Display panel

Abstract

The invention discloses a display panel. The display panel comprises a display area and a peripheral area located on at least one side of the display area. The display panel comprises a substrate, a first inorganic layer, a first organic layer and a packaging layer, the first organic layer comprises a planarization layer arranged in a display area and a retaining wall structure arranged in a peripheral area, the display panel further comprises a stacking structure, and the stacking structure comprises an inorganic sub-layer, an organic sub-layer and an inorganic sub-layer which are sequentially stacked. The organic sub-layers and the retaining wall structures in the stacked structure are arranged at intervals, the packaging layer is in contact with the first inorganic layer at the intervals, the organic sub-layers are arranged between the two adjacent inorganic sub-layers, the stacked inorganic sub-layers can be split to form an inorganic / organic / inorganic multi-layer repeated stacked structure, and the organic / organic / inorganic multi-layer repeated stacked structure is formed. And the risk of generating cracks in the cutting process of the inorganic stack-up structure is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel. Background Art

[0002] In the process of preparing organic electroluminescent display panels, in order to improve production efficiency and reduce production costs, a single organic electroluminescent display panel is generally obtained by cutting after being prepared as a whole on a display motherboard. The overall thin covering encapsulation layer in the preparation process of the display motherboard is generally an encapsulation inorganic layer, which is prepared by a chemical vapor deposition process. Since there is a certain gap between the mask and the display motherboard, the reaction gas can penetrate the gap into the partial area blocked by the mask and form a shadow in this area.

[0003] If the shadow covers the cutting path, the thickness of the inorganic film at the cutting point will increase, resulting in edge cracks during cutting. The edge cracks extend along the encapsulation inorganic layer to the display area and cause failure of the panel edge. In order to ensure the cutting yield, the distance from the chemical vapor deposition edge to the cutting path is usually increased to avoid the shadow covering the cutting path. However, as the frame continues to compress, the shadow will cover the cutting path. The narrower the frame, the thicker the shadow, the greater the risk of cutting cracks, which greatly affects the life of the display panel. Summary of the invention

[0004] An embodiment of the present invention provides a display panel to solve the technical problem that a shadow in an existing display panel covers a cutting path, resulting in cutting cracks.

[0005] To solve the above problems, the technical solution provided by the present invention is as follows:

[0006] The present invention provides a display panel, comprising a display area and a peripheral area located on at least one side of the display area, the display panel comprising:

[0007] substrate;

[0008] A first inorganic layer is disposed on one side of the substrate;

[0009] A first organic layer is disposed on a side of the first inorganic layer away from the substrate, the first organic layer comprising a planarization layer disposed in the display area and a retaining wall structure disposed in the peripheral area; and

[0010] An encapsulation layer, disposed on a side of the first organic layer away from the substrate;

[0011] Among them, the display panel also includes a stacking structure arranged in the peripheral area and located on the side of the retaining wall structure away from the display area, the stacking structure includes an inorganic sublayer, an organic sublayer and an inorganic sublayer stacked in sequence, there is a gap between the organic sublayer and the retaining wall structure, and the encapsulation layer is in contact with the first inorganic layer at the gap.

[0012] According to the display panel provided by the present invention, the encapsulation layer comprises a first inorganic encapsulation layer, a first organic encapsulation layer and a second inorganic encapsulation layer which are sequentially stacked;

[0013] The first inorganic encapsulation layer covers the display area and extends to cover the retaining wall structure, and the first inorganic encapsulation layer is in contact with the first inorganic layer at the interval.

[0014] According to the display panel provided by the present invention, the first organic layer further comprises a first organic filling layer arranged on a side of the retaining wall structure away from the display area;

[0015] The stacked structure includes the first inorganic layer, the first organic filling layer and the first inorganic encapsulation layer which are stacked in sequence.

[0016] According to the display panel provided by the present invention, the first inorganic layer includes at least one groove arranged on a side of the retaining wall structure away from the display area;

[0017] Wherein, the first organic filling layer covers the groove.

