Wafer bearing device and semiconductor process equipment

Abstract

The invention provides a wafer bearing device and semiconductor process equipment, the wafer bearing device is used for bearing a wafer in a reaction chamber and controlling the temperature of the wafer, and the wafer bearing device comprises a tray used for bearing the wafer; the liquid cooling disc is arranged below the tray and cools the tray and the wafer carried on the tray by guiding cooling liquid; the back plate is arranged below the liquid cooling disc and is used for bearing the tray and the liquid cooling disc; wherein the back plate comprises a body and a reinforcing structure, the reinforcing structure and the liquid cooling disc are located on the two sides of the body respectively, and the reinforcing structure is located in at least part of the area, bearing the liquid cooling disc, of the body. According to the wafer bearing device, the back plate is provided with the reinforcing structure, so that the structural strength of the back plate can be improved, the back plate is prevented from deforming in a high-temperature environment, the temperature rise of the wafer can be avoided, the temperature difference between different areas of the wafer is also avoided, the conditions of silicon precipitation and abnormal reflectivity of the wafer are further avoided, and the service life of the wafer is prolonged. And the deposition quality of the wafer is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor equipment technology, and in particular to a wafer carrier and semiconductor process equipment. Background Art

[0002] Physical vapor deposition (PVD) equipment is widely used in the manufacturing processes of today's semiconductors, solar cells, flat panel displays, etc. Aluminum interconnects in integrated circuits and front aluminum processes for power devices both require high-temperature PVD processes.

[0003] When performing the aluminum process, the wafer needs to be placed on a heater to control the temperature of the wafer to be lower than the temperature of the sputtered aluminum, so that the aluminum can cool down and be deposited after falling on the wafer. However, the existing heater cannot control the temperature of the wafer well at high temperatures (300°C), causing the temperature of the wafer to rise, so that the aluminum grains that fall on the wafer cannot cool down and become larger, which in turn causes silicon precipitation on the wafer. In addition, the heater will also have poor temperature uniformity at high temperatures, resulting in temperature differences between different areas of the wafer, which makes the size of the aluminum grains that fall on different areas of the wafer different, which in turn causes abnormal reflectivity of the wafer. Summary of the invention

[0004] In view of this, the present application provides a wafer carrier, which can prevent silicon precipitation and abnormal reflectivity of the wafer, thereby improving the deposition quality of the wafer. In addition, the present application also provides a semiconductor process equipment having the above-mentioned wafer carrier.

[0005] In order to achieve the above objectives, this application provides the following technical solutions:

[0006] A wafer carrying device, used for carrying a wafer in a reaction chamber and controlling the temperature of the wafer, comprising:

[0007] A tray, used for carrying the wafer;

[0008] A liquid cooling plate is disposed below the tray and cools the tray and the wafers carried on the tray by guiding cooling liquid;

[0009] A back plate, disposed below the liquid cooling plate and carrying the tray and the liquid cooling plate;

[0010] The back plate includes a main body and a reinforcement structure, wherein the reinforcement structure and the liquid cooling plate are respectively located on two sides of the main body, and the reinforcement structure is located in at least a portion of the main body that supports the liquid cooling plate.

[0011] Optionally, in the above-mentioned wafer carrying device, an elastic member is provided on the back plate, the liquid cooling plate is supported on the elastic member, and the elastic member applies an elastic force to the liquid cooling plate in a direction approaching the tray.

[0012] Optionally, in the above wafer carrying device, the liquid cooling plate is provided with a protrusion protruding from the upper surface of the liquid cooling plate, and the protrusion abuts against the lower surface of the tray so that there is a gap between the upper surface of the liquid cooling plate and the lower surface of the tray;

[0013] Wherein, the protrusion is detachably arranged on the liquid cooling plate.

[0014] Optionally, in the above-mentioned wafer carrying device, the edge of the tray is provided with an extension wall which protrudes axially from the lower surface of the tray, and the extension wall extends to the position of the back plate and is connected to the side of the back plate; the liquid cooling plate is accommodated in the inner cavity surrounded by the extension wall and the back plate.

[0015] Optionally, in the above wafer carrying device, the back plate includes a central through hole opened in the center, a first annular area surrounding the central through hole, and a second annular area surrounding the first annular area, and the first annular area and the second annular area are areas for carrying the liquid cooling plate;

[0016] The reinforcing structure is a thickening body that increases the thickness of the back plate. The thickening body includes a tubular thickening body that is coaxial and has the same diameter as the central through hole, and an annular thickening body located in the first annular area, and the thickness of the tubular thickening body is greater than the thickness of the annular thickening body.

[0017] Optionally, in the above-mentioned wafer carrying device, elastic members for supporting the liquid cooling plate are arranged on the back plate, and the elastic members are all located in the first annular area.

[0018] Optionally, in the above-mentioned wafer carrying device, the liquid cooling plate is supported by a plurality of the elastic members, and contact portions between all the elastic members and the liquid cooling plate are evenly distributed on the liquid cooling plate.

