Active radiator for high-power AI server chip

Abstract

The invention provides an active radiator for a high-power AI server chip, relates to the technical field of radiating devices, and solves the technical problems that in the prior art, the heating power of the chip of an AI server reaches up to 800 W or above, and a traditional radiator cannot meet the requirement for long-term reliable operation of the chip. The device comprises a semiconductor cooler and a 3DVC radiator, the semiconductor cooler is installed on the inner side of the bottom of the 3DVC radiator, and the outer portion of the bottom of the 3DVC radiator is connected with an AI server chip.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation devices, and in particular to an active heat sink for a high-power AI server chip. Background Art

[0002] AI computing server is a server specially designed to support AI computing tasks. It is equipped with high-performance computing chips, large-capacity memory and high-speed network interface, which can quickly and efficiently perform complex computing tasks and meet the high requirements of AI applications for computing resources and data storage. However, the heat generation power of AI computing server chips is as high as 800W or more, and traditional heat sinks cannot meet the needs of long-term reliable operation of chips. Summary of the invention

[0003] The purpose of the present invention is to provide an active heat sink for high-power AI server chips to solve the technical problem that the heat generation power of the chip of the AI ​​computing server is as high as 800W or more, and the traditional heat sink cannot meet the requirements of long-term reliable operation of the chip. The many technical effects that can be produced by the preferred technical solution among the many technical solutions provided by the present invention are described in detail below.

[0004] To achieve the above object, the present invention provides the following technical solutions:

[0005] The present invention provides an active heat sink for a high-power AI server chip, comprising a semiconductor cooler and a 3DVC heat sink, wherein the semiconductor cooler is installed on the inner side of the bottom of the 3DVC heat sink, and the outer side of the bottom of the 3DVC heat sink is connected to the AI ​​server chip.

[0006] Optionally, the 3DVC radiator includes a heat spreader assembly, a heat dissipation assembly and a fan, the upper end of the heat spreader assembly is connected to the lower end of the heat dissipation assembly and the semiconductor cooler is located between the heat spreader assembly and the heat dissipation assembly, the lower end of the heat spreader assembly is connected to the AI ​​server chip, there are two fans, and the two fans are respectively located on both sides of the heat dissipation assembly.

[0007] Optionally, a cavity is provided between the vapor chamber assembly and the heat dissipation assembly, and the semiconductor cooler is installed in the cavity.

[0008] Optionally, the cavity is a closed structure and is vacuumed.

[0009] Optionally, a partial area or the entire area of ​​the lower end surface of the heat sink assembly is coated with heat dissipation silicone grease, and the heat dissipation silicone grease is in contact with the AI ​​server chip.

[0010] Optionally, the cold surface of the semiconductor refrigerator is coated with heat dissipation silicone grease, the heat dissipation silicone grease is in contact with the upper end surface of the heat spreader assembly, and the hot surface of the semiconductor refrigerator is connected to the heat dissipation assembly.

[0011] Optionally, the heat dissipation assembly includes a middle heat dissipation structure and a side heat dissipation structure, the number of the side heat dissipation structures is two, the two side heat dissipation structures are respectively connected to the two sides of the middle heat dissipation structure, the middle heat dissipation structure and the side heat dissipation structure are both connected to the heat spreader assembly, and the semiconductor refrigerator is located between the middle heat dissipation structure and the heat spreader assembly, and the fan is located on one side of the side heat dissipation structure.

[0012] Optionally, the intermediate heat dissipation structure includes first heat dissipation fins and a U-shaped closed tube, the number of the first heat dissipation fins is multiple, all the first heat dissipation fins are sequentially stacked and connected, and there is a gap between two adjacent first heat dissipation fins;

[0013] The first heat dissipation fin is provided with a plurality of first through holes, and the corresponding first through holes on all the first heat dissipation fins form a first channel, and the two ends of the U-shaped closed tube are respectively installed on two of the first channels;

[0014] The interior of the U-shaped closed tube is vacuumed.

