Vapor chamber and electronic equipment

Abstract

The invention relates to a vapor chamber and electronic equipment. The vapor chamber is applied to the electronic equipment. The vapor chamber comprises a first cover plate, a second cover plate and a capillary structure; the edge of the first cover plate is fixedly connected with the edge of the second cover plate, so that a closed cavity is formed between the first cover plate and the second cover plate; the capillary structure is located in the cavity, and the capillary structure is used for guiding liquid in the cavity to flow; the cavity comprises a first cavity and a second cavity which communicate with each other, the first cavity is located in a first area of the vapor chamber, the second cavity is located in a second area of the vapor chamber, and the first area is used for being connected with a heating piece of the electronic equipment; the size of the second cavity in the first direction is larger than that of the first cavity in the first direction, and the first direction is the arrangement direction of the first cover plate and the second cover plate. According to the vapor chamber, the size of the second cavity is increased, so that the air resistance of the gas in the second cavity is small, the through-flow capacity is improved, the gas can be timely and rapidly diffused to the second cavity, and the heat dissipation capacity of the vapor chamber is improved.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat spreader and electronic equipment. Background Art

[0002] The development of electronic devices has changed our way of life, especially the development of tablets, foldable computers, foldable mobile phones, etc. has brought great convenience to our lives.

[0003] Electronic devices are usually equipped with a vapor chamber to dissipate heat for the electronic devices. Existing vapor chambers have low heat dissipation efficiency and limited heat dissipation capacity, which restricts the performance improvement of electronic devices. Therefore, it is crucial to optimize the design of the vapor chamber to improve the heat dissipation capacity of the vapor chamber. Summary of the invention

[0004] The embodiment of the present application provides a vapor chamber and an electronic device. The present application improves the heat dissipation capacity of the vapor chamber by setting different sizes of different areas of the vapor chamber.

[0005] In the first aspect, the embodiment of the present application provides a heat spreader, which is applied to electronic equipment. The heat spreader includes a first cover plate, a second cover plate and a capillary structure; the edge of the first cover plate is fixedly connected to the edge of the second cover plate to form a closed cavity between the first cover plate and the second cover plate; the capillary structure is located in the cavity, and the capillary structure is used to guide the flow of liquid located in the cavity; the cavity includes a first cavity and a second cavity that are interconnected, the first cavity is located in the first area of ​​the heat spreader, the second cavity is located in the second area of ​​the heat spreader, and the first area is used to connect the heating element of the electronic device; the size of the second cavity in the first direction is larger than the size of the first cavity in the first direction, and the first direction is the arrangement direction of the first cover plate and the second cover plate. It can be understood that the first area can be in contact with the heating element and fixedly connected, or other structural members can be set between the first area and the heating element, and the first area is connected to the heating element through other structural members.

[0006] It can be understood that the second area is arranged away from the heating element relative to the first area. The first area and the heating element can be fixedly connected, and the heat energy of the heating element is transmitted to the first area, and the liquid working medium in the first area is vaporized into gas, and the gas fills the cavity. After the gas contacts the second area with a lower temperature, it liquefies into liquid and dissipates the heat energy. The liquid liquefied in the second area flows back to the first area under the capillary force of the capillary structure, and continues to vaporize in the first area, and the reciprocating cycle is repeated to achieve continuous heat dissipation.

[0007] It can be understood that the size of the cavity in the first direction may refer to the spacing between the structures surrounding the cavity in the first direction. For example, the size of the first cavity in the first direction may refer to the spacing between the first cover plate and the second cover plate corresponding to the first area, and the size of the second cavity in the first direction may refer to the spacing between the first cover plate and the second cover plate corresponding to the second area.

[0008] In the embodiment of the present application, the size of the second cavity in the first direction is set to be larger than the size of the first cavity in the first direction. Compared with the design in which the sizes of the first cavity and the second cavity in the first direction are the same, the embodiment of the present application increases the size of the second cavity, so that the air resistance of the gas in the second cavity is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the second cavity, and is conducive to improving the heat dissipation efficiency to improve the heat dissipation capacity of the heat spreader.

[0009] In a possible implementation, in the first direction, the size of the portion of the capillary structure located in the second region is larger than the size of the portion of the capillary structure located in the first region. The size of the capillary structure in the first direction can be understood as the thickness of the capillary structure. In the embodiment of the present application, the size of the second cavity in the first direction is set to be larger than the size of the first cavity in the first direction, which increases the space of the second cavity. The capillary force of the capillary structure in the second cavity can be increased by setting a thicker capillary structure in the second cavity with a larger space, so as to increase the liquid reflux capacity in the second cavity. When the reverse gravity problem occurs (the reverse gravity problem can be understood as the direction of the self-gravity of the liquid in the second cavity is different from the capillary force of the capillary structure, and the liquid cannot flow back to the first cavity through the capillary force to overcome gravity), the liquid will accumulate in the second cavity, affecting the liquid from flowing back to the first cavity, reducing the heat dissipation capacity of the heat spreader. In the embodiment of the present application, by setting a thicker capillary structure in the second cavity with a larger space, the capillary force of the capillary structure in the second cavity is increased, which is conducive to the liquid overcoming its own gravity to achieve reflux even in the reverse gravity scene.

[0010] In a possible embodiment, the capillary structure includes a capillary mesh and a capillary wire, the capillary mesh is fixed to the second cover plate, and the capillary wire is fixed to the side of the capillary mesh facing the first cover plate; in the first direction, the size of the portion of the capillary wire located in the second area is larger than the size of the portion of the capillary wire located in the first area, or, in the first direction, the size of the portion of the capillary mesh located in the second area is larger than the size of the portion of the capillary mesh located in the first area. The capillary mesh can be a porous mesh structure for providing capillary force for the capillary structure, and the capillary wire can be used to drain the liquid and improve the capillary force of the capillary structure. The size of the capillary wire in the first direction can be understood as the thickness of the capillary wire, and the size of the capillary mesh in the first direction can be understood as the thickness of the capillary mesh. In the embodiment of the present application, the thickness of the capillary structure in the second area can be increased by increasing the thickness of the capillary wire or the capillary mesh in the second area, which is beneficial to provide sufficient capillary force for the liquid in the second cavity, which is beneficial to the reflux of the liquid and solves the problem of reverse gravity.

[0011] In a possible implementation, the capillary structure includes a capillary mesh and a capillary wire, the capillary mesh is fixed to the second cover plate, the capillary wire is fixed to the side of the capillary mesh facing the first cover plate, and the width of the portion of the capillary wire located in the second area is greater than the width of the portion of the second capillary wire located in the first area. In the embodiment of the present application, the capillary force of the capillary structure in the second area can be increased by increasing the width of the portion of the capillary wire in the second area, which is beneficial to provide sufficient capillary force for the liquid in the second cavity, facilitate the reflux of the liquid, and solve the problem of reverse gravity.

[0012] In a possible implementation, the cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, the third cavity is located in the third area of ​​the heat spreader, the third area is used for heat dissipation, and the size of the third cavity in the first direction is greater than or equal to the size of the first cavity in the first direction. The size of the third cavity in the first direction may refer to the distance between the first cover plate and the second cover plate corresponding to the third area. When the size of the third cavity in the first direction is greater than the size of the first cavity in the first direction, compared with the design in which the first cavity and the third cavity have the same size in the first direction, the embodiment of the present application increases the size of the third cavity, so that the air resistance of the gas in the third cavity is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the third cavity, and is conducive to improving the heat dissipation efficiency to improve the heat dissipation capacity of the heat spreader.

