Chip solder pressing die head assembly

Abstract

The invention belongs to the technical field of semiconductor chip processing, and discloses a chip solder pressing die head assembly which comprises a shell, a pressing assembly used for controlling a pressing die head to move longitudinally and a pressing die assembly arranged outside the shell, and a heating assembly used for heating the pressing die assembly is further arranged on the pressing die assembly. The downward pressing assembly and the pressing die assembly are hinged through a connecting assembly, the pressing die assembly inclines towards any direction of 360 degrees around in the horizontal plane direction of the end of the downward pressing assembly, and a damping assembly used for reducing vibration generated by inclination of the pressing die assembly is arranged at the bottom of the shell. The angle of the pressing die head can be adaptively adjusted, and the angle is automatically adjusted under the condition that the working surface of the pressing die head is not parallel to the core carrying plate, so that the thickness of pressed welding flux is more uniform, the shape is more complete, the pressing die head is replaceable, and the pressing die head matched with the pressing die head is replaced for machining according to machining requirements.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor chip processing, and in particular to a chip solder die head assembly. Background Art

[0002] In the process of semiconductor packaging and patching, the components need to be pressed by a die head so that the solder inside the components can be formed for subsequent processing. Conventional solder die head devices use cylinders or electric push rods as direct power, which makes the force used to drive the die head larger.

[0003] To this end, for example, a Chinese patent, application announcement number CN117219538A, discloses a solder die head device for semiconductor packaging patch process, including a shell and a die head arranged on the shell, the outer side of the shell is provided with a driving unit, the driving unit is used to drive the shell to reciprocate in the vertical direction; the interior of the shell is provided with a heating unit, the heating unit is used to preheat the die head; a conveyor belt is provided under the shell, the conveyor belt is used to convey components; the present invention can drive the die head on the shell to reciprocate in the vertical direction through the driving unit provided, so as to realize the solder molding of the die head on the component; at the same time, the distance between the positioning shaft and the opening is greater than the distance between the positioning shaft and the incomplete gear, which acts as a lever, thereby reducing the required driving force, and the clamping unit provided can be used to complete the replacement of the die head according to actual needs, and the operation is relatively convenient.

[0004] But it has the following problems:

[0005] (1) The position of the die head is fixed. When the core carrier is horizontal, there will be no problem. Once the working surface of the die head is not parallel to the surface of the core carrier, it will cause uneven solder thickness and even incomplete shape, which will seriously affect product quality.

[0006] (2) Different die heads are required for semiconductor packaging and patching according to chip processing requirements. However, the die head of the above technical solution is inconvenient to replace, which brings limitations to its use. Summary of the invention

[0007] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a chip solder die head assembly. When the working surface of the die head is not parallel to the core carrier plate, when the die head touches the core carrier plate, the die head can adaptively adjust its own angle, so that the thickness of the solder after pressing can be more uniform and the shape can be more complete. The die head is replaceable and can be replaced with a matching die head according to processing requirements for processing.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solution: The present invention provides a chip solder die head assembly, comprising:

[0009] case;

[0010] A pressing assembly, used to control the longitudinal movement of the die head, wherein the moving end of the pressing assembly is slidably connected to the housing;

[0011] A die assembly is arranged outside the housing, and the die assembly is controlled by the lower die assembly to move up and down to press the solder into shape;

[0012] A heating assembly is arranged on the die assembly to heat the die assembly;

[0013] A connecting assembly is arranged between the pressing assembly and the die assembly;

[0014] The pressing assembly and the die assembly are hinged via a connecting assembly, and the die assembly is inclined in any direction of the circumference in the horizontal plane direction of the end of the pressing assembly;

[0015] A damping assembly for reducing vibration of the die assembly due to tilting is arranged at the bottom of the shell.

[0016] Preferably, the shell comprises an upper shell sleeved on the outside of the pressing assembly and a lower shell arranged at the bottom of the upper shell, and the lower shell is a hemispherical structure.

[0017] Preferably, the die assembly comprises:

[0018] A connecting rod connected to the connecting assembly;

[0019] A die head is arranged at the lower end of the connecting rod;

[0020] Wherein, a movable disassembly mechanism is arranged between the connecting rod and the die head to facilitate the movable connection between the die head and the connecting rod.

