Heat dissipation device and electronic equipment

Abstract

The embodiment of the invention discloses a heat dissipation device and electronic equipment, the outer side of each first liquid cooling plate of a heat dissipation module in the heat dissipation device is provided with a fluid connection module, the fluid connection module comprises a communication hole, a guide channel is formed between the fluid connection module and the first liquid cooling plate, one side of the guide channel is communicated with the communication hole, and the other side of the guide channel is communicated with the communication hole. The other side of the guide channel communicates with a liquid inlet or a liquid outlet of the first liquid cooling plate, and the liquid inlet and the liquid outlet, located on the outermost side, of each heat dissipation module communicate with a first liquid inlet pipe and a first liquid return pipe through corresponding communicating holes correspondingly. And the adjacent liquid outlets and liquid inlets on the other two adjacent first liquid cooling plates are respectively communicated with the two ends of the connecting pipe in series through the corresponding communicating holes. The communicating holes of the fluid connecting modules replace the liquid inlets and the liquid outlets to be connected with corresponding pipelines, the bending radius and operability of the connecting pipes between the adjacent first liquid cooling plates are increased, the flow resistance is reduced, and the heat dissipation capacity is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of communication equipment, and in particular to a heat dissipation device and electronic equipment. Background Art

[0002] As the demand for high-density, high-performance optical modules in data centers and high-performance computing continues to grow, heat dissipation has become one of the key factors restricting equipment performance. Traditional air cooling is not enough for high-power density optical modules, while liquid cooling has gradually become the mainstream trend in the industry with its excellent heat dissipation effect. However, in actual applications, especially in high-density installation environments, multiple liquid cooling plates of multiple optical modules usually need to be installed side by side in a close arrangement to maximize the utilization of chassis space.

[0003] At present, the adjacent inlet and outlet ports of adjacent liquid cooling plates are usually connected in series through connecting pipes. Since the optical module itself is small in size, and in order to save space, the inlet and outlet ports of the liquid cooling plate on it are usually set near the edge of the liquid cooling plate, resulting in a very small bending radius of the connecting pipe between adjacent liquid cooling plates, which not only increases the difficulty of installing the connecting pipe, but also increases the water flow resistance due to the too sharp bending angle, affecting the cooling effect, and even causing the risk of damage to the connecting pipe. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a heat dissipation device and an electronic device, which increase the bending radius and operability of the connecting pipe, reduce the flow resistance, and improve the heat dissipation capacity.

[0005] In a first aspect, an embodiment of the present invention provides a heat dissipation device, the heat dissipation device includes at least one group of heat dissipation modules, the heat dissipation modules include at least two first liquid cooling plates arranged side by side, each of the first liquid cooling plates includes a liquid cooling channel having a liquid inlet and a liquid outlet, a fluid connection module is arranged on the outer side of the first liquid cooling plate, the fluid connection module includes a connecting hole, a guide channel is formed between the fluid connection module and the first liquid cooling plate, one side of the guide channel is connected to the connecting hole, and the other side of the guide channel is connected to the liquid inlet or the liquid outlet of the first liquid cooling plate;

[0006] Among them, the liquid inlet located on the outermost side of each group of the heat dissipation modules is connected to the first liquid inlet pipe through the corresponding connecting hole, and the liquid outlet located on the outermost side is connected to the first liquid return pipe through the corresponding connecting hole, and the remaining adjacent liquid outlets and liquid inlets are connected in series with the two ends of the connecting pipe through the corresponding connecting holes, and the liquid outlets and liquid inlets connected by the connecting pipe are respectively located on two adjacent first liquid cooling plates.

[0007] Optionally, the liquid inlet and the liquid outlet of the first liquid cooling plate are close to the two side edges of the first liquid cooling plate, the fluid connection module includes a first connecting block and a second connecting block, the first connecting block and the second connecting block are connected to the two side edges of the first liquid cooling plate, the first connecting block and the second connecting block are respectively provided with one of the connecting holes, and the first connecting block and the second connecting block each form one of the guide channels with the first liquid cooling plate;

[0008] Among them, the connecting hole of the first connecting block is connected with the liquid inlet of the first liquid cooling plate through the corresponding guide channel, and the connecting hole of the second connecting block is connected with the liquid outlet of the first liquid cooling plate through the corresponding guide channel, and the connecting hole of the first connecting block and the connecting hole of the second connecting block are located between the liquid inlet and the liquid outlet of the first liquid cooling plate.

[0009] Optionally, the guide channel is an L-shaped channel or an obliquely extending channel, the liquid inlet and the connecting hole of the first connecting block are obliquely staggered and not opposite, and the liquid outlet and the connecting hole of the second connecting block are obliquely staggered and not opposite.

