Machining method for laser cutting of inner-layer resistor, anti-oxidation and improvement of precision of resistor

Abstract

The invention discloses an inner-layer resistor laser cutting and anti-oxidation resistor precision improving processing method, which comprises the following steps: determining laser cutting parameters according to the material, the size and the required resistance value change of a resistor, and making preparation before resistor laser cutting; the prepared resistor is accurately positioned on a laser cutting station table, and a proper cutting method is selected for cutting the resistor on the laser cutting station table; the laser cutting machine is used for cutting the resistor according to preset parameters, the surface of the cut resistor is detected, and the edge of the resistor etched twice is trimmed, so that the precision of the resistor in the width direction can be + / -5 [mu] m, the resistance tolerance is improved from + / -10% to + / -2%, and the precision of the resistor in the width direction can be improved from + / -10% to + / -2%. The laser cutting resistor is used for carrying out size finishing on the finished resistor, the resistor with irregular edges is subjected to CO2 laser light path finishing, the resistor size is neat, the size is better close to the theoretical value width, and after etching and laser finishing of the resistor are finished, resistor layer protection is achieved in the mode that the resistor is covered with resin.

Description

Technical Field

[0001] The present invention belongs to the technical field of laser resistance trimming, and in particular relates to a method for laser cutting of inner layer resistors and preventing oxidation to improve resistor precision. Background Art

[0002] Laser cutting to correct resistor size is a widely used process in the microelectronics industry. Laser resistance trimming technology uses a very fine laser beam to vaporize and evaporate the resistor body, thereby achieving resistor cutting. By changing the geometric shape of the resistor, such as the cross-sectional area and the conductive length, the resistance value of the resistor can be changed. This technology has the advantages of high adjustment accuracy, good repeatability, fast speed, and low cost, so it has been widely used in the production of chip resistors and thick film circuits.

[0003] Conventional resistor manufacturing requires acid etching to determine the resistor width, and then alkaline etching to determine the resistor length, thereby forming a resistor with two shapes of length and width. The resistance value is proportional to the length of the resistor and inversely proportional to the width of the resistor. Therefore, the size of the resistor is linearly related to the resistance value. The length and width of the resistor directly affect the resistance value. The resistance value of the traditional process is determined by the accuracy of etching. The tolerance of etching accuracy is + / -10%, and the superposition accuracy of two etchings is + / -20%. In addition, the material itself has a tolerance greater than 5%, and the influence of subsequent production processes, it is easy to cause the finished resistance value to exceed the + / -20% tolerance required by the customer. In addition, there is a lack of protection for the resistor layer, which affects the resistance value in the roughening process. The acid solution and micro-etching solution in the subsequent process attack the resistor layer, resulting in resistor discreteness, and the resistance stability cannot be guaranteed. Therefore, we need to provide inner layer resistor laser cutting and anti-oxidation processing methods to improve resistor accuracy. Summary of the invention

[0004] The purpose of the present invention is to provide a method for laser cutting and anti-oxidation of inner layer resistors to improve resistor precision. By trimming the edges of resistors that have completed two etchings, the precision of the resistor width direction can be + / -5μm, which affects the resistor tolerance from + / -10% to + / -2%. The laser cut resistor performs size trimming on the completed resistor. After the resistor with irregular edges is trimmed by CO2 laser optical path, the resistor size becomes neat and the size is closer to the theoretical value width. After the resistor is etched and laser trimmed, the resistor layer is protected by covering the top of the resistor with resin, so as to solve the problem proposed in the above background technology that the conventional resistor production in the prior art needs to determine the resistor width by acid etching, and after alkaline etching, the resistor width is determined by acid etching. Etching determines the length of the resistor, thus forming the shape of the resistor in terms of length and width. The resistance value is proportional to the length of the resistor and inversely proportional to the width of the resistor. Therefore, the size of the resistor is linearly related to the resistance value. The length and width of the resistor directly affect the size of the resistance value. The resistance value of the traditional process is determined by the accuracy of etching. The tolerance of etching accuracy is + / -10%, and the superposition accuracy of two etchings is + / -20%. In addition, the material itself has a tolerance greater than 5%, and the influence of subsequent production processes can easily cause the finished resistance value to exceed the + / -20% tolerance required by the customer. In addition, there is a lack of protection for the resistor layer, which affects the resistance value in the roughening process. The acid solution and micro-etching solution in the subsequent process attack the resistor layer, resulting in the problem of resistor discreteness.

