Display module, preparation method of display module and display device

Abstract

The embodiment of the invention discloses a display module, a preparation method of the display module and a display device. The display module comprises a display panel, a bonding element and a conductive adhesive layer, the conductive adhesive layer is arranged in the bonding connection area of the display panel; the bonding element is in bonding connection with the display panel through the conductive adhesive layer; the conductive adhesive layer comprises a first film layer, a second film layer and a plurality of self-recovery conductive particle structures; the plurality of self-recovery conductive particle structures are arranged between the first film layer and the second film layer in an array. According to the technical scheme of the embodiment of the invention, the conductive adhesive layer is arranged in the bonding connection area of the display panel, and the self-recovery conductive particle structure is arranged in the conductive adhesive layer, so that the module is protected from being damaged when a short-circuit fault occurs, the display module can work normally after being electrified again, and the reliability of the display module is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display module, a method for preparing the display module, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) is a current-type organic light-emitting device. OLED display technology has the advantages of simple structure, fast response speed, self-luminescence without backlight, wide viewing angle, high contrast and wide operating temperature range, and has been widely recognized by the market. After the OLED display device is manufactured, the screen needs to be tested for lighting. However, during the test or user installation and use, improper operation may cause a short circuit and circuit burns, causing the device to be scrapped and unusable.

[0003] The solution in the prior art is to add an empty pin between the voltage pin and the ground pin when designing the pins of the flexible printed circuit board, when the number of pins is not limited, so as to increase the physical distance between the power supply and the ground terminal.

[0004] However, the solutions in the prior art can only reduce the occurrence of short circuits, and cannot protect the display device from being damaged when a short circuit occurs. Summary of the invention

[0005] The present invention provides a display module, a method for preparing the display module and a display device to solve the problem of damage to the display module when a circuit is short-circuited. After a short-circuit failure occurs, the display module can work normally after power is turned on again, thereby improving the reliability of the display module.

[0006] According to one aspect of the present invention, a display module is provided, the display module comprising: a display panel, a bonding element and a conductive adhesive layer; the conductive adhesive layer is arranged in a bonding connection area of ​​the display panel; the bonding element is bonded and connected to the display panel through the conductive adhesive layer;

[0007] The conductive adhesive layer includes a first film layer, a second film layer and a plurality of self-recovering conductive particle structures;

[0008] A plurality of self-recovery conductive particle structure arrays are arranged between the first film layer and the second film layer.

[0009] Optionally, the self-recovering conductive particle structure comprises at least two conductive layers;

[0010] At least two conductive layers are insulated.

[0011] Optionally, the conductive layer includes a spiked protrusion structure;

[0012] The spike protrusion structure is connected to the conductive layer, and the spike protrusion structure is arranged on the outer surface of the conductive layer.

[0013] Optionally, the display panel includes a plurality of first terminals; the bonding element includes a plurality of second terminals;

[0014] The first terminal is electrically connected to the second terminal through the spike protrusion structure.

[0015] Optionally, the spike protrusion structure includes a first spike protrusion structure and a second spike protrusion structure;

[0016] The first spike protrusion structure pierces the first terminal, and the second spike protrusion structure pierces the second terminal, thereby forming a conductive path.

[0017] Optionally, the self-recovering conductive particle structure further includes a protective layer, a polymer and conductive particles; the conductive layer runs through the protective layer;

[0018] The polymer and the conductive particles are both disposed in the protective layer.

[0019] Optionally, when there is no abnormality in the conductive path, the conductive particles are bound outside the polymer to form a chain-like conductive path without changing the volume of the self-healing conductive particle structure.

[0020] Optionally, when the conductive path is overcurrented, the polymer melts, the volume of the self-healing conductive particle structure increases, and the operating current of the conductive path is reduced;

[0021] When there is no abnormality in the conductive path, the self-healing conductive particle structure presents a low-resistance state; when there is an overcurrent in the conductive path, the self-healing conductive particle structure presents a high-resistance state.

