High-precision photoresist removing and stripping equipment and steps for wafer processing

Abstract

The invention discloses high-precision photoresist removing and stripping equipment and steps for wafer processing, belongs to the field of wafer processing, and aims to overcome the defects that when chippings move in cleaning liquid, the chippings are likely to make contact with the surface of a wafer again, the wafer is abraded, and scratches, pits and the like are likely to appear on the surface of the wafer due to excessive abrasion. The high-precision degumming and stripping equipment for wafer processing comprises a cleaning and stripping box, an ultrasonic machine fixedly connected to the outer side of the cleaning and stripping box, a clamp arranged on the inner side of the cleaning and stripping box, and a filter pump machine communicated to the outer side of the cleaning and stripping box. According to the technical scheme, the pushing mechanism can push chips downwards when the pushing mechanism moves downwards, and compared with the prior art, the number of the chips staying around the wafer is reduced, so that the purpose of enabling the stripping effect to be better is achieved.

Description

Technical Field

[0001] The invention relates to the field of wafer processing, and in particular to a high-precision debonding and stripping device and steps for wafer processing. Background Art

[0002] The high-precision debonding and stripping equipment used for wafer processing is a device that utilizes the high-frequency vibration effect generated by ultrasound in the cleaning liquid. When ultrasound propagates in the cleaning liquid, it causes violent vibration of the liquid molecules, forming tiny bubbles. These bubbles continue to grow and shrink under the action of ultrasound. When the bubbles burst, they release huge energy, generating local high-temperature and high-pressure microjets and shock waves. The microjets and shock waves can effectively impact the photoresist and other attachments on the surface of the wafer.

[0003] The patent with publication number CN217325569U includes a box body, a cavity is arranged in the box body, a workbench is arranged in the cavity, a bracket is arranged on the workbench, a vibrator is fixed on the bracket, a water tank is fixed on the top of the box body, the water tank is connected to the nozzle through a connecting pipe, a blower is fixed on the side of the box body, the blower is connected to the cavity through a vent, a controller is fixed on the front of the box body, the controller is connected to the blower, the controller is connected to the nozzle, and the controller is connected to the vibrator. The wafer degumming cleaning device, the wafer is placed in a sealed environment for cleaning, the wafer is contaminated, and the wafer is vibrated by the vibrator after cleaning. In the existing ultrasonic cleaning process, the debris falling off the surface of the wafer is easy to move back and forth in the cleaning solution. These debris may include photoresist particles, metal particles, etc. Due to the vibration of ultrasound and the flow of cleaning fluid, it is difficult for the debris to stay in one position stably. When the debris moves in the cleaning fluid, they are likely to come into contact with the wafer surface again, causing wear to the wafer. Excessive wear may cause defects such as scratches and pits on the wafer surface, seriously affecting the quality and performance of the wafer.

[0004] To solve the above problems, a high-precision stripping device and steps for wafer processing are proposed. Summary of the invention

[0005] The purpose of the present invention is to provide a high-precision debonding and stripping equipment and steps for wafer processing, which solves the problem that when debris moves in the cleaning solution, they are likely to contact the wafer surface again and cause wear to the wafer. Such excessive wear may cause defects such as scratches and pits on the wafer surface, seriously affecting the quality and performance of the wafer.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-precision debonding and stripping device for wafer processing, comprising a cleaning and stripping box, an ultrasonic machine fixedly connected to the outside of the cleaning and stripping box, a clamp arranged on the inside of the cleaning and stripping box, a filter pump connected to the outside of the cleaning and stripping box, a pushing mechanism arranged at the upper end of the cleaning and stripping box, and a rotating mechanism arranged on one side of the pushing mechanism;

[0007] The pushing mechanism includes a sliding component and a limiting component, and the limiting component is arranged on one side of the sliding component;

[0008] The sliding assembly includes a first support plate fixedly connected above the cleaning and stripping box, a cylinder fixedly connected to the inner side of the first support plate, a gas rod fixedly connected to the output end of the cylinder, a first fixed block fixedly connected to the lower end of the gas rod, a second sliding hole is provided inside the lower end of the first fixed block, a first pushing rod is provided inside the second sliding hole, and one end of the first pushing rod is fixedly connected to the pushing plate.

[0009] Preferably, the central axis of the gas rod is perpendicular to the central axis of the first fixing block.

[0010] Preferably, the first push rod is connected to the first fixed block in a sliding connection, and the appearance structure of the first push rod is cylindrical, and the width of the first push rod is consistent with that of the second sliding hole.

