Performance detection method for thin film sensor packaging process

Abstract

The invention discloses a performance detection method for a thin film sensor packaging process, and relates to the technical field of thin film sensors, and the method comprises the following steps: laying an ionic thin film and an FPC according to a preset structural layout; selecting a packaging mode, and packaging the ionic film and the FPC; and testing the packaged ionic thin film and the FPC, and recording a test result. The operation process is convenient and fast, and the influence of different thin film sensor packaging processes on the performance can be intuitively known, so that a data reference basis is provided for selection of the thin film sensor packaging processes.

Description

Technical Field

[0001] The present application relates to the technical field of thin film sensors, and in particular to a performance detection method for a thin film sensor packaging process. Background Art

[0002] The thin film sensor detects the pressure through the ionization effect generated by the ion film through the electrode, so the packaging method of the ion film and the electrode is extremely important. The easier methods to implement are pasting with double-sided tape, pasting with liquid glue and hot stamping. The space between the ion film and the electrode produced by the three technologies is different. When the pressure is transmitted to the film, this will cause the data collected by the electrode to be different. In the past, the performance of the sensor was adjusted more by adjusting the formula of the ion film, which would cause great waste and pollution.

[0003] Therefore, in order to better understand the impact of different thin film sensor packaging processes on performance, a performance detection method for thin film sensor packaging processes is now provided. Summary of the invention

[0004] In view of the defects existing in the prior art, the purpose of this application is to provide a performance testing method for thin film sensor packaging technology. The operation process is convenient and fast, and it can intuitively understand the impact of different thin film sensor packaging processes on performance, thereby providing data reference for the selection of thin film sensor packaging technology.

[0005] In order to achieve the above objectives, the technical solution adopted by this application is:

[0006] The present application provides a performance detection method for a thin film sensor packaging process, the detection method comprising the following steps:

[0007] Arrange the ion film and FPC according to the preset structural layout;

[0008] Select a packaging method to package the ion film and FPC;

[0009] Test the packaged ion film and FPC, and record the test results.

[0010] On the basis of the above technical solution, the packaging method includes double-sided adhesive pasting, liquid adhesive pasting or hot stamping.

[0011] On the basis of the above technical solution, the encapsulated ion film and FPC are tested and the test results are recorded, including the following steps:

[0012] Perform range test, accuracy test and response time test on the packaged ion film and FPC, and record the test results.

[0013] On the basis of the above technical solution, after testing the packaged ion film and FPC and recording the test results, the following steps are also included:

[0014] Compare the test results corresponding to different packaging methods.

[0015] On the basis of the above technical solution, after testing the packaged ion film and FPC and recording the test results, the following steps are also included:

[0016] Compare the test results corresponding to different packaging methods to obtain the packaging method with the best range effect, the packaging method with the best accuracy, and the packaging method with the best response time.

[0017] On the basis of the above technical solution, the packaging method with the best range effect is double-sided tape pasting.

[0018] Based on the above technical solution, the packaging method with the best accuracy is liquid glue bonding.

[0019] Based on the above technical solution, the packaging method with the best response time is hot stamping.

[0020] Compared with the prior art, the advantages of this application are:

[0021] The application operation process is convenient and fast, and can intuitively understand the impact of different thin film sensor packaging processes on performance, thereby providing a data reference for the selection of thin film sensor packaging processes. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 A schematic diagram of the structure of a thin film sensor in a performance detection method for a thin film sensor packaging process according to an embodiment of the present application;

[0024] In the figure:

[0025] 1. Ion film; 2. Packaging structure layer; 3. FPC. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0027] The embodiments of the present application are further described in detail below in conjunction with the accompanying drawings.

[0028] The embodiment of the present application provides a performance detection method for a thin film sensor packaging process. The operation process is convenient and fast, and the influence of different thin film sensor packaging processes on the performance can be intuitively understood, thereby providing a data reference basis for the selection of thin film sensor packaging processes.

[0029] In order to achieve the above technical effects, the overall idea of ​​this application is as follows:

[0030] A performance detection method for a thin film sensor packaging process, the detection method comprising the following steps:

[0031] S1. Arrange the ion film and FPC according to the preset structural layout;

[0032] S2, select a packaging method to package the ion film and FPC;

[0033] S3. Test the packaged ion film and FPC, and record the test results.

[0034] The embodiments of the present application are further described in detail below in conjunction with the accompanying drawings.

[0035] See also Figure 1 As shown, the embodiment of the present application provides a performance detection method for a thin film sensor packaging process, and the detection method includes the following steps:

[0036] S1. Arrange the ion film and FPC according to the preset structural layout;

[0037] S2, select a packaging method to package the ion film and FPC;

[0038] S3. Test the packaged ion film and FPC, and record the test results.

[0039] Among them, FPC, Flexible Printed Circuit, flexible circuit board.

[0040] It should be noted that, taking the three easier-to-implement sensor packaging methods as examples, the performance differences brought about by the three packaging methods are analyzed, and the advantages and disadvantages are discussed, and the usage scenarios are listed. It is explored whether the performance of the sensor can be changed by changing the packaging method. Experiments are conducted using sensors with three packaging methods to compare their range, accuracy, and response time.