[0013] In a possible implementation, the capillary structure includes a capillary mesh and a capillary wire, the capillary mesh is fixed to the second cover plate, the capillary wire is fixed to the side of the capillary mesh facing the first cover plate, and the number of the capillary wires in the second region is greater than or equal to two. When there is a counter-gravity problem in the second region, by setting the number of the capillary wires in the second region to be greater than or equal to two, it is beneficial to provide sufficient capillary force for the liquid in the second cavity, which is beneficial to the reflux of the liquid and solves the counter-gravity problem.

[0014] In a possible embodiment, the cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, and the third cavity is located in the third area of ​​the vapor chamber; the vapor chamber includes a partition, the partition is located between the second cavity and the third cavity, and is used to isolate the second cavity and the third cavity. It can be understood that the third area is arranged away from the heating element relative to the first area. The first area, the second area and the third area can be in a "Y"-shaped structure, or a "T"-shaped structure. The first area can be fixedly connected to the heating element, and the heat energy of the heating element is transmitted to the first area, and the liquid working medium in the first area is vaporized into gas, and the gas fills the cavity. After the gas contacts the second area and the third area with a lower temperature, it liquefies into liquid and dissipates the heat energy. The liquid liquefied in the second area and the third area flows back to the first area under the capillary force of the capillary structure, and continues to vaporize in the first area, and reciprocates to achieve continuous heat dissipation. The partition can be a hollow structure to reduce the weight of the vapor chamber and achieve lightweight. The partition can also be a solid structure. In the reverse gravity scenario, when the second cavity has a reverse gravity problem, part of the liquid in the third cavity will flow to the second cavity under its own gravity, causing the liquid to accumulate in the second cavity, increasing the difficulty of the liquid in the second cavity to flow back, resulting in a decrease in the heat dissipation capacity of the heat spreader. The embodiment of the present application sets a partition between the second cavity and the third cavity to isolate the second cavity and prevent the liquid in the third cavity from flowing to the second cavity, so that the liquid in the third cavity flows back to the first cavity to achieve circulating heat dissipation.

[0015] In a possible implementation, the surface of the partition piece facing the second cavity is an arc-shaped surface, or the surface of the partition piece facing the third cavity is an arc-shaped surface. When the surface of the partition piece facing the third cavity is an arc-shaped surface, the liquid in the third cavity can flow along the arc-shaped surface to the first cavity, thereby avoiding the problem that when the surface of the partition piece facing the third cavity is a surface with a large bending angle, the liquid accumulates seriously at the partition piece and cannot flow back to the first cavity in time. In addition, the arc-shaped surface can reduce the resistance to the gas. The surface of the partition piece facing the second cavity is an arc-shaped surface, and the surface of the partition piece facing the third cavity is an arc-shaped surface, which can prevent the partition piece from affecting the diffusion of the gas and affecting the heat dissipation effect of the heat spreader.

[0016] In a possible implementation, the partition member includes a first end and a second end that are arranged opposite to each other, the first end is closer to the first region than the second end, the dimension of the first end in the second direction is smaller than the dimension of the second end in the second direction, and the second direction is perpendicular to the first direction. The first end has a smaller width than the second end, which is conducive to the liquid flowing quickly from the second end to the first end and converging in the first region, thereby improving the heat dissipation capacity of the vapor chamber.

[0017] In a possible implementation, the capillary structure includes a capillary mesh and a capillary line, the capillary mesh is fixed to the second cover plate, the capillary line is fixed to the side of the capillary mesh facing the first cover plate, one side of the partition member abuts against the first cover plate, and the other side of the partition member abuts against the capillary mesh. The partition member abuts between the capillary mesh and the first cover plate, which is conducive to separating the first cavity from the second cavity.

[0018] In a possible implementation, the partition piece and the first cover plate are integrally formed. The partition piece and the first cover plate are integrally formed so that the process of fixing the partition piece and the first cover plate can be omitted, and the partition piece and the first cover plate are integrally formed so that the first cover plate and the partition piece are tightly connected, thereby preventing the first cover plate and the partition piece from being loosely connected and causing a gap to cause the liquid in the third cavity to flow into the second cavity.

[0019] In a possible embodiment, the capillary structure includes a capillary mesh and a first capillary line, the capillary mesh is fixed to the second cover plate, the first capillary line is fixed to the side of the capillary mesh facing the first cover plate, and at least part of the first capillary line is located in the second area; the second area includes a first side and a second side, the temperature of the first side is lower than the temperature of the second side, and the part of the second capillary line located in the second area is located on the first side. In the reverse gravity scenario, when the second cavity has a reverse gravity problem, by setting the first capillary line on the first side with a lower temperature, it is beneficial to the rapid reflux of the liquid in the second cavity, avoiding the accumulation of liquid in the second cavity, and effectively solving the reverse gravity problem. It can be understood that compared with the second side with a higher temperature, the gas is easier to liquefy into liquid on the first side with a lower temperature. By setting the first capillary line on the first side where the gas is easier to liquefy, the liquid liquefied on the first side can be promptly and quickly refluxed to the first cavity.

[0020] In a possible implementation, the cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, and the third cavity is located in the third region of the vapor chamber; the capillary structure also includes a second capillary, at least part of the second capillary is located in the third region; the third region includes a third side and a fourth side, the temperature of the third side is lower than the temperature of the fourth side, and the part of the second capillary located in the third region is located on the fourth side. The first capillary is located on the first side with a lower temperature, and the second capillary is located on the fourth side with a higher temperature, so that the first capillary and the second capillary are arranged in a staggered manner, and the second capillary serves to isolate the second cavity and the third cavity, preventing part of the liquid in the third cavity from flowing to the second cavity, which is conducive to the liquid in the third cavity flowing back to the first cavity, thereby improving the heat dissipation capacity of the vapor chamber. In addition, the staggered arrangement of the first capillary and the second capillary isolates the second cavity and the third cavity, which is conducive to the completion of the vacuuming process, can improve the vacuum degree in the cavity, and improve the heat dissipation capacity of the vapor chamber.

[0021] In a possible implementation, the material of the first cover plate or the second cover plate is at least one of stainless steel, copper, and titanium. In the embodiment of the present application, the cavity formed by the first cover plate and the second cover plate has different thicknesses in different areas, that is, the first cover plate or the second cover plate has an uneven structure, which can be formed by stamping. The first cover plate or the second cover plate needs to have high strength. By setting the material of the first cover plate or the second cover plate to be at least one of stainless steel, copper, and titanium with high strength, it is beneficial to the processing of the heat sink.

[0022] In a possible implementation manner, the first region is used for absorbing heat, and the second region is used for dissipating heat.

[0023] In a second aspect, the present application provides an electronic device, comprising a heating element and a heat spreader as described in any of the aforementioned embodiments, wherein the heating element is connected to the heat spreader, and the heat energy of the heating element is conducted to the heat spreader. The electronic device may be a tablet, a folding computer, a folding mobile phone, etc. The heating element may be a central processing unit, etc. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the drawings required for use in the embodiments of the present invention or the background technology will be described below.