[0010] Optionally, the first liquid cooling plate is provided with a first fluid groove, the first fluid groove is located outside the liquid inlet, and the liquid inlet is connected to one end of the first fluid groove, the first connecting block is provided with a second fluid groove, the second fluid groove is located on one side of the connecting hole, and one end of the second fluid groove is connected to the connecting hole, and the first fluid groove and the second fluid groove are buckled to form the guide channel;

[0011] The first liquid cooling plate is provided with a third fluid groove, the third fluid groove is located on the outside of the liquid outlet, and the liquid outlet is connected with one end of the third fluid groove, the second connecting block is provided with a fourth fluid groove, the fourth fluid groove is located on one side of the connecting hole, and one end of the fourth fluid groove is connected with the connecting hole, and the third fluid groove and the fourth fluid groove are buckled to form the guide channel.

[0012] Optionally, the liquid inlet and the liquid outlet of the first liquid cooling plate are arranged at the center position of the first liquid cooling plate, and the fluid connection module includes a third connecting block, and the third connecting block is arranged outside the center position of the first liquid cooling plate. The third connecting block is provided with two connecting holes, and two guide channels are formed between the third connecting block and the first liquid cooling plate, and one end of the two guide channels is respectively connected to the two connecting holes, and the other end of the two guide channels is respectively connected to the liquid inlet and the liquid outlet.

[0013] Optionally, the guide channel extends in the height direction, the liquid inlet and the corresponding connecting hole are staggered and not opposite in the height direction, and the liquid outlet and the corresponding connecting hole are staggered and not opposite in the height direction.

[0014] Optionally, the first liquid cooling plate is provided with a first fluid groove and a third fluid groove, the first fluid groove is located outside the liquid inlet, and the liquid inlet is communicated with one end of the first fluid groove, and the third fluid groove is located outside the liquid outlet, and the liquid outlet is communicated with one end of the third fluid groove;

[0015] The third connecting block is provided with two second fluid grooves, the two second fluid grooves are respectively located on one side of the two connecting holes, and one end of the two second fluid grooves is respectively connected with the two connecting holes, and the first fluid groove and the third fluid groove are respectively engaged with the two second fluid grooves in a one-to-one correspondence to form the guide channel.

[0016] Optionally, the heat dissipation device includes multiple groups of heat dissipation modules arranged side by side, and the first liquid inlet pipes and first liquid return pipes of the multiple groups of heat dissipation modules are respectively connected to the cooling capacity distribution unit through the first liquid distributor and the second liquid distributor to form multiple first cooling liquid circuits arranged in parallel.

[0017] Optionally, the heat dissipation device also includes a second liquid cooling plate, and a second liquid inlet pipe and a second liquid return pipe of the second liquid cooling plate are respectively connected to the cold distribution unit through the first liquid distributor and the second liquid distributor to form a second cooling liquid circuit, and the second cooling liquid circuit is arranged in parallel with the first cooling liquid circuit.

[0018] Optionally, a main liquid inlet pipe is connected between the first liquid distributor and the cold capacity distribution unit, and a main liquid return pipe is connected between the second liquid distributor and the cold capacity distribution unit.

[0019] In a second aspect, an embodiment of the present invention provides an electronic device, comprising a chassis and a heat dissipation device as described in the first aspect, wherein at least two optical module groups are arranged in the chassis, and the first liquid cooling plate is connected to the optical module groups in a one-to-one correspondence.

[0020] Optionally, the heat dissipation device further includes a second liquid cooling plate arranged in parallel with the loop of the heat dissipation module, and the electronic device further includes an electronic device, and the second liquid cooling plate is connected to the electronic device.

[0021] Optionally, the electronic device also includes a shielding cage and a radiator snap-fit ​​structure arranged above the shielding cage, the radiator snap-fit ​​structure includes a first snap-fit ​​piece and a second snap-fit ​​piece that are snap-fitted together to form a accommodating space, the first snap-fit ​​piece is snap-fitted to the shielding cage, the first liquid cooling plate is installed in the accommodating space, and the optical module group is installed in the shielding cage.

[0022] In the heat dissipation device of the embodiment of the present invention, a fluid connection module is arranged on the outside of each first liquid cooling plate of the heat dissipation module, the fluid connection module includes a connecting hole, a guide channel is formed between the fluid connection module and the first liquid cooling plate, one side of the guide channel is connected with the connecting hole, and the other side of the guide channel is connected with the liquid inlet or liquid outlet of the first liquid cooling plate, the liquid inlet and liquid outlet located on the outermost side of each group of heat dissipation modules are respectively connected with the first liquid inlet pipe and the first liquid return pipe through the corresponding connecting holes, and the adjacent liquid outlets and liquid inlets on the other two adjacent first liquid cooling plates are respectively connected in series with the two ends of the connecting pipe through the corresponding connecting holes. The connecting hole of the fluid connection module is used to replace the liquid inlet and the liquid outlet to connect with the corresponding pipeline, which increases the bending radius and operability of the connecting pipe between adjacent first liquid cooling plates, reduces the flow resistance, and improves the heat dissipation capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0024] Figure 1 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention;

[0025] Figure 2 is a structural schematic diagram of a fluid connection module connected to a first liquid cooling plate according to an embodiment of the present invention;