[0019] Optionally, in the above-mentioned wafer carrying device, the contact parts are distributed on the liquid cooling plate on a plurality of concentric circles with the center of the liquid cooling plate as the center, and the contact parts on adjacent concentric circles are staggered in the circumferential direction.

[0020] Optionally, in the above-mentioned wafer supporting device, the elastic member is a spring, and both ends of the spring abutting against the back plate and the liquid cooling plate respectively are planar ends perpendicular to the axis of the spring.

[0021] Optionally, in the above-mentioned wafer carrying device, the protrusions are distributed on the liquid cooling plate on a plurality of concentric circles with the center of the liquid cooling plate as the center, and the protrusions located on the concentric circle with the largest diameter are arranged close to the edge of the liquid cooling plate, and the protrusions located on the concentric circle with the smallest diameter are arranged close to the central through hole of the liquid cooling plate.

[0022] Optionally, in the above wafer carrying device, the protruding member includes:

[0023] A pin body having a bottom step and a top plane, wherein the bottom step is used to contact the liquid cooling plate and be pressed by the screw, and the top plane is used to abut against the tray;

[0024] The slot body is connected to the pin body and is used to limit the screw.

[0025] Optionally, in the above wafer carrying device, one of a step and a carrying bump is provided on the side surface of the back plate, and the other of the step and the carrying bump is provided on the inner surface of the extension wall, so that the step carries the carrying bump or the carrying bump supports the step;

[0026] The inner surface of the extension wall is welded to the side surface of the back plate, and the welding position is located below the step and the bearing protrusion;

[0027] A stress release groove is provided on the lower surface of the back plate, and the stress release groove is arranged close to the side surface of the back plate.

[0028] Optionally, in the above-mentioned wafer carrying device, a surface of the tray for carrying the wafer is provided with a reflective coating.

[0029] Optionally, in the above-mentioned wafer carrying device, the tray, the liquid cooling plate and the back plate are coaxially arranged, and a bellows is coaxially connected to the bottom of the back plate; an inlet pipe for introducing cooling liquid into the liquid cooling plate and a liquid outlet pipe for extracting cooling liquid from the liquid cooling plate pass through the tube cavity of the bellows and the central through hole of the back plate to be connected with the liquid cooling plate.

[0030] A semiconductor process equipment comprises a reaction chamber and a wafer carrying device arranged in the reaction chamber, wherein the wafer carrying device is the above-mentioned wafer carrying device.

[0031] The wafer carrying device provided in the present application is configured so that the back plate of the carrying tray and the liquid cooling plate has a reinforced structure. By providing the reinforced structure on the back plate, the structural strength of the back plate can be increased, and deformation of the back plate in a high temperature environment can be reduced or even avoided. Thus, the tray and the liquid cooling plate arranged on the back plate can always control the temperature of the wafer on the tray well, avoid the temperature increase of the wafer, and avoid the temperature difference between different areas of the wafer, thereby avoiding silicon precipitation and abnormal reflectivity of the wafer, and improving the deposition quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0033] Figure 1 A schematic diagram of the structure of a wafer carrier provided in an embodiment of the present application;

[0034] Figure 2 for Figure 1 A partial enlarged view of

[0035] Figure 3 It is a schematic diagram of the structure of the distribution of elastic parts on the liquid cooling plate;

[0036] Figure 4 It is a schematic diagram of the structure of the protrusions distributed on the liquid cooling plate;

[0037] Figure 5 It is a schematic diagram of the structure in which the protrusion is pressed by the screw.

[0038] exist Figure 1-Figure 5 middle:

[0039] 1-tray, 2-liquid cooling plate, 3-back plate, 4-elastic member, 5-protruding member, 6-screw, 7-extension wall, 8-bellows, 9-gap;

[0040] 101-heating tube pressing plate;

[0041] 201-flow guide channel, 202-liquid inlet pipe, 203-liquid outlet pipe;

[0042] 301-body, 302-reinforcement structure, 303-central through hole, 304-first annular area, 305-second annular area, 306-step, 307-stress relief groove;

[0043] 3021- tubular thickened body, 3022- annular thickened body;

[0044] 501-pin body, 502-slot body;

[0045] 5011-bottom step, 5012-top flat surface;