[0025] Figure 1 It is a structural schematic diagram of an electronic device provided in an embodiment of the present application;

[0026] Figure 2 is a schematic structural diagram of another electronic device provided in an embodiment of the present application;

[0027] Figure 3 yes Figure 1 The structural schematic diagram of the electronic device in a horizontal position is shown;

[0028] Figure 4 yes Figure 1 A schematic diagram of an internal structure of an electronic device shown;

[0029] Figure 5 This is a schematic diagram of the heat dissipation principle of a heat spreader provided in an embodiment of the present application;

[0030] Figure 6 yes Figure 1 A schematic diagram of a structure of a heat spreader shown;

[0031] Figure 7 yes Figure 6 Schematic diagram of the exploded structure of the heat sink shown;

[0032] Figure 8 yes Figure 6 A side view of the vapor chamber shown;

[0033] Fig. 9 It is a schematic diagram of the structure formed by a cavity of a heat spreader provided in an embodiment of the present application;

[0034] Fig.10 It is a schematic structural diagram of another cavity formation of a vapor chamber provided in an embodiment of the present application;

[0035] Fig.11 is a schematic diagram of the internal liquid and gas circulation of the vapor chamber provided in the embodiment of the present application;

[0036] Fig.12 yes Figure 6 A schematic diagram of a portion of the structure of a vapor chamber is shown;

[0037] Fig.13 yes Figure 6 A schematic diagram of a portion of the internal structure of the vapor chamber at one angle;

[0038] Fig.14 yes Figure 6 A schematic diagram of the internal structure of the vapor chamber from another angle;

[0039] Fig.15 It is a partial structural schematic diagram of another heat sink provided in an embodiment of the present application;

[0040] Fig.16 It is a schematic diagram of the internal structure of a heat sink provided in an embodiment of the present application;

[0041] Fig.17 is a structural schematic diagram of a first cover plate provided in an embodiment of the present application;

[0042] Fig.18 It is a schematic diagram of the internal structure of another hot plate provided in an embodiment of the present application;

[0043] Fig.19 It is a partial structural schematic diagram of another heat sink provided in an embodiment of the present application;

[0044] Fig. 20 is a schematic diagram of the internal structure of another vapor chamber provided in an embodiment of the present application;

[0045] Fig.21 It is a partial structural schematic diagram of another heat sink provided in an embodiment of the present application;

[0046] Fig. 22 is a schematic diagram of the internal structure of another vapor chamber provided in an embodiment of the present application;

[0047] Fig.23 is a schematic structural diagram of another vapor chamber provided in an embodiment of the present application;

[0048] Fig.24 It is a schematic diagram of the structure of another heat spreader provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] It should be understood that the terms “first”, “second”, etc. used in the present application are only used for the purpose of distinguishing the description, and cannot be understood as indicating or implying relative importance, nor can they be understood as indicating or implying an order.

[0051] In the description of the present application, the terms "up", "down", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they should not be understood as limitations on the present application.

[0052] In the description of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, a conflicting connection or an integral connection; for ordinary technicians in this field, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0053] like Figure 1 , Figure 2 and Figure 3 As shown, Figure 1 is a schematic diagram of the structure of an electronic device 100, Figure 2 is a schematic diagram of the structure of another electronic device 100, Figure 3 yes Figure 1 The electronic device 100 is shown as a schematic diagram of a horizontally placed state. The electronic device 100 may be a tablet, a foldable computer, a foldable mobile phone, etc. When the electronic device 100 is working, some components inside the electronic device 100 will generate heat. As the heat energy generated by the electronic device 100 increases, the working performance of the electronic device 100 will be affected and the user experience will be reduced. Therefore, the electronic device 100 needs to be cooled.

[0054] The embodiment of the present application is introduced by taking the electronic device 100 as a computer as an example. The electronic device 100 may include a first part 101 and a second part 102 connected. The first part 101 and the second part 102 may both be display parts, which may display text, images, etc. The electronic device 100 may be connected to an external keyboard to control the display of the first part 101 and the second part 102. In other implementations, the first part 101 may also be a display part for displaying text, images, etc., and the second part 102 may be a touch keyboard to control the display of the first part 101. The electronic device 100 may also be in other application forms, which are not limited in the present application.

[0055] The electronic device 100 may include a heating element 10 and a heat spreader 20. The heating element 10 and the heat spreader 20 may be fixedly connected. The heat energy of the heating element 10 may be transmitted to the heat spreader 20. The heat spreader 20 is used to dissipate the heat energy of the heating element 10 to achieve heat dissipation of the electronic device 100. The heating element 10 may be fixed to a circuit board, and the heating element 10 may be a central processing unit, etc.

[0056] See also Figure 1 The heating element 10 may be located in the first portion 101, and the heat spreader 20 is disposed in the first portion 101 and fixedly connected to the heating element 10, and the heat spreader 20 dissipates heat for the heating element 10. Figure 2 , the heating element 10 may also be located in the second part 102, and the heat spreader 20 is disposed in the second part 102 and fixedly connected to the heating element 10, and the heat spreader 20 dissipates heat for the heating element 10. In other embodiments, the first part 101 and the second part 102 may both be provided with the heating element 10, and the number of the heat spreaders 20 may also be two, and the two heat spreaders 20 are respectively disposed in the first part 101 and the second part 102. The position of the heat spreader 20 may be set according to the heating element to improve the effective and timely heat dissipation of the electronic device 100.

[0057] Figures 1 to 3The electronic device 100 is only schematically shown, and the size, shape, position, etc. of the heating element 10 and the heat spreader 20 can be set as needed. The present application does not limit the specific structure of the electronic device 100.

[0058] See also Figure 1 and Figure 4 , Figure 4 for Figure 1 A schematic diagram of an internal structure of an electronic device 100 is shown. Figure 4 The arrow in the figure indicates the direction of wind. The electronic device 100 may include heat sink fins 103, a rear housing 104, a heat sink 105 and a fastener 106. The rear housing 104 may be provided with an installation space, and the heating element 10, the heat spreader 20, the heat sink fins 103, the heat sink 105 and the fastener 106 are all located in the installation space of the rear housing 104. A gap is provided between the heat spreader 20 and the rear housing 104, and the wind in the environment can pass through the gap to dissipate the heat of the heat spreader 20. The heat spreader 20 is fixedly connected to the heating element 10 by fasteners 106. The heat dissipation area of ​​the heat spreader 20 is provided with heat sink fins 103, and the air outlet of the heat sink 105 (the heat sink 105 may be a fan) faces the heat sink fins, and the heat energy is taken away by the wind to dissipate heat.

[0059] In some embodiments, the fastener 106 may include a body 1061 and a spring 1062 (see the following Figure 7 ), the main body 1061 is welded to the heat spreader 20, and the spring piece 1062 is fixedly connected to the main body 1061 and the circuit board, so that the main body 1061 and the heating element 10 on the circuit board are closely arranged, that is, the heat spreader 20 and the heating element 10 are closely arranged, which is beneficial for the heat energy of the heating element 10 to be transmitted to the heat spreader 20 in time, and is beneficial for the rapid heat dissipation of the electronic device 100.

[0060] See also Figure 1 and Figure 5 , Figure 5 Schematic diagram of the heat dissipation principle of the heat spreader 20 . Figure 5 The heat dissipation principle of the heat spreader 20 is described by taking the first area 21 and the second area 22 as examples. Figure 5 The third region is not shown. It can be understood that the heat dissipation principle of the first region 21 and the third region refers to that of the first region 21 and the second region 22 . Figure 5 The black arrows in the heat plate 20 in the figure indicate the flow direction of the liquid. Figure 5 The white arrows in the middle vapor chamber 20 indicate the flow direction of the gas.