[0026] Figure 3 is a schematic structural diagram of a first liquid cooling plate according to an embodiment of the present invention;

[0027] Figure 4 is a schematic diagram of the structure of a first interconnection block according to an embodiment of the present invention;

[0028] Figure 5 is a schematic diagram of the structure of a second interconnection block according to an embodiment of the present invention;

[0029] Figure 6 is a cross-sectional view of a fluid connection module connected to a first liquid cooling plate according to an embodiment of the present invention;

[0030] Figure 7 is a schematic structural diagram of a heat dissipation device according to another embodiment of the present invention;

[0031] Figure 8is a schematic structural diagram of a first liquid cooling plate in another embodiment of the present invention;

[0032] Fig. 9 is a schematic structural diagram of a third interconnection block in another embodiment of the present invention;

[0033] Fig.10 is a cross-sectional view of a fluid connection module connected to a first liquid cooling plate according to another embodiment of the present invention;

[0034] Fig.11 is a schematic structural diagram of an electronic device according to an embodiment of the present invention;

[0035] Fig.12 It is a schematic structural diagram of an electronic device according to another embodiment of the present invention.

[0036] Reference numerals:

[0037] 100-heat dissipation module; 1-first liquid cooling plate; 11-liquid inlet; 12-liquid outlet; 13-liquid cooling channel; 14-first fluid groove; 15-third fluid groove; 2-connecting hole; 21-first connecting block; 211-second fluid groove; 22-second connecting block; 221-fourth fluid groove; 23-third connecting block; 231-fifth fluid groove; 3-guiding channel; 4-first liquid inlet pipe; 5-first liquid return pipe; 6-connecting pipe; 7-first liquid distributor; 8-second liquid distributor; 9-second liquid cooling plate; 91-second liquid inlet pipe; 92-second liquid return pipe; 101-main liquid inlet pipe; 102-main liquid return pipe. DETAILED DESCRIPTION

[0038] The present application is described below based on embodiments, but the present application is not limited to these embodiments. In the detailed description of the present application below, some specific details are described in detail. It is possible for those skilled in the art to fully understand the present application without the description of these details. In order to avoid confusing the essence of the present application, known methods, processes, flows, components and circuits are not described in detail.

[0039] In addition, persons of ordinary skill in the art will appreciate that the drawings provided herein are for illustration purposes and are not necessarily drawn to scale.

[0040] Unless otherwise clearly defined and specified, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0041] Unless the context clearly requires otherwise, the words "include", "comprising" and similar words throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is "including but not limited to".

[0042] In the description of this application, it should be understood that the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0043] In the prior art, the liquid inlet and outlet of the liquid cooling plate are usually arranged at the edge positions near the two sides of the liquid cooling plate. When multiple liquid cooling plates are arranged side by side, the liquid outlet of the previous liquid cooling plate is arranged adjacent to the liquid inlet of the next liquid cooling plate, and the distance between the two is relatively short. When adjacent liquid cooling plates are connected in series through adjacent holes, the distance between the liquid outlet and liquid inlet of the two liquid cooling plates is relatively short, and they cannot be connected in series, or the bending angle of the pipeline is too sharp, resulting in increased water flow resistance, which affects the cooling effect of the liquid cooling plate and even creates the risk of pipeline damage.

[0044] The embodiment of the present application provides a heat dissipation device, which includes at least one group of heat dissipation modules 100, each group of heat dissipation modules 100 includes at least two first liquid cooling plates 1 arranged side by side, and all the first liquid cooling plates 1 in each group of heat dissipation modules 100 are connected in series to form a series circuit, such as Figure 1 and Figure 7 Each first liquid cooling plate 1 includes a liquid cooling channel 13 having a liquid inlet 11 and a liquid outlet 12, as shown in FIG. Figure 6 and Fig.10 As shown. A fluid connection module is provided on the outside of the first liquid cooling plate 1, and the fluid connection module includes a connecting hole 2. After the fluid connection module and the first liquid cooling plate 1 are connected, a guide channel 3 is formed between the two. One side of the guide channel 3 is connected to the connecting hole 2, and the other side of the guide channel 3 is connected to the liquid inlet 11 or the liquid outlet 12 of the first liquid cooling plate 1. In other words, each liquid inlet 11 is connected to a connecting hole 2 through a guide channel 3, and each liquid outlet 12 is connected to a connecting hole 2 through a guide channel 3, and the guide channels 3 are independent of each other and do not interfere with each other.

[0045] like Figure 1 and Figure 7 As shown, the outermost liquid inlet 11 in each group of heat dissipation modules 100 is connected to the first liquid inlet pipe 4 through the corresponding connecting hole 2, and the outermost liquid outlet 12 is connected to the first liquid return pipe 5 through the corresponding connecting hole 2. Among all the other liquid outlets 12 and liquid inlets 11, the adjacent liquid outlets 12 and liquid inlets 11 are connected in series with the two ends of the connecting pipe 6 through the corresponding connecting holes 2, thereby forming a cooling circuit. In other words, the liquid outlet 12 and the liquid inlet 11 connected by the connecting pipe 6 through the two connecting holes 2 are adjacent to each other and belong to the two adjacent first liquid cooling plates 1 respectively. Among them, the distance between the two connecting holes 2 connected at the two ends of the connecting pipe 6 is greater than the distance between the adjacent liquid inlet 11 and the liquid outlet 12 in the adjacent two first liquid cooling plates 1 located at the edge position in the prior art, providing installation space for the connecting pipe 6. The increase in space increases the bending radius and operability of the connecting pipe, reduces the flow resistance, and improves the heat dissipation capacity.