[0015] Optionally, the side heat dissipation structure includes second heat dissipation fins and a linear closed tube, the number of the second heat dissipation fins is multiple, all the second heat dissipation fins are sequentially stacked and connected, and there is a gap between two adjacent second heat dissipation fins;

[0016] The second heat dissipation fins are provided with a plurality of second through holes, and the corresponding second through holes on all the second heat dissipation fins form a second channel, and the linear closed tube is installed on the second channel;

[0017] The interior of the linear closed tube is vacuumed.

[0018] Optionally, a positioning groove is provided on the upper end surface of the second heat dissipation fin, and a positioning protrusion is provided on the lower end surface of the second heat dissipation fin, and the positioning groove on one second heat dissipation fin is snap-fitted with the positioning protrusion on another second heat dissipation fin.

[0019] The present invention provides an active heat sink for high-power AI server chips. By integrating a semiconductor cooler into a 3DVC heat sink and through the joint action of the semiconductor cooler and the 3DVC heat sink, the heat dissipation power can be increased to 1000-1200W, and the temperature of the AI ​​server chip can be quickly reduced, thereby meeting the long-term operation requirements of the AI ​​server chip. This solves the technical problem in the prior art that the chip heating power of the AI ​​computing server is as high as 800W or more, and the traditional heat sink cannot meet the requirements of long-term reliable operation of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic diagram of a structure of an active heat sink for a high-power AI server chip provided by an embodiment of the present invention;

[0022] Figure 2 2 is a schematic structural diagram from another angle of an active heat sink for a high-power AI server chip provided by an embodiment of the present invention;

[0023] Figure 3 This is a front view of an active heat sink for a high-power AI server chip provided by an embodiment of the present invention;

[0024] Figure 4 is a top view of an active heat sink for a high-power AI server chip provided by an embodiment of the present invention;

[0025] Figure 5 This is a heat transfer diagram for an active heat sink for a high-power AI server chip provided by an embodiment of the present invention.

[0026] In the figure, 1, semiconductor refrigerator;

[0027] 2. 3DVC radiator; 21. Vapor chamber assembly; 22. Heat dissipation assembly; 221. Intermediate heat dissipation structure; 2211. First heat dissipation fin; 2212. U-shaped closed tube; 222. Side heat dissipation structure; 2221. Second heat dissipation fin; 2222. Linear closed tube; 23. Fan;

[0028] 3. AI server chip. DETAILED DESCRIPTION

[0029] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0030] In the description of the present invention, it should be noted that, unless otherwise specified, the meaning of "plurality" is two or more; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0031] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] The present invention provides an active heat sink for a high-power AI server chip, including a semiconductor cooler 1 and a 3DVC heat sink 2, wherein the semiconductor cooler 1 is installed on the inner side of the bottom of the 3DVC heat sink 2, and the outer side of the bottom of the 3DVC heat sink 2 is connected to the AI ​​server chip 3. The present invention provides an active heat sink for a high-power AI server chip, by embedding the semiconductor cooler 1 in the 3DVC heat sink 2, and by the joint action of the semiconductor cooler 1 and the 3DVC heat sink 2, the heat dissipation power can be increased to 1000-1200W, and the temperature of the AI ​​server chip 3 can be quickly reduced, thereby meeting the long-term operation requirements of the AI ​​server chip 3, and solving the technical problem that the chip heating power of the AI ​​computing server in the prior art is as high as 800W or more, and the traditional heat sink cannot meet the requirements of long-term reliable operation of the chip.

[0033] As an optional implementation, the 3DVC heat sink 2 includes a vapor chamber assembly 21, a heat dissipation assembly 22 and a fan 23. The upper end of the vapor chamber assembly 21 is connected to the lower end of the heat dissipation assembly 22 and the semiconductor refrigerator 1 is located between the vapor chamber assembly 21 and the heat dissipation assembly 22. The lower end of the vapor chamber assembly 21 is connected to the AI ​​server chip 3. There are two fans 23, which are respectively located on both sides of the heat dissipation assembly 22. The heat generated by the AI ​​server chip 3 is transferred to the vapor chamber assembly 21, and then the semiconductor refrigerator 1 absorbs the heat in the vapor chamber assembly 21. Then the semiconductor refrigerator 1 transfers the absorbed heat to the heat dissipation assembly 22. Both fans 23 blow air to the heat dissipation assembly 22 to take away the heat in the heat dissipation assembly 22 by convection.