[0046] 701-Bearing bump. DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0048] In the related art, in the process of depositing aluminum onto the wafer using a high-temperature PVD process (i.e., an aluminum process), the heat generated by the sputtered aluminum is very large, causing the wafer that receives the aluminum to also receive a lot of heat. The temperature of the wafer will rise, and the high-temperature wafer will transfer the heat to the heater. Since the heater has a water cooling plate, the water cooling plate will cool the tray (or heating plate) that carries the wafer. After the wafer transfers the heat to the heater, the temperature of the wafer itself will drop, thereby achieving cooling of the wafer. When the heater is used at 300°C, the back plate of the heater that supports the water-cooling plate deforms under the action of thermal stress and vacuum force. Specifically, the back plate deforms downward, and the deformation can reach about 2mm. The water-cooling plate on the back plate also moves downward, causing the water-cooling plate to move away from the tray, and the gap between the water-cooling plate and the tray becomes larger. The cooling ability of the water-cooling plate to the tray becomes worse, which in turn causes the heating power of the heater to decrease. After the wafer transfers heat to the heater, the heating power of the heater will also decrease. Therefore, on the basis of the reduction in heating power caused by the deformation of the back plate, the heating power will be reduced again, thereby reducing the heating power of the heater to zero. The temperature of the heater with zero heating power will increase. After the temperature of the heater increases, the temperature difference between the wafer and the heater will become smaller. , the wafer needs to be heated to a higher temperature before it can transfer heat to the heater, causing the temperature of the wafer to rise and unable to be effectively cooled. The aluminum grains on the heated wafer will become larger, and the larger aluminum grains will squeeze out the silicon between the aluminum grains, resulting in silicon precipitation; in addition, the backplane is deformed, which will cause the distance between the water cooling plate and the tray to increase, and the distance between each part will be inconsistent, so that the local thermal conductivity is good in the local area with a large spacing, and the local thermal conductivity is poor in the local area with a small spacing, which will lead to poor temperature uniformity of the tray, resulting in differences in the amount of heat transferred from the wafer to different parts of the heater, resulting in temperature differences in different parts of the wafer itself, and poor temperature uniformity of the wafer, resulting in different sizes of aluminum grains in different parts of the wafer, which in turn leads to abnormal reflectivity of the wafer.

[0049] In view of the above situation, if Figure 1-Figure 5 As shown, an embodiment of the present application provides a novel wafer carrier, which can be installed in a reaction chamber of a semiconductor process equipment and is used to carry wafers and control the temperature of the wafers, so as to be suitable for aluminum processes. This wafer carrying device mainly includes a tray 1, a liquid cooling plate 2 and a back plate 3, wherein the tray 1 is a component for carrying the wafer. When the aluminum process is performed, the wafer is placed on the tray 1, and the tray 1 can realize heat conduction between the wafer and the liquid cooling plate 2, so as to control the temperature of the wafer. The tray 1 also includes a heating tube clamping plate 101 arranged facing the liquid cooling plate 2; the liquid cooling plate 2 is arranged below the tray 1, and a guide channel 201 for guiding the cooling liquid (the cooling liquid can be cooling water, cooling oil or refrigerant, etc.) is opened. When the cooling liquid flows in the guide channel 201, it can conduct cold energy to the liquid cooling plate 2, so that the liquid cooling plate 2 maintains a low temperature, and the liquid cooling plate 2 can also conduct cold energy to the tray 1, and the cold energy reaches the wafer through the conduction of the tray 1, so as to realize the cooling of the wafer; the back plate 3 is located below the liquid cooling plate 2, and it is a component for carrying and supporting the tray 1 and the liquid cooling plate 2, that is, the tray 1 and the liquid cooling plate 2 are arranged on the back plate 3. The improvement of this back plate 3 is that it not only includes a plate-shaped body 301 (that is, the plate-shaped structure of the back plate in the related art), but also includes a reinforcing structure 302. The reinforcing structure 302 and the liquid cooling plate 2 are respectively located on both sides of the body 301, that is, the reinforcing structure 302 is connected to the lower side of the body 301, and the liquid cooling plate 2 is supported on the upper side of the body 301. Moreover, when the reinforcing structure 302 is arranged on the body 301, the reinforcing structure 302 is also located in the area of ​​the body 301 that carries the liquid cooling plate 2 (this area refers to the area occupied by the projection of the liquid cooling plate 2 on the back plate 3), and is located in part or all of the area. By adding this reinforcing structure 302, the structural strength of the back plate 3 can be increased, so that the area of ​​the back plate 3 that supports the liquid cooling plate 2 or the entire back plate 3 will no longer deform in a high temperature (for example, 300°C) environment. Optionally, the tray 1, liquid cooling plate 2, back plate 3 and the bellows 8 described later are all components with circular cross-sections and are coaxially arranged with their axes in the vertical direction, so that the tray 1, liquid cooling plate 2 and back plate 3 are all horizontally arranged and carry the wafers horizontally.

[0050] The above-mentioned wafer supporting device can improve the structural strength of the back plate 3 by arranging a reinforcing structure 302 on the back plate 3, so that the back plate 3 will not be deformed in a high temperature environment, and the tray 1 and the liquid cooling plate 2 arranged on the back plate 3 will not be displaced, so that the tray 1 and the liquid cooling plate 2 can always maintain the spacing and temperature uniformity that meet the process requirements. Through such an arrangement, on the one hand, it is possible to prevent the heating power of the wafer supporting device from being reduced to zero, that is, although the heating power of the wafer supporting device will also be reduced after the wafer transfers heat to the wafer supporting device, it will not be reduced to zero, and the temperature of the wafer supporting device will remain stable and will not increase, which makes the temperature of the wafer no longer increase, avoiding the situation of silicon precipitation on the wafer; on the other hand, the liquid cooling plate 2 can cool the tray 1 and the wafer well, which can also avoid the temperature increase of the wafer, and at the same time avoid the temperature difference between different areas of the wafer, so that the wafer supporting device and the wafer have stable temperature uniformity, and the aluminum grains in various parts of the wafer are the same size, thereby avoiding the situation of abnormal reflectivity of the wafer and improving the deposition quality of the wafer.