[0011] Preferably, the limiting assembly includes a first rotating shaft fixedly connected to the other end of the first pushing rod, a first gear is fixedly connected to the outer side of the first rotating shaft, a first rack is arranged on the outer side of the first gear, a first slide groove is arranged inside the cleaning and stripping box, a second slider is arranged on the inner side of the first slide groove, the second slider and the first rack are connected in a fixed manner, a guide groove is arranged on one side of the first slide groove, the other end of the first rotating shaft is nested in the inner side of the guide groove, a point a is arranged on the inner side of the upper end of the guide groove, a point b is arranged on the inner side of the upper end of the guide groove, a point c is arranged on the outer side of the lower end of the guide groove, a point d is arranged on the inner side of the lower end of the guide groove, and the first rack is connected to the gas rod in a fixed manner.

[0012] Preferably, the width of the first chute away from the center of the cleaning and stripping box is greater than the width of the first chute close to the center of the cleaning and stripping box, and the central axis of the first chute is perpendicular to the bottom surface of the cleaning and stripping box.

[0013] Preferably, the appearance structures of the left and right ends of the guide groove are vertical straight lines, and the appearance structures of the upper and lower ends of the guide groove are inclined straight lines.

[0014] Preferably, point a of the guide groove is farther away from the clamp than point b of the guide groove, and point c of the guide groove is closer to the clamp than point d of the guide groove.

[0015] Preferably, the appearance structure of the first rotating shaft is a rectangular parallelepiped, and the width of the first rotating shaft is smaller than the width of the upper and lower ends of the guide groove.

[0016] Preferably, the rotating mechanism includes a second rotating shaft fixedly connected to one end of the clamp, the other end of the second rotating shaft is fixedly connected to the second gear, a sliding plate is provided on one side of the second gear, a hole is provided on the middle inner side of the sliding plate, the upper end width of the hole is smaller than the lower end width of the hole, the upper end width of the hole is consistent with the width of the second rotating shaft, and the appearance structure of the second rotating shaft is a rectangular parallelepiped, the second rotating shaft is nested on the inner side of the hole, a groove is provided inside the other side of the sliding plate, a second push rod is provided on the inner side of the groove, the second push rod is connected to the first fixed block in a fixed manner, and the lower end of the first fixed block is fixedly connected to the second rack.

[0017] The steps of a high-precision debonding and stripping device for wafer processing are as follows: a wafer is clamped and fixed with a clamp, and when a cylinder is started to move downward, a push plate drives water to move outward and downward, so that debris leaves the periphery of the wafer, and drives the clamp and the wafer to rotate at a certain angle, so that the water flow can impact and strip from multiple angles to complete the debonding.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The present invention provides a high-precision debonding and stripping device and steps for wafer processing. By providing a pushing mechanism, the pushing mechanism can push the debris downward when it moves downward. Compared with the prior art, the debris staying around the wafer is reduced, thereby achieving the purpose of better stripping effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall three-dimensional structure of the present invention;

[0021] Figure 2 It is a schematic diagram of the left side cross-sectional structure of the cleaning and stripping box of the present invention;

[0022] Figure 3 It is a schematic diagram of the left cross-sectional structure of the sliding plate of the present invention;

[0023] Figure 4 It is a schematic diagram of the left side cross-sectional structure of the first gear of the present invention;

[0024] Figure 5 It is a schematic diagram of the left-side cross-sectional structure of the guide groove of the present invention;

[0025] Figure 6 For the present invention Figure 3 Schematic diagram of the structure at point A in the middle.

[0026] In the figure: 1. cleaning and stripping box; 2. ultrasonic machine; 3. clamp; 7. filter pump; 6. pushing mechanism; 5. rotating mechanism; 61. sliding assembly; 62. limiting assembly; 6101. first supporting plate; 6102. cylinder; 6103. gas rod; 6105. first fixing block; 6106. second sliding hole; 6107. first pushing rod; 6108. pushing plate; 6201. first rotating shaft; 6202. first gear; 6203. first rack; 6204. first sliding groove; 6205. second sliding block; 6206. guide groove; 501. second rotating shaft; 502. second gear; 503. sliding plate; 504. hole; 505. groove; 506. second pushing rod; 507. second rack. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0028] See also Figure 1-Figure 6 The present invention provides a technical solution: a high-precision debonding and stripping device for wafer processing, comprising a cleaning and stripping box 1, an ultrasonic machine 2 fixedly connected to the outside of the cleaning and stripping box 1, a clamp 3 arranged inside the cleaning and stripping box 1, a filter pump 7 connected to the outside of the cleaning and stripping box 1, a pushing mechanism 6 is arranged at the upper end of the cleaning and stripping box 1, and a rotating mechanism 5 is arranged on one side of the pushing mechanism 6;