[0021] Preferably, the movable disassembly mechanism comprises:

[0022] Connecting end and fixing end;

[0023] Wherein, the connecting end comprises a slot and a plug plugged into the slot, the slot is arranged at the bottom center of the connecting rod, and the plug is arranged at the top center of the die head;

[0024] Wherein, the fixed end includes a pin that passes through the slot and the plug, and one end of the pin is a threaded rod and the other end is a round tube;

[0025] A movable card seat with a right-angle trapezoidal structure is slidably arranged on the round tube, and a receiving groove plugged with the movable card seat is arranged on the connecting rod.

[0026] Preferably, the movable disassembly mechanism also includes a disassembly pin arranged on the connecting rod and connected to the accommodating groove, and a push block slidably arranged in the accommodating groove to push the movable card seat to leave the accommodating groove, the disassembly pin is threadedly connected to the connecting rod, and the disassembly pin is rotatably connected to the push block.

[0027] Preferably, the heating assembly comprises:

[0028] A heating element is arranged on the connecting rod;

[0029] A heat conducting pipe, wherein two heat conducting pipes are arranged, and the two heat conducting pipes are connected to the heating element to conduct heat to the die head;

[0030] The heat insulation mechanism is arranged at the upper end of the heating element to prevent the heating element from conducting heat to the connecting component;

[0031] Wherein, one end of the heat conducting pipe connected to the die head is arranged as a hemispherical structure.

[0032] Preferably, the connection assembly comprises:

[0033] An upper connector, wherein the cross section of the upper connector is a T-shaped structure;

[0034] A lower connector, wherein the lower connector is a spherical structure;

[0035] The moving block is clamped on the lower connecting head and is slidably connected with the lower connecting head;

[0036] The upper connecting head is fixedly connected to the lower connecting head, and the moving block is slidably connected to the shell.

[0037] Preferably, the damping assembly comprises:

[0038] Disc housing;

[0039] A plurality of buffer mechanisms are arranged in a circular array in the disc housing;

[0040] Wherein, all the buffer mechanisms are arranged around the connecting rod.

[0041] Preferably, the buffer mechanism comprises:

[0042] A mounting groove, the mounting groove being arranged in the disc housing;

[0043] Buffer rod, sliding freely in the mounting slot;

[0044] A spring is arranged in the mounting groove to buffer the movement of the buffer rod;

[0045] A contact end connected to the buffer rod;

[0046] Wherein, the contact end is arranged as a spherical structure.

[0047] The beneficial effects of the present invention are:

[0048] The present invention hinges the pressing assembly and the die assembly by using a connecting assembly, so that the die assembly can be tilted in any direction of 360 degrees around the horizontal plane direction of the end of the pressing assembly. When packaging chips with uneven surfaces, the die head of the die assembly can better match the chip surface packaging surface, and with the assistance of the damping assembly at the bottom of the shell, the vibration of the die assembly caused by the tilting can be reduced, thereby further improving the accuracy of the molding and improving the quality of the semiconductor packaging patch.

[0049] The present invention arranges a detachable mechanism between the connecting rod and the die head for movably connecting the die head to the connecting rod, so that the die head can be detached and replaced, so that the die head matching the processing requirements can be replaced for processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0051] Figure 1 A schematic diagram of the internal structure of a chip solder die head assembly provided in an embodiment of the present invention.

[0052] Figure 2 A schematic diagram of the internal structure of a connecting rod of a chip solder die head assembly provided in an embodiment of the present invention.

[0053] Figure 3 for Figure 2 Enlarged view of point A in .

[0054] Figure 4 A schematic structural diagram of a chip solder die head assembly pin provided in an embodiment of the present invention.

[0055] Figure 5 A schematic structural diagram of a damping assembly of a chip solder die head assembly provided in an embodiment of the present invention.

[0056] Figure 6 for Figure 5 Enlarged view of point B in .

[0057] Description of reference numerals:

[0058] 1-upper shell, 2-lower shell, 3-pressing assembly, 4-connecting rod, 401-accommodating groove, 5-die head, 6-slot, 7-plug, 8-pin, 9-threaded rod, 10-round tube, 1001-movable card seat, 1002-make way groove, 1003-ejection spring, 11-disassembly pin, 12-push block, 13-heating element, 1301-insulating mechanism, 14-heat conducting pipe, 15-upper connector, 16-lower connector, 17-moving block, 18-disc shell, 19-installation groove, 20-buffer rod, 21-spring, 22-contact end. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] Embodiment 1:

