Electronic device and immersed cooling system

Abstract

The invention discloses an electronic device and an immersed cooling system. The electronic device comprises a bearing frame group, at least one mainboard and a plurality of expansion cards, the bearing frame group comprises a fixed frame and at least one movable side frame. The at least one movable side frame is movably arranged on the fixed frame. The at least one mainboard is arranged on the at least one movable side frame. The expansion cards are arranged on the at least one mainboard.

Description

Technical Field

[0001] The present invention relates to an electronic device, in particular to an electronic device used in an immersion cooling system. Background Art

[0002] With the advent of the big data era and the continuous development of cloud technology, all walks of life have higher and higher requirements for the performance of computing and processing units such as expansion cards. The amount of data to be processed is also increasing, which has greatly increased the heat flux density and heat generation of expansion cards. Therefore, the heat dissipation problem needs to be solved urgently.

[0003] Users usually use an immersion liquid cooling system to cool expansion cards. The motherboard equipped with the expansion card is immersed in a coolant to dissipate heat from the expansion card, thereby maintaining the performance and service life of the expansion card. However, when a motherboard needs to be equipped with multiple expansion cards, the current structural design will occupy a large space, causing inconvenience in installing the motherboard on the immersion liquid cooling system. Therefore, how to save the space occupied by the motherboard equipped with multiple expansion cards in the immersion liquid cooling system is one of the problems that researchers should solve. Summary of the invention

[0004] The present invention provides an electronic device, which can save the space occupied by a motherboard equipped with a plurality of expansion cards in an immersion liquid cooling system.

[0005] An electronic device disclosed in an embodiment of the present invention comprises a carrier assembly, at least one motherboard and a plurality of expansion cards. The carrier assembly comprises a fixed frame and at least one movable side frame. The at least one movable side frame can be movably disposed on the fixed frame. The at least one motherboard is mounted on the at least one movable side frame. The plurality of expansion cards are mounted on the at least one motherboard.

[0006] According to one embodiment of the present invention, one side of the at least one movable side frame is pivotally mounted on the fixed frame, so that the other side of the at least one movable side frame is relatively close to and fixed to the fixed frame so that the at least one movable side frame is located in a closed position, or relatively away from the fixed frame so that the at least one movable side frame is located in an open position.

[0007] According to an embodiment of the present invention, the number of the at least one movable side frame is two, the number of the at least one motherboard is two, the two movable side frames on which the two motherboards are mounted are arranged on opposite sides of the fixed frame, and when the two movable side frames are located in the closed position, the multiple expansion cards respectively mounted on the two motherboards are arranged in a staggered manner.

[0008] According to one embodiment of the present invention, the electronic device further includes a plurality of fixing members, each fixing member includes a first buckle portion and a second buckle portion, the first buckle portion is disposed on the fixing frame, the second buckle portion is disposed on the at least one movable side frame, and the first buckle portion and the second buckle portion are buckled to fix the at least one movable side frame to the fixing frame.

[0009] According to an embodiment of the present invention, the electronic device further comprises at least one contact electrode, and the at least one main board comprises at least one conductive sheet, the at least one contact electrode has a first contact portion, the first contact portion is in electrical contact with the at least one conductive sheet

[0010] According to one embodiment of the present invention, the electronic device further includes a conductive seat, and the at least one contact electrode has a second contact portion, the conductive seat includes a seat body and at least one conductive member, the supporting frame assembly and the at least one conductive member are arranged on the seat body, the second contact portion is away from the first contact portion, and the second contact portion is electrically contacted with the at least one conductive member.

[0011] According to one embodiment of the present invention, the at least one conductive member includes a conductive strip and at least one conductive protrusion, and the base body has at least one through hole, the at least one conductive protrusion is connected to the conductive strip, and the at least one conductive protrusion is penetrated by the at least one through hole, and the second contact portion is in electrical contact with the at least one conductive protrusion.

[0012] According to an embodiment of the present invention, the electronic device further includes at least one cable management rack, and the at least one cable management rack is disposed on the at least one movable side frame.

[0013] According to an embodiment of the present invention, the electronic device further includes a handle, and the handle is disposed on the fixing frame.

[0014] According to an embodiment of the present invention, the plurality of expansion cards are display cards.

[0015] The present invention also provides an immersion cooling system, comprising an immersion tank and at least one electronic device, the immersion tank is used to contain a cooling liquid; the at least one electronic device is arranged in the immersion tank, the at least one electronic device comprises a supporting frame group, at least one motherboard at least one motherboard, the supporting frame group comprises a fixed frame and at least one movable side frame, the at least one movable side frame can be movably arranged on the fixed frame; at least one motherboard is installed on the at least one movable side frame; a plurality of expansion cards are installed on the at least one motherboard.