[0018] According to the display panel provided by the present invention, the first organic layer further includes:

[0019] a pixel definition layer, disposed on a side of the planarization layer away from the substrate; and

[0020] A support column, disposed on a side of the pixel definition layer away from the substrate;

[0021] The first organic filling layer includes an organic material that is the same as a combination of one or more of the planarization layer, the pixel definition layer and the support column.

[0022] According to the display panel provided by the present invention, the stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulation layer, the second organic filling layer and the second inorganic encapsulation layer which are stacked in sequence;

[0023] Wherein, the second organic filling layer comprises the same organic material as the organic encapsulation layer.

[0024] According to the display panel provided by the present invention, the display panel further includes:

[0025] A second inorganic layer is disposed on a side of the encapsulation layer away from the substrate; and

[0026] A third organic filling layer is disposed between the second inorganic layer and the encapsulation layer and is located on a side of the retaining wall structure away from the display area;

[0027] The stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulation layer, the second organic filling layer, the second inorganic encapsulation layer, the third organic filling layer and the second inorganic layer stacked in sequence, and the third organic filling layer includes the same organic material as the organic encapsulation layer.

[0028] According to the display panel provided by the present invention, the stacked structure comprises the first inorganic encapsulation layer, the second organic filling layer and the second inorganic encapsulation layer which are stacked in sequence;

[0029] Wherein, the second organic filling layer comprises the same organic material as the organic encapsulation layer.

[0030] According to the display panel provided by the present invention, the first inorganic layer also includes at least one groove arranged on the side of the retaining wall structure away from the display area, and the first organic layer also includes an anti-crack layer arranged between the retaining wall structure and the stacking structure, and the anti-crack layer covers the groove.

[0031] According to the display panel provided by the present invention, the thickness of the organic sublayer is in the range of 2 micrometers to 10 micrometers.

[0032] The beneficial effects of the present invention are as follows: the display panel provided by the present invention comprises a first inorganic layer, a first organic layer and an encapsulation layer, the first organic layer comprises a planarization layer arranged in the display area and a retaining wall structure arranged in the peripheral area, and a stacking structure is arranged in the peripheral area, the stacking structure is located on the side of the retaining wall structure away from the display area, the stacking structure comprises an inorganic sublayer, an organic sublayer and an inorganic sublayer stacked in sequence, there is a gap between the organic sublayer and the retaining wall structure, the encapsulation layer contacts the first inorganic layer at the gap to form a complete package; the organic sublayer in the stacking structure is arranged between two adjacent inorganic sublayers, so that the stacking structure is an inorganic / organic / inorganic multi-layer repeated stacking structure, which is equivalent to splitting the stacked inorganic film layers into multiple layers of inorganic sublayers. When the display motherboard is cut, the risk of cracks in the stacking structure during the cutting process is greatly reduced, which is beneficial to improving the performance of the light-emitting device of the display panel and extending its service life while achieving an extremely narrow frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0034] Figure 1A is a schematic diagram of a top view structure of a display panel provided by an embodiment of the present invention;

[0035] Figure 1B is a schematic diagram of a top view structure of a display motherboard provided by an embodiment of the present invention;

[0036] Figure 2A yes Figure 1B Schematic diagram of the first cross-sectional structure along AA;

[0037] Figure 2B is a schematic diagram of a first cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0038] Figure 3 yes Figure 1B Schematic diagram of the local cross-section structure at point B;

[0039] Figure 4A yes Figure 1B Schematic diagram of the second cross-sectional structure along AA;

[0040] Figure 4B is a schematic diagram of a second cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0041] Figure 5A yes Figure 1B Schematic diagram of the third cross-sectional structure along AA;

[0042] Figure 5B is a schematic diagram of a third cross-sectional structure of a display panel provided by an embodiment of the present invention;

[0043] Fig. 6A yes Figure 1B Schematic diagram of the fourth cross-sectional structure along AA;

[0044] Figure 6B It is a schematic diagram of a fourth cross-sectional structure of a display panel provided by an embodiment of the present invention.

