TCO coating carrier plate cleaning device

Abstract

The invention discloses a TCO coating carrier plate cleaning device which comprises a support, a laser module and a sweeping module, and the support is provided with a supporting piece used for supporting a carrier plate. The laser module is installed on the support and can project laser to the surface of the carrier plate. The sweeping module is installed on the support and can sweep away indium on the surface of the carrier plate. The TCO coating carrier plate cleaning device provided by the invention has the advantages that the cleaning cost of the carrier plate is low, and the cleaning time is controllable.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic components, and in particular to a TCO coating carrier cleaning device. Background Art

[0002] In the related technology, in the production process of heterojunction cells, TCO (Transparent Conductive Oxide, a component formed by uniformly coating a layer of transparent conductive oxide film on the surface of flat glass by physical or chemical coating methods) adopts sputtering coating (which is also the mainstream coating method). When the silicon wafer is placed on the carrier for coating, not only the silicon wafer is coated, but also the carrier. Usually, the carrier needs to be sent out for cleaning after a certain number of uses. However, the cost of cleaning the carrier is expensive, and it requires a special cleaning company to clean it. There are relatively few choices, and the time is uncontrollable. Summary of the invention

[0003] The present invention aims to solve one of the technical problems in the related art at least to a certain extent.

[0004] To this end, an embodiment of the present invention provides a TCO-coated carrier cleaning device, which has the advantages of low carrier cleaning cost and controllable cleaning time.

[0005] The TCO coated substrate cleaning device of an embodiment of the present invention includes a bracket, a laser module and a cleaning module, wherein the bracket is provided with a support member for supporting the substrate; the laser module is installed on the bracket, and the laser module can project laser onto the surface of the substrate; the cleaning module is installed on the bracket and can sweep away the indium on the surface of the substrate.

[0006] According to the TCO coated substrate cleaning device of the embodiment of the present invention, when the substrate needs to be cleaned, the substrate is placed on a support, and then the laser module projects the laser onto the surface of the substrate, and moves the laser track relative to the substrate to decompose the indium oxide on the surface of the substrate into indium, and then the cleaning module cleans the surface of the substrate, and the loose indium can be further swept away from the surface of the substrate, completing the cleaning of the substrate. Among them, the TCO coated substrate cleaning device can be set next to the battery production line, so that the substrate does not need to be sent to other companies for acid and alkali cleaning, which reduces transportation costs and acid and alkali consumption costs. At the same time, the laser module can control the cleaning time of the substrate, and the cleaning time of the substrate can be effectively controlled according to the rhythm, effectively ensuring the time efficiency of the substrate.

[0007] In some embodiments, the TCO coated substrate cleaning device further includes an indium absorption module, which is mounted on the bracket and can absorb and store discrete indium on the surface of the substrate.

[0008] In some embodiments, the support member includes a conveyor belt, the laser module and the cleaning module are both fixedly mounted on the support, and the cleaning module and the laser module are arranged in sequence along the conveying direction of the conveyor belt.

[0009] In some embodiments, the number of the conveyor belts is two, the two conveyor belts are arranged at intervals along the width direction of the conveyor belt, and the carrier plate abuts against the two conveyor belts at opposite ends in the width direction of the conveyor belt respectively;

[0010] There are two laser modules, which are respectively arranged above and below the supporting part; there are two cleaning modules, which are respectively arranged above and below the supporting part.

[0011] In some embodiments, the support portion includes a support plate, and the laser module and the cleaning module are both slidably connected to the bracket along a first direction;

[0012] The TCO coated substrate cleaning device further comprises a driving device, which is mounted on the bracket and is transmission-connected to each of the laser module and the cleaning module.

[0013] In some embodiments, the number of the support plates is two and both extend along the first direction, the two support plates are arranged at intervals along the width direction of the support plates, and the carrier plate abuts against the two support plates at opposite ends in the width direction of the support plates respectively;

[0014] There are two laser modules, which are respectively arranged above and below the supporting part; there are two cleaning modules, which are respectively arranged above and below the supporting part.

[0015] In some embodiments, the cleaning module includes a roller brush;

[0016] Alternatively, the cleaning module includes an air pump and an air blowing pipe, and the air blowing pipe is connected to the air pump.

[0017] In some embodiments, the driving device includes a motor, a screw and a nut, the motor is installed on the bracket; the screw is coaxially connected to the shaft of the motor and extends along the first direction; there are two nuts and both are threaded with the screw, and the two nuts are respectively connected to the laser module and the cleaning module.

