Method for manufacturing electronic component and electronic component

Abstract

The invention provides a method for manufacturing an electronic component and an electronic component capable of improving sealing performance of an air cavity. This method for manufacturing an electronic component comprises: a step for mounting at least one electronic component on a circuit board; a step in which a curable composition that is liquid at 23 DEG C is applied to the upper surface of the circuit board to form a curable composition layer; and a step of curing the curable composition layer to form an adhesive portion, in the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with at least a portion of a side surface of the electronic member, and an air cavity is formed by the circuit board, the electronic member, and the adhesive portion.

Description

Technical Field

[0001] The present invention relates to a method for producing an electronic component using a curable composition and an electronic component. Background Art

[0002] The communication filter has an air cavity (space) formed by the RDL layer and metal, etc. Conventionally, the air cavity is formed using a sheet material such as a photosensitive polyimide resin sheet and an epoxy resin sheet (for example, see Patent Document 1 below).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2010-278971 Summary of the invention

[0006] Technical problem solved by the invention

[0007] In the previous method of forming an air cavity using a sheet material, the manufacturing cost is high and the manufacturing process is complicated. In addition, in the previous method of forming an air cavity using a sheet material, when the peripheral portion of the filter structure is molded by a resin, the resin may penetrate the sheet material and immerse into the air cavity. In order to improve the communication reliability of the communication filter, it is necessary that the molding material (resin) does not immerse into the air cavity, and an air cavity with better sealing is required. In addition, in the previous method of forming an air cavity using a sheet material, in order to make the end of the sheet material surface-contact on the substrate, the sheet material is sometimes arranged on a portion of the substrate that does not need to be arranged.

[0008] An object of the present invention is to provide a novel method for manufacturing an electronic component capable of improving the sealing performance of an air cavity. Another object of the present invention is to provide an electronic component capable of improving the sealing performance of an air cavity.

[0009] Technical means of solving problems

[0010] This specification discloses the following method for manufacturing an electronic component and the electronic component.

[0011] Item 1. A method for manufacturing an electronic component, comprising:

[0012] The step of mounting at least one electronic component on the circuit substrate;

[0013] A step of applying a curable composition that is liquid at 23° C. onto the upper surface of the circuit substrate to form a curable composition layer; and

[0014] a step of curing the curable composition layer to form an adhesive portion,

[0015] In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with at least a portion of a side surface of the electronic member.

[0016] An air cavity is formed by the circuit substrate, the electronic component, and the bonding portion.

[0017] Item 2. The method for manufacturing an electronic component according to Item 1, wherein:

[0018] There are multiple electronic components.

[0019] In the step of mounting the electronic components, a plurality of the electronic components are mounted on the circuit board with gaps therebetween.

[0020] In the step of forming the curable composition layer, the curable composition layer is formed so as not to be in contact with at least a portion of the side surfaces of the electronic components in a portion adjacent to the plurality of electronic components.

[0021] Item 3. The method for manufacturing an electronic component according to Item 1, wherein:

[0022] In the step of forming the curable composition layer, the curable composition layer is formed over the entire periphery of the electronic component so as to be in contact with the side surface of the electronic component.

[0023] Item 4. The method for manufacturing an electronic component according to any one of Items 1 to 3, wherein:

[0024] In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with the upper end to the lower end of the side surface of the electronic member.

[0025] Item 5. The method for manufacturing an electronic component according to any one of Items 1 to 4, wherein:

[0026] In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with an edge portion of the upper surface of the electronic component.

[0027] Item 6. The method for manufacturing an electronic component according to any one of Items 1 to 5, wherein:

[0028] In the step of forming the curable composition layer, the curable composition layer is formed so as not to come into contact with the lower surface of the electronic member.

[0029] Item 7. The method for manufacturing an electronic component according to any one of Items 1 to 6, wherein:

[0030] The step of forming the bonding portion comprises:

[0031] A step of photocuring the curable composition layer to form the adhesive portion.

[0032] Item 8. The method for manufacturing an electronic component according to any one of Items 1 to 7, wherein:

[0033] The step of forming the bonding portion comprises:

[0034] A step of photocuring the curable composition layer to obtain a B-stage layer; and

[0035] The step of thermally curing the B-stage compound layer to form the bonding portion.

[0036] Item 9. The method for manufacturing an electronic component according to Item 8, wherein:

[0037] The step of forming the bonding portion comprises:

[0038] Each time a plurality of drops or one drop of the curable composition is applied, the curable composition layer is photocured to obtain a multi-layer B-stage compound layer; and

[0039] The step of thermally curing the multi-layer B-stage compound layer to form a multi-layer adhesive portion.

[0040] Item 10. The method for producing an electronic component according to any one of Items 1 to 9, further comprising:

[0041] A step of sealing the upper surface and side surfaces of the bonding portion using a resin.

[0042] Item 11. The method for manufacturing an electronic component according to any one of Items 1 to 10, wherein:

[0043] In the step of forming the curable composition layer, the curable composition is applied by an inkjet method.

[0044] Item 12. An electronic component comprising a circuit board, at least one electronic component and an adhesive portion,

[0045] At least one of the electronic components is mounted on the circuit substrate.

[0046] The adhesive portion is a cured product of a curable composition that is liquid at 23°C.

[0047] The bonding portion is in contact with the upper surface of the circuit substrate and at least a portion of the side surface of the electronic component.

[0048] An air cavity is formed by the circuit substrate, the electronic component, and the bonding portion.

[0049] Item 13. The electronic component according to Item 12, wherein:

[0050] There are multiple electronic components.

[0051] A plurality of the electronic components are mounted on the circuit substrate at intervals.

[0052] The adhesive portion does not contact at least a portion of the side surface of the electronic component in a portion where the plurality of electronic components are adjacent to each other.

[0053] Item 14. The electronic component according to Item 12, wherein:

[0054] The adhesive portion is in contact with a side surface of the electronic component over the entire periphery of the electronic component.

[0055] Item 15. The electronic component according to any one of Items 12 to 14, wherein

[0056] The bonding portion is in contact with an edge portion of the upper surface of the electronic component.

[0057] Item 16. The electronic component according to any one of Items 12 to 15, wherein

[0058] The adhesive portion does not contact the lower surface of the electronic component.

[0059] Item 17. The electronic component according to any one of Items 12 to 16, wherein

[0060] The height of the bonding portion is greater than or equal to 1 μm and less than or equal to 300 μm.

[0061] Item 18. The electronic component according to any one of Items 12 to 17, wherein

[0062] The curable composition includes an epoxy compound, a (meth)acrylate compound, or a polysiloxane compound.

[0063] Item 19. The electronic component according to any one of Items 12 to 18, wherein

[0064] The electronic component is a semiconductor chip, a capacitor or a light emitting element.

[0065] Item 20. The electronic component according to any one of Items 12 to 19, wherein

[0066] The electronic component is a surface acoustic wave (Surface Acoustic Wave) filter, a bulk acoustic wave (Bulk Acoustic Wave) filter or a membrane elastic resonator filter.

[0067] Effects of the Invention

[0068] The method for manufacturing an electronic component of the present invention comprises: a step of mounting at least one electronic component on a circuit substrate; a step of applying a curable composition that is liquid at 23°C to the upper surface of the circuit substrate to form a curable composition layer; and a step of curing the curable composition layer to form an adhesive portion. In the method for manufacturing an electronic component of the present invention, in the step of forming the curable composition layer, the curable composition layer is formed in a manner that contacts at least a portion of the side surface of the electronic component. In the method for manufacturing an electronic component of the present invention, an air cavity is formed by the circuit substrate, the electronic component, and the adhesive portion. The present invention is a new method for manufacturing an electronic component. In the method for manufacturing an electronic component of the present invention, since the structure is provided, the sealing property of the air cavity can be improved.

[0069] The electronic component of the present invention comprises a circuit substrate, at least one electronic component and an adhesive portion. In the electronic component of the present invention, at least one electronic component is mounted on the circuit substrate. In the electronic component of the present invention, the adhesive portion is a cured product of a curable composition that is liquid at 23°C. In the electronic component of the present invention, the adhesive portion is in contact with at least a portion of the upper surface of the circuit substrate and the side surface of the electronic component. In the electronic component of the present invention, an air cavity is formed by the circuit substrate, the electronic component and the adhesive portion. In the electronic component of the present invention, since it has the above-mentioned structure, the sealing property of the air cavity can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0070] [ Figure 1 ] Figure 1 (a) is a plan view schematically showing an electronic component according to a first embodiment of the present invention, Figure 1 (b) is a cross-sectional view schematically showing the electronic component.