[0034] As an optional implementation, a cavity is provided between the vapor chamber assembly 21 and the heat dissipation assembly 22, and the semiconductor refrigerator 1 is installed in the cavity. The cavity is a closed structure and is evacuated to facilitate heat conduction.

[0035] As an optional implementation, a partial area or the entire area of ​​the lower end surface of the vapor chamber assembly 21 is coated with heat dissipation silicone grease, which contacts the AI ​​server chip 3. The cold surface of the semiconductor refrigerator 1 is coated with heat dissipation silicone grease, which contacts the upper end surface of the vapor chamber assembly 21, and the hot surface of the semiconductor refrigerator 1 is connected to the heat dissipation assembly 22. The heat dissipation silicone grease has high thermal conductivity and facilitates rapid heat transfer.

[0036] As an optional implementation, the heat dissipation assembly 22 includes a middle heat dissipation structure 221 and a side heat dissipation structure 222. The number of the side heat dissipation structures 222 is two, and the two side heat dissipation structures 222 are respectively connected to the two sides of the middle heat dissipation structure 221. The middle heat dissipation structure 221 and the side heat dissipation structure 222 are both connected to the heat spreader assembly 21, and the semiconductor refrigerator 1 is located between the middle heat dissipation structure 221 and the heat spreader assembly 21, and the fan 23 is located on one side of the side heat dissipation structure 222.

[0037] As an optional implementation, the middle heat dissipation structure 221 includes a first heat dissipation fin 2211 and a U-shaped closed tube 2212, the number of the first heat dissipation fin 2211 is multiple, all the first heat dissipation fins 2211 are sequentially stacked and connected, and there is a gap between two adjacent first heat dissipation fins 2211;

[0038] The first heat sink fin 2211 is provided with a plurality of first through holes, and the corresponding first through holes on all the first heat sink fins 2211 form a first channel. The two ends of the U-shaped closed tube 2212 are respectively installed on the two first channels, and the bottom end of the U-shaped closed tube 2212 is close to the heat sink assembly 21; the U-shaped closed tube 2212 is vacuumed inside, and the U-shaped closed tube 2212 can be a copper tube. The heat in the semiconductor refrigerator 1 will be transferred to the U-shaped closed tube 2212, and the heat in the U-shaped closed tube 2212 will be transferred to the first heat sink fin 2211, and the heat in the first heat sink fin 2211 will be taken away by the fan 23.

[0039] As an optional implementation, the side heat dissipation structure 222 includes a second heat dissipation fin 2221 and a linear closed tube 2222, the number of the second heat dissipation fin 2221 is multiple, all the second heat dissipation fins 2221 are sequentially superimposed and connected, and there is a gap between two adjacent second heat dissipation fins 2221;

[0040] The second heat sink fin 2221 is provided with a plurality of second through holes, and the corresponding second through holes on all the second heat sink fins 2221 form a second channel, and the linear closed tube 2222 is installed on the second channel; the linear closed tube 2222 is vacuumed inside, and the linear closed tube 2222 can be a copper tube. The heat in the semiconductor refrigerator 1 will be transferred to the linear closed tube 2222, and the heat in the linear closed tube 2222 will be transferred to the second heat sink fin 2221, and the heat in the second heat sink fin 2221 will be taken away by the fan 23.

[0041] As an optional embodiment, a positioning groove is provided on the upper end surface of the second heat dissipation fin 2221, a positioning protrusion is provided on the lower end surface of the second heat dissipation fin 2221, and a positioning groove on one second heat dissipation fin 2221 is engaged with a positioning protrusion on another second heat dissipation fin 2221. A positioning groove is provided on the upper end surface of the first heat dissipation fin 2211, a positioning protrusion is provided on the lower end surface of the first heat dissipation fin 2211, and a positioning groove on one first heat dissipation fin 2211 is engaged with a positioning protrusion on another first heat dissipation fin 2211. The positioning groove and the positioning protrusion are used to position the second heat dissipation fin 2221 or the first heat dissipation fin 2211, so that the arrangement can be more neat.