[0046] In one embodiment, the liquid inlet 11 and the liquid outlet 12 of the first liquid cooling plate 1 are arranged near the edge positions of both sides of the first liquid cooling plate 1. Figure 6 The fluid connection module includes a first connecting block 21 and a second connecting block 22, and the first connecting block 21 and the second connecting block 22 are respectively connected to the edge positions of both sides of the first liquid cooling plate 1, as shown in FIG. Figure 1 , Figure 2 and Figure 6 That is, the outer side of the liquid inlet 11 is connected to the first interconnecting block 21, and the outer side of the liquid outlet 12 is connected to the second interconnecting block 22, as shown in FIG. Figure 6 shown.

[0047] Among them, a connecting hole 2 is provided on the first connecting block 21. After the first connecting block 21 is connected to the outside of the liquid inlet 11 of the first liquid cooling plate 1, a guiding channel 3 is formed between the first connecting block 21 and the first liquid cooling plate 1. Figure 4 and Figure 6 The connecting hole 2 and the liquid inlet 11 of the first connecting block 21 are respectively connected to the openings at both ends of the guide channel 3, so that the connecting hole 2 and the liquid inlet 11 of the first connecting block 21 are staggered and not opposite, as shown in FIG. Figure 6 Preferably, the connecting hole 2 and the liquid inlet 11 are respectively connected to the guide channel 3 vertically. The second connecting block 22 is provided with a connecting hole 2. After the second connecting block 22 is connected to the outer side of the liquid outlet 12 of the first liquid cooling plate 1, a guide channel 3 is formed between the second connecting block 22 and the first liquid cooling plate 1. Figure 5 and Figure 6The connecting hole 2 and the liquid outlet 12 of the second connecting block 22 are respectively connected to the openings at both ends of the guide channel 3, so that the connecting hole 2 and the liquid outlet 12 of the second connecting block 22 are staggered and not opposite to each other, as shown in FIG. Figure 6 Preferably, the communication hole 2 and the liquid outlet 12 are vertically connected to the guide channel 3 respectively.

[0048] Among them, "the communicating hole 2 and the liquid inlet 11 are staggered and not opposite to each other" means that the communicating hole 2 and the liquid inlet 11 are staggered or obliquely staggered in the horizontal direction (i.e., the length direction / left and right), so that the two are not opposite to each other. "The communicating hole 2 and the liquid outlet 12 are staggered and not opposite to each other" means that the communicating hole 2 and the liquid outlet 12 can be staggered or obliquely staggered in the horizontal direction (i.e., the length direction / left and right), so that the two are not opposite to each other.

[0049] In this embodiment, the connecting hole 2 of the first connecting block 21 and the connecting hole 2 of the second connecting block 22 are located between the liquid inlet 11 and the liquid outlet 12 of the first liquid cooling plate 1, so that the distance between the connecting hole 2 of the adjacent second connecting block 22 and the connecting hole 2 of the first connecting block 21 on two adjacent first liquid cooling plates 1 is greater than the distance between the adjacent liquid outlet 12 and the liquid inlet 11, thereby providing space for the connecting pipe 6 to connect the two first liquid cooling plates 1 in series, increasing the bending radius and operability of the connecting pipe 6, thereby reducing the flow resistance and improving the heat dissipation capacity. The setting of the guide channel 3 makes the connecting hole staggered with the liquid inlet 11 or the liquid outlet 12, increasing the distance between the two ends of the connecting pipe 6 in series, increasing the bending radius and operability of the connecting pipe 6, thereby reducing the flow resistance and improving the heat dissipation capacity. At the same time, the guide channel 3 is a smooth channel, which can reduce the flow resistance of the coolant, and its smoothness can be set according to needs.

[0050] Preferably, the first interconnecting block 21 and the second interconnecting block 22 are two completely symmetrical structures. After being connected to the first liquid cooling plate 1, the two guide channels 3 formed are completely symmetrical. Among them, whether the connecting hole 2 and the liquid inlet 11, the connecting hole 2 and the liquid outlet 12 are staggered along the length direction or staggered along the diagonal direction needs to be selected according to the space in front of the first liquid cooling plate. The following is a specific implementation of the diagonal staggering.

[0051] The guide channel 3 is an L-shaped channel or an obliquely extending channel, which makes the liquid inlet 11 and the connecting hole 2 of the first connecting block 21 staggered and not opposite, and the liquid outlet 12 and the connecting hole 2 of the second connecting block 22 staggered and not opposite. Staggered and not opposite includes staggered upward or staggered downward, which means that the two are staggered in both the height direction and the horizontal direction. The staggered and not opposite mode can meet the requirements of the installation space.