[0018] In some embodiments, the bracket is provided with an indium storage tank, and the indium storage tank is two and is disposed on two opposite sides of the support member in the width direction of the carrier.

[0019] In some embodiments, the TCO coating substrate cleaning device further includes a tray, and the bracket is disposed on the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 Schematic diagram of a TCO coated substrate cleaning device according to an embodiment of the present invention.

[0021] Figure 2 is another schematic diagram of a TCO coated substrate cleaning device according to an embodiment of the present invention.

[0022] Reference numerals:

[0023] 1. Bracket; 11. Conveyor belt; 12. Support plate; 2. Laser module; 3. Cleaning module; 4. Indium suction module; 5. Motor; 6. Screw rod; 7. Carrier plate. DETAILED DESCRIPTION

[0024] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0025] Combine the following Figure 1 and Figure 2 A TCO coated substrate cleaning device according to an embodiment of the present invention is described.

[0026] The TCO coating substrate cleaning device of the embodiment of the present invention comprises a bracket 1, a laser module 2 and a cleaning module 3, wherein the bracket 1 is provided with a support member for supporting the substrate 7. The laser module 2 is mounted on the bracket 1, and the laser module 2 can project a laser onto the surface of the substrate 7. The cleaning module 3 is mounted on the bracket 1 and can sweep away the indium on the surface of the substrate 7.

[0027] According to the TCO coated substrate cleaning device of the embodiment of the present invention, when the substrate 7 needs to be cleaned, the substrate 7 is placed on the support, and then the laser module 2 projects the laser on the surface of the substrate 7, and moves the laser track relative to the substrate 7 to decompose the indium oxide on the surface of the substrate 7 into indium, and then the cleaning module 3 cleans the surface of the substrate 7, and the loose indium can be further swept away from the surface of the substrate 7, and the cleaning of the substrate 7 is completed. Among them, the TCO coated substrate cleaning device can be set beside the battery production line, so that the substrate 7 does not need to be sent to other companies for acid and alkali cleaning, which reduces the transportation cost and acid and alkali consumption cost. At the same time, the laser module 2 can control the cleaning time of the substrate 7, and the cleaning time of the substrate 7 can be effectively controlled according to the rhythm, effectively ensuring the time efficiency of the substrate 7.

[0028] It should be noted that the laser module 2 includes a laser generator, and its working principle and structure are similar to those of a laser rust remover, so its specific structure will not be described in detail.

[0029] In some embodiments, Figure 1 and Figure 2As shown, the TCO coated substrate cleaning device further includes an indium absorption module 4 , which is mounted on the bracket 1 and can absorb and store discrete indium on the surface of the substrate 7 .

[0030] That is, when the cleaning module 3 sweeps away the indium on the surface of the carrier 7, the indium absorption module 4 absorbs the scattered indium and gathers and stores it in the set chamber, which not only realizes the collection of indium and meets the repeated reuse of indium, but also prevents the indium from being scattered and accumulated on the surface of the bracket 1 and the support member to affect the cleaning effect of the carrier 7.

[0031] Specifically, the indium absorption module 4, the cleaning module 3 and the laser module 2 are preferably arranged in sequence along one direction.

[0032] In some embodiments, Figure 2 As shown, the support member includes a conveyor belt 11 , and the laser module 2 and the cleaning module 3 are both fixedly mounted on the bracket 1 , and the cleaning module 3 and the laser module 2 are arranged in sequence along the conveying direction of the conveyor belt 11 .

[0033] That is, after the carrier 7 is placed on the conveyor belt 11, the conveyor belt 11 can drive the carrier 7 to move along the set direction. During the movement of the carrier 7, the laser emitted by the laser module 2 passes through different positions on the surface of the carrier 7 in turn, thereby realizing the decomposition of indium oxide at various positions on the upper surface of the carrier 7. The cleaning module 3 also completes the cleaning of different positions on the surface of the carrier 7 in turn.

[0034] Specifically, the conveyor belt 11 can be a belt drive or a chain drive. The direction in which the conveyor belt 11 drives the carrier 7 to move is consistent with the length direction of the carrier 7. The trajectory line projected by the laser module 2 on the surface of the carrier 7 extends along the width direction of the carrier 7 and extends to the two edges of the carrier 7 in its width direction.

[0035] In some embodiments, there are two conveyor belts 11, which are arranged at intervals along the width direction of the conveyor belts 11, and the carrier plate 7 is respectively against the two conveyor belts 11 at two opposite ends in the width direction of the conveyor belts 11. There are two laser modules 2, which are respectively arranged above and below the support part, and there are two cleaning modules 3, which are respectively arranged above and below the support part.

