Chip assembly, electronic equipment and preparation method of chip assembly

Abstract

The invention discloses a chip assembly, electronic equipment and a preparation method of the chip assembly, and belongs to the technical field of electronic products. The chip assembly comprises a chip, a first packaging layer, a carrier plate, solder balls and anti-warping supporting pieces, the carrier plate is provided with a first surface and a second surface which are arranged oppositely, the chip and the first packaging layer are arranged on the first surface, the first packaging layer wraps the chip, and the solder balls are arranged on the second surface of the carrier plate. The solder ball and the anti-warping supporting piece are both arranged on the carrier plate, at least part of at least one of the solder ball and the anti-warping supporting piece protrudes out of the second surface, and the anti-warping supporting piece is arranged close to the edge of the carrier plate.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic products, and specifically relates to a chip assembly, an electronic device, and a method for preparing the chip assembly. Background Art

[0002] With the continuous development of electronic devices, the functions of electronic devices are increasing. Correspondingly, the number of chips used to realize various functions in electronic devices is also increasing. In order to protect each chip and avoid mutual interference between chips, a packaging structure is usually used to package the chips to protect each chip while avoiding adverse effects between chips.

[0003] After being packaged, the chip can form a chip assembly. The current method of packaging chips easily increases the overall thickness of the chip assembly, which is not conducive to the lightweight design of electronic devices. Therefore, the chip assembly also needs to develop in the direction of lightweight and thinness. However, if the thickness of the entire chip assembly is reduced, it will easily lead to the problem of chip assembly warping. That is, in the subsequent process of the chip being attached to the circuit board of the electronic device through the solder balls on the chip assembly, if the chip assembly is too thin, the chip assembly will produce a large warping deformation, which will easily cause the solder balls to fail to fit completely on the circuit board, that is, it will easily cause a cold solder joint phenomenon, which will easily cause the chip to fail to work properly.

[0004] In summary, the chip components involved in the related art have the problem of being prone to large warping deformation. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a chip assembly, an electronic device and a method for preparing a chip assembly, which can solve the problem that the chip assembly involved in the related art is prone to large warping deformation.

[0006] In a first aspect, an embodiment of the present application provides a chip assembly, including a chip, a first packaging layer, a carrier, solder balls, and an anti-warping support member. The carrier has a first surface and a second surface arranged opposite to each other, the chip and the first packaging layer are both arranged on the first surface, and the first packaging layer wraps the chip, the solder ball and the anti-warping support are both arranged on the carrier, at least one of the solder ball and the anti-warping support is at least partially protruded from the second surface, and the anti-warping support is arranged close to the edge of the carrier.

[0007] In a second aspect, an embodiment of the present application provides an electronic device, comprising a housing, a circuit board and the chip assembly described above, wherein the chip assembly and the circuit board are both disposed in the housing, and the solder ball electrically connects the chip and the circuit board.

[0008] In a third aspect, an embodiment of the present application provides a method for preparing a chip assembly, which is applied to the chip assembly described above, and the method comprises: Arranging the chip and the first packaging layer wrapping the chip on the first surface of the carrier; Arranging the solder ball and the anti-warping support member on the carrier; preparing a second packaging layer so that the second packaging layer completely wraps the solder ball and the anti-warping support member; The side of the second packaging layer facing away from the carrier is ground to expose the solder balls and the anti-warping support member relative to the second packaging layer.

[0009] In the embodiment of the present application, since the larger warping deformation produced by the chip assembly is usually at the edge of the chip assembly, the present application sets the anti-warping support member close to the edge of the carrier, that is, increases the thickness of the edge of the carrier to a certain extent, so that the anti-warping support member can resist the warping deformation of the edge of the carrier while supporting the carrier, and thus resist the warping deformation of the entire chip assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 A schematic cross-sectional view of a chip assembly disclosed in an embodiment of the present application; Figure 2 and Figure 3 A schematic diagram of a process for preparing a chip assembly disclosed in an embodiment of the present application; Figure 4 and Figure 5 It is a schematic diagram of the structure of providing anti-warping support members at different edges of a carrier board disclosed in an embodiment of the present application; Figure 6 This is a schematic diagram of a structure in which anti-warping support members are provided at each edge of a carrier board according to an embodiment of the present application; Figure 7 and Figure 8 A schematic diagram of a process for preparing a chip assembly disclosed in an embodiment of the present application.