[0052] Figure 3-Figure 5The first liquid cooling plate 1 is provided with a first fluid groove 14, the first fluid groove 14 is located outside the liquid inlet 11, and the liquid inlet 11 is connected to the end of the first fluid groove 14 close to the outside, and the first liquid cooling plate 1 is provided with a third fluid groove 15, the third fluid groove 15 is located outside the liquid outlet 12, and the liquid outlet 12 is connected to the end of the third fluid groove 15 close to the outside, as shown in FIG. Figure 3 The first connecting block 21 is provided with a second fluid groove 211, the second fluid groove 211 is located on one side of the connecting hole 2, and the end of the second fluid groove 211 close to the inner side is connected to the connecting hole 2, as shown in FIG. Figure 4 The second connecting block 22 is provided with a fourth fluid groove 221, which is located at one side of the connecting hole 2, and one end of the fourth fluid groove 221 close to the inner side is connected with the connecting hole 2, as shown in FIG. Figure 5 As shown. The first fluid groove 14 and the second fluid groove 211 are completely symmetrical, and the third fluid groove 15 and the fourth fluid groove 221 are completely symmetrical. After the first connecting block 21, the second connecting block 22 and the first liquid cooling plate 1 are connected, the first fluid groove 14 and the second fluid groove 211 are buckled to form a guide channel 3, and the third fluid groove 15 and the fourth fluid groove 221 are buckled to form a guide channel 3. Figure 6 The formation method of the guide channel 3 is convenient for processing and operation.

[0053] In another embodiment, the liquid inlet 11 and the liquid outlet 12 of the first liquid cooling plate 1 are arranged at the center of the first liquid cooling plate 1. Figure 8 The fluid connection module includes a third interconnecting block 23, and the third interconnecting block 23 is connected to the outside of the center position of the first liquid cooling plate 1, as shown in FIG. Figure 7 and Fig.10 As shown. The third interconnecting block 23 is provided with two connecting holes 2. After the third interconnecting block 23 is connected to the outer side of the first liquid cooling plate 1, two independent guide channels 3 are formed between the third interconnecting block 23 and the first liquid cooling plate 1. Fig.10 One end of the two guide channels 3 is connected to the two corresponding connecting holes 2, and the other end of the two guide channels 3 is connected to the liquid inlet 11 and the liquid outlet 12, so that one connecting hole 2 of the third connecting block 23 and the liquid inlet 11 are staggered and not opposite, and the other connecting hole 2 and the liquid outlet 12 are staggered and not opposite. Preferably, the connecting hole 2, the liquid inlet 11 and the liquid outlet 12 are connected to the guide channels 3 vertically, respectively.

[0054] In this embodiment, the guide channel 3 is extended in the height direction, and the distance between the two connecting holes 2 is the same as the distance between the liquid inlet 11 and the liquid outlet 12, so that one of the connecting holes 2 and the liquid inlet 11 is staggered and not opposite in the height direction, and the other connecting hole 2 and the liquid outlet 12 are staggered and not opposite in the height direction. In this embodiment, by arranging the liquid inlet 11 and the liquid outlet 12 at the center position of the first liquid cooling plate 1, the distance between the adjacent liquid outlets 12 and the liquid inlet 11 of two adjacent first liquid cooling plates 1 is greater than the distance between the liquid outlet 12 and the liquid inlet 11 in the previous embodiment, providing installation space for the adjacent holes of the connecting pipe 6 to be connected in series, thereby increasing the bending radius and operability of the connecting pipe 6, thereby reducing the flow resistance and improving the heat dissipation capacity.

[0055] Furthermore, the first liquid cooling plate 1 is provided with a first fluid groove 14 and a third fluid groove 15, the first fluid groove 14 is located outside the liquid inlet 11, and the liquid inlet 11 is connected to the end of the first fluid groove 14 close to the bottom, and the third fluid groove 15 is located outside the liquid outlet 12, and the liquid outlet 12 is connected to the end of the third fluid groove 15 close to the bottom, such as Figure 8 The third interconnecting block 23 is provided with two fifth fluid grooves 231, the two fifth fluid grooves 231 are respectively located on one side of the two communicating holes 2, and the ends of the two fifth fluid grooves 231 close to the upper side are respectively connected to the two communicating holes 2, as shown in FIG. Fig. 9 shown.

[0056] Among them, the first fluid groove 14, the third fluid groove 15 and the two fifth fluid grooves 231 are completely symmetrical. After the third connecting block 23 and the first liquid cooling plate 1 are connected, the first fluid groove 14 and the third fluid groove 15 are respectively buckled with the two fifth fluid grooves 231 in a one-to-one correspondence to form a guide channel 3. Fig.10 The formation method of the guide channel 3 is convenient for processing and operation.