[0022] According to another aspect of the present invention, a display device is provided. The display device includes the above-mentioned display module.

[0023] According to another aspect of the present invention, a method for preparing a display module is provided, the method for preparing a display module comprising:

[0024] Provide display panels and bonding components;

[0025] A conductive adhesive layer is formed in the bonding connection area of ​​the display panel, and the bonding element is bonded to the display panel through the conductive adhesive layer; wherein the conductive adhesive layer includes a first film layer, a second film layer and a plurality of self-recovering conductive particle structures; and the plurality of self-recovering conductive particle structures are arrayed between the first film layer and the second film layer.

[0026] The technical solution of the embodiment of the present invention is to set a conductive adhesive layer in the bonding connection area of ​​the display panel, and a self-recovering conductive particle structure is set in the conductive adhesive layer. A plurality of self-recovering conductive particle structures are arranged in an array between the first film layer and the second film layer to prevent the self-recovering conductive particle structure from moving freely, causing the adjacent terminals of the display panel or the bonding element to be connected to each other, causing a short circuit between the terminals, and reducing the waste of the self-recovering conductive particle structure. When the self-recovering conductive particle structure is set, when a short circuit or overload occurs in the circuit, the heat generated by the large current can rapidly increase the internal volume of the self-recovering conductive particle structure, reduce the working current, thereby limiting and protecting the circuit and preventing the circuit or integrated circuit from burning. When the fault is eliminated, the self-recovering conductive particle structure is cooled and crystallized again, the volume is reduced, and the internal conductive particles re-form a conductive path, thereby completing the protection of the display module. After power is turned on again, the display module can work normally, thereby improving the reliability of the display module.

[0027] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 is a structural schematic diagram of a display module provided according to an embodiment of the present invention;

[0030] Figure 2 is a schematic diagram of a self-recovering conductive particle structure in a display module provided according to an embodiment of the present invention;

[0031] Figure 3 is a schematic structural diagram of another display module provided according to an embodiment of the present invention;

[0032] Figure 4 is a schematic structural diagram of a display device provided according to an embodiment of the present invention;

[0033] Figure 5 The present invention is a flowchart of a method for preparing a display module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0035] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0036] Figure 1 is a schematic diagram of the structure of a display module provided according to an embodiment of the present invention. Figure 1 As shown, the display module includes: a display panel 10, a bonding element 20 and a conductive adhesive layer 30; the conductive adhesive layer 30 is arranged in the bonding connection area of ​​the display panel 10; the bonding element 20 is bonded and connected to the display panel 10 through the conductive adhesive layer 30; the conductive adhesive layer 30 includes a first film layer 301, a second film layer 302 and a plurality of self-recovering conductive particle structures 40; the plurality of self-recovering conductive particle structures 40 are arranged in an array between the first film layer 301 and the second film layer 302.

[0037] In an embodiment of the present invention, the display panel 10 may include a substrate and a display function layer, and the substrate includes but is not limited to a glass substrate and a flexible substrate. The display function layer includes an array layer, a light-emitting device layer and a thin film encapsulation layer. The array layer generally includes a substrate, a pixel electrode, a data line, a gate line and a thin film transistor, etc. The bonding component 20 includes a flexible printed circuit board (Flexible Printed Circuit, FPC) or an integrated circuit (Integrated Circuit, IC). In the process of display screen manufacturing, the bonding process of the module segment is indispensable. Bonding connects the display panel 10 and the bonding component 20 together, and realizes signal transmission through the connection.