[0071] [ Figure 2 ] Figure 2 It is a cross-sectional view schematically showing an electronic component according to a second embodiment of the present invention.

[0072] [ Figure 3 ] Figure 3 It is a cross-sectional view schematically showing an electronic component according to a third embodiment of the present invention.

[0073] [ Figure 4 ] Figure 4 (a) and Figure 4 (b) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component.

[0074] [ Figure 5 ] Figure 5 (c) and Figure 5 (d) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component.

[0075] [ Figure 6 ] Figure 6 (e) and Figure 6 (f) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component.

[0076] [ Figure 7 ] Figure 7 (g) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component.

[0077] [ Figure 8 ] Figure 8 (a) and Figure 8 (b) is a diagram for explaining a formation region of an adhesive portion with respect to an electronic component.

[0078] [ Fig. 9 ] Fig. 9 (a) and Fig. 9 (b) is a diagram for explaining a modified example of the formation region of the bonding portion with respect to the electronic component. DETAILED DESCRIPTION

[0079] Hereinafter, the present invention is described in detail.

[0080] In the previous method of forming an air cavity using a sheet material, the manufacturing cost is high and the manufacturing process is complicated. In addition, in the previous method of forming an air cavity using a sheet material, when the peripheral portion of the filter structure is molded by resin, the resin sometimes penetrates the sheet material and immerses into the air cavity. In order to improve the communication reliability of the communication filter, it is necessary to prevent the molding material (resin) from immersing into the air cavity, and an air cavity with better sealing is required. In addition, in the previous method of forming an air cavity using a sheet material, in order to make the end of the sheet material contact on the substrate, the sheet material is sometimes also arranged on the part of the substrate that does not need to be arranged.

[0081] The present inventors have conducted intensive research to solve the above-mentioned problems, and as a result, found that the sealing property of the air cavity is greatly improved by the electronic component and the method for manufacturing the electronic component of the present invention, especially by forming the bonding portion using a curable composition that is liquid at 23°C. By forming the bonding portion using a curable composition that is liquid at 23°C, the sealing property of the air cavity is greatly improved compared to the case where the bonding portion is formed using a curable sheet. In addition, in the present invention, when the mold is sealed, the molding material is not easily infiltrated into the air cavity.

[0082] (Electronic component and method for manufacturing electronic component)

[0083] The electronic component of the present invention comprises a circuit substrate, at least one electronic component and an adhesive portion. In the electronic component of the present invention, at least one electronic component is mounted on the circuit substrate. In the electronic component of the present invention, the adhesive portion is a cured product of a curable composition that is liquid at 23°C. In the electronic component of the present invention, the adhesive portion is in contact with the upper surface of the circuit substrate and at least a portion of the side surface of the electronic component. In the electronic component of the present invention, an air cavity is formed by the circuit substrate, the electronic component and the adhesive portion.

[0084] The method for manufacturing an electronic component of the present invention comprises the following steps (1) to (3). (1) A step of mounting at least one electronic component on a circuit board. (2) A step of applying a curable composition that is liquid at 23° C. to the upper surface of the circuit board to form a curable composition layer. (3) A step of curing the curable composition layer to form an adhesive portion.

[0085] In the method for producing an electronic component of the present invention, in the step (2) of forming a curable composition layer, the curable composition layer is formed so as to be in contact with at least a portion of the side surface of the electronic member.

[0086] In the method for manufacturing an electronic component of the present invention, an air cavity is formed by the circuit board, the electronic member, and the bonding portion.

[0087] Hereinafter, specific embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that, for the sake of illustration, the dimensions, thicknesses, shapes, etc. in the following drawings are different from the actual dimensions, thicknesses, shapes, etc.

[0088] Figure 1 (a) is a plan view schematically showing an electronic component according to a first embodiment of the present invention, Figure 1 (b) is a cross-sectional view schematically showing the electronic component. Figure 1 (b) is along Figure 1 (a) is a cross-sectional view of line II.

[0089] Figure 1 The electronic component 10 shown in FIG. 1 includes a circuit board 1, an electronic component 2, an adhesive portion 3, and a molded resin portion 44. The electronic component 2 includes a solder ball 41, a resin sheet 42, and a contact terminal 43 ( Figure 1(a) is not shown). An electronic component 2 is installed in the electronic component 10. In the electronic component 10, there is one electronic component 2. The adhesive portion 3 is a cured product of a curable composition that is liquid at 23°C. The adhesive portion 3 is a light and heat cured product of the curable composition. The adhesive portion 3 is in contact with the upper surface of the circuit substrate 1 and a portion of the side surface of the electronic component 2. The adhesive portion 3 is in contact with a portion of the upper surface of the circuit substrate 1, and is in contact with a portion of the side surface of the electronic component 2 and the entire upper surface. The adhesive portion 3 is not in contact with the lower surface of the electronic component 2. The adhesive portion 3 bonds the upper surface of the circuit substrate 1 to the side surface and the upper surface of the electronic component 2. The adhesive portion 3 is arranged on the upper surface of the circuit substrate 1. The adhesive portion 3 is arranged on the side surface of the electronic component 2, and is arranged on the upper surface of the electronic component 2. The adhesive portion 3 is arranged on a portion of the upper surface of the circuit substrate 1, and is arranged on a portion of the side surface of the electronic component 2 and the entire upper surface. The adhesive portion 3 is not arranged on the lower surface of the electronic component 2. The circuit board 1 , the electronic component 2 , and the bonding portion 3 form an air cavity R. The mold resin portion 44 is disposed on the upper surface and the side surface of the bonding portion 3 .

[0090] Figure 1 In the electronic component 10 shown, the air cavity R has a very high sealing property. In addition, in the present invention, the mold material (the material of the mold resin portion) does not easily penetrate into the air cavity R.

[0091] Figure 2 It is a cross-sectional view schematically showing an electronic component according to a second embodiment of the present invention.

[0092] Figure 2 The electronic component 11 shown includes a circuit substrate 1, a plurality of electronic components 2, an adhesive portion 3, and a molded resin portion 44. A plurality of electronic components 2 are mounted in the electronic component 11. In the electronic component 11, there are a plurality of electronic components 2. In the electronic component 11, a plurality of electronic components 2 are mounted on the circuit substrate 1 with a gap therebetween. The adhesive portion 3 does not contact the side surfaces of the electronic components 2 in the adjacent portions of the plurality of electronic components 2. The adhesive portion 3 is not arranged in the gap between the adjacent electronic components 2. The adhesive portion 3 is not arranged on the side surfaces of the electronic components 2 between the adjacent electronic components 2.

[0093] The adhesive portion 3 is in contact with the upper surface of the circuit substrate 1 and a portion of the side surface of the electronic component 2. The adhesive portion 3 is in contact with a portion of the upper surface of the circuit substrate 1, and is in contact with a portion of the side surface and the entire upper surface of the electronic component 2. The adhesive portion 3 is not in contact with the lower surface of the electronic component 2. The adhesive portion 3 bonds the upper surface of the circuit substrate 1 to the side surface and the upper surface of the electronic component 2. The adhesive portion 3 is arranged on the upper surface of the circuit substrate 1. The adhesive portion 3 is arranged on the side surface of the electronic component 2, and is arranged on the upper surface of the electronic component 2. The adhesive portion 3 is arranged on a portion of the upper surface of the circuit substrate 1, and is arranged on a portion of the side surface and the entire upper surface of the electronic component 2. The adhesive portion 3 is not arranged on the lower surface of the electronic component 2. An air cavity R is formed by the circuit substrate 1, the electronic component 2, and the adhesive portion 3. The molded resin portion 44 is arranged on the upper surface and the side surface of the adhesive portion 3.

[0094] Figure 2 In the electronic component 11 shown, the air cavity R has a very high sealing property. In addition, in the present invention, the mold material (the material of the mold resin portion) does not easily penetrate into the air cavity R.

[0095] Figure 3 It is a cross-sectional view schematically showing an electronic component according to a third embodiment of the present invention.