[0036] At this time, the gap between the two conveyor belts 11 exposes most of the lower surface of the carrier 7 that is easy to be coated. At this time, the two laser modules 2 can respectively decompose the indium oxide on the upper and lower surfaces of the carrier 7, and the two cleaning modules 3 can respectively clean the upper and lower surfaces of the carrier 7, thereby improving the cleaning efficiency of the carrier 7.

[0037] Specifically, the driving wheels of the two conveyor belts 11 are coaxially connected through a rotating shaft to ensure that the rotation speeds of the two conveyor belts 11 are consistent, thereby being able to drive the carrier plate 7 to move more smoothly. There are also two indium absorption modules 4, which are located above and below the carrier plate 7, respectively.

[0038] In some embodiments, Figure 1 As shown, the support portion includes a support plate 12, and the laser module 2 and the cleaning module 3 are both slidably connected to the bracket 1 along a first direction. The TCO coating substrate cleaning device also includes a driving device, which is installed on the bracket 1 and is drivingly connected to each of the laser module 2 and the cleaning module 3.

[0039] That is, the carrier plate 7 is fixedly placed above the support plate 12, and the laser module 2 is arranged to be slidable relative to the bracket 1 to achieve the decomposition of indium oxide at different positions on the surface of the carrier plate 7, and the cleaning module 3 is arranged to be slidable relative to the bracket 1 to achieve the cleaning of the decomposed indium at different positions on the surface of the carrier plate 7. At the same time, the setting of the driving device makes the laser module 2 and the cleaning module 3 work stably and reliably, and the cleaning time of the carrier plate 7 is better controllable.

[0040] Specifically, the laser module 2 and the cleaning module 3 can share a driving device, that is, the laser module 2 and the cleaning module 3 move synchronously to effectively reduce the movement cost of the two. Alternatively, the laser module 2 and the cleaning module 3 can also be independently controlled by two driving devices, so that the two work more independently, have higher fault tolerance and higher functionality.

[0041] In some embodiments, there are two support plates 12, both extending in the first direction, and the two support plates 12 are arranged at intervals in the width direction of the support plates 12. The carrier plate 7 is respectively against the two support plates 12 at two opposite ends in the width direction of the support plates 12. There are two laser modules 2, which are respectively arranged above and below the support portion, and there are two cleaning modules 3, which are respectively arranged above and below the support portion.

[0042] At this time, the gap between the two support plates 12 exposes most of the lower surface of the carrier 7 that is easy to be coated. At this time, the two laser modules 2 can respectively decompose the indium oxide on the upper and lower surfaces of the carrier 7, and the two cleaning modules 3 can respectively clean the upper and lower surfaces of the carrier 7, thereby improving the cleaning efficiency of the carrier 7.

[0043] Specifically, there are also two indium absorption modules 4 , which are respectively located above and below the carrier plate 7 .

[0044] In some embodiments, the cleaning module 3 includes a roller brush. Alternatively, the cleaning module 3 includes an air pump and an air blowing pipe, and the air blowing pipe is connected to the air pump.

[0045] That is, the indium on the surface of the carrier plate 7 can be swept away from the carrier plate 7 by a rolling brush, or the indium on the surface of the carrier plate 7 can be blown away from the carrier plate 7 by an airflow, both of which can effectively complete the sweeping away of the indium.

[0046] Specifically, when the cleaning module 3 is a roller brush, the combined structure of the cleaning module 3 and the indium suction module 4 is similar to the vacuum cleaner in the related art, so the specific structures of the two are not repeated.

[0047] In some embodiments, the driving device includes a motor 5, a screw rod 6 and a nut. The motor 5 is mounted on the bracket 1. The screw rod 6 is coaxially connected to the shaft of the motor 5 and extends along the first direction. There are two nuts and both are threadedly matched with the screw rod 6. The two nuts are connected to the laser module 2 and the cleaning module 3 respectively.

[0048] The motor 5 drives the screw rod 6 to rotate, thereby causing the nut to rotate relative to the screw rod 6, so that the nut moves relative to the screw rod 6 along the first direction, thereby completing the reciprocating sliding of the laser module 2 and the cleaning module 3 relative to the bracket 1 along the first direction. The structure of the driving device is simple, and the movement of the laser module 2 and the cleaning module 3 is convenient and reliable.