[0016] According to the electronic device of the above embodiment, since at least one motherboard equipped with multiple expansion cards is respectively installed on at least one movable side frame, and at least one movable side frame can move relative to the fixed frame, at least one motherboard equipped with multiple expansion cards is integrated with the carrier assembly to form a whole, so the space occupied by the electronic device in the immersion cooling system can be reduced. In addition, when the user opens at least one movable side frame, at least one motherboard equipped with multiple expansion cards will move with the at least one movable side frame, so that the user can more conveniently replace the expansion card.

[0017] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention and to provide further explanation of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is a three-dimensional schematic diagram of an electronic device according to a first embodiment of the present invention;

[0019] Figure 2 for Figure 1 Another three-dimensional schematic diagram of the electronic device;

[0020] Figure 3 for Figure 2 An exploded schematic diagram of an electronic device;

[0021] Figure 4 for Figure 1 A three-dimensional schematic diagram of a conductive seat of an electronic device;

[0022] Figure 5 for Figure 1 A schematic cross-sectional view of an electronic device;

[0023] Figure 6 for Figure 1 A three-dimensional schematic diagram of a movable side frame of an electronic device in a closed position;

[0024] Figure 7 for Figure 1 A three-dimensional schematic diagram of a movable side frame of an electronic device in an open position;

[0025] Figure 8 It is a three-dimensional schematic diagram of an immersion cooling system according to a second embodiment of the present invention.

[0026]

Explanation of symbols

[0027] 1: Immersion cooling system

[0028] 2: Immersion tank

[0029] 10: Electronic devices

[0030] 11: Carrying frame group

[0031] 111:Fixed bracket

[0032] 112: Movable side frame

[0033] 12: Motherboard

[0034] 121: Conductive sheet

[0035] 13: Expansion Card

[0036] 14:Fixer

[0037] 141: First button

[0038] 142: Second buckle

[0039] 15: Contact electrode

[0040] 151: First contact portion

[0041] 152: Second contact portion

[0042] 16: Conductive seat

[0043] 161: base body

[0044] 1611: Perforation

[0045] 162: Conductive parts

[0046] 1621: Conductive strip

[0047] 1622: Conductive convex column

[0048] 17: Cable management rack

[0049] 18: Grip

[0050] A: direction DETAILED DESCRIPTION

[0051] See also Figures 1 to 3 . Figure 1 FIG. 4 is a schematic three-dimensional diagram of an electronic device according to a first embodiment of the present invention. Figure 2 for Figure 1 Another three-dimensional schematic diagram of the electronic device. Figure 3 for Figure 2 Exploded diagram of the electronic device.

[0052] The electronic device 10 of the present embodiment includes a carrier assembly 11, two motherboards 12, a plurality of expansion cards 13, a plurality of fixing members 14, a plurality of contact electrodes 15, and a conductive seat 16. The carrier assembly 11 includes a fixing frame 111 and two movable side frames 112. One side of the two movable side frames 112 is respectively pivoted on two opposite sides of the fixing frame 111, so that the other sides of the two movable side frames 112 are relatively close to each other so that the two movable side frames 112 are located in a closed position, or relatively away from the fixing frame 111 so that the two movable side frames 112 are located in an open position. When the two movable side frames 112 are located in the closed position, the two movable side frames 112 are in an upright state. When the two movable side frames 112 are located in the open position, the two movable side frames 112 are in a flattened state.

[0053] The two motherboards 12 are respectively mounted on the two movable side frames 112. The expansion cards 13 are, for example, display cards and are respectively mounted on the two motherboards 12. When the two movable side frames 112 are in the closed position, the expansion cards 13 respectively mounted on the two motherboards 12 are staggered and do not interfere with each other.

[0054] Each fixing member 14 includes a first buckle 141 and a second buckle 142. The first buckles 141 are disposed on the fixing frame 111, and the second buckles 142 are respectively disposed on the two movable side frames 112, and the first buckles 141 and the second buckles 142 are buckled together, so that when the two movable side frames 112 are in the closed position, they can be fixed to the fixing frame 111 by the buckling of the first buckles 141 and the second buckles 142. In this way, the two motherboards 12 equipped with a plurality of expansion cards 13 can be integrated with the carrier assembly 11.