[0011] Description of reference numerals: 100-chip; 200-first encapsulation layer; 300 - carrier board, 310 - first surface, 320 - second surface, 330 - first edge, 340 - third edge, 350 - second edge, 360 - fourth edge; 400-Solder Balls; 500-anti-warping support member, 510-second bottom surface, 520-first support member, 530-second support member, 540-third support member, 550-fourth support member; 600-second packaging layer, 610-first bottom surface, 620-groove; 710 - first adhesive member, 720 - second adhesive member; 810 - first connecting line, 820 - second connecting line. DETAILED DESCRIPTION

[0012] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0013] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0014] The chip assembly disclosed in the embodiment of the present application is described in detail below through specific embodiments and their application scenarios in conjunction with the accompanying drawings.

[0015] Please refer to Figure 1-Figure 6 The present application discloses a chip assembly, which includes a chip 100, a first packaging layer 200, a carrier board 300, a solder ball 400 and an anti-warping support member 500.

[0016] The chip assembly disclosed in the present application can be attached to a circuit board in an electronic device described later, so that the chip 100 is electrically connected to the circuit board. The chip 100 disclosed in the present application can be a storage chip, or a processing chip or other chip, so that the electronic device has a storage function, a data processing function or other functions. The first packaging layer 200 is used to protect the chip 100, that is, the first packaging layer 200 can wrap the chip 100. Optionally, the material made of the first packaging layer 200 can be plastic.

[0017] The carrier 300 is used to carry the chip 100 and the first packaging layer 200, that is, the carrier 300 is a basic component of the chip assembly, which can provide an installation foundation for the chip 100, the first packaging layer 200 and other components of the chip assembly. Specifically, the carrier 300 has a first surface 310 and a second surface 320 arranged opposite to each other, the chip 100 and the first packaging layer 200 are both arranged on the first surface 310, and the chip 100 can be specifically bonded to the first surface 310 through the first adhesive 710, the solder ball 400 and the anti-warping support member 500 are both arranged on the carrier 300, and at least a part of at least one of the solder ball 400 and the anti-warping support member 500 protrudes from the second surface 320, so that the solder ball 400 is electrically connected to the circuit board, and the anti-warping support member 500 is arranged close to the edge of the carrier 300, which can increase the thickness of the edge of the carrier 300 to a certain extent, so that the anti-warping support member 500 can increase the overall anti-warping ability of the chip assembly, thereby improving the reliability of the chip assembly.

[0018] Optionally, the first adhesive member 710 may be DAF (Die Attach Film). DAF is an ultra-thin film adhesive with strong bonding properties. Therefore, the first adhesive member 710 can better bond the chip 100 and the carrier 300. Figure 1 When multiple chips 100 are used, DAF can also bond the multiple chips 100 .

[0019] Optionally, a first connecting wire 810 may be embedded in the carrier 300, and a second connecting wire 820 may be embedded in the first packaging layer 200. The second connecting wire 820 is used to electrically connect the chip 100 and the first connecting wire 810. The first connecting wire 810 is electrically connected to the solder ball 400. Since the solder ball 400 is electrically connected to the circuit board, the chip 100 is electrically connected to the circuit board via the second connecting wire 820, the first connecting wire 810 and the solder ball 400 in sequence.

[0020] In the embodiment of the present application, since the larger warping deformation produced by the chip assembly is usually at the edge of the chip assembly, the present application sets the anti-warping support member 500 close to the edge of the carrier 300, that is, the thickness of the edge of the carrier 300 is increased to a certain extent, so that the anti-warping support member 500 can resist the warping deformation of the edge of the carrier 300 while supporting the carrier 300, and thus resist the warping deformation of the entire chip assembly.

[0021] Optionally, the chip assembly may further include a second packaging layer 600, which is disposed on the carrier 300, at least part of the second packaging layer 600 protrudes from the second surface 320, and the second packaging layer 600 may wrap part of the solder ball 400 and at least part of the anti-warping support member 500, that is, part of the solder ball 400 is exposed relative to the second packaging layer 600 to facilitate electrical connection between the solder ball 400 and the circuit board.

[0022] In this embodiment, since the second encapsulation layer 600 wraps at least part of the anti-warping support member 500, the second encapsulation layer 600 can protect at least part of the anti-warping support member 500 to avoid bumping the anti-warping support member 500 during the installation process, thereby avoiding affecting the ability of the anti-warping support member 500 to resist warping and deformation. It can be seen that the second encapsulation layer 600 can better protect the anti-warping support member 500 without affecting the electrical connection between the solder ball 400 and the circuit board. Of course, the chip assembly may also not include the second encapsulation layer 600.