[0045] Description of reference numerals:

[0046] 100, display motherboard; 200, display panel; 300, substrate;

[0047] 1a, display area; 1b, peripheral area; 1c, cutting area; 201, first inorganic layer; 202, first organic layer; 203, second inorganic layer; 204, substrate;

[0048] 10. stacking structure; 10a. inorganic sublayer; 11a. organic sublayer; 111. first organic filling layer; 112. second organic filling layer; 113. third organic filling layer; 114. retaining wall structure; 12. groove; 13. second inorganic layer; 14. anti-cracking layer;

[0049] 20. driving circuit layer; 21. light-emitting device layer; 211. pixel definition layer; 212. anode layer; 213. light-emitting functional layer; 22. support column; 23. encapsulation layer; 231. first inorganic encapsulation layer; 232. second inorganic encapsulation layer; 233. organic encapsulation layer; 24. touch layer; 241. first insulating layer; 242. touch electrode; 243. second insulating layer;

[0050] 101, semiconductor layer; 102, first gate insulating layer; 103, first gate layer; 104, second gate insulating layer; 105, second gate layer; 106, interlayer dielectric layer; 107, first source and drain metal layer; 108, first planarization layer; 109, second source and drain metal layer; 110, second planarization layer. DETAILED DESCRIPTION

[0051] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention. In the present invention, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the drawings; while "inside" and "outside" refer to the outline of the device.

[0052] See also Figure 1A and Figure 1B , Figure 1A is a schematic diagram of a top view structure of a display panel provided by an embodiment of the present invention, Figure 1B The embodiment of the present invention provides a display panel 200, which includes a display area 1a and a peripheral area 1b located at least on one side of the display area 1a.

[0053] The display panel 200 is cut from the display motherboard 100. Figure 1B As shown, the display motherboard 100 includes a substrate 300 and a plurality of display panels 200 disposed on one side of the substrate 300, and the display panels 200 are formed by cutting the display motherboard 100. Specifically, the display motherboard 100 includes a cutting area 1c, and the cutting area 1c is provided with cutting roads, and the display motherboard 100 is cut along the cutting roads to form a plurality of independent display panels 200. In this embodiment, the cutting process used can be wheel cutting or laser cutting or a combination of the two methods.

[0054] See also Figure 2A and Figure 2B , Figure 2A yes Figure 1B Schematic diagram of the first cross-sectional structure along AA, Figure 2B is a schematic diagram of a first cross-sectional structure of a display panel provided by an embodiment of the present invention, Figure 2A is a cross-sectional view of the display motherboard 100 before cutting, Figure 2B is a cross-sectional view of the display panel 200 after cutting.

[0055] The display panel 200 includes a substrate 204, a first inorganic layer 201, a first organic layer 202, and an encapsulation layer 23. The first inorganic layer 201 is disposed on one side of the substrate 204. The first organic layer 202 is disposed on a side of the first inorganic layer 201 away from the substrate 204, and the first organic layer 202 includes a planarization layer disposed in the display area 1a and a retaining wall structure 114 disposed in the peripheral area 1b. The encapsulation layer 23 is disposed on a side of the first organic layer 202 away from the substrate 204.

[0056] The display panel 200 further includes a stacked structure 10 disposed in the peripheral area 1b and located on a side of the retaining wall structure 114 away from the display area 1a, the stacked structure 10 includes an inorganic sublayer 10a, an organic sublayer 11a and an inorganic sublayer 10a stacked in sequence. There is a gap between the organic sublayer 11a and the retaining wall structure 114, and the encapsulation layer 23 contacts the first inorganic layer 201 at the gap.

[0057] It is understandable that as the frame is continuously compressed, the shadow will cover the cutting path. The narrower the frame, the thicker the shadow, that is, the thicker the inorganic stacked structure located in the cutting area 1c, which leads to a greater risk of cutting cracks. The present invention adds an organic sublayer 11a to the stacked structure 10, and the organic sublayer 11a is arranged between two adjacent layers of the inorganic sublayers 10a, so that the stacked structure 10 is an inorganic / organic / inorganic multi-layer repeated stacked structure, which is equivalent to splitting the stacked inorganic film layers into multiple layers of inorganic sublayers 10a. When the display motherboard 100 is cut, the risk of cracks in the stacked structure 10 during the cutting process is greatly reduced. While achieving an extremely narrow frame, it is beneficial to improve the performance of the light-emitting device of the display panel 200 and extend its service life.