[0061] The heat spreader 20 may include a first region 21, a second region 22 and a third region 23. The first region 21 may be fixedly connected to the heat generating element 10. It can be understood that the first region 21 may be in contact with and fixedly connected to the heat generating element 10, or other structural components (such as fasteners 106) may be provided between the first region 21 and the heat generating element 10, and the first region 21 is connected to the heat generating element 10 through other structural components.

[0062] In some embodiments, the first region 21 is used for absorbing heat, and the second region 22 and the third region 23 can be arranged away from the heating element 10 relative to the first region 21. The second region 22 and the third region 23 are used for heat dissipation, that is, the second region 22 and the third region 23 dissipate the heat energy of the heating element 10. The first region 21, the second region 22 and the third region 23 can be in a "Y"-shaped structure, or a "T"-shaped structure. The heat energy of the heating element 10 is transmitted to the first region 21, and the heat energy vaporizes the liquid working medium (the liquid working medium can be water) in the first region 21 into gas, and the gas diffuses and fills the cavity of the heat spreader 20. After the gas contacts the second region 22 or the third region 23 with a lower temperature, it liquefies into liquid and dissipates the heat energy, thereby achieving heat dissipation of the heating element 10. The liquid liquefied in the second region 22 and the third region 23 flows back to the first region 21 under the capillary force of the capillary structure 26 in the heat spreader 20, and continues to vaporize to form gas in the first region 21, and reciprocates to achieve continuous heat dissipation.

[0063] In some embodiments, a heat sink 103 may be disposed outside the second region 22 or the third region 23. Figure 5 Not shown, see Figure 4 )'s air outlet faces the cooling fins, and the wind takes away the heat energy, thus playing a role in heat dissipation.

[0064] The second area 22 and the third area 23 can be arranged near the air outlet of the electronic device 100 to dissipate heat. Figure 1 The heat sink 20 is located in the first portion 101, and the air outlet is usually at the top 1011 of the first portion 101. Therefore, the second area 22 and the third area 23 are arranged close to the top 1011 of the first portion 101. Figure 2 The heat sink 20 is located in the second part 102 , the air outlet is usually arranged at the connection 1021 between the first part 101 and the second part 102 , and the second area 22 and the third area 23 are arranged close to the connection 1021 between the first part 101 and the second part 102 .

[0065] Understandably, Figure 1 and Figure 2 The second area 22 and the third area 23 of the heat spreader 20 are arranged left and right. In other embodiments, Figure 1 and Figure 2 The second area 22 and the third area 23 of the heat spreader 20 may also be arranged up and down.

[0066] It can be understood that in some embodiments, the vapor chamber 20 may not include the third region 23 , and the vapor chamber 20 may have various structural forms. The embodiments of the present application do not limit the specific structure of the vapor chamber 20 .

[0067] like Figure 6 , Figure 7 and Figure 8 As shown, Figure 6 for Figure 1 A schematic diagram of the structure of the heat spreader 20 is shown. Figure 7 for Figure 6 The schematic diagram of the exploded structure of the heat sink 20 is shown in FIG. Figure 8 for Figure 6 The side view of the heat sink 20 is shown. Figure 8 The figure is a simplified side view schematic diagram from the perspective of the side where the second area 22 is located. The heat spreader 20 includes a first cover plate 24, a second cover plate 25 and a capillary structure 26. The first cover plate 24 and the second cover plate 25 are arranged along the first direction A1, and the edge of the first cover plate 24 and the edge of the second cover plate 25 are fixedly connected to form a closed cavity 27 between the first cover plate 24 and the second cover plate 25. Exemplarily, the first cover plate 24 and the second cover plate 25 can be fixedly connected by welding. The capillary structure 26 is located in the cavity 27, and the capillary structure 26 is used to guide the flow of the liquid working medium located in the cavity 27. In the embodiment of the present application, the thickness of the cavity 27 in different areas may be different.

[0068] The material of the first cover plate 24 can be at least one of stainless steel, copper, and titanium, and the material of the second cover plate 25 can be at least one of stainless steel, copper, and titanium. Exemplarily, the first cover plate 24 can be made of stainless steel, or a composite material of stainless steel and copper, that is, copper is plated on the surface of stainless steel, and the material of the second cover plate 25 can be the same as or different from the first cover plate 24. In the embodiment of the present application, the cavity 27 formed by the first cover plate 24 and the second cover plate 25 has different thicknesses in different areas, that is, the first cover plate 24 or the second cover plate 25 has an uneven structure, and the first cover plate 24 or the second cover plate 25 can be formed by stamping, and the first cover plate 24 or the second cover plate 25 needs to have high strength performance. By setting the material of the first cover plate 24 or the second cover plate 25 to be at least one of stainless steel, copper, and titanium with high strength, it is beneficial to the processing of the heat spreader 20 and improve the manufacturing yield of the heat spreader 20.

[0069] The capillary structure 26 may include a capillary mesh and a capillary line. The capillary mesh is used to provide capillary force for the capillary structure. The capillary mesh may be a porous structure. The capillary mesh may be a structure formed by weaving a metal wire (such as a copper wire), or a structure formed by sintering a powder. The present application embodiment does not limit the material, structure, and formation method of the capillary mesh. The capillary line can be used to drain the liquid and improve the capillary force of the capillary structure. The number of capillary meshes may be one layer or two layers, etc. The present application embodiment takes the number of capillary meshes as two layers, and the two layers of capillary meshes are stacked as an example, and the two layers of capillary meshes are respectively the first capillary mesh 261 and the second capillary mesh 262. The present application embodiment takes the capillary lines as the first capillary line 263 and the second capillary line 264 as an example. The first capillary mesh 261 and the second capillary mesh 262 are stacked and fixed to the second cover plate 25, and the first capillary line 263 and the second capillary line 264 are both fixed to the capillary mesh (specifically the second capillary mesh 262) toward the side of the first cover plate 24. The first capillary wire 263 and the second capillary wire 264 may be in contact with the first cover plate 24 and fixedly connected.

[0070] See the following Fig.12 In some embodiments, part of the first capillary wire 263 may be located in the second cavity 272 of the second region 22, another part of the first capillary wire 263 may be located in the first cavity 271 of the first region 21, part of the second capillary wire 264 may be located in the third cavity 273 of the third region 23, and another part of the second capillary wire 264 may be located in the first cavity 271 of the first region 21. In other embodiments, the capillary structure may not be provided with capillaries.

[0071] In some embodiments, the first capillary mesh 261 and the second capillary mesh 262 can be pre-fixed to the second cover plate 25 by spot welding, the first capillary wire 263 and the second capillary wire 264 can be pre-fixed to the second capillary mesh 262 by spot welding, and the first cover plate 24 and the second cover plate 25 are welded and fixed. After welding, the heat spreader 20 is sintered at a high temperature, the first capillary mesh 261 and the second capillary mesh 262 are stably fixed to the second cover plate 25, and the first capillary wire 263 and the second capillary wire 264 are stably fixed between the second capillary mesh 262 and the first cover plate 24, so as to realize the manufacture of the heat spreader 20.