[0038] The bonding element 20 is bonded to the display panel 10 through the conductive adhesive layer 30. The conductive adhesive layer 30 includes a first film layer 301, a second film layer 302 and a plurality of self-recovering conductive particle structures 40. The conductive adhesive layer 30 also includes glue 303. The material of the glue 303 can be epoxy acrylate, unsaturated polymer resin or acrylate monomer, etc. The glue 303 can be a UV curing glue. The first film layer 301 is a substrate film. The second film layer 302 is a release film. The release film is a film with distinguishable film surface. The release film is not sticky or has slight stickiness after contacting with a specific material under limited conditions. The conductive adhesive layer 30 of the embodiment of the present invention is different from the anisotropic conductive film (ACF) in the prior art. The ACF glue in the prior art includes resin and conductive particles. In the embodiment of the present invention, the conductive adhesive layer 30 includes a self-recovering conductive particle structure 40. The self-recovering conductive particle structure 40 is similar to the self-recovering fuse structure. When a short circuit or overload occurs in the circuit, the heat generated by the large current can rapidly increase the internal volume of the self-recovering conductive particle structure 40, reducing the working current, thereby limiting and protecting the circuit and preventing the circuit or IC from burning. When the fault is eliminated, the self-recovering conductive particle structure 40 cools and crystallizes again, the volume shrinks, and the internal conductive particles re-form a conductive path, thereby completing the protection of the display module. After powering on again, the display module can work normally, thereby improving the reliability of the display module.

[0039] Multiple self-recovery conductive particle structures 40 are arranged in an array between the first film layer 301 and the second film layer 302. Exemplarily, multiple self-recovery conductive particle structures 40 are arranged in a row and N columns between the first film layer 301 and the second film layer 302. Multiple self-recovery conductive particle structures 40 are neatly and orderly arranged between the first film layer 301 and the second film layer 302, and multiple self-recovery conductive particle structures 40 are on the same side of the electrode polarity, which is convenient for conduction when the circuit is applied. The array arrangement is applied to prevent the self-recovery conductive particle structure 40 from moving freely, causing the adjacent terminals of the display panel 10 or the bonding element 20 to be connected to each other, causing a short circuit between the terminals, and reducing the waste of the self-recovery conductive particle structure 40.

[0040] The technical solution of the embodiment of the present invention is to set a conductive adhesive layer in the bonding connection area of ​​the display panel, and a self-recovering conductive particle structure is set in the conductive adhesive layer. A plurality of self-recovering conductive particle structures are arranged in an array between the first film layer and the second film layer to prevent the self-recovering conductive particle structure from moving freely and causing the adjacent terminals of the display panel or the bonding element to be connected to each other, causing a short circuit between the terminals, and reducing the waste of the self-recovering conductive particle structure. When the self-recovering conductive particle structure is set, when a short circuit or overload occurs in the circuit, the heat generated by the large current can rapidly increase the internal volume of the self-recovering conductive particle structure, reduce the working current, thereby limiting and protecting the circuit and preventing the circuit or IC from burning. When the fault is eliminated, the self-recovering conductive particle structure is cooled and crystallized again, the volume is reduced, and the internal conductive particles re-form a conductive path, thereby completing the protection of the display module. After power is turned on again, the display module can work normally, thereby improving the reliability of the display module.

[0041] Figure 2 FIG. 1 is a schematic diagram of a self-recovering conductive particle structure in a display module according to an embodiment of the present invention. Figure 2 As shown, the self-healing conductive particle structure 40 includes at least two conductive layers 401; at least two conductive layers 401 are insulated.

[0042] In the embodiment of the present invention, the self-recovering conductive particle structure 40 may include two upper and lower conductive layers 401, and each conductive layer 401 may occupy a quarter of the entire self-recovering conductive particle structure 40. At least two conductive layers 401 are arranged opposite to each other in the self-recovering conductive particle structure 40, and the electrode polarities of at least two conductive layers 401 are opposite. Exemplarily, the conductive layer 401 on one side of the self-recovering conductive particle structure 40 is set as the positive electrode, and the conductive layer 401 on the other side of the self-recovering conductive particle structure 40 is set as the negative electrode.

[0043] Based on the technical solution of the above invention embodiment, Figure 2 Optionally, the conductive layer 401 includes a spike protrusion structure 402 ; the spike protrusion structure 402 is connected to the conductive layer 401 , and the spike protrusion structure 402 is arranged on the outer surface of the conductive layer 401 .