[0058] It should be noted that Figure 2B The display area 1a and the peripheral area 1b are schematically distinguished by dotted lines. The display area 1a is used to set the light-emitting unit and the pixel circuit that drives the light-emitting unit to emit light. The peripheral area 1b is the border area of ​​the display panel 200 and is used to set the driving circuit and various signal lines.

[0059] The substrate 204 and the base plate 300 may be the same film layer, and the substrate 204 is cut from the base plate 300. In this embodiment, the substrate 204 may be a flexible substrate, which may be a structure having a single layer or multiple layers of flexible organic films, and may resist stress impact to a certain extent, thereby reducing the risk of cracks in the stacked structure 10 on the substrate 204 during the cutting process.

[0060] Optionally, the flexible substrate can be made of flexible substrate materials such as polyimide (PI), polyethylene terephthalate (PET), polybutylene naphthalate (PBN) or polycarbonate. In this embodiment, the flexible substrate uses a single-layer PI film. In other embodiments of the present invention, the flexible substrate can be a multi-layer PI film, or a multi-layer PET film, or a multi-layer film structure having PI films and PET alternately stacked.

[0061] The encapsulation layer 23 is used to protect the light-emitting unit. The encapsulation layer 23 adopts a thin film encapsulation method. The encapsulation layer 23 can adopt an inorganic / organic / inorganic multi-layer encapsulation structure. For example, in this embodiment, the encapsulation layer 23 includes a first inorganic encapsulation layer 231, a second inorganic encapsulation layer 232 and an organic encapsulation layer 233 which are stacked in sequence in a direction away from the substrate 204. The first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 extend from the display area 1a and cover the peripheral area 1b, and the organic encapsulation layer 233 covers the display area 1a.

[0062] The first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 extend from the display area 1a to the peripheral area 1b and cover the retaining wall structure 114. The first inorganic encapsulation layer 231 contacts the first inorganic layer 201 at the interval, thereby forming a complete encapsulation and encapsulating and protecting the wiring in the peripheral area 1b, playing a major role in blocking the intrusion of water and oxygen, thereby improving the encapsulation effect.

[0063] Optionally, the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 may be made of nitride, oxide, oxynitride, nitrate, carbide or any combination thereof.

[0064] The first organic encapsulation layer 233 usually terminates at the retaining wall structure 114, and plays a role in assisting encapsulation and planarization. Optionally, the first organic encapsulation layer 233 can be made of acrylic, hexamethyldisiloxane, polyacrylate, polycarbonate, polystyrene and other materials.

[0065] In an embodiment of the present invention, the first organic layer 202 also includes a first organic filling layer 111 arranged on the side of the retaining wall structure 114 away from the display area 1a. In this case, the stacked structure 10 includes the first inorganic layer 201, the first organic filling layer 111 and the first inorganic encapsulation layer 231 stacked in sequence.

[0066] It can be understood that the first inorganic layer 201 and the first inorganic encapsulation layer 231 in the prior art are in direct contact in the peripheral area 1b. At this time, the two inorganic layers are stacked, which is equivalent to a thicker inorganic film layer, resulting in a greater risk of cracks during the cutting process. The present invention arranges the first organic filling layer 111 between the first inorganic layer 201 and the first inorganic encapsulation layer 231, so that the first inorganic layer 201 and the first inorganic encapsulation layer 231 are arranged at intervals without direct contact, which is equivalent to splitting the inorganic stack composed of the first inorganic layer 201 and the first inorganic encapsulation layer 231, so that the stacked structure 10 is an inorganic / organic / inorganic film layer structure, which is equivalent to splitting a thicker inorganic film layer into two thinner inorganic sub-layers 10a, reducing the risk of cracks during the cutting process.

[0067] It should be noted that the first organic filling layer 111 is an organic film layer, which can play a stress buffering role, further reducing the risk of cracks during the cutting process.