[0051] In an optional embodiment, if Figure 1 and Figure 3As shown, the back plate 3 includes a central through hole 303 opened in the center, a first annular area 304 surrounding the central through hole 303, and a second annular area 305 surrounding the first annular area 304, and the first annular area 304 and the second annular area 305 are areas for carrying the liquid cooling plate 2; the reinforcing structure 302 is a thickened body for increasing the thickness of the back plate 3, and the thickened body includes a tubular thickened body 3021 coaxial and arranged with the central through hole 303 and the same diameter (the same diameter means that the diameter of the central through hole 303 and the inner diameter of the tubular thickened body 3021 are the same), and an annular thickened body 3022 located in the first annular area 304, and the thickness of the tubular thickened body 3021 is greater than the thickness of the annular thickened body 3022, wherein it should be noted that this "thickness" is the axial dimension of the back plate 3. When the reinforcing structure 302 is arranged on the back plate 3, the specific structure of the reinforcing structure 302 can be selected in many ways, such as reinforcing ribs, reinforcing grooves and reinforcing entities, etc. In the present application, it is preferred to arrange a reinforcing entity, i.e., a thickening body, on the back plate 3, and also make the thickening body and the body 301 of the back plate 3 an integrally formed structure (specifically, the forming method is, for example, machining or casting of the same blank), so as to maximize the structural strength of the back plate 3. In order to avoid affecting the setting of the liquid cooling plate 2 due to the addition of the thickening body, the thickening body is arranged below the body 301. Furthermore, while the thickened body enhances the structural strength of the back plate 3 itself, in order to make the role of the thickened body more prominent, the setting position of the thickened body on the main body 301 is optimized, that is, the thickened body is set in the above-mentioned area close to the central through hole 303. Specifically, the annular thickened body 3022 is arranged in the first annular area 304 for bearing the weight of the liquid cooling disk 2, so that the back plate 3 can provide a more stable support for the liquid cooling disk 2, and the tubular thickened body 3021 is arranged at the position of the back plate 3 for connecting with the bellows 8 described later, so as to enhance the connection firmness between the back plate 3 and the bellows 8, and because the connection position between the back plate 3 and the bellows 8 is subjected to greater and more concentrated force, the thickness of the tubular thickened body 3021 is made greater than the thickness of the annular thickened body 3022, so as to further enhance the connection stability of the back plate 3.

[0052] In the related art, a tightening bolt is provided on the back plate, and the tightening bolt is screwed to push the liquid cooling plate onto the tray, thereby realizing the setting and fixing of the liquid cooling plate between the tray and the back plate. This connection method is a rigid connection. When the back plate is deformed, the tightening bolt will move with the deformation of the back plate, and the tightening bolt can no longer tighten the liquid cooling plate, and even detach from the liquid cooling plate, resulting in the distance between the liquid cooling plate and the tray being no longer uniform, and the tray and the wafer can no longer be cooled, which leads to silicon precipitation and abnormal reflectivity. In the present application, if Figure 1 and Figure 3As shown, an elastic member 4 is provided on the back plate 3, the liquid cooling plate 2 is supported on the elastic member 4, and the elastic member 4 applies elastic force to the liquid cooling plate 2 in the direction of approaching the tray 1. That is to say, the present application realizes the arrangement of the liquid cooling plate 2 on the back plate 3 by connecting and supporting the elastic member 4, and uses the elastic member 4 to press the liquid cooling plate 2 against the tray 1 (the liquid cooling plate 2 is pressed against the tray 1 by the protruding member 5 described later), and the elastic force of the elastic member 4 is greater than the gravity of the liquid cooling plate 2, which can not only realize the arrangement of the liquid cooling plate 2 on the back plate 3 and the cooperation with the tray 1, but also the present application makes the compression amount of the elastic member 4 not less than 6mm, which is large enough, even if the tray 1 or the back plate 3 is deformed due to high temperature, because the deformation amount is small, so this compression amount can also make up for the deformation amount, so that the liquid cooling plate 2 can still be pressed against the tray 1, ensuring that the gap 9 between the liquid cooling plate 2 and the tray 1 is stable and consistent. The method of tightening the liquid cooling plate 2 by the elastic member 4 is a flexible connection, which is less affected or not affected by the deformation of the back plate 3, thereby better avoiding the occurrence of silicon precipitation and abnormal reflectivity.