[0044] In the embodiment of the present invention, the outer surface of the conductive layer 401 in the self-recovering conductive particle structure 40 is provided with a spike protrusion structure 402, which is connected to the conductive layer 401 and can more easily penetrate into the metal circuit for conduction during bonding and pressing.

[0045] Figure 3 FIG. 1 is a schematic diagram of the structure of another display module provided according to an embodiment of the present invention. Figure 3As shown, the display panel 10 includes a plurality of first terminals 101 ; the bonding element 20 includes a plurality of second terminals 202 ; and the first terminals 101 are electrically connected to the second terminals 202 via the spike protrusion structure 402 .

[0046] In an embodiment of the present invention, the display panel 10 includes a plurality of first terminals 101, and the bonding element 20 includes a plurality of second terminals 202. The first terminal 101 and the second terminal 202 may be ports for transmitting electrical signals. The first terminal 101 is electrically connected to the second terminal 202 through a conductive adhesive layer. In an optional embodiment of the present invention, the first terminal 101 and the second terminal 202 are connected through a spike protrusion structure 402. The spike protrusion structure 402 penetrates into the metal circuit, making it easier to connect the first terminal 101 and the second terminal 202, thereby realizing the bonding connection between the display panel 10 and the bonding element 20.

[0047] Based on the technical solution of the above invention embodiment, Figure 3 Optionally, the spike protrusion structure 402 includes a first spike protrusion structure 4021 and a second spike protrusion structure 4022; the first spike protrusion structure 4021 pierces the first terminal 101, and the second spike protrusion structure 4022 pierces the second terminal 202, thereby forming a conductive path.

[0048] In the embodiment of the present invention, illustratively, the conductive layer connected to the first spike protrusion structure 4021 is the positive electrode, and the conductive layer connected to the second spike protrusion structure 4022 is the negative electrode. The first spike protrusion structure 4021 penetrates the first terminal 101 and is connected to the display panel 10, and the second spike protrusion structure 4022 penetrates the second terminal 202 and is connected to the bonding element 20. The display panel 10 and the bonding element 20 are bound and connected through the first terminal 101, the first spike protrusion structure 4021, the second spike protrusion structure 4022 and the second terminal 202, thereby forming a conductive path and enhancing the connection of the circuit.

[0049] Based on the technical solution of the above invention embodiment, Figure 2 Optionally, the self-recovering conductive particle structure 40 further includes a protective layer 403 , a polymer 404 and conductive particles 405 ; the conductive layer 401 runs through the protective layer 403 ; the polymer 404 and the conductive particles 405 are both disposed in the protective layer 403 .

[0050] In an embodiment of the present invention, the self-recovering conductive particle structure 40 is formed by using a high molecular organic polymer 404, adding a conductive particle 405 material under high temperature, high pressure and vulcanization reaction conditions, and then undergoing a special process. Among them, the polymer 404 includes a polymer resin. The conductive particles 405 include one or more carbon-based particles in carbon black metal conductive particles, carbon fibers and carbon nanotubes. The shape of the conductive particles 405 can be conical, cylindrical or spherical. The material of the protective layer 403 is a non-conductive material. The polymer 404 and the conductive particles 405 are both arranged in the protective layer 403. The conductive layer 401 runs through the protective layer 403 to facilitate line connectivity.

[0051] On the basis of the technical solution of the above-mentioned invention embodiment, optionally, when there is no abnormality in the conductive path, the conductive particles are bound outside the polymer to form a chain-like conductive path, and the volume of the self-healing conductive particle structure is not changed.

[0052] In the embodiment of the present invention, a spike protrusion structure is provided on the outer surface of the conductive layer of the self-recovering conductive particle structure, which is easier to penetrate into the metal circuit for conduction when the display panel and the bonding component are bound and pressed. When there is no abnormality in the conductive path, that is, under normal operation, the polymer resin tightly binds the conductive particles outside the crystalline structure to form a chain-like conductive path, and the self-recovering conductive particle structure is in a low-resistance state. At this time, the current flowing through the self-recovering conductive particle structure on the circuit is small, and the heat generated is small, which will not change the crystal structure, and thus will not change the volume of the self-recovering conductive particle structure.