[0072] See also Figure 8The cavity 27 may include a first cavity 271 and a second cavity 272 that are interconnected. The first cavity 271 may be located in the first area 21, and the second cavity 272 may be located in the second area 22. The dimension H2 of the second cavity 272 in the first direction A1 is greater than the dimension H1 of the first cavity 271 in the first direction A1. It can be understood that the dimension of the cavity in the first direction A1 may refer to the spacing between the structures enclosed in the first direction A1 to form the cavity. For example, the dimension H1 of the first cavity 271 in the first direction A1 may refer to the spacing between the first cover plate 24 and the second cover plate 25 corresponding to the first area 21 in the first direction A1, and the dimension H2 of the second cavity 272 in the first direction A1 may refer to the spacing between the first cover plate 24 and the second cover plate 25 corresponding to the second area 22 in the first direction A1. The dimension H1 of the first cavity 271 in the first direction A1 can be understood as the thickness of the first cavity 271 being H1 , and the dimension H2 of the second cavity 272 in the first direction A1 can be understood as the thickness of the second cavity 272 being H2 .

[0073] In the embodiment of the present application, the thickness of the second cavity 272 is set to be greater than the thickness of the first cavity 271, that is, the cavity 27 is designed with unequal thickness. Compared with the design in which the first cavity 271 and the second cavity 272 are of the same size in the first direction A1, the embodiment of the present application increases the size of the second cavity 272 for dissipating heat from the heating element, so that the air resistance of the gas in the second cavity 272 is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the second cavity 272, and is conducive to improving the heat dissipation efficiency of the heat spreader 20 to improve the heat dissipation capacity of the heat spreader 20.

[0074] like Fig. 9 As shown, Fig. 9 The figure is a schematic diagram of the structure of the cavity 27 of the heat spreader 20. The unequal thickness design of the cavity 27 can be formed by stamping the second cover plate 25 to form a special-shaped structure (the special-shaped structure is relative to the flat structure), and fixedly connected to the flat first cover plate 24. The two parts of the second cover plate 25 are connected by an inclined surface 251 to facilitate stamping, so that a wedge-shaped transition is formed between the first area 21 and the second area 22.

[0075] like Fig.10 As shown, Fig.10 2 is a schematic diagram of another structure of the cavity 27 of the heat spreader 20. The unequal thickness design of the cavity 27 can be formed by stamping the first cover plate 24 to form a special-shaped structure (the special-shaped structure is relative to the flat plate structure), and fixedly connected to the flat plate-shaped second cover plate 25. The two parts of the first cover plate 24 are connected by an inclined surface 241 to facilitate stamping, so that a wedge-shaped transition is formed between the first area 21 and the second area 22.

[0076] like Figure 3 and Fig.11 As shown, Fig.11 It is a schematic diagram of the internal liquid and gas circulation of the heat spreader 20. The liquid working medium in the first area 21 is affected by the thermal energy of the heating element and vaporizes into gas. The gas can diffuse to the second area 22 and the third area 23 and fill the cavity of the heat spreader 20. After the gas contacts the second area 22 and the third area 23 with lower temperatures, it liquefies into liquid and dissipates the heat energy to achieve heat dissipation for the heating element 10. The liquefied liquid in the second area 22 and the third area 23 flows back to the first area 21 under the capillary force of the capillary structure in the heat spreader 20, and continues to vaporize to form gas in the first area 21, and circulates back and forth to achieve continuous heat dissipation. When the electronic device 100 is in use, it can be placed horizontally, vertically or flat. The relative position of the heat spreader 20 will change in different usage scenarios. When the heat spreader 20 is in Figure 3 and Fig.11 In the scenario shown, the second area 22 has a counter-gravity problem. It can be understood that the liquid in the second area 22 needs to overcome its own gravity and flow back to the first area 21 under the action of the capillary force of the capillary structure. However, when the capillary force on the liquid in the second area 22 is not enough to overcome the liquid's own gravity (i.e., counter-gravity), the liquid in the second area 22 will not be able to flow back to the first area 21, and the liquid will accumulate in the second area 22, reducing the heat dissipation capacity of the heat spreader 20. In addition, part of the liquid liquefied in the third area 23 flows back to the first area 21 under the action of gravity and capillary force, and another part of the liquid in the third area 23 flows to the second area 22 under the action of gravity, causing the accumulation of liquid in the second area 22, and the liquid in the second area 22 is difficult to flow back to the first area 21, and the gas-liquid circulation in the second area 22 is blocked, reducing the heat dissipation capacity of the heat spreader 20. Therefore, it is necessary to solve the counter-gravity problem in the second area 22.

[0077] The embodiment of the present application will introduce the structure of the heat spreader 20 by way of example through the following four schemes to solve the reverse gravity problem of the heat spreader 20 and improve the heat dissipation capacity of the heat spreader 20. It is understandable that the heat spreader 20 can also be a structure other than the four schemes, and the present application does not limit the structure of the heat spreader 20. The schemes of the embodiment of the present application include but are not limited to changing the size of the capillary structure of the second region 22 to increase the capillary force of the capillary structure of the second region 22, increasing the number of capillary lines in the second region 22 to increase the capillary force of the capillary structure of the second region 22, setting a partition 28, setting the first capillary line 263 on the first side 221 with a lower temperature, staggering the first capillary line 263 and the second capillary line 264, etc.

[0078] Option 1: If Fig.12 , Fig.13 and Fig.14 As shown, Fig.12 for Figure 6 The schematic diagram of the partial structure of the heat spreader 20 is shown in FIG. Fig.12 The structure in is Figure 6 The schematic diagram of the structure of the heat spreader 20 after removing the first cover plate 24 is to clearly show the internal structure of the heat spreader 20. Fig.13 yes Figure 6 The schematic diagram of the partial internal structure of the heat spreader 20 at one angle is shown. Fig.14 for Figure 6 A schematic diagram of the internal structure of the heat spreader 20 is shown from another angle.

[0079] In some embodiments, in the first direction A1, the size of the portion of the capillary structure 26 located in the second region 22 is larger than the size of the portion of the capillary structure 26 located in the first region 21. In the first direction A1, the size of the portion of the capillary structure 26 located in the second region 22 can be understood as the thickness of the capillary structure of the second region 22, and in the first direction A1, the size of the portion of the capillary structure 26 located in the first region 21 can be understood as the thickness of the capillary structure of the first region 21, that is, the thickness of the capillary structure of the second region 22 is larger than the thickness of the capillary structure of the first region 21.

[0080] In the embodiment of the present application, the thickness of the second cavity 272 is set to be greater than the thickness of the first cavity 271, thereby increasing the space of the second cavity 272. A thicker capillary structure can be set in the second cavity 272 with a larger space, so that the thickness of the capillary structure in the second area 22 is greater than the thickness of the capillary structure in the first area 21, so as to increase the capillary force of the capillary structure in the second cavity 272. Even in the reverse gravity scenario, it is beneficial for the liquid in the second cavity 272 to overcome its own gravity and achieve reflux, which is beneficial to improve the reflux capacity of the liquid in the second cavity 272 and prevent the liquid from accumulating in the second cavity 272, thereby solving the reverse gravity problem and improving the heat dissipation efficiency and heat dissipation capacity of the heat spreader 20.

[0081] In some embodiments, see Fig.14 In the first direction A1, the thickness of the capillary structure of the second area 22 can be increased by setting the size of the first capillary thread 263 in the second area 22 (i.e., the thickness of the first capillary thread 263 in the second area 22) to be larger than the size of the first capillary thread 263 in the first area 21 (i.e., the thickness of the first capillary thread 263 in the first area 21). This makes the thickness of the capillary structure of the second area 22 greater than the thickness of the capillary structure of the first area 21, which is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, facilitate the reflux of the liquid, and solve the problem of counter-gravity.