[0053] like Figure 1 and Figure 3 As shown, the liquid cooling plate 2 is supported by a plurality of elastic members 4, and the contact parts of all the elastic members 4 with the liquid cooling plate 2 are evenly distributed on the liquid cooling plate 2. By setting a plurality of elastic members 4 and distributing them evenly, on the one hand, it is possible to provide a greater elastic force to the liquid cooling plate 2, so that the liquid cooling plate 2 can be more fully pressed against the tray 1, reducing the possibility of an unexpected change in the gap 9 between the two, and on the other hand, it is possible to make the force on the liquid cooling plate 2 more balanced, and the gaps 9 of various parts are kept more precisely consistent, thereby improving the working performance of the wafer bearing device. In addition, in order to better cooperate with the thickening body, the contact parts of all the elastic members 4 with the back plate 3 are all located in the first annular area 304, that is, the elastic members 4 are all located in the first annular area 304 where the annular thickening body 3022 is distributed, so that the annular thickening body 3022 can bear the gravity of the liquid cooling plate 2 and the elastic force of the elastic members 4, thereby achieving good support of the back plate 3 to the liquid cooling plate 2 through the cooperation between the reinforcing structure 302 and the elastic members 4. Among them, the reinforcing structure 302 and the elastic member 4 complement and promote each other. Specifically, by adding the reinforcing structure 302, the first annular area 304 where the elastic member 4 is set has sufficient structural strength, which can not only avoid high-temperature deformation, but also better support the elastic member 4, that is, it can well withstand the elastic force applied to the back plate 3 by the elastic member 4, and can ensure that all the elastic members 4 will not be displaced but maintain a parallel and uniformly stressed state; at the same time, it is also possible to design or select elastic members 4 with greater elastic force and compression to elastically support the liquid cooling plate 2, even if the back plate 3 has a slight deformation, the deformation can be fully compensated, thereby achieving a more stable support for the liquid cooling plate 2 and making the liquid cooling plate 2 more tightly pressed against the tray 1.

[0054] In the present application, the diameter of the liquid cooling plate 2 is made larger than the diameter of the carrying area of ​​the tray 1 for carrying the wafer, so that the liquid cooling plate 2 can cool the wafer more comprehensively, thereby improving the cooling effect of the liquid cooling plate 2. At the same time, the gap 9 between the liquid cooling plate 2 and the tray 1 is made as small as possible, for example, less than 1 mm, so that the liquid cooling plate 2 can cool the tray 1 and the wafer more efficiently, thereby ensuring that the liquid cooling plate 2 has a high cooling capacity.

[0055] Further, such as Figure 3 As shown, the uniform distribution of the contact parts between the elastic member 4 and the liquid cooling plate 2 can be that the contact parts are distributed on the liquid cooling plate 2 on multiple concentric circles with the center of the liquid cooling plate 2 as the center, and the contact parts on adjacent concentric circles are staggered in the circumferential direction. The distribution of the contact parts is the distribution of the elastic member 4. In this arrangement, it is preferred that there are two (or one or more) concentric circles distributed, and the radius difference between the two concentric circles is increased as much as possible. Since the elastic member 4 needs to be located on the annular thickened body 3022, the outer concentric circle can be arranged close to the outer circumference of the first annular area 304, and the inner concentric circle can be arranged close to the inner circumference of the first annular area 304. In this way, the distribution range of the elastic member 4 can be larger, and the forces on the back plate 3 and the liquid cooling plate 2 are more dispersed and balanced. Furthermore, it is also preferred that the number of elastic members 4 on the outer concentric circle is set to 10, and the number of elastic members 4 on the inner concentric circle is set to 6, so that the elastic members 4 can be distributed more evenly on the same concentric circle and the force can be more balanced. At the same time, the elastic members 4 on the outer concentric circle and the elastic members 4 on the inner concentric circle are staggered in the circumferential direction, that is, in the circumferential direction of the concentric circles, any elastic member 4 on the inner concentric circle is located between two adjacent elastic members 4 on the outer concentric circle, which can further optimize the force effect and ensure that the liquid cooling plate 2 is subjected to force along the direction of the bellows 8, and the liquid cooling plate 2 is not subjected to force in the tilting direction, thereby ensuring stable support, avoiding tilting of the liquid cooling plate 2, keeping the liquid cooling plate 2 and the tray 1 parallel, and ensuring the stability and consistency of the gap 9 therebetween.

[0056] Specifically, the elastic member 4 is a spring, and the two ends of the spring that abut against the back plate 3 and the liquid cooling plate 2, respectively, are both plane ends perpendicular to the axis of the spring. The spring is a relatively common elastic member 4, which has a simple structure and a small size, and is suitable for being set in a wafer carrier. By making the two ends of the spring plane ends perpendicular to the axis, the spring can be vertically abutted against the back plate 3 and the liquid cooling plate 2 (the specific abutment method is to open grooves matching the spring on the back plate 3 and the liquid cooling plate 2, and make the two ends of the spring extend into the grooves respectively, and abut against the bottom wall of the groove, and the side walls of the groove limit the spring), so as to ensure the horizontal setting and vertical force of the back plate 3 and the liquid cooling plate 2, reduce the probability of the liquid cooling plate 2 tilting, and make the gap 9 between the liquid cooling plate 2 and the tray 1 have good stability and consistency.

[0057] Specifically, in order to better adapt to the working environment of the wafer carrying device, the spring is preferably made of a material that can withstand high temperatures.