[0096] Figure 3 The electronic component 12 shown here has only the bonding portion 3 and Figure 1 The electronic component 10 shown is different. In the electronic component 12, the adhesive portion 3 is in contact with the upper end to the lower end of the side surface of the electronic member 2 (except the solder ball 41).

[0097] Figure 3 In the electronic component 12 shown, the air cavity R has a very high sealing property. In addition, in the present invention, the mold material (the material of the mold resin portion) does not easily penetrate into the air cavity R.

[0098] It should be noted that, in the electronic component, the adhesive portion may or may not be in contact with the upper surface of the electronic component. In the electronic component, the adhesive portion may or may not be configured on the upper surface of the electronic component. In addition, in the electronic component, the adhesive portion may or may not be in contact with the lower surface of the electronic component. In addition, in the electronic component, the adhesive portion may or may not be configured on the lower surface of the electronic component.

[0099] In the electronic components 10, 11, 12 and hereinafter referred to as an electronic component 10X, the electronic member 2 is a semiconductor chip. The electronic components 10, 11, 12 and hereinafter referred to as an electronic component 10X are communication filters.

[0100] Figure 4 (a) and Figure 4(b) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component. Figure 5 (c) and Figure 5 (d) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component. Figure 6 (e) and Figure 6 (f) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component. Figure 7 (g) is used to illustrate Figure 1 A cross-sectional view showing each step of a method for manufacturing an electronic component. Figures 4 to 7 (a)~(g) indicates Figure 1 A series of steps of a method for manufacturing an electronic component are shown.

[0101] First, at least one electronic component is mounted on the circuit board 1 (mounting process). Figure 4 As shown in (a), a curable composition that is liquid at 23° C. is applied to the upper surface (surface) of the circuit board 1 using an inkjet device to form a curable composition layer 3A (coating step). The curable composition is applied to the upper surface of the circuit board 1 to form the curable composition layer 3A. The curable composition is ejected from the ejection unit 51 of the inkjet device.

[0102] Next, if Figure 4 (b) Figure 5 (c) and Figure 5 (d) and Figure 6 (e) and Figure 6 As shown in (f), the curable composition layer 3A is cured to form the adhesive portion 3. Specifically, Figure 4 As shown in (b), the curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to cure the curable composition layer 3A to form a B-stage compound layer 3B (photocuring step). The B-stage compound layer 3B is a preliminary cured layer of the curable composition.

[0103] It should be noted that in the method for manufacturing the electronic component, after the curable composition is applied to a specific area, the entire applied curable composition can be irradiated with light to form a B-stage compound layer. In the method for manufacturing the electronic component, multiple drops of the curable composition can be applied each time, and the applied curable composition can be irradiated with light to form a B-stage compound layer. In the method for manufacturing the electronic component, 1 drop of the curable composition can be applied each time, and the applied curable composition can be irradiated with light to form a B-stage compound layer. That is, multiple drops or 1 drop of the curable composition can be applied each time, and the applied curable composition can be irradiated with light to form a B-stage compound layer. Therefore, multiple drops or 1 drop of the curable composition can be applied each time, and the curable composition layer can be photocured to obtain a multi-layer B-stage compound layer.

[0104] In the method for manufacturing an electronic component, in the step of forming the curable composition layer 3A (coating step), the curable composition layer 3A is formed in a manner in contact with at least a portion of the side surface of the electronic component 2, and in the step of forming the B-stage compound layer 3B (photocuring step), the B-stage compound layer 3B is formed in a manner in contact with at least a portion of the side surface of the electronic component 2 (see Figure 6 (e)).

[0105] After the photocuring step, it is determined whether to repeat the coating step and the photocuring step. When the coating step and the photocuring step are repeated, the curable composition is applied to the surface side opposite to the circuit substrate side of the obtained B-stage compound layer.

[0106] Figure 5 (c) and Figure 5 (d) is a diagram showing the second coating step and the second photocuring step, respectively. Figure 5 As shown in (c), the curable composition is applied to the surface of the B-stage compound layer 3B opposite to the circuit substrate 1 side using an inkjet device to form a curable composition layer 3A on the surface of the B-stage compound layer 3B. Figure 5 As shown in (d), the applied curable composition layer 3A is irradiated with light from the light irradiation unit 52 of the inkjet device to form a B-stage compound layer 3B.

[0107] Figure 4 (a) and Figure 4 (b), and Figure 5 (c) and Figure 5 In (d), the coating step and the photocuring step are performed twice in the thickness direction of the curable composition layer. Figure 4 (a) and Figure 4 (b), and Figure 5 (c) and Figure 5(d). By performing the coating step and the photocuring step multiple times in the thickness direction of the curable composition layer, the thickness of the B-stage compound layer can be increased, and the ratio (height (thickness) / width) (aspect ratio) of the B-stage compound layer can be increased. The coating step and the photocuring step can be performed more than 2 times, and can be performed more than 3 times.

[0108] In the coating process and the light curing process, by repeating coating and light curing, Figure 6 As shown in (e), a B-stage compound layer 3B is formed in contact with the side surface of the electronic component 2. It should be noted that Figure 6 In (e), the B-stage compound layer 3B is formed so as to be in contact with the side surface and the upper surface of the electronic component 2 .

[0109] Next, the B-stage compound layer 3B is thermally cured by heating (thermal curing step). Figure 6 The laminated structure having the circuit board 1, the electronic component 2 and the B-stage compound layer 3B obtained in (e) is subjected to thermal curing of the B-stage compound layer 3B. Figure 6 As shown in (f), the adhesive portion 3 is formed. The adhesive portion 3 is a layer of a photo- and heat-cured material of the curable composition.

[0110] Next, if Figure 7 As shown in (g), the upper surface and the side surfaces of the bonding portion 3 are sealed with resin. The resin is placed on the upper surface and the side surfaces of the bonding portion 3 to form a mold resin portion 44.

[0111] From this, we can get Figure 1 10 is an electronic component shown.

[0112] Figure 8 (a) and Figure 8 (b) is a diagram for explaining a formation region of an adhesive portion with respect to an electronic component. Figure 8 (b) is along Figure 8 (a) Diagram of line II. Figure 8 In (b), the region where the adhesive portion 3 is formed is indicated by hatching. In the electronic component 10, the adhesive portion 3 is in contact with the entire side surface of the electronic member 2. In the electronic component 10, the adhesive portion 3 is in contact with the side surface of the electronic member 2 over the entire periphery of the electronic member 2.

[0113] Fig. 9 (a) and Fig. 9 (b) is a diagram for explaining a modified example of the formation region of the bonding portion with respect to the electronic component. Fig. 9 (b) is along Fig. 9 (a) Diagram of line II. Fig. 9In (b), the region where the adhesive portion 3X is formed is indicated by oblique lines. In the electronic component 10X, the adhesive portion 3X contacts a portion of the side surface of the electronic component 2 and contacts a portion of the side surface of the outer periphery of the electronic component 2. In the electronic component 10X, there is a region on the side surface of the electronic component 2 where the adhesive portion 3X is not disposed.

[0114] From the viewpoint of further improving the sealing property of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is preferably coated by an inkjet method. From the viewpoint of further improving the sealing property of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is preferably coated by an inkjet device.

[0115] In the electronic component, the adhesive portion may be in contact with a side surface of the electronic component over the entire periphery of the electronic component, or may be in contact with a side surface of a portion of the periphery of the electronic component.

[0116] From the viewpoint of further improving the sealing property of the air cavity, in the electronic component, the adhesive portion is preferably in contact with the side surface of the electronic component over the entire periphery of the electronic component (for example, see Figure 8 (b)). From the perspective of further improving the sealing of the air cavity, when there is only one electronic component, the adhesive portion is preferably in contact with all the side surfaces of the electronic component. From the perspective of further improving the sealing of the air cavity, when there are multiple electronic components, the adhesive portion is preferably in contact with the side surfaces of the electronic component at the entire periphery of the assembly of the electronic components.

[0117] It should be noted that, in the electronic component, sometimes, even if the adhesive portion does not contact the side surface of the electronic component in the entire periphery of the electronic component, the air cavity can still be sealed. In the electronic component, the adhesive portion may only contact the side surface of a portion of the periphery of the electronic component (for example, see Fig. 9 (b)) When there is one electronic component, the adhesive portion may be in contact with a portion of the side surface of the electronic component. When there are multiple electronic components, the adhesive portion may be in contact with a portion of the side surface of the outer periphery of the assembly of the electronic components.