[0082] In some embodiments, in the first direction A1, the size of the capillary mesh in the second region 22 can be set to be larger than the size of the capillary mesh in the first region 21 to increase the thickness of the capillary structure in the second region 22, so that the thickness of the capillary structure in the second region 22 is greater than the thickness of the capillary structure in the first region 21, which is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, which is beneficial to the reflux of the liquid and solves the problem of inverse gravity. Taking the stacking of the first capillary mesh 261 and the second capillary mesh 262 as an example, the capillary mesh here refers to the structure after the first capillary mesh 261 and the second capillary mesh 262 are stacked. Exemplarily, the thickness of the first capillary mesh 261 in the second region 22 can be increased, and the thickness of the second capillary mesh 262 in the second region 22 can also be increased, or the thickness of the first capillary mesh 261 in the second region 22 and the thickness of the second capillary mesh 262 in the second region 22 are both increased. In other embodiments, the number of layers of the capillary mesh in the second region 22 can also be increased.

[0083] In some embodiments, the width W2 of the portion of the first capillary line 263 located in the second region 22 is greater than the width W1 of the portion of the first capillary line 263 located in the first region 21. In the embodiment of the present application, the width of the portion of the first capillary line 263 located in the second region 22 can be increased to increase the capillary force of the capillary structure of the second region 22, which is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, which is beneficial to the reflux of the liquid and solves the problem of inverse gravity.

[0084] In some embodiments, when the vapor chamber 20 includes the third region 23, the third cavity 273 is located in the third region 23, the third cavity 273 is interconnected with the first cavity 271 and the second cavity 272, the gas can diffuse from the first cavity 271 to the second cavity 272 and the third cavity 273, and the liquid can flow from the second cavity 272 and the third cavity 273 to the first cavity 271. The thickness of the third cavity 273 may be greater than or equal to the thickness of the first cavity 271.

[0085] In some embodiments, the thickness of the portion of the capillary structure located in the third region 23 may be greater than or equal to the thickness of the portion of the capillary structure located in the first region 21. When the thickness of the portion of the capillary structure located in the third region 23 is greater than the thickness of the portion of the capillary structure located in the first region 21, the thickness of the portion of the capillary line located in the third region 23 may be greater than the thickness of the portion of the capillary line located in the first region 21, or the thickness of the portion of the capillary mesh located in the third region 23 may be greater than the thickness of the portion of the capillary mesh located in the first region 21. The width of the portion of the capillary line located in the third region 23 may be greater than or equal to the width of the portion of the capillary line located in the first region 21.

[0086] Option 2: See Fig.15 and Fig.16 , Fig.15 is a partial structural schematic diagram of another type of heat spreader 20, Fig.15 The structure in FIG. 1 is a schematic diagram of the structure of the heat spreader 20 without the first cover plate 24 , in order to clearly illustrate the internal structure of the heat spreader 20 . Fig.16 Schematic diagram of the internal structure of the heat spreader 20 .

[0087] In some embodiments, the number of the first capillary lines 263 in the second region may be greater than or equal to two. In the embodiment of the present application, the number of capillary lines in the second region 22 of the vapor chamber 20 may be increased to increase the capillary force of the capillary structure in the second region 22, which is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, which is beneficial to the reflux of the liquid and solves the problem of inverse gravity.

[0088] In some embodiments, when the third region 23 is provided on the vapor chamber 20, the number of capillaries in the second region 22 may be greater than the number of capillaries in the third region 23. For example, there may be two first capillaries 263 in the second region 22, and there may be one second capillary line 264 in the third region 23. When there is a counter-gravity problem in the second region 22, by setting the number of capillaries in the second region 22 to be greater than the number of capillaries in the third region 23, it is beneficial to provide sufficient capillary force for the liquid in the second cavity 272, which is beneficial to the reflux of the liquid and solves the counter-gravity problem.

[0089] In some embodiments, the vapor chamber 20 may not include the third region 23 , that is, the vapor chamber 20 is not provided with the third cavity 273 . The embodiment of the present application does not limit the specific structure of the vapor chamber 20 .

[0090] Option 3: If Fig.11 , Fig.17 and Fig.18 As shown, Fig.17 is a schematic structural diagram of the first cover plate 24, Fig.18 FIG. 2 is a schematic diagram of the internal structure of another type of heat spreader 20 .

[0091] The heat spreader 20 may include a partition 28, and the partition 28 abuts between the second capillary mesh 262 and the first cover plate 24, that is, one side of the partition 28 abuts against the first cover plate 24, and the other side of the partition 28 abuts against the second capillary mesh 262. The partition 28 is located between the second cavity 272 and the third cavity 273, that is, between the second area 22 and the third area 23, and is used to isolate the second cavity 272 and the third cavity 273.

[0092] The partition 28 can be a hollow structure to reduce the weight of the heat spreader and achieve lightweight. The partition 28 can also be a solid structure. In the reverse gravity scenario, when the second cavity 272 has a reverse gravity problem, part of the liquid in the third cavity 273 will flow to the second cavity 272 under the action of its own gravity, causing the liquid to accumulate in the second cavity 272. The difficulty of the liquid in the second cavity 272 to flow back increases, resulting in a decrease in the heat dissipation capacity of the heat spreader 20. The embodiment of the present application isolates the second cavity 272 and the third cavity 273 by setting a partition 28 between the second cavity 272 and the third cavity 273, preventing the liquid in the third cavity 273 from flowing to the second cavity 272, so that the liquid in the third cavity 273 flows back to the first cavity 271 to achieve circulating heat dissipation. In addition, the partition 28 has a diversion effect on the liquid in the third cavity 273.

[0093] In some embodiments, the partition member 28 and the first cover plate 24 are integrally formed structures, which can omit the process of fixing the partition member 28 and the first cover plate 24, and the partition member 28 and the first cover plate 24 are integrally formed structures so that the first cover plate 24 and the partition member 28 are tightly connected, thereby preventing the first cover plate 24 and the partition member 28 from being loosely connected and causing a gap to cause the liquid in the third cavity 273 to flow into the second cavity 272. In other embodiments, the partition member 28 and the first cover plate 24 are split structures and fixedly connected.

[0094] In some embodiments, the surface of the partition member 28 facing the second cavity 272 is an arc-shaped surface, or the surface of the partition member 28 facing the third cavity 273 is an arc-shaped surface. It is also possible to set the surface of the partition member 28 facing the second cavity 272 to be an arc-shaped surface and the surface of the partition member 28 facing the third cavity 273 to be an arc-shaped surface. When the surface of the partition member 28 facing the third cavity 273 is an arc-shaped surface, the liquid in the third cavity 273 can flow to the first cavity 271 along the arc-shaped surface, avoiding the problem that the liquid accumulates seriously at the partition member 28 when the surface of the partition member 28 facing the third cavity 273 is a surface with a large bending angle, and cannot flow back to the first cavity 271 in time. In addition, the arc-shaped surface can reduce the resistance to the gas. The surface of the second cavity 272 is an arc-shaped surface and the surface of the partition member 28 facing the third cavity 273 is an arc-shaped surface, which can avoid the partition member 28 affecting the diffusion of the gas and affecting the heat dissipation effect of the heat spreader.