[0023] Optionally, the second encapsulation layer 600 may be made of plastic, that is, the first encapsulation layer 200 and the second encapsulation layer 600 may be made of the same material, or may be different.

[0024] Optionally, the second packaging layer 600 has a first bottom surface 610 facing away from the carrier 300, and the first bottom surface 610 is the outer surface of the second packaging layer 600. The anti-warping support 500 has a second bottom surface 510 facing away from the carrier 300, and the second bottom surface 510 is the outer surface of the anti-warping support 500. The first bottom surface 610 and the second bottom surface 510 may not be flush, that is, at this time, in the thickness direction of the chip component, the size of the second packaging layer 600 may be larger or smaller than the size of the anti-warping support 500. When the size of the second packaging layer 600 is larger than the size of the anti-warping support 500, this means that the second packaging layer 600 can completely wrap the anti-warping support 500. When the size of the second packaging layer 600 is smaller than the size of the anti-warping support 500, this means that the second packaging layer 600 only wraps part of the side wall of the anti-warping support 500.

[0025] In another embodiment, the first bottom surface 610 can be flush with the second bottom surface 510, that is, in the thickness direction of the chip component, the size of the second packaging layer 600 is equal to the size of the anti-warping support 500, so that the second packaging layer 600 can wrap the side wall of the entire anti-warping support 500, thereby better protecting the anti-warping support 500 while ensuring that the size of the second packaging layer 600 in the thickness direction of the chip component is not too large. It can be seen that this can reduce the weight of the entire chip component while reducing the production cost of the second packaging layer 600.

[0026] Optionally, a portion of at least one of the solder ball 400 , the anti-warping support member 500 and the second packaging layer 600 may be embedded in the carrier 300 , so that another portion of the at least one is located outside the carrier 300 , ie, protrudes from the second surface 320 .

[0027] In another embodiment, at least one of the solder ball 400, the anti-warping support member 500 and the second packaging layer 600 can be arranged on the second surface 320, that is, the at least one completely protrudes from the second surface 320. It can be seen that the at least one can be just attached to the second surface 320, which can avoid opening an installation groove on the carrier 300 for installing at least one of the solder ball 400, the anti-warping support member 500 and the second packaging layer 600, that is, this connection method and processing technology are simpler.

[0028] Optionally, when the anti-warping support member 500 is attached to the second surface 320, the anti-warping support member 500 can be specifically bonded to the second surface 320 through the second adhesive member 720, that is, the anti-warping support member 500 is bonded to the carrier 300 through the second adhesive member 720. Of course, the carrier 300 and the anti-warping support member 500 can also be connected in other ways. In addition, the anti-warping support member 500 can be a strip-shaped member, which can extend along the edge of the carrier 300. Optionally, the material of the second adhesive member 720 can be the same as the material of the first adhesive member 710, and of course, the materials of the two can also be different.

[0029] Optionally, a groove 620 may be provided on the side of the second packaging layer 600 facing away from the carrier 300, and the groove 620 surrounds the solder ball 400, that is, the groove 620 is a reserved space for the solder ball 400 to deform during subsequent processing. Specifically, when the entire chip assembly is subsequently heated at high temperature by a reflow furnace or other equipment, a portion of the solder ball 400 will deform toward the area where the groove 620 is located, so that the size of the solder ball 400 in the thickness direction of the chip assembly becomes smaller, that is, a short solder ball is formed to reduce the overall thickness of the chip assembly. At the same time, after being heated, the solder ball 400 can be combined with the solder pad on the circuit board, that is, the effect of electrical connection with the circuit board is achieved. In other words, the dwarfing of the solder ball 400 and the combination of the solder ball 400 and the solder pad can be achieved simultaneously by heating, making the processing technology of the chip assembly simpler. Of course, the second packaging layer 600 may not be provided with a groove 620.

[0030] Optionally, in a first direction (the first direction may specifically be Figures 1 to 3 In the direction indicated by the middle arrow line A, that is, the first direction is the thickness direction of the chip assembly), the anti-warping support 500 has a first size, the solder ball 400 has a second size, the first size can be equal to the second size, and when the entire chip assembly is installed on the circuit board, the anti-warping support 500 and the solder ball 400 are in contact with the circuit board.