[0118] From the viewpoint of further effectively exerting the effect of the present invention, in the electronic component, the adhesive portion is preferably in contact with the upper end to the lower end of the side surface of the electronic component. From the viewpoint of further effectively exerting the effect of the present invention, in the electronic component, the adhesive portion is preferably in contact with the entirety of the upper and lower directions of the side surface of the electronic component. From the viewpoint of further effectively exerting the effect of the present invention, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is preferably formed in a manner that contacts the upper end to the lower end of the side surface of the electronic component. From the viewpoint of further effectively exerting the effect of the present invention, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is preferably formed in a manner that contacts the entirety of the upper and lower directions of the side surface of the electronic component. From the viewpoint of further improving the sealing property of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is preferably applied to the upper end to the lower end of the side surface of the electronic component. In addition, in this specification, "the upper end to the lower end of the side surface of the electronic component" means the upper end to the lower end of the side surface of the electronic component excluding the solder ball.

[0119] In the electronic component, the adhesive portion may be in contact with a portion of the side of the electronic component, or may be in contact with the entire side of the electronic component. From the viewpoint of further effectively exerting the effect of the present invention, in the electronic component, the adhesive portion is preferably in contact with the entire side of the electronic component. From the viewpoint of further improving the sealing of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is preferably formed in a manner that contacts the entire side of the electronic component. From the viewpoint of further improving the sealing of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is preferably applied to the entire side of the electronic component.

[0120] When there is only one electronic component, the adhesive portion is preferably in contact with at least a portion of all side surfaces of the electronic component, more preferably in contact with all side surfaces from the upper end to the lower end of the electronic component, and further preferably in contact with the entire side surfaces of the electronic component. In these cases, the effect of the present invention can be further effectively exerted.

[0121] From the viewpoint of further improving the sealing property of the air cavity, when there are a plurality of electronic components, it is preferred that the plurality of electronic components be installed on the circuit substrate with a gap between them. The gap between the electronic components is not particularly limited. The gap between the electronic components may be 50 μm or more, 100 μm or more, 500 μm or less, or 300 μm or less.

[0122] From the viewpoint of further improving the sealing of the air cavity, when there are multiple electronic components, the adhesive portion is preferably not in contact with at least a portion of the side surface of the electronic component of the adjacent portion of the multiple electronic components. From the viewpoint of further improving the sealing of the air cavity, when there are multiple electronic components, the adhesive portion is preferably not configured at least a portion of the side surface of the electronic component between the adjacent electronic components, and the multiple electronic components are preferably not configured at least a portion of the side surface of the electronic component of the adjacent portion. From the viewpoint of further improving the sealing of the air cavity, when there are multiple electronic components, it is preferred that there is a portion on the side surface of the electronic component of the adjacent portion of the multiple electronic components that does not contact the adhesive portion. From the viewpoint of further improving the sealing of the air cavity, when there are multiple electronic components, the adhesive portion is preferably not in contact with the side surface of the electronic component of the adjacent portion of the multiple electronic components. From the viewpoint of further improving the sealing of the air cavity, when there are multiple electronic components, the adhesive portion is preferably not configured in the gap between the adjacent electronic components, and is preferably not configured on the side surface of the electronic component of the adjacent portion of the multiple electronic components.

[0123] From the viewpoint of further improving the sealing performance of the air cavity, it is particularly preferred that, among the electronic components, there are a plurality of electronic components, a plurality of the electronic components are mounted on the circuit substrate with intervals therebetween, and the adhesive portion does not contact at least a portion of the side surfaces of the electronic components adjacent to the plurality of the electronic components.

[0124] When there are multiple electronic components, the adhesive portion is preferably in contact with at least a portion of each side surface of the electronic component at the entire periphery of the assembly of the electronic components, more preferably in contact with the upper end to the lower end of each side surface, and further preferably in contact with the entire side surface. In these cases, the sealing performance of the air cavity can be further improved.

[0125] In the method for manufacturing the electronic component, it is preferred that the electronic component is multiple, and in the step (1) of installing the electronic component (installation step), the multiple electronic components are installed on the circuit substrate with a gap between them. In the method for manufacturing the electronic component, it is preferred that in the step (2) of forming the curable composition layer (coating step), the curable composition layer is formed in a manner that does not contact at least a portion of the side of the electronic component of the portion adjacent to the multiple electronic components. In the method for manufacturing the electronic component, it is preferred that in the step (2) of forming the curable composition layer (coating step), at least a portion of the side of the electronic component of the portion adjacent to the multiple electronic components is not coated with the curable composition. In these cases, the sealing of the air cavity can be further improved.

[0126] From the viewpoint of further effectively exerting the effect of the present invention, in the electronic component, it is preferred that the adhesive portion is in contact with the edge portion of the upper surface of the electronic component, and it is more preferred that the adhesive portion is in contact with the entire upper surface of the electronic component. From the viewpoint of further improving the sealing of the air cavity, in the method for manufacturing the electronic component, it is preferred that in the step (2) of forming a curable composition layer (coating step), the curable composition layer is formed in a manner that contacts the edge portion of the upper surface of the electronic component. From the viewpoint of further improving the sealing of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), it is preferred that the curable composition be applied to the edge portion of the upper surface of the electronic component, and it is more preferred that the curable composition be applied to the entire upper surface of the electronic component. It should be noted that the edge portion of the upper surface of the electronic component is a portion (edge ​​portion) located on the upper surface of the electronic component, which is different from a portion located on the side of the electronic component.

[0127] The adhesive portion may be in contact with a region of 5 μm inward from the end of the upper surface of the electronic component, or may be in contact with a region of 1000 μm inward from the end of the upper surface of the electronic component. The edge of the upper surface of the electronic component is preferably a region of 5 μm or more and 1000 μm or less inward from the end of the upper surface of the electronic component.

[0128] From the viewpoint of further effectively exerting the effect of the present invention, in the electronic component, the adhesive portion is preferably not in contact with the lower surface of the electronic component. From the viewpoint of further improving the sealing of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition layer is preferably formed in a manner that does not contact the lower surface of the electronic component. From the viewpoint of further improving the sealing of the air cavity, in the method for manufacturing the electronic component, in the step (2) of forming a curable composition layer (coating step), the curable composition is preferably not applied to the lower surface of the electronic component.

[0129] From the viewpoint of further improving the sealing property of the air cavity, in the method for manufacturing the electronic component, in the step (3) of forming the adhesive portion (curing step), the curable composition is preferably photocured, and more preferably photocured and thermally cured. From the viewpoint of further improving the sealing property of the air cavity, in the method for manufacturing the electronic component, in the step (3) of forming the adhesive portion (curing step), the curable composition is preferably cured by irradiation with light and heating. From the viewpoint of further improving the sealing property of the air cavity, in the method for manufacturing the electronic component, in the step (3) of forming the adhesive portion (curing step), it is preferred to include a step (photocuring step) of photocuring the curable composition layer to form the adhesive portion. When the curable composition layer is photocured to form the adhesive portion, thermal curing may be performed after photocuring.

[0130] In the method for manufacturing the electronic component, the step (3) of forming the adhesive portion (curing step) more preferably comprises: a step of photocuring the curable composition layer to obtain a B-stage compound layer (photocuring step); and a step of thermally curing the B-stage compound layer to obtain a cured product (adhesive portion) of the curable composition layer (thermal curing step). In this case, the sealing property of the air cavity can be further improved.

[0131] In the method for manufacturing the electronic component, the step (3) of forming the adhesive portion (curing step) preferably comprises: a step of photocuring the curable composition layer to obtain a multi-layer B-stage compound layer (photocuring step) after applying a plurality of drops or a single drop of the curable composition; and a step of thermally curing the multi-layer B-stage compound layer to form a multi-layer adhesive portion (thermal curing step). In this case, the adhesive portion can be formed with high precision, and the effect of the present invention can be effectively exerted.