[0053] On the basis of the technical solution of the above-mentioned invention embodiment, optionally, when the conductive path is overcurrent, the polymer melts, the volume of the self-healing conductive particle structure increases, and the working current of the conductive path is reduced; when there is no abnormality in the conductive path, the self-healing conductive particle structure presents a low-resistance state; when the conductive path is overcurrent, the self-healing conductive particle structure presents a high-resistance state.

[0054] In the embodiment of the present invention, when the conductive path is overcurrent, that is, when the circuit is short-circuited or overloaded, the current flowing through the self-healing conductive particle structure increases, and thus the heat generated increases. The generated heat causes the polymer resin to melt, and the volume of the self-healing conductive particle structure grows rapidly. At this time, the self-healing conductive particle structure presents a high resistance state, and the working current decreases rapidly, thereby limiting and protecting the circuit and preventing the circuit or IC from burning.

[0055] When the fault is eliminated, the self-healing conductive particle structure cools down and crystallizes again, shrinks in volume, and returns to normal state. The internal conductive particles reform the conductive path, and the self-healing conductive particle structure returns to the low-resistance state, thereby protecting the circuit without damaging the display module. After power-on, the display module can work normally, thereby improving the reliability of the display module.

[0056] It should be noted that the low resistance state and high resistance state of the self-recovering conductive particle structure in the embodiment of the present invention are relative. When the self-recovering conductive particle structure is in the low resistance state, the current flowing through the circuit is large, and when the self-recovering conductive particle structure is in the high resistance state, the current flowing through the circuit is small or even zero.

[0057] Figure 4 is a schematic diagram of the structure of a display device provided according to an embodiment of the present invention. Figure 4 As shown, the display device 200 includes the display module 100 of any of the above embodiments, and has the beneficial effects of the display module of the embodiment of the present invention.

[0058] Figure 5 1 is a flow chart of a method for preparing a display module according to an embodiment of the present invention. The embodiment of the present invention can be applied to preparing a display module. The method for preparing a display module can be performed by a display module preparation device. The display module preparation device can be implemented in the form of hardware and / or software. Figure 5 As shown, the method for preparing the display module includes:

[0059] S110, providing a display panel and bonding components.

[0060] Exemplarily, a display panel including a substrate and a display function layer may be provided. The provided bonding element may include a flexible printed circuit board or an integrated circuit. In the process of manufacturing a display screen, the bonding process of the module segment is indispensable. The bonding connects the display panel and the bonding element together, and realizes signal transmission through the connection.

[0061] S120, forming a conductive adhesive layer in the bonding connection area of ​​the display panel, and bonding the bonding element to the display panel through the conductive adhesive layer; wherein the conductive adhesive layer includes a first film layer, a second film layer and a plurality of self-recovering conductive particle structures; the plurality of self-recovering conductive particle structures are arrayed between the first film layer and the second film layer.

[0062] Specifically, a conductive adhesive layer including a first film layer, a second film layer and a plurality of self-recovering conductive particle structures is formed in the bonding connection area of ​​the display panel. The bonding element is bonded to the display panel through the conductive adhesive layer. The plurality of self-recovering conductive particle structures are neatly and orderly arranged in an array between the first film layer and the second film layer, and the electrodes of the plurality of self-recovering conductive particle structures on the same side have the same polarity, which is convenient for conduction when the circuit is applied. The array arrangement is applied to prevent the self-recovering conductive particle structures from moving freely, causing adjacent terminals of the display panel or the bonding element to be connected to each other, causing a short circuit between the terminals, and reducing the waste of the self-recovering conductive particle structures.

[0063] When a short circuit or overload occurs in the circuit, the heat generated by the large current can rapidly increase the volume of the self-healing conductive particle structure in the conductive adhesive layer, reducing the working current, thereby limiting and protecting the circuit and preventing the circuit or IC from burning. When the fault is eliminated, the self-healing conductive particle structure in the conductive adhesive layer cools and crystallizes again, shrinks in volume, and the internal conductive particles re-form a conductive path, thereby completing the protection of the display module. After power is turned on again, the prepared display module can still work normally, improving the reliability of the prepared display module.