[0031] In another embodiment, please refer to Figure 1 and Figure 3 , the first size is smaller than the second size, that is, at this time, the thickness of the anti-warping support 500 is smaller than the thickness of the solder ball 400, which ensures that the thickness of the anti-warping support 500 will not be too large, which can reduce the production cost of the anti-warping support 500 while reducing the weight of the entire chip assembly, and at the same time prevent the anti-warping support 500 from restricting the solder ball 400 from combining with the pad of the circuit board.

[0032] Optionally, in a direction perpendicular to the first direction (the direction may specifically be Figures 1 to 3 The solder ball 400 has a third size, wherein the third size may be equal to or smaller than the second size. In this case, the solder ball 400 may be a round sphere or a sphere with a long axis extending along the Figures 1 to 3 An ellipsoidal sphere extending in the direction indicated by the arrow line A.

[0033] In another embodiment, the solder ball 400 may be a long axis along Figures 1 to 3 The elliptical sphere extending in the direction indicated by the middle arrow line B, that is, the third dimension can be larger than the second dimension, which makes the solder ball 400 smaller in the thickness direction of the chip component, thereby reducing the overall thickness of the chip component, which is beneficial to the lightweight design of the electronic device.

[0034] Optionally, the number of the anti-warping support member 500 may be one.

[0035] In another embodiment, please refer to Figure 1 and Figure 4, the number of anti-warping support members 500 can be at least two, including a first support member 520 and a second support member 530, the number of solder balls 400 can be at least one, the first support member 520 and the second support member 530 are spaced apart on the carrier 300, specifically, they can be spaced apart on the second surface 320, and the first support member 520 and the second support member 530 are located on opposite sides of one of the solder balls 400 or all of the solder balls 400, that is, the first support member 520 and the second support member 530 can be located on opposite sides of any solder ball 400, at this time, the positional relationship between the first support member 520 and the second support member 530 and other solder balls 400 can be flexibly set; or, the first support member 520 and the second support member 530 are located on both sides of the area where all the solder balls 400 are located, that is, the area where all the solder balls 400 are located is located between the first support member 520 and the second support member 530. At the same time, the first support member 520 and the second support member 530 are symmetrically arranged, that is, the first support member 520 and the second support member 530 are arranged close to two edges on opposite sides of the carrier 300. Since the first support member 520 and the second support member 530 are symmetrically arranged, the first support member 520 and the second support member 530 can facilitate stress balance, thereby ensuring warping balance.

[0036] Optionally, when the number of solder balls 400 is multiple, correspondingly, the number of the first connecting wires 810 and the number of the second connecting wires 820 are also multiple, and the multiple solder balls 400 can be arranged in an array on the carrier 300. For details, please refer to Figures 4 to 6 The first connection lines 810 are arranged at intervals, the second connection lines 820 are also arranged at intervals, and the second connection lines 820, the first connection lines 810 and the solder balls 400 correspond to each other one by one and are connected in sequence.

[0037] Optionally, refer to Figure 4 The first support member 520 and the second support member 530 are both strip-shaped members, both of which extend along the edge of the carrier 300 and are parallel to each other. In the length direction of the first support member 520 and the second support member 530, the size of the first support member 520 and the size of the second support member 530 are both smaller than or equal to the size of the carrier 300, so as to avoid the end of the first support member 520 and the end of the second support member 530 protruding from the carrier 300, thereby avoiding affecting the installation of other components in the electronic device, that is, this arrangement can reduce the space occupied by the entire chip assembly.

[0038] Please refer to Figures 1 to 5 The carrier 300 may have a first edge 330, a third edge 340, a second edge 350 and a fourth edge 360 ​​connected end to end in sequence. Optionally, the anti-warping support member 500 may only include a first support member 520 and a second support member 530. Please refer to Figure 4In one embodiment, the first support member 520 may be disposed near the first edge 330, the second support member 530 may be disposed near the second edge 350, and the third edge 340 and the fourth edge 360 ​​may not be provided with an anti-warping support member 500. Alternatively, please refer to Figure 5 The first support member 520 may be disposed close to the third edge 340 , the second support member 530 may be disposed close to the fourth edge 360 ​​, and the anti-warping support member 500 may not be disposed at the first edge 330 and the second edge 350 .