[0005] To achieve the above purpose, the present invention adopts the following technical solution: a method for laser cutting of inner layer resistors and anti-oxidation and improving resistor precision processing, comprising the following steps:

[0006] Determine the laser cutting parameters according to the resistor's material, size, and required resistance change, and make preparations for the resistor laser cutting;

[0007] Precisely position the prepared resistor on the laser cutting table, and select a suitable cutting method to cut the resistor on the laser cutting table;

[0008] The laser cutting machine is installed with preset parameters to cut the resistors, and the surface of the resistors after cutting is tested, and the resistors that meet the standards after cutting are protected;

[0009] A resin solution is configured to protect the resistors that meet the standards, the configured resin solution is coated on the resistors, and the resin covering layer is cured.

[0010] Preferably, the laser cutting parameters are determined according to the material, size and required resistance change of the resistor, and preparations are made before the resistor laser cutting, including:

[0011] Laser cutting parameters include: laser power, cutting speed and number of cuts.

[0012] Preferably, the preparation before resistor laser cutting includes determining a cutting area.

[0013] Preferably, the step of precisely positioning the prepared resistor on a laser cutting station and selecting a suitable cutting method to cut the resistor on the laser cutting station includes:

[0014] Secure the resistor using an appropriate clamp or adhesive.

[0015] Preferably, the cutting operation: the cutting width is less than half of the total width of the resistor, and rounded "L"-shaped cutting is preferred.

[0016] Preferably, the laser cutting machine is used to perform resistor cutting processing according to preset parameters, and detects the surface of the resistor after cutting, and performs protective processing on the resistor that meets the standards after cutting, including:

[0017] The laser cutting machine is started to perform cutting according to the preset parameters, and the resistance value change of the resistor is monitored in real time.

[0018] Preferably, the desired resistance value is achieved through multiple cuttings, and subsequent cutting parameters are adjusted according to the measurement results.

[0019] Preferably, after the cutting is completed, a high-precision resistance measuring instrument is used to detect the resistance value of the cut resistor to determine whether it meets the standard.

[0020] Preferably, the protective treatment of the resistor that meets the standard by configuring the resin solution, coating the configured resin solution on the resistor, and curing the resin covering layer, includes:

[0021] Select the appropriate resin material according to the material, working environment and performance requirements of the resistor;

[0022] According to the ratio provided by the resin supplier, mix the resin, curing agent and other additives evenly to form a resin solution.

[0023] Preferably, when applying the resin solution, a suitable coating tool is used to evenly coat the resin solution on the surface of the resistor;

[0024] Control the curing conditions: according to the curing temperature and curing time of the resin.

[0025] Technical effects and advantages of the present invention: The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision proposed by the present invention has the following advantages compared with the prior art:

[0026] The present invention trims the edges of resistors that have completed two etchings, so that the accuracy of the resistor width direction can be achieved to be + / -5μm, which increases the resistor tolerance from + / -10% to + / -2%. Laser cutting of resistors is used to trim the size of the completed resistors. After the resistors with irregular edges are trimmed by CO2 laser light path, the size of the resistors becomes neat and the size is closer to the theoretical width. After the resistors are etched and laser trimmed, the resistor layer is protected by covering the top of the resistor with resin.

[0027] Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or be understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the structures pointed out in the description and the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural step flow chart of the present invention. DETAILED DESCRIPTION

[0029] The following will be combined with the accompanying drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0030] The present invention provides Figure 1 The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision shown includes the following steps:

[0031] Determine the laser cutting parameters according to the resistor's material, size, and required resistance change, and make preparations for the resistor laser cutting;

[0032] Precisely position the prepared resistor on the laser cutting table, and select a suitable cutting method to cut the resistor on the laser cutting table;

[0033] The laser cutting machine is installed with preset parameters to cut the resistors, and the surface of the resistors after cutting is tested, and the resistors that meet the standards after cutting are protected;

[0034] A resin solution is configured to protect the resistors that meet the standards, the configured resin solution is coated on the resistors, and the resin covering layer is cured.