[0057] In addition, for the first liquid cooling plate 1 in which the liquid inlet 11 and the liquid outlet 12 are arranged at the center position of the first liquid cooling plate 1, the joints can be directly connected to the connecting pipes at the liquid inlet 11 and the liquid outlet 12, and the bending radius and operability of the connecting pipe 6 can be increased, thereby reducing the flow resistance and improving the heat dissipation capacity.

[0058] In the embodiment of the present application, the heat dissipation device may include multiple groups of heat dissipation modules 100, and the first liquid cooling plates 1 in the multiple groups of heat dissipation modules 100 are connected in series by connecting adjacent holes to form a loop. Among them, the first liquid inlet pipes 4 and the first liquid return pipes 5 of the multiple groups of heat dissipation modules 100 are respectively connected to the cooling distribution unit through the first liquid distributor 7 and the second liquid distributor 8 to form multiple first cooling liquid loops arranged in parallel, such as Figure 1 and Figure 7 A main liquid inlet pipe 101 is connected between the first liquid distributor 7 and the cold distribution unit, and a main liquid return pipe 102 is connected between the second liquid distributor 8 and the cold distribution unit. Figure 1 and Figure 7 shown.

[0059] The first liquid distributor 7 and the second liquid distributor 8 have multiple liquid inlets and liquid return ports, and the first liquid distributor 7 and the second liquid distributor 8 are used to divert the coolant to form multiple parallel loops. The parallel arrangement of multiple first coolant loops means that in a liquid cooling system, multiple first coolant loops are independently connected to the same cold distribution unit, and each first coolant loop can be cooled independently without being affected by other loops, which can effectively improve the heat dissipation efficiency. In an optional embodiment, the main liquid inlet pipe 101 and the main liquid return pipe 102 can be connected to the cold distribution unit through quick connectors, respectively. Among them, the quick connector is pluggable and connected to the cold distribution unit, making the installation of the heat dissipation device more convenient.

[0060] Among them, the number of first liquid cooling plates 1 in each group of heat dissipation modules 100 may be the same or different, and the number of heat dissipation modules 100 and the number of first liquid cooling plates 1 in each group of heat dissipation modules 100 are determined according to the product specifications of the optical module. In the embodiment of the present application, multiple groups and multiple refer to two or more. Preferably, multiple groups of heat dissipation modules 100 are arranged side by side inside an electronic device, and side-by-side arrangement refers to arrangement in the same direction inside an electronic device or on a panel to achieve high-density installation and efficient management, which helps to optimize the space utilization inside the device and facilitates later maintenance and upgrading. In addition, multiple groups of heat dissipation modules 100 can also be set at corresponding positions according to specific needs.

[0061] like Figure 1 and Figure 7 As shown, the heat dissipation device may also include a second liquid cold plate 9, and the second liquid cold plate 9 may also be connected to the cold distribution unit through the above-mentioned first liquid distributor 7 and the second liquid distributor 8 to form a second coolant circuit. The second coolant circuit is arranged in parallel with the first coolant circuit to improve the heat dissipation efficiency. Specifically, the first liquid distributor 7 is connected to the second liquid cold plate 9 through the second liquid inlet pipe 91, and the second liquid distributor 8 is connected to the second liquid cold plate 9 through the second liquid return pipe 92. The coolant flows out of the cold distribution unit through the main liquid inlet pipe 101 and the first liquid distributor 7, enters the second liquid inlet pipe 91 and flows into the second liquid cold plate 9, and then flows out from the second liquid cold plate 9 through the second liquid return pipe 92 to the second liquid distributor 8, and returns to the cold distribution unit through the main liquid return pipe 102.

[0062] In the embodiment of the present application, both ends of each liquid inlet pipe and liquid return pipe can be connected to the corresponding connecting hole, liquid inlet and liquid outlet through a quick connector. The quick connector is used to ensure that the pipeline connection is both fast and reliable, while preventing leakage and ensuring that the system can operate stably for a long time. Among them, common types of quick connectors include quick plug-in connectors, threaded connectors, ferrule connectors, crimp connectors, and flange connectors. The selection of connectors depends on the type of coolant, working pressure, temperature range, connection frequency, etc.

[0063] The heat dissipation module in the heat dissipation device of the embodiment of the present application includes at least two first liquid cooling plates arranged side by side and connected in series. By adding a fluid connection module in front of the first liquid cooling plate, the connecting hole of the fluid connection module replaces the liquid inlet and the liquid outlet to be connected to the corresponding pipeline, and the distance between adjacent connecting holes of adjacent fluid connection modules is greater than the distance between the liquid inlet and the liquid outlet of existing adjacent liquid cooling plates. The series connection of the two increases the bending radius and operability of the connecting pipe, reduces the flow resistance, and improves the heat dissipation capacity.