[0055] Please also read Figure 4 and Figure 5 . Figure 4 for Figure 1 A three-dimensional schematic diagram of a conductive seat of an electronic device. Figure 5 for Figure 1 A schematic cross-sectional view of an electronic device.

[0056] The two main boards 12 each include a plurality of conductive sheets 121. Each contact electrode 15 has a first contact portion 151 and a second contact portion 152. The second contact portion 152 is away from the first contact portion 151. The first contact portions 151 are in electrical contact with the conductive sheets 121, respectively. The conductive seat 16 includes a seat body 161 and a plurality of conductive members 162. The support frame assembly 11 and the conductive members 162 are disposed on the seat body 161. The support frame assembly 11 is detachably disposed on the conductive seat 16, and the second contact portions 152 are in electrical contact with the conductive members 162.

[0057] In detail, each conductive member 162 includes a conductive strip 1621 and a plurality of conductive protrusions 1622, and the base 161 has a plurality of through holes 1611. The conductive protrusions 1622 are connected to the conductive strips 1621, and the conductive protrusions 1622 are respectively disposed in the through holes 1611. The second contact portions 152 are in electrical contact with the conductive protrusions 1622 of the conductive members 162. The first contact portions 151 and the second contact portions 152 of the contact electrodes 15 are in electrical contact with the conductive sheet 121 of the motherboard 12 and the conductive protrusions 1622 of the conductive members 162, respectively, so that power and signal transmission can be performed.

[0058] In this embodiment, the electronic device 10 may further include two cable management frames 17. The two cable management frames 17 are respectively disposed on the two movable side frames 112, so that multiple cables (not shown) plugged into the electronic device 10 can be stored in the cable management frames 17 without making the lines of these cables too chaotic.

[0059] In this embodiment, the electronic device 10 may further include a handle 18 . The handle 18 is disposed on the fixing frame 111 , so that the user can carry the electronic device 10 .

[0060] In this embodiment, the two motherboards 12 equipped with multiple expansion cards 13 are respectively installed on the two movable side frames 112. The advantage is that since the two motherboards 12 equipped with multiple expansion cards 13 are integrated with the carrier assembly 11, the space occupied by the electronic device 10 in the immersion cooling system can be reduced. In addition, when the user opens the two movable side frames 112, the two motherboards 12 equipped with multiple expansion cards 13 will move with the two movable side frames 112, so that the user can more conveniently replace the expansion card 13.

[0061] In this embodiment, the number of the mainboard 12 and the number of the movable side frame 112 are two, but the present invention is not limited thereto. In other embodiments, the number of the mainboard and the number of the movable side frame can also be only one.

[0062] See also Figure 6 and Figure 7 . Figure 6 for Figure 1 A three-dimensional schematic diagram of a movable side frame of an electronic device in a closed position. Figure 7 for Figure 1 A three-dimensional schematic diagram of the movable side frame of the electronic device in the open position.

[0063] like Figure 6The two movable side frames 112 are in the closed position, and the two movable side frames 112 equipped with the two motherboards 12 are fixed to the fixed frame 111 by the engagement of the first buckles 141 and the second buckles 142. At this time, the two motherboards 12 equipped with the plurality of expansion cards 13 are integrated with the carrier assembly 11, so when the user places the electronic device 10 in the immersion cooling system, the space occupied by the electronic device 10 can be reduced.

[0064] like Figure 7 As shown. When the user wants to replace the expansion card 13, first release the engagement of the first buckles 141 and the second buckles 142, and then rotate the two movable side frames 112 along the direction A to open the two movable side frames 112, so that the two movable side frames 112 move from the closed position to the open position. At this time, the two motherboards 12 equipped with multiple expansion cards 13 also move to the open position along with the two movable side frames 112, so that the user can replace the expansion card 13. When the user has finished replacing the expansion card 13, the two movable side frames 112 can be rotated in the opposite direction of the direction A to close the two movable side frames 112, so that the two movable side frames 112 move from the open position to the closed position, and the two movable side frames 112 can be fixed to the fixed frame 111 again by the engagement of the first buckles 141 and the second buckles 142.

[0065] See also Figure 8 . Figure 8 1 is a perspective schematic diagram of an immersion cooling system according to a second embodiment of the present invention. The immersion cooling system 1 of this embodiment comprises an immersion tank 2 and a plurality of electronic devices 10. The immersion tank 2 is used to contain a cooling liquid (not shown), and the electronic devices 10 are disposed in the immersion tank 2, and the cooling liquid is used to dissipate heat from the electronic devices 10.