[0061] like Figures 1 to 6 As shown, the present invention provides a chip solder die head assembly, comprising a housing, a pressing assembly 3 for controlling the longitudinal movement of the die head, and a die assembly arranged outside the housing, wherein the moving end of the pressing assembly 3 is slidably connected to the housing, and the pressing assembly is controlled by the pressing assembly 3 to move up and down to press and form the solder;

[0062] The die assembly is also provided with a heating assembly for heating the die assembly. The lower pressing assembly 3 is hinged to the die assembly through a connecting assembly. The die assembly can be tilted in any direction of 360 degrees around the lower pressing assembly 3 in the horizontal plane direction of the end portion. A damping assembly for reducing the vibration of the die assembly caused by the tilting is arranged at the bottom of the shell, so that the die head of the die assembly can better match the chip surface packaging surface when packaging chips with uneven surfaces.

[0063] Specifically, the shell includes an upper shell 1 sleeved on the outside of the pressing assembly 3 and a lower shell 2 arranged at the bottom of the upper shell 1. The lower shell 2 is a hemispherical structure, and the shell plays a role in protecting the internal structure.

[0064] The die assembly includes a connecting rod 4 connected to the connecting assembly and a die head 5 arranged at the lower end of the connecting rod 4. The pressing assembly 3 drives the die head 5 to move up and down by controlling the connecting assembly to complete the semiconductor package placement.

[0065] The heating assembly includes a heating element 13 arranged on the connecting rod 4 and two heat pipes 14 connected to the heating element 13, and the heat of the heating element 13 is transferred to the die head 5 through the heat pipes 14 to encapsulate the solder;

[0066] In order to prevent the heat generated by the heating element 13 from affecting the upper connection components, a heat insulation mechanism 1301 is arranged at the upper end of the heating element 13, thereby preventing the heating element 13 from transferring heat to the connection components, and preventing the connection components from aging due to high temperature and thus affecting the tilting of the die assembly;

[0067] Among them, one end of the heat pipe 14 connected to the die head 5 is arranged as a hemispherical structure. The connection method of the hemispherical structure has a larger contact area than the flat head connection, making the heat transfer more balanced and the transfer effect better.

[0068] Embodiment 2:

[0069] On the basis of Example 1, in order to facilitate the disassembly and assembly of the die head 5, a movable disassembly mechanism is arranged between the connecting rod 4 and the die head 5 for movably connecting the die head 5 to the connecting rod 4, so that the die head can be disassembled and replaced, thereby being able to replace the matching die head 5 for processing according to processing requirements.

[0070] Specifically, the movable disassembly mechanism includes a connecting end and a fixed end;

[0071] The connecting end includes a slot 6 and a plug 7 plugged into the slot 6. The slot 6 is arranged at the bottom center of the connecting rod 4, and the plug 7 is arranged at the top center of the die head 5. When assembling, align the plug 7 on the die head 5 with the slot 6 at the bottom of the connecting rod 4 and insert it.

[0072] The fixed end includes a plug 8 that penetrates the slot 6 and the plug 7. One end of the plug 8 is a threaded rod 9 and the other end is a round tube 10. When assembling, the plug 8 is inserted into the connecting rod 4 from the round tube 10 end and then the plug 8 is continuously rotated to completely install the plug, so that the die head 5 and the connecting rod 4 are assembled together.

[0073] Among them, a movable card seat 1001 with a right-angled trapezoidal structure is slidably arranged on the circular tube 10, a receiving groove 401 connected with the movable card seat 1001 is arranged on the connecting rod 4, and a yield groove 1002 and an ejection spring 1003 that can allow the movable card seat 1001 to be extended and retracted are also arranged on the circular tube 10. In the process of installing the latch 8, human intervention is first required to push the movable card seat 1001 into the yield groove 1002, compress the ejection spring 1003, and the movable card seat 1001 is accommodated in the yield groove 1002, so that the latch 8 can be installed. When the movable card seat moves to the position aligned with the receiving groove 401, the movable card seat 1001 is pushed into the receiving groove 401 under the action of the ejection spring 1003, thereby fixing the latch 8 and also achieving the fixation of the die head 5.

[0074] Among them, the movable disassembly mechanism also includes a disassembly pin 11 arranged on the connecting rod 4 and connected with the accommodating groove 401, and a push block 12 slidably arranged in the accommodating groove 401 to push the movable card seat 1001 to leave the accommodating groove 401. The disassembly pin 11 is threadedly connected to the connecting rod 4, and the disassembly pin 11 is rotatably connected to the push block 12. During disassembly, the push block 12 is driven to move toward the inside of the connecting rod 4 by rotating the disassembly pin 11. When the push block 12 moves horizontally, it pushes the movable card seat 1001 with a right-angled trapezoidal structure to leave the accommodating groove 401 until the movable card seat 1001 is pushed into the yielding groove 1002. At this time, the rotating latch 8 is taken out. When the latch 8 is taken out, the die head 5 and the connecting rod 4 can be separated.