[0029] The pushing mechanism 6 includes a sliding component 61 and a limiting component 62, and the limiting component 62 is arranged on one side of the sliding component 61;

[0030] The sliding assembly 61 includes a first support plate 6101 fixedly connected above the cleaning and stripping box 1, a cylinder 6102 is fixedly connected to the inner side of the first support plate 6101, a gas rod 6103 is fixedly connected to the output end of the cylinder 6102, and a first fixed block 6105 is fixedly connected to the lower end of the gas rod 6103. The sliding assembly 61 includes a first support plate 6101 fixedly connected above the cleaning and stripping box 1, a cylinder 6102 is fixedly connected to the inner side of the first support plate 6101, a gas rod 6103 is fixedly connected to the output end of the cylinder 6102, and a first fixed block 6105 is fixedly connected to the lower end of the gas rod 6103. There is a first fixed block 6105, a second sliding hole 6106 is arranged inside the lower end of the first fixed block 6105, a first push rod 6107 is arranged on the inner side of the second sliding hole 6106, one end of the first push rod 6107 is fixedly connected to a push plate 6108, the first push rod 6107 is connected to the first fixed block 6105 in a sliding connection, and the appearance structure of the first push rod 6107 is cylindrical, and the width of the first push rod 6107 is consistent with the width of the second sliding hole 6106, so that the first push rod 6107 can rotate and slide on the inner side of the second sliding hole 6106.

[0031] The limiting assembly 62 includes a first rotating shaft 6201 fixedly connected to the other end of the first pushing rod 6107, a first gear 6202 fixedly connected to the outer side of the first rotating shaft 6201, a first rack 6203 is arranged on the outer side of the first gear 6202, a first slide groove 6204 is arranged inside the cleaning and stripping box 1, a second slider 6205 is arranged on the inner side of the first slide groove 6204, and the width of the first slide groove 6204 away from the center of the cleaning and stripping box 1 is greater than the width of the first slide groove 6204 close to the cleaning and stripping box 1. The width of one side of the center of the box 1, and the central axis of the first slide groove 6204 is perpendicular to the bottom surface of the cleaning and stripping box 1, so that the second slider 6205 will not move out of the inner side of the first slide groove 6204, the second slider 6205 is connected to the first rack 6203 in a fixed connection, a guide groove 6206 is provided on one side of the first slide groove 6204, the other end of the first rotating shaft 6201 is nested in the inner side of the guide groove 6206, and a point a is provided on the inner side of the upper end of the guide groove 6206. The inner side is provided with point b, the outer side of the lower end of the guide groove 6206 is provided with point c, the inner side of the lower end of the guide groove 6206 is provided with point d, the left and right ends of the guide groove 6206 have a vertical straight line shape, and the upper and lower ends of the guide groove 6206 have an inclined straight line shape. The appearance structure of the first rotating shaft 6201 is a rectangular parallelepiped, and the width of the first rotating shaft 6201 is smaller than the width of the upper and lower ends of the guide groove 6206, so that the first rotating shaft 6201 can be moved at the upper and lower ends of the guide groove 6206. It can rotate when moving, but it will not rotate when moving in the middle of the guide groove 6206. Point a of the guide groove 6206 is farther away from the clamp 3 than point b of the guide groove 6206, and point c of the guide groove 6206 is closer to the clamp 3 than point d of the guide groove 6206, so that when the first rotating shaft 6201 moves to point a of the guide groove 6206 and moves downward, it can move to the side of the guide groove 6206 away from the clamp 3, and the connection method between the first rack 6203 and the gas rod 6103 is a fixed connection.

[0032] The rotating mechanism 5 includes a second rotating shaft 501 fixedly connected to one end of the clamp 3, and the other end of the second rotating shaft 501 is fixedly connected to the second gear 502, a sliding plate 503 is arranged on one side of the second gear 502, and a hole 504 is arranged on the middle inner side of the sliding plate 503, the upper end width of the hole 504 is smaller than the lower end width of the hole 504, the upper end width of the hole 504 is consistent with the width of the second rotating shaft 501, and the appearance structure of the second rotating shaft 501 is a rectangular parallelepiped, the second rotating shaft 501 is nested on the inner side of the hole 504, a groove 505 is arranged inside the other side of the sliding plate 503, and a second push rod 506 is arranged on the inner side of the groove 505, the second push rod 506 is connected to the first fixed block 6105 in a fixed connection, and the lower end of the first fixed block 6105 is fixedly connected to the second rack 507.