[0039] In another embodiment, please refer to Figure 6 , the anti-warping support member 500 includes the first support member 520 and the second support member 530, and may also include the third support member 540 and the fourth support member 550. The third support member 540 and the fourth support member 550 are located on opposite sides of the solder ball 400, and the third support member 540 and the fourth support member 550 are symmetrically arranged. At the same time, the first support member 520 is arranged near the first edge 330, the second support member 530 is arranged near the second edge 350, the third support member 540 is arranged near the third edge 340, and the fourth support member 550 is arranged near the fourth edge 360. It can be seen that the anti-warping support member 500 is arranged at the entire edge of the carrier 300, which can increase the thickness of the entire edge of the carrier 300 to a certain extent, so as to further resist the warping deformation of the entire edge of the carrier 300, and further resist the warping deformation of the entire chip assembly, that is, this arrangement can further ensure the warping balance.

[0040] In this embodiment, since the anti-warping support member 500 is disposed at the entire edge of the carrier 300, that is, the first support member 520, the second support member 530, the third support member 540 and the fourth support member 550 form an annular support structure, and since the third support member 540 and the fourth support member 550 are located on opposite sides of the solder ball 400, the first support member 520 and the second support member 530 are also located on opposite sides of the solder ball 400, that is, at this time, the annular support structure formed by the first support member 520, the second support member 530, the third support member 540 and the fourth support member 550 surrounds the solder ball 400, so that the first support member 520, the second support member 530, the third support member 540 and the fourth support member 550 can protect the solder ball 400 to a certain extent, thereby ensuring the electrical connection stability between the solder ball 400 and the circuit board. Of course, the first support member 520, the second support member 530, the third support member 540 and the fourth support member 550 can also be provided as a whole, so as to form a complete annular support member.

[0041] Optionally, the anti-warping support member 500 may be a support member made of metal material or plastic material.

[0042] In another embodiment, the anti-warping support member 500 may be a support member with a higher elastic modulus such as a silicon wafer, a glass wafer or a silicon carbide wafer. This type of anti-warping support member 500 is not easy to interfere with the chip 100, and because the elastic modulus of the anti-warping support member 500 is large, the anti-warping support member 500 has stronger rigidity and greater hardness, which makes the anti-warping support member 500 less likely to deform and can better resist warping deformation.

[0043] Optionally, the present application also discloses an electronic device, which includes a shell, a circuit board and the chip assembly mentioned above, the chip assembly and the circuit board are both arranged in the shell, the shell can protect the chip assembly and the circuit board at the same time, and the solder ball 400 electrically connects the chip 100 and the circuit board to ensure that the chip 100 can work normally.

[0044] Optionally, refer to Figure 7 and Figure 8 The present application also discloses a method for preparing a chip assembly. The method for preparing a chip assembly is applied to the chip assembly described in any of the above embodiments. The method comprises: S100 , a chip 100 and a first packaging layer 200 encapsulating the chip 100 are disposed on a first surface 310 of a carrier board 300 .

[0045] Specifically, please refer to Figure 2 In the present application, the chip 100 can first be installed on the first surface 310 of the carrier 300, specifically, it can be bonded to the first surface 310 through the above-mentioned first adhesive 710, and then a second connecting wire 820 can be set, one end of the second connecting wire 820 can be electrically connected to the chip 100, and the other end of the second connecting wire 820 can be electrically connected to the first connecting wire 810 embedded in the carrier 300, and finally a first packaging layer 200 can be set around the chip 100, which can be specifically achieved by injection molding, so that the first packaging layer 200 wraps the chip 100, thereby protecting the chip 100.

[0046] S200 , placing solder balls 400 and anti-warping support members 500 on the carrier 300 .

[0047] Specifically, please refer to Figure 3 , the present application can implant solder balls 400 on the carrier 300 so that the solder balls 400 are electrically connected to the first connecting wires 810, and the present application can also set an anti-warping support member 500 in a region near the edge of the carrier 300. Optionally, the present application can set solder balls 400 and mount anti-warping support members 500 on the second surface 320, and specifically, the anti-warping support member 500 can be bonded to the second surface 320 by the second adhesive member 720.

[0048] S300 , preparing a second encapsulation layer 600 , so that the second encapsulation layer 600 completely wraps the solder ball 400 and the anti-warping support member 500 .