[0095] In some embodiments, see Fig.11 and Fig.17The partition member 28 includes a first end 281 and a second end 282 that are arranged opposite to each other. The first end 281 is closer to the first region 21 than the second end 282, and the second end 282 is fixedly connected to the inner side wall of the first cover plate 24. The dimension of the first end 281 in the second direction A2 is smaller than the dimension of the second end 282 in the second direction A2, and the second direction A2 is perpendicular to the first direction A1. The first end 281 has a smaller width than the second end 282, which is conducive to the liquid flowing quickly along the second end 282 to the first end 281 and converging in the first region 21, which is conducive to improving the heat dissipation capacity of the heat spreader 20.

[0096] See also Fig.11 and Fig.17 , the first cover plate 24 may be provided with a support column 242, one end of the support column 242 abuts against the side of the first cover plate 24 facing the second cover plate 25, and the other end of the support column 242 abuts against the second capillary mesh 262, so as to support between the first cover plate 24 and the second cover plate 25, forming a stable and closed cavity 27. The support column 242 can enhance the strength of the heat spreader 20. The number of the support columns 242 can be multiple, and the multiple support columns 242 can be arranged according to the size and shape of the heat spreader. For example, the support columns 242 can be arranged in an array or in an irregular arrangement. More support columns 242 can be distributed in the central area of ​​the heat spreader 20, and fewer support columns 242 can be distributed in the edge area of ​​the heat spreader 20. The shape of the support column 242 is not limited to a cylindrical structure, and the support column 242 can also be a strip structure.

[0097] In some embodiments, the first capillary wire 263 and the second capillary wire 264 are staggered with the support column 242 and the partition 28. For example, the first capillary wire 263 and the second capillary wire 264 can be distributed in the gaps between the plurality of support columns 242, and the first capillary wire 263 and the second capillary wire 264 can be arranged at intervals with the partition 28.

[0098] Option 4: If Fig.19 and Fig. 20 As shown, Fig.19 is a partial structural schematic diagram of another type of heat spreader 20, Fig.19 The structure in FIG. 1 is a schematic diagram of the structure of the heat spreader 20 without the first cover plate 24 , in order to clearly illustrate the internal structure of the heat spreader 20 . Fig. 20 2 is a schematic diagram of the internal structure of the heat plate 20. It can be understood that Fig. 20 and Fig.13 The difference is that Fig. 20 The first capillary line 263 in FIG. 2 is closer to the right side.

[0099] The second region 22 may include a first side 221 and a second side 222, the temperature of the first side 221 is lower than the temperature of the second side 222, and the portion of the first capillary line 263 located in the second region 22 is located on the first side 221. The first side 221 is closer to the first region 21 than the second side 222. A heat sink 105 is usually provided in an electronic device, and the heat sink 105 is disposed on the first side 221 and blows heat energy toward the second side 222 to move the heat energy away from the heat spreader 20. Therefore, the temperature of the first side 221 is lower than the temperature of the second side 222. In the reverse gravity scenario, when the second cavity 272 has a reverse gravity problem, by disposing the portion of the first capillary line 263 located in the second region 22 on the first side 221 with a lower temperature, it is beneficial to quickly reflux the liquid in the second cavity 272, avoid the accumulation of liquid in the second cavity 272, and effectively solve the reverse gravity problem. It can be understood that the gas is more easily liquefied into liquid on the first side 221 with a lower temperature than on the second side 222 with a higher temperature. By setting the portion of the first capillary 263 located in the second region 22 on the first side 221 where the gas is easier to liquefy, the liquid liquefied on the first side 221 can be promptly and quickly returned to the first cavity 271.

[0100] In some embodiments, the third region 23 may include a third side 231 and a fourth side 232, the temperature of the third side 231 is lower than the temperature of the fourth side 232, and the portion of the second capillary 264 located in the third region 23 is located on the fourth side. The third side 231 is closer to the first region 21 than the fourth side 232. A heat sink 105 is usually provided in the electronic device, and the heat sink 105 is disposed on the third side 231 and blows heat energy toward the second side 222 to keep the heat energy away from the vapor chamber 20. The portion of the first capillary 263 located in the second region 22 is located on the first side 221 with a lower temperature, and the portion of the second capillary 264 located in the third region 23 is located on the fourth side 232 with a higher temperature, so that the first capillary 263 and the second capillary 264 are arranged in a staggered manner, and the second capillary 264 serves to isolate the second cavity 272 and the third cavity 273, thereby preventing part of the liquid in the third cavity 273 from flowing to the second cavity 272, which is conducive to the liquid in the third cavity 273 flowing back to the first cavity 271, thereby improving the heat dissipation capacity of the heat spreader 20. In addition, the staggered arrangement of the first capillary 263 and the second capillary 264 isolates the second cavity 272 and the third cavity 273, which is conducive to the completion of the vacuuming process, can improve the vacuum degree in the cavity, and improve the heat dissipation capacity of the heat spreader 20.

[0101] like Fig.21 and Fig. 22 As shown, Fig.21 is a partial structural schematic diagram of another type of heat spreader 20, Fig.21 The structure in FIG. 1 is a schematic diagram of the structure of the heat spreader 20 without the first cover plate 24 , in order to clearly illustrate the internal structure of the heat spreader 20 . Fig. 22 2 is a schematic diagram of the internal structure of the heat spreader 20. When there are two first capillaries 263 in the second region 22, both first capillaries 263 can be disposed close to the first side 221 to return the liquid liquefied on the first side 221 to the first cavity 271 in a timely and rapid manner.

[0102] like Fig.23 As shown, Fig.23 FIG. 2 is a schematic diagram of the structure of another type of heat spreader 20 . Fig.23 (a1) means that the thickness of the second cavity 272 is greater than the thickness of the first cavity 271, two first capillaries 263 are arranged in the second region 22, and both first capillaries 263 can be arranged close to the first side 221 with a lower temperature, so as to promptly and quickly return the liquid liquefied on the first side 221 to the first cavity 271. Fig.23 (a2) means that the thickness of the second cavity 272 is greater than that of the first cavity 271, and a partition 28 is provided to isolate the second cavity 272 and the third cavity 273 to prevent the liquid in the third cavity 273 from flowing to the second cavity 272, so that the liquid in the third cavity 273 flows back to the first cavity 271 to achieve circulating heat dissipation. Fig.23 (a3) means that the thickness of the second cavity 272 is greater than that of the first cavity 271. The first capillary 263 is arranged on the first side 221 where the temperature is lower, which is conducive to the rapid reflux of the liquid in the second cavity 272 and avoids the accumulation of liquid in the second cavity 272, which can effectively solve the problem of reverse gravity. In addition, the first capillary 263 and the second capillary 264 are arranged in a staggered manner to isolate the second cavity 272 and the third cavity 273, which is conducive to the completion of the vacuum process and can improve the vacuum degree in the cavity.

[0103] Fig.23 The difference between (a1), (a2) and (a3) ​​in the above embodiment is that the external shape of the heat spreader 20 is different. The heat spreader 20 in the above embodiment is Y-shaped. Fig.23 The heat spreader 20 in the embodiment of the present application can be of various shapes, which is not limited in the present application. Fig.23 The heat spreader 20 in the embodiment may also adopt other aforementioned designs except (a1), (a2) and (a3) ​​to solve the heat dissipation problem of the heat spreader 20.