[0058] In an optional embodiment, a protrusion 5 protruding from the upper surface of the liquid cooling plate 2 is provided on the liquid cooling plate 2, and the protrusion 5 supports the tray 1 so that there is a gap between the upper surface of the liquid cooling plate 2 and the lower surface of the tray 1; wherein the protrusion 5 is detachably provided on the liquid cooling plate 2. By providing this protrusion 5, while ensuring that the liquid cooling plate 2 can be pressed against the tray 1, a gap 9 can be created between the liquid cooling plate 2 and the tray 1. The heat conduction from the liquid cooling plate 2 to the tray 1 is conducted through the air in the gap 9. This can prevent the temperature of the tray 1 and the wafer from being too low while being reduced. While the liquid cooling plate 2 and the tray 1 are conducting heat through the air in the gap 9, the protrusion 5 can also be removed from the liquid cooling plate 2. Compared with the setting method in the related art that the protrusion and the liquid cooling plate are an integrated structure, in the structure of the present application, on the one hand, if the protrusion height of the protrusion 5 does not meet the tolerance requirements, the protrusion 5 can be replaced, thereby improving the convenience of processing and maintenance of the liquid cooling plate 2. On the other hand, the protrusion 5 and the liquid cooling plate 2 can be processed separately, and the flatness of the upper surface of the liquid cooling plate 2 can be processed and controlled with higher precision. The surface flatness after heat treatment is also convenient for trimming, so that the structure of the liquid cooling plate 2 is optimized.

[0059] In the specific structure, as described above, the tray 1 also includes a heating tube pressing plate 101 connected to its lower surface, and the protrusion 5 supports the tray 1 by abutting against the heating tube pressing plate 101. Since the protrusion 5 protrudes upward relative to the upper surface of the liquid cooling plate 2, there is a gap between the tray 1 supported by the protrusion 5 and the upper surface of the heating tube pressing plate 101 and the liquid cooling plate 2, such as Figure 2 As shown, the gap is actually the gap 9 between the upper surface of the liquid cooling plate 2 and the lower surface of the heating tube clamping plate 101 .

[0060] In addition, under the premise of meeting the process requirements, the protrusion 5 can be omitted, and the liquid cooling plate 2 can be directly attached to the tray 1 without the gap 9 therebetween. In this way, the liquid cooling plate 2 can also cool the tray 1 and the wafer.

[0061] like Figure 4 As shown, the protrusions 5 are distributed on the liquid cooling plate 2 on a plurality of concentric circles with the center of the liquid cooling plate 2 as the center, and the protrusions 5 located on the concentric circle with the largest diameter are arranged close to the edge of the liquid cooling plate 2, and the protrusions 5 located on the concentric circle with the smallest diameter are arranged close to the central through hole 303 of the liquid cooling plate 2. Among them, the distribution mode of the protrusions 5 is similar to the distribution mode of the elastic member 4, and it is also distributed on a plurality of concentric circles, so that the protrusions 5 can be distributed more evenly on the liquid cooling plate 2, so that the stability and consistency of the gap 9 between the liquid cooling plate 2 and the tray 1 can be more reliably guaranteed. Preferably, the protrusions 5 are distributed on three concentric circles (or can also be distributed on one, two or more concentric circles), and the distribution range of the protrusions 5 in the radial direction of the liquid cooling plate 2 is larger, so that the contact points between the liquid cooling plate 2 and the tray 1 can be more dispersed, and the stability and consistency of the gap 9 can be better guaranteed, reducing the probability of relative tilt between the liquid cooling plate 2 and the tray 1.

[0062] Specifically, Figure 4 and Figure 5 As shown, the protruding member 5 is connected to the liquid cooling plate 2 by screws 6, and the protruding member 5 includes: a pin body 501, having a bottom step 5011 and a top plane 5012, the bottom step 5011 is used to contact the liquid cooling plate 2 and be pressed by the screw 6, and the top plane 5012 is used to abut against the tray 1; a groove body 502, connected to the pin body 501, and used to limit the screw 6. The screw 6 is used to connect the protruding member 5 and the liquid cooling plate 2, so that the protruding member 5 can be easily disassembled and assembled. In the specific structure, the screw 6 presses the bottom step 5011 of the pin body 501 when being tightened on the liquid cooling plate 2 to prevent the pin body 501 from separating from the liquid cooling plate 2, and the top end of the pin body 501 protrudes relative to the upper surface of the liquid cooling plate 2, and the top end has a top plane 5012 for contacting and fitting with the tray 1, so that the protrusion 5 can be stably pressed against the tray 1. After the screw 6 presses the bottom step 5011, the nut of the screw 6 is located in the groove body 502, and the groove body 502 limits the nut to prevent the screw 6 from accidentally loosening, causing the protrusion height of the protrusion 5 to change and affecting the consistency of the gap 9.