[0068] Furthermore, the first inorganic layer 201 includes at least one groove 12 disposed on a side of the retaining wall structure 114 away from the display area 1a, and the first organic filling layer 111 covers the groove 12. The groove 12 is used to prevent the cutting crack from extending from the peripheral area 1b to the display area 1a, thereby reducing the risk of failure of the light-emitting unit located in the display area 1a.

[0069] It should be noted that the thickness of each organic sublayer 11a is in the range of 2 microns to 10 microns. The reason for setting the thickness in this range is that, on the one hand, the organic sublayer 11a needs to play a buffering role, so the thickness of each organic sublayer 11a cannot be too thin; on the other hand, when cutting the display motherboard 100, the organic sublayer 11a is too thick and easy to stick. Preferably, the thickness of each organic sublayer 11a is in the range of 5 microns to 10 microns.

[0070] Specifically, see Figure 3 , Figure 3 yes Figure 1B Schematic diagram of a partial cross-sectional structure at B. The display panel 200 includes a driving circuit layer 20 and a light-emitting device layer 21, wherein the light-emitting device layer 21 is located on a side of the driving circuit layer 20 away from the substrate 204 and located in the display area 1a, and the encapsulation layer 23 covers the side of the light-emitting device layer 21 away from the substrate 204, the light-emitting device layer 21 includes a plurality of light-emitting units, and the driving circuit layer 20 includes a plurality of pixel driving circuits for driving the light-emitting units to emit light, and the pixel driving circuit includes a plurality of thin film transistors.

[0071] The driving circuit layer 20 includes an inorganic film layer and an organic film layer. Specifically, the driving circuit layer 20 may include multiple inorganic film layers and multiple organic film layers. In the embodiment of the present invention, the first inorganic layer 201 may be one of the inorganic film layers in the driving circuit layer 20, or a combination of multiple inorganic film layers, and the first organic layer 202 may be one of the organic film layers in the driving circuit layer 20, or a combination of multiple organic film layers.

[0072] In this embodiment, the thin film transistor may be an etch-stop type, a back-channel etch type, a top-gate type thin film transistor or the like, and there is no specific limitation.

[0073] like Figure 3 As shown, in the embodiment of the present invention, taking the thin film transistor as a top-gate thin film transistor as an example, the driving circuit layer 20 includes a semiconductor layer 101, a first gate insulating layer 102, a first gate layer 103, a second gate insulating layer 104, a second gate layer 105, an interlayer dielectric layer 106, a first source and drain metal layer 107, a first planarization layer 108, a second source and drain metal layer 109 and a second planarization layer 110.

[0074] The semiconductor layer 101 is located on one side of the substrate 204, the first gate insulating layer 102 covers the side of the semiconductor layer 101 away from the substrate 204, the first gate layer 103 is located on the side of the first gate insulating layer 102 away from the substrate 204, the second gate insulating layer 104 covers the side of the first gate layer 103 away from the substrate 204, the second gate layer 105 is located on the side of the second gate insulating layer 104 away from the substrate 204, the interlayer dielectric layer 106 covers the side of the second gate layer 105 away from the substrate 204, the first source and drain metal layer 107 is located on the side of the interlayer dielectric layer 106 away from the substrate 204, the first planarization layer 108 covers the side of the first source and drain metal layer 107 away from the substrate 204, the second source and drain metal layer 109 is located on the side of the first source and drain metal layer 107 away from the substrate 204, and the second planarization layer 110 covers the side of the second source and drain metal layer 109 away from the substrate 204.

[0075] In this embodiment, the first inorganic layer 201 may include a combination of one or more layers of the first gate insulating layer 102, the second gate insulating layer 104 and the interlayer dielectric layer 106, and the first organic layer 202 may include a combination of one or more layers of the first planarization layer 108 and the second planarization layer 110.

[0076] Specifically, the light-emitting device layer 21 includes a pixel definition layer 211, which is disposed on the side of the second planarization layer 110 away from the substrate 204, and the pixel definition layer 211 is an organic film layer. The light-emitting device layer 21 also includes an anode layer 212, a light-emitting functional layer 213 and a cathode layer (not shown in the figure), and the pixel definition layer 211 defines a plurality of pixel openings, and the light-emitting functional layer 213 is located in the pixel openings. The light-emitting functional layer 213 may also include an electron injection layer, an electron transport layer, a light-emitting layer, a hole transport layer and a hole injection layer between the anode layer 212 and the cathode layer.