[0064] Fig.11 and Fig.12 It is a schematic diagram of the structure of an electronic device of an embodiment of the present application. Among them, the electronic device includes a chassis and a heat dissipation device of the above embodiment, and an optical module group is arranged in the chassis. Each optical module group may include multiple optical modules. The heat dissipation device can be installed in the chassis to dissipate heat and cool the heating components in the chassis. Among them, the number of first liquid cooling plates 1 in the heat dissipation device is the same as the number of optical module groups, and a first liquid cooling plate 1 is connected above each optical module group to improve the heat dissipation capacity by liquid cooling.

[0065] In a specific embodiment, a plurality of optical module groups can be arranged side by side at one end of the chassis, and a corresponding plurality of first liquid cooling plates 1 can be installed side by side above the corresponding optical module groups, which can maximize the utilization of the chassis space and also maximize the reduction of the temperature inside the chassis. Each optical module group is installed side by side in a corresponding shielding cage, and the first liquid cooling plate 1 is connected to the top of the shielding cage through a radiator snap-fit ​​structure, so as to dissipate heat and cool the optical module in the shielding cage. The radiator snap-fit ​​structure includes a first snap-fit ​​part and a second snap-fit ​​part that are snap-fitted together to form a receiving space, and the first snap-fit ​​part can also be snap-fitted with the shielding cage. The first liquid cooling plate 1 is installed in the receiving space to form a whole, which is convenient for disassembly and installation.

[0066] The chassis is also provided with electronic devices such as processors, chips, and circuit boards. The second liquid cooling plate 9 in the heat dissipation device is connected to the electronic device and is used to dissipate heat and cool the electronic device. In the present application, the chassis is provided with an upper and lower two-layer structure through a partition, wherein the heat dissipation device can be provided on the upper layer, so that the heat dissipation device is smaller and thinner, and can be more easily installed in electronic equipment with high-density electronic devices, making the electronic equipment thinner and smaller in size as a whole. The lower space of the chassis can be provided with a fan lamp heat dissipation structure, which can dissipate heat for other electronic devices in the chassis.

[0067] In the heat dissipation device of the electronic device in the embodiment of the present application, a fluid connection module is added in front of the first liquid cooling plate, so that the connecting hole of the fluid connection module replaces the liquid inlet and the liquid outlet to be connected to the corresponding pipeline, and the distance between adjacent connecting holes of adjacent fluid connection modules is greater than the distance between the liquid inlet and the liquid outlet of the existing adjacent liquid cooling plates. The two are connected in series to increase the bending radius and operability of the connecting pipe, reduce the flow resistance, and improve the heat dissipation capacity.

[0068] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A heat dissipation device, characterized in that: The heat dissipation device comprises at least one group of heat dissipation modules (100), the heat dissipation module (100) comprises at least two first liquid cooling plates (1) arranged side by side, each of the first liquid cooling plates (1) comprises a liquid cooling channel (13) having a liquid inlet (11) and a liquid outlet (12), a fluid connection module is arranged on the outer side of the first liquid cooling plate (1), the fluid connection module comprises a connecting hole (2), a guide channel (3) is formed between the fluid connection module and the first liquid cooling plate (1), one side of the guide channel (3) is connected to the connecting hole (2), and the other side of the guide channel (3) is connected to the liquid inlet (11) or the liquid outlet (12) of the first liquid cooling plate (1); The outermost liquid inlet (11) in each group of the heat dissipation modules (100) is connected to the first liquid inlet pipe (4) through the corresponding connecting hole (2), the outermost liquid outlet (12) is connected to the first liquid return pipe (5) through the corresponding connecting hole (2), and the remaining adjacent liquid outlets (12) and liquid inlets (11) are connected in series with the two ends of the connecting pipe (6) through the corresponding connecting holes (2), and the liquid outlets (12) and liquid inlets (11) connected by the connecting pipe (6) are respectively located on two adjacent first liquid cooling plates (1).

2. The heat dissipation device according to claim 1, characterized in that: The liquid inlet (11) and the liquid outlet (12) of the first liquid cooling plate (1) are close to the two side edges of the first liquid cooling plate (1); the fluid connection module comprises a first connecting block (21) and a second connecting block (22); the first connecting block (21) and the second connecting block (22) are connected to the two side edges of the first liquid cooling plate (1); the first connecting block (21) and the second connecting block (22) are respectively provided with a connecting hole (2); and the first connecting block (21) and the second connecting block (22) and the first liquid cooling plate (1) each form a guide channel (3); The communicating hole (2) of the first connecting block (21) is connected to the liquid inlet (11) of the first liquid cooling plate (1) through the corresponding guiding channel (3), and the communicating hole (2) of the second connecting block (22) is connected to the liquid outlet (12) of the first liquid cooling plate (1) through the corresponding guiding channel (3); the communicating hole (2) of the first connecting block (21) and the communicating hole (2) of the second connecting block (22) are located between the liquid inlet (11) and the liquid outlet (12) of the first liquid cooling plate (1).

3. The heat dissipation device according to claim 2, characterized in that: The guide channel (3) is an L-shaped channel or an obliquely extending channel; the liquid inlet (11) and the communication hole (2) of the first connecting block (21) are obliquely staggered and not opposite; the liquid outlet (12) and the communication hole (2) of the second connecting block (22) are obliquely staggered and not opposite.