[0063] In the related art, the back plate has an extension wall that protrudes axially from its upper surface and surrounds the liquid cooling plate. The extension wall extends upward to the position of the tray and is welded to the side of the tray, so as to realize the bearing and support of the tray by the back plate. In this arrangement, the welding point is located on the side wall of the tray, close to the hot plate. Since the hot plate is affected by the wafer during the process and its temperature is higher than that of the liquid cooling plate and the back plate, the welding point close to the tray will have a large deformation in the radial direction of the tray, and the welding point at this location will be repeatedly heated and cooled, which will cause the welding point to have the risk of cracking, affecting the normal operation of the wafer bearing device. In the present application, if Figure 1 and Figure 2 As shown, the edge of the tray 1 is provided with an extension wall 7 axially protruding from the lower surface of the tray 1, and the extension wall 7 extends to the position where the back plate 3 is located and is connected to the side of the back plate 3. In this way, the welding point can be moved downward, so that the welding point is located at the position where the back plate 3 is located, away from the hot plate, so that the temperature of the welding point can be reduced, the risk of welding cracking at the welding point is reduced, and the working performance of the wafer carrying device is improved. In addition, it is also preferred that the thickness of this extension wall 7 is less than the thickness of the tray 1 and the back plate 3 to reduce the heat conduction from the tray 1 to the back plate 3. In this structure, the liquid cooling plate 2 is accommodated in the inner cavity surrounded by the extension wall 7 and the back plate 3.

[0064] Furthermore, one of the step 306 and the bearing protrusion 701 is provided on the side of the back plate 3, and the other of the step 306 and the bearing protrusion 701 is provided on the inner surface of the extension wall 7, so that the step 306 supports the bearing protrusion 701 or the bearing protrusion 701 supports the step 306; the inner surface of the extension wall 7 is welded to the side of the back plate 3, and the welding part is located below the step 306 and the bearing protrusion 701. In this structure, Figure 2 As shown, the step 306 is preferably arranged on the side of the back plate 3, and the bearing protrusion 701 is arranged on the inner surface of the extension wall 7, so that the step 306 can support the bearing protrusion 701 to realize the bearing of the tray 1 by the back plate 3, and the bearing protrusion 701 is arranged on the inner surface of the extension wall 7, so that the thickness of the extension wall 7 can be kept small, thereby reducing the heat conduction from the tray 1 to the back plate 3. Alternatively, the bearing protrusion 701 and the step 306 can be arranged interchangeably on the side of the back plate 3 and the inner surface of the extension wall 7. By arranging the step 306 and the bearing protrusion 701, the gravity of the tray 1 can be shared and the heat can be dispersed and conducted, thereby reducing the stress and temperature of the welding part, reducing the deformation probability of the welding part, and extending the welding life. In addition, it can also improve the matching accuracy of the tray 1 and the back plate 3, which is conducive to improving the stability and consistency of the gap 9.

[0065] And, if Figure 2As shown, a stress release groove 307 is provided on the lower surface of the back plate 3, and the stress release groove 307 is arranged close to the side of the back plate 3. The stress release groove 307 can release the welding stress generated during welding, improve the welding strength, and reduce the deformation of the wafer carrier device caused by welding. Specifically, the spacing between the stress release groove 307 and the welding part is 2.5mm-5mm, the depth of the stress release groove 307 is the same as the axial length of the welding part, and the width of the stress release groove 307 is preferably 2mm.

[0066] Preferably, the surface of the tray 1 for carrying the wafer is provided with a reflective coating. In the related art, the surface of the wafer carrying device is bare stainless steel, while the present application adds a reflective coating on the surface to improve the heat exchange efficiency between the tray 1 and the wafer. The specific reflective coating is preferably made of chromium oxide.

[0067] like Figure 1 As shown, in the entire wafer carrying device, the tray 1, the liquid cooling plate 2 and the back plate 3 are coaxially arranged, and a bellows 8 is coaxially connected to the bottom of the back plate 3; the liquid inlet pipe 202 for introducing the cooling liquid into the liquid cooling plate 2 and the liquid outlet pipe 203 for guiding the cooling liquid out of the liquid cooling plate 2 pass through the tube cavity of the bellows 8 and the central through hole 303 of the back plate 3 to communicate with the liquid cooling plate 2. Among them, the bellows 8 supports the back plate 3, and the tubular thickened body 3021 of the back plate 3 is fixedly connected to the bellows 8 by welding, so that the back plate 3, the liquid cooling plate and the tray 1 are arranged at a certain height in the reaction chamber.

[0068] The above-mentioned wafer carrier provided in the present application has a heating power between 40%-50% and is very stable, which meets the heat dissipation requirements of the aluminum process, and the temperature uniformity of the wafer carrier is improved (the wafer carrier is set at 300°C and the chamber pressure is 1 torr), and the temperature uniformity is maintained at 9.7°C, which meets the temperature uniformity requirements of the aluminum process.

[0069] Based on the above-mentioned wafer carrier, the embodiment of the present application further provides a semiconductor process equipment, which includes a reaction chamber and a wafer carrier arranged in the reaction chamber, and the wafer carrier is the above-mentioned wafer carrier. The beneficial effects of the semiconductor process equipment brought by the above-mentioned wafer carrier can be found in the above content, which will not be repeated here.