[0033] The steps of a high-precision debonding and stripping device for wafer processing are as follows: the wafer is clamped and fixed using a clamp 3, and when the cylinder 6102 is started to move downward, the push plate 6108 drives the water flow to move outward and downward, so that the debris leaves the wafer, and drives the clamp 3 and the wafer to rotate at a certain angle, so that the water flow can impact and strip from multiple angles to complete the debonding.

[0034] When debonding and stripping are required, the wafer is clamped and fixed using the clamp 3, and the cylinder 6102 is started to move downward, driving the air rod 6103 and the first fixed block 6105 to move downward, so that the second slide hole 6106 and the first push rod 6107 move downward. Because the appearance structure of the first rotating shaft 6201 is a rectangular parallelepiped, and the width of the first rotating shaft 6201 is smaller than the width of the upper and lower ends of the guide groove 6206, the first push rod 6107 drives the first gear 6202, the first rotating shaft 6201, and the push plate 6108 to move downward, pushing the water flow downward. Because the push plate 6108 moves downward with a larger lateral surface, a large amount of water is pushed downward, which not only makes the debris in the vertical direction move downward, but also because there is no water in the pushing place, the water pressure on both sides is large, pushing the water flow to move to both sides, so as to clean the wafer and perform multi-directional cleaning, so as to achieve better debonding and stripping effects.

[0035] After the push plate 6108 is pushed downward, the cylinder 6102 drives the first rotating shaft 6201 to move upward. Because point a of the guide groove 6206 is farther away from the clamp 3 than point b of the guide groove 6206, and point c of the guide groove 6206 is closer to the clamp 3 than point d of the guide groove 6206, the appearance structure shapes of the left and right ends of the guide groove 6206 are vertical straight lines, and the appearance structures of the upper and lower ends of the guide groove 6206 are inclined straight lines, so that the first rotating shaft 6201 can move to the inside of the side of the guide groove 6206 close to the clamp 3 when it moves to point c. The first rotating shaft 6201 uses lateral movement to drive the first gear 6202 to be pushed by the first rack 6203 to rotate, so that the push plate 6108 rotates, so that the push plate 6108 goes back with a smaller area, reducing the possibility of debris being brought back, and at the first fixed block When 6105 moves upward, it drives the second push rod 506 to move upward, and drives the sliding plate 503 to move upward. Because the upper width of the hole 504 is smaller than the lower width of the hole 504, the upper width of the hole 504 is consistent with the width of the second rotating shaft 501, and the appearance structure of the second rotating shaft 501 is a rectangular parallelepiped. After the second rotating shaft 501 contacts the lower end of the hole 504, the second rack 507 contacts the second gear 502, so that the second gear 502, the second rotating shaft 501 and the clamp 3 rotate. Because point a of the guide groove 6206 is farther away from the clamp 3 than point b of the guide groove 6206, the clamp 3 and the wafer are driven to rotate at a certain angle, so that the water flow can impact and peel from multiple angles to complete the degumming, so that the second rack 507 is away from the second gear 502, and can be rotated to press down with a larger area to continue working.

[0036] When the push plate 6108 is pushed downward, the debris can be driven downward to separate from the wafer. At this time, the wafer can be kept at a fixed angle to improve the separation effect.

[0037] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0038] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-precision debonding and stripping device for wafer processing, comprising a cleaning and stripping box (1), an ultrasonic machine (2) fixedly connected to the outside of the cleaning and stripping box (1), a clamp (3) arranged on the inside of the cleaning and stripping box (1), and a filter pump (7) connected to the outside of the cleaning and stripping box (1), characterized in that: The upper end of the cleaning and stripping box (1) is provided with a pushing mechanism (6), and one side of the pushing mechanism (6) is provided with a rotating mechanism (5); The pushing mechanism (6) comprises a sliding component (61) and a limiting component (62), wherein the limiting component (62) is arranged on one side of the sliding component (61); The sliding assembly (61) includes a first support plate (6101) fixedly connected above the cleaning and stripping box (1), a cylinder (6102) fixedly connected to the inner side of the first support plate (6101), a gas rod (6103) fixedly connected to the output end of the gas cylinder (6102), a first fixed block (6105) fixedly connected to the lower end of the gas rod (6103), a second sliding hole (6106) provided inside the lower end of the first fixed block (6105), a first pushing rod (6107) provided inside the second sliding hole (6106), and one end of the first pushing rod (6107) fixedly connected to a pushing plate (6108).