[0077] The display panel 200 further includes a plurality of support columns 22 . The support columns 22 are disposed on a side of the pixel definition layer 211 away from the substrate 204 and located in the display area 1 a . The support columns 22 are made of organic material.

[0078] In this embodiment, the first organic filling layer 111 may include any one or more of the planarization layer, the pixel definition layer 211 and the support column 22 using the same material, that is, the first organic filling layer 111 may be prepared and formed with the same process as the planarization layer, the pixel definition layer 211 and the support column 22, which is beneficial to reduce the process.

[0079] Specifically, any one or more of the first organic filling layer 111 including the first planarization layer 108 , the second planarization layer 110 , the pixel definition layer 211 and the support column 22 are made of the same material.

[0080] In one embodiment, see Figure 4A and Figure 4B , Figure 4A yes Figure 1B Schematic diagram of the second cross-sectional structure along AA, Figure 4B It is a schematic diagram of a second cross-sectional structure of a display panel provided by an embodiment of the present invention. Figure 4A and Figure 4B and Figure 2A and Figure 2B The difference is that the stacked structure 10 further includes a second organic filling layer 112 disposed between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 .

[0081] In this case, the stacked structure 10 includes the first inorganic layer 201 , the first organic filling layer 111 , the first inorganic encapsulating layer 231 , the second organic filling layer 112 , and the second inorganic encapsulating layer 232 which are sequentially stacked.

[0082] It can be understood that in the peripheral area 1b, if the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 are in direct contact, the two film layers are equivalent to a thicker inorganic film layer, which easily leads to a greater risk of cracks during the cutting process. The present invention arranges the second organic filling layer 112 so that the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232 are arranged at intervals without direct contact, which is equivalent to splitting the thicker inorganic film layer formed by stacking the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232, so that the stacking structure 10 has an inorganic / organic / inorganic organic / inorganic film structure, reducing the risk of cracks during the cutting process.

[0083] Likewise, the second organic filling layer 112 is an organic film layer, which can play a stress buffering role, further reducing the risk of cracks during the cutting process.

[0084] In this embodiment, the second organic filling layer 112 may include the same organic material as the organic encapsulation layer 233, that is, structurally, the second organic filling layer 112 may be arranged in the same layer as the organic encapsulation layer 233; from a process perspective, the second organic filling layer 112 and the organic encapsulation layer 233 are formed using the same process, which is beneficial to reducing the process and reducing costs.

[0085] In one embodiment, see Figure 5A and Figure 5B , Figure 5A yes Figure 1B Schematic diagram of the third cross-sectional structure along AA, Figure 5B It is a schematic diagram of a third cross-sectional structure of a display panel provided by an embodiment of the present invention. Figure 5A and Figure 5B and Figure 4A and Figure 4B The difference is that the display panel 200 also includes a second inorganic layer 203 and a third organic filling layer 113, the second inorganic layer 203 is arranged on the side of the encapsulation layer 23 away from the substrate 204, and the third organic filling layer 113 is arranged between the second inorganic layer 203 and the encapsulation layer 23 and is located on the side of the retaining wall structure 114 away from the display area 1a.

[0086] In this case, the stacked structure 10 includes the first inorganic layer 201, the first organic filling layer 111, the first inorganic encapsulation layer 231, the second organic filling layer 112, the second inorganic encapsulation layer 232, the third organic filling layer 113 and the second inorganic layer 203 which are stacked in sequence.

[0087] It is understandable that in the peripheral area 1b, if the second inorganic encapsulation layer 232 and the second inorganic layer 203 are in direct contact, the two film layers are equivalent to a thicker inorganic film layer, which easily leads to a greater risk of cracks during the cutting process. The present invention arranges the third organic filling layer 113 so that the second inorganic encapsulation layer 232 and the second inorganic layer 203 are spaced apart without direct contact, which is equivalent to splitting the thicker inorganic film layer formed by stacking the second inorganic encapsulation layer 232 and the second inorganic layer 203, so that the stacking structure 10 has an inorganic / organic / inorganic / organic / inorganic / organic / inorganic film layer structure, reducing the risk of cracks during the cutting process.

