and reduce costs, and step seven for each PCB board assigned a unique serial number, so that the subsequent rework troubleshooting will be more convenient.

[0020] During use, by using special suction nozzles for different SMD lamp beads and sorting the material trays, damage to the lamp beads and position confusion can be effectively prevented, and the SMD accuracy can be controlled within ±0.05mm. In addition, a database is established to achieve full-process quality traceability and big data management, providing a detailed basis for continuous process optimization. The data accumulated over a long period of time can help optimize the process parameters.

[0021] Those skilled in the art should understand that the modules or steps of the present invention described above can be implemented by a general-purpose computer device, or alternatively, they can be implemented by a program code executable by a computing device, so that they can be stored in a storage device and executed by the computing device, or they can be made into individual integrated circuit modules, or multiple modules or steps therein can be made into a single integrated circuit module for implementation. The present invention is not limited to any specific combination of hardware and software.

[0022] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0023] Although the above describes the specific implementation mode of the present invention in conjunction with the accompanying drawings, it is not intended to limit the scope of protection of the present invention. Those skilled in the art should understand that various modifications or variations that can be made by those skilled in the art on the basis of the technical solution of the present invention without creative work are still within the scope of protection of the present invention.

Claims

1. A manufacturing process for assisting the installation of SMD lamp beads, characterized in that: The following steps are involved: Step 1: Pre-treat the PCB board to ensure that the cleanliness of the PLC board surface meets the subsequent welding requirements; Step 2: Fix the steel mesh above the PCB board, use a scraper to evenly scrape the solder paste through the steel mesh, and print the solder paste through the mesh holes of the steel mesh onto the pads of the PCB board; Step 3: Check the solder paste printing quality through AOI equipment, and make corresponding adjustments or rework according to the inspection results; Step 4: Place the SMD lamp beads in the material tray of the SMD machine according to the correct polarity and position; Step 5: Send the PCB with SMD lamp beads into the reflow oven, and then put the soldered PCB into the reflow zone for cooling; Step 6: Take out the PLC board after cooling and test the electrical properties of the lamp beads; Step 7. In the above steps, optical 3D measurement technology is introduced to accurately measure the shape and height of solder joints to achieve a more comprehensive and accurate assessment of solder joint quality. For each inspection operation, detailed records and storage of data information including solder joint images, electrical performance indicators, defect categories, etc. are recorded; Step 8. Use data analysis algorithms to determine the trend of welding quality and make quality predictions in the production process. At the same time, these data can be effectively applied to the product quality traceability system to help accurately locate the root causes of quality problems and provide strong support for timely optimization and improvement of production processes.

2. A manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: In the step 2, before using the solder paste, tiny bubbles in the solder paste need to be removed by a vacuum degassing machine, and the steel mesh needs to be cleaned by a steel mesh cleaning device after each solder paste printing. At the same time, the steel mesh with insufficient tension or blocked or deformed openings needs to be replaced in time to ensure the uniformity of solder paste scraping.

3. A manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: In the step 3, the AOI equipment uses a high-resolution camera to comprehensively scan the PCB board, accurately detecting the shape, size, position, and presence of bridging and insufficient tin defects of the solder paste.

4. A manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: In step 4, it is necessary to use various types of special nozzles according to the different sizes and shapes of the SMD lamp beads, and classify and organize the SMD lamp beads according to their models and specifications to ensure the compatibility and stability of the material tray and avoid damage to the lamp beads or misalignment of their positions during transportation and loading.

5. The manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: In the step 5, the PCB with the SMD lamp beads mounted thereon is sent into a reflow oven, and then the soldered PCB board is placed in a reflow zone for cooling so that the solder joints are quickly cooled and solidified to form a reliable soldering connection.

6. The manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: In step six, a multimeter is used to comprehensively test the key electrical parameters of the lamp beads, such as conductivity, luminous characteristics, forward voltage, reverse current, etc., and the lamp beads that do not meet the standards are marked and recorded for subsequent repair or replacement to ensure that the SMD lamp beads on the entire PCB board can work normally and meet the electrical performance requirements of the product.

7. The manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: In step seven, a database needs to be established. When the optical three-dimensional measuring device completes the measurement of the solder joint, it automatically generates an image file format containing the solder joint image in a high-resolution format, and assigns a unique serial number to each PCB board. The identification code is associated with the corresponding inspection data and stored in the database for subsequent query and tracing.

8. The manufacturing process for assisting the installation of SMD lamp beads according to claim 1, characterized in that: Step eight is to compare and analyze the information in the database with the pre-set standard value. Once the target value is significantly greater than or significantly less than the standard value, the data reverse mechanism can be used to accurately trace the specific production step where the error occurred, thereby enabling faster and more effective adjustment measures to be implemented.

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