2. The high-precision debonding and stripping equipment for wafer processing according to claim 1, characterized in that: The central axis of the gas rod (6103) is perpendicular to the central axis of the first fixed block (6105).

3. The high-precision debonding and stripping equipment for wafer processing according to claim 1, characterized in that: The connection between the first push rod (6107) and the first fixed block (6105) is a sliding connection, and the appearance structure of the first push rod (6107) is cylindrical, and the width of the first push rod (6107) is consistent with that of the second sliding hole (6106).

4. The high-precision debonding and stripping equipment for wafer processing according to claim 1, characterized in that: The limiting assembly (62) includes a first rotating shaft (6201) fixedly connected to the other end of the first pushing rod (6107), a first gear (6202) fixedly connected to the outer side of the first rotating shaft (6201), a first rack (6203) is arranged on the outer side of the first gear (6202), a first slide groove (6204) is arranged inside the cleaning and stripping box (1), a second slider (6205) is arranged on the inner side of the first slide groove (6204), and the connection between the second slider (6205) and the first rack (6203) is The method is a fixed connection, a guide groove (6206) is provided on one side of the first slide groove (6204), the other end of the first rotating shaft (6201) is nested in the inner side of the guide groove (6206), a point a is provided on the inner side of the upper end of the guide groove (6206), a point b is provided on the inner side of the upper end of the guide groove (6206), a point c is provided on the outer side of the lower end of the guide groove (6206), and a point d is provided on the inner side of the lower end of the guide groove (6206), and the connection method between the first rack (6203) and the gas rod (6103) is a fixed connection.

5. The high-precision debonding and stripping equipment for wafer processing according to claim 4, characterized in that: The width of the first slide groove (6204) away from the center of the cleaning and stripping box (1) is greater than the width of the first slide groove (6204) close to the center of the cleaning and stripping box (1), and the central axis of the first slide groove (6204) is perpendicular to the bottom surface of the cleaning and stripping box (1).

6. The high-precision debonding and stripping equipment for wafer processing according to claim 4, characterized in that: The appearance structures of the left and right ends of the guide groove (6206) are vertical straight lines, and the appearance structures of the upper and lower ends of the guide groove (6206) are inclined straight lines.

7. The high-precision debonding and stripping equipment for wafer processing according to claim 4, characterized in that: Point a of the guide groove (6206) is farther away from the clamp (3) than point b of the guide groove (6206), and point c of the guide groove (6206) is closer to the clamp (3) than point d of the guide groove (6206).

8. The high-precision debonding and stripping equipment for wafer processing according to claim 4, characterized in that: The appearance structure of the first rotating shaft (6201) is a rectangular parallelepiped, and the width of the first rotating shaft (6201) is smaller than the width of the upper and lower ends of the guide groove (6206).

9. The high-precision debonding and stripping equipment for wafer processing according to claim 1, characterized in that: The rotating mechanism (5) comprises a second rotating shaft (501) fixedly connected to one end of the clamp (3); the other end of the second rotating shaft (501) is fixedly connected to a second gear (502); a sliding plate (503) is arranged on one side of the second gear (502); a hole (504) is arranged on the middle inner side of the sliding plate (503); the upper end width of the hole (504) is smaller than the lower end width of the hole (504); the upper end width of the hole (504) is equal to the width of the second rotating shaft (501). ) is consistent in width, and the appearance structure of the second rotating shaft (501) is a rectangular parallelepiped, the second rotating shaft (501) is nested in the inner side of the hole (504), a groove (505) is arranged inside the other side of the sliding plate (503), a second pushing rod (506) is arranged on the inner side of the groove (505), the second pushing rod (506) is connected to the first fixed block (6105) in a fixed connection, and the lower end of the first fixed block (6105) is fixedly connected with the second rack (507).

10. The steps of a high-precision debonding and stripping device for wafer processing according to any one of claims 1 to 9 are as follows: using a clamp (3) to clamp and fix the wafer, and when the cylinder (6102) is started to move downward, the push plate (6108) drives the water flow to move outward and downward, so that the debris leaves the vicinity of the wafer, and drives the clamp (3) and the wafer to rotate at a certain angle, so that the water flow can impact and strip from multiple angles to complete the debonding.

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