[0088] Likewise, the third organic filling layer 113 is an organic film layer, which can play a stress buffering role, further reducing the risk of cracks during the cutting process.

[0089] Please refer again Figure 3 The display panel 200 further includes a touch layer 24, which is disposed on a side of the encapsulation layer 23 away from the substrate 204. The touch layer 24 includes a first insulating layer 241, a touch electrode 242, and a second insulating layer 243. The first insulating layer 241 extends from the display area 1a and covers the peripheral area 1b. The touch electrode 242 is disposed on a side of the first insulating layer 241 away from the substrate 204 and located in the display area 1a. The second insulating layer 243 covers a side of the touch electrode 242 away from the substrate 204.

[0090] The material of the first insulating layer 241 is an inorganic material. In this embodiment, the second inorganic layer 203 may include the first insulating layer 241 .

[0091] In this embodiment, the third organic filling layer 113 may include the same organic material as that of the organic encapsulation layer 233 .

[0092] In one embodiment, see Fig. 6A and Figure 6B , Fig. 6A yes Figure 1B Schematic diagram of the fourth cross-sectional structure along AA, Figure 6B It is a schematic diagram of a fourth cross-sectional structure of a display panel provided by an embodiment of the present invention. Fig. 6A and Figure 6B and Figure 2A and Figure 2BThe difference is that the second organic filling layer 112 is arranged between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232. In this case, the stacking structure 10 includes the first inorganic encapsulation layer 231, the second organic filling layer 112 and the second inorganic encapsulation layer 232 which are stacked in sequence.

[0093] It can be understood that the second organic filling layer 112 is located between the first inorganic encapsulation layer 231 and the second inorganic encapsulation layer 232, which is equivalent to splitting the thicker inorganic film layer formed by stacking the first inorganic layer 201 and the first inorganic encapsulation layer 231, so that the stacking structure 10 has an inorganic / organic / inorganic film layer structure, reducing the risk of cracks during the cutting process.

[0094] In this embodiment, the second organic filling layer 112 may include the same organic material as that of the organic encapsulation layer 233 .

[0095] In this embodiment, the first inorganic layer 201 is also arranged in at least one groove 12 on the side of the retaining wall structure 114 away from the display area 1a, and the first organic layer 202 also includes an anti-crack layer 14 arranged between the retaining wall structure 114 and the stacking structure 10, and the anti-crack layer 14 covers the groove 12.

[0096] In this embodiment, the first inorganic encapsulation layer 231 covers the anti-crack layer 14 , and the anti-crack layer 14 and the second organic filling layer 112 are separated by the first inorganic encapsulation layer 231 .

[0097] The beneficial effects are as follows: the display panel provided by the embodiment of the present invention comprises a first inorganic layer, a first organic layer and an encapsulation layer, the first organic layer comprises a planarization layer arranged in the display area and a retaining wall structure arranged in the peripheral area, and a stacking structure is arranged in the peripheral area, the stacking structure is located on the side of the retaining wall structure away from the display area, the stacking structure comprises an inorganic sublayer, an organic sublayer and an inorganic sublayer stacked in sequence, there is a gap between the organic sublayer and the retaining wall structure, the encapsulation layer contacts the first inorganic layer at the gap to form a complete package; the organic sublayer in the stacking structure is arranged between two adjacent inorganic sublayers, so that the stacking structure is an inorganic / organic / inorganic multi-layer repeated stacking structure, which is equivalent to splitting the stacked inorganic film layers into multiple layers of inorganic sublayers. When the display motherboard is cut, the risk of cracks in the stacking structure during the cutting process is greatly reduced, which is beneficial to improving the performance of the light-emitting device of the display panel and extending its service life while achieving an extremely narrow frame.