[0132] The process of obtaining a multi-layer B-stage compound layer (photocuring process) is performed by repeatedly applying multiple drops or one drop of the curable composition and photocuring the curable composition layer. The coating and photocuring are repeated in the thickness direction of the curable composition layer (the thickness direction of the obtained multi-layer B-stage compound layer) to form a multi-layer B-stage compound layer. As for the process of obtaining a multi-layer B-stage compound layer (photocuring process), specifically, the following process is performed. A process of applying multiple drops or one drop of the curable composition, photocuring the first curable composition layer, and obtaining the first B-stage compound layer (the lower B-stage compound layer). Next, a process of applying multiple drops or one drop of the curable composition on the first B-stage compound layer (the lower B-stage compound layer) and photocuring the second curable composition layer (the upper B-stage compound layer) is performed to obtain the second B-stage compound layer. By repeating this operation n times (n is an integer greater than 2), n layers (the total number is n) of B-stage compound layers are obtained. The last n-th operation is to apply multiple drops or one drop of the curable composition on the n-1th B-stage compound layer, photocuring the n-th curable composition layer to obtain the n-th B-stage compound layer. After the photocuring step of obtaining the multi-layer B-stage compound layer, a step of forming a multi-layer bonding portion (thermal curing step) is performed. The step of forming a multi-layer bonding portion (thermal curing step) is a step of thermally curing the n-layer B-stage compound layer to form an n-layer bonding portion.

[0133] In the photocuring step, ultraviolet rays are preferably irradiated. The irradiance and irradiation time of ultraviolet rays in the photocuring step can be appropriately changed according to the composition of the curable composition and the coating thickness of the curable composition. The irradiance of ultraviolet rays in the photocuring step can be, for example, 1000 mW / cm 2 Above, can be 5000mW / cm 2 Above, and can be 10000mW / cm 2 Below, it can be 8000mW / cm 2 The irradiation time of ultraviolet rays in the photocuring step may be, for example, 0.01 seconds or longer, 0.1 seconds or longer, and 400 seconds or shorter, or 100 seconds or shorter.

[0134] When a plurality of drops of the curable composition are applied each time or one drop of the curable composition is applied each time and the applied curable composition is irradiated with light, the illuminance of ultraviolet rays in the photocuring step may be 1000 mW / cm 2 Above, and can be 10000mW / cm 2 In addition, the irradiation time of ultraviolet rays in the photocuring step may be 0.01 seconds or more and 100 seconds or less.

[0135] The heating temperature and heating time in the thermal curing process can be appropriately changed according to the composition of the curable composition and the thickness of the B-stage compound layer. The heating temperature in the thermal curing process can be, for example, 100°C or more, 120°C or more, 250°C or less, or 200°C or less. The heating time in the thermal curing process can be, for example, 5 minutes or more, 30 minutes or more, 600 minutes or less, or 300 minutes or less.

[0136] The electronic component may or may not have a molded resin portion. In the method for manufacturing the electronic component, the upper surface and the side surfaces of the bonding portion may or may not be sealed using a resin. From the viewpoint of further improving the sealing performance of the air cavity, in the method for manufacturing the electronic component, it is preferred that the following further be provided: (4) a step of sealing the upper surface and the side surfaces of the bonding portion using a resin (resin sealing step). From the viewpoint of further improving the sealing performance of the air cavity, in the method for manufacturing the electronic component, in the step (4) of sealing using a resin (resin sealing step), it is preferred that the resin is disposed on the upper surface and the side surfaces of the bonding portion to form a molded resin portion.

[0137] Examples of the resin include epoxy resins, acrylic resins, phenolic resins, silicone resins, and fluororesins. From the viewpoint of further improving the sealing properties of the air cavity, the resin is preferably an epoxy resin, an acrylic resin, or a phenolic resin, and more preferably an epoxy resin or an acrylic resin.

[0138] The ratio (height / width) of the height of the adhesive portion relative to the width of the adhesive portion is preferably 1.0 or more, more preferably 1.5 or more, further preferably 2.0 or more, and particularly preferably 2.5 or more. When the ratio (height / width) is above the lower limit, the adhesion and sealing properties can be further improved. The upper limit of the ratio (height / width) is not particularly limited. The ratio (height / width) of the adhesive portion can be less than 100, less than 50, less than 10, or less than 5.0. From the viewpoint of miniaturizing the obtained electronic component, the ratio (height / width) is preferably less than 5.0.

[0139] The width, height, shape, etc. of the bonding portion may be changed as appropriate.

[0140] The width of the adhesive portion is preferably the width of the adhesive portion in the contact surface between the surface of the circuit substrate and the adhesive portion. In the contact surface between the surface of the circuit substrate and the adhesive portion, the width of the adhesive portion may be greater than 50 μm, greater than 100 μm, greater than 150 μm, and less than 250 μm, less than 230 μm, or less than 200 μm.

[0141] The height of the adhesive portion is preferably the distance from the contact surface between the surface of the circuit substrate and the adhesive portion to the maximum height position of the adhesive portion. The distance from the contact surface between the surface of the circuit substrate and the adhesive portion to the maximum height position of the adhesive portion is preferably 1 μm or more, more preferably 10 μm or more, further preferably 50 μm or more, preferably 300 μm or less, more preferably 250 μm or less, further preferably 200 μm or less.

[0142] The bonding portion may be multi-layered. When the bonding portion is multi-layered, the thickness of each layer is preferably greater than 5 μm, more preferably greater than 10 μm, further preferably greater than 30 μm, preferably less than 300 μm, more preferably less than 200 μm, further preferably less than 100 μm.

[0143] The circuit substrate is a substrate having a circuit pattern on its surface.

[0144] Examples of the electronic component include semiconductor chips, capacitors, and light-emitting elements.

[0145] Examples of the semiconductor chip include a surface acoustic wave filter, a bulk acoustic wave filter, and a membrane elastic resonator filter.

[0146] Examples of the light emitting element include a light emitting diode and a semiconductor laser.

[0147] The electronic component is preferably a semiconductor chip, a capacitor, or a light-emitting element, more preferably a semiconductor chip, and still more preferably a surface acoustic wave filter, a bulk acoustic wave filter, or a membrane elastic resonator filter.

[0148] (Curable composition)

[0149] The curable composition is a curable composition that is liquid at 23° C. The viscosity of the curable composition at 23° C. and 10 rpm is preferably 3 mPa·s or more, more preferably 5 mPa·s or more, further preferably 10 mPa·s or more, further preferably 160 mPa·s or more, preferably 2000 mPa·s or less, more preferably 1600 mPa·s or less, further preferably 1500 mPa·s or less.

[0150] The viscosity is measured at 23° C. using an E-type viscometer (for example, “TVE22L” manufactured by Toki Sangyo Co., Ltd.) in accordance with JIS K2283.

[0151] The curable composition is preferably applied by an inkjet method. The curable composition is preferably applied by an inkjet device.

[0152] Using the curable composition, a circuit substrate and an electronic component can be bonded, and an air cavity can be formed. Using the curable composition, an electronic component with an air cavity can be manufactured. The curable composition is preferably a curable composition for bonding the upper surface of the circuit substrate and the side of the electronic component, and the curable composition is more preferably a curable composition for bonding the upper surface of the circuit substrate and the side and upper surface of the electronic component.

[0153] The curable composition is preferably used by curing it by irradiation with light and heating. The curable composition is preferably used by curing it by heating after curing it by irradiation with light. The curable composition is preferably photocurable, preferably thermocurable, and more preferably photocurable and thermocurable.

[0154] The curable composition preferably contains a photocurable compound (a curable compound that can be cured by irradiation with light), and more preferably contains a photocurable compound and a thermocurable compound (a curable compound that can be cured by heating).

[0155] Hereinafter, each component that can be used in the curable composition is described in detail. It should be noted that in this specification, "(meth)acryloyl" means "acryloyl" or "methacryloyl", and "(meth)acrylate" means "acrylate" or "methacrylate". In addition, in this specification, the CH2=CH group of the (meth)acryloyl group is not included in the vinyl group.

[0156] <(A) Photocurable Compound>

[0157] The curable composition preferably contains (A) a photocurable compound. (A) The photocurable compound has a photocurable functional group. Examples of the photocurable functional group include (meth)acryloyl and vinyl groups. (A) The photocurable compound may have a (meth)acryloyl group, may have a vinyl group, or may have both a (meth)acryloyl group and a vinyl group. (A) The photocurable compound may be used alone or in combination of two or more.

[0158] (A) The photocurable compound preferably does not have a thermosetting functional group as described below.