[0070] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0071] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0072] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0073] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0074] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0075] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A wafer carrying device, characterized in that: Used to carry a wafer in a reaction chamber and control the temperature of the wafer, comprising: A tray, used for carrying the wafer; A liquid cooling plate is disposed below the tray and cools the tray and the wafers carried on the tray by guiding cooling liquid; A back plate, disposed below the liquid cooling plate and carrying the tray and the liquid cooling plate; The back plate includes a main body and a reinforcement structure, wherein the reinforcement structure and the liquid cooling plate are respectively located on two sides of the main body, and the reinforcement structure is located in at least a portion of the main body that supports the liquid cooling plate.

2. The wafer carrier device according to claim 1, characterized in that: An elastic member is disposed on the back plate, the liquid cooling plate is supported on the elastic member, and the elastic member applies elastic force to the liquid cooling plate in a direction approaching the tray.

3. The wafer carrier device according to claim 1, characterized in that: The liquid cooling plate is provided with a protrusion protruding from the upper surface of the liquid cooling plate, and the protrusion abuts against the lower surface of the tray so that there is a gap between the upper surface of the liquid cooling plate and the lower surface of the tray; Wherein, the protrusion is detachably arranged on the liquid cooling plate.

4. The wafer carrier device according to claim 1, characterized in that: The edge of the tray is provided with an extension wall axially protruding from the lower surface of the tray, the extension wall extends to the position of the back plate and is connected to the side of the back plate; the liquid cooling plate is accommodated in the inner cavity surrounded by the extension wall and the back plate.

5. The wafer carrier device according to claim 1, characterized in that: The back plate includes a central through hole opened in the center, a first annular area surrounding the central through hole, and a second annular area surrounding the first annular area, and the first annular area and the second annular area are areas for carrying the liquid cooling plate; The reinforcing structure is a thickening body that increases the thickness of the back plate. The thickening body includes a tubular thickening body that is coaxial and has the same diameter as the central through hole, and an annular thickening body located in the first annular area, and the thickness of the tubular thickening body is greater than the thickness of the annular thickening body.

6. The wafer carrier device according to claim 5, characterized in that: The back plate is provided with elastic members for supporting the liquid cooling plate, and the elastic members are all located in the first annular area.

7. The wafer carrier device according to claim 2, characterized in that: The liquid cooling plate is supported by a plurality of the elastic members, and contact portions between all the elastic members and the liquid cooling plate are evenly distributed on the liquid cooling plate.

8. The wafer carrier device according to claim 7, characterized in that: The contact parts are distributed on the liquid cooling disk on a plurality of concentric circles with the center of the liquid cooling disk as the center, and the contact parts on adjacent concentric circles are staggered in the circumferential direction.

9. The wafer carrier device according to claim 2 or 7, characterized in that: The elastic member is a spring, and both ends of the spring, which are respectively in contact with the back plate and the liquid cooling plate, are planar ends perpendicular to the axis of the spring.

10. The wafer carrying device according to claim 3, characterized in that: The protrusions are distributed on the liquid cooling plate on a plurality of concentric circles with the center of the liquid cooling plate as the center, and the protrusions on the concentric circle with the largest diameter are arranged close to the edge of the liquid cooling plate, and the protrusions on the concentric circle with the smallest diameter are arranged close to the central through hole of the liquid cooling plate.

11. The wafer carrier device according to claim 3 or 10, characterized in that: The protruding member comprises: A pin body having a bottom step and a top plane, wherein the bottom step is used to contact the liquid cooling plate and be pressed by the screw, and the top plane is used to abut against the tray; The slot body is connected to the pin body and is used to limit the screw.

12. The wafer carrying device according to claim 4, characterized in that: One of a step and a bearing protrusion is provided on the side surface of the back plate, and the other of the step and the bearing protrusion is provided on the inner surface of the extension wall, so that the step bears the bearing protrusion or the bearing protrusion supports the step; The inner surface of the extension wall is welded to the side surface of the back plate, and the welding position is located below the step and the bearing protrusion; A stress release groove is provided on the lower surface of the back plate, and the stress release groove is arranged close to the side surface of the back plate.

13. The wafer carrier according to claim 1, 2, 3, 4, 5, 6, 7, 8, 10 or 12, characterized in that: A reflective coating is provided on the surface of the tray for carrying the wafer.

14. The wafer carrier according to claim 1, 2, 3, 4, 5, 6, 7, 8, 10 or 12, characterized in that: The tray, the liquid cooling disk and the back plate are coaxially arranged, and a bellows is coaxially connected to the bottom of the back plate; an inlet pipe for introducing coolant into the liquid cooling disk and a liquid outlet pipe for conducting coolant from the liquid cooling disk pass through the tube cavity of the bellows and the central through hole of the back plate to communicate with the liquid cooling disk.

15. A semiconductor process equipment, characterized in that: It comprises a reaction chamber and a wafer carrying device arranged in the reaction chamber, and the wafer carrying device is the wafer carrying device according to any one of claims 1-14.

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