[0042] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. An active heat sink for high-power AI server chips, characterized in that: It comprises a semiconductor refrigerator (1) and a 3DVC heat sink (2), wherein: The semiconductor refrigerator (1) is installed on the inner side of the bottom of the 3DVC heat sink (2), and the outer side of the bottom of the 3DVC heat sink (2) is connected to the AI ​​server chip (3).

2. According to claim 1, an active heat sink for a high-power AI server chip is characterized in that: The 3DVC radiator (2) comprises a heat spreader assembly (21), a heat dissipation assembly (22) and a fan (23); the upper end of the heat spreader assembly (21) is connected to the lower end of the heat dissipation assembly (22) and the semiconductor refrigerator (1) is located between the heat spreader assembly (21) and the heat dissipation assembly (22); the lower end of the heat spreader assembly (21) is connected to the AI ​​server chip (3); there are two fans (23), and the two fans (23) are respectively located on both sides of the heat dissipation assembly (22).

3. The active heat sink for high-power AI server chips according to claim 2 is characterized in that: A cavity is provided between the heat sink assembly (21) and the heat dissipation assembly (22), and the semiconductor refrigerator (1) is installed in the cavity.

4. The active heat sink for high-power AI server chips according to claim 3 is characterized in that: The cavity is a closed structure and is vacuumed.

5. The active heat sink for high-power AI server chips according to claim 2 is characterized in that: A partial area or the entire area of ​​the lower end surface of the heat spreader assembly (21) is coated with heat dissipation silicone grease, and the heat dissipation silicone grease is in contact with the AI ​​server chip (3).

6. The active heat sink for high-power AI server chips according to claim 2, characterized in that: The cold surface of the semiconductor refrigerator (1) is coated with heat dissipation silicone grease, the heat dissipation silicone grease is in contact with the upper end surface of the heat spreader assembly (21), and the hot surface of the semiconductor refrigerator (1) is connected to the heat dissipation assembly (22).

7. The active heat sink for high-power AI server chips according to claim 2, characterized in that: The heat dissipation assembly (22) comprises a middle heat dissipation structure (221) and a side heat dissipation structure (222), the number of the side heat dissipation structures (222) is two, the two side heat dissipation structures (222) are respectively connected to the two sides of the middle heat dissipation structure (221), the middle heat dissipation structure (221) and the side heat dissipation structures (222) are both connected to the heat spreader assembly (21), the semiconductor refrigerator (1) is located between the middle heat dissipation structure (221) and the heat spreader assembly (21), and the fan (23) is located on one side of the side heat dissipation structure (222).

8. The active heat sink for high-power AI server chips according to claim 7, characterized in that: The intermediate heat dissipation structure (221) comprises first heat dissipation fins (2211) and a U-shaped closed tube (2212); there are a plurality of first heat dissipation fins (2211); all first heat dissipation fins (2211) are sequentially stacked and connected, and there is a gap between two adjacent first heat dissipation fins (2211); A plurality of first through holes are provided on the first heat dissipation fins (2211), and the corresponding first through holes on all the first heat dissipation fins (2211) form a first channel, and the two ends of the U-shaped closed tube (2212) are respectively mounted on two of the first channels; The interior of the U-shaped closed tube (2212) is vacuumed.

9. The active heat sink for high-power AI server chips according to claim 7, characterized in that: The side heat dissipation structure (222) comprises second heat dissipation fins (2221) and a straight closed tube (2222); the number of the second heat dissipation fins (2221) is multiple, all the second heat dissipation fins (2221) are sequentially stacked and connected, and there is a gap between two adjacent second heat dissipation fins (2221); The second heat dissipation fins (2221) are provided with a plurality of second through holes, and the corresponding second through holes on all the second heat dissipation fins (2221) form a second channel, and the straight closed tube (2222) is installed on the second channel; the interior of the straight closed tube (2222) is vacuumed.

10. The active heat sink for high-power AI server chips according to claim 9, characterized in that: A positioning groove is provided on the upper end surface of the second heat dissipation fin (2221), and a positioning protrusion is provided on the lower end surface of the second heat dissipation fin (2221), and the positioning groove on one second heat dissipation fin (2221) is snap-fitted with the positioning protrusion on another second heat dissipation fin (2221).

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