[0064] The technical solution of the embodiment of the present invention is to set a method for preparing a display module, by forming a conductive adhesive layer in the bonding connection area of ​​the display panel, and a self-recovering conductive particle structure is set in the conductive adhesive layer, and a plurality of self-recovering conductive particle structures are arranged in an array between the first film layer and the second film layer, so as to prevent the self-recovering conductive particle structure from moving freely and causing the adjacent terminals of the display panel or the bonding element to be connected to each other, so as to cause a short circuit between the terminals, and to reduce the waste of the self-recovering conductive particle structure. The formed conductive adhesive layer includes a self-recovering conductive particle structure. When a short circuit or overload occurs in the circuit, the heat generated by the large current can rapidly increase the internal volume of the self-recovering conductive particle structure, reduce the working current, thereby limiting and protecting the circuit, and preventing the circuit or IC from burning. When the fault is eliminated, the internal part of the self-recovering conductive particle structure is cooled and crystallized again, the volume is reduced, and the internal conductive particles re-form a conductive path, thereby completing the protection of the display module. After powering on again, the display module can work normally, thereby improving the reliability of the display module.

[0065] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0066] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A display module, characterized in that: include: A display panel, a bonding component and a conductive adhesive layer; the conductive adhesive layer is arranged in a bonding connection area of ​​the display panel; the bonding component is bonded and connected to the display panel through the conductive adhesive layer; The conductive adhesive layer includes a first film layer, a second film layer and a plurality of self-recovering conductive particle structures; A plurality of the self-recovering conductive particle structure arrays are arranged between the first film layer and the second film layer.

2. The display module according to claim 1, characterized in that: The self-recovering conductive particle structure comprises at least two conductive layers; At least two of the conductive layers are insulated.

3. The display module according to claim 2, characterized in that: The conductive layer includes a spike protrusion structure; The spike protrusion structure is connected to the conductive layer, and the spike protrusion structure is arranged on the outer surface of the conductive layer.

4. The display module according to claim 3, characterized in that: The display panel includes a plurality of first terminals; the bonding element includes a plurality of second terminals; The first terminal is electrically connected to the second terminal through the spike protrusion structure.

5. The display module according to claim 4, characterized in that: The spike protrusion structure includes a first spike protrusion structure and a second spike protrusion structure; The first spike protrusion structure pierces the first terminal, and the second spike protrusion structure pierces the second terminal, thereby forming a conductive path.

6. The display module according to claim 2, characterized in that: The self-recovering conductive particle structure further comprises a protective layer, a polymer and conductive particles; the conductive layer runs through the protective layer; The polymer and the conductive particles are both disposed in the protective layer.

7. The display module according to claim 6, characterized in that: When there is no abnormality in the conductive path, the conductive particles are bound outside the polymer to form a chain-like conductive path, and the volume of the self-healing conductive particle structure is not changed.

8. The display module according to claim 6, characterized in that: When the conductive path is overcurrented, the polymer melts, the volume of the self-recovering conductive particle structure increases, and the working current of the conductive path is reduced; When there is no abnormality in the conductive path, the self-recovery type conductive particle structure presents a low resistance state; when there is a current flowing through the conductive path, the self-recovery type conductive particle structure presents a high resistance state.

9. A display device, characterized in that: Comprising a display module as described in any one of claims 1-8.

10. A method for preparing a display module, characterized in that: include: Provide display panels and bonding components; A conductive adhesive layer is formed in the bonding connection area of ​​the display panel, and the bonding element is bonded to the display panel through the conductive adhesive layer; wherein the conductive adhesive layer includes a first film layer, a second film layer and a plurality of self-recovering conductive particle structures; and the plurality of self-recovering conductive particle structures are arrayed between the first film layer and the second film layer.

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