[0041] Use double-sided tape: The space between the film and the electrode is the largest, the thickness of the double-sided tape is about 0.2mm, the measuring range is large, but there is basically no reaction when the pressure is small, the response time is slow, and it is difficult to detect in the case of impact.

[0042] Use liquid glue: The thickness of the glue after solidification is about 0.05mm. Compared with the case of using double-sided tape, the measuring range is reduced, but the value can also be detected under low pressure, and the response time is reduced, and it also responds to impact force to a certain extent.

[0043] By hot stamping packaging: the measuring range is further reduced, and it is more sensitive to smaller pressure and impact force. However, there is a problem of being unable to return to zero point (after releasing the pressure, it still shows that there is pressure on the sensor).

[0044] In the embodiment of the present application, the operation process is convenient and fast, and the influence of different thin film sensor packaging processes on the performance can be intuitively understood, thereby providing a data reference basis for the selection of thin film sensor packaging processes.

[0045] Furthermore, the packaging method includes double-sided adhesive bonding, liquid adhesive bonding or hot stamping.

[0046] Furthermore, the step of testing the packaged ion film and FPC and recording the test results includes the following steps:

[0047] Perform range test, accuracy test and response time test on the packaged ion film and FPC, and record the test results.

[0048] Furthermore, after testing the packaged ion film and FPC and recording the test results, the following steps are also included:

[0049] Compare the test results corresponding to different packaging methods.

[0050] Furthermore, after testing the packaged ion film and FPC and recording the test results, the following steps are also included:

[0051] Compare the test results corresponding to different packaging methods to obtain the packaging method with the best range effect, the packaging method with the best accuracy, and the packaging method with the best response time.

[0052] Furthermore, the packaging method corresponding to the best range effect is double-sided tape pasting.

[0053] Furthermore, the packaging method with the best accuracy is liquid glue bonding.

[0054] Furthermore, the packaging method with the best response time is hot stamping.

[0055] Based on the technical solution of the embodiment of the present application, during the specific implementation, the specific situation is as follows:

[0056] The same kind of ion films were packaged in different ways: the adhesive layer 2 was packaged using double-sided adhesive, liquid adhesive, and hot stamping, respectively, and fixed on the electrode. The same tests were performed to observe the differences in the results.

[0057] Test the range, accuracy and response time. Test on a force table.

[0058] Increase and release the pressure slowly, and increase and release the pressure quickly.

[0059] The accuracy is determined by analyzing the consistency of the values ​​when increasing and releasing pressure, and the pressure range is measured by the value fed back during pressurization.

[0060] The response time is measured by quickly increasing and releasing the pressure. The reaction time required is measured by controlling the cycle of pressure application and pressure release.

[0061] The experiments were conducted using sensors with three different packaging methods to compare their range, accuracy, and response time. The specific results are as follows:

[0062] Use double-sided tape: The space between the film and the electrode is the largest, the thickness of the double-sided tape is about 0.2mm, the measuring range is large, but there is basically no reaction when the pressure is small, the response time is slow, and it is difficult to detect in the case of impact.

[0063] Use liquid glue: The thickness of the glue after solidification is about 0.05mm. Compared with the case of using double-sided tape, the measuring range is reduced, but the value can also be detected under low pressure, and the response time is reduced, and it also responds to impact force to a certain extent.

[0064] By hot stamping packaging: the measuring range is further reduced, and it is more sensitive to smaller pressure and impact force. However, there is a problem of being unable to return to zero point (after releasing the pressure, it still shows that there is pressure on the sensor).

[0065] In the description of the present application, it should be noted that the terms "upper", "lower", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. Unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0066] It should be noted that, in this application, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0067] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.

Claims

1. A performance detection method for a thin film sensor packaging process, characterized in that: The detection method comprises the following steps: Arrange the ion film and FPC according to the preset structural layout; Select a packaging method to package the ion film and FPC; Test the packaged ion film and FPC, and record the test results.

2. The performance detection method for thin film sensor packaging process according to claim 1, characterized in that: The packaging method includes double-sided adhesive bonding, liquid adhesive bonding or hot stamping.

3. The performance detection method for thin film sensor packaging process according to claim 1, characterized in that: The step of testing the packaged ion film and FPC and recording the test results includes the following steps: Perform range test, accuracy test and response time test on the packaged ion film and FPC, and record the test results.

4. The performance detection method for thin film sensor packaging process according to claim 1, characterized in that: After testing the packaged ion film and FPC and recording the test results, the following steps are also included: Compare the test results corresponding to different packaging methods.

5. The performance detection method for thin film sensor packaging process according to claim 3, characterized in that: After testing the packaged ion film and FPC and recording the test results, the following steps are also included: Compare the test results corresponding to different packaging methods to obtain the packaging method with the best range effect, the packaging method with the best accuracy, and the packaging method with the best response time.

6. The performance detection method for thin film sensor packaging process according to claim 5, characterized in that: The best packaging method for the range effect is double-sided tape.

7. The performance detection method for thin film sensor packaging process according to claim 5, characterized in that: The packaging method with the best accuracy is liquid glue.

8. The performance detection method for thin film sensor packaging process according to claim 5, characterized in that: The packaging method with the best response time is hot stamping.

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