[0075] Embodiment three:

[0076] On the basis of the second embodiment, in order to enable the die head 5 to adaptively adjust its angle to be parallel to the core carrier plate when it touches the core carrier plate;

[0077] Specifically, the connecting assembly includes an upper connecting head 15, a lower connecting head 16 and a moving block 17 that is stuck on the lower connecting head 16 and is slidably connected to the lower connecting head 16. The cross-section of the upper connecting head 15 is a T-shaped structure, and the lower connecting head 16 is a spherical structure. The upper connecting head 15 is fixedly connected to the lower connecting head 16, the moving block 17 is slidably connected to the lower shell body 2, and the connecting rod 4 is fixedly connected to the bottom of the moving block 17. When the core carrier plate is not parallel, when the die head 5 contacts the core carrier plate, the die head 5, the connecting rod 4 and the moving block 17 will tilt at a certain angle to match and fit parallel to the core carrier plate, and the moving block 17 rotates around the lower connecting head 16 with the spherical structure, so that the die head 5 and the core carrier plate are parallel to each other.

[0078] In order to reduce the vibration of the die assembly caused by tilting, further improve the accuracy of the die, and improve the quality of the semiconductor package patch, a damping assembly is arranged at the bottom of the shell;

[0079] Specifically, the damping assembly includes a disc housing 18 and a plurality of buffer mechanisms arranged in a circumferential array in the disc housing 18 , and all the buffer mechanisms are arranged around the connecting rod 4 .

[0080] Among them, the buffer mechanism includes a mounting groove 19 arranged in the disc shell 18, a buffer rod 20 that slides freely in the mounting groove 19, a spring 21 that is arranged in the mounting groove 19 to buffer the movement of the buffer rod 20, and a contact end 22 connected to the buffer rod 20, wherein the contact end 22 is arranged as a spherical structure. When the core carrier plate is uneven, the die head 5 needs to be tilted at a certain angle to maintain parallel fit with the core carrier plate. At this time, the connecting rod 4 will move in the tilted direction when the die head is tilted, and contact the contact end 22 on the tilted side. The spring 21 can buffer the movement of the contact end 22, that is, buffer the movement of the connecting rod 4, offset the vibration generated during its movement, thereby avoiding vibration of the die head 5 during the tilting process, affecting the solder molding quality during the final molding.

[0081] Working principle:

[0082] When in use, the matching die head 5 is replaced according to the processing requirements for processing. When replacing, the old die head 5 needs to be removed. The specific operation is to rotate the disassembly pin 11 to drive the push block 12 to move inside the connecting rod 4. When the push block 12 moves horizontally, it pushes the movable card seat 1001 of the right-angle trapezoidal structure to leave the receiving groove 401 until the movable card seat 1001 is pushed into the yielding groove 1002. At this time, the rotating latch 8 is taken out. When the latch 8 is taken out, the die head 5 and the connecting rod 4 can be separated;

[0083] Then replace the appropriate die head 5, align the plug 7 on the die head 5 with the slot 6 at the bottom of the connecting rod 4 and insert it, then install the pin 8, insert the pin 8 into the connecting rod 4 from the end of the round tube 10 and then continue to rotate the pin 8 to completely install the pin, so that the die head 5 and the connecting rod 4 are assembled together. During the installation process, human intervention is required to push the movable card seat 1001 into the make way groove 1002, compress the ejection spring 1003, and the movable card seat 1001 is accommodated in the make way groove 1002, so that the pin 8 can be installed, and when the movable card seat moves to the position aligned with the receiving groove 401, the movable card seat 1001 is pushed into the receiving groove 401 under the action of the ejection spring 1003, so as to fix the die head 5.

[0084] When the core carrier plate is uneven and the die head 5 contacts the core carrier plate, the die head 5, the connecting rod 4 and the moving block 17 will tilt at a certain angle to match and fit parallel to the core carrier plate, and the moving block 17 will rotate around the lower connecting head 16 of the spherical structure, so that the die head 5 and the core carrier plate are parallel to each other. At the same time, during the tilting of the die head, the connecting rod 4 moves in the tilting direction, contacts and pushes the contact end 22 on the tilted side, and the spring 21 can buffer the movement of the contact end 22, that is, buffer the movement of the connecting rod 4, offset the vibration generated during its movement, thereby avoiding vibration of the die head 5 during the tilting process.