[0035] According to the material, size and required resistance change of the resistor, the laser cutting parameters are determined, and preparations before the resistor laser cutting are made, including:

[0036] Laser cutting parameters include: laser power, cutting speed and number of cuts;

[0037] Specifically, selecting a resistor material with good thermal stability can reduce the thermal expansion effect during laser cutting, thereby maintaining the stability of the resistance value;

[0038] The cutting speed should match the laser power to ensure stable cutting quality and resistance change. Too fast a cutting speed may cause the energy of the laser beam to not have enough time to completely melt the material, resulting in incomplete cutting. Too slow a cutting speed may cause the laser beam to have too much energy left on the surface of the material, resulting in overburning. The number of cuts depends on the required resistance change range and the accuracy of laser cutting. Multiple cuts can gradually approach the required resistance change, but each cut will increase the heat-affected area and the instability of the resistance. Therefore, it is necessary to minimize the number of cuts while ensuring the resistance accuracy.

[0039] The preparations before resistor laser cutting include determining the cutting area;

[0040] Specifically, the cutting area should be much smaller than the surface of the resistor to avoid excessive impact on the overall resistance. The size of the cuttable area can usually be found in the supplier's database to ensure that the cutting position is within the effective range. In order to obtain a stable resistance, the resistance after cutting should generally be about 1.5 times the original resistance. The cutting width should be less than half of the total width to ensure the stability of the resistance change. Adjust the laser power according to the thermal stability of the resistor material and the required resistance change range. Lower laser power can reduce the heat-affected area, but multiple cuts may be required to achieve the desired resistance change. Higher laser power can speed up the cutting speed, but may increase the risk of thermal damage.

[0041] The step of precisely positioning the prepared resistor on the laser cutting station and selecting a suitable cutting method to cut the resistor on the laser cutting station includes:

[0042] Secure the resistor using an appropriate clamp or adhesive;

[0043] Specifically, use precise measuring tools (such as vernier calipers, micrometers, etc.) to measure the size of the resistor, including length, width, and thickness. Based on the measurement results, mark the exact position of the resistor on the laser cutting table. Use the calibration tool to calibrate the cutting head of the laser cutting machine to ensure that it can accurately align with the marked position. According to the size and shape of the resistor, adjust the cutting parameters of the laser cutting machine (such as laser power, cutting speed, etc.) to ensure cutting accuracy. Select the appropriate type of fixture according to the size, shape, and material of the resistor. Common types of clamps include cylinder clamps, manual clamps, and automatic clamps. Ensure that the clamping force of the clamp is moderate so that it can firmly fix the resistor without damaging it. Install the clamp on the laser cutting workbench and adjust its position so that it can accurately clamp the resistor. For cylinder clamps, ensure a stable supply of gas and adjust the clamping force of the cylinder. For manual clamps, manually adjust the screw to clamp the resistor and pay attention to controlling the force. For automatic clamps, set appropriate clamping procedures and parameters and check whether their operation is normal. Use the clamp to fix the resistor on the laser cutting workbench and ensure that its position is accurate and stable. Before cutting, check the fixation of the resistor again to ensure that it is not loose or offset.

[0044] Cutting operation: The cutting width should be less than half of the total width of the resistor, and rounded “L” type cutting is preferred;

[0045] Specifically, the rounded "L"-shaped cutting can ensure that the resistance value changes evenly throughout the cutting process. Since the cutting shape is a continuous rounded "L" shape, the resistance value will gradually and steadily increase with the increase of the cutting length, avoiding the sudden change of resistance value caused by the sudden change of the cutting shape.

[0046] Reduce thermal effects: Compared with other cutting shapes, the rounded "L"-shaped cutting can reduce the heat-affected area, thereby reducing the fluctuation of resistance value caused by thermal effects. The rounded corner design helps to disperse the energy of the laser beam and reduce the concentration of heat in the resistor material, thereby maintaining the stability of the resistance value;

[0047] The rounded "L"-shaped cutting shape is relatively simple and continuous, which is convenient for the laser cutting machine to carry out precise control. The laser beam can move steadily along the preset path to ensure the accuracy of the cutting width and depth.

[0048] Reduced error: Due to the rounded corner design, the error generated during the cutting process is relatively small. Even if there is a slight cutting deviation, the impact on the overall resistance value will be controlled within a small range, thereby improving the cutting accuracy. The rounded "L"-shaped cutting can significantly reduce stress concentration. At right angles or sharp corners, the stress is often high, which can easily cause damage or deformation of the resistor material. The rounded corner design can disperse the stress and make it more evenly distributed, thereby extending the service life of the resistor.