[0049] Specifically, the laser module 2 and the cleaning module 3 are arranged at intervals along the first direction, and the same screw rod 6 is provided to threadably cooperate with two nuts to ensure that the moving speed and direction of the laser module 2 and the cleaning module 3 along the first direction are the same.

[0050] In some embodiments, the bracket 1 is provided with an indium storage tank, and there are two indium storage tanks disposed on two opposite sides of the support member in the width direction of the carrier plate 7 .

[0051] That is, when the cleaning module 3 sweeps the indium on the surface of the carrier 7 away from the carrier 7, the discrete indium can fall into the indium storage grooves on both sides of the carrier 7, so as to collect the indium, meet the needs of the reuse of indium, and further reduce the cleaning cost of the carrier 7.

[0052] Specifically, after the carrier plate 7 is placed on the support, the two indium storage tanks are located on both sides of the carrier plate 7 and are used to store indium located on the upper surface of the carrier plate 7 .

[0053] In some embodiments, the TCO coating substrate cleaning device further includes a tray, and the bracket 1 is disposed on the tray.

[0054] When the laser module 2, the cleaning module 3 and the indium absorption module 4 respectively realize the decomposition of the indium oxide on the lower surface of the carrier plate 7, the cleaning of indium and the absorption and storage of indium, the missed indium can fall into the tray under the action of gravity, further realizing the collection of indium and better completing the recycling of indium.

[0055] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0056] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0057] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0059] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0060] Although the above embodiments have been shown and described, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations on the present invention. Changes, modifications, substitutions and variations of the above embodiments by those of ordinary skill in the art are all within the scope of protection of the present invention.

Claims

1. A TCO coating substrate cleaning device, characterized in that: include: A bracket, wherein the bracket is provided with a support member for supporting the carrier plate; A laser module, the laser module is mounted on the bracket, and the laser module can project laser light onto the surface of the carrier; A cleaning module is installed on the bracket and can sweep away indium on the surface of the carrier.

2. The TCO coating substrate cleaning device according to claim 1, characterized in that: The TCO coating substrate cleaning device further comprises an indium absorption module, which is mounted on the bracket and can absorb and store discrete indium on the surface of the substrate.

3. The TCO coating substrate cleaning device according to claim 2, characterized in that: The support member comprises a conveyor belt, the laser module and the cleaning module are both fixedly mounted on the bracket, and the cleaning module and the laser module are arranged in sequence along the conveying direction of the conveyor belt.

4. The TCO coating substrate cleaning device according to claim 3, characterized in that: There are two conveyor belts, which are arranged at intervals along the width direction of the conveyor belts, and the carrier plate abuts against the two conveyor belts at opposite ends in the width direction of the conveyor belts respectively; There are two laser modules, which are respectively arranged above and below the supporting part; there are two cleaning modules, which are respectively arranged above and below the supporting part.

5. The TCO coating substrate cleaning device according to claim 2, characterized in that: The support portion includes a support plate, and the laser module and the cleaning module are both slidably connected to the bracket along a first direction; The TCO coated substrate cleaning device further comprises a driving device, which is mounted on the bracket and is transmission-connected to each of the laser module and the cleaning module.

6. The TCO coating substrate cleaning device according to claim 5, characterized in that: There are two support plates, both extending along the first direction, the two support plates are arranged at intervals along the width direction of the support plates, and the carrier plate abuts against the two support plates at opposite ends in the width direction of the support plates; There are two laser modules, which are respectively arranged above and below the supporting part; there are two cleaning modules, which are respectively arranged above and below the supporting part.

7. The TCO coating substrate cleaning device according to claim 5, characterized in that: The cleaning module includes a roller brush; Alternatively, the cleaning module includes an air pump and an air blowing pipe, and the air blowing pipe is connected to the air pump.

8. The TCO coating substrate cleaning device according to claim 5, characterized in that: The driving device comprises: A motor, wherein the motor is mounted on the bracket; A screw rod, the screw rod is coaxially connected to the shaft of the motor and extends along the first direction; Nuts, there are two nuts and both are matched with the screw thread, and the two nuts are respectively connected to the laser module and the cleaning module.

9. The TCO coating substrate cleaning device according to claim 2, characterized in that: The bracket is provided with an indium storage tank, and there are two indium storage tanks which are respectively arranged on two opposite sides of the support member in the width direction of the carrier plate.

10. The TCO coating substrate cleaning device according to claim 4 or 6, characterized in that: The TCO coating carrier cleaning device further comprises a tray, and the bracket is arranged on the tray.

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