[0066] In detail, the electronic device 10 includes a carrier assembly 11, two motherboards 12, a plurality of expansion cards 13 and a conductive seat 16. The carrier assembly 11 is detachably disposed on the conductive seat 16, and includes a fixed frame 111 and two movable side frames 112. One side of the two movable side frames 112 is, for example, pivotally disposed on opposite sides of the fixed frame 111. The two motherboards 12 are respectively mounted on the two movable side frames 112. The expansion cards 13 are, for example, display cards, and are respectively mounted on the two motherboards 12.

[0067] When the user wants to replace the expansion card 13 in the electronic device 10, the support frame assembly 11 and the conductive base 16 can be separated, and the support frame assembly 11 can be moved out of the immersion tank 2 to replace the expansion card 13. In this way, the user can easily replace the expansion card 13 in an open space without having to perform a complicated replacement operation in the narrow immersion tank 2.

[0068] In this embodiment, the number of the electronic devices 10 of the immersion cooling system 1 is multiple, but not limited thereto. In other embodiments, the number of the electronic device of the immersion cooling system may also be only one.

[0069] According to the electronic device of the above embodiment, since the two mainboards equipped with multiple expansion cards are respectively installed on the two movable side frames, and the two movable side frames can move relative to the fixed frame, the two mainboards equipped with multiple expansion cards are integrated with the carrier assembly to form a whole, so the space occupied by the electronic device in the immersion cooling system can be reduced. In addition, when the user opens the two movable side frames, the two mainboards equipped with multiple expansion cards will move with the two movable side frames, so that the user can more conveniently replace the expansion cards.

[0070] Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone familiar with similar skills can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be based on the scope defined by the claims attached to this specification.

Claims

1. An electronic device, characterized in that: Include: A support frame assembly, comprising a fixed frame and at least one movable side frame, wherein the at least one movable side frame is movably disposed on the fixed frame; At least one mainboard is mounted on the at least one movable side frame; and A plurality of expansion cards are installed on the at least one motherboard.

2. The electronic device according to claim 1, characterized in that: One side of the at least one movable side frame is pivotally mounted on the fixed frame, so that the other side of the at least one movable side frame is relatively close to and fixed to the fixed frame so that the at least one movable side frame is located in a closed position, or relatively away from the fixed frame so that the at least one movable side frame is located in an open position.

3. The electronic device according to claim 2, characterized in that: The number of the at least one movable side frame is two, the number of the at least one motherboard is two, the two movable side frames equipped with the two motherboards are arranged on opposite sides of the fixed frame, and when the two movable side frames are located in the closed position, the multiple expansion cards respectively installed on the two motherboards are staggered.

4. The electronic device according to claim 2, characterized in that: It also includes a plurality of fixing members, each of which includes a first buckle portion and a second buckle portion, the first buckle portion is arranged on the fixing frame, the second buckle portion is arranged on the at least one movable side frame, and the first buckle portion and the second buckle portion are buckled together to fix the at least one movable side frame to the fixing frame.

5. The electronic device according to claim 1, characterized in that: It also includes at least one contact electrode, and the at least one main board includes at least one conductive sheet. The at least one contact electrode has a first contact portion, and the first contact portion is in electrical contact with the at least one conductive sheet.

6. The electronic device according to claim 5, characterized in that: It also includes a conductive seat, and the at least one contact electrode has a second contact portion. The conductive seat includes a seat body and at least one conductive member. The support frame assembly and the at least one conductive member are arranged on the seat body. The second contact portion is far away from the first contact portion, and the second contact portion is electrically in contact with the at least one conductive member.

7. The electronic device according to claim 6, characterized in that: The at least one conductive member includes a conductive strip and at least one conductive protrusion, and the base has at least one through hole. The at least one conductive protrusion is connected to the conductive strip and penetrates the at least one through hole. The second contact portion is in electrical contact with the at least one conductive protrusion.

8. The electronic device according to claim 1, characterized in that: It also comprises at least one wire management frame, and the at least one wire management frame is arranged on the at least one movable side frame.

9. The electronic device according to claim 1, characterized in that: It also includes a handle, which is arranged on the fixing frame.

10. The electronic device according to claim 1, characterized in that: The multiple expansion cards are display cards.

11. An immersion cooling system, characterized in that: Include: an immersion tank for containing a cooling liquid; and At least one electronic device is disposed in the immersion tank, and the at least one electronic device comprises: A support frame assembly, comprising a fixed frame and at least one movable side frame, wherein the at least one movable side frame is movably disposed on the fixed frame; At least one mainboard is mounted on the at least one movable side frame; and A plurality of expansion cards are installed on the at least one motherboard.

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