[0049] The laser cutting machine is installed with preset parameters to perform resistor cutting processing, and detects the surface of the resistor after cutting, and performs protective processing on the resistor that meets the standards after cutting, including:

[0050] Start the laser cutting machine to perform cutting according to the preset parameters, and monitor the resistance value change of the resistor in real time;

[0051] Specifically, select a resistance measuring instrument with high precision and high resolution, such as a digital multimeter, a high-precision resistance measuring instrument, etc., to ensure that the measuring instrument can accurately measure the resistance value of the resistor and has a real-time monitoring function, and set the monitoring parameters on the measuring instrument, including the monitoring frequency, monitoring range, etc., to ensure that the monitoring parameters can accurately reflect the changes in the resistance value of the resistor, and perform cutting processing on the laser cutting machine.

[0052] The required resistance value is achieved through multiple cutting, and the subsequent cutting parameters are adjusted according to the measurement results.

[0053] After cutting, use a high-precision resistance measuring instrument to test the resistance value of the cut resistor to determine whether it meets the standard;

[0054] Specifically, start the real-time monitoring function of the measuring instrument, monitor the resistance change of the resistor in real time, and record the data to determine whether it meets the standards. If the resistance change is abnormal (such as sudden increase or decrease), stop cutting immediately and check the cause.

[0055] The protective treatment of the resistor that meets the standard by configuring the resin solution, coating the configured resin solution on the resistor, and curing the resin covering layer, includes:

[0056] Select the appropriate resin material according to the material, working environment and performance requirements of the resistor;

[0057] According to the ratio provided by the resin supplier, the resin, curing agent and other additives are mixed evenly to form a resin solution;

[0058] Specifically, commonly used resin materials include epoxy resin, acrylic resin, etc. These resins have good adhesion, insulation and moisture resistance. According to the ratio provided by the resin supplier, the resin, curing agent and other additives are mixed evenly to form a resin solution. Pay attention to controlling the viscosity, curing time and curing temperature of the resin solution to ensure the quality and performance of the covering layer.

[0059] When applying the resin solution, use an appropriate coating tool to evenly apply the resin solution on the surface of the resistor;

[0060] Control curing conditions: according to the curing temperature and curing time of the resin;

[0061] Specifically, use appropriate coating tools to evenly coat the resin solution on the surface of the resistor, avoid bubbles and missing coating during coating, ensure that the resin solution can completely cover the surface of the resistor, set appropriate curing conditions according to the curing temperature and curing time requirements of the resin, and during the curing process, keep the curing temperature constant and uniform to avoid the influence of temperature fluctuations on the curing effect. After curing, check the quality and performance of the resin coating to ensure that there are no defects such as bubbles and cracks. If necessary, the resin coating can be ground, polished, etc. to improve its surface finish and aesthetics;

[0062] Resin materials should be stored in a dry, cool, well-ventilated place, avoiding direct sunlight and high temperature. Resin materials have a limited shelf life and should be used within the validity period to avoid performance degradation due to expired use. Control of the operating environment: When applying the resin solution, the operating environment should be kept clean and dry to avoid the influence of pollutants such as dust and moisture on the resin covering layer. Operators should wear appropriate protective equipment, such as gloves, masks, etc., to prevent the resin solution from irritating and damaging the skin.

[0063] After the resin covering is cured, the resistor should be quality checked to ensure that the quality of the resin covering meets the design requirements. If defects or problems are found in the resin covering, it should be repaired or replaced in time.

[0064] Working principle: Determine the laser cutting parameters according to the material, size and required resistance change of the resistor, and make preparations before laser cutting of the resistor; accurately position the prepared resistor on the laser cutting station, and select a suitable cutting method to cut the resistor on the laser cutting station; install the laser cutting machine with preset parameters to cut the resistor, and detect the surface of the resistor after cutting, and protect the resistor that meets the standards after cutting; configure the resin solution to protect the resistor that meets the standards, apply the configured resin solution on the resistor, and cure the resin covering layer.

[0065] In addition, the above-mentioned text creation unit, image generation unit, high-quality image training unit and model optimization processing unit are also used to realize other functions of the above-mentioned inner layer resistor laser cutting and anti-oxidation to improve resistor precision processing method when executed, which will not be elaborated here one by one.

[0066] In addition, the present invention also provides a terminal device. The inner layer resistor laser cutting and anti-oxidation resistance precision improvement processing method involved in this embodiment is mainly used in the terminal device, which can be a PC, a portable computer, a mobile terminal and other devices with display and processing functions.