[0159] From the viewpoint of more effectively exerting the effects of the present invention and forming a curable composition layer with high precision, the photocurable compound (A) preferably has a (meth)acryloyl group or a vinyl group, and more preferably has a (meth)acryloyl group. The photocurable compound (A) is preferably a (meth)acrylate compound.

[0160] (A) The photocurable compound may be a monofunctional (meth)acrylate compound or a multifunctional (meth)acrylate compound. (A) The photocurable compound may be a difunctional (meth)acrylate compound or a (meth)acrylate compound having two or more functionalities, a trifunctional (meth)acrylate compound or a trifunctional (meth)acrylate compound or a tetrafunctional (meth)acrylate compound. (A) The photocurable compound may be a (meth)acrylate compound having 20 or less functionalities, a (meth)acrylate compound having 10 or less functionalities, or a (meth)acrylate compound having 5 or less functionalities. The number of functionalities corresponds to the number of (meth)acryloyl groups. (A) The photocurable compound may be used alone or in combination of two or more.

[0161] The (A) photocurable compound may have 1 (meth)acryloyl group, 2, 2 or more, 3, 3 or more, 4 or more, 20 or less, 10 or less, or 5 or less.

[0162] Examples of the monofunctional (meth)acrylate compound include methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, isobutyl (meth)acrylate, sec-butyl (meth)acrylate, tert-butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 3-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, allyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, 2-methoxyethyl (meth)acrylate, 2-phenoxy (meth)acrylate. acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, glycerol mono(meth)acrylate, 2-ethylhexyl (meth)acrylate, dihydroxycyclopentadienyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, dicyclopentyl (meth)acrylate, naphthyl (meth)acrylate, lauryl (meth)acrylate, dodecyl (meth)acrylate and stearyl (meth)acrylate, etc.

[0163] Examples of the bifunctional (meth)acrylate compound include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonane di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propylene glycol di(meth)acrylate, and ethoxylated cyclohexane methanol di(meth)acrylate. Ester, ethoxylated bisphenol di(meth)acrylate, polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, ethylene glycol di(meth)acrylate, 2-ethyl-2-butylbutanediol di(meth)acrylate, 2-ethyl-2-butylpropylene glycol di(meth)acrylate, tricyclodecane di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, urethane (meth)acrylate and dipropylene glycol di(meth)acrylate, etc.

[0164] Examples of the trifunctional (meth)acrylate compound include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, trimethylolpropane tri(meth)acrylate modified with alkylene oxide, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl) ether, isocyanuric acid tri(meth)acrylate modified with alkylene oxide, propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, and sorbitol tri(meth)acrylate.

[0165] Examples of the tetrafunctional (meth)acrylate compound include pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol propionate tetra(meth)acrylate.

[0166] Examples of the pentafunctional (meth)acrylate compound include sorbitol penta(meth)acrylate and dipentaerythritol penta(meth)acrylate.

[0167] Examples of the hexafunctional (meth)acrylate compound include dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, and alkylene oxide-modified hexa(meth)acrylate of phosphazene.

[0168] Examples of the (A) photocurable compound having a vinyl group include vinyl ethers, vinyl derivatives, styrene, chloromethylstyrene, α-methylstyrene, maleic anhydride, dicyclopentadiene, N-vinylpyrrolidone, and N-vinylformamide.

[0169] In 100 wt % of the curable composition, the content of the photocurable compound (A) is preferably 2 wt % or more, more preferably 5 wt % or more, further preferably 10 wt % or more, and particularly preferably 15 wt % or more. In 100 wt % of the curable composition, the content of the photocurable compound (A) is preferably 80 wt % or less, more preferably 70 wt % or less, further preferably 65 wt % or less, further preferably 60 wt % or less, further preferably 50 wt % or less, and particularly preferably 40 wt % or less. When the content of the photocurable compound (A) is above the lower limit and below the upper limit, the effect of the present invention can be further effectively exerted.

[0170] The curable composition may include (C) a photo- and heat-curable compound described below.

[0171] When the curable composition contains (C) a light and heat curable compound, the content of the (A) photocurable compound in 100% by weight of the curable composition is preferably 2% by weight or more, more preferably 5% by weight or more, and further preferably 10% by weight or more, and is preferably 65% ​​by weight or less, more preferably 60% by weight or less, and further preferably 55% by weight or less. When the content of the (A) photocurable compound is above the lower limit and below the upper limit, the effect of the present invention can be more effectively exerted.

[0172] When the curable composition does not contain (C) a light- and heat-curable compound, the content of the (A) photocurable compound in 100% by weight of the curable composition is preferably 5% by weight or more, more preferably 10% by weight or more, and further preferably 20% by weight or more, and is preferably 55% by weight or less, more preferably 45% by weight or less, and further preferably 35% by weight or less. When the content of the (A) photocurable compound is above the lower limit and below the upper limit, the effect of the present invention can be more effectively exerted.

[0173] <(B) Thermosetting Compound>

[0174] The curable composition preferably contains (B) a thermosetting compound. (B) The thermosetting compound has a thermosetting functional group. Examples of the thermosetting functional group include a cyclic ether group and a thioethylene group. (B) The thermosetting compound may have a cyclic ether group, may have a thioethylene group, or may have both a cyclic ether group and a thioethylene group. (B) The thermosetting compound may be used alone or in combination of two or more.

[0175] Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The epoxy group may be a part of a glycidyl group, or may be an epoxy group in a glycidyl group.

[0176] (B) The thermosetting compound preferably does not have the photocurable functional group.

[0177] From the viewpoint of more effectively exerting the effects of the present invention, the (B) thermosetting compound preferably has a cyclic ether group, and more preferably has an epoxy group. From the viewpoint of more effectively exerting the effects of the present invention, the (B) thermosetting compound is preferably an epoxy compound.

[0178] Examples of the epoxy compound include bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, bisphenol S type epoxy compounds, phenol novolac type epoxy compounds, biphenyl type epoxy compounds, biphenyl novolac type epoxy compounds, biphenol type epoxy compounds, naphthalene type epoxy compounds, fluorene type epoxy compounds, phenol aralkyl type epoxy compounds, naphthol aralkyl type epoxy compounds, dicyclopentadiene type epoxy compounds, anthracene type epoxy compounds, epoxy compounds having an adamantane skeleton, epoxy compounds having a tricyclodecane skeleton, naphthylene ether type epoxy compounds, and epoxy compounds having a triazine nucleus on the skeleton.

[0179] The thermosetting compound having an ethylene sulfide group is obtained by converting the epoxy group of the epoxy compound having an epoxy group into an ethylene sulfide group. As a method for converting into the ethylene sulfide group, it is preferable to add a solution containing the epoxy compound having an epoxy group to a first solution containing a sulfiding agent continuously or intermittently, and then further add a second solution containing a sulfiding agent continuously or intermittently. The epoxy group can be converted into an ethylene sulfide group by this method.

[0180] In addition, the (B) thermosetting compound may be a maleimide compound, a styrene compound, a phenoxy compound, an oxetane compound, an episulfide compound, a (meth)acrylic compound, a phenol compound, an amino compound, an unsaturated polyester compound, a polyurethane compound or a polysiloxane compound, etc. From the viewpoint of further improving the sealing property of the air cavity, the (B) thermosetting compound is preferably a polysiloxane compound.

[0181] In 100 wt % of the curable composition, the content of the thermosetting compound (B) is preferably 10 wt % or more, more preferably 15 wt % or more, and further preferably 20 wt % or more, and is preferably 50 wt % or less, more preferably 40 wt % or less, and further preferably 35 wt % or less. When the content of the thermosetting compound (B) is above the lower limit and below the upper limit, the effect of the present invention can be further effectively exerted, and the bonding strength between the circuit substrate and the electronic component and the bonding portion can be further improved.

[0182] In the curable composition of 100% by weight, the total content of (A) photocurable compound and (B) thermosetting compound is preferably 7% by weight or more, more preferably 12% by weight or more, further preferably 17% by weight or more, particularly preferably 20% by weight or more, and most preferably 30% by weight or more. In the curable composition of 100% by weight, the total content of (A) photocurable compound and (B) thermosetting compound is preferably 75% by weight or less, more preferably 70% by weight or less, and further preferably 65% ​​by weight or less. When the total content is above the lower limit and below the upper limit, the effect of the present invention can be further effectively exerted.