[0098] In summary, although the present invention has been disclosed as above in terms of preferred embodiments, the above preferred embodiments are not intended to limit the present invention. A person skilled in the art may make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be based on the scope defined in the claims.

Claims

1. A display panel, characterized in that: The display panel comprises a display area and a peripheral area located at at least one side of the display area, and the display panel further comprises: substrate; A first inorganic layer is disposed on one side of the substrate; A first organic layer is disposed on a side of the first inorganic layer away from the substrate, the first organic layer comprising a retaining wall structure disposed in the peripheral area; and An encapsulation layer, disposed on a side of the first organic layer away from the substrate and located in the display area and the peripheral area; The first inorganic layer includes at least one groove arranged in the peripheral area and located on the side of the retaining wall structure away from the display area, and the first organic layer also includes a first organic filling layer arranged on the side of the retaining wall structure away from the display area, wherein the first organic filling layer covers the groove, and the encapsulation layer contacts the first inorganic layer on the side of the first organic filling layer away from the retaining wall structure.

2. The display panel according to claim 1, characterized in that: The display panel also includes a stacking structure arranged in the peripheral area and located on the side of the retaining wall structure away from the display area, the stacking structure includes an inorganic sublayer, an organic sublayer and an inorganic sublayer stacked in sequence, there is a gap between the organic sublayer and the retaining wall structure, and the encapsulation layer is in contact with the first inorganic layer at the gap.

3. The display panel according to claim 2, characterized in that: The encapsulation layer comprises a first inorganic encapsulation layer, a first organic encapsulation layer, and a second inorganic encapsulation layer which are sequentially stacked in the thickness direction of the display panel, the first organic encapsulation layer is located on a side of the retaining wall structure away from the peripheral area, and the first inorganic encapsulation layer and the second inorganic encapsulation layer are located in the display area and the peripheral area; The first inorganic encapsulation layer contacts the first inorganic layer at a side of the first organic filling layer away from the retaining wall structure.

4. The display panel according to claim 3, characterized in that: The first inorganic encapsulation layer covers the display area and extends to cover the retaining wall structure, and the first inorganic encapsulation layer contacts the first inorganic layer at the interval.

5. The display panel according to claim 3, characterized in that: The stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulation layer, the second organic filling layer and the second inorganic encapsulation layer which are stacked in sequence; Wherein, the second organic filling layer comprises the same organic material as the organic encapsulation layer.

6. The display panel according to claim 5, characterized in that: The display panel further includes: A second inorganic layer is disposed on a side of the encapsulation layer away from the substrate; and A third organic filling layer is disposed between the second inorganic layer and the encapsulation layer and is located on a side of the retaining wall structure away from the display area; The stacked structure includes the first inorganic layer, the first organic filling layer, the first inorganic encapsulation layer, the second organic filling layer, the second inorganic encapsulation layer, the third organic filling layer and the second inorganic layer stacked in sequence, and the third organic filling layer includes the same organic material as the organic encapsulation layer.

7. The display panel according to claim 3, characterized in that: The stacked structure comprises the first inorganic encapsulation layer, the second organic filling layer and the second inorganic encapsulation layer which are stacked in sequence; Wherein, the second organic filling layer comprises the same organic material as the organic encapsulation layer.

8. The display panel according to claim 7, characterized in that: The first organic layer further includes an anti-crack layer disposed between the barrier wall structure and the stacking structure, and the anti-crack layer covers the groove.

9. The display panel according to claim 8, characterized in that: The first inorganic encapsulation layer covers a side of the crack prevention layer away from the substrate, and the crack prevention layer and the second organic filling layer are separated by the first inorganic encapsulation layer.

10. The display panel according to claim 3, characterized in that: The thickness of the organic sublayer is in the range of 2 micrometers to 10 micrometers.

11. The display panel according to claim 1, characterized in that: The first organic layer further comprises: A planarization layer, disposed in the display area; a pixel definition layer, disposed on a side of the planarization layer away from the substrate; and A support column, disposed on a side of the pixel definition layer away from the substrate; The first organic filling layer includes an organic material that is the same as a combination of one or more of the planarization layer, the pixel definition layer and the support column.

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