4. The heat dissipation device according to claim 3, characterized in that: The first liquid cooling plate (1) is provided with a first fluid groove (14), the first fluid groove (14) is located outside the liquid inlet (11), and the liquid inlet (11) is connected to one end of the first fluid groove (14); the first connecting block (21) is provided with a second fluid groove (211), the second fluid groove (211) is located on one side of the connecting hole (2), and one end of the second fluid groove (211) is connected to the connecting hole (2); the first fluid groove (14) and the second fluid groove (211) are buckled to form the guide channel (3); The first liquid cooling plate (1) is provided with a third fluid groove (15), the third fluid groove (15) is located outside the liquid outlet (12), and the liquid outlet (12) is connected to one end of the third fluid groove (15); the second connecting block (22) is provided with a fourth fluid groove (221), the fourth fluid groove (221) is located on one side of the connecting hole (2), and one end of the fourth fluid groove (221) is connected to the connecting hole (2); the third fluid groove (15) and the fourth fluid groove (221) are buckled to form the guide channel (3).

5. The heat dissipation device according to claim 1, characterized in that: The liquid inlet (11) and the liquid outlet (12) of the first liquid cooling plate (1) are arranged at the center of the first liquid cooling plate (1); the fluid connection module comprises a third connecting block (23); the third connecting block (23) is arranged outside the center of the first liquid cooling plate (1); the third connecting block (23) is provided with two connecting holes (2); two guide channels (3) are formed between the third connecting block (23) and the first liquid cooling plate (1); one end of the two guide channels (3) are respectively connected to the two connecting holes (2); the other end of the two guide channels (3) are respectively connected to the liquid inlet (11) and the liquid outlet (12).

6. The heat dissipation device according to claim 5, characterized in that: The guide channel (3) extends in the height direction, the liquid inlet (11) and the corresponding connecting hole (2) are staggered and not opposite in the height direction, and the liquid outlet (12) and the corresponding connecting hole (2) are staggered and not opposite in the height direction.

7. The heat dissipation device according to claim 6, characterized in that: The first liquid cooling plate (1) is provided with a first fluid groove (14) and a third fluid groove (15), the first fluid groove (14) is located outside the liquid inlet (11), and the liquid inlet (11) is connected to one end of the first fluid groove (14), and the third fluid groove (15) is located outside the liquid outlet (12), and the liquid outlet (12) is connected to one end of the third fluid groove (15); The third connecting block (23) is provided with two fifth fluid grooves (231), the two fifth fluid grooves (231) are respectively located on one side of the two connecting holes (2), and one end of the two fifth fluid grooves (231) is respectively connected to the two connecting holes (2), and the first fluid groove (14) and the third fluid groove (15) are respectively engaged with the two fifth fluid grooves (231) in a one-to-one correspondence to form the guide channel (3).

8. The heat dissipation device according to claim 1, characterized in that: The heat dissipation device comprises a plurality of groups of heat dissipation modules (100) arranged side by side, wherein the first liquid inlet pipes (4) and the first liquid return pipes (5) of the plurality of heat dissipation modules (100) are respectively connected to a cooling capacity distribution unit via a first liquid distributor (7) and a second liquid distributor (8) to form a plurality of first cooling liquid circuits arranged in parallel.

9. The heat dissipation device according to claim 8, characterized in that: The heat dissipation device also includes a second liquid cooling plate (9), and a second liquid inlet pipe (91) and a second liquid return pipe (92) of the second liquid cooling plate (9) are respectively connected to the cooling distribution unit through the first liquid distributor (7) and the second liquid distributor (8) to form a second cooling liquid circuit, and the second cooling liquid circuit is arranged in parallel with the first cooling liquid circuit.

10. The heat dissipation device according to claim 9, characterized in that: A main liquid inlet pipe (101) is connected between the first liquid distributor (7) and the cold distribution unit, and a main liquid return pipe (102) is connected between the second liquid distributor (8) and the cold distribution unit.

11. An electronic device, characterized in that: The electronic device comprises a chassis and a heat dissipation device as claimed in any one of claims 1 to 10, at least two optical module groups are arranged in the chassis, and the first liquid cooling plate (1) is connected to the optical module groups in a one-to-one correspondence.

12. The electronic device according to claim 11, characterized in that: The heat dissipation device further comprises a second liquid cooling plate (9) arranged in parallel with the circuit of the heat dissipation module (100); the electronic device further comprises an electronic device, and the second liquid cooling plate (9) is connected to the electronic device.

13. The electronic device according to claim 11, characterized in that: The electronic device further comprises a shielding cage and a heat sink snap-fitting structure arranged above the shielding cage, the heat sink snap-fitting structure comprising a first snap-fitting member and a second snap-fitting member snap-fitted together to form a receiving space, the first snap-fitting member is snap-fitted with the shielding cage, the first liquid cooling plate (1) is installed in the receiving space, and the optical module group is installed in the shielding cage.

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