[0183] <(C) Photo- and Heat-Curing Compounds>

[0184] The curable composition may or may not contain (C) a photo- and thermosetting compound. (C) The photo- and thermosetting compound has a photo-curable functional group and a thermosetting functional group. From the viewpoint of further improving the bonding strength between the circuit substrate and the electronic component and the bonding portion, the curable composition preferably contains (C) a photo- and thermosetting compound. (C) The photo- and thermosetting compound may be used alone or in combination of two or more. It should be noted that in this specification, the "photo- and thermosetting" in the compound means that the compound has both photo-curable and thermosetting properties.

[0185] The photo- and heat-curable compound (C) may have a cyclic ether group and a (meth)acryloyl group, and may have an epoxy group and a (meth)acryloyl group. The photo- and heat-curable compound (C) is preferably a curable compound different from the photo-curable compound (A) and the heat-curable compound (B).

[0186] Examples of the (C) photo- and heat-curable compound having an epoxy group and a (meth)acryloyl group include glycidyl (meth)acrylate, allyl glycidyl ether, 4-hydroxybutyl (meth)acrylate glycidyl ether, and 3,4-epoxycyclohexylmethyl (meth)acrylate.

[0187] (C) The photo- and heat-curable compound is preferably glycidyl (meth)acrylate or 4-hydroxybutyl (meth)acrylate glycidyl ether, and more preferably 4-hydroxybutyl (meth)acrylate glycidyl ether. In this case, the effect of the present invention can be further effectively exerted, and the bonding strength between the circuit substrate and the electronic component and the bonding portion can be further improved.

[0188] In 100 wt % of the curable composition, the content of the light and heat curable compound (C) is preferably 5 wt % or more, more preferably 10 wt % or more, and preferably 70 wt % or less, more preferably 65 wt % or less, and further preferably 60 wt % or less. When the content of the light and heat curable compound (C) is above the lower limit and below the upper limit, the effect of the present invention can be further effectively exerted, and the bonding strength between the circuit substrate and the electronic component and the bonding portion can be further improved.

[0189] From the viewpoint of further improving the sealing property of the air cavity, the curable composition preferably contains an epoxy compound, a (meth)acrylate compound, or a polysiloxane compound.

[0190] <Photopolymerization Initiator>

[0191] The curable composition preferably contains a photopolymerization initiator.

[0192] As the photopolymerization initiator, there can be cited a photoradical polymerization initiator and a photocationic polymerization initiator, etc. The photopolymerization initiator can be used alone or in combination of two or more. From the viewpoint of further improving the sealing property of the air cavity, the photopolymerization initiator is preferably a photoradical polymerization initiator.

[0193] The photoradical polymerization initiator is a compound used to generate free radicals by irradiation with light to start a free radical polymerization reaction. Examples of the photoradical polymerization initiator include benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, and benzoin isopropyl ether; alkyl phenone compounds such as 1-hydroxycyclohexyl phenyl ketone and 2-hydroxy-2-methylpropiophenone; acetophenone compounds such as acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, and 1,1-dichloroacetophenone; 2-methyl-1-[4-(methylthio)phenyl]-2-morpholinopropane-1-one, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl)-butan-1-one, 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinophenyl)phenyl]-1-butanone, 2-(dimethylamino)-1-(4-morpholinophenyl)-2-benzyl-1-butanone, phenylbis(2,4,6-trimethylbenzyl) aminoacetophenone compounds such as 2-methylanthraquinone, 2-ethylanthraquinone, and 2-tert-butylanthraquinone; thioxanthone compounds such as 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, and 2,4-diisopropylthioxanthone; acetophenone dimethyl ketal, benzil dimethyl ketal, and other ketal compounds; acylphosphine oxide compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide; 1,2-octanedione, 1-[4-(phenylthio)-2-(o-benzoyl oxime)], ethyl ketone, 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(o-acetyl oxime) and other oxime ester compounds; bis(cyclopentadienyl)-di-phenyl-titanium, bis(cyclopentadienyl)-di-chloro-titanium, bis(cyclopentadienyl)-bis(2,3,4,5,6-pentafluorophenyl)titanium, bis(cyclopentadienyl)-bis(2,6-difluoro-3-(pyrrol-1-yl)phenyl)titanium and other titanocene compounds. The photo-radical polymerization initiator may be used alone or in combination of two or more.

[0194] From the viewpoint of further improving the sealing property of the air cavity, the photopolymerization initiator preferably contains an aminoacetophenone compound, and more preferably contains 2-(dimethylamino)-2-(4-methylbenzyl)-1-(4-morpholinophenyl)butan-1-one.

[0195] A photopolymerization initiation aid may be used together with the photo radical polymerization initiator. Examples of the photopolymerization initiation aid include ethyl N,N-dimethylaminobenzoate, isopentyl N,N-dimethylaminobenzoate, amyl-4-dimethylaminobenzoate, triethylamine, and triethanolamine. The photopolymerization initiation aid may be used alone or in combination of two or more.

[0196] Furthermore, a titanocene compound such as CGI-784 (manufactured by CHIBA SPECIALTY CHEMICALS) which absorbs in the visible light region may be used to promote the photoreaction.

[0197] Examples of the photocationic polymerization initiator include sulfonium salts, iodonium Salts, metallocene compounds, and benzoin p-toluenesulfonate, etc. The photocationic polymerization initiator may be used alone or in combination of two or more.

[0198] From the viewpoint of further improving the sealing property of the air cavity, the content of the photopolymerization initiator in 100 wt % of the curable composition is preferably 4 wt % or more, more preferably 5 wt % or more, and preferably 20 wt % or less, more preferably 15 wt % or less.

[0199] <Thermosetting Agent>

[0200] The curable composition preferably includes a thermal curing agent. The thermal curing agent thermally cures the thermal curable compound.

[0201] Examples of the thermosetting agent include organic acids, amine compounds, amide compounds, hydrazide compounds, imidazole compounds, imidazoline compounds, phenol compounds, urea compounds, polysulfide compounds, and acid anhydrides. The thermosetting agent may be used alone or in combination of two or more.

[0202] Examples of the amine compound include aliphatic polyamines, alicyclic polyamines, aromatic polyamines, hydrazides, and guanidine derivatives. The amine compound may be a modified polyamine compound such as an amine-epoxy adduct. The amine compound may be an adduct of the amine compound. Examples of the adduct of the amine compound include epoxy compound addition polyamines (reactants of epoxy compounds and polyamines), Michael addition polyamines (reactants of α,β-unsaturated ketones and polyamines), Mannich addition polyamines (condensates of polyamines, formalin, and phenol), thiourea addition polyamines (reactants of thiourea and polyamines), and ketone-terminated polyamines (reactants of ketone compounds and polyamines (ketimines)).

[0203] Examples of the aliphatic polyamine include diethylenetriamine, triethylenetetramine, tetraethylenepentamine, and diethylaminopropylamine.

[0204] Examples of the alicyclic polyamine include menthanediamine, isophoronediamine, N-aminoethylpiperazine, 3,9-bis(3-aminopropyl)-2,4,8,10-tetraoxaspiro(5,5)undecane adduct, bis(4-amino-3-methylcyclohexyl)methane, and bis(4-aminocyclohexyl)methane.

[0205] Examples of the aromatic polyamine include meta-phenylenediamine, para-phenylenediamine, o-xylylenediamine, meta-xylylenediamine, para-xylylenediamine, 4,4-diaminodiphenylmethane, 4,4'-diamino-3,3'-diethyl-5,5'-dimethyldiphenylmethane, 4,4-diaminodiphenylpropane, 4,4-diaminodiphenyl sulfone, 4,4-diaminodicyclohexane, bis(4-aminophenyl)phenylmethane, 1,5-diaminonaphthalene, 1,1-bis(4-aminophenyl)cyclohexane, 2,2-bis[(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, 1,3-bis(4-aminophenoxy)benzene, 4,4-methylene-bis(2-chloroaniline) and 4,4-diaminodiphenyl sulfone.

[0206] Examples of the hydrazide include carbodihydrazide, adipic acid dihydrazide, sebacic acid dihydrazide, dodecanedioic acid dihydrazide, and isophthalic acid dihydrazide.