[0085] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A chip solder die head assembly, characterized in that: include: case; A pressing component (3) is used to control the longitudinal movement of the die head, and the moving end of the pressing component (3) is slidably connected to the housing; A die assembly is arranged outside the housing, and the die assembly is controlled by a lower pressing assembly (3) to move up and down to press the solder into shape; A heating assembly is arranged on the die assembly to heat the die assembly; A connecting component is arranged between the pressing component (3) and the die component; The pressing assembly (3) and the die assembly are hinged via a connecting assembly, and the die assembly can be tilted in any direction of 360 degrees around the horizontal plane of the end of the pressing assembly (3); A damping assembly for reducing vibration of the die assembly due to tilting is arranged at the bottom of the shell.

2. A chip solder die head assembly as claimed in claim 1, characterized in that: The shell comprises an upper shell (1) sleeved on the outside of the pressing assembly (3) and a lower shell arranged at the bottom of the upper shell (1); the lower shell is a hemispherical structure.

3. A chip solder die head assembly as claimed in claim 2, characterized in that: The die assembly comprises: A connecting rod (4), connected to the connecting assembly; A die head (5) is arranged at the lower end of the connecting rod (4); Wherein, a movable disassembly mechanism is arranged between the connecting rod (4) and the die head (5) for movably connecting the die head (5) and the connecting rod (4).

4. A chip solder die head assembly as claimed in claim 3, characterized in that: The movable disassembly mechanism comprises: Connecting end and fixing end; The connecting end comprises a slot (6) and a plug (7) plugged into the slot (6), the slot (6) being arranged at the bottom center of the connecting rod (4), and the plug (7) being arranged at the top center of the die head (5); The fixed end comprises a pin (8) penetrating the slot (6) and the plug (7), and one end of the pin (8) is a threaded rod (9) and the other end is a round tube (10); A movable card seat (1001) with a right-angle trapezoidal structure is slidably arranged on the circular tube (10), and a receiving groove (401) plugged into the movable card seat (1001) is arranged on the connecting rod (4).

5. A chip solder die head assembly as claimed in claim 4, characterized in that: The movable disassembly mechanism further comprises a disassembly pin (11) arranged on the connecting rod (4) and connected to the receiving groove (401), and a push block (12) slidably arranged in the receiving groove (401) to push the movable card seat (1001) to leave the receiving groove (401), the disassembly pin (11) is threadedly connected to the connecting rod (4), and the disassembly pin (11) is rotatably connected to the push block (12).

6. A chip solder die head assembly as claimed in claim 5, characterized in that: The heating assembly comprises: A heating element (13) is arranged on the connecting rod (4); A heat conducting pipe (14), wherein two heat conducting pipes (14) are arranged, and the two heat conducting pipes (14) are connected to the heating element (13) to conduct heat to the die head (5); A heat insulation mechanism is arranged at the upper end of the heating element (13) to prevent the heating element (13) from conducting heat to the connecting assembly; Wherein, one end of the heat conducting pipe (14) connected to the die head (5) is arranged in a hemispherical structure.

7. A chip solder die head assembly as claimed in claim 1, characterized in that: The connection component comprises: An upper connector (15), wherein the cross section of the upper connector (15) is a T-shaped structure; A lower connecting head (16), wherein the lower connecting head (16) is a spherical structure; A moving block (17) is clamped on the lower connecting head (16) and is slidably connected with the lower connecting head (16); The upper connecting head (15) is fixedly connected to the lower connecting head (16), and the moving block (17) is slidably connected to the shell.

8. A chip solder die head assembly as claimed in claim 7, characterized in that: The damping assembly comprises: Disc housing (18); A plurality of buffer mechanisms are arranged in a circular array in the disc housing (18); Wherein, all the buffer mechanisms are arranged around the connecting rod (4).

9. A chip solder die head assembly as claimed in claim 8, characterized in that: The buffer mechanism comprises: A mounting groove (19), wherein the mounting groove (19) is arranged in the disc housing (18); The buffer rod (20) slides freely in the mounting groove (19); A spring (21) is arranged in the mounting groove (19) to buffer the movement of the buffer rod (20); A contact end (22) connected to the buffer rod (20); Wherein, the contact end (22) is arranged as a spherical structure.

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