[0049] Specifically, please refer to Figure 3 In the present application, a second packaging layer 600 can be prepared around the solder ball 400 and the anti-warping support member 500, which can be specifically achieved by injection molding so that the second packaging layer 600 completely wraps the solder ball 400 and the anti-warping support member 500. At this time, the solder ball 400 and the anti-warping support member 500 are completely covered by the second packaging layer 600 without being exposed.

[0050] S400 , grinding the side of the second packaging layer 600 away from the carrier 300 , so that the solder balls 400 and the anti-warping support member 500 are exposed relative to the second packaging layer 600 .

[0051] Specifically, please refer to Figure 1 In the present application, a grinder may be used to grind the side of the second packaging layer 600 away from the carrier 300 so that the solder balls 400 and the anti-warping support member 500 are exposed relative to the second packaging layer 600, so as to facilitate the subsequent electrical connection of the solder balls 400 with the above-mentioned circuit board.

[0052] The chip assembly preparation method disclosed in the embodiment of the present application has an anti-warping support member 500 disposed at the edge of the carrier 300, which increases the thickness of the edge of the carrier 300 to a certain extent, so that the anti-warping support member 500 can resist the warping deformation of the edge of the carrier 300, and further resist the warping deformation of the entire chip assembly.

[0053] Optionally, the method may further include: S500 , a groove 620 surrounding the solder ball 400 is formed on a side of the second packaging layer 600 facing away from the carrier 300 .

[0054] Specifically, please refer to Figure 1 In the present application, a groove 620 can be opened on the side of the second packaging layer 600 away from the carrier 300 so that the groove 620 surrounds the solder ball 400. Optionally, the second packaging layer 600 around the solder ball 400 can be irradiated with a laser to achieve the purpose of laser opening the groove 620, thereby reserving deformation space for the solder ball 400 during subsequent processing.

[0055] S600, heating the chip assembly so that a portion of the solder ball 400 enters the groove 620, thereby reducing the second size of the solder ball 400 and increasing the third size of the solder ball 400; wherein the second size is the size of the solder ball 400 in the thickness direction of the chip assembly, and the third size is the size of the solder ball 400 in a direction perpendicular to the thickness direction of the chip assembly.

[0056] Specifically, the present application can place the entire chip assembly in a heating device such as a reflow furnace to heat the chip assembly. When the solder ball 400 is heated, a portion of the solder ball 400 will enter the groove 620, that is, a portion of the solder ball 400 will deform toward the area where the groove 620 is located, thereby reducing the second size of the solder ball 400 and increasing the third size of the solder ball 400. The second size is the size of the solder ball 400 in the above-mentioned first direction, that is, the size in the thickness direction of the chip assembly, and the third size is the size of the solder ball 400 in a direction perpendicular to the first direction, that is, the size in a direction perpendicular to the thickness direction of the chip assembly.

[0057] Optionally, in the initial state, that is, when the solder ball 400 is not heated, the third size of the solder ball 400 may be smaller than the second size, and after the solder ball 400 is heated, the third size may be equal to or slightly larger than the second size, or, in the initial state, the third size of the solder ball 400 may be equal to the second size, and after the solder ball 400 is heated, the third size may be slightly larger than the second size, or, in the initial state, the third size of the solder ball 400 may be slightly larger than the second size, and after the solder ball 400 is heated, the third size will be much larger than the second size. It can be seen that this setting method can make the solder ball 400 change from the original long axis along the Figures 1 to 3 The elliptical sphere extending in the direction indicated by the arrow line A becomes a round sphere or a sphere with its major axis along Figures 1 to 3 The elliptical sphere extending in the direction indicated by the arrow line B in the middle, or the solder ball 400 is changed from an original round sphere to a long axis along the Figures 1 to 3 The solder ball 400 is formed into a flatter elliptical sphere extending in the direction indicated by the middle arrow line B, or the solder ball 400 is changed from the original flatter elliptical sphere to an even flatter elliptical sphere, so that the size of the solder ball 400 in the thickness direction of the chip component becomes smaller, that is, a shorter solder ball is formed, thereby reducing the overall thickness of the chip component. Of course, the present application may not provide the groove 620 surrounding the solder ball 400 on the side of the second packaging layer 600 away from the carrier 300.

[0058] Optionally, in the specific patch process, that is, in the process of connecting the chip assembly and the above-mentioned circuit board, the present application can place the entire chip assembly and the circuit board in a heating device such as a reflow oven at the same time. After the solder ball 400 is heated by the heating device such as the reflow oven, it can be combined with the solder pad on the circuit board, thereby achieving the effect of electrical connection with the circuit board.