[0207] Examples of the guanidine derivatives include dicyandiamide, 1-o-tolylbiguanidine, α-2,5-dimethylguanidine, α,ω-diphenylbiguanidine, α,α-diguanylylguanidine diphenyl ether, p-chlorophenylbiguanidine, α,α-hexamethylenebis[ω-(p-chlorophenol)]biguanide, phenylbiguanide oxalate, acetylguanidine, and diethylcyanoacetylguanidine.

[0208] Examples of the phenolic compound include polyphenolic compounds, etc. Examples of the polyphenolic compound include phenol, cresol, ethylphenol, butylphenol, octylphenol, bisphenol A, tetrabromobisphenol A, bisphenol F, bisphenol S, 4,4'-biphenol, phenol novolac resins containing a naphthalene skeleton, phenol novolac resins containing a benzylene skeleton, phenol novolac resins containing a dicyclopentadiene skeleton, and phenol novolac resins containing a fluorene skeleton.

[0209] Examples of the acid anhydride include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, anhydrous methylnadic acid, anhydrous dodecylsuccinic acid, chlorendic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, methylcyclohexenetetracarboxylic anhydride, trimellitic anhydride, and polyazelaic anhydride.

[0210] The thermosetting agent preferably contains an amine compound, preferably an amine compound. The amine compound is preferably an aromatic amine compound. In this case, the bonding strength between the circuit substrate and the electronic component and the bonding portion can be further improved.

[0211] In 100 wt % of the curable composition, the content of the thermosetting agent is preferably 1 wt % or more, more preferably 5 wt % or more, further preferably 10 wt % or more, preferably 40 wt % or less, more preferably 30 wt % or less, further preferably 25 wt % or less. When the content of the thermosetting agent is above the lower limit and below the upper limit, the bonding strength between the circuit substrate and the electronic component and the bonding portion can be further improved.

[0212] <Curing Accelerator>

[0213] The curable composition may or may not contain a curing accelerator. The curing accelerator may be used alone or in combination of two or more.

[0214] Examples of the curing accelerator include tertiary amines, imidazoles, quaternary ammonium salts, Salts, organic metal salts, phosphorus compounds and urea compounds, etc.

[0215] The content of the curing accelerator in 100 wt % of the curable composition is preferably 0.01 wt % or more, more preferably 0.05 wt % or more, and is preferably 10 wt % or less, more preferably 5 wt % or less.

[0216] <Solvent>

[0217] The curable composition may or may not contain a solvent. The solvent may be used alone or in combination of two or more.

[0218] Examples of the solvent include hydrated organic solvents and the like.

[0219] From the viewpoint of further improving the removability of the residue, the solvent is preferably an organic solvent.

[0220] Examples of the organic solvent include alcohols such as ethanol, ketones such as acetone, methyl ethyl ketone, and cyclohexanone, aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene, glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and tripropylene glycol monomethyl ether, ethyl acetate, butyl acetate, butyl lactate, cellosolve acetate, butyl cellosolve acetate, carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether acetate, dipropylene glycol monomethyl ether acetate, and esters such as propylene carbonate, aliphatic hydrocarbons such as octane and decane, and petroleum solvents such as petroleum ether and naphtha.

[0221] From the viewpoint of further improving the thickness accuracy of the curable composition layer, the content of the solvent in the curable composition is preferably as small as possible.

[0222] When the curable composition contains the solvent, the content of the solvent in 100 wt % of the curable composition is preferably 5 wt % or less, more preferably 1 wt % or less, and further preferably 0.5 wt % or less. The curable composition most preferably does not contain the solvent.

[0223] <Other ingredients>

[0224] The curable composition may contain other components in addition to the above components. Examples of the other components include coupling agents, fillers, leveling agents, defoaming agents, and polymerization inhibitors.

[0225] Explanation of symbols

[0226] 1…Circuit board

[0227] 2…Electronic components

[0228] 3. 3X…bonding part

[0229] 3A...Curing composition layer

[0230] 3B…B-stage compound layer

[0231] 10, 10X, 11, 12…Electronic components

[0232] 41…Solder balls

[0233] 42…Resin sheet

[0234] 43…Contact terminal

[0235] 44…Molding resin part

[0236] 51…Ejection part

[0237] 52...Light irradiation part

[0238] R…Air cavity

Claims

1. A method for manufacturing an electronic component, comprising: The step of mounting at least one electronic component on the circuit substrate; A step of applying a curable composition that is liquid at 23° C. onto the upper surface of the circuit substrate to form a curable composition layer; and a step of curing the curable composition layer to form an adhesive portion, In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with at least a portion of a side surface of the electronic member. An air cavity is formed by the circuit substrate, the electronic component, and the bonding portion.

2. The method for manufacturing an electronic component according to claim 1, wherein: There are multiple electronic components. In the step of mounting the electronic components, a plurality of the electronic components are mounted on the circuit board with gaps therebetween. In the step of forming the curable composition layer, the curable composition layer is formed so as not to be in contact with at least a portion of the side surfaces of the electronic components in a portion adjacent to the plurality of electronic components.

3. The method for manufacturing an electronic component according to claim 1, wherein: In the step of forming the curable composition layer, the curable composition layer is formed over the entire periphery of the electronic component so as to be in contact with the side surface of the electronic component.

4. The method for manufacturing an electronic component according to any one of claims 1 to 3, wherein: In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with the upper end to the lower end of the side surface of the electronic member.

5. The method for manufacturing an electronic component according to any one of claims 1 to 4, wherein: In the step of forming the curable composition layer, the curable composition layer is formed so as to be in contact with an edge portion of the upper surface of the electronic component.

6. The method for manufacturing an electronic component according to any one of claims 1 to 5, wherein: In the step of forming the curable composition layer, the curable composition layer is formed so as not to come into contact with the lower surface of the electronic member.

7. The method for manufacturing an electronic component according to any one of claims 1 to 6, wherein: The step of forming the bonding portion comprises: A step of photocuring the curable composition layer to form the adhesive portion.

8. The method for manufacturing an electronic component according to any one of claims 1 to 7, wherein: The step of forming the bonding portion comprises: A step of photocuring the curable composition layer to obtain a B-stage layer; and The step of thermally curing the B-stage compound layer to form the bonding portion.

9. The method for manufacturing an electronic component according to claim 8, wherein: The step of forming the bonding portion comprises: Each time a plurality of drops or one drop of the curable composition is applied, the curable composition layer is photocured to obtain a multi-layer B-stage compound layer; and The step of thermally curing the multi-layered B-stage material layer to form a multi-layered adhesive portion.

10. The method for manufacturing an electronic component according to any one of claims 1 to 9, further comprising: A step of sealing the upper surface and side surfaces of the bonding portion using a resin.

11. The method for manufacturing an electronic component according to any one of claims 1 to 10, wherein: In the step of forming the curable composition layer, the curable composition is applied by an inkjet method.

12. An electronic component comprising a circuit board, at least one electronic component and an adhesive portion, At least one of the electronic components is mounted on the circuit substrate. The adhesive portion is a cured product of a curable composition that is liquid at 23°C. The bonding portion is in contact with the upper surface of the circuit substrate and at least a portion of the side surface of the electronic component. An air cavity is formed by the circuit substrate, the electronic component, and the bonding portion.

13. The electronic component according to claim 12, wherein: There are multiple electronic components. A plurality of the electronic components are mounted on the circuit substrate at intervals. The adhesive portion does not contact at least a portion of the side surface of the electronic component in a portion where the plurality of electronic components are adjacent to each other.

14. The electronic component according to claim 12, wherein The adhesive portion is in contact with a side surface of the electronic component over the entire periphery of the electronic component.

15. The electronic component according to any one of claims 12 to 14, wherein The bonding portion is in contact with an edge portion of the upper surface of the electronic component.

16. The electronic component according to any one of claims 12 to 15, wherein The adhesive portion does not contact the lower surface of the electronic component.

17. The electronic component according to any one of claims 12 to 16, wherein The height of the bonding portion is greater than or equal to 1 μm and less than or equal to 300 μm.

18. The electronic component according to any one of claims 12 to 17, wherein The curable composition includes an epoxy compound, a (meth)acrylate compound, or a polysiloxane compound.

19. The electronic component according to any one of claims 12 to 18, wherein The electronic component is a semiconductor chip, a capacitor or a light emitting element.

20. The electronic component according to any one of claims 12 to 19, wherein The electronic component is a surface acoustic wave filter, a bulk elastic wave filter or a membrane elastic resonator filter.

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