[0104] like Fig.24 As shown, Fig.24 FIG. 2 is a schematic diagram of the structure of another type of heat spreader 20 . Fig.24(b1) means that the thickness of the second cavity 272 is greater than the thickness of the first cavity 271, two first capillaries 263 are arranged in the second region 22, and both first capillaries 263 can be arranged close to the first side 221 with a lower temperature, so as to promptly and quickly return the liquid liquefied on the first side 221 to the first cavity 271. Fig.24 (b2) in which the thickness of the second cavity 272 is greater than that of the first cavity 271, and a partition 28 is provided to isolate the second cavity 272 and the third cavity 273 to prevent the liquid in the third cavity 273 from flowing to the second cavity 272, so that the liquid in the third cavity 273 flows back to the first cavity 271 to achieve circulating heat dissipation. Fig.24 (b3) means that the thickness of the second cavity 272 is greater than that of the first cavity 271. The first capillary 263 is arranged on the first side 221 where the temperature is lower, which is conducive to the rapid reflux of the liquid in the second cavity 272 and avoids the accumulation of liquid in the second cavity 272, which can effectively solve the problem of reverse gravity. In addition, the first capillary 263 and the second capillary 264 are arranged in a staggered manner to isolate the second cavity 272 and the third cavity 273, which is conducive to the completion of the vacuum process and can improve the vacuum degree in the cavity.

[0105] Fig.24 The difference between (b1), (b2) and (b3) in the above-mentioned embodiment is that the external shape of the heat spreader 20 is different. Fig.24 The heat spreader 20 is square in shape as a whole (it can be understood that the square shape can be a rectangle or a square, and a notch can be provided on the square heat spreader 20 as needed). The heat spreader 20 in the embodiment of the present application can be of various shapes, and the present application does not limit this. Fig.24 The heat spreader 20 in the embodiment may also adopt other aforementioned designs except (b1), (b2) and (b3) to solve the heat dissipation problem of the heat spreader 20.

[0106] In the embodiment of the present application, the thickness of the second cavity 272 is set to be greater than the thickness of the first cavity 271, that is, the unequal thickness design of the cavity 27 increases the size of the second cavity 272 for heat dissipation of the heating element, so that the air resistance of the gas in the second cavity 272 is small and the flow capacity is increased, which is conducive to the timely and rapid diffusion of the gas to the second cavity 272, and is conducive to improving the heat dissipation efficiency of the heat spreader 20 to improve the heat dissipation capacity of the heat spreader 20. In the embodiment of the present application, by setting the size of the part of the capillary structure located in the second area 22 to increase the capillary force of the capillary structure of the second area 22; increasing the number of capillary lines in the second area 22 to increase the capillary force of the capillary structure of the second area 22; setting the partition 28; setting the first capillary line 263 on the first side 221 with a lower temperature, and staggering the first capillary line 263 and the second capillary line 264, etc., it can solve the problem of poor heat dissipation of the heat spreader 20 in the reverse gravity scene and improve the heat dissipation efficiency and heat dissipation capacity of the heat spreader 20. It can be understood that the heat spreader 20 in the embodiment of the present application can achieve good heat dissipation effect on the heat generating components in both reverse gravity scenarios and non-reverse gravity scenarios, and the user can obtain a good usage experience in any usage scenario.

[0107] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat spreader, applied to electronic equipment, characterized in that: It includes a first cover plate, a second cover plate and a capillary structure; The edge of the first cover plate is fixedly connected to the edge of the second cover plate to form a closed cavity between the first cover plate and the second cover plate; The capillary structure is located in the cavity, and the capillary structure is used to guide the flow of liquid in the cavity; The cavity comprises a first cavity and a second cavity which are interconnected, the first cavity is located in a first area of ​​the vapor chamber, the second cavity is located in a second area of ​​the vapor chamber, and the first area is used to connect a heating element of the electronic device; A size of the second cavity in a first direction is greater than a size of the first cavity in the first direction, and the first direction is an arrangement direction of the first cover plate and the second cover plate.

2. The heat spreader according to claim 1, wherein: In the first direction, a size of a portion of the capillary structure located in the second region is larger than a size of a portion of the capillary structure located in the first region.

3. The heat spreader according to claim 1 or 2, characterized in that: The capillary structure comprises a capillary net and a capillary line, wherein the capillary net is fixed to the second cover plate, and the capillary line is fixed to a side of the capillary net facing the first cover plate; In the first direction, the size of the capillary line in the second area is larger than that in the first area, or, in the first direction, the size of the capillary net in the second area is larger than that in the first area.

4. The heat spreader according to claim 1 or 2, characterized in that: The capillary structure includes a capillary mesh and a capillary wire, the capillary mesh is fixed to the second cover plate, the capillary wire is fixed to the side of the capillary mesh facing the first cover plate, and the width of the portion of the capillary wire located in the second area is greater than the width of the portion of the capillary wire located in the first area.

5. The vapor chamber according to claim 1, wherein: The capillary structure includes a capillary mesh and capillary wires. The capillary mesh is fixed to the second cover plate. The capillary wires are fixed to a side of the capillary mesh facing the first cover plate. The number of the capillary wires in the second area is greater than or equal to two.

6. The vapor chamber according to any one of claims 1 to 5, characterized in that: The cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, and the third cavity is located in a third area of ​​the vapor chamber; The vapor chamber includes a partition member, which is located between the second cavity and the third cavity and is used to isolate the second cavity from the third cavity.

7. The vapor chamber according to claim 6, wherein: The surface of the partition member facing the second cavity is a curved surface, or the surface of the partition member facing the third cavity is a curved surface.

8. The vapor chamber according to claim 7, wherein: The partition member includes a first end and a second end that are arranged opposite to each other, the first end is closer to the first area than the second end, a dimension of the first end in a second direction is smaller than a dimension of the second end in the second direction, and the second direction is perpendicular to the first direction.

9. The vapor chamber according to any one of claims 6 to 8, characterized in that: The capillary structure includes a capillary mesh and a capillary thread, the capillary mesh is fixed to the second cover plate, the capillary thread is fixed to the side of the capillary mesh facing the first cover plate, one side of the partition piece abuts against the first cover plate, and the other side of the partition piece abuts against the capillary mesh.

10. The vapor chamber according to claim 9, wherein: The partition member and the first cover plate are an integrally formed structure.

11. The vapor chamber according to claim 1, wherein: The capillary structure comprises a capillary mesh and a first capillary line, wherein the capillary mesh is fixed to the second cover plate, the first capillary line is fixed to a side of the capillary mesh facing the first cover plate, and at least part of the first capillary line is located in the second area; The second region includes a first side and a second side, the temperature of the first side is lower than the temperature of the second side, and a portion of the first capillary line located in the second region is located on the first side.

12. The vapor chamber according to claim 11, wherein: The cavity includes a third cavity, the third cavity is interconnected with the first cavity and the second cavity, and the third cavity is located in a third area of ​​the vapor chamber; The capillary structure further includes a second capillary line, at least part of which is located in the third area; The third region includes a third side and a fourth side, the temperature of the third side is lower than the temperature of the fourth side, and a portion of the second capillary line located in the third region is located on the fourth side.

13. The vapor chamber according to claim 1, wherein: The material of the first cover plate or the second cover plate is at least one of stainless steel, copper, and titanium.

14. The vapor chamber according to claim 1, wherein: The first region is used for absorbing heat, and the second region is used for dissipating heat.

15. An electronic device, characterized in that: It comprises a heat generating element and a heat sink as claimed in any one of claims 1 to 14, wherein the heat generating element is connected to the heat sink, and the heat energy of the heat generating element is conducted to the heat sink.

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