[0059] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A chip assembly, characterized in that: The invention comprises a chip (100), a first packaging layer (200), a carrier board (300), a solder ball (400) and an anti-warping support member (500), The carrier (300) has a first surface (310) and a second surface (320) arranged in opposite directions; the chip (100) and the first packaging layer (200) are both arranged on the first surface (310), and the first packaging layer (200) wraps the chip (100); the solder ball (400) and the anti-warping support member (500) are both arranged on the carrier (300); at least a portion of at least one of the solder ball (400) and the anti-warping support member (500) protrudes from the second surface (320), and the anti-warping support member (500) is arranged close to an edge of the carrier (300).

2. The chip assembly according to claim 1, characterized in that: The chip assembly further comprises a second packaging layer (600), the second packaging layer (600) being arranged on the carrier board (300), at least a portion of the second packaging layer (600) protruding from the second surface (320), and the second packaging layer (600) wrapping a portion of the solder ball (400) and at least a portion of the anti-warping support member (500).

3. The chip assembly according to claim 2, characterized in that: The second encapsulation layer (600) has a first bottom surface (610) facing away from the carrier (300), the anti-warping support member (500) has a second bottom surface (510) facing away from the carrier (300), and the first bottom surface (610) is flush with the second bottom surface (510); And / or, at least one of the solder ball (400), the anti-warping support member (500) and the second packaging layer (600) is disposed on the second surface (320).

4. The chip assembly according to claim 2, characterized in that: A groove (620) is provided on a side of the second packaging layer (600) facing away from the carrier board (300), and the groove (620) surrounds the solder ball (400).

5. The chip assembly according to claim 1, characterized in that: In a first direction, the anti-warping support member (500) has a first size, the solder ball (400) has a second size, the first size is smaller than the second size, wherein the first direction is a thickness direction of the chip component.

6. The chip assembly according to claim 5, characterized in that: In a direction perpendicular to the first direction, the solder ball (400) has a third size, and the third size is greater than the second size.

7. The chip assembly according to claim 1, characterized in that: The number of the anti-warping support members (500) is at least two, including a first support member (520) and a second support member (530); the number of the solder balls (400) is at least one; the first support member (520) and the second support member (530) are located on opposite sides of one of the solder balls (400) or all of the solder balls (400); and the first support member (520) and the second support member (530) are symmetrically arranged.

8. The chip assembly according to claim 7, characterized in that: The carrier plate (300) has a first edge (330), a third edge (340), a second edge (350) and a fourth edge (360) which are connected end to end in sequence, and the anti-warping support member (500) further comprises a third support member (540) and a fourth support member (550), wherein the first support member (520) is arranged close to the first edge (330), the second support member (530) is arranged close to the second edge (350), the third support member (540) is arranged close to the third edge (340), and the fourth support member (550) is arranged close to the fourth edge (360).

9. An electronic device, characterized in that: It comprises a housing, a circuit board and a chip assembly according to any one of claims 1 to 8, wherein the chip assembly and the circuit board are both arranged in the housing, and the solder ball (400) electrically connects the chip (100) and the circuit board.

10. A method for preparing a chip assembly, applied to the chip assembly according to any one of claims 1 to 8, characterized in that: The method comprises: The chip (100) and the first packaging layer (200) wrapping the chip (100) are arranged on the first surface (310) of the carrier board (300); The solder ball (400) and the anti-warping support member (500) are arranged on the carrier board (300); preparing a second packaging layer (600) so that the second packaging layer (600) completely wraps the solder ball (400) and the anti-warping support member (500); The side of the second packaging layer (600) facing away from the carrier (300) is ground so that the solder balls (400) and the anti-warping support member (500) are exposed relative to the second packaging layer (600).

11. The method according to claim 10, characterized in that The method further comprises: A groove (620) surrounding the solder ball (400) is formed on a side of the second packaging layer (600) facing away from the carrier board (300); Heating the chip assembly so that a portion of the solder ball (400) enters the groove (620), thereby reducing the second size of the solder ball (400) and increasing the third size of the solder ball (400); The second dimension is the dimension of the solder ball (400) in a first direction, the third dimension is the dimension of the solder ball (400) in a direction perpendicular to the first direction, and the first direction is the thickness direction of the chip component.

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