[0067] Specifically, the terminal device may include a processor (e.g., CPU), a communication bus, a user interface, a network interface, and a memory. The communication bus is used to realize the connection and communication between these components; the user interface may include a display screen (Display), an input unit such as a keyboard (Keyboard); the network interface may optionally include a standard wired interface, a wireless interface (such as a WI-FI interface); the memory may be a high-speed RAM memory, or a stable memory (non-volatile memory), such as a disk memory, and the memory may optionally be a storage device independent of the aforementioned processor.

[0068] Among them, the memory stores a readable storage medium, and the readable storage medium stores a program for laser cutting of inner layer resistors and anti-oxidation to improve resistor accuracy. The processor can call the program for laser cutting of inner layer resistors and anti-oxidation to improve resistor accuracy stored in the memory, and execute the method for laser cutting of inner layer resistors and anti-oxidation to improve resistor accuracy provided by an embodiment of the present invention.

[0069] It is understood that a readable storage medium can be a tangible device that can hold and store instructions used by an instruction execution device. Computer-readable storage media can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination of the above. More specific examples of computer-readable storage media (a non-exhaustive list) include: portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), static random access memories (SRAM), portable compact disk read-only memories (CD-ROM), digital versatile disks (DVD), memory sticks, floppy disks, mechanical encoding devices, such as punch cards or raised structures in grooves on which instructions are stored, and any suitable combination of the above. The computer-readable storage medium used here is not to be interpreted as a transient signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagating through a waveguide or other transmission medium (e.g., a light pulse through a fiber optic cable), or an electrical signal transmitted through a wire.

[0070] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0071] The computer program instructions for performing the operation of the present disclosure may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-related instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed completely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or completely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be customized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present disclosure.

[0072] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. Inner layer resistor laser cutting and anti-oxidation resistor precision processing method, characterized in that: The following steps are involved: Determine the laser cutting parameters according to the resistor's material, size, and required resistance change, and make preparations for the resistor laser cutting; Precisely position the prepared resistor on the laser cutting table, and select a suitable cutting method to cut the resistor on the laser cutting table; The laser cutting machine is installed with preset parameters to cut the resistors, and the surface of the resistors after cutting is tested, and the resistors that meet the standards after cutting are protected; A resin solution is configured to protect the resistors that meet the standards, the configured resin solution is coated on the resistors, and the resin covering layer is cured.

2. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 1, characterized in that: According to the material, size and required resistance change of the resistor, the laser cutting parameters are determined, and preparations before the resistor laser cutting are made, including: Laser cutting parameters include: laser power, cutting speed and number of cuts.

3. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 2, characterized in that: The preparations before resistor laser cutting include determining the cutting area.

4. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 1, characterized in that: The step of precisely positioning the prepared resistor on the laser cutting station and selecting a suitable cutting method to cut the resistor on the laser cutting station includes: Secure the resistor using an appropriate clamp or adhesive.

5. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 4, characterized in that: Cutting operation: The cutting width should be less than half of the total width of the resistor, and rounded "L" shaped cutting is preferred.

6. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 1, characterized in that: The laser cutting machine is installed with preset parameters to perform resistor cutting processing, and detects the surface of the resistor after cutting, and performs protective processing on the resistor that meets the standards after cutting, including: The laser cutting machine is started to perform cutting according to the preset parameters, and the resistance value change of the resistor is monitored in real time.

7. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 6, characterized in that: The required resistance value is achieved through multiple cutting, and the subsequent cutting parameters are adjusted according to the measurement results.

8. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 7, characterized in that: After cutting is completed, use a high-precision resistance measuring instrument to test the resistance value of the cut resistor to determine whether it meets the standard.

9. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 1, characterized in that: The protective treatment of the resistor that meets the standard by configuring the resin solution, coating the configured resin solution on the resistor, and curing the resin covering layer, includes: Select the appropriate resin material according to the material, working environment and performance requirements of the resistor; According to the ratio provided by the resin supplier, mix the resin, curing agent and other additives evenly to form a resin solution.

10. The inner layer resistor laser cutting and anti-oxidation processing method for improving resistor precision according to claim 9, characterized in that: When applying the resin solution, use an appropriate coating tool to evenly apply the resin solution on the surface of the resistor; Control the curing conditions: according to the curing temperature and curing time of the resin.

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